TWI340153B - - Google Patents

Info

Publication number
TWI340153B
TWI340153B TW093120364A TW93120364A TWI340153B TW I340153 B TWI340153 B TW I340153B TW 093120364 A TW093120364 A TW 093120364A TW 93120364 A TW93120364 A TW 93120364A TW I340153 B TWI340153 B TW I340153B
Authority
TW
Taiwan
Application number
TW093120364A
Other versions
TW200505994A (en
Inventor
Masao Arima
Yasukazu Watanabe
Makoto Hayasi
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW200505994A publication Critical patent/TW200505994A/zh
Application granted granted Critical
Publication of TWI340153B publication Critical patent/TWI340153B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
TW093120364A 2003-07-10 2004-07-07 Thermosetting resin composition for multilayer printed wiring board, thermosetting adhesive film and multilayer printed board made by using them TW200505994A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003272911 2003-07-10
JP2003272908 2003-07-10

Publications (2)

Publication Number Publication Date
TW200505994A TW200505994A (en) 2005-02-16
TWI340153B true TWI340153B (zh) 2011-04-11

Family

ID=34067377

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093120364A TW200505994A (en) 2003-07-10 2004-07-07 Thermosetting resin composition for multilayer printed wiring board, thermosetting adhesive film and multilayer printed board made by using them

Country Status (4)

Country Link
JP (2) JP5214106B2 (zh)
KR (1) KR101058972B1 (zh)
TW (1) TW200505994A (zh)
WO (1) WO2005006826A1 (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI280043B (en) 2005-09-29 2007-04-21 Asustek Comp Inc Television capable of performing reminding function
JP4872125B2 (ja) * 2006-06-28 2012-02-08 Ｄｉｃ株式会社 多層プリント配線板用硬化性樹脂組成物、熱硬化性接着フィルム及び多層プリント基板
JP2008189852A (ja) * 2007-02-06 2008-08-21 Taiyo Ink Mfg Ltd 熱硬化性樹脂組成物及びそれを用いたプリント配線基板の製造方法
JP5119754B2 (ja) * 2007-06-12 2013-01-16 Ｄｉｃ株式会社 熱硬化性ポリイミド樹脂組成物
CN101679612B (zh) * 2007-06-14 2013-07-17 味之素株式会社 多层印刷电路板的层间绝缘用树脂组合物
NL1037120C2 (en) 2009-07-15 2011-01-18 Holland Novochem Technical Coatings B V Heat-resistant, chemical resistant, room temperature curable, solvent-free resin compositions to apply as protective coating.
JP5466070B2 (ja) * 2010-04-12 2014-04-09 株式会社カネカ 多層プリント配線板用ボンディングシート
NL1038104C2 (en) 2010-07-14 2012-01-23 Holland Novochem Technical Coatings B V Heat-resistant, chemical resistant, room temperature curable, solvent-free resin compositions to apply as protective coating.
US20130153275A1 (en) * 2011-12-19 2013-06-20 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and method for manufacturing the same
KR20140008871A (ko) * 2012-07-12 2014-01-22 삼성전기주식회사 빌드업 절연필름용 에폭시 수지 조성물, 이로부터 제조된 절연 필름 및 이를 구비한 다층 인쇄회로기판
WO2015037555A1 (ja) * 2013-09-12 2015-03-19 住友電気工業株式会社 プリント配線板用接着剤組成物、ボンディングフィルム、カバーレイ、銅張積層板及びプリント配線板
WO2015103427A1 (en) 2013-12-31 2015-07-09 Saint-Gobain Performance Plastics Corporation Composites for protecting signal transmitters/receivers
KR102476862B1 (ko) 2014-10-16 2022-12-14 아지노모토 가부시키가이샤 지지체, 접착 시트, 적층 구조체, 반도체 장치 및 프린트 배선판의 제조 방법
WO2020241899A1 (ja) * 2019-05-31 2020-12-03 三菱瓦斯化学株式会社 絶縁性樹脂層付き基材、並びに、これを用いた積層体及び積層体の製造方法
JPWO2022163609A1 (zh) * 2021-01-27 2022-08-04

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3415144B2 (ja) * 1989-12-21 2003-06-09 ロックヒード マーティン コーポレーション エポキシ／ポリイミド共重合体ブレンド誘電体およびこれを用いた多層回路
JP3695848B2 (ja) * 1996-06-17 2005-09-14 住友ベークライト株式会社 耐熱性フィルム接着剤およびその製造方法
JP4560886B2 (ja) * 2000-05-01 2010-10-13 Ｄｉｃ株式会社 カルボキシル基含有アミドイミド樹脂及び／又はカルボキシル基含有イミド樹脂
JP2003089784A (ja) * 2001-09-18 2003-03-28 Nippon Steel Chem Co Ltd ビルトアップ基板用耐熱性接着フィルム
JP4217952B2 (ja) * 2002-01-31 2009-02-04 Ｄｉｃ株式会社 熱硬化性ポリイミド樹脂組成物、ポリイミド樹脂の製造方法およびポリイミド樹脂
JP2004071827A (ja) * 2002-08-06 2004-03-04 Taiyo Ink Mfg Ltd 多層プリント配線板の製造方法
JP2004333672A (ja) * 2003-05-02 2004-11-25 Kanegafuchi Chem Ind Co Ltd 貯蔵安定性の良い感光性樹脂組成物及び感光性ドライフィルムレジスト、並びにその利用

Also Published As

Publication number Publication date
KR20060056309A (ko) 2006-05-24
JPWO2005006826A1 (ja) 2007-09-20
JP5214106B2 (ja) 2013-06-19
JP2011236428A (ja) 2011-11-24
TW200505994A (en) 2005-02-16
WO2005006826A1 (ja) 2005-01-20
KR101058972B1 (ko) 2011-08-23
JP5564012B2 (ja) 2014-07-30

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