TWI339134B - Liquid material applying apparatus and liquid material applying method - Google Patents

Liquid material applying apparatus and liquid material applying method Download PDF

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Publication number
TWI339134B
TWI339134B TW097100529A TW97100529A TWI339134B TW I339134 B TWI339134 B TW I339134B TW 097100529 A TW097100529 A TW 097100529A TW 97100529 A TW97100529 A TW 97100529A TW I339134 B TWI339134 B TW I339134B
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Taiwan
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substrate
coating
scanning direction
solvent
organic
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TW097100529A
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Chinese (zh)
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TW200836845A (en
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Suzuki Satoshi
Abe Makoto
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Dainippon Screen Mfg
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02107Forming insulating materials on a substrate
    • H01L21/02225Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
    • H01L21/0226Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
    • H01L21/02282Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Coating Apparatus (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Description

1339134 九、發明說明: 塗佈含有揮發性溶劑的流 【發明所屬之技術領域】 本發明係關於一種在基板上 動性材料之技術。 【先前技術】 以往,在半導縣板(以下_「基板」)上將阻劑液等 流動性材料塗佈的裝置,習知有如日本專利 # 2_-1 7402號公報及日本專利特開·一13?87號公報所 揭不’藉由將連續吐出流動性材料的噴嘴在基板上進行掃 描,而對基板主面整域以相互接觸之複數平行線狀塗佈流 • 動性材料的塗佈裝置。 此種塗佈裝置有各種為能提高流動性材料膜厚均勻性 之技術提案。例如在日本專利特開2〇〇3_174〇2號公報中 便有揭示,將經阻劑塗佈裝置施行塗佈液塗佈的基板,於 阻劑塗佈裝置之外另行設置的溶劑環境裝置中,暴露於塗 籲佈液的溶劑環境中,藉此使溶劑附著於塗佈液表面上並降 低塗佈液表面的黏性,然後,在收容有基板的容器内形成 氣⑺I· ’並藉由該氣流而將塗佈液表面平坦化的技術。在曰 本專利特開2003-1 7402號公報中尚揭示,藉由對收容有 、--Ϊ* %行塗佈液塗佈之基板的容器内施行加壓,而抑制塗佈 液揮發的技術。 曰本專利特開2005-13787號公報的塗佈成膜裝置中, 係在基板上方2mm以内的位置處,設置幾乎覆蓋基板整體 的防乾燥板,並就該防乾燥板中所形成的直線狀間隙,將 97100529 6 吐出絕緣顧塗佈液㈣嘴對基板進行掃描,藉此在基板 =均勻”仃塗佈液的塗佈。由此,在基板與防乾燥板之 、:形成I農度溶劑環境’財卩制基板上所塗佈塗佈液的乾 t。此外:日本專利特開20〇5-13787號公報的塗佈成臈 :置中’係將經滲入溶劑的海綿構件設置於防乾燥板上, 並將從海綿構件所蒸發的溶劑蒸氣,從防乾燥板中所形成 的供應孔,供應給基板與防乾燥板之間,藉此更加提高基 板與防乾燥板間的溶劑濃度。 但是,藉由將吐出流動性材料的喷嘴進行掃描,而在基 板上塗佈流動性材料的塗佈裝置,亦被利用於對平面顯示 裝置用基板塗佈含有像素形成材料之流動性材料之時。此 種?置係例如藉由依既定間距排列的複數喷嘴之掃描、及 朝掃方向的垂直方向之基板步進移動重複進行’而對基 板上所形成的隔壁間之複數溝令,條紋狀塗佈流動性材 料。 在基板上,藉由從流動性材料的各線條使溶劑成分蒸 發,而將像素形成材料固定於基板上,形成像素形成材料 的膜’藉由在截至溶劑蒸發為止的期間,使像素形成材料 在流動性材料的各線條内充分地分散,便可使像素形成材 料的膜厚均勻。 然而,當利用複數噴嘴進行流動性材料的塗佈時,因為 在基板步進移動方向的後側並未塗佈流動性材料,因而複 數喷嘴中’由就步進移動方向上位在最後側之喷嘴所塗佈 的流動性材料線條周圍中,就該線條的步進移動方向上屬 97100529 1339134 於後側環境中的溶劑成分濃度,係較低於前側的濃度。 所以,就由該噴嘴所塗佈流動性材料的線條之步進移動 方向上位於後側的部位,係較前側部位更早乾燥,在基板 上所形成的像素形成材料膜中,後側部位的膜厚較大於前 側位的膜厚。結果’當觀看整體基板時便發生塗佈不 :句:成為產品後的平面顯示裝置中顯示品質會有降低之可 發明内容】 置本:佈流動性材料的_ ^ ^ . '"置中,使從複數吐出口中就副掃為 向^於基板相對移動方向後 材料的乾燥逑度,在副掃描方向上達到均勾所土出_ 塗佈裝置係具備有基板保持部、 =:::部係保持基板;該吐出機構係朝= 土出抓動性材料;該移動機板 上述基板主㈣主掃財向上對構在平行於 每次m掃財動’同時 ,機構朝平行於上述主面且垂直於上述主=土述 田1j知描方向相對# # . & ^ i 知私方向的 上依等間隔排列的複數吐出:=:=掃描方向 供於上述基板上之材科的第〗流動性==劑與提 :上:塗佈區域塗佈上述第!流動,·:=上述基 係相對於上述第丨吐屮 °亥第2吐出部 出部’被配置於上述副掃福方向上之 97100529 ^ 1339134 上述基板的相對移動方向後側,藉由吐出上述第1流動性 材料的上述溶劑或.與上述溶劑相等的揮發性材料之^第2 流動性材料,而在上述基板上的上述塗佈區域塗佈上述第 2流動性材才斗。根據本發日月,可使複數〇土出口 +,從在副 掃4田方向上位於基板相對移動方向後侧的吐出口所吐出 之第1流動性材料的乾燥速度,在副掃描方向上形成大致 均勻。 _ 本發明一較佳實施形態,係在上述吐出機構令,上述第 2吐出部相對於上述第丨0土出部的相對位置被固定。藉 .此,便可將吐出機構與移動機構的構造簡單化。此外,^ .好上述第1吐出部係連續吐出上述第1流動性材料,上述 第2吐出部係連續吐出上述第2流動性材料。更進一步, 最 述第2吐出部係從上述副掃描方向上於不同位置 處的複數吐出口吐出上述第2流動性材料。 本發明另一較佳實施形態中,上述吐出機構係更進一步 籲具備有另-第2吐出部,其係相對於上述第卜土出部,被 配置於上述副掃摇方向上的上述基板相對㈣方向前 侧,並吐出上述第2流動性材料,而當利用上述第丨吐出 部開始上述第1流動性材料的塗佈時,藉由上述另一第2 吐出部在上述主掃描方向上移動並吐出上述第2流動性 才料而在上述基板的上述塗佈區域外側之非塗佈區域塗 佈上述第2流動性材料。藉此,便可使在塗佈區域的相對 =動方向前側所塗饰之第!流動性材料的乾燥速度,在副 掃描方向上形成大致均勻。 (S > 97100529 9 1339134 a本發明再另—實施形態’塗佈I置係係更進—步 ==其係在上述基板的上述副掃描方向上: 上述基板相對性固定,並供應上如流 ==上述溶劑或與上述溶劑相等的揮發性材料的 的第〗二 使在塗佈區域相對移動方向前側所塗佈 均= >爪動性材料之乾燥速度,於副掃描方向上形成大致 機=發態樣的塗佈裝置係具備有:基板保持部、吐出 =、移動機構、及氣體供應部;該基板保持部係保持基 二:吐出機構係從在上述基板主面的平行副掃描方向: =間隔排列的複數吐出口,朝上述基板上的塗佈區域, 吐出含有揮發性溶劑及提供於上述基板上之材料的流 ,材料;該移動機構係使上述吐出機構在垂直於上述副掃 =向且平行於上述主面的轉描方向上對於上述基板 相對移動,同時在每次朝上述主掃描方向進行移動時,便 2上述基板對上述吐出機構朝上述副掃描方向相對移 動,該氣體供應部係在上述吐出機構的上述副掃描方向上 之上述基板的相對移動方向後側,對於上述吐出機構的上 相掃描方向之相對位置被固定,同時供應上述流動性材 科的上述溶劑或與上述溶劑相等的揮發性材料的氣體。 夺上述氣體供應部最好具有涵蓋上述塗佈區域的上述主 掃描方向全長相對向於上述基板的上述主面同時朝 主面嗔出上述氣體的喷出口。此外,塗佈裝置最好更且備 有另-氣體供應部,其係在上述基板的上述副掃指方向、上1339134 IX. Description of the invention: Coating a flow containing a volatile solvent [Technical Field of the Invention] The present invention relates to a technique for a dynamic material on a substrate. [Prior Art] Conventionally, a device for applying a fluid material such as a resist liquid to a semi-conducting plate (hereinafter referred to as "substrate") is known as Japanese Patent No. 2_-1 7402 and Japanese Patent Laid-Open No. 13-87 discloses that the nozzles for continuously discharging the fluid material are scanned on the substrate, and the main surface of the substrate is coated with a plurality of parallel linear coatings for the flow of the movable material. Cloth device. Such a coating device has various technical proposals for improving the uniformity of the film thickness of the fluid material. For example, Japanese Laid-Open Patent Publication No. Hei. No. 2-174-2 discloses that a substrate coated with a coating liquid by a resist coating apparatus is separately provided in a solvent environment apparatus other than the resist coating apparatus. Exposed to the solvent environment of the coating liquid, thereby allowing the solvent to adhere to the surface of the coating liquid and reducing the viscosity of the surface of the coating liquid, and then forming a gas (7)I·' in the container in which the substrate is housed. This gas flow is a technique for flattening the surface of the coating liquid. A technique for suppressing volatilization of a coating liquid by pressurizing a container in which a substrate coated with a coating liquid is applied is disclosed in Japanese Laid-Open Patent Publication No. 2003-1 7402. . In the coating film forming apparatus of Japanese Laid-Open Patent Publication No. 2005-13787, a drying prevention plate covering almost the entire substrate is provided at a position within 2 mm above the substrate, and a linear shape formed in the drying prevention plate is provided. In the gap, the 97100529 6 spit out the insulating coating liquid (four) nozzle to scan the substrate, thereby applying the coating liquid on the substrate = uniform. Thus, in the substrate and the anti-drying plate: forming the I agricultural solvent The dry coating of the coating liquid applied on the substrate of the environmentally-friendly substrate. In addition, the coating of the coating of the Japanese Patent Laid-Open No. 20-53-1787 is set to prevent the sponge member which has been infiltrated with the solvent. The drying plate is supplied with a solvent vapor evaporated from the sponge member from a supply hole formed in the drying prevention plate to the substrate and the drying preventing plate, thereby further increasing the solvent concentration between the substrate and the drying preventing plate. However, a coating device that applies a fluid material to a substrate by scanning a nozzle that discharges a fluid material is also used for applying a fluid material containing a pixel forming material to a substrate for a flat display device. This For example, the scanning of the plurality of nozzles arranged at a predetermined pitch and the stepwise movement of the substrate in the vertical direction of the sweeping direction are repeated to form a plurality of grooves between the partition walls formed on the substrate, and the stripe coating flow is performed. On the substrate, the film forming material is fixed on the substrate by evaporating the solvent component from the respective lines of the fluid material, thereby forming a film of the pixel forming material by making the pixel during the period until the solvent evaporates. The forming material is sufficiently dispersed in each line of the fluid material to make the film thickness of the pixel forming material uniform. However, when the fluid material is coated by the plurality of nozzles, the back side of the substrate is moved in the stepwise direction. The fluid material is not coated, and thus the plurality of nozzles are surrounded by the flow material line coated by the nozzle on the last side in the step movement direction, and the step movement direction of the line is 97100529 1339134. The concentration of the solvent component in the side environment is lower than the concentration on the front side. Therefore, the line of the fluid material coated by the nozzle The portion located on the rear side in the step of moving in the direction is dried earlier than the front side portion, and in the film of the pixel forming material formed on the substrate, the film thickness of the rear side portion is larger than the film thickness of the front side portion. When the substrate is coated, it does not appear: Sentence: The display quality of the flat display device after the product is reduced. The content of the display: The _ ^ ^ . '" of the flowable material of the cloth is placed in the plural to spit out In the mouth, the sub-sweeping is the dryness of the material after the relative movement direction of the substrate, and the homogenization is achieved in the sub-scanning direction. The coating device is provided with a substrate holding portion and a =::: portion holding substrate; The discharge mechanism is directed toward the soil-moving material; the main plate of the moving machine plate (four) main sweeping is upwardly aligned parallel to each m sweeping while the mechanism is parallel to the main surface and perpendicular to the above Main = 土述田1j know the direction of the opposite direction # # . & ^ i In the direction of the privilege, the plurals are arranged at equal intervals: =: = the scanning direction is supplied to the material on the substrate. Agent and Lift: Top: Coating area coated above! Flow: ·: = The above-mentioned base system is disposed on the rear side of the relative movement direction of the substrate in the direction of the relative movement of 97100529 ^ 1339134 of the second discharge portion of the second discharge portion in the sub-sweeping direction The second fluid material of the first fluid material or the second fluid material of the volatile material equal to the solvent, and the second fluid material is applied to the coating region on the substrate. According to the present day and the circumstance, the plurality of alumina outlets + can be formed in the sub-scanning direction from the drying speed of the first fluid material discharged from the discharge port on the rear side in the direction in which the substrate is moved in the direction of the sub-sweeping field. It is roughly uniform. According to a preferred embodiment of the present invention, in the discharge mechanism, the relative position of the second discharge portion with respect to the third earthing portion is fixed. By this, the structure of the discharge mechanism and the moving mechanism can be simplified. Further, it is preferable that the first discharge portion continuously discharges the first fluid material, and the second discharge portion continuously discharges the second fluid material. Further, in the second discharge unit, the second fluid material is discharged from the plurality of discharge ports at different positions in the sub-scanning direction. In another preferred embodiment of the present invention, the discharge mechanism further includes a second discharge portion that is opposite to the substrate disposed in the sub-sweep direction with respect to the discharge portion (4) the second fluid material is discharged from the front side, and when the first fluid material is applied by the first discharge unit, the other second discharge unit moves in the main scanning direction. And discharging the second fluidity material, and applying the second fluid material to the non-coating region outside the coating region of the substrate. In this way, the first side of the coating area can be painted on the front side of the opposite direction! The drying speed of the fluid material is substantially uniform in the sub-scanning direction. (S > 97100529 9 1339134 a further embodiment of the present invention - the coating I system is further advanced = step == in the sub-scanning direction of the substrate: the substrate is relatively fixed and supplied as Flow == The second solvent of the solvent or the volatile material equivalent to the above solvent is applied to the front side of the coating region in the direction of relative movement, and the drying speed of the claw-moving material is formed in the sub-scanning direction. The coating device of the machine-like aspect includes a substrate holding portion, a discharge unit, a moving mechanism, and a gas supply unit; the substrate holding portion holds the base 2: the discharge mechanism is a parallel sub-scan from the main surface of the substrate Direction: a plurality of intermittent discharge ports, discharging a flow of material containing a volatile solvent and a material supplied to the substrate toward a coating area on the substrate; the moving mechanism is such that the discharge mechanism is perpendicular to the pair Sweeping in the direction of the parallel direction of the main surface and moving relative to the substrate, and simultaneously moving each time toward the main scanning direction, the substrate is facing the discharge mechanism toward The sub-scanning direction is relatively moved, and the gas supply unit is fixed to the rear side in the relative movement direction of the substrate in the sub-scanning direction of the discharge mechanism, and the relative position of the upper-phase scanning direction of the discharge mechanism is fixed. The gas of the fluidity material or the gas of a volatile material equivalent to the solvent. Preferably, the gas supply unit has a total length in the main scanning direction that covers the coating region, and the main surface of the substrate is simultaneously facing the main surface. Preferably, the coating device has a discharge port for the gas. Further, the coating device is further provided with a further gas supply portion in the direction of the sub-sweeping finger of the substrate.

c S 97100529 10 I339l34 之相對移動方向前侧,相對於上述基板被相對固定,並供 應上述流動性材料.的上述溶劑或與上述溶助等的揮發 性材料的氣體。 本發明係針對録板塗佈流動性材料的塗佈方法。上述 目的、以及其他目的、特徵、態樣及優點,參照所附圖式, 由以下的發明詳細說明可清楚明瞭。 【實施方式】 春圖1所耗本發明第1實施形態的塗佈裝置丨俯視圖, ,圖2所示係塗佈裝置!的右側視圖。 顯示裝置用玻璃基板9(以下簡稱「基板9」)上== 有平面顯示農置用之像素形成材料的流動性材料 f。本實施形態中,塗佈裝置1係在主動矩陣驅動式之有、 EL(Electr〇 LUminescence)顯示裝置用基板 9 上, 佈含有揮發性溶劑[例如芳香族有機溶劑之一的均三笑c S 97100529 10 I339l34 The front side in the relative movement direction is relatively fixed to the substrate, and the solvent of the fluid material or the gas of the volatile material such as the above-mentioned solvent is supplied. The present invention is directed to a coating method for a sheet-coated fluid material. The above and other objects, features, aspects and advantages of the invention will be apparent from [Embodiment] A top view of a coating apparatus according to a first embodiment of the present invention, which is consumed by Figure 1, is shown in Fig. 2 as a coating apparatus! Right side view. On the glass substrate 9 for display device (hereinafter referred to as "substrate 9"), == a fluid material f having a flat surface for displaying a pixel forming material for agricultural use. In the present embodiment, the coating apparatus 1 is provided on an active matrix drive type substrate 9 for EL (Electr® LUminescence) display device, and contains a volatile solvent [for example, one of the aromatic organic solvents

Cniesitylene; I) (1, 3, 5- f ^ ) ] . g 有機EL材料的流動性材料(以下稱「有機el液」)。 =裝置如圖2所示’具備有保持基板9的基板保Cniesitylene; I) (1, 3, 5- f ^ ) ] . g A fluid material of an organic EL material (hereinafter referred to as "organic el liquid"). = device as shown in Fig. 2 'provided with a substrate holding the substrate 9

二’且如圓i與圖2所示具備有基板移動機構H 该基板移動機構12係將基板保持部11在基板9主面上朝 :既定方向(即,圓丨中的”向,以下稱「副掃: '»、」:水,移動’並且以朝垂直方向(即z方向)的 心進订旋轉。基板保持部u内部具備有由加 成 的加熱機構(未圖示)。 …、益構成 塗佈裝置1尚具備有:對準標記檢測㉝13、塗佈頭14、 97100529 I339134 塗佈頭移動機構15、2個為、六& 部18;該對…於/ 部16、及流動性材料供應 X灯+仏έ己檢測部13係 對準標記(未圖 係拍攝在基板9上所形成的 持部丨u參照圖2)== 構;該塗佈頭移動機構:出:動:材料的吐出機The second substrate is provided with a substrate moving mechanism H as shown in FIG. 2, and the substrate moving mechanism 12 is configured such that the substrate holding portion 11 faces the main surface of the substrate 9 in a predetermined direction (that is, in a circular shape). "Sub-scan: '»,": water, moves 'and rotates in the direction of the vertical direction (i.e., the z direction). The substrate holding portion u is provided with an additional heating mechanism (not shown). The coating device 1 is provided with: alignment mark detection 3313, coating head 14, 97100529 I339134 coating head moving mechanism 15, two, six & portion 18; the pair ... / portion 16, and flow The material supply X lamp + the detection unit 13 is an alignment mark (the holding portion 丨u formed on the substrate 9 is not shown in the drawing), and the coating head moving mechanism is: : material spit machine

+ r 义 3保將盒佈頭14朝平行於其扨Q 主面且垂直於副掃描方向的方向(即圖】千订於基板9 下%「主掃描方向」)進 、°以 佈頭14的移動方向(即,心液部“係在塗 二側,同時承接來置於基板保持部11 料供應部18係對塗佈^^ 機EL液;該流動性材 1所干,特蚀I 應流動性材料;此外,如圖 制=。 更具備有對料構成進行控制的控 在塗佈裝置1中,塗佈頭移 12成為將塗佈頭14在主掃H機415與基板移動機構 且將基板9㈣移動並 機構。如後述,塗佈裳置! t,當對基板 = 從圖1中的⑼侧朝在副掃描方向上 側成為副掃描方向上的基板9 ::對::1:— ^ ^ ,i #^ ^9 ^ 5之,圖1中的(+γ)側传美杯、 游側’而(-”侧係基板9;動的上 塗佈頭14係具備有:複數第1喷 — 設為3個)、第2噴嘴142、及噴嘴 貫施形態中 '角托木143 ;該第1噴嘴 97100529+ r 3 guarantees that the head 14 is oriented parallel to the main surface of the 扨Q and perpendicular to the sub-scanning direction (that is, the figure is set to "% of the main scanning direction" of the substrate 9), and the movement of the cloth head 14 is performed. The direction (ie, the heart liquid portion is "on the two sides of the coating", and is received at the substrate holding portion 11 and the material supply portion 18 is attached to the coating machine EL liquid; the fluid material 1 is dried, and the special etching I should flow. In addition, as shown in Fig. =. Controlling the composition of the material is controlled. In the coating device 1, the coating head is moved 12 to turn the coating head 14 on the main scanning machine 415 and the substrate moving mechanism and The substrate 9 (four) is moved and the mechanism is applied as described later, and the substrate is placed on the substrate 9 in the sub-scanning direction from the (9) side in FIG. 1 toward the upper side in the sub-scanning direction :::::1:-^ ^ , i #^ ^9 ^ 5, in the (+ γ) side of the Figure 1, the beauty cup, the swimming side 'and the (-) side substrate 9; the moving upper coating head 14 is equipped with: plural number 1 Spray - set to 3), the second nozzle 142, and the nozzle in the form of a 'corner 143; the first nozzle 97100529

12 類的有……喷… 掃描方向上的基板^41,分別於(_γ)側與(+γ)側(即副 個,且連續吐出有棬目對移動方向後側與前側)各配設1 噴嘴托架143^ 液的溶劑(以下簡稱「溶劑」); 嘴142之+山、起保持3個第1喷嘴141與2個第2噴 為142之吐出部保持部。 塗佈裝詈1 Φ , ΐϊ 對於第i = 托架143,將第2喷嘴142相 構15與基板移動置固定,並利用塗佈頭移動機 描方向斑副掃ί方^ 2 ’將塗佈頭14對基板9在主掃 便與3個第!嘴田嘴⑷相對移動’藉此2個第2嗔嘴14 2 描方向上2 = :™ 5個喷嘴(即第1噴嘴141及第2喷嘴142),在圖】_ 的X方向(即主掃描方向)上排列成略直線狀,同時僅些微 偏離圖1中❸Y方向(即副掃描方向)配置。5個噴嘴的吐 •出口係在副掃描方向上等間隔排列,相鄰接2個喷嘴的吐 出口間在副掃描方向上的距離,係等於在基板9的塗佈區 域91(圖1中由虛線所圍繞表示)上預先形成且朝主掃描 方向延伸的隔壁間之間距(以下稱「隔壁間距」)的3倍。 塗佈裝置1中,從3個第!喷嘴141朝在塗佈區域Μ 的隔壁間所形成之3條溝’吐出有機EL液而施行塗佈。 在利用塗佈褒置]將有機EL液施行塗佈的2條溝間,央 持有利用其他塗佈裝置等施行其他種類有機EL液塗佈的 2條溝。基板9中,因為塗佈區域91外側的區域92,利 97100529 13 1339134 用於驅動電路之組裝、或後續步驟利用絕緣膜的密封等方 面,因而屬於不應塗佈有機EL液的區域,以下稱「非塗 佈區域92」。另外,在非塗佈區域92中並未形成有隔壁。 其次,針對利用塗佈裝置1施行有機EL液之塗佈進行 說明。目3所示係有機EL液的塗佈流程圖。當利用塗佈 裝置1施行有機EL液塗佈日夺’首先,將基板9載置並保 持於基板保持部11上’根據從對準標記檢測部13的輸 •出’驅動基板移動機構12而進行基板9的移動與旋轉 而位於圖1中貫線所示的塗佈起始位置(步驟S11 )。換古 之,塗佈頭14位於相對基板9進行副掃描方向相對移= 塗佈頭14預先位於圖!與圖2中實線所示待機位置^ =1令的(-X)側受液部16上方)。此時,基板9的塗㈣ 靠圖1中(+Y)側(即副掃描方向上的基板”目對移鸯 方向則側)邊緣,位於塗佈頭14靠(+1〇側的第2 和與該第2喷嘴142所鄰接的第!噴嘴141之鬥、。 接”用控制部2對塗如4進行控制;而開始狄 個第1噴嘴141吐出有機⑶液,從第i喷嘴 掃猫方向二側(即⑼側與(-Ό側)的第2喷嘴142門 ,,並且控制塗佈頭移動機構15,開始:二 =描方向上的移動(即從圖丨中的 塗佈裝置1中,當塗佈頭14朝主掃福方 精由從第1喷嘴141與第2噴嘴142分別將有機虹液: 97100529 溶劑朝基板9造# ,, 條溝中,將有機Γ 便在基板9之塗佈區域91的3 行地,在j hi液條紋狀塗佈,且與有機乩液塗佈並 描方向:的 1條溝中塗佈溶劑。 後側),於塗佈區域91的 行:者在區域91施行有機&液與溶劑之塗佈並 上的基板9相對條溝之(+Υ)側(即副掃搞方向 側的非塗佈區域92 ^前側)’於塗佈區域91靠⑼ 基板9上相鄰二二塗佈溶劑(步驟叫此時’ 鄰接有機EL液線條j^之之2條線條間的距離、及相 距的3倍。另外,圖二劑線條間的距離’等於隔壁間 侧的非塗佈區域92由未:塗:區域91靠⑼側與") 機EL液與溶劑。 皁禝盍因此未被塗佈有 4t:;=EL液與溶劑分別設為第1流動性材料 Ί 2 w動性材料,則塗佈頭 t 動性材料與第2流動性材料的吐出機構上出= U1成為從在|彳掃描方 ㈣4 1喷嘴 出第!流動性材料並對塗二^ ”列的複數吐出口吐 部。此外,在複數第1喷:二91二行塗佈的第1吐* 所配置第2喷嘴142,成Λ +山Ρ 吐出部)的(-Υ)側 區域9】施行塗佈的第2吐㈣第2流動性材料並對塗佈 ⑼側所配置第2喷嘴142n复數第1喷嘴141的 對非塗佈區域92施行塗佈的::土出第2流動性材料並 乃一弟Z吐出部。 97100529The 12th type of ... is sprayed... The substrate ^41 in the scanning direction is disposed on the (_γ) side and the (+γ) side (that is, the second one, and the continuous discharge has the eyes on the rear side and the front side in the moving direction). (1) The solvent of the liquid in the nozzle holder 143 (hereinafter referred to as "solvent"); the + nozzle of the nozzle 142, and the discharge portion holding portion for holding the three first nozzles 141 and the two second nozzles 142. Coating device 1 Φ , ΐϊ For the i-th bracket 143, the second nozzle 142 structure 15 is moved and fixed to the substrate, and the coating head is moved by the coating head. Head 14 on the base 9 in the main broom with 3 first! Mouth mouth (4) relative movement 'Through the two second nozzles 14 2 in the direction 2 = : TM 5 nozzles (ie, the first nozzle 141 and the second nozzle 142), in the X direction of the figure _ (ie, the main The scanning direction is arranged in a substantially linear shape, and is only slightly deviated from the ❸Y direction (ie, the sub-scanning direction) in FIG. The spouts and outlets of the five nozzles are arranged at equal intervals in the sub-scanning direction, and the distance between the discharge ports adjacent to the two nozzles in the sub-scanning direction is equal to the coating area 91 of the substrate 9 (in FIG. 1 The distance between the partition walls which are formed in advance and which extend in the main scanning direction (hereinafter referred to as "partition pitch") is three times. In the coating device 1, from the 3rd! The nozzle 141 discharges the organic EL liquid into the three grooves formed between the partition walls of the coating region Μ and applies the coating. Between the two grooves in which the organic EL liquid is applied by the coating method, two grooves which are coated with other types of organic EL liquid by another coating device or the like are held. In the substrate 9, because the region 92 outside the coating region 91, Lee 97100529 13 1339134 is used for the assembly of the driving circuit, or the sealing step using the insulating film in the subsequent steps, etc., and thus belongs to the region where the organic EL liquid should not be applied, hereinafter referred to as "Non-coated area 92". Further, a partition wall is not formed in the non-coating region 92. Next, the application of the organic EL liquid by the coating device 1 will be described. The coating flow chart of the organic EL liquid is shown in Item 3. When the organic EL liquid coating is applied by the coating device 1 , first, the substrate 9 is placed and held on the substrate holding portion 11 'by driving the substrate moving mechanism 12 from the alignment mark detecting portion 13 ' The movement and rotation of the substrate 9 are performed at the coating start position shown by the line in Fig. 1 (step S11). In other words, the coating head 14 is located on the opposite substrate 9 for relative movement in the sub-scanning direction = the coating head 14 is located in advance! The (-X) side liquid receiving portion 16 is placed at the standby position ^ =1 command shown by the solid line in FIG. 2 . At this time, the coating (4) of the substrate 9 is located on the (+Y) side in FIG. 1 (that is, the substrate in the sub-scanning direction) on the side opposite to the moving direction, and is located on the coating head 14 (the second side on the +1 side). The bucket of the first nozzle 141 adjacent to the second nozzle 142 is connected to the coating unit 4 by the control unit 2, and the first nozzle 141 is discharged to discharge the organic (3) liquid, and the first nozzle is used to sweep the cat. The second nozzle 142 door on the two sides of the direction (ie, the (9) side and the (-Ό side), and controls the coating head moving mechanism 15, starting: two = movement in the drawing direction (ie, from the coating device 1 in the drawing) When the coating head 14 is facing the main sweeper, the organic liquid: 97100529 solvent is made toward the substrate 9 from the first nozzle 141 and the second nozzle 142, respectively, and the organic sputum is on the substrate 9 in the groove. In the three rows of the coating region 91, the solvent is applied in stripes, and the solvent is applied to one groove in which the organic sputum is applied and drawn. The rear side is in the line of the coating region 91. In the region 91, the coating of the organic & liquid and the solvent is applied, and the substrate 9 on the (+Υ) side of the groove (ie, the non-coated region 92 front side of the sub-sweeping direction side) is applied to the coating region. 91 by (9) The substrate 9 is coated with a solvent adjacent to the substrate (the step is called 'the distance between the two lines of the adjacent organic EL liquid line j^ and the distance between the two lines. In addition, the distance between the lines of the two agent lines is equal to the next wall. The non-coated region 92 on the intermediate side is not: the coating region 91 is on the (9) side and the ") machine EL liquid and solvent. The saponin is therefore not coated with 4t:; = EL liquid and solvent are set to be the first The flowable material Ί 2 w the movable material, the coating head t dynamic material and the second fluid material discharge mechanism are output = U1 becomes the first liquid material from the 4 喷嘴 4 (4) nozzle (-Υ) of the second nozzle 142 in the first jetting and the second jetting in the first and second jets of the second and second rows The side region 9 is applied with the second spun (four) second fluid material applied, and the second nozzle 142n disposed on the coating (9) side is coated with the first non-coating region 92 of the first nozzle 141: 2 The fluid material is a brother Z spit out. 97100529

< S 1339134 田塗佈頭14移動至圖]與圖2中二 位置(即,圖!中靠⑼側的受液部^^戶斤示的待機 佈碩14在主掃描方向上的移動,便藉由^結束塗 頭Η進行控制,而停止從( + γ)側(即副^ °對塗佈 相對移動方向前側)的第2喷嘴14 °上的基板<S 1339134 The field coating head 14 moves to the position shown in Fig. 2 and the two positions in Fig. 2 (i.e., the liquid receiving portion on the (9) side of the figure is moved in the main scanning direction, By controlling the coating head to control, the substrate on the second nozzle 14° from the (+ γ) side (ie, the front side of the coating relative movement direction) is stopped.

Sl3)。然後,驅動基板移動機構12 °出溶劑(步驟 持部U-起朝圖丨中的⑻側(即副;:方 =基板保 隔壁間距9件的離f斗·锁Q1 /1、 ° )移動等於 個笛」 ⑷。此時,塗佈頭14從3 個幻嘴嘴141與(-Y)側第2喷嘴142 4 續吐出有機EL液與溶劑。 HP 16連 因中,為有機⑽的溶劑係利用速乾性物, ,此由第1噴嘴141在塗佈區域91上所塗佈的有機壯 塗佈後至步驟S14中基板9朝副掃描方向移動之 材㈣乂 ί速乾燥(即溶劑從有機以液中蒸發),有機乩 7貝在半乾燥狀態殘留於基板9上(即提供),而形成有 機材料的臈。此外,從第2嘴嘴142在塗佈區域w與 非塗佈區域92上所塗佈的㈣,係全部(或者除些微量^ 夕。卜的其餘幾乎全部)蒸發’未殘留於塗佈區域91與非塗佈 Εΐ 域 9 2 。 當副掃描方向上的基板9移動結束,則塗佈頭14便在 從3個第!噴嘴141與(_¥)側第2噴嘴ι42分別連續吐出 有機EL液與溶劑之情況下,藉由從圖1中的(+X)側朝(―χ) 側(即主掃描方向)移動,而在基板9的塗佈區域9丨之溝 中施行有機EL液與溶劑的塗佈(步驟S15)。此時,3個第Sl3). Then, the substrate moving mechanism is driven to remove the solvent by 12° (the step holding portion U- moves toward the (8) side in the drawing (that is, the side; the square=the substrate spacer wall spacing is 9 pieces away from the f bucket·lock Q1 /1, °) (4) At this time, the coating head 14 continuously discharges the organic EL liquid and the solvent from the three magic nozzles 141 and the (-Y) side second nozzles 142 4 . The HP 16 is a solvent for the organic (10). The quick-drying material is used, and the material that is moved by the first nozzle 141 on the coating region 91 after the organic coating is applied to the substrate 9 in the sub-scanning direction in step S14 is dried (ie, the solvent is from the solvent). The organic layer is evaporated in a liquid, and the organic cerium 7 remains on the substrate 9 in a semi-dry state (that is, supplied) to form a ruthenium of an organic material. Further, from the second nozzle 142 in the coated region w and the uncoated region (4) coated on 92, all (or except for some traces), almost all of the evaporation "does not remain in the coated region 91 and the uncoated region 9 2 . When the substrate 9 in the sub-scanning direction When the movement is completed, the coating head 14 continuously ejects the organic EL liquid from the third nozzle 141 and the (_¥) side second nozzle ι42. In the case of a solvent, the organic EL liquid and the solvent are applied to the groove of the coating region 9 of the substrate 9 by moving from the (+X) side in FIG. 1 toward the (χ) side (ie, the main scanning direction). Coating (step S15). At this time, three

97100529 噴觜141中,從( + γ;)側(即副掃描 移動方向前側)的第· i喷嘴14 向上的基板9相對 在步驟S12中終Y)側第2噴嘴二出有機EL液’被塗佈 述’因為經第2噴嘴14 2塗佈的溶、::劑因之f ’如上 況。 發生與先月,』所塗佈溶劑相混合的情 二主的塗佈頭U移動結束時,基板9便朝 距釘牛)(即副掃描方向)移動等於隔壁間距9伴的 距離(步驟S16)。然後,由控制 W门'"倍的 與基板9是否已移動至圖丨中制:二確認基板保持部η 處(步㈣υ,當尚未移動至C塗佈結束位置 嘴嘴U2分別吐出有機EL 嘴嘴141與(-Υ)側第2 ^ Ί、溶劑之情況下,朝主掃描 動’精此便對基板9的塗佈區域9!之溝施行有機 方ΓΓΓ1的塗佈(步驟S15) °㈣,基板9便朝副掃描 方向移動,並執行是否已移動 评彻 ^S16 ^S17)〇 移動至塗佈結束位置的確認(步 j佈裝置1中,截至基板保持部U與基板9位於塗佈 :束位置為止’重複進行塗佈頭14在主掃描方向上的移 以及基板9朝(+γ)侧的步進移動(即每次塗佈頭對 基板9在主掃財向上施行㈣移動時,基板9便對塗佈 頭14朝副掃描方向相對移動),藉此,在基板9的塗佈區 域91巾’有機EL液便被塗佈成依既定間距(即等於隔壁 間距3倍的間距)排列的條紋狀(步驟si5〜si7)。塗佈裝 97100529 17 1^39134 中,相關副掃描方向,在基板9上的有機虹液塗佈 進饤方向(即塗佈頭14對基板9的相對移動 板移動機構12對基板9移動方向之相反方向。為基 當基板9移動至塗佈結束位置後,便停止從" 噴^ 141與(-γ)側第2喷嘴142所進行的有機乩液 一 >谷劑吐出’而結束利用塗佈 E 裝對基板9施行的有機 乂人 佈頭14對1片基板9施行最後主掃 2喷嘴142所吐出的溶劑,塗佈於圖1 區域91之側非塗佈區域92。經塗佈裝置1 便搬送於其他的塗佈裝置等之中,並塗佈 ..二塗佈裝置1塗佈的有97100529 In the squirt 141, the substrate 9 from the (i γ;) side (that is, the front side in the sub-scanning direction) is upwardly opposed to the second nozzle in the step S12. The coating is described as "the dissolution of the coating by the second nozzle 142" is as follows. When the movement of the coating head U of the second main product is mixed with the solvent to be applied, the substrate 9 is moved toward the nail (ie, the sub-scanning direction) by a distance equal to the distance of the partition wall 9 (step S16). . Then, by controlling whether the W gate '" and the substrate 9 have been moved to the figure: 2, confirming the substrate holding portion η (step (4) υ, when not moving to the C coating end position, the mouth U2 respectively discharges the organic EL When the nozzle 141 and the (-Υ) side are 2^ Ί and the solvent is applied, the coating of the organic square 1 is applied to the groove of the application region 9 of the substrate 9 toward the main scanning (step S15). (4) The substrate 9 is moved in the sub-scanning direction, and the confirmation of whether or not the movement has been moved to the coating end position has been performed (in the step J cloth device 1, the substrate holding portion U and the substrate 9 are located in the coating). Cloth: the position of the beam is repeated 'the movement of the coating head 14 in the main scanning direction and the stepping movement of the substrate 9 toward the (+γ) side are repeated (that is, each coating head is applied to the substrate 9 in the main sweeping direction (four) movement) At this time, the substrate 9 is relatively moved toward the sub-scanning direction of the coating head 14, whereby the organic EL liquid is applied at a predetermined pitch (i.e., equal to 3 times the spacing of the partition walls) in the coating region 91 of the substrate 9. The pitch is arranged in a stripe shape (steps si5 to si7). In the coating device 97100529 17 1^39134, the relevant sub-scan The organic rainbow on the substrate 9 is coated in the direction of the weir (ie, the direction in which the coating head 14 is opposite to the direction in which the substrate 9 moves relative to the substrate 9 in the direction of movement of the substrate 9). After the position, the organic sputum > sputum discharge is performed from the "spray 141 and the (-γ) side second nozzle 142, and the organic enamel cloth head applied to the substrate 9 by the coating E is finished. The solvent discharged from the last main sweep 2 nozzle 142 is applied to one of the substrates 9 and applied to the side non-coating region 92 in the region 91 of Fig. 1. The coating device 1 is transported to another coating device or the like. And coating: two coating device 1 coated

液。 有機EL液以外之其他雙色有機EL 如上述所說明,塗佈梦番 ^ 描方向的移動,從3個^1中’猎由塗佈頭14在主掃 八w 対141與(―Y)側第2喷嘴 142刀別吐出的有機el液斑为 、 Η中條紋狀塗佈。此時,3:;二在•絲9的塗佈區域 側第1噴嘴141所塗佈的有 、嘴41中,利用(-γ) 1嗔嘴U1 π ’有機EL液線條,被利用中央第 贺% 141所並行塗佈的有 第2噴嘴142並行塗佈的j f液線條、與利用⑼側 側第1喷嘴141汾你的古 條包央。因此,在經( — Y) 側線條所蒸發的二提線條周圍中’藉由從二 分濃度。 阿衣兄中的有機EL·液之溶劑成 再者’經中央第1喷喈 利用⑼側與(-Υ)側第=的有㈣液線條,被 育’ 141所並行塗佈的有機el (£ 97100529 液線條包夾,而經(+Y)側第 液線條,被利用中央第Λ嘴嘴的有機虹 線條、與先前所塗佈的有機:L!=::有機EL液 另揭;bL液線條組所包央。所 即使在經中央與⑻侧第! 天所以, 周圍,亦與經(_γ)側第】噴嘴i4i塗 : 線條同樣地,環境中的右Μ ^ ti ^ 有機EL液之溶劑成分濃度提高。liquid. The two-color organic EL other than the organic EL liquid is applied as described above, and the movement of the coating direction is applied from the three ^1's to the coating head 14 on the main sweeping eight w 対 141 and (―Y) sides. The organic el liquid spot which is ejected from the second nozzle 142 is strip-shaped in the middle. At this time, 3:2 is applied to the first nozzle 141 on the application region side of the wire 9 and the nozzle 41 is used in the nozzle 41 by the (-γ) 1 nozzle U1 π 'organic EL liquid line. The jf liquid line in which the second nozzles 142 are applied in parallel and the side of the first nozzle 141 on the side of the (9) side are immersed in the same manner. Therefore, in the vicinity of the two-lift line that is evaporated by the (Y) side line, by the concentration from the binary. In the case of the solvent of the organic EL liquid in the singer's brother, the organic liquid el (the squirting of the (1) side and the (-Υ) side of the central sneeze is used. £ 97100529 liquid line wrap, while the liquid line on the (+Y) side is used by the organic rainbow line of the central Λ mouth, and the previously coated organic: L!=:: organic EL liquid; bL The liquid line group is included in the center. Even in the center and the (8) side of the day!, the surrounding is also coated with the (_γ) side nozzle] i4i: the same line, the right Μ ^ ti ^ organic EL liquid in the environment The concentration of the solvent component is increased.

:處,若將在塗佈頭僅設置有吐出有機EL液 1嗔嘴的塗佈裝置作為比較例,則比較例的塗佈褒置中4 =嘴、及中央第!嘴嘴所塗佈的有機EL液線條周圍,與 述同樣地’ % i兄中的有機EL液溶劑成分濃度將提高。In the case where the coating head is provided with only the coating device for discharging the organic EL liquid 1 nozzle, the coating device of the comparative example has 4 = mouth and center number in the coating device of the comparative example! Around the line of the organic EL liquid applied to the mouth, as in the above, the concentration of the solvent component of the organic EL liquid in the '% brother' will increase.

經(-Y)側(即副掃描方向上的基板相對移動方向 後側)第1喷嘴所塗佈的有機EL液線條之⑼側,並未施 仃其他有機EL液與溶劑的線條塗佈,而僅在⑻側,配 置經中央第1噴嘴並行塗佈的有機EL液線條。 所以,在經(-Y)側第!喷嘴塗佈的有機EL液線條周圍, 相較於經⑼側與中央第!喷嘴所塗佈的有機乩液線條 周圍之下,有機EL液的溶劑成分濃度降低,(-Y)側的有 機EL液線條乾燥速度大於( + γ)側的2條有機乩液線條。 2外,在(-Υ)側有機EL液線條周圍,該線條在(_γ)側的 環境t之有機EL液溶劑成分濃度,係較低於線條靠(+γ) 側的濃度,導致線條靠(_γ)側的部位較靠(+γ)侧的部位更 早乾燥。 圓4Α所示係藉由從經比較例之塗佈裝置的3個第1喷 97100529 < £ 1339134 :塗佈之有機EL液令將溶劑蒸發,而在基板Μ的塗佈 =91a中形成有機EL材料之3片膜—的剖視圖。圖 :配。圖示方便,省略在基板9a的塗佈區域9la令 之隔壁的圖示’又,將膜93a的高度描繪成大於實 際鬲度(圖4B中亦同)。 比較例的塗佈裝置中,如上述,因為(_γ)側的有機釭 条靠(-Υ)側的部位較靠(+γ)側的部位更早乾燥,因而 口圖4Α所示’(一γ)侧的膜93中,靠(_γ)側部位的膜厚較 2靠⑼側部位的膜厚。而且依此具厚度偏差的有機 乩材料膜93a,在塗佈區域…中周期性(即每3片) 而產生塗佈不均,導致有成為產品後的平面顯示裝置 示品質降低之可能性。 ‘、 相對於此,本實施形態的塗佈裝置i中係 3個第1喷嘴141塗佈的3條有機EL液線條周圍二 中的有機EL液之溶劑成分濃度提高。又,3個第 141中,於經(一 γ)側第j嘴嘴141所塗佈的有機此液 條靠(-Y)側的區域(即副掃描方向上的基板9相 方 向後側之區域,有機EL液尚未被塗佈的區域) 二嘴142所塗佈的溶劑蒸發’而縮小該有機 γυ侧與(-Y)側的環境中之有機EL液溶劑成分的濃度 藉此,便可使從3個第丨嘴嘴141的吐出口所吐 EL液的乾燥速度均句化’同時可使從(_γ)側(即副 向上的基板9相對移動方向後侧)第i噴嘴ΐ4ι的吐二 97100529 20 1339134 所吐出有機EL液的乾燥速度, 勻。結杲俤如网在刻掃描方向上成大致均 93 ^ 相鄰接有機⑪材料的3片膜 93截面可形成大致相同形狀 材:的3片膜 區域91發生塗佈不均。 止在基板9上的塗佈 對2的=面,置用像素形成材料的流動性材料 Μ板的㈣巾,#發生塗佈Μ 面顯示裝置顯示品質降低之可 2成為產°。後的平 •置…如上述,因為可防I;:不=態的塗佈裝 罾梦罟孟师不均的發生,因而塗佈 " 特別適用於含有平面顯示裝 .流動性材料的塗佈。 i用像素形成材料之 ,土 ^裝置1中,#制塗佈頭Η的第〗噴嘴141開始 =有機EL液時,則從⑼側第2噴嘴142對位。 ==置的基板9(即副掃描方向上的塗佈頭⑷目對移動 域吐出的溶劑,在塗佈區域91的⑽側非塗佈區 區域91靠基板9相對移動方向前側的區域, 未塗財機EL液的區域)中蒸發。藉此,塗佈區域㈣ ^塗佈區域92上,環境中的有機el液溶劑成分濃 南,彳縮小塗佈區域91最靠⑼側所塗佈有機EL 在⑽側與(-Υ)側的環境中之有機&液溶劑成分 ft U ’便可使塗佈區域91最靠(+ Ό側的有機EL 液線條乾燥速度,在副掃描方向上形成大致均句,可更加 確實防止基板9上的塗佈區域91發生塗佈不均情形。 塗佈頭14中,藉由利用單一喷嘴托架!铛一起保持3 個第1喷嘴141與2個第2噴嘴142,而將第2喷嘴142 97100529 21 1339134 對第1噴嘴141的相對位置固定,因此便可將塗佈頭i4、 以及將塗佈頭14對基板9相對移動之屬於移動機構其中 一部分的塗佈頭移動機構15構造簡單化。另外,就副掃 描方向上’(-Y)側第2噴嘴142、和與該第2噴嘴142所 鄰接第1噴嘴141間之距離,未必一定要等於第丨嘴嘴 141的間距(本實施形態中,設為等於隔壁間距的3倍)(第 2與第3實施形態中亦同)。此外,( + γ)側第2喷嘴142、 鲁和與該第2噴嘴142所鄰接第1喷嘴141間在副掃描方向 上的距離,亦未必一定要等於第1喷嘴141的間距。 其次’針對本發明第2實施形態的塗佈裝置進行說明。 .圖5所示係第2實施形態的塗佈裝置la之俯視圖。如圖 5所示,塗佈裝置la的塗佈頭14中,在吐出有機此液 的3個第1喷嘴丨41之(-Y)侧(即副掃描方向上的基板g 相對移動方向後側),設有吐出溶劑的2個第2噴嘴1 & 2, 但在( + Y)側則並未設置第2噴嘴142。此外,塗佈裝置^ •係在基板9的( + Y)側設有:固定於基板保持部n上面,且 將含有機EL液溶劑成分的氣體(本實施形態中係將有機 E/液溶劑氣化,以下稱「溶劑氣體」),供應於基板9的 氣體供應部19。其餘構造均如同圖1與圖2所示塗佈裝 置1 ’在下述說明中賦予相同的元件符號。 如圖5所示,塗佈頭14的5個喷嘴(即第丨喷嘴141與 第2喷嘴142),係在圖5中的x方向(即主掃描方向)^ 呈略直線狀排列,同時僅些微偏離圖5中之γ方向(即副 掃描方向)配置。 97100529 22 丄丄 出:二=中嘖,1實施形態同樣地,作為第1吐 (即隔壁Η距# 41係具有在副掃描方向上依等間隔 出”月二9?::UI)排列之3個吐出" 外,作;C第9 為第1流動性材料的有機虹液。此 乍為第2吐出部的2個第2噴嘴142係具有 從2個依隔壁間距3倍距離相隔開配置的2個吐出口,: 2個吐出口吐出作為第2流動性材料 ::二外’㈠)側第1喷嘴⑷與⑼和^The (9) side of the line of the organic EL liquid applied to the first nozzle via the (-Y) side (that is, the rear side in the direction in which the substrate is moved in the sub-scanning direction) is not applied by line coating of other organic EL liquid and solvent. On the (8) side, only the organic EL liquid lines coated in parallel by the central first nozzle were arranged. So, on the (-Y) side! The nozzle is coated with organic EL liquid around the line, compared to the (9) side and the center! Below the line of the organic sputum coated by the nozzle, the concentration of the solvent component of the organic EL liquid is lowered, and the drying speed of the organic EL liquid on the (-Y) side is higher than the two organic sputum lines on the (+ γ) side. 2, outside the (-Υ) side of the organic EL liquid line, the concentration of the organic EL liquid solvent concentration of the line on the (_γ) side t is lower than the concentration on the (+γ) side of the line, resulting in the line The portion on the (_γ) side is dried earlier than the portion on the (+γ) side. As shown by the circle 4, the solvent was evaporated from the three first sprays 97100529 < £1339134: coated organic EL liquid of the coating apparatus of the comparative example, and the organic layer was formed in the coating of the substrate = 91a. A cross-sectional view of three films of EL material. Figure: Match. The illustration is convenient, and the illustration of the partition wall in the application region 9a of the substrate 9a is omitted. Further, the height of the film 93a is drawn to be larger than the actual twist (the same applies in Fig. 4B). In the coating apparatus of the comparative example, as described above, the portion on the (-Υ) side of the (_γ) side is dried earlier than the portion on the (+γ) side, and thus the port 4' is shown. In the film 93 on the γ) side, the film thickness on the (_γ) side portion is larger than the film thickness on the (9) side portion. Further, the organic tantalum material film 93a having the thickness variation may be unevenly applied in the coating region... periodically (i.e., every three sheets), resulting in a possibility that the quality of the flat display device after the product is lowered. In contrast, in the coating apparatus i of the present embodiment, the concentration of the solvent component of the organic EL liquid in the periphery of the three organic EL liquid lines applied by the three first nozzles 141 is improved. Further, in the three 141st, the organic liquid strip coated on the (jm) side j-th nozzle 141 is on the (-Y) side (that is, the rear side of the substrate 9 in the sub-scanning direction). In the region where the organic EL liquid has not been applied, the solvent coated by the two nozzles 142 is evaporated, and the concentration of the solvent component of the organic EL liquid in the environment of the organic γ υ side and the (-Y) side is reduced. The drying speed of the EL liquid discharged from the discharge ports of the three second nozzles 141 is made uniform, and the ejection of the i-th nozzle ΐ4ι from the (_γ) side (that is, the rear side of the substrate 9 in the direction of the moving direction) can be made. Two 97100529 20 1339134 The drying speed of the organic EL liquid spit out, evenly. The knots, such as the web, are approximately 93 in the engraved scanning direction. The three sheets of the film 93 adjacent to the organic 11 material can form substantially the same shape. The three film regions 91 are unevenly coated. The surface of the coating pair on the substrate 9 is placed on the surface of the coating material 2, and the liquid material of the pixel forming material is used as a (four) cloth. The coating surface of the coating surface display device can be lowered in quality. After the flat setting... As mentioned above, because it can prevent I;: the coating of the non-state is not uniform, so the coating is particularly suitable for coatings containing flat display materials and fluid materials. cloth. In the case where the pixel forming material is used, the first nozzle 141 of the # coating head 开始 starts to be the organic EL liquid, and the second nozzle 142 is aligned from the (9) side. == The substrate 9 placed (that is, the solvent ejected from the coating head (4) in the sub-scanning direction to the moving region, and the region on the front side of the relative movement direction of the substrate 9 in the (10) side non-coating region region 91 of the coating region 91, Evaporation in the area of the EL liquid of the coating machine. Thereby, in the coating region (4) ^ coating region 92, the organic EL liquid solvent component in the environment is concentrated south, and the coating area 91 is applied to the (10) side and the (-) side of the organic EL on the (9) side. In the environment, the organic & liquid solvent component ft U ' can make the coating area 91 the most (+ Ό side of the organic EL liquid line drying speed, forming a substantially uniform sentence in the sub-scanning direction, which can more reliably prevent the substrate 9 from being on the substrate 9 The coating area 91 is unevenly coated. In the coating head 14, the third nozzle 142 and the two second nozzles 142 are held together by a single nozzle holder 铛, and the second nozzle 142 97100529 is used. 21 1339134 The relative position of the first nozzle 141 is fixed, so that the coating head i4 and the coating head moving mechanism 15 belonging to a part of the moving mechanism that relatively moves the coating head 14 to the substrate 9 can be simplified. The distance between the second nozzle 142 on the '(-Y) side in the sub-scanning direction and the first nozzle 141 adjacent to the second nozzle 142 is not necessarily equal to the pitch of the second nozzle 141 (in the present embodiment) , set to be equal to three times the pitch of the partitions) (second and third embodiments) In addition, the distance between the second nozzle 142 on the (+ γ) side and the first nozzle 141 adjacent to the second nozzle 142 in the sub-scanning direction is not necessarily equal to the pitch of the first nozzle 141. Next, a coating apparatus according to a second embodiment of the present invention will be described. Fig. 5 is a plan view showing a coating apparatus 1a according to a second embodiment. As shown in Fig. 5, a coating head 14 of the coating apparatus 1a is shown. In the (-Y) side of the three first nozzles 41 that discharge the organic liquid (that is, the back side of the substrate g in the sub-scanning direction with respect to the moving direction), two second nozzles 1 & 2, but the second nozzle 142 is not provided on the (+Y) side. Further, the coating device is provided on the (+Y) side of the substrate 9: fixed on the substrate holding portion n, and will contain the machine The gas of the solvent component of the EL liquid (in the present embodiment, the organic E/liquid solvent is vaporized, hereinafter referred to as "solvent gas") is supplied to the gas supply portion 19 of the substrate 9. The remaining structures are as shown in Figs. 1 and 2 The coating device 1' is given the same reference numerals in the following description. As shown in Fig. 5, the five nozzles of the coating head 14 ( That is, the second nozzle 141 and the second nozzle 142) are arranged in a straight line in the x direction (ie, the main scanning direction) in FIG. 5, and are only slightly deviated from the γ direction (ie, the sub-scanning direction) in FIG. 97100529 22 丄丄出:2=中啧, 1 embodiment is similarly arranged as the first spit (that is, the partition wall # distance #41 has the same interval in the sub-scanning direction) 2:9::UI) The third nozzle is the organic fluid of the first fluidity material, and the second nozzles 142 of the second discharge portion are separated by two distances from the two partition walls by a distance of three times. Two discharge ports of the open arrangement: Two discharge ports are discharged as the second fluid material: the second outer '(one)) side first nozzles (4) and (9) and ^

%描方向上的距離,亦是設為隔壁間距的3倍。S (1 Vtt" EL ^#J ^ ^ ^ 掃描方向)人二板9的塗佈區域91之X方向(即主 田^王,女裝於基板保持部11的主面上。因此 二利用基板移動機構12將基板保持部u移 因二 ,⑺便在相對於基板9固定的狀態下,與J體= ^掃描方向上移動。而且,藉由使_供_19中; 糊的溶劑蒸發,而將對基板9的塗佈區域 位供應溶劑氣體。 4 其次’針對利用塗佈裝置la施行有機之塗佈 =程圖圖6:Γ利用塗佈裳置la施行的有機el液塗佈 之流程圖。當利用塗佑驻罢 _ ., 、置1 a把彳丁有機EL液塗佈時,首 (先牛H9保^於基板保持部11上並位於塗佈起始位置 (乂,· 接者,塗佈頭W在從第!喷嘴141盥第2 連續吐出有機EL液與溶劑的情況下,從圖 5中的⑼側朝⑼側(即主掃招方向)移動,藉此便在基 (s 97100529 23 1339134 佈區域91之3條溝#條紋狀塗佈有機EL液,同 /條溝的㈠)側,於塗佈區域91的2條溝中被塗 步驟S22)。此時’塗佈區域91的側部位(即 侧的邊緣附近部位),由氣體供應部 八人利用基板移動機構丨2,將基板9朝圖5中的( + y) !;副掃福方向)移動(步驟⑽。在基板9上,與第! ,SI:樣地,溶劑從經第1喷嘴141在塗佈區域91 下提供在其ΓEL液蒸發,而將有機EL材料在半乾燥狀態 9上’而形成有機EL材料的膜。又,從第 之塗佈區域91塗佈的溶劑全部(或者除極微量 幾近全部)蒸發,不殘留在塗佈區域91上。 方向上的基板9移動結束,便由控制部2確 = =11與基板9是否已移動至圖5中依二點鏈 束位置(步驟叫當尚未移動至塗佈結 況時’便重返步驟您,執行塗佈頭14朝主 ^田方向的移動、基板9朝副掃描方向的移動、及基板9 的位置確認(步驟S22〜S24)。 塗佈裝置la中,截至芙;fe/兄4dt*rr 1 結克仂署或,— 部1與基板9位於塗佈 動時; 母〜進订塗佈頭14朝主掃描方向的移 的塗佈Ϊ二二朝副掃描方向步進移動,藉此,在基板9 t佈S域91中’有機EL液便被塗佈成依既定間距(即The distance in the % drawing direction is also set to be three times the spacing of the partition walls. S (1 Vtt" EL ^#J ^ ^ ^ scanning direction) in the X direction of the coating area 91 of the second board 9 (i.e., main field, king, and the main surface of the substrate holding portion 11) The moving mechanism 12 moves the substrate holding portion u by two, and (7) moves in the J body = ^ scanning direction in a state of being fixed with respect to the substrate 9. Further, by evaporating the solvent of the paste in the _19 The solvent gas is supplied to the coating region of the substrate 9. 4 Next, the organic coating is applied to the coating device la = Fig. 6: The process of coating the organic EL solution by the coating When using the coating of the coating, the first (the first cattle H9 is secured on the substrate holding portion 11 and located at the coating start position (乂,· When the organic EL liquid and the solvent are continuously ejected from the second nozzle 141 ,, the coating head W moves from the (9) side to the (9) side (that is, the main sweep direction) in FIG. (s 97100529 23 1339134 Three grooves of the cloth region 91 # Strip-shaped coated organic EL liquid, on the (I) side of the same groove, the step S22) is applied to the two grooves of the coating region 91. When the side portion of the coating region 91 (i.e., the portion near the edge of the side) is used by the gas supply unit, the substrate moving mechanism 丨2 is used, and the substrate 9 is turned toward (+ y) in the direction of Fig. 5; Moving (step (10). On the substrate 9, on the substrate, SI: sample, the solvent is supplied from the first nozzle 141 under the coating region 91 to evaporate the EL liquid therein, and the organic EL material is in the semi-dry state 9 Further, a film of an organic EL material is formed. Further, all of the solvent applied from the first coating region 91 is evaporated (or almost entirely, except for a very small amount), and does not remain on the coating region 91. The substrate 9 in the direction is moved. Then, the control unit 2 confirms that ==11 and whether the substrate 9 has moved to the position of the two-point chain bundle in Fig. 5 (the step is called when it has not moved to the coating condition) and then returns to the step to execute the coating head 14 The movement in the direction of the main field, the movement of the substrate 9 in the sub-scanning direction, and the position of the substrate 9 are confirmed (steps S22 to S24). In the coating device la, as of Fu; fe/brother 4dt*rr 1 Or, when the portion 1 and the substrate 9 are in the application movement; the coating of the mother-to-substituting coating head 14 in the main scanning direction Two stepping movement toward the sub-scanning direction, whereby the cloth in the substrate 9 t 91 domain S 'will be applied to the organic EL liquid according to a predetermined pitch (i.e.

St)壁Π"㈣間距)… 22〜S24)。然後,當基板9移動至塗佈結束位置,便停止St) niches " (four) spacing) ... 22 ~ S24). Then, when the substrate 9 moves to the coating end position, it stops.

(S 97100529 24 1339134 從3個第1喷嘴141與2個第2嘴嘴142進行的有機EL 液與溶劑之吐出,結束對基板9進行有機EL液塗饰。 在所說明,塗佈裝置1a與第1實施形態同樣地, 二固第1喷嘴141塗佈的3條有機虬液線條周圍中, ,兄中的有機EL液溶劑成分濃度提高,又,在 第^嘴嘴141所塗佈的有機EL液線條周圍,該線條在⑼ 貝1與(-Y)側的環境中之有機EL液溶劑成分的濃度差合縮 ,小。糟此,便可使從3個第!噴嘴141的吐出口所吐^有 機EL液的乾燥速度均勻化,同時可將從㈠)側第1喷 =的吐出口所吐出之有機EL液的乾燥速度,在副掃描 。'上形成大致均勾。結果,便可防止在基板9上的塗佈 區域91發生塗佈不均。 于2實施形態的塗佈裝置la中,特別係藉由在第!噴 嘴⑷的⑼侧設置2個第2喷嘴142,便可減少從各第 噴嘴142所吐出並塗佈於塗佈區域91中的溶劑量並 可Y缩侧第^ ^ 貝、、(-Y)側的環境中之有機EL液溶劑成分濃度差。 結果,便可縮短經各第2喷嘴142在塗佈區域91塗 =劑線條蒸發所需時間,可更確實防止之後所塗佈的有機 EL液與先前所塗佈的溶劑發生混合情況。 另外’2個第2喷嘴142的吐出口未必在副掃描方向上 -定要相隔開隔壁間距3倍的距離配置,只要在副掃描方 向上配置成不同位置便可。藉此,與上述同樣地,可缩短 經各第2喷嘴142在塗佈區域91所塗佈之溶劑線條蒸發 97100529 25 ⑴ 9134 所需時間,可更確實防止之後所塗佈的有機EL液與先前 所塗佈的溶劑發生混合情況。 再者,塗佈裝置la中,藉由在基板9的(+¥)側設置氣 體供應部19,便可提高塗佈區域91靠(+Y)側的非塗佈區 j 92上之環境中有機EL液溶劑成分濃度。結果,與第丑 實施形態同樣地,可使塗佈區域91最靠(+γ)側的有機乩 液線條乾燥速度,在副掃描方向上形成大致均勻,可更確 鲁實防止基板9上的塗佈區域91發生塗佈不均。另外,從 氣體供應部19進行之氣體喷出,亦可在塗佈頭14第j次 主掃描結束後便停止。 人 利用塗佈裝置la施行的有機EL液塗佈中,利用氣體供 應部19供應溶劑氣體,由此相較於在第丨噴嘴ΐ4ι的Gy' 侧設置第2噴嘴142之情況下’可省略在有機乩液塗佈 作業中從(+Y)侧第2喷嘴142進行的吐出停止動作,可將 有機fL液的塗佈簡單化。此外,因為可同時進行2個第 嘴142的吐出開始與停止,因而可使塗佈帛14的構 造簡單化。另一方面,第i實施形態的塗佈裝置^中,因 為在基板保持部1丨上並不需要設置氣體供應部19(來昭 圖5),因而可將基板保持部n的構造簡單化。 /… 其次,針對本發明第3實施耗的塗佈|置進行說明。 圖7所示係第3實施形態的塗佈裝置化之俯視圖。如圖 7所不,塗佈裝置lb的塗佈頭Η中,在吐出 第1喷嘴141之⑼侧(即副掃描方向上的基板9 相對移動方向後侧),僅設置们個吐出溶劑的第2嗔嘴 97100529 26 ^^134 142,而在(+γ)側則並麥設置第2喷嘴142。其餘的構造 '、圖1與圖2所不塗佈裝置1同樣,在以下的說明中將賦 予相同的元件符號。 圖8所不係利用塗佈裝置1 b施行有機EL液塗佈的流程 圖。當利用塗佈裝置11}施行有機乩液塗佈時,首先,基 板9由基板保持部11 (參照圖2 )保持並位於塗佈起始位置 (步驟S31)。此時,塗佈頭丨4的4個喷嘴(即3個第工喷 %高141與1個第2喷嘴142),在圖7中的γ方向(即副掃 描方向)上,位於基板9的(+γ)側(即副掃描方向上的基板 9相對移動方向前側)邊緣、與基板9的塗佈區域μ之(+γ) .侧邊緣間,即與塗佈區域91的( + Υ)側非塗佈區域92對應 之位置處。 接著’由控制部2控制塗佈頭移動機構15,藉此塗佈 頭14便在從第丨喷嘴141與第2喷嘴142中分別連續吐 出有機EL液與溶劑之情況下,從圖7中的(一X)側朝(+χ) _侧(即主掃描方向)移動。藉此,便在基板9的塗佈區域 91之(+Υ)側(即外側)非塗佈區域92中,條紋狀塗佈有機 EL液與溶劑(步驟S32)。其次,利用控制部2控制基板移 動機構12,藉此便將基板9與基板保持部11 一起朝圖7 中的( + Υ)側(即副掃描方向)移動(步驟S33)。 在基板9上’溶劑從經第1噴嘴丨41在非塗佈區域92 所塗佈的有機EL液蒸發,有機EL材料在半乾燥狀態下殘 留於非塗佈區域92上。又,從第2噴嘴142塗佈於非塗 佈區域92上的溶劑全部(或者除極微量之外的其餘幾乎 97100529 27 U39134 王)蒸發,不殘留於非塗佈區域9 2上。塗佈裝置1匕中, 藉由在步驟S33中將基板9朝副掃描方向移動,塗佈頭 14的圖7中(+Y)侧第1喷嘴141,便位於塗佈區域91的 (一+Υ^)側邊緣之(-Υ)側。換言之,塗佈頭14的4個噴嘴在 wJ掃描方向上,位於與塗佈區域9丨的(+丫)側部位所對應 之位置處。 田田]掃榀方向上的基板9移動結束後便利用控制部2 •控制塗佈頭移動機構15與基板移動機構12,塗佈頭14 便攸圖7中的( + χ)側朝(_χ)側(即主掃描方向)移動,藉此 便在基板9的塗佈區域91之溝中塗佈有機EL液與溶劑, ^後,基板9便朝(+γ)側(即副掃描方向)移動(步驟s 3 4、 當副掃描方向上的基板9移動結束後,便由控制部2 5忍基板保持部11與基板9是否已移動至® 7中二點鏈 =㈣結束位置(步驟S36)’ #尚未移動至塗佈結束 =^重返步驟如,執行塗佈頭Η朝主掃描方向, ==彳掃描方向的移動、及基板9的位㈣ 動'ΐ L 母:人進行塗佈頭14朝主掃指方向的· 動時’基板9便制掃描方向步進 的塗佈區域91中,將有機稭此便在基板 於隔壁間距3倍的間距佈成依既定間距㈣ 然後,當基板9移動至塗 不位置後’便停止從3個第 97100529 28 1 _ 141肖1個第2嗔嘴142的有機EL液與溶劑吐出, 而結束對基板9施行的有機EL液塗佈。 如上所說明’塗佈裝置lb中與第丄實施形態同樣地, m個第1喷嘴141所塗佈的3條有機EL液線條周圍, 環境中的有機EL液溶劑成分濃度提高,又在經(_γ)側第 1噴嘴141所塗佈的有機EL液線條周圍,該線條在⑻ 側與^Υ)側的環境中之有機EL液溶劑成分的濃度差縮 小。藉此,便可使從3個第1喷嘴141的吐出口所吐出有 機EL液的乾㉝速度均句化,同時可使從(_γ)側第丄喷嘴 141的吐出口所吐出的有機EL、液之乾燥速度’在副掃描 方向上形成大致均句。結果,便可防止在基板9上的塗佈 區域91發生塗佈不均。 塗佈裝置lb中,特別係藉由在塗佈區域91的(+γ)侧非 塗佈區域92中塗佈有機液與溶劑,並從該等有機 液與洛劑線條中將溶劑蒸發,而可將塗佈區域9ι的(+” :非塗佈區域92上之環境中的有機EL液溶劑成分濃度提 内=果’與第1與第2實施形態同樣地,可使塗佈區域 91最葬(+γ)側的有機豇液線條乾燥速度,在副掃描方向 上形成大致均句,俾可更確實防止基& 9上的塗佈區域 91發生塗佈不均。另外,由在非塗佈區域92上所塗佈的 有機EL液所形成的有# EL材料的膜,在對基才反9施行有 機EL液之塗佈結束後被便除去。 塗佈裝置lb中,因為塗佈頭14中並不需要在第^喷嘴 141的( + Y)側設置第2噴嘴142,又亦不需要在基板保持 97100529 29 1339134 :11上設置氣體供應部19,因此可將塗佈裝置的構造簡 早化。另一方面’第1與第2實施形態的塗佈裝置中因 為並不需要執行從非塗佈區域92中將有機EU才料去除的 作業’因而可使有機EL液的塗佈簡單化。 其次,針對本發明第4實施形態的塗佈裝置進行說明。 圖9與圖1G所示係第4實施形態塗佈裝置化之俯視圖與 右側視圖。如圖9與圖10所示,於塗佈裝置ic的塗佈頭 鲁14設有吐出有機乩液的3個第1喷嘴141,但並無設置 ,吐出溶劑的第2噴嘴。此外,塗佈裝置lc係在塗佈頭14 的(-Y)側(即副掃描方向上的基板9相對移動方向後 .側),具備有跨越基板保持部11與基板移動機構12之設 置,同時對基才反9連續供應溶劑氣體的氣體供應部19&。 更進一步,與圖5所示塗佈裝置la同樣地,在圖9所示 基板9的(+Y)側(即副掃描方向上的基板9相對移動方= 前侧),具備有固定於基板保持部n上面,同時對基板9 籲供應溶劑氣體的另一氣體供應部19b。其他的構造與圖1 與圖2所示塗佈裝置丨同樣,在以下的說明中便賦予相同 的元件符號。此外,在以下的說明中,為區分氣體供應部 19a、19b’便分別稱為「第i氣體供應部19a」與「第2 氣體供應部19b」。 圖9與圖10所示第1氣體供應部丨9a,係從噴出口 19丄 朝基板9的主面連續噴出溶劑氣體的氣體噴出機構,因 與基板移動機構12及塗佈頭移動機構15一起固定於未圖 不的基台上,因此相對於第丨氣體供應部19a的塗佈頭 97100529 30 1339134 14 ’在主掃描方向與 口兴命搖方向上的相對位置保持固定。 =應部…的噴出口 l9l係χ方向全長較長於基 塗備區域91(參照圖9)x方向全長的狭縫狀,涵蓋 柘q二’1的X方向(即主掃描方向)全長而相對向於基 板9的主面。 的9所示第2氣體供應部⑽係與第2實施形態 人們古^ 之氣體供應部19(參照圖5)同樣地,屬於 丨= 有機EL液溶劑的棒狀多孔性樹脂(例如海綿等),涵 =板9的塗佈區域91之χ方向全長,安裝於基板保持 盥塗❹主罢面上’且對基板9相對固定。塗佈裝置1C亦是 潤同樣地,藉由使第2氣體供應部19b所含 供庫發’而對基板9的塗佈區域91之(+γ)側部位 供應洛劑氣體。 n所示係利用塗佈裝置lc施行有機此液塗佈之流 田利用塗佈裝置1<:施行有機EL液塗佈時,首先, ::反9保持於基板保持部"上並位於塗佈起始位置(步驟 有心r接著’塗佈頭14便在從第1喷嘴141中連續吐出 有液的情況下’從圖9中的(_χ)側朝⑽側(即主掃 描方向)移動,藉此便在基板9的塗佈區域91之3條溝 文狀塗佈有機以液(步驟S42)。此時,從第1氣 :、=19a朝基板9的塗佈區域91所喷出的溶劑氣 備佈有機EL液的3條溝之(-γ)側中,被供應於塗 ?=卜此外’對塗佈區域91的⑼側部位,由第2 乳體供應部19b供應溶劑氣體。 97100529 1339134 接著,利用基板移動機構12將基板9朝圖9中的(+γ) 側(即副掃#方向)移動之後,便由控制部2確認基板保持 4 U與基板9是否已移動至圖9中二點鏈線所示之塗佈 結束位置處(步驟S43、S44)。然後,當基板保持部u邀 基板9尚未移動至塗佈結束位置之情況時,便重返步驟 S42’並執行塗佈頭14朝主掃描方向的移動、基板9朝副 掃描方向的移動、及基板9的位置確認(步驟S42〜s44)。 塗佈裝置lc +,截至基板保持部^肖基板9位於塗佈 結束位置為止,每次執行㈣頭14朝主掃財向的移動 時’基板9便朝副掃描方向步進移動,藉此便在基板9的 k佈區域91中’將有機EL液塗佈成依既定間距(即等於 隔壁=距3侉的間距)排列之條紋狀(步驟s42〜s44)。然 後:當基板9已移動至塗佈結束位置後,便停止從3個第' 1噴嘴141的有機EL液吐出’而結束對基板 機EL液塗佈。 们有 如;^所說明,塗佈裝置lc中於塗佈頭14的(-Y)側設置 第1亂體供應部19a’且在副掃描方向上,於與塗佈頭14 一起對基板9相對移動之情況下,對基板9的塗佈區域 91供應办劑氣體,藉此由塗佈頭丨4的卜γ)側第i噴嘴 所塗佈之有機EL液線條靠(-Y)側區域(即副掃描方向上 的土板9相對移動方向後側之區域’尚未塗佈有機EL液 =區域' 中有機EL液的溶劑成分濃度提高。結果,與第1 實施形態同樣地,可將從塗佈頭14的(-Y)側(即副掃描方 向上的基板9相對移動方向後側)第1喷嘴141之吐出口 97100529 32 1339134 =勾出燥速度,在副掃描方向上形成大 塗夂:Γ 上的塗佈區域91發生塗佈不均。 涵蓋塗中藉由第1氣體供應部…的喷出口191 頭?Λ @主掃描方向全長設置,便可使由塗佈 向上的)=第1喷嘴141所塗佈有機el液在副掃描方 機EL二V:之Γ勻性J涵蓋朝主掃描方向延伸的該有(S97100529 24 1339134) The organic EL liquid and the solvent are discharged from the three first nozzles 141 and the two second nozzles 142, and the organic EL liquid coating is finished on the substrate 9. As described, the coating device 1a and the coating device 1a In the same manner as in the first embodiment, in the vicinity of the three organic sputum lines applied by the second solid first nozzle 141, the organic EL liquid solvent component concentration in the brother is improved, and the organic substance applied to the second nozzle 141 is applied. Around the EL liquid line, the difference in concentration of the organic EL liquid solvent component in the environment of the (9) shell 1 and the (-Y) side is small and small, and the discharge port from the three nozzles 141 can be made. The drying rate of the organic EL liquid to be discharged is uniform, and the drying speed of the organic EL liquid discharged from the discharge port of the first spray = (1) side can be sub-scanned. 'The formation is roughly hooked. As a result, uneven coating can be prevented from occurring in the coating region 91 on the substrate 9. In the coating device 1 of the second embodiment, in particular, by the first! By providing two second nozzles 142 on the (9) side of the nozzle (4), the amount of solvent discharged from each of the first nozzles 142 and applied to the coating region 91 can be reduced, and the Y side can be reduced and the (-Y) can be reduced. The concentration of the solvent component of the organic EL liquid in the side environment is poor. As a result, the time required for the evaporation of the coating line in the coating region 91 by each of the second nozzles 142 can be shortened, and the mixing of the organic EL liquid applied thereafter with the previously applied solvent can be more surely prevented. Further, the discharge ports of the two second nozzles 142 are not necessarily arranged at a distance of three times the distance between the partition walls in the sub-scanning direction, and may be arranged at different positions in the sub-scanning direction. Thereby, in the same manner as described above, it is possible to shorten the time required for evaporation of the solvent line applied by the respective nozzles 142 in the coating region 91 by 97100529 25 (1) 9134, and it is possible to more surely prevent the organic EL liquid applied later from the previous The applied solvent is mixed. Further, in the coating apparatus 1a, by providing the gas supply portion 19 on the (+¥) side of the substrate 9, the coating region 91 can be raised in the environment on the (+Y) side of the non-coating region j 92. Organic EL liquid solvent component concentration. As a result, in the same manner as the ugly embodiment, the drying speed of the organic sputum line on the (+γ) side of the application region 91 can be made substantially uniform in the sub-scanning direction, and the substrate 9 can be prevented more reliably. Coating unevenness occurs in the coating region 91. Further, the gas ejected from the gas supply unit 19 may be stopped after the j-th main scan of the coating head 14 is completed. In the application of the organic EL liquid applied by the coating device 1a, the solvent supply gas is supplied from the gas supply unit 19, and thus the second nozzle 142 can be omitted as compared with the case where the second nozzle 142 is provided on the Gy' side of the second nozzle ΐ4 In the organic sputum coating operation, the discharge stop operation from the (+Y)-side second nozzle 142 can simplify the application of the organic fL liquid. Further, since the discharge of the two nozzles 142 can be started and stopped at the same time, the structure of the coating crucible 14 can be simplified. On the other hand, in the coating apparatus of the first embodiment, since it is not necessary to provide the gas supply portion 19 (see Fig. 5) in the substrate holding portion 1b, the structure of the substrate holding portion n can be simplified. /... Next, the coating|disconnection of the 3rd implementation of this invention is demonstrated. Fig. 7 is a plan view showing the coating apparatus of the third embodiment. As shown in Fig. 7, in the coating head of the coating device 1b, the (9) side of the first nozzle 141 is discharged (that is, the rear side of the substrate 9 in the sub-scanning direction with respect to the moving direction), and only one of the discharge solvents is provided. 2 nozzle 97100529 26 ^^ 134 142, and on the (+ γ) side, the second nozzle 142 is provided. The rest of the structure ', Fig. 1 and Fig. 2 are the same as the non-coating device 1, and the same reference numerals will be given in the following description. Fig. 8 is a flow chart showing the application of the organic EL liquid by the coating device 1b. When the organic sputum coating is performed by the coating device 11}, first, the substrate 9 is held by the substrate holding portion 11 (see Fig. 2) and positioned at the coating start position (step S31). At this time, the four nozzles of the coating head 4 (that is, the three ejector % 141 and one second nozzle 142) are located on the substrate 9 in the γ direction (ie, the sub-scanning direction) in FIG. 7 . (+γ) side (ie, the front side of the substrate 9 in the sub-scanning direction with respect to the moving direction), and the (+γ) side of the coated area μ of the substrate 9, that is, between the side of the coated area 91 (+ Υ) The side non-coated region 92 corresponds to the position. Then, the coating head moving mechanism 15 is controlled by the control unit 2, whereby the coating head 14 continuously ejects the organic EL liquid and the solvent from the second nozzle 141 and the second nozzle 142, respectively, from FIG. The (one X) side moves toward the (+χ) _ side (ie, the main scanning direction). Thereby, the organic EL liquid and the solvent are applied in a stripe shape on the (+Υ) side (i.e., the outer side) non-coating region 92 of the application region 91 of the substrate 9 (step S32). Then, the substrate moving mechanism 12 is controlled by the control unit 2, whereby the substrate 9 and the substrate holding portion 11 are moved together toward the (+ Υ) side (i.e., the sub-scanning direction) in Fig. 7 (step S33). On the substrate 9, the solvent evaporates from the organic EL liquid applied in the uncoated region 92 via the first nozzle 41, and the organic EL material remains in the uncoated region 92 in a semi-dry state. Further, all of the solvent applied to the non-coating region 92 from the second nozzle 142 (or almost the other than a very small amount of almost 97100529 27 U39134) is evaporated, and does not remain on the non-coating region 92. In the coating apparatus 1A, the substrate 9 is moved in the sub-scanning direction in step S33, and the first nozzle 141 on the (+Y) side in Fig. 7 of the coating head 14 is located in the coating area 91 (one + Υ^) The side of the side edge (-Υ). In other words, the four nozzles of the coating head 14 are located at positions corresponding to the (+丫) side portion of the coating region 9丨 in the wJ scanning direction. Tian Tian] After the movement of the substrate 9 in the broom direction is completed, the control unit 2 is controlled. • The coating head moving mechanism 15 and the substrate moving mechanism 12 are controlled, and the coating head 14 is placed on the side of the (+ χ) side in FIG. 7 (_χ The side (ie, the main scanning direction) is moved, whereby the organic EL liquid and the solvent are applied to the groove of the coating region 91 of the substrate 9, and then the substrate 9 is directed to the (+γ) side (ie, the sub-scanning direction). Moving (step s 3 4), after the movement of the substrate 9 in the sub-scanning direction is completed, the control unit 25 forbeares whether or not the substrate holding portion 11 and the substrate 9 have moved to the two-point chain=(four) end position in the step 7 (step S36). ) ## has not moved to the end of coating = ^ return step, for example, the coating head Η is moved toward the main scanning direction, == 彳 scanning direction movement, and the position of the substrate 9 (four) moving 'ΐ L mother: human coating In the coating area 91 in which the head 14 is in the direction of the main scanning finger, the substrate 9 is formed in the scanning direction stepped by the scanning direction, and the organic straw is arranged at a pitch of three times the spacing of the substrate at a predetermined interval (4). After the substrate 9 is moved to the uncoated position, the organic EL liquid and the solvent are discharged from the three 97100529 28 1 _ 141 XI 1 second nozzles 142. In the same manner as in the third embodiment, the application of the three organic EL liquid lines applied to the m first nozzles 141 is as described above. The concentration of the solvent component of the organic EL liquid is increased, and the organic EL liquid solvent component in the environment on the side of the (8) side and the side of the line on the (8) side and the side of the organic EL liquid coated on the (_γ) side first nozzle 141 The concentration difference is reduced. By this, the dry 33 speed of the organic EL liquid discharged from the discharge ports of the three first nozzles 141 can be made uniform, and the organic EL discharged from the discharge port of the (_γ)-side second nozzle 141 can be made. The drying speed of the liquid 'forms a substantially uniform sentence in the sub-scanning direction. As a result, uneven coating can be prevented from occurring in the coating region 91 on the substrate 9. In the coating device 1b, in particular, the organic liquid and the solvent are applied in the (+γ) side non-coating region 92 of the coating region 91, and the solvent is evaporated from the organic liquid and the agent line. The concentration of the organic EL liquid solvent component in the environment on the (+":non-coated region 92 in the coating region 9i can be made the same as in the first and second embodiments, and the coating region 91 can be made the most. The drying speed of the organic sputum line on the burial (+γ) side forms a substantially uniform sentence in the sub-scanning direction, and the coating area 91 on the base & 9 can be more reliably prevented from being unevenly coated. The film of the #EL material formed by the organic EL liquid applied on the application region 92 is removed after the application of the organic EL liquid to the substrate is completed. In the coating device lb, since the coating is applied It is not necessary to provide the second nozzle 142 on the (+Y) side of the second nozzle 141 in the head 14, and it is not necessary to provide the gas supply portion 19 on the substrate holding 97100529 29 1339134:11, so that the configuration of the coating device can be On the other hand, in the coating apparatuses of the first and second embodiments, it is not necessary to perform the non-coating. In the field 92, the operation of removing the organic EU material can be simplified. Therefore, the application of the organic EL liquid can be simplified. Next, the coating device according to the fourth embodiment of the present invention will be described. Fig. 9 and Fig. 1G show the fourth. The plan view and the right side view of the embodiment of the coating apparatus are provided. As shown in FIG. 9 and FIG. 10, the first nozzles 141 for discharging the organic sputum are provided in the coating head 14 of the coating device ic, but are not provided. The second nozzle that discharges the solvent. The coating device lc is provided on the (-Y) side of the coating head 14 (that is, the side opposite to the movement direction of the substrate 9 in the sub-scanning direction), and is provided with the spanning substrate holding portion 11 With the arrangement of the substrate moving mechanism 12, the gas supply portion 19& which continuously supplies the solvent gas to the substrate 9 at the same time. Further, similarly to the coating device 1a shown in Fig. 5, the substrate 9 shown in Fig. 9 (+ The Y) side (that is, the relative movement of the substrate 9 in the sub-scanning direction = the front side) is provided with another gas supply portion 19b that is fixed to the upper surface of the substrate holding portion n while supplying the solvent gas to the substrate 9. Other structures and Figure 1 is the same as the coating device shown in Figure 2, in the following description In the following description, the gas supply units 19a and 19b' are referred to as the "i-th gas supply unit 19a" and the "second gas supply unit 19b", respectively. Fig. 9 and Fig. 10 The first gas supply unit 丨9a is a gas discharge mechanism that continuously discharges solvent gas from the discharge port 19丄 toward the main surface of the substrate 9, and is fixed to the substrate moving mechanism 12 and the coating head moving mechanism 15 together. Therefore, the relative position of the coating head 97100529 30 1339134 14 ' with respect to the second gas supply portion 19a in the direction of the main scanning direction is kept constant. The discharge port l9l of the upper portion is longer than the entire length of the base coating region 91 (see FIG. 9) in the x direction, and covers the entire length of the X direction (ie, the main scanning direction) of the 二q2'1. The main surface of the substrate 9 is oriented. In the same manner as the gas supply unit 19 (see FIG. 5) of the second embodiment, the second gas supply unit (10) is a rod-shaped porous resin (for example, a sponge or the like) of the organic EL liquid solvent. The culvert = the entire length of the coating region 91 of the plate 9 is mounted on the substrate to be coated on the main surface of the substrate, and the substrate 9 is relatively fixed. In the coating apparatus 1C, the agent gas is supplied to the (+γ) side portion of the coating region 91 of the substrate 9 by the supply of the second gas supply unit 19b. In the case where n is applied by the coating device lc, the flow-through coating device 1 is applied to the organic liquid solution. When the organic EL liquid is applied, first, the ::re 9 is held on the substrate holding portion " The starting position of the cloth (the step of the step r follows the 'coating head 14 when the liquid is continuously discharged from the first nozzle 141' moves from the (_χ) side to the (10) side in FIG. 9 (ie, the main scanning direction), Thereby, the organic liquid is applied to the three grooves of the application region 91 of the substrate 9 (step S42). At this time, the first gas: = 19a is ejected toward the application region 91 of the substrate 9. In the (-γ) side of the three grooves of the solvent-containing organic EL liquid, the solvent gas is supplied from the second emulsion supply portion 19b to the (9) side portion of the coating region 91. 97100529 1339134 Next, after the substrate 9 is moved toward the (+γ) side (ie, the sub-scan # direction) in FIG. 9 by the substrate moving mechanism 12, it is confirmed by the control unit 2 whether or not the substrate holding 4 U and the substrate 9 have moved to the figure. 9 at the coating end position shown by the two-dot chain line (steps S43, S44). Then, when the substrate holding portion u invites the substrate 9 not to move to the coating junction In the case of the position, the process returns to step S42' and the movement of the coating head 14 in the main scanning direction, the movement of the substrate 9 in the sub-scanning direction, and the position of the substrate 9 are confirmed (steps S42 to s44). +, the substrate holding portion is located at the application end position, and the substrate 14 is stepped in the sub-scanning direction every time (4) the movement of the head 14 toward the main scanning direction is performed, thereby being on the substrate 9 In the k-cloth region 91, 'the organic EL liquid is applied in a stripe shape arranged at a predetermined pitch (that is, equal to the partition wall = a pitch of 3 Å) (steps s42 to s44). Then: when the substrate 9 has moved to the coating end position Then, the discharge of the organic EL liquid from the three '1st nozzles 141' is stopped, and the coating of the substrate machine EL liquid is completed. As described in the above, the coating device lc is applied to the coating head 14 (-Y). The first chaotic body supply portion 19a' is provided on the side, and in the sub-scanning direction, when the substrate 9 is relatively moved together with the coating head 14, the coating gas is supplied to the coating region 91 of the substrate 9, thereby being coated. The organic EL liquid applied by the i-th nozzle on the γ) side of the cloth head 4 is on the (-Y) side region (ie, the vice The concentration of the solvent component of the organic EL liquid in the area where the soil plate 9 in the drawing direction is on the rear side of the moving direction is not coated with the organic EL liquid = region. As a result, in the same manner as in the first embodiment, the coating head can be used. (-Y) side of 14 (that is, the back side of the substrate 9 in the sub-scanning direction with respect to the moving direction). The discharge port of the first nozzle 141 is 97100529 32 1339134 = the drying speed is formed, and a large coating is formed in the sub-scanning direction: Γ Coating unevenness occurs in the coating region 91. The first nozzle 141 is coated by the first outlet of the first gas supply unit 191, and the first nozzle 141 is provided in the main scanning direction. The applied organic EL liquid in the sub-scanning machine EL two V: the uniformity J covers the extension in the main scanning direction

的塗你t、’、全長提升。藉此,便可更確實防止基板9上 的塗佈區域91中發生塗佈不均。 .,藉由在基板9的(+Y)側設置第2氣體供應部19b, 更”第2實施形態同樣地,可將塗佈區域9i最靠( + 側 =有機EL㈣條之乾燥速度,在副掃描方向上形成大致 :勻可更確貫防止基板9上的塗佈區域91發生塗佈不 以上,針對本發明的實施形態進行說明,惟本發明並不 僅侷限於上述實施形態,可進行各種變更。Apply your t, ', and full length. Thereby, it is possible to more reliably prevent coating unevenness from occurring in the coating region 91 on the substrate 9. By providing the second gas supply portion 19b on the (+Y) side of the substrate 9, in the second embodiment, the application region 9i can be closest (+ side = organic EL (four) drying speed, In the sub-scanning direction, it is possible to prevent the coating region 91 on the substrate 9 from being coated more than once, and the embodiment of the present invention will be described. However, the present invention is not limited to the above embodiment, and various types of the present invention can be used. change.

φ 例如第1貫施形態的塗佈裝置1中,亦可取代在第1嗜 觜141的( + γ)側所設置的第2喷嘴142,改為設置有在塗 ^區域91的(+Υ)側非塗佈區域92上方被安裝於基板保持 4 11上並且連續吐出溶劑且可朝主掃描方向移動(即在 田J掃知方向上,對基板9相對固定)的溶劑喷嘴。此情況, 與塗佈頭14第1次朝主掃描方向的移動並行地,在基板 保持部11上所安裝的溶劑喷嘴’朝塗佈頭14移動方向的 相同方向移動’藉此便對塗佈區域91的(+γ)側非塗佈區 域92塗佈溶劑,可使塗佈區域91最靠(+γ;)側的有機EL 97100529 33 1339134 =線條乾燥速度’在副掃㈣向上形成大致均t此外, 1用塗佈裝置1施行的有機EL液塗佈,亦可並行實施從 ⑼側第2喷嘴142的有機乩液〇土出停止(步驟⑽、 ”基板9朝⑹方向的移動(步驟su),亦可在步驟si3 之前便施行步驟S14。 第2實施形態的塗佈裝置la中,2個第2喷嘴142亦 可獨立於具有P喷嘴141的塗佈頭14,另外設置於可 在主掃猫方向上移動的其他塗佈頭上。此情泥,利用第2 喷嘴14 2施行的溶劑塗佈,未必一定要與第!喷嘴i 4】施 行的有機EL液塗佈並行實施,亦可利用在第i噴嘴i4i 施^有機EL液塗佈之前(最好在正要施行有機el液塗佈 之則)’便對塗佈有機EL液的預定溝之(_γ)側塗佈溶劑。 再者,塗佈裝置la中,氣體供應部19未必一定要使用 含潤有機EL液溶劑的多孔質樹脂,亦可利用例如經含潤 洛劑的脫脂棉等纖維。或者與第4實施形態塗佈裝置 =的第1氣體供應部l9a同樣之氣體噴出機構,亦;r作為 氣體供應部19在基板9的(·ί·Υ)側被固定於基板保持部u 上,又亦可在基板9的( + Y)側,於在基板保持部u上面 所形成且朝主掃描方向延伸的溝部令貯留溶劑,並利用哕 洛劑的条發,而對基板9的( + Y)側部位供應溶劑氣體 進一步,可朝主掃描方向移動且喷出溶劑氣體的氣體噴 嘴,亦可安裝於基板保持部U上(即固定對基板9的相對 位置),藉由氣體喷嘴喷出溶劑氣體並朝主掃描方向 動,而對基板9的(+Y)側部位供應溶劑氣體(塗佈裝置1〇 97100529 34 ^39134 中亦同)。 第3實施形態的塗佈裝置lb中,亦可在未開始從第^ 喷嘴U1進行有機EL液吐出,而僅施行從第2噴嘴142 施行溶劑吐出的狀態下,施行塗佈頭14第1次朝主掃描 方向的移動,藉此在塗佈區域91的(^)側非塗佈區域^ 僅塗佈’谷劑。此外,在塗佈起始位置,為使第2喷嘴 142位於與塗佈區域91對應之位置處,亦可藉由調整基 板9的位置’在塗佈頭14第】次朝主掃插方向的移動中, 區域91的( + Y)側非塗佈區域92僅施行有機乩液 u 更進一步,亦可藉由僅使(+Υ)側的1個第J嘴嘴 備1^非塗佈區域92上進行掃描,而對非塗佈區域92涂 線條。不管何種情況’均可使塗佈區 方向上Λ 機E L液線條之乾燥速度,在副掃指 91發生塗佈不均。勺了更確貝防止基板9上的塗佈區域 第4實施形態的塗你梦番 部…的,出口 ,,亦可從第1氣體供應 赁出口 191間歇式嘴出溶劑 體供應部19a的喷出口 ^ Γ弟1虱 掃描方向全長㈣之姑㈣ 為涵蓋塗佈區域91的主 】9a上,設置涵蓋涂佈亦可例如在第1氣體供應部 複數小噴出口。▲品^ 91的主掃描方向全長排列的 體trr可在主掃描方向上移動且噴出溶劑氣體的氣 體噴薄,亦可在塗佈頭14的 月』虱奴的軋 保持部11設置⑽在㈣描H越=9與基板 J上對丄佈頭14之相對位 97100529 1339134For example, in the coating device 1 of the first embodiment, the second nozzle 142 provided on the (+ γ) side of the first sputum 141 may be replaced with the (+ 在) in the coating region 91. A solvent nozzle that is mounted on the substrate holding portion 41 above the side non-coating region 92 and continuously discharges the solvent and is movable in the main scanning direction (that is, relatively fixed to the substrate 9 in the direction in which the field J is swept). In this case, in parallel with the movement of the coating head 14 in the main scanning direction for the first time, the solvent nozzles 'on the substrate holding portion 11 are moved in the same direction as the moving direction of the coating head 14'. The (+γ) side non-coating region 92 of the region 91 is coated with a solvent, and the organic EL 97100529 33 1339134 = line drying speed of the coating region 91 on the (+γ;) side is formed to be substantially uniform in the sub-sweep (four) direction. In addition, the application of the organic EL liquid applied by the coating device 1 may be performed in parallel with the organic mash liquid from the (9)-side second nozzle 142 (step (10)," movement of the substrate 9 in the (6) direction (step) Su), step S14 may be performed before step si3. In the coating device 1a of the second embodiment, the two second nozzles 142 may be independent of the coating head 14 having the P nozzle 141, and may be provided separately. The main coating head is moved on the other coating head in the direction of the cat. The solvent application by the second nozzle 142 is not necessarily carried out in parallel with the application of the organic EL liquid applied by the nozzle No. 4 It is used before the application of the organic EL liquid in the i-th nozzle i4i (preferably in the middle) In the coating apparatus la, the gas supply unit 19 does not necessarily have to use the organic-containing organic EL liquid. The porous resin of the solvent may be, for example, a fiber such as a cotton-containing absorbent or a gas discharge mechanism similar to the first gas supply unit 19a of the fourth embodiment, or a gas supply unit; 19 is fixed to the substrate holding portion u on the (·····) side of the substrate 9, or may be formed on the (+Y) side of the substrate 9 on the substrate holding portion u and extending in the main scanning direction. The groove portion is a gas nozzle that supplies a solvent gas and supplies a solvent gas to the (+Y) side portion of the substrate 9 to move the solvent gas in the main scanning direction, or may be attached to the substrate. On the holding portion U (that is, the relative position to the substrate 9), the solvent gas is ejected by the gas nozzle and moved in the main scanning direction, and the solvent gas is supplied to the (+Y) side portion of the substrate 9 (coating device 1〇) 97100529 34 ^39134 中中同). 3rd form In the coating apparatus 1b, the organic EL liquid is not discharged from the second nozzle U1, and only the second nozzle 142 is used to discharge the solvent, and the coating head 14 is applied to the main scanning direction for the first time. The movement is thereby applied to the (^) side non-coating area of the coating region 91 to apply only the "grain." Further, at the coating start position, the second nozzle 142 is placed corresponding to the coating region 91. At the position, by adjusting the position of the substrate 9 in the movement of the coating head 14 toward the main sweeping direction, the (+Y) side non-coating region 92 of the region 91 is only subjected to the organic sputum u. Further, it is also possible to apply a line to the non-coating region 92 by scanning only one of the J-th nozzles on the (+Υ) side. In any case, the drying speed of the E L liquid line in the direction of the coating zone can be made unevenly applied to the secondary finger 91. The spoon is applied to prevent the coating area on the substrate 9 from being sprayed on the substrate of the fourth embodiment, and the outlet may be sprayed from the first gas supply and outlet 191 to the intermittent nozzle supply body supply portion 19a. Exit ^ Γ 虱 1 虱 虱 虱 虱 虱 ( ( 四 ( ( ( 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四▲The main body trr of the main scanning direction of the product 91 can be moved in the main scanning direction and the gas of the solvent gas is sprayed, or can be set in the rolling holding portion 11 of the coating head 14 (10). H==9 and the relative position of the substrate head 14 on the substrate head 97100529 1339134

置被固定的狀態下設置、M 朝主掃描方向移動.,=‘2=2;;溶劑氣體並 供應溶劑氣體。 ,(y)側,對基板9 塗佈^Ic: t,村取代作為氣 體供應部19a改為例如將已 構的第1乳 樹脂或纖維,於在副掃^機豇液》谷劑的多孔質 任田J卸描方向上對塗佈頭14 被固定的狀態下,設置於塗佈頭Η的 ' 置 •置4最好涵盖塗佈區域91的主掃描方向全長設 f 1至第3實施形態的塗佈裝置中,從第 .吐出的溶劑未必為有機EL液的溶劑,亦可為盘有嘴機心: 的流動性材料。第4實施形態的 f裝置lc亦疋同樣的,可從第1氣體供應部19a噴出 ^有機EL液溶劑相等的揮發性材料氣體’並供應給基板 9。所謂「與有機EL液溶劑相等的揮發性材料」,係指可 鲁延遲有機EL液乾燥的揮發性材料,最好含有與有機^ 溶劑共通成分或類似成分。如上述實施形態,在有機= 液的溶劑係使用均三甲笨情況時,與有機EL液溶劑的相 等的揮發性材料係可利用諸如:大茴香醚(甲氧基笨)、甲 本、一甲苯等芳香族有機溶劑。 再者,第2與第4實施形態的塗佈裝置中,亦可利用在 基板9的(+Y)側於基板保持部u上所固定的氣體供應部 19與第2氣體供應部19b,供應與有機EL液溶劑相等的 揮發性材料氣體。另外,第2實施形態的塗佈裝置la, 97100529 36 1339134 從氣體供應部19所供摩的氣體, 142所吐出的流動性材料為不同種 於與從第2喷嘴 第4實施形態的塗佈裝置 的揮發性材料氣體。 體供應部W所供應的氣體、盘亦可將從第1氣 供應的氣體設為不同種類。 第2氣體供應部19b所 上述貧施形態的塗佈裝置中, 構12進彳亍Am 亦可取代利用基板移動機 板保持部11之移動,改為藉由塗佈 板9對冷係4 °上的移動而進行在副掃描方向上基 板9對塗佈頭14的相對移動。 頭移動機構15施行的塗佈頭! :取代利用塗佈 基板保持部U在主掃描方向上的移動文^由基板9與 向上塗佈頭U對基板9的相對移動。 仃主知描方 上述塗佈裝置中,亦可從塗佈頭14的 141,同時吐出分別含有紅色⑻、綠色⑹及藍色⑻等: 異顏色之3種有機EL材料的 施行塗佈。此情,戈下冷:有機此液,而對基板9 _在副Ah上? 中相鄰接2個第1嘴嘴 此外,塗係Μ Η °、距離’被設為與隔壁間距相等。 出有機EL料第1噴嘴⑷個數 未必僅侷限於3個,亦可蔣 數 ⑷設置於塗佈頭14上Z 上的第1喷嘴 所吐出的有機^ t ,從該等第1噴嘴141 中條紋狀塗佈 亦可在未設置有隔壁的塗佈區域91 二二:基板9上連續吐出的有機EL液線條,因 …中的有機EL材料在主掃描方向上較容易移動為: 97100529Set to a fixed state, M moves in the main scanning direction., = '2 = 2;; solvent gas and supply solvent gas. On the (y) side, the substrate 9 is coated with ^Ic: t, and the village is replaced by the gas supply portion 19a, for example, the first latex or fiber which has been constructed, and the porous material in the sub-sweeping machine. In the state in which the coating head 14 is fixed in the direction in which the coating is applied, the setting of the coating head 14 is preferably set to cover the entire length of the coating region 91 in the main scanning direction from the first to the third embodiment. In the coating apparatus of the form, the solvent discharged from the first embodiment is not necessarily a solvent of the organic EL liquid, and may be a fluid material of a disk-nozzle movement. Similarly to the f device lc of the fourth embodiment, the volatile material gas "equivalent to the organic EL liquid solvent" can be ejected from the first gas supply portion 19a and supplied to the substrate 9. The "volatile material equivalent to the organic EL liquid solvent" means a volatile material which can be delayed in drying the organic EL liquid, and preferably contains a common component or a similar component with an organic solvent. In the above embodiment, when the organic solvent is used in a solvent-based manner, the volatile material equivalent to the organic EL solvent may be, for example, anisole (methoxy phenyl), methylamine, and toluene. Aromatic organic solvents. Further, in the coating apparatus according to the second and fourth embodiments, the gas supply unit 19 and the second gas supply unit 19b fixed to the substrate holding portion u on the (+Y) side of the substrate 9 may be supplied. A volatile material gas equal to the solvent of the organic EL solution. In addition, the coating device la of the second embodiment, 97100529 36 1339134, the fluid material discharged from the gas supplied from the gas supply unit 19, 142 is different from the coating device of the fourth embodiment of the second nozzle. Volatile material gas. The gas or disk supplied from the body supply unit W may be of a different type from the gas supplied from the first gas. In the coating apparatus of the above-described lean mode of the second gas supply unit 19b, the movement of the substrate moving plate holding portion 11 may be replaced by the coating plate 9 instead of the cooling system 4°. The relative movement of the substrate 9 to the coating head 14 in the sub-scanning direction is performed by the upper movement. The coating head to be applied by the head moving mechanism 15: instead of the relative movement of the substrate 9 by the substrate 9 and the upper coating head U by the movement of the coated substrate holding portion U in the main scanning direction. In the coating apparatus described above, three kinds of organic EL materials each containing red (8), green (6), blue (8), and the like: different colors may be simultaneously ejected from the coating head 14 141. This situation, Ge down cold: organic this liquid, and on the substrate 9 _ on the Deputy Ah? Two first nozzles are adjacent to each other. Further, the coating system 距离 ° and the distance ' are set to be equal to the distance between the partition walls. The number of the first nozzles (4) of the organic EL material is not limited to three, and the organic nozzles discharged from the first nozzles provided on the coating head 14 Z may be used in the first nozzles 141. The stripe-like coating may also be an organic EL liquid line continuously ejected on the coated area 91 and the substrate 9 which are not provided with the partition walls, and the organic EL material in the main scanning direction is easily moved to: 97100529

37 S 1339134 而依乾燥時間的差異,有機此材料的偏差變大,而容易 發生如圖4A所示膜厚差。上述實施形態的塗佈裝置,如 上述可提高有機EL液的乾燥時間均句性,因此特別適用 於連續吐出有機EL液並對基板施行塗佈的裝置,亦適用 於如噴墨方式將流動性材料㈣式吐“㈣㈣ 的裝置。 域實施形態的塗佈裝置中,亦可將含有揮發性溶劑 (例如幻與電洞輸送材料的流動性材料塗佈於基板9 二此處,所謂「電洞輸送材料」’係指形成有㈣顯示 洞輸送層的材料,所謂「電洞輸送層」係並非僅 機EL材料所形成的有機EL層輸送電洞的狹義電 洞輸送層,亦涵蓋執行電洞注入的電洞注入層。 裝们片基板製造複數錢EL顯示 \ α更夕面)的情況。此外,上述塗佈裝 =含有機EL顯示裝置用有㈣材料或電洞輸送材: ^動性材料塗佈,亦可利用於例如對液晶顯 :顯示裝置等平面顯示裝置用基板塗佈含有 = :、。榮先材料等其他種類像素形成材料之流動性材= :二佈?:置由於可防止在基板9上的塗佈區域 均与㈣“ 因而㈣適用於含有較容易受塗佈不 用品時之顯示品質降低之平面顯示裝置 機E L材^枓(上述實施形態中,有機E L顯示裝置用有 材枓)的流動性材料塗佈,但是上述塗佈裝置亦可利 97100529 38 < s 1339134 用於對平面顯示裝置用基板與半導體基板等各種基板施 行各種流動性材料的塗佈。 針對本發明已詳細描述說明,惟前述說明僅止於例示而 不作限疋。所以’在不脫離本發明範脅之前提下,可有多 數變化與態樣。 【圖式簡單說明】 圓1為第1實施形態的塗佈裝置俯視圖。 φ 圖2為塗佈裝置的右側視圖。 圖3為有機EL液的塗佈流程圖。 圖4A為由比較例的塗佈裝置在基板上所形成的有機虹 材料之獏的剖視圖。 圖為由本實施形態的塗佈裝置在基板上所形成有 EL材料之膜的剖視圖。 圖5為第2實施形態的塗佈裝置俯視圖 圖6為有機EL液的塗佈流程圖。37 S 1339134 Depending on the difference in drying time, the deviation of the organic material becomes large, and the film thickness difference as shown in Fig. 4A easily occurs. Since the coating apparatus of the above-described embodiment can improve the drying time uniformity of the organic EL liquid as described above, it is particularly suitable for a device which continuously ejects the organic EL liquid and applies the substrate, and is also suitable for fluidity such as an ink jet method. In the coating device of the field embodiment, a fluid material containing a volatile solvent (for example, a magical and hole transporting material may be applied to the substrate 9), so-called "hole". The conveying material "" refers to a material in which a (four) display hole transport layer is formed, and the so-called "hole transport layer" is not a narrow hole transport layer of an organic EL layer transport hole formed only by an EL material, and also covers an execution hole. The injection hole is injected into the layer. The case where the substrate substrate is manufactured to make a plurality of money EL display \ α 夕 面). Further, the above-mentioned coating device=(4) material or hole transporting material for the organic EL display device is coated with a movable material, and may be used, for example, for coating a substrate for a flat display device such as a liquid crystal display device. :,. Flow material of other kinds of pixel forming materials such as Rongxian material = : 2 cloth? : It is possible to prevent the coating area on the substrate 9 from being (4) "thus (4) is suitable for a flat display device machine EL material which is suitable for containing a display material which is more susceptible to coating, and is not organic (in the above embodiment, organic The EL display device is coated with a fluid material of the material, but the above-mentioned coating device can also be used for applying various fluid materials to various substrates such as a substrate for a flat display device and a semiconductor substrate. The description of the present invention has been described in detail, but the foregoing description is only illustrative and not limiting. Therefore, many variations and aspects may be present without departing from the scope of the invention. [Simplified illustration] 1 is a plan view of the coating apparatus of the first embodiment. Fig. 2 is a right side view of the coating apparatus, Fig. 3 is a flow chart of coating of an organic EL liquid, and Fig. 4A is a substrate formed by a coating apparatus of a comparative example. A cross-sectional view of a film of an EL material formed on a substrate by the coating apparatus of the present embodiment. Fig. 5 is a plan view of the coating apparatus of the second embodiment. FIG 6 is a flowchart illustrating an organic EL coating liquid.

9a 圖7為第3實施形態的塗佈裝置俯視圖 圖8為有機EL液的塗佈流程圖。 圖9為第4實施形態的塗佈裝置俯視圖 圖10為塗佈裝置的右側視圖。 51 11為有機EL液的塗佈流程圖。 【主要元件符號說明】 la ' lb、lc 塗佈裝置 控制部 基板 97100529 39 13391349a is a plan view of a coating apparatus according to a third embodiment. Fig. 8 is a flow chart showing the application of an organic EL liquid. Fig. 9 is a plan view of a coating apparatus according to a fourth embodiment. Fig. 10 is a right side view of the coating apparatus. 51 11 is a coating flow chart of the organic EL liquid. [Main component symbol description] la ' lb, lc coating device Control unit Substrate 97100529 39 1339134

11 基板保持部 12 基板移動機構 13 對準標記檢測部 14 塗佈頭 15 塗佈頭移動機構 16 受液部 18 流動性材料供應 19 氣體供應部 19a 第1氣體供應部 19b 第2氣體供應部 91、 91a 塗佈區域 92 非塗佈區域 93、 93a 膜 141 第1喷嘴 142 第2喷嘴 143 噴嘴托架 191 喷出口 97100529 4011 substrate holding portion 12 substrate moving mechanism 13 alignment mark detecting portion 14 coating head 15 coating head moving mechanism 16 liquid receiving portion 18 fluid material supply 19 gas supply portion 19a first gas supply portion 19b second gas supply portion 91 91a coating area 92 uncoated area 93, 93a film 141 first nozzle 142 second nozzle 143 nozzle holder 191 discharge port 97100529 40

Claims (1)

1339134 十、申請專利範圍: 1.種塗佈裝置係對基板塗佈流動性材料;其具備有: 基板保持部,用以保持基板; 吐出機構,朝上述基板吐出流動性材料;以及 *移動機構,使上述吐出機構在平行於上述基板主面的主 掃描方向上對上述基板相對移動,同時每次朝上述主掃描 方向進行移動時,將上述基板對上述吐出機構朝平行於上 鲁述主面且垂直於上述主掃描方向的副掃描方向相對移動; 而上述吐出機構係具備有: 第1 土出,從在上述副掃描方向上依等間隔排列的複 吐出口,吐出含有揮發性溶劑與提供於上述基板上之材 的第1流動性材料’藉此在上述基板上的塗佈區域塗佈 上述第1流動性材料;以及 第2吐出部’相對於上述第1吐出部,被配置於上述〗 *描方向上之上述基板的相對移動方向後侧,藉由吐出 述第1流動性材料的上述溶劑或與上述溶劑相考 t材料之第2流動性材料’而在上述基板上的上述塗佈e 域塗佈上述第2流動性材料。 2·如申請專利範圍第 ——· ▲項之塗佈裝置,兵肀,上述吐 =固%t述第2吐出部相對於上述第1吐出部的相對 上述吐出 3.如申請專利範圍第2項之塗佈裝置,其中 機構係更進一步具備有: 被配置於相對於上述第 吐出部於上述副掃描方向上 97100529 41 向前側且吐*上述第2流動性材 佈:在上利:另上一述第第;:二部開始上述第1流動性材料的塗 外側材料’藉此在上述基板的上述塗佈區域 J之非塗佈區域塗佈上述第2流動性材料。 具=中請專利範圍第2項之塗佈裝置,其中,更進一步 2供應部,其係在上述基板於上述崎 對移動方向前側,對上述基板相對时 的相 =材料的上述溶劑或與上述溶劑相等的^; ‘如申請專利範圍第1項之塗佈裝置,其中, 上述第2吐出部係從上述副掃描方向上不同位置 數吐出口吐出上述第2流動性材料。 6.如申請專利範圍第i項之塗佈裝置,其中, 機構係更進一步具備有: 相對於上述第1吐出部被配置於上述副婦描方向上的 上述基板相對移動方向前側且吐出上述第2流動性 的另一第2吐出部; / 而在利用上述第!吐出部開始上述第i流動性材料的塗 佈時,上述另一第2吐出部於上述主掃描方向上移動並 吐出上述第2流動性材料,藉此在上述基板的上述塗佈區 域外側之非塗佈區域塗佈上述第2流動性材料。 97100529 42 7·如申請專利範圍第 具備有: .1項之塗佈裝置,其中,更進 步 對:::::’其係在上述基板於上述副掃描方向上的相 流動极/則側’對上述基板相對固定,且供應上述第1 :氣體。料的上述溶劑或與上述溶劑相等的揮發性材料 中,.如申5月專利範圍第4 7項中任一項之塗佈裝置其 材料 =述第!流動性材料係包含平面顯示裝置用像素形成 中 9·如申請專利範圍第丨至7項中任―項之塗佈裂置,其 ;吐出部係連續吐出上述第1流動性材料; 吐出部係連續吐出上述第2流動性材料。 10·如申請專利範圍第9項之塗佈裝置其令, 材ί述第1流動性材料係包含平面顯示裝置用像素形成 有..種塗佈裝置,係對基板塗佈流動性材料其具備 基板保持部,用以保持基板; Η::’從在上述基板主面的平行副掃描方向上依等 料; 劑及“供於上述基板上之材料的流動性材 971005291339134 X. Patent Application Range: 1. A coating device for applying a fluid material to a substrate; the device comprising: a substrate holding portion for holding the substrate; a discharge mechanism for discharging a fluid material toward the substrate; and a *moving mechanism And causing the discharge mechanism to relatively move the substrate in a main scanning direction parallel to the main surface of the substrate, and moving the substrate toward the discharge main body in parallel with the main surface in the main scanning direction. And moving in a sub-scanning direction perpendicular to the main scanning direction; and the discharging mechanism is provided with: a first soil discharge, and a re-discharging outlet arranged at equal intervals in the sub-scanning direction, and discharging a volatile solvent and providing a first fluid material of the material on the substrate, wherein the first fluid material is applied to the application region on the substrate; and the second discharge portion is disposed on the first discharge portion * The solvent or the solvent described above for discharging the first fluid material by the back side of the relative movement direction of the substrate in the drawing direction T test materials flowable material 2 'in the coating on the substrate region e applying the second fluid material. 2. In the case of the coating device of the scope of the patent application, the sputum, the sputum, the sputum, the sputum, the sputum, the second squirting portion, the first squirting portion, the squirting portion The apparatus of the present invention, further comprising: disposed on the front side of the first discharge unit 97100529 41 in the sub-scanning direction, and spits the second fluid material cloth: on the top: another The second material is applied to the non-coating region of the coating region J of the substrate by the first coating material of the first fluid material. The coating apparatus according to the second aspect of the invention, wherein the second supply unit is the solvent of the phase=material when the substrate is facing the moving direction, and the solvent is The coating apparatus according to the first aspect of the invention, wherein the second discharge unit discharges the second fluid material from a plurality of different positions in the sub-scanning direction. 6. The coating apparatus according to the invention of claim 1, wherein the apparatus further includes: the first discharge unit is disposed on the front side of the substrate in the direction of the movement direction of the substrate, and the discharge is performed 2 another second discharge part of fluidity; / while using the above mentioned! When the discharge portion starts the application of the first fluid material, the other second discharge portion moves in the main scanning direction and discharges the second fluid material, whereby the outer side of the coating region of the substrate is not The second fluid material is applied to the coating region. 97100529 42 7· If the scope of application for patent application is: 1. The coating device of item 1. Among them, the more advanced pair:::::' is the phase flow electrode/the side of the substrate in the above-mentioned sub-scanning direction' The substrate is relatively fixed and the first gas is supplied. The above-mentioned solvent of the material or the volatile material equivalent to the above-mentioned solvent, such as the coating device of any one of the items of the patent of the fourth of The fluidity material includes a coating formation in a pixel for a flat display device, and a coating cracking according to any one of the above-mentioned items, in the seventh aspect of the invention, wherein the discharge portion continuously discharges the first fluid material; The second fluid material is continuously discharged. 10. The coating apparatus according to claim 9 of the invention, wherein the first fluid material comprises a coating device for forming a pixel for a flat display device, and the substrate is coated with a fluid material. a substrate holding portion for holding the substrate; Η:: 'from the parallel sub-scanning direction of the main surface of the substrate; a solvent and a flow material for the material on the substrate 97100529 43 ⑶9134 平=2,使上述吐!機構在垂直於上述副掃描方向且 動,同時的主掃描方向上對於上述基板相對移 板對I 朝上述主掃描方向進行移動時,使上述基 氣體2出機構朝上述副掃描方向相對移動;以及 ^體供應部,在上収出機構的上㈣掃 對移動方向後r對於上述吐出機構的上述副 上相對位置被固定’同時供應上述流動性材料的 述浴劑或與上述溶劑相等的揮發性材料的氣體。 2.如申請專利範圍第丨丨項之塗佈裝置,苴 係具有涵蓋上述塗佈區域的上述主掃描方= = 基板的上述主面同時朝上述主面喷出上 13·如申請專利範圍第12項之塗佈裝置其 步具備有: 另一氣體供應部’其係在上述基板的上制掃描方向上 相對移動方向别側,對於上述基板被相對固定,並供應 ==材料的上述溶劑或與上述溶劑相等的揮發; 14.如申%專利範圍第丨丨項之塗佈裝置,其中,一 步具備有: 另-氣體供應部,其係在上述基板的上述副掃福方向上 之相^移動方向前側,對於上述基板被相對m定,並供應 上述流動性材料的上述溶劑或與上述溶劑相等的揮發性 材料的氣體。 < S 97100529 44 丄339134 項之塗佈裝 置用像素形 15.如申請專利範圍第u至14項中任一 置其中,上述流動性材料係含有平面顯示裝 成材料。 16·種塗佈方法,係對基板塗佈流動性材料;其包括 =吐出機構朝基板吐出流動性材料並使上述吐出機 上述基板主面的主掃描方向上對上述基板相 對移動的步驟; b) 在平行於上述基板之上述主面且垂直於上述主掃描 指方向上’使上述基板對上述吐出機構相對移 動的步驟;以及 切 c) 重複上述a)步驟與上述b)步驟的步驟; 而上述a)步驟係包括有: c〇=述吐出機構的第丨吐出部卜從在上述副掃 的複數吐出口,吐出含有揮發性溶劑及 = 述基板上之材料的第1流動性材料,藉此在上述 上的塗佈區域塗佈上述第1流動性材料的步驟;以及 ο與上述d)步驟並行、或在上述d)步驟之前,對於在 =d)步驟所塗佈的上述第1流動性材料,在上述副掃 ^向上的上述基板相對移動方向後側,從第2吐出部吐 出上^丨流純材料的上述㈣或與 動性材料,藉此在上述塗佈= 上述第2流動性材料的步驟。 17.如申請專利範圍第16項之塗佈方法,其中,43 (3) 9134 flat = 2, make the above spit! When the mechanism moves in the main scanning direction while moving in the main scanning direction perpendicular to the sub-scanning direction, the mechanism causes the base gas 2 out mechanism to relatively move in the sub-scanning direction; The body supply portion is fixed to the upper side relative position of the discharge mechanism after the upper (4) sweeping direction of the upper take-up mechanism, and is supplied with the above-mentioned fluid material or the same solvent as the solvent. Material gas. 2. The coating apparatus according to claim 2, wherein the lanthanide has the main scanning side covering the coating area == the main surface of the substrate is simultaneously ejected toward the main surface. 13 The coating apparatus of the 12th item is provided in the following steps: the other gas supply unit' is attached to the other side of the substrate in the scanning direction of the substrate, and the substrate is relatively fixed, and the solvent or the material of the == material is supplied or And a coating device according to the above aspect of the invention, wherein the coating device of the first aspect of the invention has: a gas supply portion, which is in the direction of the sub-blessing of the substrate; In the front side of the moving direction, the substrate is relatively fixed, and the solvent of the fluid material or the volatile material equivalent to the solvent is supplied. <S97100529, pp. 339,134, the disclosure of which is incorporated herein by reference. a coating method for applying a fluid material to a substrate; the method comprising: discharging a fluid material to the substrate by the discharge mechanism; and moving the substrate relative to the substrate in a main scanning direction of the main surface of the substrate; b a step of: relatively moving the substrate relative to the ejection mechanism in a direction parallel to the main surface of the substrate and perpendicular to the direction of the main scanning finger; and c) repeating the steps of the steps a) and b) above; The step a) includes: c〇=the third discharge material of the discharge mechanism is discharged from the plurality of discharge ports of the sub-sweep, and the first fluid material containing the volatile solvent and the material on the substrate is discharged. The step of applying the first fluid material to the coating region above; and the step of applying the first flow applied in step = d) in parallel with step d) or before step d) The material is discharged from the second discharge portion to the rear side of the substrate in the relative movement direction, and the (4) or the movable material of the pure material is discharged from the second discharge portion, whereby the coating is performed. The step of moving material. 17. The coating method of claim 16, wherein 97100529 45 1339134 上述d)步驟中係連續吐出上述第丨流動性材料; 上述e)步驟中係連續吐出上述第2流動性材料。 18·如申請專利範圍第16或17項之塗佈方法,苴 在上述a)步驟之前,係包括有: 、 〇在上述基板於上述副掃描方向 侧,從上述複數吐出口吐出上述第^、二對移動方向別 楚w山… 4第流純材料並使上述 σ 4在上述主掃描方向相對移動,藉此 的上述㈣區域外狀非㈣區域 上^板 材料的步驟;或 师上这第1流動性 g)在上述基板於上述副掃描 侧,從上述第2吐出部吐出上 °、ά'目對移動方向前 第2吐出部在上述主掃描方向相:動,材料並使上述 佈區域塗佈上述第2流動性材料的步驟’藉此在上述非塗97100529 45 1339134 In the above step d), the second fluid material is continuously discharged; and in the step e), the second fluid material is continuously discharged. 18. The coating method according to claim 16 or 17, wherein before the step a), the method comprises: ??? immersing the substrate on the side of the sub-scanning direction, and discharging the second portion from the plurality of discharge ports The two pairs of moving directions are different from each other. 4 The first stream is pure material and the above-mentioned σ 4 is relatively moved in the above-mentioned main scanning direction, whereby the above-mentioned (four) region is outside the non-(four) region on the board material step; or the division (1) fluidity g) the substrate is ejected from the second discharge unit on the sub-scanning side, and the second discharge unit is moved in the main scanning direction before the moving direction, and the material is placed on the sub-scanning unit. a step of applying the second fluid material described above 97100529 46 < S97100529 46 < S
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