TWI333986B - - Google Patents

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Publication number
TWI333986B
TWI333986B TW95130710A TW95130710A TWI333986B TW I333986 B TWI333986 B TW I333986B TW 95130710 A TW95130710 A TW 95130710A TW 95130710 A TW95130710 A TW 95130710A TW I333986 B TWI333986 B TW I333986B
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TW
Taiwan
Prior art keywords
wastewater
workpiece
copper
rinsing step
recovered
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Application number
TW95130710A
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Chinese (zh)
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TW200811315A (en
Inventor
qi liang Chen
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Mitac Technology Corp
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Priority to TW95130710A priority Critical patent/TW200811315A/en
Publication of TW200811315A publication Critical patent/TW200811315A/en
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Publication of TWI333986B publication Critical patent/TWI333986B/zh

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  • Chemically Coating (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • Treatment Of Water By Ion Exchange (AREA)

Description

1333986 九、發明說明: 【發明所屬之技術領域】 方法 本發明係關於-種表面處理方法,制侧於—種化學錢銅 【先前技術】 隨著化學鍍峨術走向絲,化學細方法已開 =塑谬表面防丽處理和PCB板表面财等工業領域。而】= /干鑛巧方法巾,漂洗ji件過程巾所產生廢水@含有重金屬Cu2? 須進行處理後才能回收或排放。儘管傳統之化學沉殿法可以有^ 之去除廢水中金屬離子,但仍會產生需要專業處n 泥,不利環境。 里备屬5 【發明内容】 鑒於以上問題,本發明係提供一種化學鐘銅迴圈處理方 該方法將化學鍵銅與離子交換和反滲透等技術有機結合起竇 現閉路迴®,在陳大部分金;源之同時無舰和廢水排放。 本發明提供德學織1迴@處理方法,其巾所包括之處理 驟為.首先’將-待鑛銅工件進行前處理,以去除該待錢銅 表面之油脂和氧化膜層並清潔其表面;然後將上述工件浸 學鍍銅溶液中進行_處理;接著再浸洗已鑛完銅之工件,以 收部分銅資u後再翻三級逆流漂洗,把工件表面 餘鍍液用大量树洗’這部分生成之帶有重金屬的廢水不符合排 放標準’必賊理;因此,最後祕上述漂洗所鶴水調整PH值 至2〜10後,再通過離子交換樹脂,使廢水中之重金屬離子與離 f父換樹脂中之相同類型離子進行交換,以回收廢水中之重金屬 資源,再經過一超濾步驟,以除去其廢水中所含之大分子雜質, 然後再進行反滲透處理,將未淨化之廢水分離出來,並將直輸送 回開始之漂洗廢水中以進行迴圈處理,而將已淨化之 ^ 直接用於漂洗工件。 該化學鍍銅迴圈處理方法本身已形成閉路迴圈,所得回收之 1333986 ,金屬和水可以再糊,基本上實現了廢水之零聽,避免其造 或%境污染。 #為使對本發明之目的、構造特徵及其功能有進一步之瞭解, 级配合圖示詳細說明如下: 【實施方式】 本發明提供之化學鑛銅迴圈處理方法,如圖丨所示立中所 包括之處理步驟分別為: /、1333986 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a surface treatment method, and the side is made of a chemical money copper. [Prior Art] With the electroless rhodium plating, the chemical fine method has been opened. = Plastic surface anti-treatment and PCB board surface financial industry. And] = / dry mining method towel, rinsing ji parts process towel produced wastewater @ containing heavy metal Cu2? Must be treated before recycling or discharge. Although the traditional chemical sinking method can remove metal ions from wastewater, it still produces a need for professional n mud, which is unfavorable. In view of the above problems, the present invention provides a chemical clock copper loop processing method which combines chemical bond copper with ion exchange and reverse osmosis technologies to form a sinus closed circuit®, in most of Chen Gold; the source is without ship and wastewater discharge. The invention provides a German processing method, and the processing steps included in the towel are: firstly, the pre-treatment of the copper workpiece to be removed to remove the grease and oxide film layer of the copper surface and clean the surface thereof. Then, the workpiece is immersed in a copper plating solution for _ treatment; then the copper-plated workpiece is immersed to collect a portion of the copper material, and then the third-stage countercurrent rinsing is performed, and the surface plating solution of the workpiece surface is washed with a large amount of trees. 'This part of the wastewater with heavy metals generated does not meet the emission standards' must be thief; therefore, the final secret of the above-mentioned rinsing water to adjust the PH value to 2~10, and then through the ion exchange resin, so that the heavy metal ions in the wastewater f The father exchanges the same type of ions in the resin to recover the heavy metal resources in the wastewater, and then undergoes an ultrafiltration step to remove the macromolecular impurities contained in the wastewater, and then reverse osmosis treatment, and the unpurified The wastewater is separated and sent directly back to the initial rinse wastewater for loop processing, while the purified scrubber is used directly to rinse the workpiece. The electroless copper plating loop treatment method itself has formed a closed loop, and the recovered 1333986, the metal and water can be further paste, basically realizes the zero hearing of the waste water, avoiding its manufacture or % environmental pollution. In order to further understand the object, structural features and functions of the present invention, the level matching diagram is described in detail as follows: [Embodiment] The method for processing a chemical ore copper loop provided by the present invention is as shown in FIG. The processing steps included are: /,

^前處理S1 ’以播待鍍銅轉表面之油脂和氧化膜層並清 办八表面,其可以透過噴砂、酸洗或水洗等工藝來實行; b.化學_ S2,將上述件浸潰於化學細驗巾進行鑛銅 處理’該步财不對化學細雜似限任意、 銅溶液皆可; 干 c·銅回收S3,浸洗已錢完銅之工件,以回收部分銅資源 ^驟中優選使用去離子水進行浸洗處理錢其浸洗後所得溶液 可以直接回用; d. 漂洗S4,採用三級逆流漂洗,作業時三槽並列,一段連續 ,水」一段連續排放,以將工件表面之少量殘餘鍍液用大量水沖 ;這。卩刀生成之帶有重金屬的廢水不符合排放標準,必須處理; e. 漂洗廢水回收處理S5〜S11,其過程具體為開始係對漂 行調整PH值S5,以將其PH值調為3〜10,然後進行離子交 換S6,利用離子交換樹脂特性,使廢水+之重金屬離子與離 換樹脂中相同類型離子進行交換,以回收廢水中之重金屬邓, ^超濾S7,通過一半透膜以去除其廢水_含有之大分子雜 ^後即通過-反渗透轉S8,⑽已淨化絲淨化之廢水進分 離,所得淨水中幾乎檢測不到銅離子之存在,可將其淨水直 ίΓ用^漂缸件S1丨,而另絲淨化之廢水經過—濃水迴圈處理 S10’輸迗回開始未經處理之廢水中,重新處理,如此迴 化廢水,可基本達到零排放。 J/r 以上所述,僅是本發明較佳可行之實施例而已,不能因此即 6 1333986 局限本發明之權利範圍,對熟悉本領域的普通技術人員來說’舉 凡運用本發明之技術方案和技術構思做出其他各種相應之改變和 篇=内而所有這些改變和變形都應屬在本發明權利要:之保護範 【圖式簡單說明】 圖1係為本發明之流程示意圖。 【主要元件符號說明】 51 52 53 54 55 前處理^Pre-treatment S1 'to broadcast the grease and oxide layer of the copper-plated surface and clear the eight surfaces, which can be carried out by sandblasting, pickling or water washing; b. Chemistry _ S2, the above parts are immersed in Chemical fine test towel for mineral copper treatment 'This step is not limited to chemical fine impurities, copper solution can be; dry c · copper recovery S3, dip the finished copper workpiece, to recover part of the copper resources Use deionized water for dip treatment. The solution obtained after immersion can be directly reused. d. Rinse S4, use three-stage countercurrent rinsing, three slots in parallel during operation, one continuous, one continuous discharge of water, to surface the workpiece A small amount of residual plating solution is washed with a large amount of water; this. The waste water with heavy metal generated by the sickle does not meet the discharge standard and must be disposed of. e. The rinse waste water recovery treatment S5~S11, the process is specifically to adjust the pH value S5 to adjust the pH value to 3~ 10, then ion exchange S6, using the characteristics of ion exchange resin, the heavy metal ions of the wastewater + exchange with the same type of ions in the exchange resin, in order to recover the heavy metal Deng in the wastewater, ^ ultrafiltration S7, through half of the membrane to remove After the wastewater _ contains macromolecules, it passes through - reverse osmosis to S8, (10) the purified wastewater purified by the purified silk enters and separates, and the obtained purified water can hardly detect the presence of copper ions, and the water can be directly used. The slewing cylinder S1 丨, and the waste water purified by the other wire is discharged into the untreated wastewater by the concentrated water circulation treatment S10', and the wastewater is retreated, so that the waste water can be basically reduced to zero. The above description of the present invention is only a preferred embodiment of the present invention, and thus it is not intended to limit the scope of the present invention, and those skilled in the art will be able to apply the technical solutions of the present invention. The technical concept makes various other corresponding changes and changes. All such changes and modifications are intended to be included in the scope of the present invention. FIG. 1 is a schematic flow diagram of the present invention. [Main component symbol description] 51 52 53 54 55 Pre-processing

56 57 58 59 510 51156 57 58 59 510 511

化學鍍銅 銅回收 漂洗 調整 離子交換 超濾、 反渗透 重金屬回收 濃水猶環處理 淨水回用Electroless copper plating, copper recovery, rinsing, adjustment, ion exchange, ultrafiltration, reverse osmosis, heavy metal recovery, concentrated water treatment, water purification

Claims (1)

1333986 -:·ώ' 4ν -一一A 申請專利範圍:1333986 -:·ώ' 4ν - One A A patent application scope: 1. 一種化學鍍銅迴圈處理方法,包括: 待錢銅件表面之油脂和氧化膜層並清 ; J潰該工件於-化學鍍銅溶液中進行鍍銅處理;’、一 浸洗已鑛完銅的工件,回收部分銅; 漂洗該工件表面的少量殘餘鍍液; 調整該漂洗步驟所得之廢水之PH值為3〜1〇 . 值的廢水經—離子交換樹脂,分離出該廢水中之重 金屬離子並回收; Α 濾除該廢水中之雜質; 將該廢水經-反滲透步驟,分離出—未淨化廢水與一淨化廢 水,及 上將,淨化廢水輸送至該漂洗步驟回收利用作為漂洗用水,而 該未淨化廢水輸送至該漂洗步驟後重新處理。 2. 如申請專利範圍第1項所述之化學鍍銅迴圈處理方法,其中該 去除-待_工件表面之油脂和氧倾層並清潔其表糾系採用/ 噴砂、酸洗或水洗處理。 3. 如申請專利範圍第丨項所述之化學鍍銅迴圈處理方法,其中該 浸洗已鍍完銅的工件係使用一去離子水進行浸洗處理。八〇x 4. 如申請專利範圍第1項所述之化學鍍銅迴圈處理方法,其中兮 漂洗該工件表面的少量殘餘鍍液係採用三級逆流漂洗步驟,^ 二級逆漂洗步驟包括一段連續進水及一段連續排放進行j票洗§。 81. An electroless copper plating loop processing method, comprising: clearing a grease and an oxide film layer on a surface of a copper piece to be cleaned; J crushing the workpiece in a copper plating solution for copper plating; ', a dip-washed ore The copper workpiece is recovered, part of the copper is recovered; a small amount of residual plating solution is rinsed on the surface of the workpiece; and the pH of the wastewater obtained by the rinsing step is adjusted to be 3 to 1 〇. The value of the wastewater is separated by the ion exchange resin. Heavy metal ions are recovered and recovered; Α the impurities in the wastewater are filtered; the wastewater is subjected to a reverse osmosis step, the unpurified wastewater and a purified wastewater are separated, and the purified wastewater is sent to the rinsing step for recycling as a rinsing water And the unpurified wastewater is sent to the rinsing step for reprocessing. 2. The electroless copper plating loop processing method according to claim 1, wherein the grease and oxygen layer on the surface of the workpiece are removed and cleaned, and the surface is modified by sandblasting, pickling or water washing. 3. The method of claim 2, wherein the immersed copper-plated workpiece is immersed in a deionized water. 8. The electroless copper plating loop processing method according to claim 1, wherein a small amount of residual plating liquid on the surface of the workpiece is rinsed by a three-stage countercurrent rinsing step, and the second reverse rinsing step includes a section. Continuous water ingress and a continuous discharge of j-tickets. 8
TW95130710A 2006-08-21 2006-08-21 Method of cyclic treatment chemical copper coating TW200811315A (en)

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TWI333986B true TWI333986B (en) 2010-12-01

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