TWI333937B - Scriber for controlling pressure using magnetic force - Google Patents
Scriber for controlling pressure using magnetic force Download PDFInfo
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- TWI333937B TWI333937B TW095144545A TW95144545A TWI333937B TW I333937 B TWI333937 B TW I333937B TW 095144545 A TW095144545 A TW 095144545A TW 95144545 A TW95144545 A TW 95144545A TW I333937 B TWI333937 B TW I333937B
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- pressure
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- glass substrate
- wheel
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D79/00—Methods, machines, or devices not covered elsewhere, for working metal by removal of material
- B23D79/02—Machines or devices for scraping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D7/00—Planing or slotting machines characterised only by constructional features of particular parts
- B23D7/10—Planing or slotting machines characterised only by constructional features of particular parts of drives for reciprocating parts
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/105—Details of cutting or scoring means, e.g. tips
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- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Dicing (AREA)
Description
1333937 九、發明說明: 交互參照之相關申請案 此申請主張以下之優先權:韓國專利申請幸贫 10-2005-0133742,2005年12月29日申請,其揭露内 容整體於此納入作為參照。 【發明所屬之技術領域】 本發明關於劃刻裝置供使用磁力控制壓力,具體 言之,係關於劃刻裝置供使用磁力控制壓力,其使加 壓力(pressurizing force)得以於最佳條件下,規則地 作用於基板上。 【先前技術】 一般而言,用於平面顯示器(像是液晶顯示器) 之玻璃基板係根據顯示器尺寸,自大母板(m〇°t°her board)切割與處理。 切割像是玻璃基板之脆性(brittle)材料之製程透 過以下程序執行:藉由鑽石材料所組成之工具以形成 切割線於玻璃基板之表面上之劃刻製程,其中鑽^材 料具有較玻璃基板為大之硬度;以及斷裂(break)製 程’藉由集中於形成.在玻璃基板上之切割線上加^ 板以切#*]玻璃基板。1333937 IX. INSTRUCTIONS: CROSS REFERENCE TO RELATED APPLICATIONS This application claims the following priority: Korean Patent Application No. 10-2005-0133742, filed on Dec. 29, 2005, the disclosure of which is incorporated herein by reference. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a scribe device for using a magnetic force control pressure, in particular, for a scribe device for using a magnetic force control pressure, which allows a pressurizing force to be subjected to optimal conditions, rules Apply to the substrate. [Prior Art] In general, a glass substrate for a flat panel display (such as a liquid crystal display) is cut and processed from a large mother board according to the size of the display. The process of cutting a brittle material such as a glass substrate is performed by a tool consisting of a diamond material to form a cutting line on a surface of the glass substrate, wherein the material of the drill has a glass substrate The hardness of the large; and the breaking process 'by focusing on the formation. Adding a plate to the cutting line on the glass substrate to cut the #*] glass substrate.
4TOP-8N/06021TW : HP02006-KI40050TW 1333937 劃刻製程形成裂痕於玻璃基板之表面上,使用由 硬金屬組成之鑽石切割器或輪切割器。 ,斷裂製程係切割玻璃基板,沿形成於玻璃基板上 之裂痕,藉施加彎矩(bending moment)或陡震力(sh〇ck power)使得裂痕發展深入玻璃内。 換&之’當切割器對玻璃基板之表面加壓,以形 成裂痕於玻璃基板上時,若壓切割器之壓力大於玻璃 之應力畸變(stress distortion)的臨界值,於壓力所施 之一方向產生裂痕,亦即,產生於垂直玻璃基板表面 之方向。此稱為垂直裂痕。 當垂直裂痕發展並到達玻璃基板之對面表面,玻 璃基板自然切割。 然而’當麗切割器之壓力太高,裂痕形成於玻璃 基板表面之水平方向’而此稱為水平裂痕。 當水平裂痕開始發生,對輪之加壓力不作用形成 垂直裂痕,而作用為一力發展水平裂痕。 因此,當以切割器劃刻破璃基板之表面,重要的 是不要發生水平裂痕。4TOP-8N/06021TW : HP02006-KI40050TW 1333937 The scribing process forms cracks on the surface of the glass substrate, using a diamond cutter or a wheel cutter made of hard metal. The breaking process cuts the glass substrate, and along the crack formed on the glass substrate, the crack develops into the glass by applying a bending moment or a sh〇ck power. Change & 'When the cutter presses the surface of the glass substrate to form a crack on the glass substrate, if the pressure of the pressure cutter is greater than the critical value of the stress distortion of the glass, one of the pressures The direction is cracked, that is, in the direction perpendicular to the surface of the glass substrate. This is called a vertical crack. When the vertical crack develops and reaches the opposite surface of the glass substrate, the glass substrate is naturally cut. However, the pressure of the Dang Cutter is too high, and the crack is formed in the horizontal direction of the surface of the glass substrate, which is called a horizontal crack. When a horizontal crack begins to occur, the pressure applied to the wheel does not act to form a vertical crack, and the effect is to develop a horizontal crack. Therefore, when the surface of the glass substrate is scribed by the cutter, it is important that horizontal cracks do not occur.
4TOP-EN/0602ITW ; HP02006-KI40050TW 影響基板上劃刻之典型因素如下。 刀割器端之角度、輪之 (1)切割器:種類、材料、 直徑(在輪切割器之情形下); 殘留(二:=::)部分的特性、破璃之成分 ⑷環境:環境溫度與渔度、切割器油^utter〇ii) 存在與否。 要精確切割厚玻璃基板,需要形成深垂直裂痕。 因此,切割器端之角度可較大且切割器之負載可較 大。在輪切割器中,使輪之直徑較大是有效的。 當使用切割器劃刻玻璃基板時,從開始劃刻之起 始點至結束點的負載應足夠並一致,使得垂直裂痕形 成於一致(uniform)深度。只有當一致地形成一致垂 直裂痕之深度’可清楚地形成玻璃基板之切割表面。 為此目的,傳統技藝使用氣缸(pneumatic cylinder)加壓輪之方法,如圖1所例示。 劃刻裝置,揭露於韓國專利早期公開案號4TOP-EN/0602ITW ; HP02006-KI40050TW The typical factors affecting the scribe on the substrate are as follows. Angle of the cutter end, wheel (1) cutter: type, material, diameter (in the case of a wheel cutter); characteristics of the residual (two: =::) part, composition of the broken glass (4) Environment: environment Temperature and fishing, cutter oil ^utter〇ii) presence or absence. To accurately cut a thick glass substrate, deep vertical cracks need to be formed. Therefore, the angle of the cutter end can be large and the load of the cutter can be large. In the wheel cutter, it is effective to make the diameter of the wheel larger. When the glass substrate is scribed using a cutter, the load from the start point to the end point should be sufficient and uniform so that the vertical crack is formed at a uniform depth. The cut surface of the glass substrate can be clearly formed only when the depth of the uniform vertical crack is uniformly formed. For this purpose, conventional techniques use a pneumatic cylinder to press the wheel, as illustrated in FIG. Scratch device, disclosed in the Korean Patent Early Disclosure Case
4TOP-HN/06021TW ; HP02006-K140050TW 1333937 « 2005-0032834,標題「切割基板之裝置及其驅動方法 (Apparatus for cutting substrate and method for driving the same)」,包含支撐部15,具輪尖端(wheel tip) 17 之輪支架16,透過軸承(bearing) 18安裝其上;以及 頭單元(head) 10,供於移動支撐部15時,施加形成 劃刻線所需壓力。頭單元10包含氣缸(aircylinder) 12 ’利用透過形成於一頭單元(head unit) 11中的氣 路(Pneumatic line) 14供應之壓縮氣體,驅動活塞 — (pistGn) 13加壓支撐部15。 然而,因氣路之特性,氣動(pneumatic)類型之 反應特性較慢,故無執行精確負載之控制且需要額外 • 氣路。在氣路中,維持之一致壓力相對地低於其他方 ' 法之壓力。因此,對於在劃刻製程期間有很大受影響 之風險的玻璃基板而言,必需使用具有非常精確壓力 控制功能之氣路。因此,維持一致壓力相對較低之氣 • 路使得生產力下降。 要解決使用氣路負載控制方法之前述問題,可使 用馬達(motor)控制方法。如圖2例示,馬達控制方 法包含:輪支架26,具欲安裝之一輪28 ;安裝頭 24 ’使得輪支架26之架軸(h〇lder shaft) 27以轴承 25為樞軸(pivoted);以及馬達2〇,位於頭單元% 之上端’以加壓頭單元24。4TOP-HN/06021TW; HP02006-K140050TW 1333937 «2005-0032834, entitled "Apparatus for cutting substrate and method for driving the same", comprising a support portion 15 with a wheel tip The wheel bracket 16 of the 17 is mounted thereon by a bearing 18; and a head 10 for applying the pressure required to form the scribe line when the support portion 15 is moved. The head unit 10 includes an air cylinder 12' that pressurizes the piston (pistGn) 13 by a compressed gas supplied through a pneumatic line 14 formed in a head unit 11. However, due to the nature of the gas path, the pneumatic type has a slower reaction characteristic, so no precise load control is performed and an additional • gas path is required. In the gas path, the consistent pressure maintained is relatively lower than that of the other parties. Therefore, it is necessary to use a gas path having a very precise pressure control function for a glass substrate which is greatly affected by the scribing process. Therefore, maintaining a consistently low pressure gas path reduces productivity. To solve the aforementioned problems using the pneumatic load control method, a motor control method can be used. As illustrated in Fig. 2, the motor control method includes a wheel bracket 26 having a wheel 28 to be mounted, and a mounting head 24' such that the harrow shaft 27 of the wheel bracket 26 is pivoted with the bearing 25; The motor 2 is located at the upper end of the head unit % to pressurize the head unit 24.
4TOP-EN/06021TW ; HP02006-K140050TW 1333937 馬達 20 係音圈馬達(voice coil motor,VCM ), 並包含固定於劃刻裝置之頭單元上之定子(stat〇r) 21,以及相對定子21垂直移動之原動機(m〇ver)22。 然而,於使用音圈馬達之傳統劃刻裝置中,既然 設定來限制施加於玻璃基板之作用的扭矩(t〇rque)是 受限的’故無法施加足夠之負載於輪上。 再者’亦有建儀使用旋轉馬達(r〇tary m〇t〇r )之 方法,但因旋轉馬達之特性而會有非常複雜之結構。 使用氣壓與彈簧的負载控制方法,介紹於韓國專 利公開案號2002-13400 ’其於2002年02月20日公 開,標題「供切割脆性材料之切割器,劃刻裝置及其 使用方法(Cutter for cutting brittle material,scriber and scribing method using the same)」。 揭露於韓國專利早期公開案號2002-13400中之許 多實施例中之代表性實施例,例示如圖3。參照圖3, 塞(stopper) 31附接至一架軸38a的中間,架軸38a 自具有輪39的輪支架38向上延伸,由鐵順磁物質(iron paramagnetic substance)組成的筒管(bobbin) 33 滑 動地(sHdingly )插入圓柱體(cylindrical body ) 30 中, 4TOP-EN/0602ITW ; HP02006-KI40050TW (S ) 而架軸38a之一端藉螺釘固定於磁體34之底。 塞31之底接觸形成於架軸支撐部37之内下端的 下階(step) 37a,架軸支撐部37形成於圓柱體30之 低部。筒管33之底接觸形成於架軸支撐部37之内上 端的上階37b。 磁體34之底接觸形成於圓柱體30之内圓周 (circumference)、凸緣(flange)形之連接部 30a。彈 簧35插在突出部33a與連接部30a之底間,突出部33a 於直徑方向形成於筒管33之下端。形成於圓柱體30 之上部的上限制塞36係來限制磁體34的向上移動。 前述傳統劃刻裝置中,於待命時,筒管33接受彈 簧35向下彈性動作,而架轴38a與輪支架38接受向 下彈性動作,因為這些元件一起吸附於磁體34。 因此,當對著玻璃基板壓輪39時,磁體34與筒 管33 —起向上移動,而彈簧35藉筒管33之移動壓 縮。向下力(亦即自磁體34分離筒管33提供之力) 藉彈簧35之反作用而作用在筒管33上。 當對著玻璃基板進一步加壓於輪39,彈簧35之 斥力與磁體34之移動程度成比例增加。當斥力大於磁 -10-4TOP-EN/06021TW ; HP02006-K140050TW 1333937 Motor 20 is a voice coil motor (VCM), and includes a stator (status) 21 fixed to the head unit of the scoring device, and vertically movable relative to the stator 21. The prime mover (m〇ver) 22. However, in the conventional scribing apparatus using the voice coil motor, since the torque (t〇rque) set to limit the action applied to the glass substrate is limited, it is impossible to apply a sufficient load to the wheel. Furthermore, there is also a method of using a rotary motor (r〇tary m〇t〇r), but it has a very complicated structure due to the characteristics of the rotary motor. The use of air pressure and spring load control method is described in Korean Patent Publication No. 2002-13400, which was published on Feb. 20, 2002, entitled "Cutter for cutting brittle materials, scribing device and method of use (Cutter for Cutting brittle material, scriber and scribing method using the same)". A representative embodiment of many embodiments disclosed in Korean Patent Laid-Open Publication No. 2002-13400 is illustrated in Fig. 3. Referring to Figure 3, a stopper 31 is attached to the middle of a shaft 38a extending upward from a wheel bracket 38 having a wheel 39, a bobbin composed of an iron paramagnetic substance. 33 Sliding ground (sHdingly) is inserted into the cylindrical body 30, 4TOP-EN/0602ITW; HP02006-KI40050TW (S) and one end of the shaft 38a is fixed to the bottom of the magnet 34 by screws. The bottom of the plug 31 contacts a lower step 37a formed at the lower inner end of the frame support portion 37, and the frame support portion 37 is formed at a lower portion of the cylindrical body 30. The bottom of the bobbin 33 contacts the upper step 37b formed at the upper end of the bobbin support portion 37. The bottom contact of the magnet 34 is formed in the inner circumference (circular) and flange-like connecting portion 30a of the cylinder 30. The spring 35 is inserted between the projection 33a and the bottom of the connecting portion 30a, and the projection 33a is formed at the lower end of the bobbin 33 in the diameter direction. An upper restriction plug 36 formed on the upper portion of the cylinder 30 is used to restrict the upward movement of the magnet 34. In the aforementioned conventional scribing device, when on standby, the bobbin 33 receives the spring 35 to elastically move downward, and the bobbin 38a and the wheel bracket 38 receive the downward elastic action because these elements are attracted to the magnet 34 together. Therefore, when facing the glass substrate pressing wheel 39, the magnet 34 moves upward together with the bobbin 33, and the spring 35 is compressed by the movement of the bobbin 33. The downward force (i.e., the force provided by the separation of the bobbin 33 from the magnet 34) acts on the bobbin 33 by the reaction of the spring 35. When the glass substrate is further pressed against the wheel 39, the repulsive force of the spring 35 increases in proportion to the degree of movement of the magnet 34. When the repulsive force is greater than the magnetic -10-
4TOP-EN/06021TW : HP02006-K140050TW 1333937 體34與向管33間的吸收力(absorption force )時,只 有筒管33藉彈簧35之彈性瞬時下移並向下撞擊塞31 之上表面。因此,向下陡震力透過架軸38a施加於輪 支架38之輪39,藉此形成自劃刻起始點的有效裂痕。 接著,施加於輪39之劃刻壓力可藉以下設定:透 過圓柱體30之上部施加氣壓於磁體34。 然而,上述構造中的傳統劃刻裝置僅自劃刻起始 點於玻璃基板上形成有效垂直裂痕。亦即,傳統劃刻 裝置中,整個劃刻製程期間,不可能控制為規則之負 載。 、 某些情形中’可使用施加於磁體34的氣壓控制加 壓力。然而,此傳統劃刻裝置有類似其他上述傳統技 術之氣動劃刻裝置的問題。 【發明内容】 因此,本發明針對提供劃刻裝置以控制壓力,其 係使用磁力,以規則負載於藉加壓劃刻裝置之輪於玻 璃基板上,形成一致裂痕。 本發明另一目的係提供劃刻裝置以控制壓力,其 係使用磁力,以簡單構造使劃刻裝置之輪一致地加壓 * 11 -4TOP-EN/06021TW: HP02006-K140050TW 1333937 When the body 34 and the suction force between the tubes 33, only the bobbin 33 is momentarily moved downward by the elasticity of the spring 35 and hits the upper surface of the plug 31 downward. Therefore, the downward steep shock force is applied to the wheel 39 of the wheel bracket 38 through the frame shaft 38a, thereby forming an effective crack from the starting point of the scribing. Next, the squeezing pressure applied to the wheel 39 can be set by applying a gas pressure to the magnet 34 through the upper portion of the cylinder 30. However, the conventional scribing apparatus in the above configuration forms an effective vertical crack only on the glass substrate from the scribing starting point. That is, in the conventional scribing apparatus, it is impossible to control the load of the rule during the entire scribing process. In some cases, the pressure applied to the magnet 34 can be used to control the pressure. However, this conventional scoring apparatus has problems similar to the pneumatic scribing apparatus of the other conventional techniques described above. SUMMARY OF THE INVENTION Accordingly, the present invention is directed to providing a scribing device for controlling pressure using a magnetic force to regularly load a wheel on a glass substrate by a press scribing device to form a uniform crack. Another object of the present invention is to provide a scoring device for controlling the pressure, which uses a magnetic force to uniformly press the wheel of the scoring device in a uniform configuration.
4TOP-EN/06021TW ; HP02006-JCI40050TW 1333937 於玻璃基板上。 本發明之示例實施例提供劃刻裝置供控制壓力, 其係使用磁力,其包含:第一磁體,連接至輪供形成 裂痕於脆性基板上;第二磁體產生相對第一磁體之預 定斥力;以及頭單元,於其中第一磁體相對第二磁體 可移動地定位。 第一磁體係電磁體(electromagnet)。 電磁體做為第一磁體更包含電源供應裝置,其可 變化電流之量,以及轉換電流之極性。 第二磁體係電磁體。 電磁體做為第二磁體更包含電源供應裝置,其可 變化電流之量,以及轉換電流之極性。 做為第二磁體之電磁體係固定於頭單元中。 第一磁體係永久磁體。 第二磁體係永久磁體。 -12-4TOP-EN/06021TW; HP02006-JCI40050TW 1333937 on a glass substrate. An exemplary embodiment of the present invention provides a scribing device for controlling pressure, which uses a magnetic force, comprising: a first magnet coupled to the wheel for forming a crack on the fragile substrate; and a second magnet generating a predetermined repulsive force relative to the first magnet; a head unit in which the first magnet is movably positioned relative to the second magnet. The first magnetic system electromagnet (electromagnet). The electromagnet as the first magnet further includes a power supply device that varies the amount of current and the polarity of the switching current. The second magnetic system electromagnet. The electromagnet as the second magnet further includes a power supply device that varies the amount of current and the polarity of the switching current. The electromagnetic system as the second magnet is fixed in the head unit. The first magnetic system is a permanent magnet. The second magnetic system is a permanent magnet. -12-
4TOP^EN/06021TW ; HP02006-K140050TW 永久磁體做為第二磁體係可移動地定位於頭單元 中〇 【實施方式】 本發明參照此後所附圖式更完整地說明,其中顯 示了本發明之較佳實施例。然本發明可以不同形式實 施,且不應解讀為被文中之實施例所限制。而這也匕杂 施例僅係提供本發明之教示範例。相同編號表示相门 元件。 圖4係一剖面圖供解釋根據本發明第一實施 用磁力控制壓力之劃刻裝置的構造;而圖5係:二使 圖’供解釋根據本發明第二實施例使用磁力控'制 之劃刻裝置的構造。 工 ' 力 供使用磁力控制壓力的劃刻裝置,將來照 久磁體之第一實施例,以及使用電磁體 二一用永 說明。 〈弟二貫施例 <第一實施例> 如圖4例示,在本發明第—實施例中, 控制壓力之劃刻裝_置包含:頭單元4〇,其勺=用磁力 加磁體46,此係一永久磁體;可移動碩^ L含壓力施 含壓力接受磁體52,此係一永久磁、二兀50,其包 可移動頭單元 -13-4TOP^EN/06021TW; HP02006-K140050TW permanent magnets are movably positioned in the head unit as a second magnetic system. [Embodiment] The present invention is more fully described with reference to the following drawings, which show a comparison of the present invention. A good example. The invention may be embodied in different forms and should not be construed as being limited by the embodiments herein. Moreover, this noisy embodiment merely provides an exemplary embodiment of the present invention. The same number indicates the phase component. Figure 4 is a cross-sectional view for explaining the configuration of a magnetically controlled pressure scribing apparatus according to a first embodiment of the present invention; and Figure 5 is a second embodiment of the present invention for explaining the use of a magnetic control system according to the second embodiment of the present invention. The construction of the device. The work force is used to scribe the pressure-controlled pressure, the first embodiment of the long-lasting magnet, and the use of the electromagnet. <Second embodiment> First embodiment> As exemplified in Fig. 4, in the first embodiment of the present invention, the embossing of the control pressure includes: the head unit 4 〇, the spoon = magnetically applied magnet 46, this is a permanent magnet; the movable shaft contains a pressure receiving magnet 52, which is a permanent magnet, a second 50, and a movable head unit-13-
4TOP-EN/0602ITW : HP02006-K140050TW 因此,當藉輪 施加磁體46及壓力 戍裂痕於玻璃基板上,藉壓力 地維持加壓力,雜接文礤體52間產生之斥力,規則 致深度。 3此、准持形成於玻璃基板上裂痕之一 壓力裝置44可!〜 自壓力接受部51疋於殼42之預定位置,亦即, 置。然而,更伟A,持且產生預定斥力之距離之位 變化’以考慮安擎於2裴置44之位置可隨著殼42 或玻璃基板W輪切56中之輪58的機械特性 又谷度,而改變加壓力。 <弟一實施例> 如圖5所例示,為太恭贫_虚 ,力,:T置‘含:頭單=:含= 力接受船 頭:元60包含:殼端部63、_壓力震置料以及 欣62。咸端部63形成於頭單元6〇之下#, 單元7〇,使得可移動頭h7Q於某一範圍 可移動。壓力裝置64有中空部,使得壓力施加磁體 就位於其中°殼62有中” ’容納壓力裝置64。 4TOP-EN/0602ITW ; HP〇2〇〇6-KI40050TW 15- 1333937 因此,當藉輪78形成裂痕於玻璃基板上,藉由壓 力:磁體66及壓力接受罐體72間所產生之斥力而 規貝i維持加壓力,藉此維持㈣於玻璃基板上裂痕 之一致深度。 既然墨力施加磁體66係由電磁體形成,無須調整 壓力施加磁體66之位置,與第-實_之壓力施加磁 體46不同。藉變化供應給電磁體之電流量可控制斥 在第-實施财,壓力接受磁體Μ被描述為永久 磁體’但其亦可如同壓力施加磁體%般為電磁體。 如上述,本發明提供維持裂痕之深度一致之效 果’,為磁體定位於劃刻|置之頭單元與輪支架之 間藉磁體間所產生之斥力而規則地維持施加於 架的加懕六。 ~ 此外’本發明提供減少作業成本之效果 ,因為藉 由磁體來設定_裝置之加壓力之構造較為簡單。 本發明已利物佳範例實施例說明。然而應了解 的是,發明之㈣不限於所揭露之實施例。相反地, 發明之耗圍意欲包含利用目前習知或未來之科技與均4TOP-EN/0602ITW : HP02006-K140050TW Therefore, when the magnet 46 and the pressure 戍 crack are applied to the glass substrate by the wheel, the pressure is maintained by the pressure, and the repulsive force generated between the spliced bodies 52 is regular. 3 This is one of the cracks formed on the glass substrate. The pressure device 44 can be! ~ The self-pressure receiving portion 51 is placed at a predetermined position of the case 42, that is, placed. However, the more versatile A, the positional change of the distance of the predetermined repulsive force is taken to take into account the mechanical properties of the wheel 58 of the shell 42 or the glass substrate W. And change the pressure. <Different embodiment> As illustrated in Fig. 5, it is too poor to be _ imaginary, force,: T set 'including: head single =: containing = force accepting bow: element 60 contains: shell end 63, _ pressure Shocking materials and Xin 62. The salty end portion 63 is formed under the head unit 6〇, the unit 7〇, so that the movable head h7Q is movable within a certain range. The pressure device 64 has a hollow portion such that the pressure applying magnet is located therein. The housing 62 has a "holding pressure device 64." 4TOP-EN/0602ITW; HP〇2〇〇6-KI40050TW 15- 1333937 Therefore, when the borrowing wheel 78 is formed The crack is on the glass substrate, and the urging force generated between the magnet 66 and the pressure receiving can 72 maintains the pressing force, thereby maintaining (4) the uniform depth of the crack on the glass substrate. It is formed by an electromagnet, and it is not necessary to adjust the position of the pressure applying magnet 66, which is different from the pressure applying magnet 46 of the first real. The amount of current supplied to the electromagnet by the change can be controlled to be repelled in the first implementation, and the pressure receiving magnet is clamped. Described as a permanent magnet 'but it can also be an electromagnet as a pressure applied magnet %. As described above, the present invention provides the effect of maintaining a consistent depth of cracks', positioning the magnet between the sculpt|head unit and the wheel bracket The twisting applied to the frame is regularly maintained by the repulsive force generated between the magnets. ~ Furthermore, the present invention provides an effect of reducing the operating cost because the pressing force of the device is set by the magnet The invention has been described in terms of a preferred embodiment of the invention. However, it should be understood that the invention is not limited to the disclosed embodiments. Conversely, the invention is intended to encompass the use of current or future technologies. And both
4TOP-EN/0602ITW ; HP02006-K140050TW 1333937 等例、且在熟此技藝者能力内的種種修改與替代安 排。因此’申請專利範圍之範疇,應給予最寬廣之闡 • 釋,以包含所有此類修改與類似安排。 【圖式簡單說明】 藉參照所附圖式詳述較佳實施例,熟此技藝者將 會清楚瞭解本發明前述特徵與其他特徵及優點,其中: • 圖1係一示意圖’供解釋使用一氣缸控制壓力之 一傳統劃刻裝置; 圖2係一示意圖’供解釋使用音圈馬達控制壓力 之一傳統劃刻裝置; 圖3係一示意圖,供解釋使用結合 • 之傳統劃刻裝置; 圖4係一剖面圖,供解釋根據本發明第一實施 例’供使用磁力控制壓力之劃刻裳置的構造;以及 圖5係一剖面圖,供解釋根據本發明第二實施 列,供使用磁力控制壓力之劃刻裴置的構造。 【主要元件符號說明】 10頭單元 11頭單元 12氣红 13活塞 14氣路 -18-4TOP-EN/0602ITW; HP02006-K140050TW 1333937 and other examples, and modifications and alternative arrangements within the capabilities of those skilled in the art. Therefore, the scope of the scope of the patent application should be given the broadest interpretation to cover all such modifications and similar arrangements. BRIEF DESCRIPTION OF THE DRAWINGS The foregoing features and other features and advantages of the present invention will become apparent to those skilled in the <RTIgt; A conventional scribing device for cylinder control pressure; Fig. 2 is a schematic view of a conventional scribing device for explaining the use of a voice coil motor control pressure; Fig. 3 is a schematic view for explaining the use of a conventional scribing device; Fig. 4 A cross-sectional view for explaining a configuration for sculling a magnetically controlled pressure according to a first embodiment of the present invention; and FIG. 5 is a cross-sectional view for explaining the second embodiment of the present invention for use of magnetic control The structure of the pressure scribe. [Main component symbol description] 10 head unit 11 head unit 12 gas red 13 piston 14 gas path -18-
4TOP-EN/06021TW ; HP02006-K140050TW 1333937 支撐部 輪支架 輪尖端 軸承 馬達 定子 原動機 頭單元 軸承 輪支架 架軸 輪 圓柱體 連接部 塞 筒管 突出部 磁體 彈簧 上限制塞 架軸支撐部 下階 上階 輪支架 -19-4TOP-EN/06021TW ; HP02006-K140050TW 1333937 Support wheel bracket wheel tip bearing motor stator prime mover head unit bearing wheel bracket frame shaft wheel cylinder connection plug tube protrusion magnet spring upper limit plug shaft support lower stage upper step wheel Bracket -19-
4TOP-EN/06021TW ; HP02006-KI40050TW 1333937 架軸 輪 頭單元 殼 殼端部 壓力裝置 壓力施加磁體 可移動頭單元 壓力接受部 壓力接受磁體 壓力接受部軸 輪支架連接部 軸承 輪支架 輪 頭單元 殼 殼端部 壓力裝置 壓力施加磁體 可移動頭單元 壓力接受部 壓力接受磁體 壓力接受部軸 -20-4TOP-EN/06021TW ; HP02006-KI40050TW 1333937 Shaft head unit Shell end pressure device Pressure application magnet Movable head unit Pressure receiving part Pressure receiving magnet Pressure receiving part Shaft wheel bracket Connection part Bearing wheel bracket Wheel head unit Shell End pressure device pressure application magnet movable head unit pressure receiving portion pressure receiving magnet pressure receiving portion shaft -20-
4TOP-EN/06021TW : HP02006-K140050TW 1333937 74輪支架連接部 75軸承 76輪支架 78輪4TOP-EN/06021TW : HP02006-K140050TW 1333937 74 wheel bracket connection 75 bearing 76 wheel bracket 78 wheels
4TOP-EN/0602ITW : HP02006-K140050TW -214TOP-EN/0602ITW : HP02006-K140050TW -21
Claims (1)
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KR1020050133742A KR100745577B1 (en) | 2005-12-29 | 2005-12-29 | Scriber for Controlling Pressure Using Magnetic Force |
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JP5139852B2 (en) * | 2008-03-17 | 2013-02-06 | 三星ダイヤモンド工業株式会社 | Scribing apparatus and scribing method |
JP5332344B2 (en) * | 2008-06-30 | 2013-11-06 | 三星ダイヤモンド工業株式会社 | Chip holder and holder unit |
JP2014008710A (en) * | 2012-06-29 | 2014-01-20 | Mitsuboshi Diamond Industrial Co Ltd | Tip holder |
MX2016002284A (en) * | 2013-08-29 | 2016-06-10 | Univ Leland Stanford Junior | Method of controlled crack propagation for material cleavage using electromagnetic forces. |
CN108777933B (en) * | 2018-06-25 | 2020-08-11 | 中国电子科技集团公司第四十一研究所 | Method for pasting soft medium microstrip circuit by electromagnetic technology |
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KR20020028251A (en) | 2000-10-09 | 2002-04-17 | 김인 | Tapping oil supply device for tapping machine |
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