1331082 九、發明說明： 【發明所屬之技術領域】 本發明係與壓床設備有關，尤指模組化的壓 床設備。 【先前技術】 在機槭加工中，壓床可以說是應用十分廣泛 白勺加工設備，舉凡大型金屬板的製備，如汽1331082 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to press equipment, and more particularly to modular press equipment. [Prior Art] In the processing of maple, the press can be said to be a very widely used processing equipment, such as the preparation of large metal plates, such as steam
:外3板f衝壓成形’小至微機電產品都會運 用到壓床’來進行加工。 ^微機電的領域中，壓床的應用大致可以分 成形是指：種MS成！合。所謂 -起。在這兩種的應料，壓床即是 動力源，如在成形方面，壓床的動力^: External 3 plate f stamping forming 'small to micro-electromechanical products will be applied to the press' for processing. ^ In the field of micro-electromechanical, the application of the press can be roughly divided into: MS! Hehe. The so-called. In these two kinds of materials, the press is the power source, such as in the forming, the power of the press ^
與材料可以相互接觸，乃至於推擠$ G 具而成形；如在結合方面，壓床的 湃〇 兩個材料能夠盡可能的接近，並2 ^ 了以使 助功能使兩個材料結合在一起。 δ，、他的輔 若再將成形的方式細分，則 以及加壓成形，其中加壓成形尚壓成形 外性硬化聚合物製造。而若:將有;f是利用紫 分，則包含了陽極接合、直接接人、=的+方式細 由此可見，上述這些較常應用的二丄接合。 五種，如果再加上其他種類的變方式就已有 在以往，這些不同的加工方式、彳種類更多。 設備來達到所欲加工之目的，不同的壓床 僅具有單一的加工方式，固然 ^ =既各個壓床 製化的產品，可以針對各種加工^床設備是特 万式所需的不同 5 的條件將壓床的設 用到不同的加工方$ = t最佳化，因此如果要應 對於大型的製造商要不同的壓床設備，^ :乂多種少量供應微機；I i : f問題’然而對於 術研究單位而言，，產扣的小型工廠，以及 多少具壓床設備，=少種的加工方式就代表有 且每個愿床都會佔單價不但高，而 限的小型工廠與π 、二間，這對於空間有 本耗費甚鉅，报難立而吕金錢成本與空間成 的消費者身上，轉嫁到終端產品 而言有著不競：ί::’對於整體產》 直沒有找;;；善==些問題，此-【發明内容】。町解决万案。 有鑑於習用的壓庆^^ β分祕 別特製化的產品，如工方式而個 j會重複賭置多個壓mm”：方式 :模f化的壓床設備取代以往的ί 一功 改㈣床設備更ί;:Γ’就可以 至另-機台上進行他移 成曰更捷。再者，由於本發明的壓床今借禮 僅疋更換加工模組就可以變更壓 ^ 也就是說使用本發明的人可以空出 6 1331082 可以做其他的應用，況且加工模組的體積遠較 部壓床ΐ很多，一定數量的壓床所佔用的空間 遠的多於同樣數量的加工模組。由此Υ見本發 不但能讓使用者減少設備支出、方便操作’還 夠節省空間，進而增加空間的使用1率。 為了達刻上述之目的，本發明提供了一種 種運^於微機電的模組化壓床’包3 一壓床 體，具有/加壓裝置以及一結合部；以及一力口 模組，其中該加工模組與該結合部相結合並可 癱 離，而該加工模組並受壓於該加壓裝置。 9 如上所述的模組化壓床，其中該結合部是 凹陷空間，用以容置該加工模組。 如上所述的模組化壓床’其中該加工模緩 . 包含一容置體；一加工基座，是設置於該容置 内；以及〆受壓連動裝置’是設置於該容置體 而與該加工基座面對面’且伸出該容置體外以 壓於該加麋裝置。 如上所述的模組化壓床，當該加工模組，是 加熱成形模組者’其中該容置體更具有一通 鲁 孔，透過該通氣孔將5亥谷置體内之氣體排出， 該容置體内呈真空狀；該加工基座具有一力π 器；以及該受壓連動裝置是一壓力調節機構。 如上所述的模組化壓床’更包含一真空 浦，與該通氟孔連通；以及一電源供應器，與 加熱器電連接。 ~ 如上所述的模組化壓床，當該加工模組θ 直接接合模組者’其中該容置體更具有 孔，透過該通氣孔將該容置體内之氣體排出， 該容置體内呈真空狀；該加工基座具有一力〇 整遠明能 I本工分 I 更體内受 一氣使熱 栗該 I氣使熱 7 1331082 器，該加熱器上則更設有一第一壓合平板；以及 該受壓連動裝置是一壓力調節機構，且更設有一 第二壓合平板與該第一壓合平板面對面。 如上所述的模組化壓床，當該加工模組是一 陽極接合模組者，其中該容置體更具有一通氣 孔，透過該通氣孔將該容置體内之氣體排出，使 該容置體内呈真空狀；該加工基座更具有一加熱 器以及一第一電極；以及該受壓連動裝置更具有 一第二電極。 ^ 如上所述的模組化壓床，更包含一真空泵 浦，與該通氣孔連通；以及一電源供應器，與該 第一電極與該第二電極電連接，使該第一電極與 該第二電極之間產生高電位差。 • 如上所述的模組化壓床，當該加工模組是一 黏著接合模組者，其中該容置體更具有一通氣 孔，透過該通氣孔將該容置體内之氣體排出，使 該容置體内呈真空狀；該加工基座具有一第一加 熱器；以及該受壓連動裝置具有一第二加熱器。 如上所述的模組化壓床，當該加工模組是一 • 加壓成形模組者，其中該容置體更具有一通氣 孔，透過該通氣孔將該容置體内之氣體排出，使 該容置體内呈真空狀；該加工基座係用以承載一 工件；以及該受壓連動裝置更設有一模座，用以 設置一模具。 如上所述的模組化壓床，其中該加工基座下 方更具有一紫外線裝置。 如上所述的模組化壓床，更包含一真空泵 浦，與該通氣孔連通；以及一電源供應器，與該 紫外線裝置電連接。 8 1331082 如上所述的模組化壓床，其中該結合部盥兮 加工模組係透過一快拆組件而相互結合固定。X 如上所述的模組化壓床，其中該結合部具 一第一電子接點，而該加工模塊具有一第二電 接點用以與遠苐一電子接點相互電連接。 為了違到上述之目的，本發明另提供一 運用於微機電接合作業的模組化之壓床設 ^ 含一壓床本體，而在該壓床本體上則 ^ 壓裝置以及一結合部，該設備還具備 °The material can be brought into contact with each other, even pushing the $G tool; as in the case of bonding, the two materials of the press can be as close as possible, and 2 ^ to enable the function to bring the two materials together . δ, and his auxiliary sub-division of the forming method, and press forming, in which press forming is performed by forming an externally hardened polymer. And if: there will be; f is the use of purple points, including the anodic bonding, direct access, = + fine method can be seen, these two more commonly used two-joint bonding. Five kinds, if you add other kinds of variants, you have already had these different processing methods and types. The equipment can be used for the purpose of processing. Different presses only have a single processing method. Of course, the products of the various presses can be different for the various processing conditions. The press is designed to be optimized for different processing sides, so if you want to have different press equipment for large manufacturers, ^: 乂 a variety of small supply microcomputers; I i : f problem 'however for In terms of the research unit, the small factory that produces the buckle, and the number of press equipment, = the processing method of the lesser species, and each of the willing beds will account for not only the high unit price, but also the limited small factory with π, two This has a huge cost for space, and it is difficult for consumers to report their costs and space. The transfer to the terminal products is not competitive: ί:: 'For the overall production', there is no search; == Some questions, this - [invention content]. The town solves the case. In view of the custom-made products that are specially tailored, such as the work method, a j will repeatedly gamble multiple pressures mm": mode: the press-type press equipment replaces the previous one. The bed equipment is more ;;:Γ' can be moved to another machine to make it more convenient. Moreover, since the press of the present invention can only change the processing module, the pressure can be changed. The person using the present invention can vacate 6 1331082 for other applications, and the processing module is much more bulky than the partial press, and a certain number of presses take up much more space than the same number of processing modules. Therefore, the present invention not only allows the user to reduce equipment expenditure and facilitate operation, but also saves space, thereby increasing the usage rate of the space. In order to achieve the above purpose, the present invention provides a model for transporting MEMS. The grouping press 'package 3' is a press body having a/pressing device and a joint portion; and a force port module, wherein the processing module is combined with the joint portion and can be separated, and the processing module And pressed against the pressing device. 9 The mold as described above The chemical pressing bed, wherein the joint portion is a recessed space for accommodating the processing module. The modular pressing press as described above, wherein the processing mold is slow. comprises a receiving body; a processing base is set And the 〆 pressure-receiving device 'is disposed on the accommodating body and facing the processing pedestal' and protrudes outside the accommodating body to press the twisting device. The pressing bed, when the processing module is a heating forming module, wherein the receiving body further has a through hole, through which the gas in the body of the 5H Valley is discharged, and the body is vacuumed The processing base has a force π device; and the pressure linking device is a pressure adjusting mechanism. The modular pressing machine as described above further includes a vacuum pump connected to the through hole; and a power supply Electrically connected to the heater. ~ The modularized press as described above, when the processing module θ is directly coupled to the module, wherein the receiving body has a hole through the vent hole The gas is discharged, and the body is in a vacuum; the processing base There is a force to make a far-reaching energy I work in the body I is more energized by the gas, the heat is the heat, the heat is 7 1331082, the heater is further provided with a first pressing plate; and the pressure linkage device is a a pressure adjusting mechanism, and further comprising a second pressing plate facing the first pressing plate. The modular pressing machine as described above, wherein the processing module is an anode bonding module, wherein the receiving body Further having a vent hole through which the gas contained in the body is discharged, so that the body is vacuumed; the processing base further has a heater and a first electrode; and the pressure linkage device Further having a second electrode. ^ The modularized press as described above further includes a vacuum pump in communication with the vent; and a power supply electrically coupled to the first electrode and the second electrode such that A high potential difference is generated between the first electrode and the second electrode. The modularized press as described above, wherein the processing module is an adhesive bonding module, wherein the receiving body further has a vent hole through which the gas in the receiving body is discharged, so that the The receiving body has a vacuum; the processing base has a first heater; and the pressure linking device has a second heater. The modularized press as described above, wherein the processing module is a pressure forming module, wherein the receiving body further has a venting hole through which the gas in the receiving body is discharged, so that The receiving body is in a vacuum shape; the processing base is used to carry a workpiece; and the pressure linking device is further provided with a mold base for setting a mold. The modular press as described above, wherein the processing base has an ultraviolet device underneath. The modular press as described above further includes a vacuum pump in communication with the vent; and a power supply electrically coupled to the ultraviolet device. 8 1331082 The modular press as described above, wherein the joint processing module is coupled to each other through a quick release assembly. X. The modularized press as described above, wherein the joint has a first electrical contact and the processing module has a second electrical contact for electrically connecting to an electrical contact. In order to achieve the above object, the present invention further provides a modular pressurizing device for a microelectromechanical joining operation, wherein a pressing device and a joint portion are disposed on the press body. The device also has °
模塊，各該加工模塊均可單獨與該結人 σ = 合並固定’則該結合部與各該加工 1 °卩相互結 組化的結合。 吴掩之間為模 如上所述的壓床設備，其中各 加工方式係選自陽極接合、直接接^\力° ^模組的 加熱成形以及加壓成形中之一種。σ、點著接合、 【實施方式】 ° 請參見圖1 ’為本發明的模組 圖。其中揭示了一壓床本體1〇， ^反床示意 上透過一支撐結構14設置一加壓壓床本體10 加壓裝置1 2的下方則設置一結^ :置】2 ’而在 1 6的用途即在於與一加工模級2°纟:11 6 ’結合部 組2除了能與結合部丨6相結合外了 5 ’且加工模 1 6上拆下，此即模組化所能達至二並可自結合部 工杈組2受壓於該加壓裝置12。 又果。又’加 發明是將麗床上會共通使用到的 f此觀之’本 體10’以及加壓裝置12,與實際上〇 :即壓床本 置，即加工模組2分離開來，^ ，行加工的裝 的目的，也就是說不同的加工镇，到了模組化 個壓床本體1 〇與加壓裝置1 2，、: 可以共用一 所以無須重複購 9 1331082 置之。反過來說就是同一組壓床本體1〇鱼 置12即可提供給不同的加工模組2使用: ^ 這個模組化的目的，當然各個加工模纟且2 尺 外觀可以說是完全一樣，因為壓床本體丨〇 L 合部16只有一個，所以各個加工模組2 ^ 夠與結合部丨6相互結合固定才行，也因^ ‘ 加工模組2的尺寸相同。簡而言之，各=工 組2尺寸相同而所能提供的加工方式互異刀。又 如圖1所示，結合部16是開設呈一凹^ °二 間，以供加工模組2固定於其中。 βj工 請參見圖2，是本發明具熱壓成形功能的加 工杈組。如上一段所述，由於本發明是 壓床及其設備，因此各個加工模組2 ' f二= 同，也因此首先介紹的是具熱壓成形功能工 模組2a(又稱為熱壓成形模組2a)的整俨紐 壓成形模組2a包含一容置體2〇，1上有二 通氣孔21 ’與熱壓成形模組2a外部的# 相連通，抽氣設備4包含一真空泵浦4〇鱼二 42，真空泵浦40將模組2a内抽真空，= j Ϊ Ϊ Ϊ Ϊ度後，將閥門42關閉以維持模田組2a内 的真空度。又，於容置體20内則是一加工其 25’而在容置體20上還包含一受壓連動 1 疋设置於各置體20上，並與加工基座25而斜 且伸出谷置體20外以受壓於加壓裝置 受壓連動裝置22是用來將壓床本體二，t 裝置12所產生的壓力傳遞到容置體2〇 ^ ^ 壓力傳遞到所需加工的材料上。 ’丹將 請繼續參閱圖2，由於所揭露者為埶 模組2a ’係透過加熱的方式使所欲加工'的材g ^ 10 丄 情形下，利用-模具在該材 用者所要的形狀。因此，為了達到 ^目6V在Ϊ卫基座25上更設置一加熱 益25a’當然，加工基庙 熱器，加熱器2 5 a用以i舳甘’、可以疋一個加 之俘梏名 ^ 用^乂加熱其上的熱壓材料3a使 二v:s壓於加壓裝置u 因此當熱壓材料3a置放於i f „熱壓杈具27a。 定溫度，且模組2a内二加产熱Ha上並達到預 於其上，使熱材料、，土並進而施壓 形狀。為了確保受遷連動=所欲形成的 12的M力平均的施於熱‘材 T 7將加塵〒置 H ; 22與熱壓模具27a之間更設有二^ f 機構23，或者受壓連 1 f = 2歷㈣即 調節之功能。此夕卜，加執裝哭置22/ ^身即具有壓力 應器（圖中未揭示）電遠a更可與一電源供 加熱器25a所需之),^接1；、電源供應器即是提供 結構與功效。 i 述即為熱屢模組2a的 $月參閲圖 3，县士欲n〇 „ 工模Μ。此模組亦稱為‘心接合功能的加 一容置體20、一 接合模組$亦包含 一壓力調節機構23、、一加工一文壓連動裴置22、 2 7，又在模組2 b外有一 #々t上25以及一模座 40透過通氣孔21將$ f設備4的真空泵浦 門42閉鎖以保持“體置f〇 20内:真空，並以閥 ;'之相1 “立置與連接關係度丄上述f '，但於實際使用上仍可能針 11 1331082 不同而在細節上予以最佳化設計。 請繼續參閱圖3，其中加工基座25得具有 熱功此’用以將所欲加工之材料加熱至適當之 度，至於在加工基座上25上則更設有一第一壓 平=25b ’而與加工基座25相對的模座27其 亦設^第二壓合平板27b。直接接合材料3b則 ^於第一壓合平板2 5b上，材料3b通常是兩片 二斗’分別是置放於第一壓合平板2Sb的第一子 _容置;置Γ第一子材3bl上的第二子材3b2。 籲、t +心 内的條件如真空度以及材料3b的溫 壓連置12(請配合圖”即施壓力於 篦-工Ϊ置22上’進而使第二壓合平板27b壓 作^ *材3b2上，並由於第一壓合平板25b的 結合^ i i吏第—子材3bl與第二子材3b2緊密 料的车。直接接合技術是利用化學藥劑使 合面：：：：丄ΐ讓材料與材料接合，通常在 -百至Γ而接合時的溫度通常在攝 部分即於低溫接合。上述關於圖3 •效之說g。接接5模組2b的結構、元件組成與 的加二$ Γ圖4二為本發明中具有陽極接合功 件標號20、21、22、M 莫C ’其中 等，與前述圖2、圖3所揭I、去2U、4〇與 以用上仍可能針對各』 細即士予以最佳化設計。 工方式之不同而 請繼續參閱圖4，1中隖权技人上 加工基座2 、中除極接合模組2c中 為一Λ f 亦具有一加熱器25a，太| 加熱器’又加工基座25上更設置1 = 加 溫 合 上 置 材 材 當 度 受 在 反 的 材 接 氏 的 功 能 元 42 於 在 的 即 極 12 1331082 25c，且加工基座25與第一電極25c之間亦可掸 設了受熱板（圖中未揭示），而在模座27上則具^ 一第二電極27c。至於第一電極25c與第二^極 27c則各自透過一第一導線25cl以及—第二暮綠 27cl與外界的一電源供應器5電連接，麻 器5適用以在第一、二電極之間產生高電應 陽極接合材料3c則置於第一電極25c上，备 材料3c被加熱到一定之溫度時且容置體二 真空度亦達到預設值時，加堡裝置 ^動作使第二電極27c接近並f觸匕㈡ 料3。，此時電源供應器5即在第一、=電J := 產^向電位差以達到陽極接合之目的。 ^ f 通常適用於玻璃與矽晶片的接合，接' 第一導線…1與電源供應器 接。至於玻璃3cl則盥第二正極電連 27c2相接觸’且接觸’電極27 = J觸：極 i7:1與電源供應器5的負極電連接iC ^發明模組化的效果，因為 ^ 為了達到 3體2〇是可自屋床本體二組2c的容 =’故為了方便容置體2〇 “ ；圖1)上抽換 源供應器5達到可分離的設計，在裝容置與外部的電 =置外露的第一電子接點241愈體2〇 士更 242以方便盘外却从 一乐__•電子接點 此時電源^器電5源所供C或斷路。 伏特左右（但亦不以 ^供之電位差約在一千 石夕晶片3〇2加熱至攝氏四、百二1熱斋25a則 上升破璃3cl中帶Χ左右。&著溫度的 _，相對的破璃J = 往負極漂移 ，、石夕日日片3c2接觸的那、 13 1331082 面的部份就會形成空乏層（depletion layer) ’故而 在矽晶片3 c2與玻璃3 c 1之間形成了一個很大的 電場’使得玻璃3cl中的氧原子與矽晶片3c2的 石夕$結起來’而具有一定的接合力。以上所述即 為陽極接合模組2 c的構造及其原理。 請參閱圖5 ’為本發明中具有加壓成形功能 ^，工模組，又稱為加壓成形模組2d。其中元件 標號 20 、 21 、 22 、 23 、 25 、 27 、 4 、 40 與 42 等，The module, each of the processing modules can be combined with the knot σ = combined and fixed, and the joint is combined with each of the processing 1 ° 结. The masking device is a die press device as described above, wherein each processing mode is selected from the group consisting of anodic bonding, direct bonding, and heat forming and press forming. σ, point bonding, [Embodiment] ° See Fig. 1 ' is a module diagram of the present invention. There is disclosed a press body 1〇, ^ the reverse bed is schematically disposed through a support structure 14 and a pressurizing press body 10 is provided below the pressurizing device 1 2 to set a junction ^ 2] and at 16 The use is in combination with a processing die 2 ° 纟: 11 6 ' combination group 2 can be combined with the joint portion 丨 6 5 ' and the processing die 16 is removed, which means that the modularization can reach Second, the pressurizing device 12 can be pressed from the bonding unit group 2. Fruit again. In addition, the invention is a 'body 10' and a pressurizing device 12 that are commonly used in the bed, and is actually separated from the processing module 2, that is, the processing module 2 is separated. The purpose of the processing, that is, the different processing towns, to the modular press body 1 〇 and the pressurizing device 1 2,: can be shared, so there is no need to repeat the purchase of 9 1331082. Conversely, the same group of presses 1 squid set 12 can be supplied to different processing modules 2: ^ The purpose of this modularization, of course, the processing of each model and the appearance of 2 feet can be said to be exactly the same, because There is only one presser body 丨〇L joint portion 16, so that each processing module 2^ can be combined with the joint portion 丨6, and the size of the processing module 2 is the same. In short, each = the same size of the work group 2 and the processing methods that can be provided are different. As shown in Fig. 1, the joint portion 16 is opened in a recessed manner for the processing module 2 to be fixed therein. See Fig. 2, which is a processing set of the present invention having a hot press forming function. As described in the above paragraph, since the present invention is a press and its equipment, the respective processing modules 2'f=the same, and therefore the first introduction is a thermoforming functional module 2a (also known as a hot press forming mold). The whole twist forming module 2a of the group 2a) comprises a receiving body 2, wherein the two venting holes 21' communicate with the # outside the thermoforming module 2a, and the pumping device 4 comprises a vacuum pump 4 The squid 2, 42, vacuum pump 40 vacuums the module 2a, = j Ϊ Ϊ Ϊ After the temperature, the valve 42 is closed to maintain the vacuum in the mold group 2a. Moreover, in the housing 20, a 25' is processed, and a receiving pressure 1 is further disposed on the housing 20, and is disposed on each of the housings 20, and obliquely extends from the processing base 25. The body 20 is pressed against the pressurizing device. The pressure linking device 22 is used to transfer the pressure generated by the press body 2 and the t device 12 to the receiving body 2 to transfer the pressure to the material to be processed. Dan will continue to refer to Fig. 2. Since the disclosed module 2a' is heated to the extent that the material to be processed is g ^ 10 丄, the shape of the mold is used by the user. Therefore, in order to achieve the goal 6V, a heating benefit 25a' is set on the defending base 25, of course, the processing base heatspot, the heater 2 5 a is used for i 舳 甘, and can be used as a captive name. ^乂The hot-pressed material 3a heated thereon presses the two v:s against the pressurizing device u. Therefore, when the hot-pressed material 3a is placed on the if-hot-pressing cookware 27a, the temperature is set, and the heat is generated in the module 2a. On the Ha, it is pre-applied to make the hot material, the soil and then the shape of the pressure. In order to ensure the interaction, the M force of 12, which is to be formed, is evenly applied to the heat material T 7 to be dusted. 22 and the hot pressing mold 27a is further provided with a two-f mechanism 23, or a pressure connection 1 f = 2 calendar (four) that is the function of adjustment. In addition, the addition of crying 22 / ^ body pressure The device (not shown in the figure) can be connected to a power supply for the heater 25a, and the power supply device provides the structure and function. i is the heat relay module 2a See Figure 3 for the month, the county scholar wants n〇„ The module is also referred to as a 'heart joining function plus one receiving body 20, a joining module $ also includes a pressure adjusting mechanism 23, a processing and a text linkage device 22, 2 7, and a module 2 b There is a #々t upper 25 and a die holder 40 through the venting opening 21 to lock the vacuum pumping door 42 of the $f device 4 to maintain "the inside of the body f〇20: vacuum, and the valve; the phase 1" The degree of connection with the above f ', but in actual use may still be different in pin 11 1331082 and optimized in detail. Please continue to refer to FIG. 3, in which the processing base 25 has thermal work to heat the material to be processed to an appropriate degree, and a first flattening = 25b is provided on the processing base 25. The die holder 27 opposite to the processing base 25 is also provided with a second pressing plate 27b. The direct bonding material 3b is on the first pressing plate 2 5b, and the material 3b is usually two pieces of two buckets ' respectively placed in the first sub-plate of the first pressing plate 2Sb; the first sub-material is placed The second sub-material 3b2 on 3bl. The conditions in the heart, such as vacuum, and the temperature and pressure of the material 3b are 12 (please apply the pressure on the 篦-工Ϊ22), and then press the second pressing plate 27b into the material. 3b2, and because of the combination of the first pressing plate 25b, the first sub-material 3b1 and the second sub-material 3b2 are tightly packed. The direct bonding technique is to use a chemical agent to make the surface::::丄ΐ Engaged with the material, usually at -100 to Γ and the temperature at the time of bonding is usually at the low temperature. The above is about Figure 3. The effect is g. The structure, component composition and the component of the 5 module 2b are added. FIG. 4 is a second embodiment of the present invention having an anodic bonding work member number 20, 21, 22, M 莫 C ', etc., and the above-mentioned FIG. 2, FIG. 3, I, 2U, 4 〇, and may still be used for Each model is optimized for the details of the work. Please refer to Figure 4, 1 for the machining method. The middle of the machining base 2 and the middle depolarization joint module 2c are also a heating unit. 25a, too | heater's processing on the base 25 is more set 1 = heating and closing the material when the degree is affected by the reverse The functional element 42 is at the end 12 1331082 25c, and a heat receiving plate (not shown) may be disposed between the processing base 25 and the first electrode 25c, and a second is formed on the mold base 27 The first electrode 25c and the second electrode 27c are electrically connected to a power supply 5 of the outside through a first wire 25cl and a second green 27cl, and the device 5 is applied to the first and second electrodes. A high electric power is generated between the electrodes, and the anodic bonding material 3c is placed on the first electrode 25c. When the preparation material 3c is heated to a certain temperature and the vacuum of the receiving body 2 reaches a preset value, The second electrode 27c approaches and f touches the material (2). At this time, the power supply 5 is at the first, = electric J: = potential difference to achieve the purpose of anodic bonding. ^ f is generally applicable to glass and germanium wafers. The joint is connected to the first wire...1 and the power supply. As for the glass 3cl, the second positive electrical connection 27c2 contacts 'and the contact' electrode 27 = J touch: the pole i7:1 and the negative pole of the power supply 5 Electrical connection iC ^ invention modular effect, because ^ in order to achieve 3 body 2 〇 is available from the house bed The volume of the body 2c 2c = 'so that it is convenient to accommodate the body 2〇"; Figure 1) The upper extraction source supply 5 reaches a separable design, and the first electronic connection is exposed in the external and external Point 241 is more than 2 gentlemen and 242 to facilitate the outside of the disk but from a music __• electronic contact at this time power supply device 5 source for C or open circuit. The volts are around (but not by the potential difference of about one thousand stone eve wafers 3 〇 2 heating to four degrees Celsius, one hundred and two 1 heat fast 25a, then rise the broken glass 3cl with the Χ around. & temperature _, relative The broken glass J = drifts to the negative pole, and the part of the 13 1331082 surface that is contacted by the stone eve day 3c2 forms a depletion layer. Therefore, a tantalum wafer 3 c2 and glass 3 c 1 are formed. A large electric field 'causes the oxygen atoms in the glass 3cl to be bonded to the 石 wafer $c2' to have a certain bonding force. The above is the structure and principle of the anodic bonding module 2c. Figure 5 is a press forming function of the present invention, which is also referred to as a press forming module 2d, wherein the component numbers 20, 21, 22, 23, 25, 27, 4, 40 and 42, etc.
與前述圖2、圖3所揭露者並無不同，但於實際 使用上仍可能針對各種加工方式之不同而在細g 上予以最佳化設計。 頊繼躓參閱圖5 ..... ^ 2=，而在加工基座25上則置放一受壓材料 刊，虽加壓裝置12(請參考圖㈠透 置22傳遞壓力使模具27d塵印於受墨材遷料動^ t t t文壓材料3 d就可以成形。然而通常在壓 守又堅材料3 d的狀態多是比較軟的传 軟；ΐ:配合模具…的形狀而成形 f =岛，再對壓印中或壓印後的材料以施以 :貝d;譬f說，若材# 3d為熱固性聚合 j則而要將之加i ’若是熱塑性聚合物， ϊ ΐΛ本Λ明广此所揭示的實施例則是以受 2 Λίν上紫外線硬化聚合物為例。故加工基座 25則包含一紫外線穿透板25d，以 j 射器而受壓材料3d即是置放於 =，二當模* 27<1擠愿著㈣3d、時、， 器W使之釋放出紫外線透過紫夕ί 請參閱圖6,為本發明模組與匕間 14 1331082 的結合示意圖。其中壓床本體 合部16，而加工模，且2即置放於有p呈;^ = 機構(圖中未揭示)使加工模組1固 疋於壓床本體10上。而圖6亦是側面圖， 工模組2是以側向推送入結合部丨6内，且 ^ 1 16内還增設有滚輪18以方 f -二 :合部16。當結合部16與加工模組出 :了 = 以將加工模組2内的氣體排It is not different from those disclosed in Figures 2 and 3 above, but it may still be optimized on the fine g for various processing methods in actual use.顼继踬 Refer to Fig. 5 ..... ^ 2=, and a pressed material is placed on the processing base 25, although the pressing device 12 (please refer to the figure (1), the transmission 22 transmits the pressure to make the mold 27d dust. It can be formed by printing on the ink-receiving material for 3 d. However, it is usually soft-transferred in the state of being pressed and steadily 3 d for the material; ΐ: forming with the shape of the mold... f = Island, and then embossed or embossed material to apply: shell d; 譬f said that if #3d is thermoset polymerization j then add it 'if it is a thermoplastic polymer, ΐΛ ΐΛ本Λ明The embodiment disclosed herein is exemplified by a UV-curable polymer on 2 Λίν. Therefore, the processing pedestal 25 includes an ultraviolet ray transmissive plate 25d, and the pressed material 3d is placed on the j. , when the mold * 27 < 1 squeezing (four) 3d, when, the device W to release the ultraviolet light through the purple ί 请 please see Figure 6, the combination of the module and the 14 14 1331082 of the present invention. The merging portion 16 is machined, and 2 is placed in the p-presentation; ^ = mechanism (not shown) to fix the processing module 1 to the pressing bed body 10. In the side view, the working module 2 is pushed into the joint portion 6 in the lateral direction, and the roller 18 is further added in the ^16 to the square f-two: the joint portion 16. When the joint portion 16 and the processing module are out: = to discharge the gas in the processing module 2
j，抽虱官44與通氣孔21連通，如此 F 浦40動作時，即可透過抽氣管46與具工$ 外，由於加工模組2内尚有一電子度二f 了諸如圖2中的加熱器25a、圖4中 匕括 5的紫外線發射器Ldi 4兀件，因此在加工模組2的容置體2〇上 ^ 外露的第-電子接點241與第二電子接點^^ = 本· 1〇内的電源供應器5 、s ; ί饮第奋電/原接點5 1與第二電源接點52導 通或斷路。至於在容置體20内則自有 第1將電源供應器5的電力輸送到 可#，由於模組化的重點在 1 ,固疋，且都可以對容置體20内 =真空並，2提供電力，因此每個模組（2&至2d) 亡所St有的通氣孔21、第—電子接點241與 弟一電子接點242的位置均相同， 共用壓床本體10之模組化的目的。 因此，由上述各個圖式的實施例可以很清楚 15 的理解本發明所避Α , 過規格-致而各壓床的概念，就是透 說使用者原本使用有的不模組，譬如 卫，而在之後i 3 ί ξ ΐ接接合模組來進行加 工，那麼使用者紫外線硬化加壓成形的加 直接接合I:者^將已設置於壓床本體10上的 所示的加壓成形^且配=圖3)拆下，換上圖5中 床本體H)即可’vt! 原本的壓 庆的庫用,八有夕種功此。相較於以往的壓 需要^具壓广果使，者需要多種功能，那麼他便 加工方可是習用的壓床除了功能上因為 異外，其餘的結構如壓床的本體二 資本較少的工廠術也 κ:負？。然而只要使用了本發明：模：化： m ’二可以在同樣能夠進行多種加工方式j 省少麗床設備的投資成本，還 的i: 於微機電元件的製造具有極為卓越 娜，d月？ΐ習？術領域之人所任為匠思之修 以:Γ請專利範圍之保護。 ，^，為本發明的模組化壓床示意圖； ’ΐί發明具熱塵成形功能的加工模組，· 3’疋本發明具直接接合功能的加工模組； 圖，為本發明中具有陽極接合功能的加工 16 1331082 模組； 圖5，為本發明中具有加壓成形功能的加工 模組；以及 圖6，為本發明模組與壓床本體之間的結合 示意圖。 【主要元件符號說明】 1 :模組化壓床 10 壓 床 本 體 12 加 壓 裝 置 14 支撐 結 構 16 結 合 部 18 滾 輪 2 :加工模組 2a :熱壓成形模組 2b :直接接合模組 2 c :陽極接合模組 2d :加壓成形模組 20 :容置體 21 :通氣孔 φ 22:受壓連動裝置 23 :壓力調節機構 241 :第一電子接點 242 :第二電子接點 2 5 :加工基座 25a :加熱器 25b :第一壓合平板 25c :第一電極 2 5 c 1 :第一導線 2 5 d :紫外線發射器 17 1331082 2 5 d ’ ：紫外線穿透板 2 7 :模座 27a :熱壓模具 27b :第二壓合平板 27c :第二電極 2 7 c 1 :第二導線 27c2 :接觸電極 2 7 d :加壓模具 3 a :熱壓材料 3 b :直接接合材料 3 b 1 :第一子材 3b2 :第二子材 3 c :陽極接合材料 3cl :玻璃 3 c 2 ·石夕晶片 3 d :受壓材料 4 :抽氣設備 40 :真空泵浦 42 :閥門 44 :抽氣管 5 :電源供應器 5 1 :第一電源接點 5 2 :第二電源接點 6 :電子設備 61 :第一導線 62 :第二導線 18j, the pumping officer 44 is connected to the vent hole 21, so that when the F pump 40 is actuated, it can pass through the exhaust pipe 46 and the work unit, since the processing module 2 still has an electron degree, such as the heating in FIG. The device 25a and the ultraviolet emitter Ldi 4 of the 5 in FIG. 4, so that the exposed first and second electronic contacts 241 and the second electronic contacts are mounted on the receiving body 2 of the processing module 2 · The power supply 5, s in 1〇; 第 第 奋 / / original contact 51 and the second power contact 52 are turned on or off. As for the inside of the accommodating body 20, the electric power of the power supply 5 is supplied to the first one, and since the focus of the modularization is 1, solid, and both can be placed in the housing 20 = vacuum, 2 The power is supplied, so that each of the modules (2& to 2d) has the same vent hole 21, the first electronic contact 241 and the younger electronic contact 242, and the modular press body 10 is modularized. the goal of. Therefore, it can be clearly understood from the embodiments of the above various figures that the concept of the present invention is avoided, and the concept of each press is to say that the user originally used the non-module, such as Wei, and After the i 3 ί ΐ 接合 接合 接合 接合 接合 接合 接合 使用者 使用者 使用者 使用者 使用者 使用者 使用者 使用者 使用者 使用者 使用者 使用者 使用者 使用者 使用者 使用者 使用者 使用者 使用者 使用者 使用者 使用者 使用者 使用者 使用者 使用者 使用者 使用者 使用者 使用者 使用者 使用者 使用者 使用者 使用者 使用者 使用者= Figure 3) Remove, replace the bed body H) in Figure 5 to 'vt! Originally used for the library, eight have the same kind of work. Compared with the previous pressure, it requires a variety of functions, so he can process the conventional press, except for the functional difference, the rest of the structure, such as the body of the press, has less capital. The technique is also κ: negative? . However, as long as the present invention is used: mold: m: two can also be used in a variety of processing methods to save the investment cost of the sleek bed equipment, and i: the manufacture of MEMS components is extremely excellent, na? Bad habits? The person in the field of technology is the master of the repairs: to protect the scope of patents. , ^, is a schematic diagram of the modular press machine of the present invention; 'ΐ 发明 invented a processing module with a hot dust forming function, · 3' 加工 the processing module with direct bonding function of the present invention; Processing of the joint function 16 1331082 module; FIG. 5 is a processing module having a press forming function in the present invention; and FIG. 6 is a schematic view showing the joint between the module and the press body of the present invention. [Main component symbol description] 1 : Modular press 10 Press body 12 Pressing device 14 Support structure 16 Joint portion 18 Roller 2: Process module 2a: Hot press forming module 2b: Direct joint module 2 c : Anode junction module 2d: pressure forming module 20: housing 21: vent hole φ 22: pressure linkage device 23: pressure adjustment mechanism 241: first electronic contact 242: second electronic contact 2 5: processing Base 25a: heater 25b: first pressing plate 25c: first electrode 2 5 c 1 : first wire 2 5 d : ultraviolet emitter 17 1331082 2 5 d ' : ultraviolet penetrating plate 2 7 : die holder 27a : hot pressing die 27b: second pressing plate 27c: second electrode 2 7 c 1 : second wire 27c2 : contact electrode 2 7 d : pressing die 3 a : hot pressing material 3 b : direct bonding material 3 b 1 : first sub-material 3b2 : second sub-material 3 c : anodic bonding material 3cl : glass 3 c 2 · lithographic wafer 3 d : pressure-receiving material 4 : suctioning device 40 : vacuum pump 42 : valve 44 : suction pipe 5 : power supply 5 1 : first power contact 5 2 : second power contact 6 : electronic device 61 : first wire 62 : second wire 1 8