1329203 、· 九、發明說明： ·· 【發明所屬之技術領域】 本發明係提供_ 執倾合戦之戦設備，制是—種 具有複合式壓貨頭之測試設備。 【先前技術】 先前技術之職設傷皆具有—壓#頭（Pusher)，該壓貨頭用 • 卩將待測晶片向下壓至測試座（Socket)上，使待測晶片上之電 路接點（LeadorPad)可與測試座中之測試探針（pr〇bepin)達 成電性連接。 然而，先前技術之壓貨頭僅適用於單面測試晶片，即使該壓 貨頭具有複數個壓貨平面或吸貨設計用以同時壓迫多個待測晶 片，先前技術之壓貨頭仍只能提供壓貨之單一功能。 鲁為因應現今晶片之功能增加與封裝製程的進步，某些晶片之 設計具有上下兩面之電路接點，或如多晶片模組（MuW Chip Module，MCM)、系統單封裝（SysteminPackage，证）等在封 裝過程中，雙面皆具有制之電路接點，若單一測試設備無法提 供同時測試上下兩面電路接點之功能，則該晶片或封裝模組於測 試過程中必須使用不同之測試設備或更換不同之壓貨頭，以反覆 進行多次測試。如此一來，將增加測試流程之工時與成本。 7 因此’確有必要提出一種新的技術方案以解決上述先前技術 中測試設備所存在的問題。 【發明内容】 本發明係提供一種可執行複合測試之測試設備，其具有複合 式壓貨頭可對待測晶片進行複合測試流程。 爲達成上述目的，本發明提供一種可執行複合測試之測試設 備，其包含一壓貨頭、一測試基座與複數個測試探針。該壓貨頭 吸取一待測物，該待測物原本放置在一來回梭機構上，壓貨頭會 移動至來回梭機構上吸取待測物後再移回至測試基座並放置於 一預設位置後下壓測貨。該壓貨頭包含至少一複合壓貨頭與至少 一真空吸嘴’該壓貨頭上位於複合壓貨頭外之區域可嵌入一具測 試功能之1C，，另該複合壓貨頭具有複數個複合測試探針，或 該複合壓貨頭亦可單嵌入至少一具有測試功能之IC，同時亦可 將該複合測試探針及該具測試功能之1C整合於複合壓貨頭内， 用以電性連接該待測物之相應電路接點；該複合壓貨頭之設計端 視待測物之結構仔以做對應組合之調整。該真空吸嘴則用以吸取 該待測物。該測試基座位於該壓貨頭下方，固定於一底板上，其 包含一容置空間與複數個探針孔，該容置空間用以收容該待測 物。該測試探針設置於該測試基座下方，當該壓貨頭將該待測物 1329203 向下壓時，酬鄉針可通過相狀探針孔與雜鳴之相應電 路接點達成電性連接。 該塵貨頭可設置有至少—定位機構，_測試基剌可設置 有至少-定位孔，該定位機構與該定位孔相配合用以當該壓貨頭 將該待測物向下壓時，對該«頭與該測試基座之相對位置進行 定位。 該待測物可為單-或多晶片之封裝模組，其頂面與底面皆有 電路接點，當雌貨頭向下壓時，該待測物頂面與底面之電路接 點可同時分別與該複合磨貨頭及該測試基座之測試探針達成電 性連接’可同時進行相應電路接點之電性測試。相較於先前技 術，本發明所提供之可執行複合測試之測試設備，利·貨頭上 所设置之複合歡頭’使該測試設備可針對上下兩_具有待測 電路接點讀嶋進行齡紐戦，使該制物上下兩面之電 路接點可科進行雜職，科需移^—職基座或另_測 試設備上再行職。因此，本㈣之顿行複合 不但可減少測試流程所需之工時，亦可降低測試設備之設置成 本〇 【實施方式】 以下結合圖式’詳細說明本發明之技術方案。請參閱第—圖1329203, IX, invention description: ···Technical field to which the invention pertains The present invention provides a _ 执 戦 戦 戦 , , , , 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 [Prior Art] The prior art job has a “Pusher”, which presses the wafer to be tested down to the test socket (Socket) to connect the circuit on the wafer to be tested. The point (LeadorPad) can be electrically connected to the test probe (pr〇bepin) in the test socket. However, the prior art press head is only suitable for single-sided test wafers, even if the press head has a plurality of press planes or suction designs to simultaneously press a plurality of wafers to be tested, the prior art press head can only Provide a single function of the cargo. In response to the increasing functionality and packaging process of today's wafers, some chips are designed with circuit contacts on both sides, or such as multi-chip modules (Mu), system in packages, etc. In the packaging process, both sides have circuit contacts. If a single test device cannot provide the function of simultaneously testing the upper and lower circuit contacts, the chip or package module must use different test equipment or replace during the test. Different pressure heads are tested repeatedly. As a result, the labor and cost of the test process will increase. 7 Therefore, it is indeed necessary to propose a new technical solution to solve the problems of the test equipment in the prior art mentioned above. SUMMARY OF THE INVENTION The present invention provides a test apparatus capable of performing a composite test, which has a composite press head capable of performing a composite test flow on a wafer to be tested. To achieve the above object, the present invention provides a test apparatus for performing a composite test comprising a press head, a test base and a plurality of test probes. The pressing head sucks a sample to be tested, and the object to be tested is originally placed on a shuttle mechanism, and the pressing head moves to the shuttle mechanism to suck the object to be tested, and then moves back to the test base and is placed in a pre-measurement After setting the position, press down to test the goods. The pressing head comprises at least one composite pressing head and at least one vacuum nozzle. The area on the pressing head outside the composite pressing head can be embedded in a test function 1C, and the composite pressing head has a plurality of composites. The test probe, or the composite press head, may be embedded in at least one IC having a test function, and the composite test probe and the test function 1C may be integrated into the composite press head for electrical use. The corresponding circuit contact of the object to be tested is connected; the design of the composite press head is adjusted according to the structure of the object to be tested. The vacuum nozzle is used to suck the object to be tested. The test base is located under the press head and is fixed on a bottom plate. The test base is disposed on a bottom plate and includes a receiving space and a plurality of probe holes for receiving the object to be tested. The test probe is disposed under the test base. When the press head presses the object to be tested 1329203 downward, the counter needle can be electrically connected to the corresponding circuit contact of the noise through the phase probe hole. . The dust head may be provided with at least a positioning mechanism, and the test base may be provided with at least a positioning hole, and the positioning mechanism cooperates with the positioning hole for when the pressing head presses the object to be tested downward. The relative position of the «head to the test pedestal is located. The object to be tested may be a single- or multi-wafer package module, and the top surface and the bottom surface have circuit contacts. When the female head is pressed downward, the circuit contacts of the top surface and the bottom surface of the object to be tested may be simultaneously Electrical connection to the composite grinding head and the test probe of the test pedestal respectively can be performed simultaneously to perform electrical testing of the corresponding circuit contacts. Compared with the prior art, the test device for performing the compound test provided by the present invention, the compounding head set on the head of the cargo head, enables the test device to be used for the upper and lower sides of the circuit to be tested.戦, the circuit contacts on the upper and lower sides of the product can be used for miscellaneous duties, and the department needs to move to the pedestal or another _ test equipment. Therefore, the composite of the present invention can not only reduce the number of man-hours required for the test process, but also reduce the setting cost of the test device. [Embodiment] The technical solution of the present invention will be described in detail below with reference to the drawings. Please refer to the figure
9 1329203 及第-g ’其分別為-封裝触1G之底面視酸頂面視圖。封 ·· 频組10之底面具有複數個帛-電路接‘點12，該第-電路接點 I2可辑腳（Lead)或銲塾（Pad)。該封裝模組1Q之頂面具有 H片22 一第二晶片23、—第三晶片24、若干個被動元 件25與複數個第二電路接點2〇。其中，該第一晶片二之頂面 具有複數個第三電路接點22()。該第二電路接點2()與第三電路 修 接點220係為鮮塾。該被動元件25可為電阻器、電容器、電感 器或其他被動元件。另外，該封裝模組1〇可為多晶片模組（Muki Chip Module，MCM)、纽單封裝（&恤峨，证）等， 或為雙面皆具有電路接點之晶片。 請參閱第三圖’第三圖為本發明之可執行複合測試之測試設 備30之結構示意圖。該測試設僙3〇具有一壓貨頭32、一測試 • 基座（加㈣S〇Cket) 34、複數個測試探針（Probe Pin) 36與一 底板4〇。複數個測試探針36係與該底板4〇呈電性連接。該塵 貨頭32具有至）-複合壓貨頭32〇，當待測之該封裝模組⑴頂 面具有待測接點時，如第二電路接點20或第三電路接點220， 該複合㈣頭32G之複合測試探針迦或該具測試功能之IC 32〇4可與贿離‘料絲錢細断湖電性測試 。該複 合麼貨頭320之設計魏待測之該封裝模組1〇之結構得以做對 10 1329203 應組合之調整’即該複合_頭320可具有複數個複合測試探針 3202或可嵌人至少—制試魏之IC迦亦或可同時將該複合 測試探針及該具測試功能之IC 32〇4整合於複合壓貨頭内。該複 合塵貨頭320之設計端視待測物之結構得以做對應組合之調 整。該壓貨頭32設有至少一真空吸嘴32卜用以吸取待測物。 該待測物原本放置在一來回梭機構（圖中未示）上，該壓貨頭 32會移動至該來回梭機構上吸取待測物後再移回放置於測試基 座34再下壓測貨。 當該封裝模組10欲進行電性測試時，該壓貨頭32利用真空 吸嘴321吸取封裝模組10後將其移至該測試基座34上方，接著 將封裝模組10對準測試基座34上之一容置空間342並放置於其 中°開始進行電性測試時，壓貨頭32將封裝模組1〇向下壓，此 時，複數個測試探針36可通過相應之探針孔344與封裝模組1〇 底面上相對應之待測接點（如第一電路接點12)達成電性連接， 以進行電性測試。 請參閱第四圖，第四圖為該壓貨頭32、封裝模組10與測試 基座34之立體分解視圖。該測試基座34上設有複數個定位孔， 如第一定位孔346與第二定位孔348，用以在壓貨頭32將封裝 模組10於容置空間342向下壓時，對壓貨頭32與測試基座34 S ) 11 之相對位置财位。職合壓_ 32G若為_複合職探針設計 時，另包含一外接埠322，該外接埠322具有複數個外接電路接 點通肋傳輸職減接至細職翻或設備以執行測 試。 請參閲第五圖，第五圖為該壓貨頭32之底面立體視圖。當 封裝模組10欲進行複合電性功能測試時，該複合壓貨頭32〇使 其上之複合峨探針迦與錄封賴組1()頂自之械電路接 點（如第二電路接點20或第三電路接點22〇)達成電性連接， 以進行複合電性測試。另外，該壓_ 32之底面亦設有複數個 定位機構，如第一定位機構326與第二定位機構328，其分別用 以對應該職基座34之相應定位孔，藉此可對壓貨頭32與測試 基座34之相對位置做定位。 相較於先前技術，本發明所提供之可執行複合測試之測試設 備，利用麗貨頭上所設置之複合愿貨頭，使該測試設傷可對上下 兩面皆具有制電路魅之待·進行複合紐測試，使該待測 物上下兩面之電路接點可同時進行電性測試，而不需移至另一測 試基座或另-測試設備上再行測試。因此，本發明之可執行複合 測試之測試設備不但可減少測試流輯需之_，___ 設備之設置成本。 13292039 1329203 and the -g ' are respectively - the top view of the bottom side of the package touch 1G. The bottom surface of the frequency group 10 has a plurality of 帛-circuits connected to the point 12, and the first circuit contact I2 can be a lead or a pad. The top surface of the package module 1Q has an H-chip 22, a second wafer 23, a third wafer 24, a plurality of passive components 25, and a plurality of second circuit contacts 2''. The top surface of the first wafer 2 has a plurality of third circuit contacts 22(). The second circuit contact 2 () and the third circuit repair point 220 are fresh. The passive component 25 can be a resistor, capacitor, inductor or other passive component. In addition, the package module 1 can be a Muki Chip Module (MCM), a New Zealand package (&shoe, certificate), or the like, or a chip having circuit contacts on both sides. Please refer to the third figure. The third figure is a schematic structural diagram of the test device 30 of the executable composite test of the present invention. The test setup has a press head 32, a test pedestal (plus (four) S 〇 Cket) 34, a plurality of test probes (Probe Pin) 36 and a bottom plate 4 。. A plurality of test probes 36 are electrically connected to the bottom plate 4A. The dust head 32 has a composite press head 32 〇, when the top surface of the package module (1) to be tested has a contact to be tested, such as a second circuit contact 20 or a third circuit contact 220, Composite (four) head 32G composite test probe can or the test function of the IC 32 〇 4 can be bribed away from the 'wire money fine break lake power test. The design of the composite head 320 is to be tested. The structure of the package module can be adjusted to 10 1329203. That is, the composite head 320 can have a plurality of composite test probes 3202 or can be embedded at least. - The test of Wei Zhi IC can also integrate the composite test probe and the test function IC 32〇4 into the composite press head. The design of the composite dust head 320 can be adjusted according to the structure of the object to be tested. The press head 32 is provided with at least one vacuum nozzle 32 for sucking the object to be tested. The test object is originally placed on a shuttle mechanism (not shown), and the press head 32 is moved to the shuttle mechanism to pick up the object to be tested, and then moved to the test base 34 and then pressed down. goods. When the package module 10 is to be electrically tested, the press head 32 sucks the package module 10 by using the vacuum nozzle 321 and then moves it to the test base 34, and then aligns the package module 10 with the test base. When one of the seats 34 accommodates the space 342 and is placed therein, when the electrical test is started, the press head 32 presses the package module 1 , downward, and at this time, the plurality of test probes 36 can pass the corresponding probes. The hole 344 is electrically connected to the corresponding contact (such as the first circuit contact 12) on the bottom surface of the package module 1 for electrical testing. Please refer to the fourth figure. The fourth figure is a perspective exploded view of the press head 32, the package module 10 and the test base 34. The test base 34 is provided with a plurality of positioning holes, such as a first positioning hole 346 and a second positioning hole 348, for pressing the package head 10 when the pressing head 32 presses the package module 10 downward in the accommodating space 342. The relative position of the cargo head 32 and the test base 34 S ) 11 is financial position. If the _32G is a _ composite probe design, it also includes an external port 322, which has a plurality of external circuit contacts, and the ribs are transferred to the fine job or device to perform the test. Please refer to the fifth figure. The fifth figure is a bottom perspective view of the press head 32. When the package module 10 is to be subjected to a composite electrical function test, the composite press head 32 is configured such that the composite 峨 probe is attached to the mechanical circuit contact (eg, the second circuit) The contact 20 or the third circuit contact 22 is electrically connected to perform a composite electrical test. In addition, the bottom surface of the pressure _ 32 is also provided with a plurality of positioning mechanisms, such as a first positioning mechanism 326 and a second positioning mechanism 328, respectively for respectively corresponding positioning holes of the pedestal base 34, thereby The head 32 is positioned relative to the test base 34. Compared with the prior art, the test device for performing the compound test provided by the present invention utilizes the composite wishing head set on the head of the fascia, so that the test can be wounded and can have a circuit charm for both upper and lower sides. New test, so that the circuit contacts on the upper and lower sides of the object to be tested can be electrically tested at the same time, without having to move to another test pedestal or another test equipment for testing. Therefore, the test device of the executable composite test of the present invention can not only reduce the installation cost of the _____ device required for the test stream. 1329203
綜上所述，本發明確已符合發明專利之要件，爰依法提出專 利申請。惟，以上所述者僅爲本發明之較佳實施方式，舉凡熟習 本案技術之人士援依本發明之精神所作之等效修飾或變化，皆涵 蓋於後附之申請專利範圍内。 s 13 1329203 【圖式簡單說明】 第一圖為一封裝模組之底面視圖。 第二圖為該封裝模組之頂面視圖。 第三圖為本發明之可執行複合測試之測試設備之結構示意 圖。 第四圖為壓貨頭、封裝模組與測試基座之立體分解視圖。 第五圖為壓貨頭之底面立體視圖。 【主要元件符號說明】 10 封裝模組 12 第一電路接點 20 第二電路接點 22 第一晶片 220 第三電路接點 23 第二晶片 24 第二晶片 25 被動元件 30 測試設備 32 壓貨頭 14 1329203In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art to the spirit of the present invention are within the scope of the appended claims. s 13 1329203 [Simple description of the diagram] The first picture shows the bottom view of a package module. The second picture shows the top view of the package module. The third figure is a schematic structural view of a test apparatus for an executable composite test of the present invention. The fourth picture is a perspective exploded view of the press head, the package module and the test base. The fifth picture is a perspective view of the underside of the press head. [Main component symbol description] 10 package module 12 first circuit contact 20 second circuit contact 22 first wafer 220 third circuit contact 23 second wafer 24 second wafer 25 passive component 30 test equipment 32 press head 14 1329203
320 複合壓貨頭 3202 複合測試探針 3204 測試功能1C 321 真空吸嘴 322 外接埠 3220 外接電路接點 326 第一定位機構 328 第二定位機構 34 測試基座 342 容置空間 344 探針孔 346 第一定位孔 348 第二定位孔 36 測試探針 40 底板 15320 composite pressure head 3202 composite test probe 3204 test function 1C 321 vacuum nozzle 322 external port 3220 external circuit contact 326 first positioning mechanism 328 second positioning mechanism 34 test base 342 housing space 344 probe hole 346 a positioning hole 348, a second positioning hole 36, a test probe 40, a bottom plate 15