1328973 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種晶片，特別是指一種麥克風晶片 及封裝成的動圈式麥克風。 【先前技術】 麥克風由聲電轉換方式區分’可分為以聲能振動構成 電容的振膜以產生微小電位差’再經過放大後送出訊號的 電容式麥克風、以聲能振動振膜而使音圈相對磁場位移， 以產生電流然後送出訊號的動圈式麥克風（其中，振膜成 皺折絲帶態樣的又稱為絲帶式麥克風（Ribbon MIC ))，以 及以聲能振動薄膜而使例如石英之壓電材料產生電流變化 的壓電式麥克風等三類。 參閱圖1，其中’現有的動圈式麥克風1都是以機械加 工方式製作’包含一個供聲能穿透的殼座11、一組設置於 該殼座11中並形成一個磁場的磁力組件12、一片可以感應 聲能並產生對應形變的振膜13 (Diaphragm )，及一個與該 振膜13連接並設置在該磁場中的音圈14( Voice Coil)。 當外界的聲能穿透該殼座11而作用至該振膜13時，該 振膜13即會反應聲能的聲波壓力而產生對應振幅的形變， 從而帶動連接的音圈14在磁場中位移產生感應電動勢，進 而產生電流而輸出對應於作用之聲能的電子訊號。 此種動圈式麥克風1進行聲電轉換的機制並不需要驅 動電源，而是依靠振膜13感應聲能變化帶動音圈14,再以 音圈14位移時切割磁場的磁力線產生感應電流，輸出供後 5 ^違用的電子錢；但是由㈣13帶動 = 於卡車帶動貨櫃移動，由起動與停止都與振= …與::=:ΓΤ機械加工方咖 尺寸與重量也就較大Μ要較長積 產生明顯訊號衰減的他，心法將頻㈣應特性&更 β因此’若能有效改善目前動圈式麥克風1的結構，特 別是微型化、輕量化振膜13 ， Μ . _ ㈤Η寻構造，不但可以改 訊號衰減的缺點、完整提昇動圈式麥克風^ 的頻率響應特性，同拉 ，也可明應應时克風的電氣產 釭、薄、短、小發展的潮流趨勢。 【發明内容】 因此’本發明之目的， 半導體製程製作，而可以大供—種以微機電技術與 片。 了大幅輕量化、微型化的麥克風晶 術盘本發明之另一目的’即在提供一種以微機電技 :?半導體製程製作之麥克風晶片封裝而成的動圈式麥克 場=二發明—種麥克風晶片，是與-組形成-個磁 麥克風曰…Γ 可供聲能穿透的殼座内，該 風日日片包s—層框架單元，及-層響應單元。 該層框架單元，盥 口的振動空間。―磁力組件共同形成-個具有-開 1層響應單元形成在該框架單元上並與該殼座内壁面 相間隔，具有一層以絕緣材料形成的振膜，及一層以導體 材料形成在該振膜上的音圈膜，該層振模並包括一封閉該 開口的振動區域，及一由該振動區域周緣向外延伸並與該 框架單元頂面連接的固定區域，該振膜的振動區域可被穿 透該殼座的聲能作用而產生對應形變，並同步帶動該音圈 膜在該磁場中位移產生感應電動勢。 再者，本發明之動圈式麥克風，包含一個殼座、一個 磁力組件，及一片麥克風晶片。 該殼座供外界聲能穿透並界定出一個封裝空間。 該磁力組件設置在該封裝空間中並形成一磁場。 該麥克風晶片設置在該封裝空間中並具有一層框架單 兀及層形成在該框柴單元上並與該殼座内壁面相間隔 的響應單元’該層框架單元與該磁力組件共同形成一個具 有開口的振動空間，該層響應單元包括一層以絕緣材料 形成的振膜’及一層以導體材料形成在該振膜上的音圈膜 ’該層振膜還包含一封閉該開口的振動區域，及一由該振 動區域周緣向外延伸並與該框架單元頂面連接的固定區域 ，該振動區域可被穿透該殼座的聲能作用而產生對應形變 ，並同步帶動該音圈膜在該磁場中位移產生感應電動勢。 本發明的功效在於提供一種新的，以半導體製程與微 機電技術製成，並用於供封裝成動圈式麥克風的麥克風晶 片，它的振膜與音圈層因為以微機電技術成型，所以可以 突破機械加工的限制而更進一步地輕量化、微型化，從而 而使得封裝製得的 改善高、低頻時訊號明顯衰減的問題， 動圈式麥克風具有更佳的頻率響應特性。 【實施方式】 、有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之—個較佳實施例的詳細說明中，將可 清楚的呈現。 在本發明被詳細描述之前，要注意的是，在以下的說 明内容中，類似的元件是以相同的編號來表示。 參閱圖2、圓3,本發明一種麥克風晶片5的一第一較 佳實施例，適用於與一組形成一個磁場的磁力組件4共同 封裝在一個可供聲能穿透的殼座3内，而成一個動圈式麥 克風2。 該殼座3具有一底壁31、一由該底壁31周緣向上延伸 的周壁32’及一與該周壁32頂緣連結的頂壁33,該底壁 31、周壁32’與頂壁33共同界定出一個供該磁力組件4、 麥克風晶片5容置的封裝空間34，且該頂壁33並包括一可 供聲能穿透的韌膜部331。 該組磁力組件4具有一塊設置在該殼座3底壁31上的 磁鐵塊41，及二個成翻轉90。之「U」字型且呈鏡像相對的 設置的導磁軛塊42，該兩個導磁軛塊42底部分別與該磁鐵 塊41的兩磁極相連接而彼此相間隔地對應設置’而將該磁 鐵塊41的磁力線導引成一個位於二導磁軛塊42頂部的水 平方向磁場。 該麥克風晶片5是應用半導體製程與微機電技術製成 ’包含一層框架單元 上的響應單元52。 51’與一層定義形成在該框架單元51 該框架單元51由—塊基材經過半導體製程定義形成， 有相間隔# A第一基塊511與_塊第二基塊512，該第 一、二基塊511、512分別設置在該磁鐵塊41的頂面且高度 實質到達該二導磁輛塊42頂部，而與該磁鐵塊Μ、導磁輛 塊42共同形成一個具有一開口的振動空間513 ^ *該層響應單元52應用微機電技術經過半導體製程形成 極薄的平板態樣，連接在該框架單元51上並與該殼座3頂 壁33的内壁面相間隔且水平地位於該磁場中，具有一層以 絕緣材料形成的振膜521，及—層以導歸料形成在該振膜 52!上的音圈膜522，該層振膜521並包括一封閉該振動空 門513開口的振動區域523，及一由該振動區域⑵周緣向 外延伸並與該框架單元51頂面連接的固定區域524，該音 圈膜522包括以相反方向環繞的一第一音圈段525，及第二 音圈段526。較佳地，該振膜521的厚度可在(本 例是2/zm) ’並以例如氮化矽、聚醯亞氨（p〇iyimide)、聚 對一甲苯為材料沉積形成（本例是聚醯亞氨）；該音圈膜 522的厚度也在數仁m (本例是丨以爪），並以例如鋁、銅、 鉻/金等導體材料m濺鍍、蒸鍍等方式形成。 虽外界的聲能穿透該殼座3而作用至該響應單元52時 ’該振膜521的振動區域523可被穿透該殼座3的聲能作 用而在振動空間513與跟殼座3頂壁33間的間隙產生對應 形變’並同步帶動該音圈膜522在該磁場中位移，以切割 1328973 • 4力線產生感應電動勢，進而產生電流而輸出對應於作用 之聲能的電子訊號。 上述的麥克風晶片5,在配合町的製造方法詳細說明 後’當可更加清楚的明白。 首先，選擇〈100〉矽晶圓作為基材，經過標準潔淨步 料洗後，以離子耗合電漿化學氣相沉積法（ICPCVD)， 纟基材上沉積一層高密度氧切的犧牲層，接著利用微機 • €技術（MEMS)在犧牲層上以Lift.技術鍍上鉻/金（ 定義出該線圈膜522，之後，再旋佈上一層聚醯亞 氨完成該振膜521的製作，完成響應單元52 ;之後，再利 用濺鍍、電鍍技術自振膜521向上形成出該第一、二基塊 511、512,元成框架單元51 ;最後，蝕刻掉該犧牲層即可 直接將麥克風晶片5與基材分離，取得成型出麥克風晶片5 ’之後再進行封裝即製得該動圈式麥克風2。 當然’此等麥克風晶片5的振膜521冑面態樣並非限 • 定是平板11樣；參_ 4，為更有效提昇頻率響應特性，該 振膜521之振動區域523的截面亦可呈連續的彎折態樣— 此部伤技術僅需先在基材上定義出對應的圖像，即可在沉 積氮化矽層、定義出氮化矽層的圖像後，對應製得該等態 樣的振膜521’。其他，例如框架單元51的結構，也可以視 實際的需要’而成例如圓環態樣、多數間隔之基塊態樣等 等；由於此等變化組合種類眾多，不再一一舉例詳述。 由上述說明可知，本發明主要是依據動圈式麥克風的 聲電轉換原理，應用半導體製程與微機電技術，設計並製 10 造出與磁力組件4共同封裝於機殼3中而成動圈式麥克風2 的麥克風晶片5;由於以應用半導體製程與微機電技術製成 的麥克風晶片5，可以大幅縮減例如厚度、長度、寬度、重 量等構件尺度，所以可以有效輕量化、微型化響應單元52 之振膜521、音圈膜522，改善在高、低頻時訊號衰減的缺 點、完整提昇動圈式麥克風2的頻率響應特性，同時，也 可以順應應用麥克風的電氣產品往輕、薄、短、小發展的 潮流趨勢’確實達到本發明的創作目的。 惟以上所述者，僅為本發明之較佳實施例而已，當不 能以此限定本發明實施之範圍，即大凡依本發明申請專利 範圍及發明說明内容所作之簡單的等效變化與修飾，皆仍 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 圖1是一俯視示意圖’說明一個習知的動圈式麥克風 » 圖2是一剖視示意圖，說明一個以本發明麥克風晶片 之一較佳實施例封裝成的動圈式麥克風； 圖3是一俯視圖，輔助說明圖2之麥克風晶片與動圈 式麥克風；及 圖4是一局部剖視圖，說明圖2之麥克風晶片的振媒 的另一態樣。 13289731328973 IX. Description of the Invention: [Technical Field] The present invention relates to a wafer, and more particularly to a microphone chip and a packaged moving coil microphone. [Prior Art] The microphone is distinguished by the sound-electric conversion method, which can be divided into a condenser microphone that generates a small potential difference by a diaphragm that forms a capacitor with acoustic energy vibration, and a microphone that transmits the signal after amplification, and a voice coil that vibrates the diaphragm with a sound energy. a moving coil microphone that generates a current and then sends a signal (in which a diaphragm is in a wrinkled ribbon shape, also called a Ribbon MIC), and a sound energy vibrating film such as quartz There are three types of piezoelectric microphones in which piezoelectric materials generate current changes. Referring to Figure 1, the 'existing moving coil microphone 1 is made by machining' includes a housing 11 for acoustic energy penetration, a set of magnetic components 12 disposed in the housing 11 and forming a magnetic field. A diaphragm 13 (Diaphragm) capable of sensing acoustic energy and generating a corresponding deformation, and a voice coil 14 connected to the diaphragm 13 and disposed in the magnetic field. When the external sound energy penetrates the housing 11 and acts on the diaphragm 13, the diaphragm 13 reacts with the acoustic pressure of the acoustic energy to generate a corresponding amplitude deformation, thereby causing the connected voice coil 14 to be displaced in the magnetic field. An induced electromotive force is generated, which in turn generates a current and outputs an electronic signal corresponding to the applied acoustic energy. The mechanism of the acoustic-electrical conversion of the moving coil microphone 1 does not need to drive the power supply, but the diaphragm 13 is used to induce the change of the acoustic energy to drive the voice coil 14, and then the magnetic field of the cutting magnetic field is generated by the voice coil 14 to generate an induced current, and the output is output. For the post 5 ^ violation of the electronic money; but by (four) 13 drive = in the truck to drive the container to move, from starting and stopping both with the vibration = ... and :::: ΓΤ machine processing party coffee size and weight is larger The long product produces obvious signal attenuation, and the heart method will frequency (4) should be characteristic & more β, therefore, if it can effectively improve the structure of the current moving coil microphone 1, especially the miniaturized, lightweight diaphragm 13, Μ. _ (5) The search structure can not only change the shortcomings of signal attenuation, but also improve the frequency response characteristics of the dynamic microphone ^, and can also understand the trend of electrical production, thin, short and small development. SUMMARY OF THE INVENTION Therefore, the object of the present invention is to manufacture a semiconductor process, and to provide a large number of microelectromechanical technologies and films. A further lightweight, miniaturized microphone crystal disc is another object of the present invention, which is to provide a moving coil type microphone field packaged by a micro-electromechanical technology: semiconductor chip fabricated by a semiconductor process. The wafer is formed in a pair of - a magnetic microphone 曰 ... 可供 in the housing for sound energy penetration, the wind day and day package s-layer frame unit, and - layer response unit. The layer frame unit, the vibration space of the mouth. ―The magnetic components are collectively formed—one-and-one-layer response unit is formed on the frame unit and spaced apart from the inner wall surface of the housing, and has a diaphragm formed of an insulating material, and a layer formed of a conductor material on the diaphragm a voice coil film comprising: a vibration region enclosing the opening, and a fixed region extending outward from the periphery of the vibration region and connected to the top surface of the frame unit, the vibration region of the diaphragm can be worn A corresponding deformation is generated through the acoustic energy of the housing, and the voice coil film is synchronously driven to generate an induced electromotive force in the magnetic field. Furthermore, the moving coil microphone of the present invention comprises a housing, a magnetic component, and a microphone chip. The housing provides external acoustic energy to penetrate and define a package space. The magnetic component is disposed in the package space and forms a magnetic field. The microphone chip is disposed in the package space and has a frame unit and a response unit formed on the frame unit and spaced apart from the inner wall surface of the housing. The layer frame unit and the magnetic assembly form an opening. a vibration space, the layer response unit includes a diaphragm formed of an insulating material and a voice coil film formed on the diaphragm by a conductor material. The diaphragm further includes a vibration region that closes the opening, and a fixed area of the periphery of the vibrating area extending outwardly and connected to the top surface of the frame unit, the vibrating area being oscillated by the acoustic energy of the housing to generate a corresponding deformation, and simultaneously driving the voice coil film to be displaced in the magnetic field Generates an induced electromotive force. The function of the present invention is to provide a new microphone chip which is made by semiconductor process and micro-electromechanical technology and is used for packaging into a dynamic microphone. The diaphragm and voice coil layer are formed by micro-electromechanical technology. Breaking through the limitations of machining, it is further lightweight and miniaturized, so that the package is improved in high frequency and the signal at the low frequency is obviously attenuated. The dynamic microphone has better frequency response characteristics. The above and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments. Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals. Referring to FIG. 2 and the circle 3, a first preferred embodiment of the microphone chip 5 of the present invention is suitable for being packaged together with a set of magnetic components 4 forming a magnetic field in a housing 3 for sound energy penetration. Become a moving coil microphone 2. The housing 3 has a bottom wall 31, a peripheral wall 32' extending upward from the periphery of the bottom wall 31, and a top wall 33 coupled to the top edge of the peripheral wall 32. The bottom wall 31 and the peripheral wall 32' are combined with the top wall 33. A package space 34 is provided for the magnetic component 4 and the microphone chip 5, and the top wall 33 includes a tough portion 331 for acoustic energy penetration. The set of magnetic components 4 has a magnet block 41 disposed on the bottom wall 31 of the housing 3, and two turns 125. a "U"-shaped yoke block 42 disposed in a mirror image, and the bottoms of the two yoke blocks 42 are respectively connected to the two magnetic poles of the magnet block 41 so as to be spaced apart from each other. The magnetic lines of force of the magnet block 41 are guided into a horizontal magnetic field at the top of the second yoke block 42. The microphone chip 5 is a response unit 52 formed on a frame unit by a semiconductor process and MEMS technology. A frame portion 51 is formed in the frame unit 51. The frame unit 51 is formed by a block substrate through a semiconductor process definition, and has a spacing #A first block 511 and a block second block 512, the first and second The base blocks 511 and 512 are respectively disposed on the top surface of the magnet block 41 and substantially reach the top of the two magnetic conductive block 42 , and together with the magnet block and the magnetic conductive block 42 form a vibration space 513 having an opening. ^ The layer response unit 52 applies a micro-electromechanical technique to form a very thin plate-like pattern through a semiconductor process, is connected to the frame unit 51 and is spaced apart from the inner wall surface of the top wall 33 of the housing 3 and horizontally located in the magnetic field. There is a diaphragm 521 formed of an insulating material, and a layer of the voice coil film 522 formed on the diaphragm 52!, and the diaphragm 521 includes a vibration region 523 that closes the opening of the vibration gate 513. And a fixed area 524 extending outward from the periphery of the vibration region (2) and connected to the top surface of the frame unit 51, the voice coil film 522 including a first voice coil segment 525 surrounded by the opposite direction, and a second voice coil Segment 526. Preferably, the thickness of the diaphragm 521 can be formed by (for example, 2/zm) ' and deposited by, for example, tantalum nitride, p〇iyimide, or poly-p-toluene (in this case, The thickness of the voice coil film 522 is also a plurality of layers (in this example, a claw), and is formed by sputtering, vapor deposition, or the like of a conductor material m such as aluminum, copper, or chromium/gold. When the external sound energy penetrates the housing 3 and acts on the response unit 52, the vibration region 523 of the diaphragm 521 can be penetrated by the acoustic energy of the housing 3 in the vibration space 513 and the heel seat 3 The gap between the top walls 33 generates a corresponding deformation 'and synchronously drives the voice coil film 522 to be displaced in the magnetic field to cut the 1328973 • 4 force line to generate an induced electromotive force, thereby generating a current and outputting an electronic signal corresponding to the applied acoustic energy. The microphone chip 5 described above can be more clearly understood after the detailed description of the manufacturing method of the collocation. First, select <100> 矽 wafer as the substrate, after a standard clean step wash, a high-density oxygen-cut sacrificial layer is deposited on the ruthenium substrate by ion-assisted plasma chemical vapor deposition (ICPCVD). The chrome/gold is then plated on the sacrificial layer using Lift. technology (the coil film 522 is defined), and then the layer of polyfluorene is applied to complete the fabrication of the diaphragm 521. The response unit 52; then, using the sputtering and electroplating techniques, the first and second base blocks 511 and 512 are formed upward from the diaphragm 521 to form the frame unit 51. Finally, the sacrificial layer is etched away to directly directly mount the microphone chip. 5 Separating from the substrate, obtaining the microphone chip 5' and then packaging the dynamic microphone 2. Of course, the diaphragm 521 of the microphone chip 5 is not limited to a flat 11 In order to more effectively improve the frequency response characteristic, the cross section of the vibration region 523 of the diaphragm 521 can also be in a continuous bending state - this injury technique only needs to first define a corresponding image on the substrate. , can be deposited in the layer of tantalum nitride, defined After the image of the tantalum nitride layer is formed, the diaphragm 521' of the same pattern is obtained correspondingly. For example, the structure of the frame unit 51 may be formed into a circular pattern or a plurality of intervals depending on actual needs. As a result of the above description, the present invention is mainly based on the principle of acoustic-electrical conversion of a moving coil microphone, applying a semiconductor process and a microelectromechanical technology. Designing and manufacturing 10 to form a microphone chip 5 which is packaged in the casing 3 together with the magnetic component 4 to form a moving coil microphone 2; since the microphone wafer 5 made by applying a semiconductor process and a microelectromechanical technique can be greatly reduced, for example, the thickness The length, width, weight and other component dimensions can effectively reduce and miniaturize the diaphragm 521 and the voice coil film 522 of the response unit 52, improve the shortcoming of signal attenuation at high and low frequencies, and completely enhance the dynamic microphone 2 Frequency response characteristics, at the same time, can also adapt to the trend of light, thin, short, and small development of electrical products using microphones. The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are It is still within the scope of the present invention. [Simplified Schematic] FIG. 1 is a top plan view illustrating a conventional moving coil microphone. FIG. 2 is a cross-sectional view showing a microphone chip of the present invention. FIG. 3 is a top view of the microphone chip and the moving coil microphone of FIG. 2; and FIG. 4 is a partial cross-sectional view showing the vibrating medium of the microphone chip of FIG. Another aspect. 1328973
【主要元件符號說明】 1 動圈式麥克風 5 麥克風晶片 11 殼座 51 框架單元 12 磁力組件 511 第一基塊 13 振膜 512 第二基塊 14 音圈 513 振動空間 2 動圈式麥克風 52 響應單元 3 殼座 521 振膜 31 底壁 521， 振膜 32 周壁 522 音圈膜 33 頂壁 523 振動區域 331 韌膜部 524 固定區域 34 封裝空間 525 第一音圈段 4 磁力組件 526 第二音圈段 41 磁鐵塊 42 導磁軛塊 12[Main component symbol description] 1 Moving coil microphone 5 Microphone chip 11 Housing 51 Frame unit 12 Magnetic component 511 First base block 13 Diaphragm 512 Second base block 14 Voice coil 513 Vibration space 2 Moving coil microphone 52 Response unit 3 housing 521 diaphragm 31 bottom wall 521, diaphragm 32 peripheral wall 522 voice coil film 33 top wall 523 vibration area 331 tough film portion 524 fixed area 34 packaging space 525 first voice coil section 4 magnetic component 526 second voice coil section 41 magnet block 42 yoke block 12