CN212435927U - Miniature microphone - Google Patents
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- CN212435927U CN212435927U CN202021197828.8U CN202021197828U CN212435927U CN 212435927 U CN212435927 U CN 212435927U CN 202021197828 U CN202021197828 U CN 202021197828U CN 212435927 U CN212435927 U CN 212435927U
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Abstract
Disclosed is a miniature microphone, including: a substrate comprising a first cavity; a first sacrificial layer on the substrate, the first sacrificial layer including a second cavity; at least one part of the vibration film layer is supported by the first sacrificial layer, and the vibration film layer positioned above the second cavity forms a vibration diaphragm; the second sacrificial layer is positioned on the vibrating membrane layer and comprises a third cavity; the back plate layer is positioned on the second sacrificial layer, at least one part of the back plate layer is supported by the second sacrificial layer, the back plate layer positioned above the third cavity forms a back plate, and the back plate comprises at least one sound hole; wherein the size of the third cavity is smaller than that of the first cavity. The utility model discloses miniature microphone has reduced parasitic capacitance, has solved the process deviation and has caused the problem of adverse effect to the device performance.
Description
Technical Field
The utility model relates to a MEMS technical field, in particular to miniature microphone.
Background
With the development of micro-processing technology, the miniature microphone is more miniaturized, wherein the distance between the diaphragm and the back plate of the miniature microphone is less than 1.5um, for example, and the process requirements in the manufacturing and application processes of the miniature microphone are also higher. The structural defects introduced by the process deviation not only affect the product yield of the microphone, but also cause the performance of the miniature microphone in the application environment to be sharply deteriorated. In addition, the capacitance change of the miniature microphone caused by the vibration of the diaphragm due to the air vibration generated by the sound signal includes not only an effective portion but also an ineffective portion, and the ineffective capacitance component may generate an unfavorable parasitic capacitance. Further improvements in the structure of the miniature microphone are expected to reduce parasitic capacitance and suppress adverse effects of process variations in deep trench etching and etching of the sacrificial layer on device performance, to improve yield and uniformity of mass production, and sensitivity of the miniature microphone.
SUMMERY OF THE UTILITY MODEL
In view of the above problems, an object of the present invention is to provide a micro microphone, which reduces parasitic capacitance and solves the problem of adverse effect on device performance caused by process deviation of deep trench etching and sacrificial layer corrosion.
According to the utility model discloses a first aspect provides a miniature microphone, include:
a substrate comprising a first cavity;
a first sacrificial layer on the substrate, the first sacrificial layer comprising a second cavity;
a diaphragm layer, at least a portion of which is supported by the first sacrificial layer, the diaphragm layer above the second cavity forming a diaphragm;
the second sacrificial layer is positioned on the vibration film layer and comprises a third cavity;
a back plate layer on the second sacrificial layer, at least a portion of the back plate layer supported by the second sacrificial layer, the back plate layer above the third cavity forming a back plate, the back plate comprising at least one acoustic aperture;
wherein the size of the third cavity is smaller than the size of the first cavity.
Optionally, the size of the first cavity is smaller than the size of the second cavity.
Optionally, the miniature microphone further comprises:
and the first passivation layer is positioned between the vibration film layer and the back plate layer and surrounds the inner side wall of the second sacrificial layer.
Optionally, the miniature microphone further comprises:
a first electrode on the back plate layer and electrically connected to the back plate layer,
and the second electrode is positioned on the second sacrificial layer and is electrically connected with the vibration film layer through the opening of the second sacrificial layer.
Optionally, the miniature microphone further comprises:
and the second passivation layer is positioned on the back plate layer, covers the exposed second sacrificial layer and part of the back plate layer, and exposes the first electrode, the second electrode and the effective sound hole area on the back plate.
Optionally, the miniature microphone further comprises:
and the anti-adhesion layer is positioned on the second passivation layer, covers the exposed surface of the miniature microphone and exposes the first electrode and the second electrode.
Optionally, the material of the first sacrificial layer includes: silicon dioxide, the thickness of the first sacrificial layer comprising: 0.5 to 2 um.
Optionally, the material of the diaphragm layer includes: doped polycrystalline silicon, the thickness of the diaphragm layer includes: 0.3 to 1 um.
Optionally, the material of the second sacrificial layer includes: silicon dioxide, the thickness of the second sacrificial layer comprising: 1 to 4 um.
Optionally, the material of the first passivation layer comprises: one of silicon nitride, boron nitride and silicon carbide.
Optionally, the material of the back plate layer comprises: doped polysilicon, the thickness of the back plate layer comprising: 1 to 3 um.
Optionally, the material of the first electrode and the second electrode comprises: a metal, an alloy, a thickness of the first electrode and the second electrode comprising: 0.5 to 2 um.
Optionally, the material of the second passivation layer comprises: one of silicon nitride, boron nitride and silicon carbide.
Optionally, the material of the substrate comprises: single crystal silicon, the thickness of the substrate comprising: 300 to 400 um.
Optionally, the material of the anti-adhesion layer comprises: a self-assembled organic film, the anti-adhesion layer having a thickness comprising: 1 to 10 nm.
According to the embodiment of the present invention, a substrate includes a first cavity, a first sacrificial layer is disposed on the substrate, and the first sacrificial layer includes a second cavity; at least one part of the vibration film layer is supported by the first sacrificial layer, and the vibration film layer positioned above the second cavity forms a vibration diaphragm; the second sacrificial layer is positioned on the vibration film layer and comprises a third cavity; the back plate layer is located on the second sacrificial layer, at least one part of the back plate layer is supported by the second sacrificial layer, the back plate layer located above the third cavity forms a back plate, and the back plate comprises at least one sound hole. The first passivation layer is introduced between the vibrating membrane layer and the back plate layer, the second sacrificial layer material is corroded by using a semiconductor conventional process technology, the release of the structure is completed, the lateral corrosion is stopped at the introduced first passivation layer, the lateral corrosion depth of the second sacrificial layer material is effectively controlled, the effective vibration areas of the vibration diaphragms defined by the first passivation layer of each tube core among the wafers and in each tube core in the wafers are consistent in size, the performance consistency of the miniature microphone is improved, and the yield and the consistency of products in batch production (including the inside of the wafers and among different wafers) are further improved.
Among the first, second and third cavities, the third cavity is smallest in size. The size of the third cavity is smaller than the size of the second cavity. Preferably, the size of the third cavity is smaller than the size of the first cavity, and the size of the first cavity is smaller than the size of the second cavity. The residual quantity of the first sacrificial layer is smaller than that of the second sacrificial layer, the effective area (vibratile area) of the vibrating diaphragm is determined by the residual quantity (size of the third cavity) of the second sacrificial layer between the vibrating diaphragm layer and the back plate layer, and the influence of poor size uniformity of the first cavity formed by the substrate deep groove etching process is avoided, so that the vibratile areas of the vibrating diaphragm layers in the wafers and among the wafers are consistent in size, and the yield and the consistency of mass-produced products (including the wafers and among different wafers) are improved. In addition, since the remaining amount of the first sacrificial layer between the diaphragm layer and the substrate is small, there is a small parasitic capacitance, which improves the sensitivity of the miniature microphone.
Drawings
The above and other objects, features and advantages of the present invention will become more apparent from the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:
fig. 1 is a schematic structural view showing a micro microphone in the related art;
fig. 2 is a schematic structural diagram of a miniature microphone according to an embodiment of the present invention;
fig. 3 to 12 are sectional views of the manufacturing method of the miniature microphone according to the embodiment of the present invention at different stages.
Detailed Description
Various embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Like elements in the various figures are denoted by the same or similar reference numerals. For purposes of clarity, the various features in the drawings are not necessarily drawn to scale.
The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples.
Miniature microphones are acoustoelectric transducers fabricated based on MEMS technology. In recent years, the manufacturing process of the miniature microphone is rapidly developed, and the miniature microphone is widely applied to consumer electronics products such as TWS earphones, smart phones, smart sound boxes and notebook computers. The miniature microphone mainly includes: MEMS chips and IC chips. The MEMS chip is a vibration detecting device for converting an external sound signal into an electric signal, and the IC chip is for outputting the electric signal. Fig. 1 shows a schematic structural diagram of a micro microphone in the related art. As shown in fig. 1, a micro microphone 1000 in the related art includes: a substrate 1100, the substrate 1100 comprising a first cavity 1101; a first sacrificial layer 1200 on the substrate 1100, the first sacrificial layer 1200 including a second cavity 1201; a diaphragm layer 1300, at least a portion of the diaphragm layer 1300 being supported by the first sacrificial layer 1200, the diaphragm layer 1300 located above the second cavity 1201 forming a diaphragm; a second sacrificial layer 1400 on the diaphragm layer 1300, the second sacrificial layer 1400 including a third cavity 1401; a back plate layer 1600 located on the second sacrificial layer 1400, at least a portion of the back plate layer 1600 being supported by the second sacrificial layer 1400, the back plate layer 1600 located above the third cavity 1401 forming a back plate, the back plate comprising at least one acoustic aperture 1601; a first electrode 1701 on the back plate layer 1600 and electrically connected to the back plate layer 1600; a second electrode 1702 located on the second sacrificial layer 1400 and electrically connected to the diaphragm layer 1300 through the opening of the second sacrificial layer 1400; a second passivation layer 1800 on the back plate layer 1600 covering the exposed second sacrificial layer 1400 and a portion of the back plate layer 1600 exposing the first electrode 1701, the second electrode 1702 and the effective acoustic hole area on the back plate. The size of the third cavity 1401 is larger than the size of the second cavity 1201 and the size of the second cavity 1201 is larger than the size of the first cavity 1101.
The vibrating diaphragm and the back plate form a variable capacitor, external sound pressure acts on the vibrating diaphragm to cause the vibrating diaphragm to vibrate, so that the capacitance of the vibrating diaphragm is changed, the potential between the vibrating diaphragm and the back plate is further changed, and the conversion of a sound pressure signal and an electric signal is realized. Since the size of the third cavity 1401 is larger than the size of the second cavity 1201, and the size of the second cavity 1201 is larger than the size of the first cavity 1101, that is, the remaining amount of the first sacrificial layer 1200 is larger than the remaining amount of the second sacrificial layer 1400, the effective area (vibratable region) of the vibration diaphragm is determined by the remaining amount of the first sacrificial layer 1200 (the size of the second cavity 1201) between the diaphragm layer 1300 and the substrate 1100. The residual amount of the first sacrificial layer 1200 below the diaphragm layer 1300 is affected by the poor size uniformity of the first cavity 1101 obtained by etching the deep groove of the substrate 1100, so that the vibratable areas of the diaphragm layer 1300 are different in size, and the uniformity and consistency in and among the wafers are poor, thereby causing the performance of the miniature microphone to fluctuate. In addition, the remaining amount of the first sacrificial layer 1200 between the diaphragm layer 1300 and the substrate 1100 is large, and there is also a large parasitic capacitance, which may reduce the sensitivity of the miniature microphone 1000.
In order to solve the above problem, embodiments of the present invention provide a miniature microphone, and the structure of the miniature microphone in embodiments of the present invention is described in detail below with reference to the accompanying drawings.
Fig. 2 shows a schematic structural diagram of a miniature microphone according to an embodiment of the present invention. As shown in fig. 2, the micro microphone 2000 in the embodiment of the present invention includes: a substrate 2100, the substrate 2100 comprising a first cavity 2101; the materials of the substrate 2100 include: the crystal orientation of the silicon single crystal is <100 >. The thickness of the substrate 2100 includes: 300 to 400 um. A first sacrificial layer 2200 on the substrate 2100, the first sacrificial layer 2200 including a second cavity 2201; the material of the first sacrificial layer 2200 includes: silicon dioxide, the thickness of the first sacrificial layer 2200 includes: 0.5 to 2 um. A vibration film layer 2300, at least a portion of the vibration film layer 2300 being supported by the first sacrificial layer 2200, the vibration film layer 2300 located above the second cavity 2201 forming a vibration diaphragm; the material of the diaphragm layer 2300 includes: doped polysilicon, the thickness of the diaphragm layer 2300 includes: 0.3 to 1 um. The second sacrificial layer 2400 is located on the diaphragm layer 2300, and the second sacrificial layer 2400 includes a third cavity 2401; the material of the second sacrificial layer 2400 includes: silicon dioxide, the thickness of the second sacrificial layer 2400 includes: 1 to 4 um. A back plate layer 2600 on the second sacrificial layer 2400, at least a portion of the back plate layer 2600 being supported by the second sacrificial layer 2400, the back plate layer 2600 over the third cavity 2401 forming a back plate comprising at least one sound hole 2601. Materials of the back plate layer 2600 include: doped polysilicon, the thickness of the back plate layer 2600 includes: 1 to 3 um. Of the first, second, and third cavities 2101, 2201, 2401, the third cavity 2401 is smallest in size. The size of the third cavity 2401 is smaller than the size of the second cavity 2201. Preferably, the size of the third cavity 2401 is smaller than the size of the first cavity 2101, and the size of the first cavity 2101 is smaller than the size of the second cavity 2201. It should be noted that the shapes of the first cavity 2101, the second cavity 2201 and the third cavity 2401 may be circular, square, etc., and when the first cavity 2101, the second cavity 2201 and the third cavity 2401 are circular, the stress distribution on the whole vibrating diaphragm is most uniform and balanced. The at least one sound hole 2601 communicates with the third cavity 2401.
The miniature microphone 2000 further includes: and a first passivation layer 2500 between the vibration film layer 2300 and the back plate layer 2600, the first passivation layer 2500 surrounding an inner sidewall of the second sacrificial layer 2400. The material of the first passivation layer 2500 includes: one of silicon nitride, boron nitride and silicon carbide. The first passivation layer 2500 serves to define an effective vibration region of the vibration diaphragm. A first electrode 2701 located on the back electrode plate layer 2600 and electrically connected to the back electrode plate layer 2600; the second electrode 2702 is located on the second sacrificial layer 2400, and is electrically connected to the diaphragm layer 2300 through the opening of the second sacrificial layer 2400. The materials of the first electrode 2701 and the second electrode 2702 include: metals and alloys. For example, the material of the first and second electrodes 2701 and 2702 can be Au, Al, aluminum silicon (Al-Si 1%), Ti + TiN + Al-Si, Cr + Au, or Ti + Pt + Au, etc. The thicknesses of the first electrode 2701 and the second electrode 2702 include: 0.5 to 2 um. A second passivation layer 2800, which is positioned on the back plate layer 2600, covers the exposed second sacrificial layer 2400 and a portion of the back plate layer 2600, exposing the first electrode 2701, the second electrode 2702, and the effective acoustic hole area on the back plate. The material of the second passivation layer 2800 includes: one of silicon nitride, boron nitride and silicon carbide. An anti-adhesion layer 2900 is disposed on the second passivation layer 2800 to cover the exposed surface of the micro microphone 2000 and expose the first and second electrodes 2701 and 2702. The materials of anti-adhesion layer 2900 include: the self-assembled organic film (SAM organic film) has characteristics such as hydrophobicity and low surface adhesion, and can reduce adhesion between the vibration film layer 2300 and the back plate layer 2600 due to moisture or the like, thereby improving device reliability. The thickness of anti-adhesion layer 2900 includes: 1 to 10nm, the thickness does not affect the wire bonding of subsequent products and the like.
Fig. 3 to 12 are sectional views of the manufacturing method of the miniature microphone according to the embodiment of the present invention at different stages. Referring to fig. 3 to 12, the method of manufacturing the micro microphone 2000 includes the following steps.
As shown in fig. 3, a substrate 2100 is provided, and a first sacrificial layer 2200 is formed on the substrate 2100 by a conventional semiconductor processing method such as thermal oxidation or Low Pressure Chemical Vapor Deposition (LPCVD) or Plasma Enhanced Chemical Vapor Deposition (PECVD). The material of the first sacrificial layer 2200 includes: silicon dioxide, the thickness of the first sacrificial layer 2200 includes: 0.5 to 2 um.
As shown in fig. 4, a diaphragm material is deposited on the first sacrificial layer 2200 by a conventional semiconductor process such as Low Pressure Chemical Vapor Deposition (LPCVD), and then patterned by photolithography and etching to form a diaphragm layer 2300. The vibration film layer 2300 covers a portion of the first sacrificial layer 2200. The material of the diaphragm layer 2300 includes: doped polysilicon, the thickness of the diaphragm layer 2300 includes: 0.3 to 1 um.
As shown in fig. 5, a second sacrificial layer material is deposited on the diaphragm layer 2300 by a conventional semiconductor process such as Low Pressure Chemical Vapor Deposition (LPCVD) or Plasma Enhanced Chemical Vapor Deposition (PECVD), and then patterned by photolithography and etching to form a second sacrificial layer 2400. The second sacrificial layer 2400 includes: the first opening 2402 and the second opening 2403, and the first opening 2402 and the second opening 2403 expose the diaphragm layer 2300. The material of the second sacrificial layer 2400 includes: silicon dioxide, the thickness of the second sacrificial layer 2400 includes: 1 to 4 um.
As shown in fig. 6, a first passivation layer material is deposited on the second sacrificial layer 2400 by using a conventional semiconductor process such as Low Pressure Chemical Vapor Deposition (LPCVD) or Plasma Enhanced Chemical Vapor Deposition (PECVD), and a first passivation layer 2500 is formed by using a Chemical Mechanical Polishing (CMP), a photolithography, an etching, and the like, and the first passivation layer 2500 fills the first opening 2402 and the second opening 2403. The material of the first passivation layer 2500 includes: one of silicon nitride, boron nitride and silicon carbide. The first passivation layer 2500 serves to define an effective vibration region of the vibration diaphragm.
As shown in fig. 7, a layer of back plate material is deposited on the second sacrificial layer 2400 by a semiconductor conventional process technique such as Low Pressure Chemical Vapor Deposition (LPCVD), and then patterned by a photolithography and etching process to form a back plate layer 2600, wherein the back plate layer 2600 includes at least one acoustic hole 2601. Materials of the back plate layer 2600 include: doped polysilicon, the thickness of the back plate layer 2600 includes: 1 to 3 um.
As shown in fig. 8, the second sacrificial layer 2400 is patterned by photolithography and etching processes to form a third opening (corresponding to the position of the second electrode 2702), which serves as a wire hole window of the second electrode 2702. Then, an electrode material is deposited on the back plate layer 2600 by a conventional semiconductor process such as sputtering or evaporation, and then patterned by photolithography and etching to form a first electrode 2701 on the back plate layer 2600 and a second electrode 2702 on the second sacrificial layer 2400. The first electrode 2701 is electrically connected to the back plate layer 2600, and the second electrode 2702 is electrically connected to the vibration film layer 2300 through the third opening of the second sacrificial layer 2400. The materials of the first electrode 2701 and the second electrode 2702 include: metals and alloys. For example, the material of the first and second electrodes 2701 and 2702 can be Au, Al, aluminum silicon (Al-Si 1%), Ti + TiN + Al-Si, Cr + Au, or Ti + Pt + Au, etc. The thicknesses of the first electrode 2701 and the second electrode 2702 include: 0.5 to 2 um.
As shown in fig. 9, a second passivation layer material is deposited on the back plate layer 2600 by using a conventional semiconductor process such as Low Pressure Chemical Vapor Deposition (LPCVD) or Plasma Enhanced Chemical Vapor Deposition (PECVD), and then patterned by using photolithography and etching processes to form a second passivation layer 2800, wherein the second passivation layer 2800 covers a portion of the second sacrificial layer 2400 and a portion of the back plate layer 2600, exposing the first electrode 2701, the second electrode 2702, and the effective acoustic hole region on the back plate. The material of the second passivation layer 2800 includes: one of silicon nitride, boron nitride and silicon carbide.
As shown in fig. 10, a first cavity 2101 is formed in a substrate 2100. The thickness of the substrate 2100 is thinned to a design value by conventional semiconductor CMP or thinning process. Then, the silicon substrate 2100 is etched from the back side by a conventional semiconductor process such as double-sided lithography and deep trench etching until the first sacrificial layer 2200 is automatically detected and terminated, thereby forming a first cavity 2101 in the substrate 2100. The first cavity 2101 has a size larger than the effective vibration area of the vibration diaphragm defined by the first passivation layer 2500.
As shown in fig. 11, the first sacrificial layer 2200 is etched through the first cavity 2101 to form a second cavity 2201 in the first sacrificial layer 2200 by using a semiconductor conventional process technique such as selective wet etching HF acid or BOE solution or vapor phase etching, at least a portion of the diaphragm layer 2300 is supported by the first sacrificial layer 2200, and the diaphragm layer 2300 above the second cavity 2201 forms a diaphragm. And etching the second sacrificial layer 2400 through the at least one sound hole 2601 of the back plate layer 2600 by using a semiconductor conventional process technology such as selective wet etching HF acid or BOE solution or vapor phase etching to form a third cavity 2401 in the second sacrificial layer 2400, wherein at least a portion of the back plate layer 2600 is supported by the second sacrificial layer 2400, the back plate layer 2600 over the third cavity 2401 forms a back plate, and the at least one sound hole 2601 is located in the back plate. The third cavity 2401 communicates with the at least one sound hole 2601. Of the first, second, and third cavities 2101, 2201, 2401, the third cavity 2401 is smallest in size. The size of the third cavity 2401 is smaller than the size of the second cavity 2201. Preferably, the size of the third cavity 2401 is smaller than the size of the first cavity 2101, and the size of the first cavity 2101 is smaller than the size of the second cavity 2201. That is, the remaining amount of the first sacrificial layer 2200 is smaller than the remaining amount of the second sacrificial layer 2400, and the effective area (vibratable region) of the vibration diaphragm is determined by the remaining amount of the second sacrificial layer 2400 (the size of the third cavity 2401) between the diaphragm layer 2300 and the back plate layer 2600, without being affected by the poor uniformity of the size of the first cavity 2101 formed by the deep trench etching process of the substrate 2100, so that the vibratable regions of the diaphragm layer 2300 inside a wafer and between wafers are uniform, the performance stability of the micro microphone is improved, and the parasitic capacitance between the diaphragm layer 2300 and the substrate 2100 can be reduced.
As shown in fig. 12, an anti-adhesive layer 2900 is formed on the second passivation layer 2800 by a semiconductor conventional process method, and the anti-adhesive layer 2900 covers an exposed surface of the micro microphone 2000 and exposes the first and second electrodes 2701 and 2702. The materials of anti-adhesion layer 2900 include: the self-assembled organic film (SAM organic film) has characteristics such as hydrophobicity and low surface adhesion, and can reduce adhesion between the vibration film layer 2300 and the back plate layer 2600 due to moisture or the like, thereby improving device reliability. The thickness of anti-adhesion layer 2900 includes: 1 to 10nm, the thickness does not affect the wire bonding of subsequent products and the like.
According to the embodiment of the present invention, a substrate includes a first cavity, a first sacrificial layer is disposed on the substrate, and the first sacrificial layer includes a second cavity; at least one part of the vibration film layer is supported by the first sacrificial layer, and the vibration film layer positioned above the second cavity forms a vibration diaphragm; the second sacrificial layer is positioned on the vibration film layer and comprises a third cavity; the back plate layer is located on the second sacrificial layer, at least one part of the back plate layer is supported by the second sacrificial layer, the back plate layer located above the third cavity forms a back plate, and the back plate comprises at least one sound hole. The first passivation layer is introduced between the vibrating membrane layer and the back plate layer, the second sacrificial layer material is corroded by using a semiconductor conventional process technology, the release of the structure is completed, the lateral corrosion is stopped at the introduced first passivation layer, the lateral corrosion depth of the second sacrificial layer material is effectively controlled, the effective vibration areas of the vibration diaphragms defined by the first passivation layer of each tube core among the wafers and in each tube core in the wafers are consistent in size, the performance consistency of the miniature microphone is improved, and the yield and the consistency of products in batch production (including the inside of the wafers and among different wafers) are further improved.
Among the first, second and third cavities, the third cavity is smallest in size. The size of the third cavity is smaller than the size of the second cavity. Preferably, the size of the third cavity is smaller than the size of the first cavity, and the size of the first cavity is smaller than the size of the second cavity. The residual quantity of the first sacrificial layer is smaller than that of the second sacrificial layer, the effective area (vibratile area) of the vibrating diaphragm is determined by the residual quantity (size of the third cavity) of the second sacrificial layer between the vibrating diaphragm layer and the back plate layer, and the influence of poor size uniformity of the first cavity formed by the substrate deep groove etching process is avoided, so that the vibratile areas of the vibrating diaphragm layers in the wafers and among the wafers are consistent in size, and the yield and the consistency of mass-produced products (including the wafers and among different wafers) are improved. In addition, since the remaining amount of the first sacrificial layer between the diaphragm layer and the substrate is small, there is a small parasitic capacitance, which improves the sensitivity of the miniature microphone.
In accordance with the embodiments of the present invention as set forth above, these embodiments are not exhaustive and do not limit the invention to the precise embodiments described. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical application, to thereby enable others skilled in the art to best utilize the invention and its various embodiments with various modifications as are suited to the particular use contemplated. The present invention is limited only by the claims and their full scope and equivalents.
Claims (15)
1. A miniature microphone, comprising:
a substrate comprising a first cavity;
a first sacrificial layer on the substrate, the first sacrificial layer comprising a second cavity;
a diaphragm layer, at least a portion of which is supported by the first sacrificial layer, the diaphragm layer above the second cavity forming a diaphragm;
the second sacrificial layer is positioned on the vibration film layer and comprises a third cavity;
a back plate layer on the second sacrificial layer, at least a portion of the back plate layer supported by the second sacrificial layer, the back plate layer above the third cavity forming a back plate, the back plate comprising at least one acoustic aperture;
wherein the size of the third cavity is smaller than the size of the first cavity.
2. The miniature microphone of claim 1, wherein the size of said first cavity is smaller than the size of said second cavity.
3. The miniature microphone of claim 1, further comprising:
and the first passivation layer is positioned between the vibration film layer and the back plate layer and surrounds the inner side wall of the second sacrificial layer.
4. The miniature microphone of claim 1, further comprising:
a first electrode on the back plate layer and electrically connected to the back plate layer,
and the second electrode is positioned on the second sacrificial layer and is electrically connected with the vibration film layer through the opening of the second sacrificial layer.
5. The miniature microphone of claim 4, further comprising:
and the second passivation layer is positioned on the back plate layer, covers the exposed second sacrificial layer and part of the back plate layer, and exposes the first electrode, the second electrode and the effective sound hole area on the back plate.
6. The miniature microphone of claim 5, further comprising:
and the anti-adhesion layer is positioned on the second passivation layer, covers the exposed surface of the miniature microphone and exposes the first electrode and the second electrode.
7. The miniature microphone of claim 1, wherein the material of the first sacrificial layer comprises: silicon dioxide, the thickness of the first sacrificial layer comprising: 0.5 to 2 um.
8. The miniature microphone of claim 1, wherein the diaphragm layer comprises a material comprising: doped polycrystalline silicon, the thickness of the diaphragm layer includes: 0.3 to 1 um.
9. The miniature microphone of claim 1, wherein the material of the second sacrificial layer comprises: silicon dioxide, the thickness of the second sacrificial layer comprising: 1 to 4 um.
10. The miniature microphone of claim 3, wherein the material of the first passivation layer comprises: one of silicon nitride, boron nitride and silicon carbide.
11. The miniature microphone of claim 1, wherein the material of the backplate layer comprises: doped polysilicon, the thickness of the back plate layer comprising: 1 to 3 um.
12. The miniature microphone of claim 4, wherein the material of the first electrode and the second electrode comprises: a metal, an alloy, a thickness of the first electrode and the second electrode comprising: 0.5 to 2 um.
13. The miniature microphone of claim 5, wherein the material of the second passivation layer comprises: one of silicon nitride, boron nitride and silicon carbide.
14. The miniature microphone of claim 1, wherein the substrate comprises a material comprising: single crystal silicon, the thickness of the substrate comprising: 300 to 400 um.
15. The miniature microphone of claim 6, wherein the anti-adhesion layer comprises: a self-assembled organic film, the anti-adhesion layer having a thickness comprising: 1 to 10 nm.
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| CN202021197828.8U CN212435927U (en) | 2020-06-24 | 2020-06-24 | Miniature microphone |
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| CN202021197828.8U CN212435927U (en) | 2020-06-24 | 2020-06-24 | Miniature microphone |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113259821A (en) * | 2021-06-17 | 2021-08-13 | 中芯集成电路制造(绍兴)有限公司 | Microphone and method for manufacturing the same |
| CN113613151A (en) * | 2021-07-30 | 2021-11-05 | 歌尔微电子股份有限公司 | Micro-electro-mechanical system microphone, microphone monomer and electronic equipment |
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2020
- 2020-06-24 CN CN202021197828.8U patent/CN212435927U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113259821A (en) * | 2021-06-17 | 2021-08-13 | 中芯集成电路制造(绍兴)有限公司 | Microphone and method for manufacturing the same |
| CN113613151A (en) * | 2021-07-30 | 2021-11-05 | 歌尔微电子股份有限公司 | Micro-electro-mechanical system microphone, microphone monomer and electronic equipment |
| CN113613151B (en) * | 2021-07-30 | 2023-08-04 | 歌尔微电子股份有限公司 | Micro-electromechanical system microphone, microphone unit and electronic equipment |
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