TWI328699B - Method for manufacturing flat panel display and external mechanical polishing apparatus of glass substrate for flat panel display - Google Patents

Method for manufacturing flat panel display and external mechanical polishing apparatus of glass substrate for flat panel display Download PDF

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TWI328699B
TWI328699B TW95101796A TW95101796A TWI328699B TW I328699 B TWI328699 B TW I328699B TW 95101796 A TW95101796 A TW 95101796A TW 95101796 A TW95101796 A TW 95101796A TW I328699 B TWI328699 B TW I328699B
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Taiwan
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substrate
eluate
outside
nozzle
glass substrate
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TW95101796A
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Chinese (zh)
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Shintaro Yanagisawa
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Global Display Co Ltd
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1328699 六、發明說明: 【發明所屬之技術領域】 本發明係有關液晶顯示器或電漿顯示器、有 機電激發光顯示器等平面顯示器(以下稱為FPD ) r 的製造。 【先前技術】 φ 液晶顯示器或電漿顯示器等平面顯示器(Flat panel display, FPD ),係廣泛使用於電腦顯示裝置或 TV受像器用、行動電話顯示部用等各種電子機 器。最近還進行有為了自發光而不需背光之高速 反應性優良的有機EL顯示器開發,且未來受到 期望。 此種FPD所要求的課題之一,就是薄型化。 % 薄型化是伴隨其所裝載之電子機器之薄型化或 小型化、輕量化而要求的。例如筆記型電腦或行 ' 動電話中,係要求更加薄型化或輕量化,隨之FPD • 也要求更薄更輕量。 作為FPD之薄型化或輕量化的重要要素,係 玻璃基板。不論液晶顯示器、電聚顯示器、或是 有機EL顯示器,都採用黏貼一對基板,在其内 面配置元件電極的構造。玻璃比重較重,又有確" 3 1328699 保機械性強度之必要性,故必須有一定程度的厚 度。從而,玻璃基板之存在對於FPD之薄型化或 幸至量化會造成阻礙。 許多FPD製造工程中,係採用從較大之一對 玻璃基板中生產多數FPD的工法。一對玻璃基 板’係區分為所生產之各FPD用途’於各區域分 別形成元件電極。在黏貼等工程結束之後,一對 玻璃基板會被切割為各區域,而進入修飾工程。 此種從一對玻璃基板產生多數FPD之工法, 因為進行工程之極簡化而有可降低製造成本的 優點,但是有玻璃基板變大的傾向。例如液晶顯 示器之製造製程中,係使用2000mmxl800mm左右 大小的玻璃基板。處理這麼大的玻璃基板時,若 玻璃基板太薄,則容易斷裂,或因為本身重量而 折彎。從而必須有一定程度的厚度。 另一方面,切斷為各區域之後者(半成品) 或成為成品者’即使玻璃基板薄到一個程度,也 因為尺寸較小而沒有問題。從這點來看,曰本特 開平5 - 2 4 9 4 2 2號公報的發明中,係採用在進行 一對玻璃基板之黏貼後,蝕刻一邊之玻璃基板外 面來打薄’之後切斷為各區域的工法。 4 1328699 【發明内容】 發明所欲解決之課題 上述么報中’有關打薄外面時之姓刻,幾乎 沒有揭7F具體内容。亦即雖然說明蝕刻是以浸泡 法進行,但是使用何種蝕刻液、浸泡多久時間 等,完全沒有具體說明。從而上述公報之揭示内 谷中,即使業者具備實施能力,也難以實施該發 月又即使可以實施,就F P D之非常重要之要素 亦即平坦性的觀點來說,也判斷為難以確保充分 品質 ° ’係為了解決該課題而成 FPD薄型化之實用技術的技 本申請案之發明 者,具有提供可達成 術性意義。 用以解決課題之手段 解决上述課題,本申請案之申請專利 圍第1項所記載的發明,係一種平面顯示器之 造方法,係包含· •於一方或雙方為玻璃基板 對基板中最少一方犯;+ α 方形成電極的電極形成工程, 於電極形成工程德妹 曼、,二由在、封材黏貼一對基板 密封内部的密封工 .._ ^ ^ ^ 私,和在岔封工程之後將玻 基板亦即一方或雔 ^ —雙方之基板外面加以機械性 磨來打薄的外面播Ρ 機械研磨工程;其中上述外面 5 1328699 有 將 溶 出 液 , 向 著 上 述 外 面 所 造 成 之 加 速 度 還 要 大 述 外 面 喷 出 並 衝 擊 上 述 射 中 係 使 上 述 外 面 成 述 基 板 並 ^— 邊 使 上 述 溶 出 液 之 噴 嘴 做 相 對 機 溶 出 上 述 外 面 利 用 溶 用 5 來 加 以 研 磨 的 構 造 又 為 了 解 決 上 述 所 記 載 的 發 明 5 係 針 對 之 方 法 具 有 上 述 溶 出 又 為 了 解 決 上 述 課 所 記 栽 的 發 明 9 係 針 對 之 方 法 9 具 有 上 述 溶 出 的 壓 力 9 係 0. 5kg/cm2〜 又 為 了 解 決 上 述 課 所 記 載 的 發 明 9 係 針 對 之 方 法 具 有 將 上 述 黏 方 外 面 > 同 時 加 以 機 械 又 為 了 解 決 上 述 課 溶出上述玻璃基板外面之 嘴射,附加有比本身重量 之加速度,使溶出液往上 外面’其中,在溶出液喷 為垂直姿勢地,來保持上 —方或雙方之基板對噴射 械性移動,一邊以溶出液 出液造成之衝擊的物理作 0 題’申請專利範圍第2項 上述申請專利範圍第1項 液係氟酸的構造。 題’申請專利範圍第3項 上述申請專利範圍第1項 液造成上述外面之衝擊時 3· 5kg/cm2 的範圍。 題’申請專利範圍第4項 上述申請專利範圍第1項 合後之一對玻璃基板的雙 研磨,將整體厚度變薄。 題’申請專利範圍第5項 1328699 所記載的發明,係針對上述申請專利範圍第丨項 之方法,具有在研磨開始時,從上述噴嘴之喷射 孔到上述基板外面為止的距離,係5mm以上1〇〇_ 以下。 又為了解決上述課題,申請專利範圍第6項 所記載的發明’係針對上述申請專利範圍第i項 之方法,具有各噴射孔係以等間隔來複數設置, 且從各噴射孔到上述外面為止之距離是一定的 構造。 “又為了解決上述課題’申請專利範圍第7項 所δ己載的發明’係一種外面機械研磨裝置,係將 I面顯示器用之玻璃基板外面做機械研磨來打 缚;其具有一種構造:具備在内部進行外面機械 研磨處理之處理室,和將上述玻璃基板保持於處 理室内特定位置之基板保持具’和具有將溶出上 述外面之材料之溶出液、 向者被上述基板保持具 :持之上逃玻璃基板之該外面喷射之噴射孔的 Π上::’…板保持具,係在溶出液嘴: 者,二=成為垂直姿勢地’來保持上述基板 节’和對噴嘴供仏、交 ,.口,合出液的溶出液供給系統. 述溶出液供給系絲,仫> '·' 係Μ附加有比本身重量所诰 成之加速度還1 + ^ 定要大的加速度之溶出液 [ 7 U28699 面喷出並衝擊上述外面,而可利 〜用衝擊造成之物 理作用來加以研磨的壓力,來對上述喷嘴供給溶 出液者;更且,具備使被喷射溶出液之上述二冷 或雙方之基板,對喷嘴之噴射孔做機械性相: 動的移動機構。 又為了解決上述課題,申請專利範圍第 所記載的發明,係針對上述申請專利範圍第了項 之構造:具有上述溶出液係氟酸的構造。 又為了解決上述課題,士主 申μ專利範圍第9項 所圯载的發明,係針_ i 、 之槿造,且古。 请專利範圍第7項 "- 述溶出液供給系統,係使上述溶 出液從上述噴嘴之噴射 ,„ 7 2 ~ 噴射孔被噴射,以0.5kg/cm、 3. 5kg/cm範圍之壓 地,t^楚力衝擊上述玻璃基板外面 地’對上述噴嘴供给 + 、σ上迷〉谷出液的構造。 又為了解決上述 項所記載的發明,係針申請專利範圍第 項之構造,具有上过^十上述申請專利範圍第7 璃基板的雙方外面ΠΓ可將黏合後之一對破 被基板保持具所保一 ^ 構造。 對玻璃基板的兩側的 又為了解決上述 項所記載的發明,係I靖,·申請專利範圍第11 ' 對上述申請專利範圍第7 8 1328699 -項之構造’具有在研磨開始時,從上述 射孔到上述玻璃基板外面為止的距離, 上1 OOmm以下的構造。 • 又為了解決上述課題,申請專利聋 .項所記载的發明,係針對上述申請專利 項之構造’纟有各喷射孔係以等間隔 置,且從各噴射孔到上述外面為止之距 的構造。 發明效果 如以下所說明,若依本申請案之申 圍第1項或第7項所記載的發明,則除 給新的(沒有溶入外面之材料)溶出液 在溶出液噴射中’係使外面成為垂直姿 持基板,溶入有外面材料之溶出液也會 連續流出,故可進行效率佳且平均性 磨°即使是外面申玻璃成分或結晶狀態 場所’因為並用有物理作用,故可充分 行研磨。因此研磨後之外面平坦性可提 所生產之FPD之顯示性能也高者。 又若依本申請案之申請專利範圍第 9項所記載的發明,則除了上述效果之 噴嘴之噴 係 5 m m以 i圍第11 範圍第7 來複數設 離是一定 請專利範 了連續供 之外,且 勢地來保 因衝擊而 優良的研 不平均的 平均地進 局,成為 3項或第 外,因為1 9 1328699 以溶出液衝擊上述外面時之壓力為 〇^kg/cm2〜3.5kg/cm2的範圍,故可充分供給新溶 出液來進行研磨,同時也可充分利用物理作用, t即使是外面t玻璃成分或結晶狀態不平均的 %所,亦可充分研磨,而更確保較高平坦性。 又若依申請專利範圍第4項或第丨〇項所呓 載的發明’則除了上述效果之外,因為將黏合後 之一對玻璃基板的雙方外面同時加以機械研 磨,將整體厚度變薄,故除了可對點貼面板之薄 型化帶來貢獻之外,製程生產性也較高。 又右依申請專利範圍第5項或第丨1項所記 載的發明,則除了上述效果之外,因為在研磨開 始時,從喷嘴之噴射孔到基板外面為止的距離係 5ππη以上丨00mm以下,故可確保衝擊之平均性(亦 即研磨平坦性),並可成為實用的製程。 又若依申請專利範圍第6項或第12項所記 載的發明,則除了上述效果之外,因為各喷射孔 係以等間隔來複數設置’且從各噴射孔到外面為 止之距離是一定的,故容易使所噴射之溶出液造 成的衝擊壓力平均,這點對平坦性較高之研磨處 理可帶來貢獻。 1328699 【實施方式】 以下,說明用以實絲大由▲太 π %本申请案發明的最佳方 式(以下稱為實施方式)。 以下之說明中,作太 • 作為FpD之一例,係採用液 晶顯示器(以下稱為L c D )。 第1圖係表示實施方式中FPD之製造方法概 略的圖。第1圖之方法,係例如行動電話用之lCD •製造方法。第1圖所示之方法,係包含:於雙方 為玻璃基板之一對基板丨中之一方,形成電極n 的電極形成工程;和於電極形成工程後經由密封 材1 2黏貼一對基板1,在内部注入液晶丨3後來 达封的岔封工程,和在密封工程之後,將雙方玻 璃基板1之外面加以機械性研磨來打薄的外面機 g 械研磨工程。 第1圖所示之製造方法中,係從幾乎相同形 狀大小之一對玻璃基板1來生產多數LCD。一拟 , 對 .坡填基板1,係區分為所生產之各LCD用涂 φ 处,而 電極形成等工程,則對個別區域進行。 電極形成工程,係包含ΙΤ〇等透明導電獏造 成的透明電極形成工程;和以電漿CVD法製作之 低溫多結晶矽膜等所造成的驅動電極或共通電 極形成工程。各工程中,係包含由曝光、顯影、[ 餘刻等所構成的光微影法工程。 有關另一邊之玻璃基板丨 光片形成工程。彩色遽光片c有彩色壤 基板1上形成著色層或黑 -,係於破鴇 程。著色層,係將彩色 ;透明電極等的工 案形成的工程;以光微影法'而之顏料以特定圖 進行。黑矩陣,传A 印刷法或電鍍法來 沿著像素邊界形忐 或防止混色’而 咬4俗成的遮光犋.夕 鍍形成。透明電極,係多數忤夕數情況下係以濺 濺錢來形成。 月;兄下為I T 0膜而以 选封工程中,係於一方 佈密封材12。密封材12, t璃基板1表面塗1328699 VI. Description of the Invention: [Technical Field] The present invention relates to the manufacture of a liquid crystal display or a plasma display, a flat panel display having an electromechanical excitation light display (hereinafter referred to as FPD) r. [Prior Art] A flat panel display (FPD) such as a liquid crystal display or a plasma display is widely used in various electronic devices such as a computer display device, a TV receiver, and a mobile phone display unit. Recently, an organic EL display having excellent high-speed reactivity for self-luminescence without backlighting has been developed, and is expected in the future. One of the problems required for such FPDs is thinning. % Thinning is required for thinning, miniaturization, and weight reduction of the electronic equipment to be mounted. For example, in a notebook computer or in a mobile phone, it is required to be thinner or lighter, and the FPD is also required to be thinner and lighter. An important element of thinning or lightening of FPD is a glass substrate. Regardless of the liquid crystal display, the electro-polymer display, or the organic EL display, a pair of substrates are bonded to each other, and the structure of the element electrodes is disposed inside. The glass has a heavier specific gravity and it is necessary to ensure the mechanical strength of the glass. Therefore, it must have a certain degree of thickness. Therefore, the presence of the glass substrate may hinder the thinning or fortunate quantification of the FPD. In many FPD manufacturing projects, the method of producing most FPDs from a larger pair of glass substrates is used. A pair of glass substrates 'are differentiated into the respective FPD uses produced' to form element electrodes in each region. After the end of the bonding process, a pair of glass substrates are cut into various areas and enter the finishing process. Such a method of generating a large number of FPDs from a pair of glass substrates has an advantage of being extremely simplified in engineering and having a reduced manufacturing cost, but the glass substrate tends to be large. For example, in the manufacturing process of a liquid crystal display, a glass substrate having a size of about 2000 mm x 800 mm is used. When such a large glass substrate is handled, if the glass substrate is too thin, it is easily broken or bent due to its own weight. Therefore, there must be a certain degree of thickness. On the other hand, if the glass substrate is thinned to the extent that the glass substrate is thinned to the extent that it is after each region (the semi-finished product), there is no problem because the size is small. From this point of view, in the invention of Japanese Laid-Open Patent Publication No. Hei No. 5 - 2 4 9 4 2 2, after the bonding of a pair of glass substrates is performed, the outer surface of the glass substrate is etched and thinned, and then cut into Construction methods in various regions. 4 1328699 [Summary of the Invention] Problem to be Solved by the Invention In the above-mentioned report, the name of the person who was thinning the outside was hardly revealed. That is, although the etching is described as being performed by the immersion method, the etching solution used and the immersion time are not specifically described. Therefore, in the disclosure of the above-mentioned publication, even if the manufacturer has the ability to implement, it is difficult to implement the month and even if it can be implemented, it is judged that it is difficult to ensure sufficient quality from the viewpoint of flatness, which is a very important factor of FPD. In order to solve this problem, the inventor of the present application, which is a practical technique for reducing the thickness of the FPD, has an operational significance. The invention described in the first aspect of the application of the present application is a method for fabricating a flat panel display, comprising: • one or both of the glass substrates are at least one of the substrates ; + α The formation of the electrode forming electrode, in the electrode formation engineering De Meiman, the second seal, the sealing material adhered to the inside of a pair of substrate seals.. _ ^ ^ ^ private, and after the seal project The glass substrate is also a mechanical polishing process in which the outer surface of the substrate is mechanically ground to be thinned on one side or the other side; wherein the outer surface 5 1328699 has the dissolution liquid, and the acceleration caused by the outer surface is further described outside. In order to solve the above-described invention, the fifth embodiment is directed to the above-described invention, in which the above-described substrate is ejected and the outer surface of the substrate is formed, and the nozzle of the eluate is dissolved in the outer surface. Method having the above dissolution In addition, in order to solve the invention described in the above-mentioned section, the method 9 has the pressure of the above-mentioned elution 9 system 0. 5kg/cm2~ In order to solve the invention described in the above section, the method has the above-mentioned sticking outer surface &gt At the same time, in order to solve the above-mentioned lessons, the nozzles on the outside of the glass substrate are dissolved, and the acceleration of the weight is added to make the eluate go up to the outside, and the eluate is sprayed in a vertical posture to maintain the upper side or The substrate of both the sides is mechanically moved, and the impact caused by the discharge of the eluate is the same as the problem of the application of the second paragraph of the above-mentioned patent application. Problem 'Applicable Patent Scope Item 3 of the above-mentioned patent application scope item 1 The range of 3·5kg/cm2 when the above-mentioned external impact is caused by the liquid. Title 'Applicable Patent Scope Item 4 The double-grinding of the glass substrate in one of the above-mentioned patent application scopes, the thickness of the whole is thinned. The invention of claim 5, wherein the distance from the injection hole of the nozzle to the outer surface of the substrate at the start of polishing is 5 mm or more. 〇〇_ below. In order to solve the above problems, the invention of claim 6 is directed to the method of item i of the above-mentioned patent application, wherein each of the injection holes is provided at equal intervals, and from each of the injection holes to the outer surface. The distance is a certain structure. "In order to solve the above problem, the invention of the invention of claim 7 is an external mechanical polishing device which is mechanically grounded outside the glass substrate for the I-side display; it has a structure: a processing chamber for performing external mechanical polishing treatment inside, and a substrate holder for holding the glass substrate at a specific position in the processing chamber and an eluate having a material for eluting the outer surface, and the holder is held by the substrate holder The upper surface of the blasting hole of the glass substrate is immersed on the ::: '...plate holder, which is in the eluent nozzle: 2, the vertical posture is 'to hold the above-mentioned substrate section' and to supply and exchange the nozzle. . The eluate supply system of the liquid mixture. The eluate supply wire, 仫> '·' is added to the eluate with an acceleration greater than the acceleration of its own weight. 7 U28699 The surface is ejected and impacted on the outside, and the pressure of the grinding is applied to the nozzle by the pressure of the physical action of the impact, and the eluate is supplied to the nozzle; The above-mentioned two-cold or both of the substrates of the eluate are mechanically moved to the injection holes of the nozzles. In order to solve the above problems, the invention described in the patent application is directed to the above-mentioned patent application. Structure: The structure having the above-mentioned eluent-based hydrofluoric acid. In order to solve the above-mentioned problems, the invention contained in the ninth article of the patent application of the syllabus is applied to the needle _i, and is ancient. 7 items "- The solution supply system is such that the above-mentioned eluate is ejected from the above nozzle, and the injection hole is sprayed to a pressure of 0.5 kg/cm, 3.5 kg/cm, t^chu The force impinges on the outside of the glass substrate to provide a structure in which the nozzles are supplied with + and σ. Further, in order to solve the invention described in the above item, the structure of the needle application patent item No. 1 has the outer surface of the seventh glass substrate of the above-mentioned application patent range, and one of the bonded substrates can be bonded to the substrate holder. Bao Yi ^ structure. In order to solve the invention described in the above paragraphs on the both sides of the glass substrate, the invention is in the form of the above-mentioned patent application No. 7 8 1328699 - the structure of the above-mentioned application, at the beginning of the grinding, from the above The distance from the perforation to the outside of the glass substrate is not more than 100 mm. In order to solve the above problems, the invention described in the patent application is directed to the structure of the above-mentioned patent application, wherein each of the injection holes is disposed at equal intervals and the distance from each of the injection holes to the outer surface is structure. Advantageous Effects of Invention As described below, according to the invention described in the first or seventh aspect of the present application, in addition to the new (material not dissolved in the outside material), the eluate is ejected in the eluate ejection. The outside is a vertical posture holding substrate, and the eluted solution in which the outer material is dissolved continuously flows out, so that the efficiency and the average grinding can be performed. Even if the outer glass component or the crystal state is used, it is sufficient because it has a physical effect. Row grinding. Therefore, the flatness of the outer surface after grinding can also improve the display performance of the produced FPD. In addition, according to the invention described in the ninth application of the present application, the nozzle of the nozzle of the above-mentioned effect is 5 mm, and the range of the 11th range is the seventh. In addition, it is the third or the first, because the pressure of the outer surface of the above-mentioned outer surface is 〇^kg/cm2~3.5kg. Since the range of /cm2 is sufficient, the new eluate can be sufficiently supplied for polishing, and the physical action can be fully utilized. Even if the outer t-glass component or the crystallized state is not evenly distributed, it can be sufficiently polished to ensure higher Flatness. In addition to the above effects, in addition to the above effects, one of the two sides of the glass substrate is mechanically ground at the same time, and the overall thickness is thinned. Therefore, in addition to contributing to the thinning of the point-and-stick panel, the process productivity is also high. In addition to the above-described effects, the distance from the injection hole of the nozzle to the outer surface of the substrate is 5ππη or more and 丨00 mm or less, in addition to the above effects, in the invention according to the fifth aspect of the invention. Therefore, the average impact (ie, the flatness of the polishing) can be ensured, and it can be a practical process. Further, according to the invention described in the sixth or the twelfth aspect of the patent application, in addition to the above effects, the respective injection holes are provided in plural at equal intervals and the distance from each of the injection holes to the outside is constant. Therefore, it is easy to average the impact pressure caused by the ejected eluate, which contributes to the polishing treatment with high flatness. 1328699 [Embodiment] Hereinafter, a preferred mode (hereinafter referred to as an embodiment) of the invention of the present application, which is large in size ▲ too π %, will be described. In the following description, as an example of FpD, a liquid crystal display (hereinafter referred to as L c D ) is used. Fig. 1 is a view showing an outline of a method of manufacturing an FPD in the embodiment. The method of Fig. 1 is, for example, a CD for a mobile phone. The method shown in FIG. 1 includes an electrode forming process in which one of the glass substrates is one of the substrate substrates and an electrode n is formed; and after the electrode forming process, the pair of substrates 1 are adhered via the sealing material 12, After the liquid crystal crucible 3 was internally injected, the sealing process was completed, and after the sealing process, the outer surfaces of the glass substrates 1 were mechanically ground to thin the outer machine. In the manufacturing method shown in Fig. 1, a majority of LCDs are produced from the glass substrate 1 from almost one of the same shape sizes. First, the sloping substrate 1 is divided into the φ where each LCD is produced, and the electrode formation is performed on individual regions. The electrode forming process is a transparent electrode forming process including a transparent conductive crucible such as germanium, and a driving electrode or a common electrode forming process by a low temperature polycrystalline germanium film produced by a plasma CVD method. In each project, it includes a light lithography method consisting of exposure, development, and [remaining time]. On the other side of the glass substrate 丨 light sheet forming project. The color grading sheet c has a colored soil. A color layer or a black layer is formed on the substrate 1, and is broken. The colored layer is a project in which a color, a transparent electrode, or the like is formed; the pigment in the photolithography method is carried out in a specific pattern. The black matrix is transmitted by A-printing or electroplating to form a pattern along the pixel boundary or to prevent color mixing. Transparent electrodes are formed by splashing money in most cases. Month; the brother is the I T 0 film and in the sealing project, the sealing material 12 is attached to one side. Sealing material 12, surface coating of t glass substrate 1

的輪廓,塗佈A^ 、/σ著所生產之各LCD 玉种馮週邊形狀。 内側係以特定量滴下曰乂费封材12包圍之 佈間隔物 為 、文日日1 3。之後配合必要來散 师間隔物,—邊對準另一 驭 用特定位置關係黏貼。▲板1 ’ -邊覆蓋而 其次’進行成為太音 、也方式之大特徵的外面 機械研磨工程。本實施方 妒 你攸 义之外面機械研磨工 転,係將洛出玻璃基板丨 从 卜面之溶出液L向著外 面噴射,糟此由本身重量 丄 β ^成之加速度來附加較 大加速度,使溶出液L往外 αο 、 卜面噴出來進行。另外’ 早純散佈溶出液L的話,、玄 办出液L就只有附加本 12 1328699 身重量造成之加速度,而與此不同。 另外本說明書中,將一對基板互相面對之面 稱為「内面」,與其相反側之面稱為「外面」。本 實施方式之外面機械研磨工程,係將黏貼之一對 玻璃基板(以下稱為黏貼面板1〇)之雙方外面加 以機械研磨的工程。所言胃「機械研磨」,係並備 利用所謂喷出壓力之溶出液物理作用的研磨,和 在研磨時使玻璃基板1做機械性移動等意義。所 謂「做機械性移動」,係「利用機械來移動」的 意思。另外,若與「削減」亦即「削去而減少厚 度」的用語作比較,則因為只要進行研磨就一定 會削去表面而減少厚度,故「研磨」為「削去」 之下位概念,此事自然明瞭。 如苐1圖所示,太音a 1Λ 本實轭方式中係保持黏貼面 在垂直站立,從配置於其兩側之喷嘴4喷 射溶出液L。作為溶出液l,# #用# / 、 ^ . 係使用鼠酸等強酸。 齓酸之情況下,係例如對 7不1uu稀釋為10〜50% 左右(體積百分比)央蚀田 … 比)來使用。衝擊壓力在黏貼面 板10之外面上為0.5kg/cm2〜3 5kg/cm2。 從喷嘴4所噴射之溶出液L所衝擊的外面, 會被溶出液L滚:醢,B1 ☆解’且糟由溶出液L之衝擊而流 外面做機械研磨,而打薄破璃基板厂 13 的厚度(也雜e h ι ’疋黏貼面板1整體 在機械研磨之H 度)。 之場所時mhL碰觸 蓋膠帶,當溶出二為蓋膠帶來預先保護。作為遮 或鐵氣龍“,:司強:時’可使用聚丙烤⑽) 耐酸性㈣,於背面塗佈脂之 者。例如日本日φ +數十_厗度之黏著劑 SPV-362M等。 』I造的 在上述外面機械研磨工程之後 進行洗淨外面之工程後,、也一 糸配合必要 程,係沿著所生產卩刀割工裎。分割工 產之各LCD輪廊,來知龄匕 板10的工程。 ㈣來切斷黏貼面 右依上述之本實施方式製造方法 1破璃基板外面之溶出…著外面切將:出 由本身重晋;it 4、 、射,藉此 k成之加速度來附加較大加The contour is coated with A^ and /σ around the shape of each LCD jade. The inner side is a cloth spacer surrounded by the specific amount of the sealing material 12, and the day and day are 13. Then use the necessary spacers to disperse the spacers, and align them with the other ones. ▲Plate 1 ′ - Covered by the side and then 'External mechanical polishing project that is characterized by being too loud and also a big feature. In this embodiment, the mechanical grinding machine outside the 攸 転 転 転 転 洛 洛 洛 洛 洛 洛 洛 洛 洛 洛 洛 洛 洛 洛 洛 机械 机械 机械 机械 机械 机械 机械 机械 机械 机械 机械 机械 机械 机械 机械 机械 机械 机械 机械 机械 机械 机械 机械 机械 机械 机械The eluate L is sprayed out to the outside αο and the surface. In addition, if the L is dissolved in the early pure, the liquid L is only added to the acceleration caused by the weight of the body 12 1328699, and is different. In the present specification, a surface on which a pair of substrates face each other is referred to as an "inner surface", and a surface on the opposite side is referred to as an "outer surface". In the outer surface mechanical polishing process of the present embodiment, the outer surface of one of the glass substrates (hereinafter referred to as the pasting panel 1) is mechanically polished. The "mechanical polishing" of the stomach is based on the polishing of the physical action of the eluate of the so-called discharge pressure, and the mechanical movement of the glass substrate 1 during polishing. The term "mechanical movement" means "moving by machine". In addition, if it is compared with the term "cutting", that is, "cutting and reducing the thickness", it is necessary to cut the surface and reduce the thickness as long as the polishing is performed. Therefore, "polishing" is the concept of "cutting". It is natural and clear. As shown in Fig. 1, the tones a 1 Λ in the yoke mode hold the adhesive surface in a vertical position, and the eluent L is ejected from the nozzles 4 disposed on both sides thereof. As the eluent l, ##用# / , ^ . A strong acid such as murine acid is used. In the case of citric acid, for example, it is used by diluting 7 to 1 uu to about 10 to 50% (volume percentage). The impact pressure is 0.5 kg/cm 2 to 3 5 kg/cm 2 on the outer surface of the adhesive sheet 10 . The outer surface that is ejected from the eluent L sprayed from the nozzle 4 is rolled by the eluent L: 醢, B1 ☆ solution 'and the bad flow is caused by the impact of the eluent L to mechanically grind outside, and the thin glass substrate factory 13 The thickness (also mixed eh ι '疋 pasted panel 1 overall in mechanical grinding H degree). At the location, mhL touches the cover tape, and when the dissolution is the cover tape, it is pre-protected. As a cover or iron gas dragon ",: strong: when 'can use polypropylene bake (10)) acid resistance (four), coated with grease on the back. For example, Japan Japan φ + tens of tens of degrees of adhesive SPV-362M and so on. After I cleaned the outside of the machine after the above-mentioned external mechanical grinding project, I also worked along the production process to cut the workmanship. (4) to cut the adhesive surface to the right according to the above-mentioned embodiment of the manufacturing method 1 dissolution of the outside of the glass substrate ... outside the cut will be: by itself re-emergence; it 4, shot, thereby k Acceleration to add a larger plus

L 溶出液L往外面噴出並衝擊外面 :又,L Eluent L is sprayed outside and hits the outside: Again,

造成之衝擊的物理作用來加以 液I 供給新溶出液丨夕& . 唧愿,故除了連續 出液L之外’溶入有外面 L也會因衝擊而連續流出,目此 :出液 平均性優良的研磨。即使是外 :率佳且 故 坦 曰曰狀心不平均的場所’因為並用有物理作用,、口 可充分平均地進行研磨。因此研磨後之外面平 性可提S,成為所生產 接著,說明適用於 研磨裝置。以下之說明 械研磨裝置的說明。 之顯示性能也高者。 上述製造方法的外面 ’也是實施方式之外 機械 面機The physical effect of the impact is to supply the liquid I to the new eluate. As a result, in addition to the continuous liquid L, 'the outside of the dissolved L will continue to flow out due to the impact, the purpose: the average of the liquid Excellent grinding. Even if it is a place where the rate is good and the situation is not uniform, the place can be polished on average evenly because of the physical effect. Therefore, the outer surface is flat after polishing, and S can be produced. Next, the description is applicable to the polishing apparatus. The following describes the description of the mechanical grinding device. The display performance is also high. The outer surface of the above manufacturing method is also an embodiment other than the mechanical machine

"係貝施方式之外面機械研磨裝置 正面概略圖,第3圖係第2圖所示之裝置的側: 剖面概略圖。帛2圖及第3圖所示之外面機 磨裝置’係、具備在内部進行外面機械研磨處理: 處理室2,和在處理室2内特定位置保持坡蹲: 板1的基板保持具3,和向著被基板保持具土 持之玻璃基板1外面、設置在喷射溶出液l ^ 置的喷嘴4’ #對噴嘴4供給溶出液L的溶出纩 供給系統5。本實施方式中,因為在黏貼後進"Besides the mechanical polishing device outside the Besch method. The front schematic view, Fig. 3 is the side of the device shown in Fig. 2: a schematic cross-sectional view. The outer surface grinding device shown in FIG. 2 and FIG. 3 is provided with an outer mechanical grinding process inside: the processing chamber 2, and the substrate holder 3 at a specific position in the processing chamber 2: the substrate holder 3 of the plate 1 The discharge enthalpy supply system 5 for supplying the eluted liquid L to the nozzle 4 is provided on the outer surface of the glass substrate 1 held by the substrate and the nozzle 4' which is provided to eject the eluate. In this embodiment, because after sticking

外面#刻,故基板保持具3會成為保持黏貼面: 1 0的構件。 處理室2中,係具備搬入黏貼面板1〇之掏 入口 2 1,和將外面機械研磨處理後黏貼面板 22,係以 封鎖閘2 3 之紙面垂 搬出的搬出口 22。搬入口 21及搬出σ 封鎖閘2 3來開關。另外’開關係藉由 在垂直於搬運方向的水平方向(第2圖 直方向)移動來進行。 此裝置, 係具備使被噴射溶出液 之玻璃基板 15 1328699 1,對噴嘴4之喷射孔做機械 嬙谣说也芬 佩性相對移動的移動 機構作為兼用此移動機構者,# & 入Ο 9 ! « μ 係叹置有透過搬 入口 21及搬出口 22搬運 椹qn u 黏貼基板1〇的搬運機 構3〇。基板保持具3,係設置為槿 ,,墙Α 直马構成搬運機構30 的構件。苐4圖’係第2 中其ku 罘d圖所不之裝置 甲暴板保持具3的立體概略圖。 如第4圖所示,基板保持 文勢之基底板31,和站立設置於基底板3ι之支 柱32’和安裝於支柱32的緩衝具…斤構成。 支柱32’係分別設置於細長長方形之基底板 31的邊角部份,總計設置4支。還讯 Λ , 又還6又置有沿著基 氏板31之長邊方向延伸的樑構件34,連接各支 柱32上端來補強基板支撐具3。各支柱32,高 度係比站立之黏貼面板10更高一點。基底板= 短邊之兩支支柱32的間隔,比黏貼基板ι〇的厚 度大一點。基底板31長邊之兩支支柱32的間 隔,比黏貼基板10的長度長一點。黏貼基板 係插入此等支柱32所形成之空間而被保持。 緩衝具3 3,係直接接觸黏貼面板1 〇 4攝件, 而不緊靠於黏貼基板1〇者。緩衝具33, 彳糸以對 於溶出液L不會被腐蝕(有耐藥品性)的材料來 形成,例如以鐵氟龍(Dupon公司註冊商標)等Outside #刻, the substrate holder 3 will become a member that maintains the adhesive surface: 10 . In the processing chamber 2, there is provided an inlet 21 for carrying in the adhesive panel 1 and a panel 22 which is mechanically polished and adhered to the panel 22, and is carried out by the paper opening of the blocking gate 2 3 . Move the inlet 21 and move out the σ blocking gate 2 to switch. Further, the 'opening relationship' is performed by moving in the horizontal direction (the straight direction of the second drawing) perpendicular to the conveyance direction. This device is provided with a moving mechanism that moves the injection hole of the nozzle 4 to the injection hole of the nozzle 4 and also moves relative to the injection hole as a moving mechanism. # & « μ 叹 搬运 搬运 搬运 搬运 搬运 〇 〇 〇 〇 〇 〇 〇 〇 〇 n n n n n n n n n n n n n n n n The substrate holder 3 is provided as a member, and the wall member constitutes a member of the transport mechanism 30.苐4图' is a three-dimensional schematic diagram of the violent plate holder 3 in the second ku 罘d diagram. As shown in Fig. 4, the base plate 31 holding the substrate and the support member 32' which is standing on the base plate 3i and the cushioning member attached to the support 32 are formed. The struts 32' are respectively provided at the corner portions of the elongated rectangular base plate 31, and a total of four are provided. Further, the yoke is further provided with a beam member 34 extending along the longitudinal direction of the base plate 31, and the upper ends of the respective posts 32 are connected to reinforce the substrate supporting member 3. Each of the struts 32 has a higher height than the standing adhesive panel 10. Base plate = the spacing of the two legs 32 of the short side is a little larger than the thickness of the adhesive substrate ι. The interval between the two legs 32 of the long side of the base plate 31 is a little longer than the length of the pasting substrate 10. The adhesive substrate is inserted into the space formed by the pillars 32 and held. The cushioning device 3 3 is in direct contact with the adhesive panel 1 〇 4 shots, and is not close to the adhesive substrate 1 . The cushioning device 33 is formed of a material that does not corrode (the chemical resistance) of the eluent L, for example, Teflon (registered trademark of Dupon Co., Ltd.), etc.

16 CD 丄jzooyy I糸樹脂來形成。 如第4圖所不’緩衝具33係由在基底板” 長邊方向兩蠕連接…32下蠕而設置者,和 一樣在長邊方向兩端連接支柱 來設置者所構成。被佯持 上端而設置者 此等… 貼基板1〇,係接觸 此4緩衝具33的各角部。接鯧机 硿# μ 接觸魏貼基板10之下 h角邛的下側緩衝且3 3 凹狀,县邊士 邊方向剖面形狀為 凹狀*邊方向剖面形狀為 基板10之上端角部的 者。接觸黏貼 ^ ΑιΙ ^ 欸衝具33,係短邊方 ° 形狀為橫向凹狀。如第4固 _ 目上而in 1 Λ 弟4圖所示’裝配黏 貼面板10時,係從上方 的凹部内。 洛在各緩衝具33 構所構成:運機構3〇 ’係例如有閂鎖與小齒輪機 者。搬運機構3〇構成為閃鎖基底板31, 从小齒輪3〇1 人 特定 ° 。小齒輪係沿著搬運線以 ]I^多數設置。小齒 室2内 】^輪301,係配置於處理 另外,適當設置有1 持具h h “ 有導弓丨移動之基板保 i體的導引構件。 如弟3圖所示,喰嘴4 呈3彳 、赁4係§又置於被基板保持 面板;〇Γ黏貼面板1〇兩側位置,可向著黏貼 係表示第二外面冋時噴射溶出液L。第5圖, 圖所示之噴嘴4之形狀的立體概略f 1328699 圖。 如第5圖所示,喷嘴4係具有喷射孔41的 管狀構件。如第5圖所示,喷嘴4係延伸於垂直 方向而配置,在黏貼面板 10之長邊方向(搬運 方向)以均等間隔複數並排設置。喷射孔41,係 設置於喷嘴4中面臨黏貼面板10的部分,在管 之延伸方向(垂直方向)以均等間隔設置。另外 作為喷嘴4之構造,有並排比第5圖所示還要更 多(或更少)者的情況,也有沿著水平方向或傾 斜方向並列複數喷嘴的情況。又喷嘴4不需要為 管狀,也可以是板狀或其他形狀。 溶出液供給系統5,係由貯存溶出液L之貯 液部51,和連接貯液部51與各喷嘴4之配管52, 和設置於配管52上之閥53或送液泵54等所構 成。從所供給之溶出液L中去除雜質或垃圾等的 過濾器或調壓用泵,則因應必要來設置。 溶出液L係藉由溶出液供給系統5對各喷嘴 4,從各喷射孔4 1向著被基板保持具3保持之黏 貼面板1 0的外面喷射。被喷射之溶出液L,會衝 擊溶解外面而研磨外面。 另外如第2圖所示,處理室2之底部成為漏 斗狀,而最下部設置有排出孔24。排出孔24係 18 1328699 連接有排出使用後之溶出液L的排出管25。如上 所述’溶入有黏貼面板1 〇之材料的溶出液L,會 落下到處理至2底部’透過排出孔24及排出管 2 5而被排出。 又處理室2之内壁面’或處理室2内各構件 之表面,係成為對溶出液L有耐藥品性的構造。 例如洛出液L為氟酸時,内壁面或各構件表面, 係成為塗佈覆蓋有鐵氟龍(Dupon公司註冊商標) 等亂系樹脂的構造。另外,開關搬入口 2 1或搬 出口 22的封鎖閘23,係不使溶出液l流出地來 進行封鎖。 ♦貝他万式之裝置,因為要更加提高機械研 磨後外面的平坦性,故對於噴嘴4構造要特別下 工夫。以下針對這點’使用帛5 明。第6圖,係声千…女‘ 水兄 in aL 係表不攸各噴射孔41對黏貼面板 10卜面平均噴出溶出 ★ 山狀L之點的概略圖。 如第5圖所示,各喰 y ^ ^ 噴射孔41係對於噴嘴4 之e延伸方向(垂直方命、 σ )為傾斜45度方向的 、.-田食。攸而,從么啥 # ^ 切孔41破噴射之溶出液L, 係如第5圖所示,在 你此順計方向擴耑 1328699 喷出的溶出液L。第6圖右側,係表示從黏貼面 板10高度方向看去,來自各喷射孔41之溶出液 L的喷射量分布。此時,面臨並通過上下相鄰之 兩個喷射孔4 1之正中間位置的外面上點P,會從 該相鄰之兩個喷射孔41接受溶出液L的供給。 此時,此點 P位於推拔狀之溶出液L的擴散端 部,故如第6圖右側所示,從一個喷射孔41接 受之溶出液L的量,係其他點之1/2左右,而用 上下相鄰之兩個喷射孔41來接收1個喷射孔4 1 份量的溶出液L供給。從而,在黏貼面板10之 高度方向,外面各點的溶出液L供給量是平均 的。另外,不只是以第5圖所示之剖面形狀來擴 散溶出液L的情況,也有用橢圓形、圓形、方形 (正方形、長方形)、菱形、平行四邊形狀等剖 面形狀來擴散溶出液L的情況。 其次,說明上述裝置的動作。 進行有上述密封工程而完成後的黏貼基板 10,係在處理室2外裝載於基板保持具3。裝載 動作,有用機器人進行之情況,也有由作業員之 手來進行的情況。在對基板保持具3裝載之前, 也有時會進行遮蓋膠帶所造成的遮蓋。 搬運機構3 0動作,打開搬入口 2 1之封鎖閘 20 23 ’透過搬入口 21使基板保持具3往處理室 内:動。基板保持具3,係在黏貼面板ι〇位 側噴嘴4之間之姓—a穿从士 '兩 後搬…〗 時間點,就停止。然 出^ 之封鎖閘23會關閉。此狀態下,溶 出液供吟系姑R 各 … 間53會打開,送液泵54以特 -壓力將溶出“送到各嘴嘴4 : 嘴4之噴射孔41喷射、容出/ 、-果曰攸各噴 擊黏目J;品… 噴射洛出 並以特定壓力衝 、面板10的外面。# 而4 A 猎此’黏貼面板1 0之外 面會被削減。溶入有 爻外 蒗·有卜面之材料的溶出液L,合 洛下而從排出孔24被排出。 θ 進行特定時間之 泵54, _閉門u 液L噴射後,停止送液 A ^ , 。然後搬運機構30會動作,使 I扳保持具3移叙+ 1文 將黏貼面板i〇C口 22之封鎖閑23 面板1。,係進行純水等至2外。被搬出之黏貼 去除等作章。之^ 、之洗淨液洗淨或遮蓋膠帶 來到下個分割工稃。 上这裝置之動作 也會因應必要而使 時在溶出浪L噴射中 10之外面上各·點t貼山面板10 ^位。黏貼面板 41為最短距離之點|當對各噴嘴4之各噴射孔 溶出液L·噴射中估/、衡搫壓力過高時’則藉由在 0i 7T_ t 使時間平均後之各、面板1 〇前後移動,可以 •的衝擊壓力平均化。藉此, 1328699 可更加提高機械研磨後外面的平坦性。黏貼面板 10之移動,也有在上下方向進行者。 又上述裝置之構造中,送液泵 54造成之送 液壓力,係設定為外面之溶出液L造成的衝擊壓 力為0.5kg/cm2〜3.5kg/cm2的範圍。此時各喷嘴4 之各喷射孔41與外面的距離(第3圖以d表示) 就成為重要因素。若距離d過大,則如果不提高 送液泵54之送液壓力,就無法用上述範圍内之 壓力衝擊外面,而難以實用。又距離d較小時, 雖然容易保持衝擊壓力之最佳值,但往喷射孔4 1 之最短點的衝擊壓力會過高,在平均性觀點上會 產生問題。為了作為確保衝擊之平均性(亦即研 磨平坦性)的實用結構,距離d以5 m m以上1 0 0 m m 以下為佳。另外溶出液L之研磨在進行中的過 程,雖然從喷射孔41到外面為止的距離會稍微 變長,但是5mm以上100mm以下是實際開始研磨 時的距離。 又若衝擊壓力比0 . 5kg/cm2小,則因為新溶 出液L之供給較少而無法進行充分研磨,此外物 理作用也不充分,故玻璃成分或結晶狀態不平均 的場所則無法充分研磨,而有平坦性降低的問 題。又若衝擊壓力比3. 5kg/cm2大,則只有從喷 ⑧ 嘴4之噴射孔41的甚 1的取短點會被較多研磨,這點 ^ 使平坦性亞 心、化。因此,作為 〇.5kg/cm2 〜3.5k£r/r>2々々 # m範圍之衝擊壓力為理想。 若依上述获罢 „κ .. '"置’除了溶出液L之化學作用 外’還利用所謂衝墼 衝^之物理作用來進行外面研 磨,故可進杆古亚t , ^ 1 仃阿千坦性之研磨;並且因為玻璃基 板1之搬運與機械 lt π帶慝理都被自動化,故生產 性也高。 番…噴嘴4之各嘴射孔4 Η系以均等間隔來設 攸各噴射孔41到外面為止之距離為一定, 故容易使被噴射之溶出“的衝擊壓力平均,這 點對平坦性較高的研磨處理會帶來貢獻。 又保持黏貼面拓1Λ -ir 微1 〇為垂直之狀態來進行溶 解這點’有促進外面之 合出液L替換的效果,而 有以充分效率進彳干外;_ U . 丁卜面機械研磨的技術性意義。 更且噴嘴4設置於黏貼面板1 0之兩側,可 將又方外面同時作機械性研磨,故除了可對黏貼 面板10之薄型化更有貢獻之外,生產性也較高。 上述各實施方式之構造中,溶出液L帶來之 外面研磨,係利用溶出液造成之衝擊的物理性作 用者,與僅次泡於蝕刻液或僅散佈蝕刻液等蝕刻 有實質上的不同。 [ 23 又上述實施方式中’雖在黏貼一對玻璃基板 之後進行外面機械研磨處理,但有時也會在黏 '如進行外面機械研磨處理。此時,係在進行電 極%成工程等之前來進行外面機械研磨,或在形 成%色濾光片之前進行外面機械研磨。此時基板 保持具3,也會構成僅保持一片玻璃基板1。當 - 坡螭基板1變薄雖然會產生強度問題,但若以氟 黾等強酸來作機械研磨,則強酸作用會有強化的 · 1效果,即使變薄也不會有問題。更且,也有在 =J工私之後進行外面機械研磨者。又,也有時 會同時保持複數黏貼面板10,來同時進行外面機 械研磨處理。 又上述實施方式之裝置中,雖使搬運機構30 兼作為移動機構,但亦可與搬運機構30分別設 置移動機構。例如有時將基板保持具3設置為移· 動機構之一部分,將搬運機構30所搬運之黏貼 面板1 0移放到基板保持具,來加以移動。另外. 所謂「相對移動」,主旨係使玻璃基板1與喷嘴4 - 之喷射孔41的位置關係變化地來移動;可以如 上述實施方式般對靜止之嗔嘴4的喷射孔41 動玻璃基板卜也可以對靜止之玻璃基板 喷射孔41 ’又可以移動兩者。 24 ^^28699 上述實施方式之說明中雖採用LCD,但電漿 顯示器或有機EL顯示器等情況也同樣適用。因 為這些FPD不需要背光,故有時與射出側相反側 的基板不疋玻璃基板。亦即有時只有一邊是玻璃 基板。又本案發明中,可以對一對玻璃基板中之 邊進行外面機械研磨處理,此時也會得到本案16 CD 丄jzooyy I 糸 resin to form. As shown in Fig. 4, the cushioning member 33 is formed by two creeping connections 32 in the longitudinal direction of the base plate, and is connected to the upper end in the longitudinal direction. And the installer like this... The substrate is attached to the corners of the 4 cushioning device 33. The pick-up machine μ# μ contacts the underside of the lower corner of the Weijiao substrate 10 and is 3 3 concave, County The cross-sectional shape of the side of the side is concave. The cross-sectional shape of the side is the upper end of the substrate 10. The contact paste is ^ιΙ ^ 欸 33, which is a short side and has a lateral concave shape. In the figure, in 1 Λ brother 4, when the adhesive panel 10 is assembled, it is from the upper recess. Lo is formed in each cushion 33: the transport mechanism 3〇 is for example, a latch and a pinion The transport mechanism 3 is configured as a flash lock base plate 31, and the pinion gear is 3 〇1 person-specific. The pinion gear is disposed along the transport line by a large number. The small tooth chamber 2 is equipped with a wheel 301. In addition, a guide member having a holder hh "the substrate for moving the guide bow" is appropriately provided. As shown in Figure 3, the mouthpiece 4 is 3 inches, and the renting system is placed on the substrate holding panel; the side of the panel is attached to the side of the panel, and the eluate can be ejected toward the adhesive system to indicate the second outer crucible. . Fig. 5 is a perspective view showing the shape of the nozzle 4 shown in Fig. 1 . As shown in Fig. 5, the nozzle 4 is a tubular member having a spray hole 41. As shown in Fig. 5, the nozzles 4 are arranged to extend in the vertical direction, and are arranged side by side at equal intervals in the longitudinal direction (transport direction) of the pasting panel 10. The injection holes 41 are provided in the nozzles 4 facing the portions to which the panel 10 is pasted, and are disposed at equal intervals in the extending direction (vertical direction) of the tubes. Further, as the configuration of the nozzle 4, there are cases where more (or less) are arranged side by side than in Fig. 5, and there are cases where a plurality of nozzles are arranged in parallel in the horizontal direction or the inclined direction. Further, the nozzle 4 does not need to be tubular, and may have a plate shape or other shape. The eluent supply system 5 is composed of a reservoir portion 51 for storing the eluate L, a pipe 52 connecting the reservoir portion 51 and each nozzle 4, a valve 53 or a liquid supply pump 54 provided on the pipe 52, and the like. A filter or a pressure-regulating pump for removing impurities, garbage, or the like from the supplied eluted liquid L is provided as necessary. The eluate L is ejected to the respective nozzles 4 by the eluent supply system 5 from the respective ejection holes 41 to the outside of the adhesive panel 10 held by the substrate holder 3. The ejected liquid L which is sprayed will be sprayed to dissolve the outside and be ground outside. Further, as shown in Fig. 2, the bottom of the processing chamber 2 has a funnel shape, and the lowermost portion is provided with a discharge hole 24. The discharge port 24 is connected to a discharge pipe 25 for discharging the used eluted liquid L. As described above, the eluted liquid L in which the material of the adhesive panel 1 is dissolved is dropped to the bottom of the process 2 and is discharged through the discharge hole 24 and the discharge pipe 25. Further, the inner wall surface of the processing chamber 2 or the surface of each member in the processing chamber 2 has a structure which is resistant to the eluted liquid L. For example, when the effluent L is fluoric acid, the inner wall surface or the surface of each member is a structure coated with a chaotic resin such as Teflon (registered trademark of Dupon Co., Ltd.). Further, the lock gate 23 of the switch inlet 2 or the outlet 22 is blocked without causing the eluted liquid 1 to flow out. ♦ The beta-type device is specially designed for the construction of the nozzle 4 because the flatness of the outer surface after mechanical grinding is further improved. The following is for this point. Figure 6 is a sound picture of the point of the mountain shape L. As shown in Fig. 5, each of the 喰 y ^ ^ injection holes 41 is a direction in which the e-direction of the nozzle 4 (vertical square life, σ) is inclined at a 45-degree angle.攸 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The right side of Fig. 6 shows the injection amount distribution of the eluted liquid L from each of the injection holes 41 as seen from the height direction of the adhesive sheet 10. At this time, the outer upper point P facing the middle of the two injection holes 41 which are adjacent to each other is received, and the supply of the eluent L is received from the adjacent two injection holes 41. At this time, since the point P is located at the diffusion end of the push-out type L, the amount of the eluted liquid L received from one injection hole 41 is about 1/2 of the other points as shown on the right side of Fig. 6, On the other hand, the two injection holes 41 adjacent to each other are used to receive the supply of the eluate L of one injection hole. Therefore, in the height direction of the pasting panel 10, the supply amount of the eluent L at each outer point is average. Further, the case where the eluted liquid L is diffused not only in the cross-sectional shape shown in Fig. 5 but also in the cross-sectional shape such as an elliptical shape, a circular shape, a square shape (square shape, a rectangular shape), a rhombic shape, or a parallelogram shape is used to diffuse the eluted liquid L. Happening. Next, the operation of the above device will be described. The pasted substrate 10 which has been completed by the above sealing process is placed on the substrate holder 3 outside the processing chamber 2. The loading operation is performed by a robot, and it is also carried out by the operator. Before the substrate holder 3 is loaded, the covering by the covering tape may be sometimes performed. The transport mechanism 30 operates to open the lock gate 20 23 ' of the carry-in port 2 1 through the carry-in port 21 to move the substrate holder 3 into the processing chamber: The substrate holder 3, which is the last name between the nozzles on the side of the adhesive panel ι〇-a, is worn from the 'two and then moved...' time point, and stops. However, the blocking gate 23 of ^ will be closed. In this state, the eluent supply system R is opened, and the liquid supply pump 54 sends the dissolution to the nozzles 4 by the special pressure to eject the injection holes 41 of the nozzles 4, and/or曰攸 喷 喷 ; ; ; ; ; ; 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射 喷射The eluent L of the material of the surface is discharged from the discharge hole 24 in the lower part. θ The pump 54 is operated for a certain period of time, and after the injection of the liquid u is closed, the liquid supply A ^ is stopped, and then the transport mechanism 30 is operated. Make the I pull holder 3 transfer + 1 text will be attached to the panel i〇C port 22 block free 23 panel. It is pure water to 2, etc. It is removed by the removal of the paste. Clean the liquid or cover the tape to the next dividing machine. The action of the device will also be applied to the outer surface of the spray wave L in the 10 points of the spray wave. 41 is the point of the shortest distance|When the injection hole L of the injection holes of each nozzle 4 is estimated to be /, the pressure is too high, then by 0i 7T_t After the time is averaged, the panel 1 〇 moves back and forth, and the impact pressure can be averaged. Thus, 1328699 can improve the flatness of the outer surface after mechanical polishing. The movement of the adhesive panel 10 is also performed in the up and down direction. In the structure of the apparatus, the liquid supply pressure caused by the liquid supply pump 54 is set to a range of 0.5 kg/cm 2 to 3.5 kg/cm 2 by the outer solution L. At this time, the respective injection holes 41 of the respective nozzles 4 The distance to the outside (indicated by d in Fig. 3) is an important factor. If the distance d is too large, if the liquid supply pressure of the liquid supply pump 54 is not increased, the pressure inside the above range cannot be used to impact the outside, which is difficult to be practical. When the distance d is small, although it is easy to maintain the optimum value of the impact pressure, the impact pressure to the shortest point of the injection hole 4 1 is too high, which causes a problem in terms of averaging. In order to ensure the average of the impact ( In the practical structure of the polishing flatness, the distance d is preferably 5 mm or more and 100 mm or less. Further, the polishing of the eluent L is in progress, although the distance from the injection hole 41 to the outside is small. It is slightly longer, but the distance from 5 mm to 100 mm is actually the distance at which the polishing starts. When the impact pressure is less than 0.5 kg/cm2, the supply of the new eluent L is small, and sufficient polishing cannot be performed, and the physical effect is also If it is not sufficient, the glass component or the crystallized state is not uniformly ground, and the flatness is lowered. If the impact pressure is larger than 3.5 kg/cm2, only the injection hole 41 from the nozzle 4 is sprayed. The short point of the 1st will be more polished, which makes the flatness sub-centered. Therefore, the impact pressure is ideal as the range of 55kg/cm2~3.5k£r/r>2々々# m . If you follow the above, κκ.. '" set 'in addition to the chemical action of the L solution', it also uses the physical action of the so-called rushing and smashing to perform external grinding, so it can enter the rod Guya t, ^ 1 仃Since the glass substrate 1 is handled and the mechanical lt π tape is automated, the productivity is also high. The nozzles 4 of the nozzles 4 are arranged at equal intervals. Since the distance from the hole 41 to the outside is constant, it is easy to average the impact pressure of the eluted ejection, which contributes to the polishing process having high flatness. Keeping the adhesive surface extension 1Λ -ir micro 1 〇 is a vertical state to dissolve this point 'has the effect of promoting the replacement of the outer liquid mixture L, and has sufficient efficiency to enter the dry; _ U. The technical significance of grinding. Further, the nozzles 4 are disposed on both sides of the pasting panel 10, and the outer surfaces can be mechanically ground at the same time. Therefore, in addition to contributing to the thinning of the adhesive panel 10, the productivity is also high. In the structure of each of the above embodiments, the physical action by the elution liquid L by the external solution is substantially different from the etching by the etching liquid or only the etching liquid. [23. In the above embodiment, the outer surface mechanical polishing treatment is performed after a pair of glass substrates are adhered, but the outer surface may be subjected to mechanical polishing. At this time, external mechanical polishing is performed before the electrode % engineering or the like is performed, or external mechanical polishing is performed before the % color filter is formed. At this time, the substrate holder 3 is also configured to hold only one glass substrate 1. When the surface of the sloping substrate 1 is thinned, there is a problem of strength. However, if it is mechanically polished with a strong acid such as fluorinated ruthenium, the strong acid action will have an effect of strengthening 1. Even if it is thinned, there is no problem. Moreover, there are also those who perform mechanical grinding outside after the =J work. Further, the plurality of pasting panels 10 may be held at the same time to perform the outer mechanical polishing process at the same time. Further, in the apparatus of the above embodiment, the transport mechanism 30 is also used as the moving mechanism, but the moving mechanism may be provided separately from the transport mechanism 30. For example, the substrate holder 3 may be provided as a part of the movement mechanism, and the adhesive panel 10 transported by the transport mechanism 30 may be moved to the substrate holder to be moved. In addition, the "relative movement" is intended to change the positional relationship between the glass substrate 1 and the injection hole 41 of the nozzle 4 -. The injection hole 41 of the stationary nozzle 4 can be moved as shown in the above embodiment. It is also possible to move both of the stationary glass substrate ejection holes 41'. 24 ^^28699 Although the LCD is used in the description of the above embodiment, the same applies to the plasma display or the organic EL display. Since these FPDs do not require a backlight, the substrate on the side opposite to the exit side may not be a glass substrate. That is, sometimes only one side is a glass substrate. In the invention of the present invention, the outer side of the pair of glass substrates can be mechanically polished externally, and the case can be obtained at this time.

發明的效果。 其次,說明FPD之發明的實施方式。 第7圖,係實施方式中FpD之剖面概略圖。 第7圖所示之FPD,係黏貼—對玻璃基板j而形 成。第7圖所示者,係與上述實施方式相同,是 :為FPD -例的液晶顯示器。一對玻璃基板之内 部,作為構成光透過控制部者,.係有形成於一邊 破填基板1内面之電極(元件電極、共通電極等) U,和被封存的液晶13。另一邊之玻璃基板 面,係形成有衫色濾光片1 4。光透過控制部之構 造本身,係與一般液晶顯示器相同。 第7圖所示之FPD的 板1之雙方外面100,是 來研磨者。外面機械研磨 的情況相同,故省略說明 大特徵點,係藉由進行上 特徵點,係一對玻璃基 藉由外面機械研磨處理 處理與上述各實施方式 。此實施方式之FPD的 述外面機械研磨處理, 25 1328699 使外 外面 作為 T5T 疋取 公司 中適 據本 磨處 左右 提供 FPD 理之 時會 坦性 性, 性。 以其 值。 的比 線平 面1 00具有0. 1 μιη以下的平坦性。 若說明平坦性,則如放大第7圖所表示,在 1 0 0中’將最頂部1 0 1與最低部1 0 2之距離 平坦性。此值係相當於表面粗糙度漁丨定中測 大粗糙度(Rmax )的情況。市售有來自數家 之可測定最大粗縫度的表面粗糙度計,從其 當選擇即可測定上述外面1〇〇的平坦性。根 案發明者之研究’藉由進行上述外面機械研 理,可將一片玻璃基板1之厚度t作為〇 5關 ’且使平坦性(Rmax)為0· 1μιη以下,而可 達成薄型化、輕量化且無顯示不均的高性能 另外此種平坦性,與進行外面機械研磨處 月'J玻璃基板1的外面平坦性為相同程度,此 得到不會因為外面機械研磨處理而損及平 的表現。 上述例子中,雖然以最大粗糙度作為平坦 但也可用中心線平均粗糙度(Ra )作為平坦 此時’係求出外面i 00之凹凸的平均高度, 高度為基準,球出各凹凸高度差異的絕對 寺也市售有可測定中心線平均粗糙度(r a ) 面粗糙度計,故使用該者。順帶一提,中心 均粗糙度之情況下,若在〇.〇3mm以下則可 1328699 提供無顯示不均之F P D,此種平坦性亦可藉由上 述外面機械研磨處理來達成。 另外上述構造,即使是液晶顯示器之外的 FPD也同樣適用。如有機EL顯示器般自發光之 FPD的情況下,係取代光透過控制部而設置發光 部。 •【圖式簡單說明】 [第1圖]表示實施方式中FPD之製造方法概 略的圖 [第2圖]實施方式之外面機械研磨裝置的正 面概略圖 [第3圖]第2圖所示之裝置的側面剖面概略 圖 • [第4圖]第2圖及第3圖所示之裝置中基板 保持具3的立體概略圖 ' [第5圖]表示第3圖所示之喷嘴4之形狀的 ' 立體概略圖 [第6圖]表示從各噴射孔4 1對黏貼面板1 0 外面平均噴出溶出液L之點的概略圖 [第7圖]實施方式中FPD之剖面概略圖 27 1328699 【主要元件符號說明】 1 ’·玻璃基板 1 0 :黏貼面板 1 1 .電極 1 2 :密封部 1 3 .液晶 1 4 :彩色濾光片 2 :處理室 21 ··搬入口 22 :搬出口 2 3 :封鎖閘 24 :排出孔 3 :基板保持具 3 0 :搬運機構 31 :基底板 32 :支柱 3 3 :緩衝具 3 0 1 :小齒輪 1328699 52 : 53 : 54 : 配管 閥 送液泵 溶出液The effect of the invention. Next, an embodiment of the invention of the FPD will be described. Fig. 7 is a schematic cross-sectional view showing the FpD in the embodiment. The FPD shown in Fig. 7 is attached to the glass substrate j. The figure shown in Fig. 7 is the same as the above embodiment, and is a liquid crystal display of the FPD type. The inner portion of the pair of glass substrates is formed as an electrode (the element electrode, the common electrode, etc.) U which is formed on the inner surface of the substrate 1 and the sealed liquid crystal 13 as a light transmission control unit. On the other side of the glass substrate, a shirt color filter 14 is formed. The structure of the light transmission control unit itself is the same as that of a general liquid crystal display. The outer faces 100 of both sides of the panel 1 of the FPD shown in Fig. 7 are the polishers. Since the outer mechanical polishing is the same, the description of the large feature points is omitted, and by performing the upper feature points, a pair of glass substrates are treated by the outer mechanical polishing treatment and the above embodiments. The external mechanical grinding treatment of the FPD of this embodiment, 25 1328699, makes the outer surface as a T5T extraction company suitable for providing FPD according to the local grinding station. With its value. The flat surface of the line has a flatness of 0.1 μm or less. If the flatness is described, as shown in the enlarged view of Fig. 7, the distance between the topmost 1 0 1 and the lowest portion 1 0 2 is flat in 1 0 0. This value corresponds to the case where the surface roughness is measured in the maximum roughness (Rmax). A surface roughness meter from a plurality of companies which can measure the maximum degree of roughness is commercially available, and the flatness of the outer surface can be measured from the selection. In the study of the inventor of the present invention, by performing the above-described external mechanical research, the thickness t of one glass substrate 1 can be made 〇5 off and the flatness (Rmax) can be made less than 0·1 μηη, thereby achieving thinning and lightness. The high performance of the high-performance and non-display unevenness is the same as the flatness of the outer surface of the moon-J glass substrate 1 at the outer mechanical polishing. This results in no damage to the flat surface due to the external mechanical polishing treatment. . In the above example, although the maximum roughness is used as the flatness, the center line average roughness (Ra) may be used as the flatness. In this case, the average height of the unevenness of the outer surface i 00 is obtained, and the height is used as a reference. Absolute temples also have a measurable centerline average roughness (ra) surface roughness meter, so use this one. Incidentally, in the case of the center roughness, if it is less than 3 mm, 1328699 F P D without display unevenness can be provided, and such flatness can also be achieved by the above external mechanical polishing treatment. In addition to the above configuration, even an FPD other than a liquid crystal display is equally applicable. In the case of an FPD that emits light like an organic EL display, a light-emitting portion is provided instead of the light transmission control portion. BRIEF DESCRIPTION OF THE DRAWINGS [Fig. 1] is a schematic view showing a method of manufacturing an FPD in an embodiment. [Fig. 2] A front schematic view of an external mechanical polishing apparatus according to an embodiment [Fig. 3] A schematic cross-sectional view of the side of the apparatus. [Fig. 4] A perspective view of the substrate holder 3 in the apparatus shown in Figs. 2 and 3 [Fig. 5] shows the shape of the nozzle 4 shown in Fig. 3. 'Three-dimensional schematic view [Fig. 6] is a schematic view showing a point at which the eluent L is ejected on the outer surface of the pasting panel 10 from each of the ejecting holes 4 1 [Fig. 7] FIG. 7 is a schematic view of the FPD in the embodiment. DESCRIPTION OF SYMBOLS 1 '. Glass substrate 1 0 : Adhesive panel 1 1 . Electrode 1 2 : Sealing part 1 3 . Liquid crystal 1 4 : Color filter 2 : Processing chamber 21 · · Carrying in port 22 : Carrying out port 2 3 : Blocking Brake 24: discharge hole 3: substrate holder 30: transport mechanism 31: base plate 32: strut 3 3: cushion 3 0 1 : pinion 1328699 52 : 53 : 54 : pipe valve feed pump eluent

2929

Claims (1)

1328699 七、申請專利範圍: 1. 一種平面顯示器之製造方法,係包含:於 一方或雙方為玻璃基板之一對基板中、最少一方 形成電極的電極形成工程,和於電極形成工程 後、經由密封材黏貼一對基板來密封内部的密封 工程,和在密封工程之後、將玻璃基板亦即一方 或雙方之基板外面加以機械性研磨來打薄的外 面機械研磨工程;其特徵係: 上述外面機械研磨工程,係將溶出上述玻璃 基板外面之溶出液,向著上述外面喷射,來附加 較本身重量所造成之加速度還要大之加速度,使 溶出液往上述外面喷出並衝擊上述外面,其中, 在溶出液噴射中,係使上述外面成為垂直姿勢 地,來保持上述基板,並一邊使上述一方或雙方 之基板對喷射溶出液之喷嘴做相對機械性移 動,一邊以溶出液溶出上述外面,利用溶出液造 成之衝擊的物理作用,來加以研磨的工程。 2. 如申請專利範圍第1項所記載之平面顯示 器之製造方法,其中,上述溶出液係氟酸者。 3. 如申請專利範圍第1項所記載之平面顯示 器之製造方法,其中,上述溶出液造成上述外面 30 之衝擊時的壓力,係〇.5kg/cm2〜3 5kg/cm2的範 圍者。 4·如申請專利範圍第1項所記載之平面顯示 器之製le方法’其巾,係將上述黏合後之一對玻 璃基板的雙方外面,同時加以機械研磨,將整體 厚度變薄者。 5如申凊專利範圍第1項所記載之平面顯示 器之製k方法,其中,在研磨開始時,從上述喷 嘴之嘴射孔到上述基板外面為±的距離,係5匪 以上100mm以下者。 /,如中請專利範圍第1項所記載之平面顯示 恭之t k方法’其中’ I噴射孔^以等間隔來複 數設置,且從各喷射孔到上述外面為止之距離是 —定的。 7. —種外面機械研磨裝置,係將平面顯示器 用之玻璃基板外面做機械研磨來打薄;其特徵 係: 具備: 在内部進行外面機械研磨處理之處理室, 和將上述玻璃基板保持於處理室内特定位 置之基板保持具, 和具有將溶出上述外面之材料之溶出液、向 U2S699 2被上述基板保持具保持之上述破璃基 外面噴射之嘴射孔的噴嘴,盆中 5亥 目 m τ 上述基板侔垃 地’^在溶出液噴射中使上述外面成為 地,來保持JL述基板者, 文勢 孝對噴嘴供給溶出液的溶出液供給系統; 旦上述溶出液供給系、統,係將附加有比本身曹 里所造成之加速度還要大之加 重 t 上述外面噴出並衝擊 又 ^ 液,往 成之— 而可利用衝擊造 供給溶出液者; 果對上逑嘴嘴 更且,具備使被噴射溶出液之上述— 方之基板,對喷嘴之喷射孔做機 ^雙 移動機構。 Τ對移動的 _ 8·如申請專利範圍帛7項所記載 研磨裝置’其中,上述溶出液係氣酸。面機械 9:如申請專利範圍第7項所記載之外 1裝置中,上述溶出液供給系统,係 述溶出液從上述噴嘴之喷射孔被喷射、,、 〇::l/cm2〜 3.5kg/cm2範圍之壓力衝擊上述坡: 基板外…也’對上述噴嘴供給上述溶出液者璃 1〇.如申請專利範圍第7項所記載之外 研磨裝置,复機械 ,、中上述噴嘴係可將黏合後之一對 32 1 玻璃基板的雙方外面间拉1 ^ Μ X ^ ^ ^ ^ σ以機械研磨地,設置 在被基板保持具所保持之__ Π 知由-主查& 〃 —對破壤基板的兩側。 11. 如申明專利範圍第7項张“ 研磨裝置’其巾,在研磨開始二载之外面機械 喷射孔到上述玻璃基板外:攸上述贺嘴之 以上1〇〇随以下者。 ’、5mm 12. 如申請專利範圍第7 研磨裝置,其令,各喷射孔#己載之外面機械 置,且”二 以等間隔來複數- 置且攸各噴射孔到上述外面為 °又 的。 1囬马止之距離是一定1328699 VII. Patent application scope: 1. A method for manufacturing a flat panel display, comprising: forming an electrode on one or both of the glass substrates on at least one of the substrates, and forming an electrode after the electrode formation process; a pair of substrates adhered to seal the internal sealing process, and an outer mechanical polishing process in which the glass substrate, that is, one or both of the substrates, is mechanically ground to be thinned after the sealing process; In the process, the eluate on the outside of the glass substrate is eluted and ejected toward the outside surface to add an acceleration greater than the acceleration caused by its own weight, so that the eluate is ejected to the outside and impacts the outside, wherein, in the dissolution In the liquid jet, the substrate is held in a vertical posture, and the substrate is held, and the one or both of the substrates are relatively mechanically moved to the nozzle for ejecting the eluate, and the outer surface is eluted with the elution solution, and the eluate is eluted. The physical effect of the impact, the worker who grinds . 2. The method of producing a flat panel according to the first aspect of the invention, wherein the eluate is a hydrofluoric acid. 3. The method of manufacturing a flat panel according to the first aspect of the invention, wherein the pressure at which the eluate causes the impact of the outer surface 30 is in the range of 5 kg/cm 2 to 3 5 kg/cm 2 . 4. The method of manufacturing a flat display according to the first aspect of the invention, wherein the one of the bonded surfaces is mechanically polished to the outer surface of both of the glass substrates, and the overall thickness is reduced. 5. The method of manufacturing a flat display according to claim 1, wherein at the start of the polishing, a distance from the nozzle of the nozzle to a distance of ± from the outside of the substrate is 5 匪 or more and 100 mm or less. /, as shown in the first paragraph of the patent scope, the method shown in the first paragraph is a method in which the "I" injection holes are plurally arranged at equal intervals, and the distance from each of the injection holes to the outside is constant. 7. An external mechanical polishing device for mechanically polishing a glass substrate for a flat display to be thinned; the features are: comprising: a processing chamber for performing external mechanical polishing treatment inside, and holding the glass substrate in the processing a substrate holder at a specific position in the chamber, and a nozzle having a discharge hole for ejecting the material of the outer surface and a nozzle for ejecting the outer surface of the glass substrate held by the substrate holder U2S699 2, in the basin In the above-mentioned substrate, the above-mentioned outer surface is made to be a ground, and the substrate of the JL is held, and the electrolyte supply system for supplying the eluate to the nozzle is provided; and the eluent supply system and the system are It is added with a larger weight than the acceleration caused by Cao Li. The above-mentioned outside is ejected and impacted, and the liquid is formed. The impact can be used to supply the eluate. The above-mentioned substrate of the eluate is sprayed, and the injection hole of the nozzle is made into a double-moving mechanism. Τ 移动 · · 如 如 如 如 研磨 研磨 研磨 ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ No. 9: In the apparatus according to the seventh aspect of the invention, the eluate supply system is configured to eject the eluate from the ejection orifice of the nozzle, and 〇: 1:1/cm2 to 3.5 kg/ The pressure in the range of cm2 impacts the above-mentioned slope: the outside of the substrate... also supplies the above-mentioned eluate to the above-mentioned nozzle. The grinding device, the re-machine, and the above-mentioned nozzle system can be bonded as described in the seventh aspect of the patent application. The latter one pulls 1 ^ Μ X ^ ^ ^ ^ σ between the outer sides of the 32 1 glass substrate to be mechanically ground, and is placed in the substrate holder to maintain the __ Π 知 知 - - - - - - - - - The sides of the soil substrate. 11. As stated in the seventh paragraph of the patent scope "grinding device", the machine is sprayed outside the glass substrate to the outside of the glass substrate at the beginning of the grinding: 攸 攸 攸 攸 攸 。 ' ' ' ' '. As in the patent application section 7, the grinding device is configured such that each of the injection holes # is mechanically placed outside, and "two at equal intervals" and each of the injection holes is further to the outside. 1 back to the horse is a certain distance 3333
TW95101796A 2006-01-16 2006-01-16 Method for manufacturing flat panel display and external mechanical polishing apparatus of glass substrate for flat panel display TWI328699B (en)

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