九、發明說明： 【發明所屬之技術領域】 尤指一 本發明是有關於-種球栅陣列封裝元件之測試裝置〜 種對真實魏板上之___元件進行測試之測試裝置 【先前技術】 半導 封 u(Ba11 gnd array paeked _ 前已成為 H封裝7°件之主流，這是因為它具有較高的ι/ο密度㈤gh 二_)以及可藉由表義著技術㈣)直接妙於電路板上。通 $半導體縣晶片都需要經過—特定之難測試程序，_拇 P歹街裝元件由於具有較高I/Q密度以及特殊的球形接腳，因此 在測試方法上與其他轉體封裝元件不較為赚。球拇陣列 封裝元件之顧難罐U grid ㈣sQeket a_biy) 主要是用來連接球柵陣列封裝元件之球形接腳(_ c。血⑷至 電路板之接艇域’使軸_封裝元件之球職腳不用直祕 接於電路板之接域，即可以達卿说之目的。 。月參閱第1圖所示’其係為使用傳統BGA測試插座組來連接 球栅陣列縣元件之球形接顺電路板之導狀結構示意圖。傳 統BGA測試插座組1具有一盒體1〇以及一夹具n，盒體1〇具有 "面層101以及-容置空間1〇2，該介面層1〇1具有複數個通孔 03可以谷置複數個彈性導針104。容置空間102可以容置球栅 陣列封震7L件12 ’且球栅陣列封裝元件12於置入容置空間⑽ 後’可受失具11夹制，使其球形接腳120可以與對應之彈性導針 ⑽的-接觸端驗接觸。彈性導針ι〇4之另一接觸端，亦即接 腳04b係延伸出盒體1〇，且可與非真實系統的電路板η之複 ^個導孔13G細’藉此以進行球娜列縣元件I〗之測試。但 是由於傳統之BGA測試插座組丨需將其接腳腿插入電路板13 對應導孔130内以進行職，因此不？、需要使轉製的測試電 路板(亦即非真實系統之板13)使成本提高 ，且將接腳l〇4b 插於導孔130之雜亦容易產生接腳觸之破壞，造成測試的錯 誤。此外，隨著半導體槌元件趨向於微小化與高積集度發展， 半導體封裝元件的接腳密度越來越高，如此—來接腳間的間距 (pitch)就會越來越小，測試電路板之導接區域的間距(pi㈣也 會縮小’因此特製測試電路板之成本亦會提高且更容易於插植 的過程導致接腳104b之破壞，造成測試的錯誤，且由於電子元件 的傳輸速度越來越快’傳統以插孔方式與彈性導針刚之接觸構 w ’將賊過大的阻抗，躺無法運肖在冑速賴試結構中，將 使高速測試電路板的LAY0UT隨傳輸速度越來越快，設計更加困難。 另外，1997年12月30日公告之美國專利US5, 7〇2, 255，名 稱『BALL GRID ARRY SOCKET ASSEMBLY』，亦曾揭露另一種傳統之 BGA測試插座組結構與測試方法，其結構如第2圖所示。該BGA 測試插座組2具有一盒體2〇以及一夾具21，盒體2〇具有一介面 :_ X及4置空間2G2 ’該介面層201具有複數個通孔203， =_ 4置複數個彈性導針2〇4，容置空間2〇2可以容置球柵陣列封 :件22 ’且球柵陣列封裝元件22於置入容置空間弧後可受 1爽制’使其球形接腳22G可以與對應之彈性導針之一 ，端2G4a接觸。彈性導針2()4之另一接觸端形成一球形接腳 其係延伸出盒體2〇 ’藉此以進行球柵陣列封裝元件22之測 …、而’由於彈性導針2G4之另—端需植棘形接腳難因 不-彈ί±導針2G4的加工製程麻煩，且於彈性導針·组裝於 ^插座組2、魏程，斜分費時而不便，容易造成接觸不佳的 …此外，當複數個測試插座組2設置於電路板23上時，每一 測^插座組2仍需要逐—對位至電路板23之接觸區域因此不利 於夕組測端座組2之設置與進行。 考牛導體產業的高度發展，積體電路 ::需求而改變其尺寸以及封裝的形狀，因此，為了因：: 而求’所制之戰嫩_雜剌狀从傾 變，以配合待戰的铸_航件，細在佩= 樹她㈣此當有不同 導封震心牛需測試時，就必須重新開模以製造一 的測試插触，舰__是糾在顯的電路板 上，尚無法直接將物具連接在實際的電路板上進行測試，如 :==::==::IX. Description of the invention: [Technical field to which the invention pertains] In particular, the invention relates to a test device for a ball grid array package component, a test device for testing a ___ component on a real board (previous technique) 】 semi-conductive seal u (Ba11 gnd array paeked _ has become the mainstream of H-package 7 ° pieces, this is because it has a higher ι / ο density (five) gh two _) and can be directly expressed by the technical (four)) On the board. Through the semiconductor semiconductor chip, it is necessary to go through a specific difficult test procedure. The _P-Picture Street component has a high I/Q density and a special spherical pin, so it is not comparable to other rotating package components in the test method. earn. The ball socket array component U grid (four) sQeket a_biy) is mainly used to connect the ball grid array package component ball pin (_ c. blood (4) to the circuit board of the boat domain 'to make the axis _ package components of the ball The foot does not need to be connected to the circuit board, which can be used for the purpose of the Qing. The month is shown in Figure 1 'It is a ball-connected circuit that uses the traditional BGA test socket group to connect the ball grid array components. Schematic diagram of the guide structure of the board. The conventional BGA test socket set 1 has a box body 1 and a clamp n, and the box body 1 has a "surface layer 101 and an accommodation space 1〇2, the interface layer 1〇1 has The plurality of through holes 03 can be provided with a plurality of elastic guide pins 104. The accommodating space 102 can accommodate the ball grid array to seal the 7L pieces 12' and the ball grid array package component 12 can be lost after being placed in the accommodating space (10). The sleeve 11 is clamped so that the spherical pin 120 can be in contact with the contact end of the corresponding elastic guide pin (10). The other contact end of the elastic guide pin ι 4, that is, the pin 04b extends out of the case 1〇 And can be thin with the guide hole 13G of the circuit board η of the non-real system to thereby perform the ball Test of the component I of the county. However, since the conventional BGA test socket set does not need to insert its pin legs into the corresponding guide holes 130 of the circuit board 13 for work, it is not necessary to make the converted test circuit board (ie, The board of the non-real system 13) increases the cost, and the miscellaneous insertion of the pin l〇4b into the via 130 is also liable to cause damage to the contact, resulting in a test error. In addition, as the semiconductor device tends to be miniaturized With the development of high integration, the pin density of semiconductor package components is getting higher and higher, so that the pitch between the pins will become smaller and smaller, and the pitch of the test area of the test board (pi(4) will also be Reduced 'so the cost of a specially crafted test board will also increase and the process that is easier to implant will cause damage to the pins 104b, causing test errors, and because the transmission speed of electronic components is getting faster and faster' traditionally The elastic guide pin just touches the structure w'. The thief's excessive impedance can't be transported in the idle speed test structure, which will make the LAY0UT of the high-speed test board faster and faster with the transmission speed, and the design is more difficult. Year 1 U.S. Patent No. 5,7,2,255, entitled "BALL GRID ARRY SOCKET ASSEMBLY", published on February 30, has also disclosed another conventional BGA test socket assembly structure and test method, the structure of which is shown in Figure 2. The BGA test socket set 2 has a box body 2〇 and a clamp 21, and the box body 2 has an interface: _ X and 4 spaces 2G2 'The interface layer 201 has a plurality of through holes 203, and the number of the plurality of through holes 203 is set. The elastic guide pin 2〇4, the accommodating space 2〇2 can accommodate the ball grid array seal: the piece 22′ and the ball grid array package component 22 can be subjected to a cool one after being placed in the accommodating space arc to make the ball pin The 22G can be in contact with one of the corresponding elastic guide pins, the end 2G4a. The other contact end of the elastic guide pin 2 () 4 forms a spherical pin which extends out of the case 2' to thereby perform the measurement of the ball grid array package component 22, and 'because of the elastic guide pin 2G4" It is difficult to handle the ratchet-shaped pin at the end. The process of the φ± guide pin 2G4 is troublesome, and it is easy to cause poor contact in the elastic guide pin·assembled in the socket group 2 and Wei Cheng. In addition, when a plurality of test socket groups 2 are disposed on the circuit board 23, each of the test socket groups 2 still needs to be aligned to the contact area of the circuit board 23, thereby being disadvantageous for the group test terminal block group 2 Set up and proceed. The high development of the cattle conductor industry, the integrated circuit:: the need to change its size and the shape of the package, therefore, in order to:: and seek for the war of the _ 剌 _ , , , , , , , , , , Casting_Navigation, fine in Pei = Tree She (4) When there are different guides to be tested, it is necessary to re-open the mold to create a test plug, the ship __ is on the circuit board, It is not possible to directly connect the object to the actual circuit board for testing, such as: ==::==::
时於提供—種職__封裝元件之裝 、、係錯由載板部直接開設有均勻塗料電體的—導通孔，且 配合導通孔置人有雜體以及導針，取代傳統彈性導針之 以達到便於製作職裝置以賴対作縣之功效。 本案之次要目的在於提供一種測試球栅陣列封裝元件之裝 置’其係藉由於電路板及球柵陣列封裝元件之間設置有—載板^ 的方式’使球栅陣列封裝藉可以於真實系統之電路板上進行測 試，以達到減少電路測試時間及成本之功效。 本案之另-目的在於提供一種測試球栅陣列封裝元件之裝 置’其係藉由觀部直接财有均勻塗料f體的—導通孔，且At the time of providing - the __ package component, the fault is directly opened by the carrier part of the conductive material - the through hole, and the through hole is placed with a body and a guide pin, replacing the traditional elastic guide pin In order to achieve the convenience of the production of the device to rely on the effect of the county. The second objective of the present invention is to provide a device for testing a ball grid array package component, which enables the ball grid array package to be used in a real system by means of a carrier plate disposed between the circuit board and the ball grid array package component. Tested on the board to reduce circuit test time and cost. Another object of the present invention is to provide a device for testing a ball grid array package component, which is a via hole directly formed by the viewing portion, and
因此，如何 【發明内容】 本案之主要目 配合導通孔置入有彈性體以及導針，確切使球栅陣列封I元件與 實際之電路板接觸而進行電訊測試，以達到減少電路測試時間及 成本之功效。 本案之又一目的在於提供一種測試球栅陣列封裝元件之裝 置，其係藉由於電路板及球柵陣列封裝元件之間設置一載板部的 方式’以有册乡組雜陣册裝元件驗置，進而達到提升測 試效率之功效。 為達上述目的，本發明係提供一種測試球栅陣列封裝元件之 1325059 裝置，對-球柵陣列封裝元件之複數個球形接腳進行電訊連接， 、進行該球栅陣列封裝元件之測試’該裝置包括有：_載板部、 板複數個彈性體以及複數個導針。該載板部具有—與 複數個球祕腳相對應之複數個導通孔，該導通孔貫穿該载板 部’使-第-側面以及—第二側面相導通，而該導通孔中係均句 塗佈有導電體。該電路板上佈設有複數個對接部，且與該第二 側面相貼靠，-一使複數個對接部與複數個導通孔相定位連接y 該彈性體位_導通孔中，一端轉鱗接部。該料位於該導 通对’該導針具有—端面與該彈性體另一端相貼靠，且以一頂 面與該球形接腳相對位接觸。 【實施方式】 請參閱第3圖至第5圖所示，其係為____ 組讀之裝置較佳實施例立體結構示意圖、局部放大立體結構分 示意圖。本發明測試球拇陣列封裝元 =置祕對-球柵陣列封裝元件32之複數個球形接_ 進仃電訊連接’ W真實系統之電路板33上對球栅_封裝 32進行測試。該測試球柵陣列封裝元件之裝置3主要包括有.— =部電路板33、複數個彈性體幻以及複數個導針35。 "U 34具有--與複數個__ 32__ 广，該導通謂係貫穿該载板部34，使—第—側面= 一第一側面343相導通，而該導通孔344中係均句塗佈有一導 1325059 -電體341，該導電體341其係為導電材質所製成，本發明較佳者為 金或金合金所製成。 真實系統之電路板33上佈設錢數鑛接部33()，本發明較 佳實施例中，該對接部330其係設計為球形形狀以利與該導通孔 344相連接。當該電路板33與該第二側面343相貼靠時，一一使 複數個對接部330與複數個導通孔344藉由表面黏著技術（SMT) 相疋位連接，當然該電路板33與該第二側面343間，亦可運用表 • 面黏著技術（SMT)進行相互貼靠連接。 複數個彈性體31係--對應該導通孔344而位於該導通孔 344中，該彈性體3卜端係抵靠該對接部33〇。而該導針祁亦位 於該導通孔344巾，該導針35具有-端面352以及一頂面如， 該端面352與該彈性體31之另-端相貼靠，且使得該頂面351可 以與該球形接腳320相對位接觸。由於該彈性體31與該導針 為可導電之材質所製成’因此當該頂面351與該球升)接腳320 相對位接觸後’可直接進行球柵_封裝元件32以及電路板33 相互電訊連接導通’俾於真實系統之電路板33上進行球栅陣列封 裝元件32之測試。 本發明較佳實施例中，該裝置3更包括有一蓋板部36，該蓋 板部36可與該第一側面342相貼靠，使該彈性體31與該導針35 固义於該導通孔344巾。而該蓋板部36更具有一一與複數個導通 孔344相對應之複數個穿孔361以及至少一連固件祁2，該穿孔 ^^5059 361可使得該導針35之頂面351延伸出該蓋板部％外而可與該 球形接腳320相對位接觸，該連固件362其係通過該蓋板部/ 而使該蓋板部36與該載板部36相連接。 ’Therefore, how to [invention] The main purpose of this case is to match the via hole with the elastic body and the guide pin, so that the ball grid array sealing I component is in contact with the actual circuit board for telecommunications test, so as to reduce the circuit test time and cost. The effect. Another object of the present invention is to provide a device for testing a ball grid array package component, which is provided by a method for setting a carrier portion between a circuit board and a ball grid array package component. Set to achieve the effect of improving test efficiency. In order to achieve the above object, the present invention provides a 1325059 device for testing a ball grid array package component, and a plurality of ball pins of a ball grid array package component are electrically connected, and the ball grid array package component is tested. It includes: _ carrier plate, a plurality of elastic plates and a plurality of guide pins. The carrier portion has a plurality of via holes corresponding to the plurality of ball secret legs, and the via holes extend through the carrier portion to electrically connect the first side surface and the second side surface, and the conductive layer has a uniform sentence It is coated with an electrical conductor. The circuit board is provided with a plurality of abutting portions, and is in contact with the second side surface, and the plurality of abutting portions are positioned and connected with the plurality of through holes y. The elastic body position is in the through hole, and the one end is turned into the scaly portion. . The material is located on the conductive pair. The guide pin has an end surface that abuts against the other end of the elastic body, and is in contact with the spherical pin at a top surface. [Embodiment] Please refer to FIG. 3 to FIG. 5, which are schematic diagrams showing a three-dimensional structure and a partially enlarged three-dimensional structure of a preferred embodiment of the apparatus for reading a group. The test ball array package element of the present invention = a plurality of ball joints of the ball-to-ball array package component 32. The ball grid_package 32 is tested on the circuit board 33 of the W real system. The device 3 for testing the ball grid array package component mainly comprises a - portion circuit board 33, a plurality of elastic bodies, and a plurality of pins 35. "U 34 has -- and a plurality of __ 32__ wide, the conduction is through the carrier portion 34, so that - the first side = a first side 343 phase conduction, and the conduction hole 344 is evenly sentenced The cloth has a lead 1325059 - an electric body 341 which is made of a conductive material, and the invention is preferably made of gold or a gold alloy. The money board 33 () is disposed on the circuit board 33 of the real system. In the preferred embodiment of the present invention, the docking portion 330 is designed to be spherical in shape to facilitate connection with the via hole 344. When the circuit board 33 and the second side surface 343 are in contact with each other, the plurality of abutting portions 330 and the plurality of conductive vias 344 are connected by a surface mount technology (SMT), of course, the circuit board 33 The second side 343 can also be connected to each other using surface mount bonding technology (SMT). A plurality of elastic bodies 31 are disposed in the through holes 344 corresponding to the through holes 344, and the elastic body 3 ends against the abutting portion 33A. The guide pin 祁 is also located in the through hole 344. The guide pin 35 has an end surface 352 and a top surface. For example, the end surface 352 abuts the other end of the elastic body 31, and the top surface 351 can be It is in contact with the spherical pin 320. Since the elastic body 31 and the guide pin are made of a conductive material, the ball grid _ package component 32 and the circuit board 33 can be directly processed after the top surface 351 is in contact with the ball 320. The mutual telecommunications connection conducts the test of the ball grid array package component 32 on the circuit board 33 of the real system. In the preferred embodiment of the present invention, the device 3 further includes a cover portion 36, and the cover portion 36 can abut the first side surface 342, so that the elastic body 31 and the guide pin 35 are fixed to the conduction. Hole 344 towel. The cover portion 36 further has a plurality of through holes 361 corresponding to the plurality of through holes 344 and at least one fastener 祁2, and the through holes 505a 361 can extend the top surface 351 of the guide pin 35 out of the cover The plate portion % is externally contactable with the ball-shaped pin 320, and the connector 362 is connected to the carrier portion 36 by the cover portion/. ’
適用本案構想之晶㈣試齡可為單—球柵陣列域元件之 測試裝置3所構成之單晶片測試模組，亦可為複數個球桃陣列封 裝元件之測試裝置3所構成之多晶片測試模組。於本發明較佳實 施例中，該電子訊號測試治具3更包括有一定位座37、—鎖固部 以及-壓蓋部38所構成。前述載板部34係設置於該球拇陣列封 裝兀件32與該電路板33之間，以作為電路板％與該球柳陣列封 裝轉32間信麟輸的媒介。#球鱗朗裝元件&進行測試 時’需要藉由定位座37來使球柵陣列封裝元件％之球形接腳汹 與相對應的該導針35相接觸，因此定位座37具有—容置空間 37i，以用於放置球栅陣列封裝元㈣。於一些實施例中，定位座 ^系藉由鎖固部(圖中未示出），例如：螺絲，與該蓋板部％及載 _部34 _在—起’當要測試不同封裝形狀大小與球形接聊數的 ，只要利用卫具鬆開鎖件沾並更換具不_狀大小的 奋置4 371的定位座37，如此就可因應不同的需求，解決習知 ^式裝置因無法更換定位座37而需重新開模製造的缺點。當铁， =本案構想之晶片測試模組可為單一球柵陣列封裝元件之測試 二3所構成之單晶片測試模組’亦可為複數個球拇陣列封裝元 件之測試裝置3所構成之多晶片測試模組。當晶片測試模組為複 ^25059 - · .數個球柵陣列封裝元件測試裝置3所構成之多晶片測試模組時， 鎖固部39以及定減37 #皆可選抛地共用，以便驗裝與節 省成本。而該壓蓋部38係設置於該定位座37之上方，可位於開 啟狀態’讓使用者可將該球栅陣列封裝元件幻放置於定位座π 之容置空間371 N。亦可位於封閉狀態，壓迫該球柵陣列封裳元 件32之球形接腳32〇與該導針35確切接觸導接，如此一來即可 進行測試步驟。 • 因此本發明之測試球栅陣列封裝元件之裝置實是克服習用技 術之缺失’滿足雜界之需求並提高產#解力。本發明之目的 及功效上均深富實施之進步性，極具產#之利用價值，且為目前 市面上前所未見之新發明，完全符合發日林歡新雛與進步性 要件’爰依法提出申請。 ‘准以上所述者，僅為本發明之較佳實施例而已，當不能以之 限定本發明所實施之範圍。即大凡依本發明申請專利二圍:作之 均等變化與修飾，皆應仍屬於本發明專利涵蓋之範圍内，謹請主 審查委員明鏗，並祈惠准，是所至禱。 貝 【圖式簡單說明】 第 第 圖其係為使用傳統脇測試插座組來連接球拇陣列封裳元件 之球形接聊與電路板之導孔之結構示意圖。 圖其係為使用另一傳統腿測試插座組來連接球拇陣列封裝 凡件之球形接腳與電路板之導孔之結構示意圖。 12 第 圖其係為本發明測試球栅陣列封裝 體結構組合示意圖。 元件之裝置較佳實施例立 第4圖其係為本發明測試裝置之局部放大 第5圖其係為本發明測試球柵陣列 。構續示意圖。 視剖面結構示意圖。 元件之裝置較佳實施例側 【主要元件符號說明】 卜2 I BGA測試插座組The crystal (4) for the purpose of the present invention can be a single-wafer test module composed of a test device 3 of a single-ball grid array domain component, or a multi-wafer test composed of a test device 3 of a plurality of spherical peach array package components. Module. In the preferred embodiment of the present invention, the electronic signal test fixture 3 further includes a positioning base 37, a locking portion and a gland portion 38. The carrier portion 34 is disposed between the ball thumb array package member 32 and the circuit board 33 as a medium for the board between the board % and the ball array package. When the test is performed, the ball joint of the ball grid array package component % is required to be in contact with the corresponding guide pin 35, so that the positioning seat 37 has the accommodating Space 37i is used to place the ball grid array package element (4). In some embodiments, the positioning seat is formed by a locking portion (not shown), such as a screw, and the cover portion % and the carrier portion 34 are in a different package shape. If you use the visor to loosen the lock and replace the locating seat 37 with the size of the 4 371, you can solve the problem of the conventional device because of the different requirements. The disadvantage of the mold 37 is that it needs to be re-opened. When the iron, = the wafer test module envisaged in this case can be a single ball grid array package component test 3, the single-chip test module can also be a plurality of ball thumb array package test device 3 Wafer test module. When the wafer test module is a multi-wafer test module composed of a plurality of ball grid array package component test devices 3, the lock portion 39 and the cut-off portion 37 are all optional for sharing. Install and save costs. The capping portion 38 is disposed above the positioning seat 37, and can be in an open state, so that the user can phantomly place the ball grid array package component in the accommodating space 371N of the positioning seat π. Alternatively, the ball pin 32A of the ball grid array sealing member 32 can be pressed into contact with the guide pin 35, so that the test step can be performed. • Therefore, the apparatus for testing a ball grid array package component of the present invention overcomes the deficiencies of conventional techniques to meet the needs of the miscellaneous world and to increase the yield. The purpose and efficacy of the invention are both profound and rich in the implementation of the progress, the use value of the production #, and the new inventions that have never been seen before on the market, fully in line with the new young and progressive elements of the hairs of the forest Application. The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto. That is to say, the application of the patent according to the invention: the equal change and modification should be within the scope of the patent of the present invention. I would like to ask the chief reviewer to abide and pray for it. Shell [Simplified description of the diagram] The first figure is a schematic diagram of the use of the traditional threat test socket set to connect the ball socket of the ball array and the guide hole of the circuit board. The figure is a structural schematic diagram of using another conventional leg test socket set to connect the spherical pin of the ball thumb array package to the guide hole of the circuit board. 12 is a schematic diagram of the structural combination of the test ball grid array package of the present invention. DETAILED DESCRIPTION OF THE DEVICE OF THE ELEMENTS FIG. 4 is a partial enlarged view of the test apparatus of the present invention. FIG. 5 is a test ball grid array of the present invention. The structure continues. A schematic view of the cross-sectional structure. Component device preferred embodiment side [Main component symbol description] Bu 2 I BGA test socket group
10、 20 ··盒體 11、 21 :夾具 12、 22 :球栅陣列封裝元件 13、 23 :電路板 101、 201 :介面層 102、 202:容置空間 103、 203 :通孔 φ 1〇4、2〇4:彈性導針 104a、204a :接觸端 104b、204b :接腳 120、220 ··球形接腳 130、230 ··導孔 3:測試裝置 31 :彈性體 32 :球柵陣列封裝元件 1325059 :球形接腳 電路板 :對接部 載板部 :導電體 :第一側面 :第二側面 :導通孔 導針 :頂面 :端面 蓋板部 :穿孔 :連固件 定位座 371 :容置空間 38 :壓蓋部10, 20 · Box 11 , 21 : Fixtures 12 , 22 : Ball grid array package components 13 , 23 : Circuit boards 101 , 201 : Interface layers 102 , 202 : accommodating spaces 103 , 203 : Through holes φ 1〇4 2〇4: elastic guide pins 104a, 204a: contact ends 104b, 204b: pins 120, 220 · ball joints 130, 230 · guide holes 3: test device 31: elastomer 32: ball grid array package components 1325059: spherical pin circuit board: butt joint carrier part: conductor: first side: second side: through hole guide pin: top surface: end cover part: perforation: even firmware positioning seat 371: accommodation space 38 : gland part