TWI320932B - Output driver for dynamic random access memory - Google Patents
Output driver for dynamic random access memory Download PDFInfo
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- TWI320932B TWI320932B TW095124005A TW95124005A TWI320932B TW I320932 B TWI320932 B TW I320932B TW 095124005 A TW095124005 A TW 095124005A TW 95124005 A TW95124005 A TW 95124005A TW I320932 B TWI320932 B TW I320932B
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
- G11C11/409—Read-write [R-W] circuits
- G11C11/4096—Input/output [I/O] data management or control circuits, e.g. reading or writing circuits, I/O drivers or bit-line switches
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/14—Power supply arrangements, e.g. power down, chip selection or deselection, layout of wirings or power grids, or multiple supply levels
- G11C5/147—Voltage reference generators, voltage or current regulators; Internally lowered supply levels; Compensation for voltage drops
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/02—Arrangements for writing information into, or reading information out from, a digital store with means for avoiding parasitic signals
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
- G11C7/1051—Data output circuits, e.g. read-out amplifiers, data output buffers, data output registers, data output level conversion circuits
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/003—Modifications for increasing the reliability for protection
- H03K19/00369—Modifications for compensating variations of temperature, supply voltage or other physical parameters
- H03K19/00384—Modifications for compensating variations of temperature, supply voltage or other physical parameters in field effect transistor circuits
Description
1320932 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種輸出驅動器;且更明確地說,係關於 一種用於輸出一穩定位準之輸出訊號的輸出驅動器。 【先前技術】 隨著一包括於一動態隨機存取記憶體(DRAM)中之輸出 驅動器的驅動強度增大,該DRAM與一連接至該DRAM之 系統之間的資料傳輸速度變得更快。為了確保一高速資料 傳輸,要求輸出驅動器之轉換率(slew rate)大於一預定最 J值而與製程、電壓及溫度的變化無關。若輸出驅動器 之轉換率過大,則輸出驅動器之電流耗用突然增大。另 外,當轉換率過大時’由DRAM與系統之間之不完美終端 所引起的反射亦增大。因此,一輸出訊號具有不穩定值。 由於此原因,輸出驅動器之轉換率需要小於一預定最大 值。換言之,要求即使當諸如製程、電壓及溫度之環境條 件變化時,輸出驅動器之轉換率維持於一在最小值與最大 值之間變動的值,以輸出一穩定輸出訊號。 圖1係一習知輸出驅動器的方塊圖。 如所展示,輸出驅動器包括一預上拉驅動單元2〇,其用 於響應於-預上拉驅動訊號pre_UP而執行_預上拉驅動操 作;一預下拉驅動單元3〇,其用於響應於_預下拉驅動訊 號pre_DNb而執行一預下拉驅動操作;及—驅動單元w, 其用於響應於預上拉驅動單元20及預下拉驅動單元%之輸 出而驅動一輸出訊號。 j 112691.doc 1320932 晶體PMl、NMl、NM2及PM3與輸出節點A、B及c之間的 被動/0件(意即,電阻器R1至R4),以減小輸出驅動器之轉 換率的變化。吾人已熟知諸如電阻器之被動元件比諸如一 MOS電晶體之主動元件較少受製程、電壓及溫度的變化之 影響。因此,藉由包括被動元件(例如,電阻器旧至尺斗), 輸出驅動器之轉換率的變化可稍微減小。在此情況下,因 為電阻器R1至R4,所以輸出驅動器之轉換率減小。轉換 率之減小可藉由增大NMOS電晶體之尺寸來補償。 雖然可能藉由在MOS電晶體與輸出節點之間組態被動元 件來減小輸出驅動器之轉換率的變化,但輸出驅動器之轉 換率仍根據製程、電壓及溫度而變化。 【發明内容】 因此,本發明之一目標係提供一種輸出一穩定位準之輸 出訊號的輸出驅動器β 根據本發明之一態樣,提供一種輸出驅動器其包括: 一預上拉驅動單元,其經組態以響應於一預上拉驅動訊號 而執仃一預上拉驅動操作;一預下拉驅動單元,其經組態 以響應於一預下拉驅動器訊號而執行一預下拉驅動操作; 一驅動單元,其經組態以響應於該預上拉驅動單元及該預 二拉驅動單元之輸出而執行—驅動操作;及—轉換率補償 單元,其經組態以感測該驅動單元之轉換率的變化,藉此 控制預上拉驅動單元及預下拉驅動單元。預上拉驅動單元 及預下拉驅動單元之驅動強度係可調的。 根據本發明之另一態樣,提供一種輸出驅動器,其包 112691.doc 1320932 轉換率補償單元,其經組態以感測輸出驅動器之轉 換率的變化’藉此產生複數個轉換率補償訊號;一預上拉 驅動單元’其經組態以響應於該複數個轉換率補償訊號而 執行預上拉操作;一預下拉驅動單元’其經組態以響應 於該複數個轉換率補償訊號而執行一預下拉操作;及一驅 動單元’其經組態以響應於該預上拉驅動單元及該預下拉 驅動單元的輪出而驅動一輸出訊號。 【實施方式】1320932 IX. Description of the Invention: [Technical Field] The present invention relates to an output driver; and more particularly to an output driver for outputting a stable level of output signal. [Prior Art] As the driving strength of an output driver included in a dynamic random access memory (DRAM) increases, the data transfer speed between the DRAM and a system connected to the DRAM becomes faster. In order to ensure a high speed data transmission, the slew rate of the output driver is required to be greater than a predetermined maximum J value regardless of variations in process, voltage and temperature. If the conversion rate of the output driver is too large, the current consumption of the output driver suddenly increases. In addition, when the conversion rate is too large, the reflection caused by the imperfect terminal between the DRAM and the system also increases. Therefore, an output signal has an unstable value. For this reason, the conversion rate of the output driver needs to be less than a predetermined maximum value. In other words, it is required that the output driver's slew rate is maintained at a value that varies between a minimum value and a maximum value even when environmental conditions such as process, voltage, and temperature change to output a stable output signal. Figure 1 is a block diagram of a conventional output driver. As shown, the output driver includes a pre-pull drive unit 〇 for performing a _ pre-pull drive operation in response to the pre-pull drive signal pre_UP; a pre-pull drive unit 〇 for responding to _ pre-pull down the drive signal pre_DNb to perform a pre-pull-down drive operation; and - a drive unit w for driving an output signal in response to the output of the pre-pull drive unit 20 and the pre-pull drive unit %. j 112691.doc 1320932 Passive / 0 pieces (ie, resistors R1 to R4) between crystals PM1, NM1, NM2, and PM3 and output nodes A, B, and c to reduce the change in the conversion ratio of the output driver. It is well known that passive components such as resistors are less susceptible to variations in process, voltage, and temperature than active components such as a MOS transistor. Thus, by including a passive component (eg, a resistor old to a bucket), the change in slew rate of the output driver can be slightly reduced. In this case, since the resistors R1 to R4, the conversion ratio of the output driver is reduced. The reduction in conversion rate can be compensated by increasing the size of the NMOS transistor. Although it is possible to reduce the change in the slew rate of the output driver by configuring a passive element between the MOS transistor and the output node, the conversion rate of the output driver varies depending on the process, voltage, and temperature. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an output driver that outputs a stable level output signal. According to an aspect of the present invention, an output driver includes: a pre-pull drive unit Configuring to perform a pre-pull drive operation in response to a pre-pull drive signal; a pre-pull drive unit configured to perform a pre-pull drive operation in response to a pre-pull drive signal; Configuring, in response to the output of the pre-pull drive unit and the pre-two pull drive unit, performing a drive operation; and - a conversion rate compensation unit configured to sense a conversion rate of the drive unit The change thereby controls the pre-pull drive unit and the pre-pull drive unit. The drive strength of the pre-pull drive unit and the pre-pull drive unit is adjustable. In accordance with another aspect of the present invention, an output driver is provided that includes a 112691.doc 1320932 slew rate compensation unit configured to sense a change in a slew rate of an output driver 'by generating a plurality of slew rate compensation signals; a pre-pull drive unit configured to perform a pre-pull operation in response to the plurality of conversion rate compensation signals; a pre-pull drive unit configured to execute in response to the plurality of conversion rate compensation signals a pre-pull operation; and a drive unit configured to drive an output signal in response to the rotation of the pre-pull drive unit and the pre-pull drive unit. [Embodiment]
下文中將參看隨附圖式詳細描述一根據本發明的用於一 半導體記憶體裝置中之輸出驅動器。 圖2係一根據本發明之一實施例之輸出驅動器的方塊 圖0 如所展示,輸出驅動器包括一驅動單元1〇〇、一預上拉 驅動單元200、一預下拉驅動單元300及一轉換率補償單元 400 ^轉換率補償單元4〇〇感測環境條件(例如,製程、電 壓及溫度)’且產生轉換率補償訊號EN[1:3]及ENb[l:3]。 在轉換率補償訊號EN[1:3]及ENb[l:3]之控制下,預上拉驅 動單元200響應於一預上拉驅動訊號pre_Up而執行一預上 拉驅動操作。在轉換率補償訊號EN[L3]&ENb[1:3]之控制 下,預下拉驅動單元3〇〇響應於一預下拉驅動訊號pre_DNb 而執行一預下拉驅動操作。驅動單元1〇〇響應於分別自預 上拉驅動單元200及預下拉驅動單元3〇〇輸出之一上拉驅動 訊號UPb及一下拉驅動訊號DN,而驅動一輸出訊號。如上 文所提及,藉由根據環境條件之轉換率補償訊號en[i 3] 112691.doc 1320932 及ENb[ 1:3]來控制預上拉驅動單元200及預下拉驅動單元 300之驅動強度。DETAILED DESCRIPTION OF THE INVENTION An output driver for use in a semiconductor memory device in accordance with the present invention will now be described in detail with reference to the accompanying drawings. 2 is a block diagram of an output driver according to an embodiment of the present invention. As shown, the output driver includes a driving unit 1 , a pre-pull driving unit 200 , a pre-pull driving unit 300 , and a conversion rate. The compensation unit 400 ^ conversion rate compensation unit 4 〇〇 senses environmental conditions (eg, process, voltage, and temperature) and generates conversion rate compensation signals EN[1:3] and ENb[l:3]. Under the control of the conversion rate compensation signals EN[1:3] and ENb[l:3], the pre-pull drive unit 200 performs a pre-pull drive operation in response to a pre-pull drive signal pre_Up. Under the control of the conversion rate compensation signal EN[L3]&ENb[1:3], the pre-pull drive unit 3 performs a pre-pull-down driving operation in response to a pre-pull drive signal pre_DNb. The driving unit 1 drives an output signal in response to one of the pull-up driving signal UPb and the pull-up driving signal DN from the pre-pull driving unit 200 and the pre-pull driving unit 3, respectively. As mentioned above, the driving strengths of the pre-pull driving unit 200 and the pre-pull driving unit 300 are controlled by the conversion rate compensation signals en[i 3] 112691.doc 1320932 and ENb[ 1:3] according to environmental conditions.
驅動單元100包括一第四PMOS電晶體PM4、一第四 NMOS電晶體NM4,以及一第五及一第六電阻器R5及R6。 連接於一電源電壓VDDQ端子與第五電阻器R5之間的第四 PMOS電晶體PM4在其閘極處接收上拉驅動訊號UPb。第五 電阻器R5連接於第四PMOS電晶體PM4與一輸出節點D之 間。連接於一接地電壓VSSQ端子與第六電阻器R6之間的 第四NMOS電晶體NM4在其閘極處接收下拉驅動訊號DN。 第六電阻器R6連接於第四NMOS電晶體NM4與輸出節點D 之間。 圖3係描繪圖2中所示之轉換率補償單元400的示意電路 圖。The driving unit 100 includes a fourth PMOS transistor PM4, a fourth NMOS transistor NM4, and a fifth and sixth resistors R5 and R6. The fourth PMOS transistor PM4 connected between a power supply voltage VDDQ terminal and the fifth resistor R5 receives the pull-up drive signal UPb at its gate. The fifth resistor R5 is connected between the fourth PMOS transistor PM4 and an output node D. The fourth NMOS transistor NM4 connected between a ground voltage VSSQ terminal and the sixth resistor R6 receives the pull-down driving signal DN at its gate. The sixth resistor R6 is connected between the fourth NMOS transistor NM4 and the output node D. FIG. 3 is a schematic circuit diagram depicting the conversion rate compensation unit 400 shown in FIG. 2.
如所展示,轉換率補償單元400包括一轉換率感測單元 420、一數位化單元440及一訊號產生單元460。轉換率感 測單元420包括一組態相同於預上拉驅動單元200及預下拉 驅動單元300之組態的MOS電晶體組態,且感測該MOS電 晶體之轉換率根據製程、電壓及溫度之變化的變化。數位 化單元440劃分轉換率感測單元420之一輸出。接收數位化 單元440之輸出的訊號產生單元460輸出轉換率補償訊號 EN[1:3]及 ENb[l:3]。 轉換率感測單元420係用串聯連接於一内部電壓VINT端 子與接地電壓VSSQ端子之間的複數個電晶體予以實施。 該等電晶體之一者係一 MOS電晶體,其相同於組態於預上 112691.doc 1320932As shown, the conversion rate compensation unit 400 includes a conversion rate sensing unit 420, a digitizing unit 440, and a signal generating unit 460. The conversion rate sensing unit 420 includes a MOS transistor configuration configured in the same configuration as the pre-pull drive unit 200 and the pre-pull drive unit 300, and senses the conversion rate of the MOS transistor according to the process, voltage, and temperature. Changes in change. The digitizing unit 440 divides the output of one of the conversion rate sensing units 420. The signal generating unit 460 that receives the output of the digitizing unit 440 outputs the conversion rate compensation signals EN[1:3] and ENb[l:3]. The conversion rate sensing unit 420 is implemented by a plurality of transistors connected in series between an internal voltage VINT terminal and a ground voltage VSSQ terminal. One of the transistors is a MOS transistor, which is identical to the configuration in the previous 112691.doc 1320932
拉驅動單元200及預下拉驅動單元3 00中的電晶體。圖3中 所示之轉換率感測單元420包括串聯連接之一第七電阻器 R7、一第五NMOS電晶體NM5及一第六NMOS電晶體 NM6。第七電阻器R7連接於内部電壓VINT端子與一輸出 節點之間。在其閘極處接收一外部電源電壓VDD的第五 NMOS電晶體NM5連接於輸出節點與第六NMOS電晶體 NM6之間。在其閘極處接收一感測訊號SEN的第六NMOS 電晶體NM6連接於第五NMOS電晶體NM5與接地電壓VSSQ 端子之間。第五NMOS電晶體NM5相同於包括於組態於預 上拉驅動單元200及預下拉驅動單元300中的NMOS電晶 體。The driving unit 200 and the transistor in the pre-pull driving unit 300 are pulled. The slew rate sensing unit 420 shown in Fig. 3 includes a seventh resistor R7, a fifth NMOS transistor NM5, and a sixth NMOS transistor NM6 connected in series. The seventh resistor R7 is connected between the internal voltage VINT terminal and an output node. A fifth NMOS transistor NM5 receiving an external power supply voltage VDD at its gate is connected between the output node and the sixth NMOS transistor NM6. A sixth NMOS transistor NM6 receiving a sense signal SEN at its gate is connected between the fifth NMOS transistor NM5 and the ground voltage VSSQ terminal. The fifth NMOS transistor NM5 is identical to the NMOS transistor included in the pre-pull driving unit 200 and the pre-pull driving unit 300.
一供應至轉換率感測單元420之内部電壓VINT維持一預 定穩定位準。因此,轉換率感測單元420能可靠地感測外 部電源電壓VDD之位準而不受環境條件(例如,製程、電 壓及溫度)之影響。感測訊號SEN僅當達到一適當臨限位準 時啟用轉換率感測單元420,以節省轉換率感測單元420的 電流耗用。 數位化單元440包括一參考電壓產生器442及一比較單元 444。參考電壓產生器442輸出複數個參考電壓。比較單元 444將參考電壓之每一者與轉換率感測單元420之輸出比 較。參考電壓產生器442包括複數個電阻器R8、R9及 R10,其串聯連接於内部電壓VINT端子與接地電壓VSSQ 端子之間。比較單元444包括複數個差動放大器DAM1及 DAM2。每一差動放大器接收參考電壓之一者及轉換率感 11269i.doc -10- 1320932 測單元420之輸出。 訊號產生單元460響應於數位化單元440之複數個輸出訊 號而輸出轉換率補償訊號EN[1:3]及ENb[l:3]。訊號產生單 元460可用通用邏輯區塊及鎖存器來實施。An internal voltage VINT supplied to the conversion rate sensing unit 420 maintains a predetermined stable level. Therefore, the conversion rate sensing unit 420 can reliably sense the level of the external power supply voltage VDD without being affected by environmental conditions such as process, voltage, and temperature. The sensing signal SEN enables the slew rate sensing unit 420 only when an appropriate threshold level is reached to save current consumption of the slew rate sensing unit 420. The digitizing unit 440 includes a reference voltage generator 442 and a comparing unit 444. The reference voltage generator 442 outputs a plurality of reference voltages. Comparison unit 444 compares each of the reference voltages to the output of slew rate sensing unit 420. The reference voltage generator 442 includes a plurality of resistors R8, R9, and R10 connected in series between the internal voltage VINT terminal and the ground voltage VSSQ terminal. Comparison unit 444 includes a plurality of differential amplifiers DAM1 and DAM2. Each of the differential amplifiers receives one of the reference voltages and the output of the sense unit 420 11269i.doc -10- 1320932. The signal generating unit 460 outputs the conversion rate compensation signals EN[1:3] and ENb[l:3] in response to the plurality of output signals of the digitizing unit 440. Signal generation unit 460 can be implemented with general purpose logic blocks and latches.
轉換率補償單元400可經由第五NMOS電晶體NM5來感測 預上拉驅動單元200及預下拉驅動單元3 00之轉換率的變 化。當外部電源電壓VDD之位準較低且MOS電晶體之驅動 強度較小時,已啟用之轉換率補償訊號EN[1:3]及ENb[l:3] 的數目增大。反之,當外部電源電壓VDD之位準較高且 MOS電晶體之驅動強度較大時,已啟用之轉換率補償訊號 EN[ 1:3]及ENb[ 1:3]的數目減小。另外,數位化單元440中 之電阻器及比較器的數目可根據所要之轉換率補償單元 4 0 0的敏感性而變化。 圖4係根據本發明之一實施例之描繪訊號產生單元的示 意電路圖。The conversion rate compensation unit 400 can sense a change in the conversion ratio of the pre-pull drive unit 200 and the pre-pull drive unit 300 through the fifth NMOS transistor NM5. When the level of the external power supply voltage VDD is low and the driving strength of the MOS transistor is small, the number of enabled conversion rate compensation signals EN[1:3] and ENb[l:3] increases. Conversely, when the level of the external power supply voltage VDD is high and the driving strength of the MOS transistor is large, the number of enabled conversion rate compensation signals EN[1:3] and ENb[1:3] is reduced. Additionally, the number of resistors and comparators in the digitizing unit 440 can vary depending on the sensitivity of the desired slew rate compensation unit 400. 4 is a schematic circuit diagram of a depicted signal generating unit in accordance with an embodiment of the present invention.
訊號產生單元460包括一邏輯單元462、一鎖存器單元 464,以及複數個傳輸閘TGI、TG2及TG3。邏輯單元462 邏輯地將數位化單元440之輸出COMP_OUTl及 COMP_OUT2與外部電源電壓VDD組合並輸出複數個邏輯 訊號。鎖存器單元464鎖存邏輯訊號並輸出轉換率補償訊 號EN[1:3]及ENb[l:3]。複數個傳輸閘TGI、TG2及TG3之 每一者響應於一轉換率控制訊號對SR_LAT及SR_LATB而 傳輸對應之邏輯訊號。 訊號產生單元460接收兩個輸出COMP_OUTl及 112691.doc 1320932The signal generating unit 460 includes a logic unit 462, a latch unit 464, and a plurality of transmission gates TGI, TG2, and TG3. The logic unit 462 logically combines the outputs COMP_OUT1 and COMP_OUT2 of the digitizing unit 440 with the external power supply voltage VDD and outputs a plurality of logic signals. The latch unit 464 latches the logic signal and outputs the conversion rate compensation signals EN[1:3] and ENb[l:3]. Each of the plurality of transmission gates TGI, TG2, and TG3 transmits a corresponding logic signal in response to a conversion rate control signal pair SR_LAT and SR_LATB. The signal generating unit 460 receives two outputs COMP_OUT1 and 112691.doc 1320932
COMP—OUT2並輸出三對轉換率補償訊號EN[1:3]及 ENb[l:3]。邏輯單元462包括三個「反及」(NAND)閘 ND1、ND2及ND3 »第一「反及」閘ND1通常經由兩個輸 入端子接收外部電源電壓VDD並邏輯地將其組合,意即, 外部電源電壓VDD經由第一「反及」閘ND1之兩個輸入端 子而輸入。第二「反及」閘ND2邏輯地將外部電源電壓 VDD與數位化單元440之第二輸出COMP_OUT2組合。第三 「反及」閘ND3邏輯地將外部電源電壓VDD與數位化單元 440之第一輸出COMP_OUTl組合》鎖存器單元464包括複 數個鎖存器,其每一者鎖存對應之邏輯訊號。響應於一邏 輯高位準之轉換率控制訊號SRJLAT而更新鎖存器單元464 中所鎖存之值。 表1展示圖4中所示之訊號產生單元的操作》 表1COMP-OUT2 outputs three pairs of conversion rate compensation signals EN[1:3] and ENb[l:3]. Logic unit 462 includes three "NAND" gates ND1, ND2, and ND3. The first "reverse" gate ND1 typically receives the external supply voltage VDD via two input terminals and logically combines it, that is, external The power supply voltage VDD is input via the two input terminals of the first "reverse" gate ND1. The second "reverse" gate ND2 logically combines the external supply voltage VDD with the second output COMP_OUT2 of the digitizing unit 440. The third "reverse" gate ND3 logically combines the external supply voltage VDD with the first output COMP_OUT1 of the digitizing unit 440. The latch unit 464 includes a plurality of latches, each of which latches a corresponding logic signal. The value latched in latch unit 464 is updated in response to a logic high level slew rate control signal SRJLAT. Table 1 shows the operation of the signal generating unit shown in Fig. 4" Table 1
VDD COMP一OUT1 COMP_OUT2 EN[1] EN[2] EN[3] 低 Η H H H H 中 L H H H L Tfj L L H L LVDD COMP-OUT1 COMP_OUT2 EN[1] EN[2] EN[3] Low Η H H H H L H H H L Tfj L L H L L
根據包括於轉換率感測單元420及數位化單元440中的 NMOS電晶體之尺寸及電阻器之電阻而將外部電源電壓 VDD分類為三個位準,意即,"低"、"中"及"高"。若外部 電源電壓VDD具有一"低”位準,則數位化單元440之第一 及第二輸出COMP-OUT1及COMP_OUT2皆具有一邏輯高位 準。若外部電源電壓VDD具有"中”位準,則第一輸出 112691.doc -1?· 1^20932 拉驅動單元200之電路類似的電路。因此,為了避免冗 餘,將不再對其進行詳細描述。 當外部電源電壓VDD之位準較低且MOS電晶體之驅動強 度較小時(意即,當轉換率較小時),自轉換率補償單元4〇〇 輸出的已啟用之轉換率補償訊號EN[1:3]&ENb[1:3]的數目The external power supply voltage VDD is classified into three levels according to the size of the NMOS transistor included in the conversion rate sensing unit 420 and the digitizing unit 440 and the resistance of the resistor, that is, "low"," Medium " &"high". If the external power supply voltage VDD has a "low" level, the first and second outputs COMP-OUT1 and COMP_OUT2 of the digitizing unit 440 have a logic high level. If the external power supply voltage VDD has a "medium" Then, the first output 112691.doc -1?·1^20932 pulls the circuit similar to the circuit of the driving unit 200. Therefore, in order to avoid redundancy, it will not be described in detail. When the level of the external power supply voltage VDD is low and the driving strength of the MOS transistor is small (that is, when the conversion rate is small), the enabled conversion rate compensation signal EN of the self-conversion rate compensation unit 4〇〇 is output. Number of [1:3]&ENb[1:3]
增大。因此,包括於預上拉驅動單元2〇〇及預下拉驅動單 元300中的開啟之反轉器的數目增大。因此,輸出驅動器 之一輸出訊號的轉換率增大。當外部電源電壓VDD之位準 較高且MOS電晶體之驅動強度較大時(意即,當轉換率較 大時),自轉換率補償單元4〇〇輸出的已啟用之轉換率補償 訊號EN[ 1:3]及ENb[ 1:3]的數目減小。因此,開啟之反轉器 的數目減小。因此,輸出驅動器之輸出訊號的轉換率減 小。以此方式,輸出訊號之轉換率經穩定調節以具有一在 一預定範圍中的值。Increase. Therefore, the number of inverters included in the pre-pull driving unit 2A and the pre-pull driving unit 300 is increased. Therefore, the conversion rate of the output signal of one of the output drivers increases. When the level of the external power supply voltage VDD is high and the driving strength of the MOS transistor is large (that is, when the conversion rate is large), the enabled conversion rate compensation signal EN of the self-conversion rate compensation unit 4〇〇 is output. The number of [ 1:3] and ENb[ 1:3] is reduced. Therefore, the number of inverters that are turned on is reduced. Therefore, the conversion rate of the output signal of the output driver is reduced. In this way, the conversion rate of the output signal is stably adjusted to have a value within a predetermined range.
在圖3中所示之實施例中,轉換率補償單元4〇〇在轉換率 感測早元420中包括NMOS電晶體NM5。然而,在另一實施 例中’轉換率感測單元420可包括一 pm〇s電晶體,其與包 括於預上拉驅動單元200及預下拉驅動單元3〇〇中之pM〇s 電晶體相同。 根據本發明之輸出驅動器根據環境條件(例如,製程、 電壓及溫度)之變化而適當地調節預上拉驅動單元及預下 拉驅動單元的驅動強度。因此’輸出訊號之轉換率的變化 保持於一預定範圍内。因此’本發明改良輸出驅動器之可 靠性及訊號完整性。 112691.(10-. 1320932 400 轉換率補償單元 420 轉換率感測單元 440 數位化單元 442 參考電壓產生器 444 比較單元 . 460 訊號產生單元 462 邏輯單元 464 鎖存器單元 • DAM1 差動放大器 DAM2 差動放大器 ND1 「反及」(NAND)閘 ND2 「反及」(NAND)閘 ND3 「反及」(NAND)閘 NM1 第一 NMOS電晶體/MOS電晶體 NM2 第二NMOS電晶體/MOS電晶體 NM3 第三NMOS電晶體 ^ NM4 第四NMOS電晶體 - NM5 第五NMOS電晶體/NMOS電晶體 NM6 第六NMOS電晶體 NM7 第七NMOS電晶體 NM8 第八NMOS電晶體/NMOS電晶體 NM9 第九NMOS電晶體/NMOS電晶體 NM10 第十NMOS電晶體 NM11 第十一 NMOS電晶體/NMOS電晶體 112691.doc -17- 1320932In the embodiment shown in FIG. 3, the conversion rate compensation unit 4A includes an NMOS transistor NM5 in the conversion rate sensing early element 420. However, in another embodiment, the 'conversion rate sensing unit 420 may include a pm〇s transistor that is the same as the pM〇s transistor included in the pre-pull drive unit 200 and the pre-pull drive unit 3〇〇. . The output driver according to the present invention appropriately adjusts the driving strength of the pre-pull driving unit and the pre-drawing driving unit in accordance with changes in environmental conditions (e.g., process, voltage, and temperature). Therefore, the change in the conversion rate of the output signal is maintained within a predetermined range. Thus, the present invention improves the reliability and signal integrity of the output driver. 112691. (10-. 1320932 400 conversion rate compensation unit 420 conversion rate sensing unit 440 digital unit 442 reference voltage generator 444 comparison unit. 460 signal generation unit 462 logic unit 464 latch unit • DAM1 differential amplifier DAM2 difference Active Amplifier ND1 "Reverse" (NAND) Gate ND2 "Reverse" (NAND) Gate ND3 "Reverse" (NAND) Gate NM1 First NMOS transistor / MOS transistor NM2 Second NMOS transistor / MOS transistor NM3 Third NMOS transistor ^ NM4 Fourth NMOS transistor - NM5 Fifth NMOS transistor / NMOS transistor NM6 Sixth NMOS transistor NM7 Seventh NMOS transistor NM8 Eight NMOS transistor / NMOS transistor NM9 Ninth NMOS Crystal/NMOS transistor NM10 Tenth NMOS transistor NM11 Eleventh NMOS transistor/NMOS transistor 112691.doc -17- 1320932
NM12 第十二NMOS電晶體/NMOS電盖 PM1 第一 PMOS電晶體/MOS電晶體 PM2 第二PMOS電晶體 PM3 第三PMOS電晶體/MOS電晶體 PM4 第四PMOS電晶體 PM5 第五PMOS電晶體 PM6 第六PMOS電晶體/PMOS電晶體 PM7 第七PMOS電晶體/PMOS電晶體 PM8 第八PMOS電晶體 PM9 PMOS電晶體 PM10 第十PMOS電晶體/PMOS電晶體 R1 第一電阻器/電阻器 R2 第二電阻器/電阻器 R3 第三電阻器/電阻器 R4 第四電阻器/電阻器 R5 第五電阻器 R6 第六電阻器 R7 第七電阻器 R8 電阻器 R9 電阻器 RIO 電阻器 112691.doc -18 -NM12 Twelfth NMOS transistor/NMOS cap PM1 First PMOS transistor/MOS transistor PM2 Second PMOS transistor PM3 Third PMOS transistor/MOS transistor PM4 Fourth PMOS transistor PM5 Fifth PMOS transistor PM6 Sixth PMOS transistor/PMOS transistor PM7 Seventh PMOS transistor/PMOS transistor PM8 Eight PMOS transistor PM9 PMOS transistor PM10 Tenth PMOS transistor/PMOS transistor R1 First resistor/resistor R2 Second Resistor / Resistor R3 Third Resistor / Resistor R4 Fourth Resistor / Resistor R5 Fifth Resistor R6 Sixth Resistor R7 Seventh Resistor R8 Resistor R9 Resistor RIO Resistor 112691.doc -18 -
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KR20090074427A (en) | 2008-01-02 | 2009-07-07 | 삼성전자주식회사 | Data output buffer circuit and semiconductor memory device including that |
KR101020291B1 (en) | 2009-02-03 | 2011-03-07 | 주식회사 하이닉스반도체 | Predriver and output driver circuit using the same |
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TWI503821B (en) * | 2012-07-09 | 2015-10-11 | Faraday Tech Corp | Static random access memory apparatus and bit-line volatge controller thereof |
CN103905028B (en) * | 2012-12-25 | 2018-05-25 | 中芯国际集成电路制造(上海)有限公司 | Signal receiver and signal transmission apparatus |
CN104104383B (en) * | 2013-04-09 | 2017-12-26 | 北京时代全芯科技有限公司 | A kind of Slew Rate and the adjustable offline drive device of resistance |
CN105306043B (en) * | 2014-06-04 | 2018-11-06 | 晶豪科技股份有限公司 | Input buffer |
CN107919154B (en) * | 2017-12-11 | 2018-10-26 | 长鑫存储技术有限公司 | A kind of input/output driver calibration circuit, method and semiconductor memory |
US10438649B2 (en) * | 2018-02-17 | 2019-10-08 | Micron Technology, Inc. | Systems and methods for conserving power in signal quality operations for memory devices |
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