TWI319748B - Polyimide composite flexible board and its preparation - Google Patents

Polyimide composite flexible board and its preparation

Info

Publication number
TWI319748B
TWI319748B TW95127281A TW95127281A TWI319748B TW I319748 B TWI319748 B TW I319748B TW 95127281 A TW95127281 A TW 95127281A TW 95127281 A TW95127281 A TW 95127281A TW I319748 B TWI319748 B TW I319748B
Authority
TW
Taiwan
Prior art keywords
preparation
flexible board
polyimide composite
composite flexible
polyimide
Prior art date
Application number
TW95127281A
Other languages
English (en)
Other versions
TW200806469A (en
Inventor
Kuen Yuan Hwang
An Bang Duh
Sheng Yen Wu
Te Yu Lin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW95127281A priority Critical patent/TWI319748B/zh
Priority to JP2007006362A priority patent/JP4448147B2/ja
Priority to US11/653,957 priority patent/US20080026195A1/en
Publication of TW200806469A publication Critical patent/TW200806469A/zh
Application granted granted Critical
Publication of TWI319748B publication Critical patent/TWI319748B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
TW95127281A 2006-07-26 2006-07-26 Polyimide composite flexible board and its preparation TWI319748B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW95127281A TWI319748B (en) 2006-07-26 2006-07-26 Polyimide composite flexible board and its preparation
JP2007006362A JP4448147B2 (ja) 2006-07-26 2007-01-15 ポリイミド複合フレキシブルシートとその製造方法
US11/653,957 US20080026195A1 (en) 2006-07-26 2007-01-17 Polyimide composite flexible board and its preparation field of the invention

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95127281A TWI319748B (en) 2006-07-26 2006-07-26 Polyimide composite flexible board and its preparation

Publications (2)

Publication Number Publication Date
TW200806469A TW200806469A (en) 2008-02-01
TWI319748B true TWI319748B (en) 2010-01-21

Family

ID=38986667

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95127281A TWI319748B (en) 2006-07-26 2006-07-26 Polyimide composite flexible board and its preparation

Country Status (3)

Country Link
US (1) US20080026195A1 (zh)
JP (1) JP4448147B2 (zh)
TW (1) TWI319748B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5727885B2 (ja) * 2010-09-07 2015-06-03 Ｊｆｅケミカル株式会社 ポリイミドおよびポリイミドフィルム
KR101720218B1 (ko) * 2015-01-29 2017-03-27 에스케이이노베이션 주식회사 저흡습 연성 금속박 적층체
CN111303792A (zh) * 2020-04-09 2020-06-19 中天电子材料有限公司 热熔性聚酰亚胺胶膜及其制备方法及应用
CN113737213A (zh) * 2021-09-01 2021-12-03 上海纳米技术及应用国家工程研究中心有限公司 一种柔性聚酰亚胺碳布复合电极材料的制备方法及其产品和应用

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4937133A (en) * 1988-03-28 1990-06-26 Nippon Steel Chemical Co., Ltd. Flexible base materials for printed circuits
US6379784B1 (en) * 1999-09-28 2002-04-30 Ube Industries, Ltd. Aromatic polyimide laminate
TW574261B (en) * 2000-08-28 2004-02-01 Ube Industries Method of producing through-hole in aromatic polyimide film
JP4304854B2 (ja) * 2000-09-21 2009-07-29 宇部興産株式会社 多層ポリイミドフィルムおよび積層体
JP4508441B2 (ja) * 2001-02-16 2010-07-21 新日鐵化学株式会社 積層体及びその製造方法
US7026436B2 (en) * 2002-11-26 2006-04-11 E.I. Du Pont De Nemours And Company Low temperature polyimide adhesive compositions and methods relating thereto
JP2005167006A (ja) * 2003-12-03 2005-06-23 Shin Etsu Chem Co Ltd フレキシブル金属箔ポリイミド基板の製造方法

Also Published As

Publication number Publication date
JP2008030434A (ja) 2008-02-14
TW200806469A (en) 2008-02-01
JP4448147B2 (ja) 2010-04-07
US20080026195A1 (en) 2008-01-31

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