TWI319606B - Inductor - Google Patents

Inductor

Info

Publication number
TWI319606B
TWI319606B TW095112467A TW95112467A TWI319606B TW I319606 B TWI319606 B TW I319606B TW 095112467 A TW095112467 A TW 095112467A TW 95112467 A TW95112467 A TW 95112467A TW I319606 B TWI319606 B TW I319606B
Authority
TW
Taiwan
Prior art keywords
inductor
Prior art date
Application number
TW095112467A
Other languages
English (en)
Other versions
TW200707602A (en
Inventor
Chung Chi Huang
Richard Kunze
Beom-Taek Lee
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of TW200707602A publication Critical patent/TW200707602A/zh
Application granted granted Critical
Publication of TWI319606B publication Critical patent/TWI319606B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/645—Inductive arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0776—Resistance and impedance
    • H05K2201/0792—Means against parasitic impedance; Means against eddy currents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/0949—Pad close to a hole, not surrounding the hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1003—Non-printed inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array

Landscapes

  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Structure Of Printed Boards (AREA)
  • Networks Using Active Elements (AREA)
  • Filters And Equalizers (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Coils Or Transformers For Communication (AREA)
TW095112467A 2005-04-11 2006-04-07 Inductor TWI319606B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/105,141 US7474539B2 (en) 2005-04-11 2005-04-11 Inductor

Publications (2)

Publication Number Publication Date
TW200707602A TW200707602A (en) 2007-02-16
TWI319606B true TWI319606B (en) 2010-01-11

Family

ID=37037011

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095112467A TWI319606B (en) 2005-04-11 2006-04-07 Inductor

Country Status (5)

Country Link
US (1) US7474539B2 (zh)
CN (1) CN101180924B (zh)
DE (1) DE112006000862B4 (zh)
TW (1) TWI319606B (zh)
WO (1) WO2006110868A2 (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7692467B2 (en) * 2007-02-03 2010-04-06 Advanced Micro Devices, Inc. Capacitance for decoupling intermediate level power rails
WO2008097911A1 (en) * 2007-02-05 2008-08-14 Rambus Inc. Semiconductor package with embedded spiral inductor
US7956713B2 (en) * 2007-09-25 2011-06-07 Intel Corporation Forming a helical inductor
US20100237462A1 (en) * 2009-03-18 2010-09-23 Benjamin Beker Package Level Tuning Techniques for Propagation Channels of High-Speed Signals
US20120243193A1 (en) * 2009-04-29 2012-09-27 Hon Hai Precision Industry Co., Ltd. Motherboard interconnection device and motherboard interconnection method
EP2290687A1 (en) * 2009-08-27 2011-03-02 Nxp B.V. Designing packaged integrated circuits for reducing impedance discontinuities
US8365399B2 (en) * 2009-12-03 2013-02-05 International Business Machines Corporation Method of connecting components to a printed circuit board
DE112012003721T5 (de) * 2011-09-07 2014-06-18 Samtec, Inc. Durchgangslochstruktur zum Übertragen differentieller Signale
US10008316B2 (en) * 2014-03-28 2018-06-26 Qualcomm Incorporated Inductor embedded in a package substrate
CN104143547B (zh) * 2014-07-25 2016-08-24 西安交通大学 一种并联电容中间布局的低寄生电感GaN 功率集成模块
US9576718B2 (en) * 2015-06-22 2017-02-21 Qualcomm Incorporated Inductor structure in a semiconductor device
US9548551B1 (en) * 2015-08-24 2017-01-17 International Business Machines Corporation DIMM connector region vias and routing
DE112016006129T5 (de) * 2015-12-31 2018-10-18 Intel Corporation Mikrospulenvorrichtung für einen induktiven Ausgleich in Gehäusen und PCB für Anordnungen mit nicht durchgehenden und vergrabenen Durchkontaktierungen
US10727892B2 (en) * 2017-08-03 2020-07-28 Nxp Usa, Inc. Interface circuit
US10021784B1 (en) * 2017-12-19 2018-07-10 Powertech Technology Inc. Electronic device and electronic circuit board thereof
CN111695319A (zh) * 2020-06-05 2020-09-22 苏州浪潮智能科技有限公司 一种实时补偿连接器串联回路电感的方法和设备
US11778731B2 (en) * 2021-10-18 2023-10-03 Raytheon Company Systems and methods for break out of interconnections for high-density integrated circuit packages on a multi-layer printed circuit board

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US22110A (en) * 1858-11-23 Jonathan dillon
EP0698896B1 (en) * 1994-08-24 1998-05-13 Yokogawa Electric Corporation Printed coil
US5990776A (en) 1994-12-08 1999-11-23 Jitaru; Ionel Low noise full integrated multilayers magnetic for power converters
JP2990652B2 (ja) * 1996-03-22 1999-12-13 株式会社村田製作所 積層型バルントランス
US6175727B1 (en) * 1998-01-09 2001-01-16 Texas Instruments Israel Ltd. Suspended printed inductor and LC-type filter constructed therefrom
JP2000223905A (ja) * 1999-02-02 2000-08-11 Toko Inc 電子装置
FR2790328B1 (fr) * 1999-02-26 2001-04-20 Memscap Composant inductif, transformateur integre, notamment destines a etre incorpores dans un circuit radiofrequence,et circuit integre associe avec un tel composant inductif ou transformateur integre
US6198374B1 (en) * 1999-04-01 2001-03-06 Midcom, Inc. Multi-layer transformer apparatus and method
US6304232B1 (en) * 2000-02-24 2001-10-16 The Goodyear Tire & Rubber Company Circuit module
WO2001099480A2 (en) 2000-06-19 2001-12-27 3M Innovative Properties Company Printed circuit board having inductive vias
KR100666762B1 (ko) * 2001-02-27 2007-01-09 엔지케이 스파크 플러그 캄파니 리미티드 고주파회로 기판 및 그것을 이용한 고주파용 안테나스위치 모듈
DE10139707A1 (de) * 2001-08-11 2003-02-20 Philips Corp Intellectual Pty Leiterplatte
DE10144464C2 (de) * 2001-09-10 2003-07-17 Infineon Technologies Ag Elektronisches Bauteil mit Induktionsspule für Hochfrequenzanwendungen und Verfahren zur Herstellung desselben
JP4211591B2 (ja) * 2003-12-05 2009-01-21 株式会社村田製作所 積層型電子部品の製造方法および積層型電子部品

Also Published As

Publication number Publication date
DE112006000862B4 (de) 2011-06-09
TW200707602A (en) 2007-02-16
US7474539B2 (en) 2009-01-06
CN101180924B (zh) 2011-09-21
US20060227522A1 (en) 2006-10-12
DE112006000862T5 (de) 2008-04-10
CN101180924A (zh) 2008-05-14
WO2006110868A3 (en) 2007-01-04
WO2006110868A2 (en) 2006-10-19

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees