TWI318587B - Film-forming method - Google Patents

Film-forming method

Info

Publication number
TWI318587B
TWI318587B TW093136784A TW93136784A TWI318587B TW I318587 B TWI318587 B TW I318587B TW 093136784 A TW093136784 A TW 093136784A TW 93136784 A TW93136784 A TW 93136784A TW I318587 B TWI318587 B TW I318587B
Authority
TW
Taiwan
Prior art keywords
film
forming method
forming
Prior art date
Application number
TW093136784A
Other languages
English (en)
Other versions
TW200529938A (en
Inventor
Taiichiro Aoki
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200529938A publication Critical patent/TW200529938A/zh
Application granted granted Critical
Publication of TWI318587B publication Critical patent/TWI318587B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0218—Pretreatment, e.g. heating the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
TW093136784A 2003-12-01 2004-11-29 Film-forming method TWI318587B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003402227A JP2005161168A (ja) 2003-12-01 2003-12-01 被膜形成方法

Publications (2)

Publication Number Publication Date
TW200529938A TW200529938A (en) 2005-09-16
TWI318587B true TWI318587B (en) 2009-12-21

Family

ID=34725877

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093136784A TWI318587B (en) 2003-12-01 2004-11-29 Film-forming method

Country Status (4)

Country Link
US (1) US7569253B2 (zh)
JP (1) JP2005161168A (zh)
KR (1) KR20050053010A (zh)
TW (1) TWI318587B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI849104B (zh) * 2019-04-23 2024-07-21 日商東京威力科創股份有限公司 基板處理方法及基板處理裝置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4794021A (en) * 1986-11-13 1988-12-27 Microelectronics And Computer Technology Corporation Method of providing a planarized polymer coating on a substrate wafer
TW439197B (en) * 1997-10-31 2001-06-07 Dow Corning Electronic coating having low dielectric constant
JP4087000B2 (ja) * 1999-03-08 2008-05-14 日鉱金属株式会社 レードル及びレードルのライニング方法
JP2002134592A (ja) * 2000-10-19 2002-05-10 Tokyo Ohka Kogyo Co Ltd 熱処理装置および熱処理方法
JP2002324745A (ja) 2001-04-25 2002-11-08 Tokyo Ohka Kogyo Co Ltd レジスト膜形成方法
JP4118659B2 (ja) * 2001-12-03 2008-07-16 東京応化工業株式会社 基板用トレイ
JP3897694B2 (ja) * 2002-12-27 2007-03-28 東京応化工業株式会社 基板用トレイ
JP4093878B2 (ja) * 2003-02-20 2008-06-04 東京応化工業株式会社 多段式処理装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI849104B (zh) * 2019-04-23 2024-07-21 日商東京威力科創股份有限公司 基板處理方法及基板處理裝置

Also Published As

Publication number Publication date
KR20050053010A (ko) 2005-06-07
US7569253B2 (en) 2009-08-04
TW200529938A (en) 2005-09-16
JP2005161168A (ja) 2005-06-23
US20050196536A1 (en) 2005-09-08

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees