1315175 . ，八、發明說明： 【發明所屬之技術領域】 本如明係關於一散熱系統(Heat dissipating system)，該散熱系 用以移除一龟子元件(Electronic component)於運作過程中所產生 之熱能。特別地’本發明係關於一雙模態散熱系統(1)1^1_111〇如Heat dissipating system) ’該雙模態散熱系統係以熱交換、熱傳導或二者 相之方式，移除該電子元件於運作過程中所產生之熱能。該 雙核‘％散熱系統亦可增設—風扇，使該風扇係提供—氣流，以加 速排除該電子元件於運作過程中所產生之熱能。 【先前技術】1315175 . Eight, invention description: [Technical field of the invention] This is a heat dissipating system for removing a turtle component during operation. The heat. In particular, the present invention relates to a dual modal heat dissipation system (1) 1^1_111 such as a heat dissipating system. 'The bimodal heat dissipation system removes the electronic component by heat exchange, heat conduction or both. The heat generated during the operation. The dual-core '% cooling system can also be equipped with a fan to provide the airflow to speed up the heat generated by the electronic components during operation. [Prior Art]
’其一為利用一 低其顯示晶片之溫度外: 該高轉速風扇係設於該電子元 電子元件之周圍設置複數個散 之該氣流，將該電子元件於 以達到散熱之效果。 亦可以降低該顯示卡上其他 運轉時所產生之該熱外，也 之溫度，如顯示卡之散熱風One is to use a lower temperature of the display chip: the high-speed fan is disposed around the electronic component of the electronic component to provide a plurality of scattered airflows, thereby dissipating the electronic component to achieve the effect of dissipating heat. It is also possible to reduce the heat generated by other operations on the display card, as well as the temperature, such as the heat dissipation of the display card.
J水冷式散熱裝置，該 該電子元件於運作過程 該水冷式散熱裝置係附著於 程所產生之熱係與該水冷式 5 1315175 散熱裝置熱偶合後，達到散熱之效果。。 以上兩種不同類型之散熱裝置，皆只具有單_之散能 右该風扇發生轉’或是該水冷散絲置缺水 ，熱系統之效率，亦會造成電子元件故障，以J可： 7用風4降低電？^件溫度之紐，料電子元件於 速，但ί’ίίΐίϊ高，勢，必須相對地提高該散熱風扇的轉 、一現者風扇轉速的提尚，也帶來越來越多的噪音。另外，σ ，用水冷式散熱裝置之方法，也只能單—地降低該電子元件之= 種能夠良好散熱’並能兼具上述兩種散熱型態 ίίϋίΐ ίΓ要性’以電子元件於運轉時所產生之溫度越 η，。有鑑於此，本發明人發揮創意， 發，逐有本發明之產生。 ^ 【發明内容】 ㈣ίϊϊ之I目的在於提供—種雙模態散熱系統，該雙模態散 以熱交換、熱傳導或二者相結合之方式，移除該電子 件於運作過程中所產生之熱能，以達降溫之效果。 料之另—目的在於提供—種雙·散熱系統，該雙模態 可增設—風扇，使該風扇係提供-氣流，以加速排除 该電子7C件於運作過程中所產生之熱能。 發日狀散鮮統，其散熱效率可獲得大幅提升。即使 及4水冷式散㈣置兩者之—發生轉，亦不會造成該電 于7〇件過熱。 β ^於本發明之優點與精神可以藉由以下的發明詳述及所附圖 式付到進一步的了解。 【實施方式】 6 -1315175 子元忿錄以供電 熱。下文轉雜縣發狀數“ 散 之之第—較佳具體實施例 -基座⑴，該器模㈣，包含 ，過程，會產生熱能，該基座m _ 件於運作 基座⑴之周圍。該等散侧⑴ttri=u=形成於該 電子元件通相定於—i _ Ϊ處卡上之—圖形處理晶片。另，該電 體實施例之i埶系if的二為3本發明之第—較佳具 ,,a ^ J 于兄的頂視圖。圖一 c為根據本骖明夕笛土 1 °1 ^i-：i ΐΐ 模組12 °其中與圖—A相同之元件， ^不再贅述。該熱父換模组12係固定於該散熱器模組 ί二;2r上。因此’如圖一 C所示，該熱交換模組12及該散埶哭 Ϊίέ =ΐ該散熱系統1，並且該等散_片出亦= 向四周呈輕射狀排列。該熱交換模組1 ;一,體’亚透過熱偶合之方式，以移除該基座m所傳導；； 換模組12之該液體，例如水，係置於該熱交換模ίί ^内部，並透過熱偶合之方式，以移除自該基座m所 一風扇13係設於該熱交換模組丨2或該散熱器模組n上， 以提供-氣流吹向該等散_片H卜以排除自該基座u = 之熱能，進而傳送熱能至散熱,_片⑴。該吹向轉散執㈣ 111之氣流，亦排除自該基座112所傳導之熱能之外之熱能了= 到移除該電子電路板16 ±之熱能之效果。若子元件為—圖开; 1315175J water-cooled heat sink, the electronic component is in operation. The water-cooled heat sink is attached to the heat generated by the process and thermally coupled with the water-cooled 5 1315175 heat sink to achieve heat dissipation. . The above two different types of heat sinks only have a single _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Use the wind 4 to reduce electricity? The temperature of the piece is the speed of the electronic components, but the ί'ίίΐίϊ high, potential, must relatively improve the rotation of the cooling fan, the speed of the fan fan, and bring more and more noise. In addition, σ, the method of water-cooled heat sink, can only reduce the electronic component by a single type, and can have good heat dissipation, and can have both heat dissipation types. ίίίίίίίίίίίίίίί The temperature produced is η. In view of this, the inventors of the present invention have developed their creativity, and have produced the present invention. ^ [Summary] (4) The purpose of I is to provide a dual-mode heat dissipation system, which uses heat exchange, heat conduction or a combination of the two to remove the heat generated by the electronic component during operation. In order to achieve the effect of cooling. In addition, the purpose is to provide a dual heat dissipation system, which can add a fan to provide a gas flow to accelerate the elimination of the heat generated by the electronic 7C during operation. The heat dissipation efficiency can be greatly improved. Even if the 4 water-cooled type (4) is set to rotate, it will not cause the electricity to overheat. The advantages and spirit of the present invention can be further understood from the following detailed description of the invention and the accompanying drawings. [Embodiment] 6 - 1315175 sub-element recorded with power supply. In the following, the number of the dynamites is the same as the pedestal (1), and the dies (4), including, the process, generate heat energy, and the susceptor m _ is around the operating pedestal (1). The side of the invention (1) ttri = u = formed on the electronic component through the -i _ Ϊ card - the graphics processing wafer. In addition, the second embodiment of the electrical system is the third of the invention - preferred, a ^ J is the top view of the brother. Figure 1 c is based on the Benxi Ming Tuo 1 °1 ^i-:i 模组 module 12 ° which is the same component as Figure -A, ^ No Further, the hot parent replacement module 12 is fixed on the heat sink module ί 2; 2r. Therefore, as shown in FIG. 1C, the heat exchange module 12 and the heat dissipation module έ ΐ ΐ ΐ 散热 散热 散热 散热1, and the scatter-slices are also arranged in a light-like arrangement around the circumference. The heat exchange module 1; one, the body 'transparently thermally coupled to remove the conduction of the susceptor m; The liquid of group 12, such as water, is placed inside the heat exchange module ίί^ and is thermally coupled to remove a fan 13 from the base m to the heat exchange module 丨 2 or The dispersion On the device module n, a gas flow is supplied to the air scatter sheet to exclude heat energy from the susceptor u = , thereby transferring heat energy to heat dissipation, and the _ sheet (1) is blown to the airflow (four) 111 Also, the thermal energy other than the thermal energy conducted by the susceptor 112 is excluded = the effect of removing the thermal energy of the electronic circuit board 16 ± if the sub-element is - Figure Open; 1315175
處理晶片時，該届扁〗Q 外’，除該顯示卡上傳導之熱能之 之散熱系統1之2根據本發日狀第二較佳具體實施例 含-固定部141二埶交ϋ ^頂視圖。該熱傳送模組14係包 係接觸―電子元件有—基座121，該基座121 141使該熱傳送模组件上之熱能。藉由該固定部 14之固定部141的二;莫、组12相接合。該熱傳送模組 則與該熱傳鰭片ιη。該等散鱗片 邻141為啦、、^ 、、 4本體之垂直方向加以延伸，並以該固定 子電路板16I 該電子元件_定於一電 子元件亦可為卡上之—圖麟理晶片，另，該電 奸實二及圖二c。圖二B為根據本發明之第一較佳具 佳具體實施ifiii的頂視圖。圖二C為根據本發明之第二車交 送i組Μ及—‘交^^爆亥散熱系統1包含一熱傳 IS組由該固定部⑷與該以 仲设口進而組成該散熱系統。因此，如圖二匚斛； 匕組12藉由該固定部141與該熱傳送模組14進一步組 二1 ’並且該等散熱鰭片111亦以該熱交換模組12咬 為中心，向四周呈_，該熱交換模2 組14所傳導之該熱。 π「于必”、、得送才果 二該風扇13係設於該熱交換模組12或該熱傳送模組14上 供—氣流吹向該錄熱鰭片m，以排除自該祕送模組U 所傳導之熱能’進而傳送熱能至該等散熱鰭片m。該吹向 熱籍片111之氣流，亦排除自該熱傳送模組14所傳導之熱^ ^ 之熱，以達到移除該電子電路板16上之熱能之效果。若卜 件為-圖形處理晶片時’該風扇13除可排除自該熱傳送模組^元 8 1315175 =導之熱能之外’亦可排除該顯示卡上其他至少1子電路之 發明具希望能更力，描述本 f具相等性的安排於本發明所欲申請之專内各種改變 【圖式簡單說明】 1之 的 爆炸圖 1之 散熱觸體物之散熱系統 頂視; ;B為根縣㈣之第—触具體實關讀熱系統i ^ C為根據本發明之第一較佳具體實施例之散熱系統 散熱日㈣二較佳具體實施例之散熱系統！散熱^之第二較佳具斷關之散熱系統1 之 之 爆炸圖 ^ C為根據本發明之第二較佳具體實施敵散熱系統！ 之 η:散熱器模組 112 ·基座 121 ·基座 14 ·熱傳送模組 【主要元件符號說明】 1:雙模態散熱系統 111 :散熱鰭片 12 :熱交換模組 13 :風扇 9 1315175 141 :固定部 16 :電子電路板When the wafer is processed, the heat dissipation system 1 of the heat dissipation of the display card is in addition to the second preferred embodiment of the second embodiment of the present invention. view. The heat transfer module 14 is in contact with an electronic component having a pedestal 121 that causes the heat to transfer heat to the mold assembly. The second portion of the fixing portion 141 of the fixing portion 14 is joined to the group 12. The heat transfer module is coupled to the heat transfer fins. The scallops 141 are extended in the vertical direction of the body, and the fixed circuit board 16I. The electronic component is set on an electronic component or a card. In addition, the electric rape is second and the second is c. Figure 2B is a top plan view of a first preferred embodiment of the invention according to the present invention. Figure 2C shows a second car delivery i group according to the present invention and - the "crossing system" includes a heat transfer IS group consisting of the fixing portion (4) and the secondary port to form the heat dissipation system. Therefore, the group 12 is further assembled by the fixing portion 141 and the heat transfer module 14 and the heat dissipating fins 111 are also centered by the heat exchange module 12, and are circumferentially In the _, the heat exchanged by the heat exchange die group 14 is conducted. The fan 13 is disposed on the heat exchange module 12 or the heat transfer module 14 for blowing airflow to the heat recording fin m to exclude the secret delivery. The thermal energy conducted by the module U in turn transmits thermal energy to the fins m. The airflow directed to the thermal sheet 111 also excludes heat from the heat transfer module 14 to remove the thermal energy from the electronic circuit board 16. If the device is a graphics processing chip, the fan 13 can exclude the heat of the heat transfer module, and can eliminate the other at least one sub-circuit on the display card. More powerfully, the description of the f is equal to the arrangement of the invention to be applied for various changes [simplified description of the drawing] 1 of the explosion of Figure 1 of the heat sink body of the heat dissipation system top view; ; B for the county (4) The first-touch specific heat reading system i ^ C is the heat dissipation system of the heat dissipation system according to the first preferred embodiment of the present invention (4). The heat dissipation system of the preferred embodiment! The second preferred embodiment of the heat dissipation system 1 is an exploded view of the heat dissipation system 1 in accordance with the second preferred embodiment of the present invention! η: heat sink module 112 · pedestal 121 · pedestal 14 · heat transfer module [main component symbol description] 1: dual modal heat dissipation system 111: heat sink fin 12: heat exchange module 13: fan 9 1315175 141: fixing portion 16: electronic circuit board
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