CN208954031U - One kind being used for CPU efficient radiating apparatus - Google Patents

Abstract

The utility model discloses one kind to be used for CPU efficient radiating apparatus, including central processing element, the upper end of the central processing element is fixedly connected with thermal grease layer, the inner cavity top of the thermal grease layer is inlaid with thermal conductive silicon blob of viscose, the upper end of the thermal grease layer is fixedly connected with heat-radiating substrate, the innermost insert of the heat-radiating substrate has cooling piece, radiating shell is fixedly connected on the outside of the upper end of the heat-radiating substrate, the outer lower portion of the radiating shell is fixedly connected with induced draft plate, exhaust vent is provided in the lower case of the radiating shell, the upper end of the radiating shell is provided with air inlet hole, upper all outsides of the radiating shell are fixedly connected to connection shell.This is used for CPU efficient radiating apparatus, and by being equipped with the structure of thermal grease layer and cooling piece, the heat that can efficiently generate to central processing element radiates；By being equipped with the structure of thermal conductive silicon blob of viscose, the heat-sinking capability of equipment is improved.

Description

One kind being used for CPU efficient radiating apparatus

Technical field

The utility model relates to technical field of electric power, specially a kind of to be used for CPU efficient radiating apparatus.

Background technique

CPU is one piece of ultra-large integrated circuit, is the arithmetic core and control core of a computer.Its function Data mainly in interpretive machine instruction and processing computer software.CPU radiator, which is that every computer is indispensable, to be set Standby, generally when buying computer CPU or after extra purchase, when carrying out installment work, high fever, which can occur, for the work of CPU leads to CPU Work by larger limitation, cause to crash if overheat, thus the heat dissipation performance of radiator is CPU job stability It is crucial.The CPU radiator of the prior art adds the structure of fan using radiator, and heat is passed by the radiating fin of radiator It passs, fan accelerates the circulation of air-flow, so that heat is taken away as early as possible, but common radiator can not timely absorb CPU The heat on surface, so that the heat dissipation of CPU is not quick enough, therefore we have proposed one kind to be used for CPU efficient radiating apparatus.

Utility model content

The purpose of this utility model is to provide one kind to be used for CPU efficient radiating apparatus, to solve in above-mentioned background technique The problem of proposition.

To achieve the above object, the utility model provides the following technical solutions: one kind being used for CPU efficient radiating apparatus, packet Include central processing element, the upper end of the central processing element is fixedly connected with thermal grease layer, the thermal grease layer it is interior Chamber top is inlaid with thermal conductive silicon blob of viscose, and the upper end of the thermal grease layer is fixedly connected with heat-radiating substrate, the heat-radiating substrate Innermost insert has cooling piece, is fixedly connected with radiating shell, the outside of the radiating shell on the outside of the upper end of the heat-radiating substrate Lower part is fixedly connected with induced draft plate, and exhaust vent is provided in the lower case of the radiating shell, and the upper end of the radiating shell is opened There is air inlet hole, upper all outsides of the radiating shell are fixedly connected to connection shell, and the inner cavity top of the connection shell is solid Surely it is connected with radiator fan.

Preferably, the thermal conductive silicon blob of viscose is equipped with several, and the thermal conductive silicon blob of viscose is uniformly embedded in thermal grease layer Inner cavity top.

Preferably, the cooling piece is equipped with several, and the cooling piece is uniformly embedded in the inside of heat-radiating substrate, described The quantity of cooling piece is equal to the quantity of thermal conductive silicon blob of viscose, and the cooling piece is oppositely arranged with thermal conductive silicon blob of viscose, the cooling piece Lower end is fixedly linked with thermal conductive silicon blob of viscose upper end, and the upper end of the cooling piece is radiating surface, the cooling piece successively electrical series.

Preferably, the exhaust vent is equipped with several, and the exhaust vent equidistant arrangement is in the lower case of radiating shell.

Preferably, the air inlet hole is equipped with several, and the air inlet hole is uniformly arranged in the upper end of radiating shell, described The section of air inlet hole is in isosceles trapezoid shape.

Compared with prior art, the utility model has the beneficial effects that this is used for CPU efficient radiating apparatus, by being equipped with The structure of thermal grease layer and cooling piece, the heat that can efficiently generate to central processing element radiates, so that central The work for handling chip is more stable；By being equipped with the structure of thermal conductive silicon blob of viscose, thermal conductive silicon blob of viscose can not only absorb heat, And the lower surface that can also protect cooling piece is capable of increasing the compactness connected between cooling piece and thermal grease layer, improves The heat-sinking capability of equipment；By being equipped with the structure of air inlet hole, the wind speed of radiator fan blowout can be improved.

Detailed description of the invention

Fig. 1 is the utility model section view.

In figure: 1 central processing element, 2 thermal grease layers, 3 heat-radiating substrates, 4 cooling pieces, 5 thermal conductive silicon blob of viscoses, 6 air inducing Plate, 7 radiating shells, 8 exhaust vents, 9 air inlet holes, 10 connection shells, 11 radiator fans.

Specific embodiment

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work Every other embodiment obtained, fall within the protection scope of the utility model.

Referring to Fig. 1, the utility model provides a kind of technical solution: one kind is for CPU efficient radiating apparatus, including center Chip 1 is handled, the upper end of the central processing element 1 is fixedly connected with thermal grease layer 2, and thermal grease layer 2 is put for power The thermally conductive and heat dissipation of the electronic components such as big device, transistor, electron tube, CPU, to guarantee the electrical of electronic instrument and meter etc. The stabilization of performance, the inner cavity top of the thermal grease layer 2 are inlaid with thermal conductive silicon blob of viscose 5, and thermal conductive silicon blob of viscose 5 can not only absorb Heat, and the lower surface of cooling piece 4 can also be protected, be capable of increasing connected between cooling piece 4 and thermal grease layer 2 it is close Property, improve the heat-sinking capability of equipment, heat conductive silica gel can be coated on various electronic products extensively, the heater in electrical equipment with Contact surface between cooling facilities plays heat transfer and the performances such as moisture-proof, dust-proof, anticorrosion, shockproof, the heat conductive silica gel Block 5 is equipped with several, and the thermal conductive silicon blob of viscose 5 is uniformly embedded in the inner cavity top of thermal grease layer 2.The thermal grease layer 2 upper end is fixedly connected with heat-radiating substrate 3, and for heat-radiating substrate 3 in order to connect cooling piece 4, the brand of cooling piece 4 is AMPHENOL, The innermost insert of the heat-radiating substrate 3 has cooling piece 4, and the cooling piece 4 is equipped with several, and the cooling piece 4 is uniformly inlayed In the inside of heat-radiating substrate 3, the quantity of the cooling piece 4 is equal to the quantity of thermal conductive silicon blob of viscose 5, the cooling piece 4 and thermal conductive silicon Blob of viscose 5 is oppositely arranged, and lower end and 5 upper end of thermal conductive silicon blob of viscose of the cooling piece 4 are fixedly linked, and the upper end of the cooling piece 4 is Radiating surface, the cooling piece 4 successively electrical series, cooling piece 4 is in order to accelerate the heat dissipation of thermal grease layer 2.The heat-radiating substrate 3 Upper end on the outside of be fixedly connected with radiating shell 7, the outer lower portion of the radiating shell 7 is fixedly connected with induced draft plate 6, induced draft plate In 6 winds to central processing element 1 blown out in order to avoid exhaust vent 8, outlet air is provided in the lower case of the radiating shell 7 Hole 8, the exhaust vent 8 are equipped with several, and 8 equidistant arrangement of exhaust vent is in the lower case of radiating shell 7.The heat dissipation The upper end of shell 7 is provided with air inlet hole 9, and air inlet hole 9 can speed up the wind that radiator fan 11 is blown into, and the air inlet hole 9 is equipped with several A, the air inlet hole 9 is uniformly arranged in the upper end of radiating shell 7, and the section of the air inlet hole 9 is in isosceles trapezoid shape.It is described Upper all outsides of radiating shell 7 are fixedly connected to connection shell 10, and the inner cavity top of the connection shell 10 is fixedly connected with Radiator fan 11, the model 50X50X10MM of radiator fan 11, brand TELESKY, radiator fan 11 are external by conducting wire Power supply.

Working principle: for CPU efficient radiating apparatus when being worked, the heat that central processing element 1 generates can quilt Thermal grease layer 2 absorbs, and is connected by external wire with power supply after all series connection of cooling piece 4, logical in central processing element 1 When electricity work, cooling piece 4 and radiator fan 11 can be also powered on, and cooling piece 4 can absorb the heat in thermal grease layer 2, The heat transfer of absorption to 4 upper end of cooling piece space interior, and radiator fan 11 can work, drive air-flow blow to air inlet hole 9, The inside that air-flow can enter radiating shell 7 after the acceleration of air inlet hole 9 passes through flowing to blow to the upper surface of cooling piece 4 Wind heat is taken away by exhaust vent 8.

While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art, It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.

Claims (5)

1. one kind is used for CPU efficient radiating apparatus, including central processing element (1), it is characterised in that: the central processing element (1) upper end is fixedly connected with thermal grease layer (2), and the inner cavity top of the thermal grease layer (2) is inlaid with thermal conductive silicon blob of viscose (5), the upper end of the thermal grease layer (2) is fixedly connected with heat-radiating substrate (3), and the innermost insert of the heat-radiating substrate (3) has The upper end outside of cooling piece (4), the heat-radiating substrate (3) is fixedly connected with radiating shell (7), outside the radiating shell (7) Side lower part is fixedly connected with induced draft plate (6), is provided with exhaust vent (8), the radiation shell in the lower case of the radiating shell (7) The upper end of body (7) is provided with air inlet hole (9), and upper all outsides of the radiating shell (7) are fixedly connected to connection shell (10), institute The inner cavity top for stating connection shell (10) is fixedly connected with radiator fan (11).

2. according to claim 1 a kind of for CPU efficient radiating apparatus, it is characterised in that: the thermal conductive silicon blob of viscose (5) Equipped with several, the thermal conductive silicon blob of viscose (5) is uniformly embedded in the inner cavity top of thermal grease layer (2).

3. according to claim 1 a kind of for CPU efficient radiating apparatus, it is characterised in that: the cooling piece (4) is equipped with Several, the cooling piece (4) is uniformly embedded in the inside of heat-radiating substrate (3), and the quantity of the cooling piece (4) is equal to thermally conductive The quantity of silica gel block (5), the cooling piece (4) are oppositely arranged with thermal conductive silicon blob of viscose (5), the lower end of the cooling piece (4) with lead Hot silica gel block (5) upper end is fixedly linked, and the upper end of the cooling piece (4) is radiating surface, and the cooling piece (4) is successively electrically gone here and there Connection.

4. according to claim 1 a kind of for CPU efficient radiating apparatus, it is characterised in that: the exhaust vent (8) is equipped with Several, exhaust vent (8) equidistant arrangement is in the lower case of radiating shell (7).

5. according to claim 1 a kind of for CPU efficient radiating apparatus, it is characterised in that: the air inlet hole (9) is equipped with Several, the air inlet hole (9) is uniformly arranged in the upper end of radiating shell (7), and the section of the air inlet hole (9) is in isosceles ladder Shape.