1314890 的年^月3^日修(吏)正替換頁 第095124172號專利申請案 -中文說明書替換頁（97年6月） 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種固定待拋光元件的吸附性墊片及其製 造方法’詳言之’係關於一種使用於化學機械拋光製程之 固定待拋光元件的吸附性墊片及其製造方法。 【先前技術】 拋光一般係指化學機械研磨（CMP)製程中，對於初為粗 | 糙表面的磨耗控制’其係利用含細粒子的研磨漿液平均分 散於一研磨墊之上表面’同時將一待拋光元件抵住該研磨 墊後以重覆規律動作搓磨。該待拋光元件係諸如半導體、 儲存媒體基材、積體電路、LCD平板玻璃、光學玻璃與光 電面板等物體。在拋光過程中，必須使用一吸附性墊片以 承載及固定該待拋光元件，而該吸附性墊片之品質則直接 影響該待拋光元件之拋光效果。 參考圖1 ’顯示美國專利第！；85,871，393號專利所揭示之 ^ 具有習知吸附性墊片之研磨設備之示意圖。該研磨設備1 包括一下基座（Lower Base Plate)ll、一吸附性塾片 (Sheet)12、一待拋光元件（polishing w〇rkpiece)13、一上 基座（Upper Base Plate)14、一拋光墊（p〇lishing pad)15& 一研磨漿液（Slurry)16 ^該吸附性墊片12係利用一黏膠層 17黏附於該下基座11上，且該吸附性墊片12係用以承載及 固定該待拋光元件13。該拋光墊15係固定於該上基座14。 該研磨設備1之作動方式如下。首先將該待抛光元件13 固定於該吸附性墊片12上，接著，轉動該上基座丨4及該下 109888 -6 -1314890, the year of the month, the 3rd day, the repair, the replacement of the page, the 095124172 patent application, the Chinese manual replacement page (June, 1997). 9. The invention relates to: [Technical field of the invention] The present invention relates to a fixed The adsorptive gasket of the member to be polished and its manufacturing method are described in detail with respect to an adsorbent gasket for fixing a member to be polished used in a chemical mechanical polishing process and a method of manufacturing the same. [Prior Art] Polishing generally refers to the abrasion control of a rough, rough surface in a chemical mechanical polishing (CMP) process, which uses an abrasive slurry containing fine particles to be evenly dispersed on the surface of a polishing pad. After the polishing element is pressed against the polishing pad, it is honed in a repeated regular motion. The component to be polished is an object such as a semiconductor, a storage medium substrate, an integrated circuit, an LCD flat glass, an optical glass, and a photovoltaic panel. During the polishing process, an adsorbent gasket must be used to carry and fix the component to be polished, and the quality of the adsorbent gasket directly affects the polishing effect of the component to be polished. Refer to Figure 1 ' to show US patents! A schematic of a grinding apparatus having a conventional absorbent gasket as disclosed in U.S. Patent No. 8,871,393. The grinding apparatus 1 comprises a lower base plate 11, an adsorbent sheet 12, a polishing w〇rkpiece 13, an upper base plate 14, and a polishing. a pluting pad 15 & a slurry (Slurry) 16 ^ the adsorptive pad 12 is adhered to the lower base 11 by an adhesive layer 17, and the absorbent pad 12 is used to carry And fixing the element 13 to be polished. The polishing pad 15 is fixed to the upper base 14. The operation of the grinding apparatus 1 is as follows. First, the component 13 to be polished is fixed on the adsorption pad 12, and then the upper base 4 and the lower 109888 -6 are rotated.
1314890 基座11，且同時將該上基座14向下移動，使該拋光墊15接 觸到該待拋光元件13之表面，藉由不斷補充該研磨漿液16 以及該拋光墊15的作用，可對該待拋光元件13進行拋光作 業。 參考圖2，顯示圖1之吸附性墊片之局部示意圖。該吸附 性墊片12係為單層結構，且其材質通常為pu(p〇lyurethane)， 其係為一種發泡材質，再者，該吸附性墊片12係由濕式製 程所加工而成，因此該吸附性墊片12之内部會具有複數個 連續式的發泡孔洞121。其缺點為，在拋光過程中該等發 泡孔洞121容易將該研磨毅液16吸入，造成該吸附性墊片 12之軟硬度及物性產生變化，而需重新調整研磨條件；再 者，該吸附性墊片12的壽命也因此而減少。此外，該吸附 性墊片12係利用濕式製程所製得’其不平坦度過大，报難 達到0.5mm以上全面均—厚度。最後，該吸附性墊片如 之發泡孔洞⑵使得該吸附性墊片12在吸附該待拋光元件 13時’會有包空氣的現象產生，因而造成該待拋光元件13 之附著不好且拋光過程中容易破裂，而且該待抛光元件Η 在抛光後之抛光面不平坦 因此’有必要提供一種創新且具進步性的吸附性墊片及 其製造方法，以解決上述問題。 【發明内容】 本發明之主要目的在於提供 附性墊片 有一表面 種固疋一待抛光元件的吸 包括-底材、一表層及一微凹凸層。該底材具 該表層係位於該底材之表面上，該表層之内部 109888.doc 1314890 無孔洞結構，該表層具有一表面。該微凹凸層係位於該表 層之表面上，用以承載且固定該待拋光元件，該微凹凸層 之内部無孔洞結構。藉此，當該待拋光元件與該微凹凸層 接觸時，其間之空氣可以經由該微凹凸層順利排出，而不 會產生包空氣的現象，可提高該待拋光元件與該吸附性墊 片間之吸附力，增加該待拋光元件之拋光效果。此外，由 於該表層及該微凹凸層之内部均無孔洞結構，因此在拋光 過程中不會吸入研磨漿液，可提高該吸附性墊片之壽命。 本發明之另一目的在於提供一種固定一待拋光元件的吸 附性墊片之製造方法，包括以下步驟： (a) 形成一表層於一離型紙上，該表層之内部無孔洞結 構； (b) 形成一底材於該表層上； (c) 烘乾； (d) 移除該離型紙；及 (e) 印刷一微凹凸層於該表層上，該微凹凸層之内部無孔 洞結構。 【實施方式】 參考圖3,顯示本發明固定待拋光元件的吸附性墊片之 局部示意圖。本發明之吸附性墊片2係為三層結構，其包 括一底材21、一表層22及一微凹凸層23〇該底材21具有一 第一表面211及一第二表面212 ,該第二表面212係用以黏 附於一研磨設備之下基座（圖中未示）上。在本實施例中該 底材21之材質係為高固成分（High s〇iid)的pu，其内部具 109888.doc • 13 1_4124172號專利申請案 中文說明書替換頁（97 月） 0 # /丨听;㈣，: 有複數個連續式或非連續式之孔洞213，且其厚度可大於 0.5mm。然而可以理解的是，該底材以之材質也可以是壓 克力樹脂或是其他樹脂。 該表層22係位於該底材21之第一表面211上，該表層22 之内部無孔洞結構，該表層22具有一表面22丨。該表層22 之材質係為不發泡的高分子彈性體（例如pu、壓克力樹脂 或疋其他樹脂），其具有均一之厚度，且其厚度小於該底 | 材21之厚度。該表層22之材質與該底材21之材質可以是相 P 同或是不同。 該微凹凸層23係位於該表層22之表面221上，用以承載 且固定一待拋光元件（圖中未示）。該微凹凸層23之内部無 孔洞結構’且其材質係為不發泡的高分子彈性體（例如 pu、壓克力樹脂或是其他樹脂）。該微凹凸層23之材質與 該表層22之材質可以是相同或是不同。該微凹凸層之任 一個突起結構23 1間形成一排氣空間232，當該待拋光元件 • 與該微凹凸層23接觸時，其間之空氣可以經由該排氣空間 232順利排出，而不會產生包空氣的現象，可提高該待拋 光元件與該吸附性墊片2間之吸附力，增加該待拋光元件 之拋光效果。在本實施例中，該等突起結構23丨係為週期 性重複之高低起伏。此外，由於該表層22及該微凹凸層23 之内邛均無孔洞結構，因此在拋光過程中不會吸入研磨漿 液，可提高該吸附性塾片2之壽命。 本發明另外關於一種固定待拋光元件的吸附性墊片之製 造方法，其包括以下步驟。 一離型紙30上形成一表層22，該表 首先，參考圖4，在 109888 1314890 層22之内部無孔洞結構。該表層22具有一表面22ι。該表 層22之材質係為不發泡的高分子彈性體（例如Ρϋ、壓克力 樹脂或是其他樹脂）’其具有均一之厚度。較佳地，該表 層22係以塗佈方式形成於該離型紙3〇上。 接著，參考圖5，形成一底材21於該表層22上，該底材 21具有一第一表面211及一第二表面212。在本實施例中該 底材21之材質係為高固成分（High s〇lid)的ρυ，其内部具 • 有複數個連續式或非連續式之孔洞213，且其厚度可大於 0.5mm。然而可以理解的是，該底材21之材質也可以是壓 克力樹脂或是其他樹脂。該表層22之材質與該底材21之材 質可以是相同或是不同。較佳地，該底材2丨係以塗佈方式 形成於該表層22上。因此，比起習知濕式製程，在該底材 2 1之厚度大於〇.5mm時本發明之該底材21還能保持厚度均 勻。 接著’將該底材21及該表層22烘乾約一天時間。之後， 移除該離型紙3 0。 最後’參考圖6，將該底材21及該表層22翻轉180度後， 於該表層22之表面221上印刷一微凹凸層23，以形成一吸 附性墊片2(與圖3相同）。該微凹凸層23之内部無孔洞結 構’且其材質係為不發泡的高分子彈性體（例如PU、壓克 力樹脂或是其他樹脂）。該微凹凸層23之材質與該表層22 之材質可以是相同或是不同。在本實施例中，該印刷步驟 係為網版印刷。 較佳地，於該微凹凸層23還可以再做防水處理，以增加 109888.doc • 10- 1314890 該吸附性墊片2之壽命。 上述實施例僅為說明本發明之原理及其功效，並非限制 本發明’因此習於此技術之人士對上述實施例進行修改及 變化仍不脫本發明之精神。本發明之權利範圍應如後述之 申請專利範圍所列。 【圖式簡單說明】 圖1顯示美國專利第US5,781，393號專利所揭示之具有習 知吸附性墊片之研磨設備之示意圖； 圖2顯示圖1之吸附性墊片之局部示意圖； 圖3顯示本發明固定待拋光元件的吸附性墊片之局部示 意圖；及 ° η 圖4至6顯*本發明固定待抛光元件的吸附性塾片之製造 方法之各個製程步驟示意圖。 故 【主要元件符號說明】 1 研磨設備 2 本發明之吸附性塾片 11 下基座 12 吸附性墊片 13 待拋光元件 14 上基座 15 拋光墊 16 研磨漿液 17 黏膠層 21 底材 109888.doc 1314890 22 表層 23 微凹凸層 30 離型紙 121 發泡孔洞 211 底材第一表面 212 底材第二表面 213 孔洞1314890 pedestal 11, and simultaneously moving the upper pedestal 14 downward, so that the polishing pad 15 contacts the surface of the component 13 to be polished, by continuously supplementing the abrasive slurry 16 and the polishing pad 15, The member to be polished 13 performs a polishing operation. Referring to Figure 2, a partial schematic view of the absorbent pad of Figure 1 is shown. The adsorbent gasket 12 is a single-layer structure, and the material thereof is usually pu (p〇lyurethane), which is a foamed material. Further, the adsorbent gasket 12 is processed by a wet process. Therefore, the interior of the adsorptive gasket 12 will have a plurality of continuous foaming holes 121. The disadvantage is that the foaming holes 121 are easy to inhale during the polishing process, causing the softness and physical properties of the adsorptive gasket 12 to change, and the grinding conditions need to be re-adjusted; The life of the adsorptive gasket 12 is also reduced. Further, the adsorptive spacer 12 is produced by a wet process, and its unevenness is too large, and it is difficult to achieve a full uniform thickness of 0.5 mm or more. Finally, the adsorbent gasket, such as the foaming hole (2), causes the adsorptive gasket 12 to have a phenomenon of air entrapment when adsorbing the component 13 to be polished, thereby causing poor adhesion of the component to be polished 13 and polishing. The process is easily broken, and the polished surface of the member to be polished 不 after polishing is not flat. Therefore, it is necessary to provide an innovative and progressive absorbent gasket and a method of manufacturing the same to solve the above problems. SUMMARY OF THE INVENTION The main object of the present invention is to provide an adhesive gasket having a surface-embedded material comprising a substrate to be polished, a substrate, a surface layer and a micro-concave layer. The substrate has the surface layer on the surface of the substrate, and the interior of the surface layer has a non-porous structure, and the surface layer has a surface. The micro-concave layer is located on the surface of the surface layer for carrying and fixing the component to be polished, and the interior of the micro-concave layer has no pore structure. Thereby, when the component to be polished is in contact with the micro-concave layer, air between them can be smoothly discharged through the micro-concave layer without entrapment of air, and the component to be polished and the adsorption pad can be improved. The adsorption force increases the polishing effect of the component to be polished. Further, since the surface layer and the inside of the micro-concave layer have no pore structure, the polishing slurry is not sucked during polishing, and the life of the absorbent gasket can be improved. Another object of the present invention is to provide a method for manufacturing an adsorptive gasket for fixing a component to be polished, comprising the steps of: (a) forming a surface layer on a release paper having a non-porous structure inside the surface layer; (b) Forming a substrate on the surface layer; (c) drying; (d) removing the release paper; and (e) printing a micro-concave layer on the surface layer, the micro-concave layer having no void structure inside. [Embodiment] Referring to Fig. 3, there is shown a partial schematic view of an adsorption pad for fixing a member to be polished according to the present invention. The adsorbent gasket 2 of the present invention has a three-layer structure, and includes a substrate 21, a surface layer 22 and a micro-concave layer 23. The substrate 21 has a first surface 211 and a second surface 212. The two surfaces 212 are attached to a base (not shown) below the grinding apparatus. In the present embodiment, the material of the substrate 21 is a high solid component (High s〇iid) pu, and the interior thereof has 109888.doc • 13 1_4124172 Patent Application Chinese Manual Replacement Page (97月) 0 # /丨Listening; (d),: There are a plurality of continuous or discontinuous holes 213, and the thickness thereof may be greater than 0.5 mm. However, it is to be understood that the substrate may be made of acryl resin or other resin. The surface layer 22 is located on the first surface 211 of the substrate 21, and the interior of the surface layer 22 has no pore structure, and the surface layer 22 has a surface 22丨. The surface layer 22 is made of a non-foamed polymeric elastomer (e.g., pu, acryl resin or enamel other resin) having a uniform thickness and a thickness smaller than the thickness of the substrate 21. The material of the surface layer 22 and the material of the substrate 21 may be the same or different. The micro-concave layer 23 is located on the surface 221 of the surface layer 22 for carrying and fixing an element to be polished (not shown). The micro-concave layer 23 has a void-free internal structure and is made of a non-foamed polymeric elastomer (e.g., pu, acrylic resin or other resin). The material of the micro-concave layer 23 and the material of the surface layer 22 may be the same or different. An exhaust space 232 is formed between any of the protruding structures 23 1 of the micro-concave layer. When the element to be polished is in contact with the micro-concave layer 23, air between them can be smoothly discharged through the exhaust space 232 without The phenomenon of entraining air is generated, which can increase the adsorption force between the component to be polished and the adsorption pad 2, and increase the polishing effect of the component to be polished. In the present embodiment, the projections 23 are cyclically repeated. Further, since the surface layer 22 and the inner surface of the micro uneven layer 23 have no pore structure, the polishing slurry is not sucked during polishing, and the life of the adsorptive sheet 2 can be improved. The present invention further relates to a method of manufacturing an adsorptive gasket for fixing an element to be polished, which comprises the following steps. A surface layer 22 is formed on a release paper 30. First, referring to Fig. 4, there is no void structure inside the layer 22 of 109888 1314890. The skin 22 has a surface 22i. The material of the surface layer 22 is a non-foamed polymeric elastomer (e.g., enamel, acrylic resin or other resin) which has a uniform thickness. Preferably, the surface layer 22 is formed on the release paper 3 by coating. Next, referring to FIG. 5, a substrate 21 is formed on the surface layer 22. The substrate 21 has a first surface 211 and a second surface 212. In the present embodiment, the material of the substrate 21 is a high solid content ρ υ having a plurality of continuous or discontinuous holes 213 therein, and the thickness thereof may be greater than 0.5 mm. However, it can be understood that the material of the substrate 21 can also be a acryl resin or other resin. The material of the surface layer 22 and the material of the substrate 21 may be the same or different. Preferably, the substrate 2 is formed on the surface layer 22 by coating. Therefore, the substrate 21 of the present invention can maintain a uniform thickness even when the thickness of the substrate 21 is greater than 55 mm, compared to the conventional wet process. Next, the substrate 21 and the surface layer 22 are dried for about one day. After that, the release paper 30 is removed. Finally, referring to Fig. 6, after the substrate 21 and the surface layer 22 are turned 180 degrees, a micro-concave layer 23 is printed on the surface 221 of the surface layer 22 to form an absorbing spacer 2 (the same as Fig. 3). The micro-concave layer 23 has a non-porous structure inside thereof and is made of a non-foamed polymer elastomer (e.g., PU, acrylic resin or other resin). The material of the micro-concave layer 23 and the material of the surface layer 22 may be the same or different. In this embodiment, the printing step is screen printing. Preferably, the micro-concave layer 23 can be further subjected to a water repellent treatment to increase the life of the adsorbent gasket 2 by 109888.doc • 10- 1314890. The above-described embodiments are merely illustrative of the principles of the present invention and the advantages thereof, and are not intended to limit the present invention. The scope of the invention should be as set forth in the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a grinding apparatus having a conventional absorbent gasket disclosed in US Pat. No. 5,781,393; FIG. 2 is a partial schematic view showing the absorbent gasket of FIG. 3 is a partial schematic view showing an adsorption pad for fixing a component to be polished according to the present invention; and FIG. 4 to FIG. 6 is a schematic view showing respective process steps of a method for manufacturing an adsorptive crucible for fixing a component to be polished. Therefore [Main component symbol description] 1 Grinding equipment 2 Adsorbent cymbal 11 of the present invention Lower pedestal 12 Adsorption pad 13 Element to be polished 14 Upper pedestal 15 Polishing pad 16 Grinding slurry 17 Adhesive layer 21 Substrate 109888. Doc 1314890 22 Surface layer 23 Micro-concave layer 30 Release paper 121 Foam hole 211 Substrate first surface 212 Substrate second surface 213 Hole
221 表層之表面 231 突起結構 232 排氣空間 109888.doc -12-221 Surface of the surface 231 Projection structure 232 Exhaust space 109888.doc -12-