TWI313484B - - Google Patents
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- TWI313484B TWI313484B TW094125184A TW94125184A TWI313484B TW I313484 B TWI313484 B TW I313484B TW 094125184 A TW094125184 A TW 094125184A TW 94125184 A TW94125184 A TW 94125184A TW I313484 B TWI313484 B TW I313484B
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/003—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/24—Inking and printing with a printer's forme combined with embossing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
- B29C2043/023—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
- B29C2043/025—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves forming a microstructure, i.e. fine patterning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/44—Compression means for making articles of indefinite length
- B29C43/46—Rollers
- B29C2043/461—Rollers the rollers having specific surface features
- B29C2043/463—Rollers the rollers having specific surface features corrugated, patterned or embossed surface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/04—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles using movable moulds
- B29C43/06—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles using movable moulds continuously movable in one direction, e.g. mounted on chains, belts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Micromachines (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Description
1313484 九、發明說明: 【發明所屬之技術領域】 本發明係與奈米科技有關,特別是指可符合產輩量產 及低成本需求的一種奈米貼紙之製造方法。 5【先前技術】 按,在製造奈米貼紙的技術中,目前是以版印技術 (Lithography Techniques)可符合量產且低價的需求,其中, 低於50奈米線寬解析度的技術,可符合未來的半導體積體 電路、電子商業化、光電產業以及磁性奈米裝置等的製造 10需求。 目前所知的技術中,有一種是掃瞄電子束的版印技術 (K. C. Beard, T. Qi. M. R. Dawson, B. Wang. C. Li, Nature 368, 604(1994)·),具有10奈米的解析度;然而,由於此種 技術是以點接點(point by point)的方式串列排列,因此其生 I5產速度極低,無法符合量產的需求。另外有一種技術,是為 X 射線的版印技術(M. Godinot and M. Mahboubi,C. R. Acad
Sci. Ser. II Mec. Phys. Chim. Chim. Sci. Terre Univers. 319, 357(1994); M. Godinot, in Anthropoid Origins, J. G. Fleagle and R. F. Kay, Eds. (Plenum, New York, 1994), pp. 235-295.), 20具有20奈米的解析度,係為接觸轉印的模式,其可具有高 生產率,然而,其光罩技術以及曝光技術均非常複雜且昂 貴,此亦無法符合業界需求。又,有一種靠近式掃瞄探針的 版印技術氏.1^811110113&11(1〇.1[.尺&81111155611,?1>0。.犯江
Acad. Sci. U.S.A. 91,9946(1994); Evol. Anthropol. 3, 128 ⑧ 1313484 不t有=米的解析度,是屬於較早期的技術;此 技術亦不㈣合產業上的量產及低成本需求。 有鑑於上述馳,本案㈣人驗過錢之試作與實 驗後,終於發展出本發明。 【發明内容】 其可符合產業上奈米貼紙之製造方法, 緣是,依據本發明所提供之一種奈米 主要包含有下列步驟:a)在真空環境下 轉印戳,該轉印戳具有一轉印面,於該轉印面二
Si,Ϊ奈米凸紋係由多數凸部及多數凹部組成:又該^ ,具=侧層;b)進行一沾取程序,使該奈米凸紋之凸部 15 一光阻材料;C)進行一轉印程序,使該 =光阻材料轉印於織刻層表面;Φ進行,彳t/ί = ’使_刻層上未覆蓋光阻材料之部位 被餘刻駄深度。藉由前述步驟,可使奈雜簡 用於產業上的量纽低成本的需求。 此應 【實施方式】 為了詳細說明本發明之特點所在,兹舉以下之 實施例並配合圖式說明如后,其中· 第一圖係本發明第一較佳實施例之第一動作示 意圖 20 1313484 第二圖係本發明第一較佳實施例之第二動作示意圖。 第三圖係本發明第一較佳實施例之狀態示意圖,顯示 以凸部來沾取光阻材料之狀態。 第四圖係本發明第一較佳實施例之狀態示意圖,顯示 5以凹部來沾取光阻材料。 第五圖係本發明第一較佳實施例之第三動作示意圖。 第六圖係本發明第一較佳實施例之狀態示意圖,顯示 轉印後之基板狀態。 第七圖係本發明第一較佳實施例之第四動作示意圖。 10 第八圖係本發明第一較佳實施例之第五動作示意圖。 第九圖係本發明第二較佳實施例之第一動作示意圖。 第十圖係本發明第二較佳實施例之第二動作示意圖。 第十一圖係本發明第二較佳實施例之第三動作示意 圖。 15 第十二圖係本發明第二較佳實施例之第四動作示意 圖。 如第一圓至第七圖所示,本發明第一較佳實施例所提 供之一種奈米貼紙之製造方法,主要包含有下列步驟 a) 在真空環境下,備置一基板n以及一轉印戳21該 2〇轉印戳21係呈板狀,底部具有一轉印面22,於該轉印面= 表面設有奈米凸紋24,該奈米凸紋24係由多數凸部⑷及 多數凹部243組成,該基板u具有一餘刻層12,該餘刻層 12係為聚合物材質(polymer),其狀態係如第一圖所示 b) 進行—沾取程序,如第二圖所示,使該奈米:紋% ⑧ 6 ‘1313484 之凸部24U戈凹部243其中之一沾取光阻材料26,其中,以 凸部241沾取光阻材料26後之狀態係如第三圖所示,而以 凹部243沾取光阻材料26後之狀態係如第四圖所示; c)進行-轉印程序,使該轉印戳21轉印於該基板u 5 t _示,此時,該奈米凸紋24即與絲刻層12接觸 ^以將該奈米凸紋24上的光阻材料26轉印於該侧層=, 表面其中,無論是以凸部241或凹部243來沾取光阻材料 26,均可將光阻材料26轉印於該侧層12表面,以 3轉印後之該基板U狀態係如第六圖所示,以凹部祕 轉印者則因概同於第六圖之狀態,容不贅述; ” Φ進行一侧程序,如第七圖所示,對該钮刻層! =!!,使該侧層12上未覆蓋光阻材料26的部位被餘刻 ^疋深度,進而在覆蓋有光阻材料26的部位形成出預 ς的多數奈米纖毛28,至此,即可直接以該基板 15 =貼紙,或將該侧層12取下而附著於其他材料做= 貼紙的其他應用。 為奈水 藉由上述之方法,可形成出奈米貼紙。 而本第-實施例中尚可再增加—步驟e): 耘序,以洗劑(圖中未示)將該基板丨丨上的 洗淨 20 =後之狀態係如第八圖所示。由於前述步驟岐 斤形成的奈米纖毛28頂端尚留存光阻材料 ) %是否移除,均不會影響奈米貼紙本=及6^光阻材料 程序可使得奈《紙的成品更為單純身:洗淨 態下的其他可能變數。 7擔未洗淨狀 •1313484 清再參閱第九圖至第十二圖,本發明第二較佳實施例 所提供之種奈米貼紙之製造方法,主要包含有下列步驟: a)在真空%境下,備置―基板31以及—轉印戳,該 轉印戳41係呈滾筒狀,周面形成一轉印面42,於該轉印面 5 42表面設有奈米凸紋44,該奈米凸紋44係由多數凸部441 ^Ϊ凹部443組成,該基板31具有一钮刻層32,其狀態 係如第九圖所示; 之、&取程序,如第十圖所示,使該奈米凸紋44 1〇 σ…1或凹部443其中之-沾取光阻材料46; 如第1)如I 一轉印程序,使該轉印戳41滾抵於該基板31, 觸,萨以^此時,該奈求凸紋44即與該侧層32接 幻表曰面太:不 '、凸紋44上的光阻材料46轉印於該侧層 而為免贅Ϊ 糸以凸部441沾取光阻材料46為例, 15 ^贅这,於此不再對凹部糾3沾取的過程說明. 進行二行使:二困所示,對刻層- 高度的多光阻材料46的部位形成出預定 奈米貼紙,或將==此,即可直接⑽基板31 — 20米貼紙的應用/ 下而附著於其他材料做為奈 印戰 疋而本第一實施例之方式,可適合連 % 1313484 續生產作業。 由上可知,本發明所提供的奈米貼紙之製造方法,可 以在真空的環境下,以簡單的轉印或滚印技術配合蝕刻技 術,來快速且大量的形成出奈米級的餘刻層,可做為奈米 5貼紙之用,不僅可符合產業上的量產需求,更兼具了低成 本的優勢,較習用者更有產業上的優勢。 • 1313484 【圖式簡單說明】 f 一圖係本發較佳實施例之第-動作示意圖。 第亡圖係本發明第一較佳實施例之第二動作示意圖。 5 以 第三圖係本發明第—較佳實施例之狀態示意圖,顯示 凸部來沾取光阻材料之狀態。 以凹:==:較佳實施例之狀態示意圖,顯示
,五圖係本發明第一較佳實施例之第三動作示意圖。 第六圖係本發明第—較佳實施例之狀態示意 10轉印後之基板狀態。 , 第七圖係本發明第一較佳實施例之第四動作示意圖。 f八圖係本發明第一較佳實施例之第五動作示意圖。 ^九圖係本發明第二較佳實施例之第一動作示意圖。 ,十圖係本發明第二較佳實施例之第二動作示意圖。 第十一圖係本發明第二較佳實施例之第三動作示意 第十二圖係本發明第二較佳實施例之第四動作示章 -1313484 【主要元件符號說明】 11基板 12蝕刻層 21轉印戳 22轉印面 24奈米凸紋 241凸部 243凹部 26光阻材料 28奈米纖毛 31基板 32餘刻層 41轉印戳 42轉印面 44奈米凸紋 441凸部 443凹部 46光阻材料 48奈米纖毛
Claims (1)
1313484 卜、申請專利範圍: 1·-種奈米貼紙之製造方法,包 戮具有一轉印面,於該轉印面表面設有奈米凸舍文= 故=錄凸部及錄m險成,錄板科未 5料;的進行一沾取程序,使該奈米凸纹之凹部沾取光阻材 列轉印程序,使該轉印戳之該奈米凸紋與該餘 該將該奈米凸纹之凹部上的光阻材料轉印於 10 一蝕刻程序,對該蝕刻層進行蝕刻,使該蝕列 層上未覆蓋光阻材料之部位被姓刻預定深度。刻 、,專利範圍第1項所述之奈米貼紙之製造方 基板上的級㈣歸)如—洗>#料,以洗劑將該 ,據申μ專她圍第丨項所述之奈米貼紙之製造方 /,驟收該侧層是聚合物材質(—_。 、去苴=δ月專利範圍第1項所述之奈米貼紙之製造方 底^而=步驟a)中,該轉印戮係呈板狀,其轉印面位於 犯凸i接觸於層中,。該轉印戮係以轉印的方式以其奈米 、土【,申請專利範圍第1項所述之奈米貼紙之製造方 用’其於步驟a)中,該轉印戳係呈滾筒狀,其轉印面位 周面,而於步驟c)_,該轉印戳係以滾 凸紋之凹部接觸於該韻刻膚。 Λ…丁、未
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
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TW094125184A TW200705541A (en) | 2005-07-25 | 2005-07-25 | Manufacturing method of nano-sticker |
JP2005235411A JP2007030147A (ja) | 2005-07-25 | 2005-08-15 | ナノ貼紙の製造法 |
KR1020050075206A KR100663858B1 (ko) | 2005-07-25 | 2005-08-17 | 나노 스티커의 제조방법 |
US11/265,096 US7449123B2 (en) | 2005-07-25 | 2005-11-03 | Nanoimprint lithograph for fabricating nanoadhesive |
CA002525364A CA2525364A1 (en) | 2005-07-25 | 2005-11-04 | Nanoimprint lithograph for fabricating nanoadhesive |
AU2005231592A AU2005231592A1 (en) | 2005-07-25 | 2005-11-08 | Nanoimprint lithograph for fabricating nanoadhesive |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW094125184A TW200705541A (en) | 2005-07-25 | 2005-07-25 | Manufacturing method of nano-sticker |
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TW200705541A TW200705541A (en) | 2007-02-01 |
TWI313484B true TWI313484B (zh) | 2009-08-11 |
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TW094125184A TW200705541A (en) | 2005-07-25 | 2005-07-25 | Manufacturing method of nano-sticker |
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US (1) | US7449123B2 (zh) |
JP (1) | JP2007030147A (zh) |
KR (1) | KR100663858B1 (zh) |
AU (1) | AU2005231592A1 (zh) |
CA (1) | CA2525364A1 (zh) |
TW (1) | TW200705541A (zh) |
Families Citing this family (21)
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US7066234B2 (en) | 2001-04-25 | 2006-06-27 | Alcove Surfaces Gmbh | Stamping tool, casting mold and methods for structuring a surface of a work piece |
US7910288B2 (en) | 2004-09-01 | 2011-03-22 | Micron Technology, Inc. | Mask material conversion |
US7611944B2 (en) * | 2005-03-28 | 2009-11-03 | Micron Technology, Inc. | Integrated circuit fabrication |
US7816262B2 (en) * | 2005-08-30 | 2010-10-19 | Micron Technology, Inc. | Method and algorithm for random half pitched interconnect layout with constant spacing |
US7902074B2 (en) | 2006-04-07 | 2011-03-08 | Micron Technology, Inc. | Simplified pitch doubling process flow |
US8003310B2 (en) | 2006-04-24 | 2011-08-23 | Micron Technology, Inc. | Masking techniques and templates for dense semiconductor fabrication |
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JP2010512028A (ja) * | 2006-12-05 | 2010-04-15 | ナノ テラ インコーポレイテッド | 表面をパターニングするための方法 |
US7604836B2 (en) * | 2006-12-13 | 2009-10-20 | Hitachi Global Storage Technologies Netherlands B.V. | Release layer and resist material for master tool and stamper tool |
WO2008115530A2 (en) * | 2007-03-20 | 2008-09-25 | Nano Terra Inc. | Polymer composition for preparing electronic devices by microcontact printing processes and products prepared by the processes |
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EP2246177B1 (en) * | 2008-02-27 | 2018-06-06 | Sharp Kabushiki Kaisha | Roller type nano-imprint device, mold roll for the roller type nano-imprint device, fixed roll for the roller type nano-imprint device, and nano-imprint sheet manufacturing method |
US8030218B2 (en) * | 2008-03-21 | 2011-10-04 | Micron Technology, Inc. | Method for selectively modifying spacing between pitch multiplied structures |
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US20020130444A1 (en) * | 2001-03-15 | 2002-09-19 | Gareth Hougham | Post cure hardening of siloxane stamps for microcontact printing |
WO2002085639A1 (en) * | 2001-04-25 | 2002-10-31 | The Trustees Of Columbia University In The City Of New York | Edge transfer lithography |
US6946332B2 (en) * | 2002-03-15 | 2005-09-20 | Lucent Technologies Inc. | Forming nanoscale patterned thin film metal layers |
US7218465B1 (en) * | 2002-06-28 | 2007-05-15 | Seagate Technology Llc | Magnetic media patterning via contact printing utilizing stamper having magnetic pattern formed in non-magnetic substrate |
US6792856B2 (en) * | 2002-07-16 | 2004-09-21 | International Business Machines Corporation | Method and apparatus for accurate, micro-contact printing |
US7632087B2 (en) * | 2003-12-19 | 2009-12-15 | Wd Media, Inc. | Composite stamper for imprint lithography |
-
2005
- 2005-07-25 TW TW094125184A patent/TW200705541A/zh not_active IP Right Cessation
- 2005-08-15 JP JP2005235411A patent/JP2007030147A/ja active Pending
- 2005-08-17 KR KR1020050075206A patent/KR100663858B1/ko not_active IP Right Cessation
- 2005-11-03 US US11/265,096 patent/US7449123B2/en not_active Expired - Fee Related
- 2005-11-04 CA CA002525364A patent/CA2525364A1/en not_active Abandoned
- 2005-11-08 AU AU2005231592A patent/AU2005231592A1/en not_active Abandoned
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AU2005231592A1 (en) | 2007-02-08 |
US7449123B2 (en) | 2008-11-11 |
JP2007030147A (ja) | 2007-02-08 |
TW200705541A (en) | 2007-02-01 |
CA2525364A1 (en) | 2007-01-25 |
KR100663858B1 (ko) | 2007-01-03 |
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