1312307 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種拋光材及其製造方法’詳言之，係關 於—種具有研磨粒子之拋光材及其製造方法。 【先前技術】 一般拋光係以化學機械研磨（CMP)製程，對於—粗糙表 面之研磨，其係利用含有研磨粒子之研磨液平均分佈於— 研磨墊之表面上，同時將一待拋光元件抵住該研磨墊後， 進行一重複且規律之搓磨動作。該待拋光元件係諸如半導 體、儲存媒體基材、積體電路、LCD平板玻璃、光學玻璃 及光電面板等物體。 參考圖1’其顯示一種習知研磨墊之示意圖。該研磨塾i 係為一不具研磨粒子之研磨墊，其表面具有複數條溝槽 11。在對一待拋光元件（圖未示出）進行拋光作業時，施加 一含有研磨粒子之研磨液於該待拋光元件與該研磨墊1之 間’利用該研磨液之該研磨粒子進行拋光。但該研磨液於 该待拋光元件與該研磨墊1間之分佈，會受限於該等溝槽 11之設計’該研磨粒子無法均勻分佈，不但會降低研磨之 效率，且使用後之該研磨液也容易造成污染。 參考圖2，其顯示美國專利第5,692,950號之習知研磨墊 之示意圖。該研磨墊2包括一基底21、一黏著層22及一研 磨層23。該基底21包括一彈性層211及一堅硬層212。該黏 著層22設置於該堅硬層212上。該研磨層23包括一背層231 及一研磨結構232，該背層231係設置於該黏著層22上。其 114380.doc 1312307 中，該研磨結構232具有預設圖案且具有複數個固定之研 磨粒子233。該等研磨粒子233分佈於該研磨結構232之内 部及表面。 同樣地，在對一待拋光元件（圖未示出）進行拋光作業 時，需施加一含有研磨粒子之研磨液於該待拋光元件與該 研磨墊2之間，以增加研磨效果。雖然該研磨墊2具該等研 磨粒子233，但該研磨結構232之主體係為一獨立發泡之pu 材質，該研磨粒子233係存在於該研磨結構232之個別獨立 之孔洞中，該研磨粒子233不具有流動性。當研磨時，該 研磨結構232表面之該等研磨粒子233會直接與該待抛光元 件之表面接觸，或當該研磨結構232經研磨一段時間之 後’該研磨結構232内部之該等研磨粒子233亦會裸露並直 接與該待拋光元件之表面接觸，故容易造成該待拋光元件 之表面刮傷。 因此，有必要提供一種創新且具進步性之具有研磨粒子 之抛光材及其製造方法，以解決上述問題。 【發明内容】 本發明之目的在於提供-種具有研磨粒子之拋光材。該 具有研磨粒子之拋光材包括—基材、複數個研磨粒子及一 高分子彈性體。該基材具有複數條纖維，㈣纖維界定複 數個網格空間。該等研磨粒子分佈於該等網格空間中。該 高分子彈性體覆蓋該基材及該等研磨粒子。 本發明之另-目的在於提供-種具有研磨粒子之抛光材 之製造方法。該製造方法包括：⑷提供—基材，該基材具 114380.doc 1312307 複數條纖維，該等纖維界定複數個網格空間；⑻沉浸該 土材於-含有複數個研磨粒子之高分子溶液中，使得該等 研磨粒子分佈於該等網格空間中；及⑷固化附著於該基材 :π>刀子/合液以形成一高分子彈性體，該高分子彈性體 覆蓋該基材及該等研磨粒子。[Technical Field] The present invention relates to a polishing material and a method of manufacturing the same. In particular, it relates to a polishing material having abrasive particles and a method of manufacturing the same. [Prior Art] Generally, the polishing is performed by a chemical mechanical polishing (CMP) process for grinding a rough surface by using a polishing liquid containing abrasive particles evenly distributed on the surface of the polishing pad while holding a member to be polished. After the polishing pad, a repeated and regular honing action is performed. The member to be polished is an object such as a semiconductor, a storage medium substrate, an integrated circuit, an LCD flat glass, an optical glass, and a photovoltaic panel. Referring to Figure 1 ', a schematic view of a conventional polishing pad is shown. The polishing pad is a polishing pad having no abrasive particles and has a plurality of grooves 11 on its surface. In the polishing operation of a member to be polished (not shown), a polishing liquid containing abrasive particles is applied between the member to be polished and the polishing pad 1 by polishing the abrasive particles of the polishing liquid. However, the distribution of the polishing liquid between the member to be polished and the polishing pad 1 is limited by the design of the grooves 11. The abrasive particles are not uniformly distributed, which not only reduces the efficiency of the polishing, but also the polishing after use. Liquid is also prone to pollution. Referring to Figure 2, there is shown a schematic view of a conventional polishing pad of U.S. Patent No. 5,692,950. The polishing pad 2 includes a substrate 21, an adhesive layer 22, and a polishing layer 23. The substrate 21 includes an elastic layer 211 and a hard layer 212. The adhesive layer 22 is disposed on the hard layer 212. The polishing layer 23 includes a back layer 231 and a polishing structure 232 disposed on the adhesive layer 22. In 114380.doc 1312307, the abrasive structure 232 has a predetermined pattern and has a plurality of fixed abrasive particles 233. The abrasive particles 233 are distributed inside and on the surface of the polishing structure 232. Similarly, in the polishing operation of a member to be polished (not shown), a polishing liquid containing abrasive particles is applied between the member to be polished and the polishing pad 2 to increase the grinding effect. Although the polishing pad 2 has the abrasive particles 233, the main system of the polishing structure 232 is a separately foamed pu material, and the abrasive particles 233 are present in separate holes of the polishing structure 232. 233 does not have liquidity. When grinding, the abrasive particles 233 on the surface of the abrasive structure 232 may directly contact the surface of the member to be polished, or after the polishing structure 232 is polished for a period of time, the abrasive particles 233 inside the polishing structure 232 are also It will be exposed and directly in contact with the surface of the component to be polished, so that the surface of the component to be polished is easily scratched. Therefore, it is necessary to provide an innovative and progressive polishing material having abrasive particles and a method of manufacturing the same to solve the above problems. SUMMARY OF THE INVENTION An object of the present invention is to provide a polishing material having abrasive particles. The polishing material having abrasive particles includes a substrate, a plurality of abrasive particles, and a polymeric elastomer. The substrate has a plurality of fibers and (iv) fibers define a plurality of grid spaces. The abrasive particles are distributed in the grid spaces. The polymeric elastomer covers the substrate and the abrasive particles. Another object of the present invention is to provide a method of producing a polishing material having abrasive particles. The manufacturing method comprises: (4) providing a substrate having 114380.doc 1312307 a plurality of fibers defining a plurality of grid spaces; (8) immersing the soil material in a polymer solution containing a plurality of abrasive particles Having the abrasive particles distributed in the grid spaces; and (4) curing adhered to the substrate: π > knife / liquid to form a polymeric elastomer, the polymeric elastomer covering the substrate and the Grind the particles.
利用本發明具#研絲子之拋光材及其製造方法，該等 磨粒子可均勻地分佈，在拋光過程中能達到均勻佈覆研 :面之政果。因此’本發明具有研磨粒子之拋光材及其製 k方法，可以改善習知未含研磨粒子之拋光材在拋光時研 磨液中之研磨粒子無法均句分散，造成降低研磨效果及研 磨液使用後研磨液污染之問題。 再者本發明之該基材可避免該等研磨粒子直接接觸被 扎光元件，故可改善習知獨立發泡體之研磨材因研磨粒子 存在於獨立孔洞内而不具流動性，而容易造成被拋光元件 表面刮傷之問題。另外，本發明之該基材同時可提供掃除 研磨殘屑之功效。 【實施方式】 本發明提供一種具有研磨粒子之拋光材，該具有研磨粒 子之拋光材係應用於化學機械研磨（CMP)製程中對一待拋 光元件進行研磨或拋光。該待抛光元件包括但不限於半導 體、储存媒體基材、積體電路、LCD平板玻璃 '光學玻璃 及光電面板等物體。 請參閱圖3至圖7，其顯示本發明具有研磨粒子之拋光材 之製造方法。參考圖3，首先提供一基材31，該基材31具 114380.doc 1312307 有複數條纖維3 11 ’該等纖維3 11界定複數個網格空間 312。較佳地，該等纖維311之細度係介於〇〇(H丹尼（den) 至1 〇丹尼（den)之間。該基材31可為一布材’在該實施例 中’該基材31係為一不織布。較佳地，該等纖維311之材 質係選自聚丙烯（PP)、聚酯（PET)、尼龍（Nylon)或其所組 成之群。 參考圖4，沉浸該基材31於一含有複數個研磨粒子32之 • 高分子溶液33中’使得該等研磨粒子32均勻地分佈於該等 網格空間312中。在該實施例中，該高分子溶液33係選自 聚丙烯（PP)、聚酯（PET)、聚胺酯樹脂等材質。較佳地， 該等研磨粒子3 2係選自二氧化鈽、二氧化矽、三氡化二 銘、三氧化二釔、三氧化二鐵或其所組成之群，且該等研 磨粒子32之粒徑係介於0.01微米至10微米之間。 配合參考圖4及圖5 ’固化附著於該基材3 1之該高分子溶 液33 ’以形成一高分子彈性體34，該高分子彈性體34覆蓋 > 該基材31及該等網格空間312中之該等研磨粒子32，以形 成一具有研磨粒子之拋光材3。該具有研磨粒子之拋光材3 具有一第一表面301及一第二表面302,該第二表面3〇2係 相對應於第一表面3〇 1。在該實施例中，係先將附著於該 基材31之該高分子溶液33凝固，接著再經一水洗之步驟， 最後’進行一烘烤步驟以固化形成該具有研磨粒子之抛光 材3。 參考圖6 ’較佳地，在固化步驟之後另包括一研磨該第 一表面301之步驟’使得該第一表面3〇1具有較佳之平坦 114380.doc 1312307 度。接著，再修整該第二表面302，使該具有研磨粒子之 拋光材3具有一適當厚度。在該實施例中，該第二表面 係作為該具有研磨粒子之拋光材3用於進行拋光作業時之 研磨面。 因為形成該具有研磨粒子之拋光材3後，先對該第一表 面301進行研磨，以得到一較平坦之表面，故可確保接下 來修整之該第二表面302具有更佳之平坦度，亦即該具有 研磨粒子之拋光材3具有一致性之厚度，故在拋光時該具 有研磨粒子之拋光材3施加於被拋光元件表面之應力較為 平均’可以產生更為平坦之拋光面。另外，由於該高分子 彈性體34相較於該基材31之該等纖維311為較硬質之材 料’因此在修整該第二表面3〇2時，該第二表面3〇2之部分 該高分子彈性體34會先被移除’而部分該等纖維311則暴 硌出該具有研磨粒子之拋光材3之該第二表面302。 參考圖7，較佳地，在修整該第二表面3〇2之步驟後，可 另包括一形成複數個溝槽303於該第二表面3〇2之步驟。依 應用之不同，該等溝槽303可為正方形、三角形或矩形等 幾何形狀。 再參考圖7，其顯示本發明具有研磨粒子之拋光材。該 具有研磨粒子之拋光材3包括一基材31、複數個研磨粒子 32及一高分子彈性體34。該基材31具有複數條纖維311， 該等纖維311界定複數個網格空間3 12。較佳地，該等纖維 311之細度係介於0 001丹尼（心…至⑺丹尼（den)之間。該基 材3 1可為一布材’在該實施例中，該基材31係為一不織 114380.doc -10- 1312307 布。較佳地，該等纖維3 11之材質係選自聚丙烯（pp)、聚 醋（PET)、尼龍（Nylon)或其所組成之群。 該具有研磨粒子之拋光材3具有一第一表面3〇1及一第二 表面302，該第二表面302係相對應於第一表面3〇1，且部 为該等纖維311係暴露出該具有研磨粒子之拋光材3之該第 一表面302，因此，可藉由暴露之該等纖維311避免該等研 磨粒子32直接接觸被拋光元件（圖未示出），故可改善習知 • 獨立發泡體研磨材之研磨粒子存在於獨立孔洞内而不具流 動I1 生而各易造成被抛光元件表面刮傷之問題。 另外，本發明暴露出該第二表面3〇2之該等纖維3 11同時 可提供掃除研磨殘屑之功效，且可改善研磨液使用後研磨 液3染之問題。在該實施例中，該具有研磨粒子之拋光材 3另包括複數條溝槽303形成於該第二表面3〇2，依應用之 不同該等溝槽303可為正方形、三角形或矩形等幾何形 狀。該等溝槽303可使研磨液中之磨顆粒分佈更均勻，配 馨 合該具有研磨粒子之拋光材3之該等研磨粒子32，能達到 更佳之研磨效果。 該等研磨粒子32分佈於該等網格3丨2空間中。在該實施 例中，該等研磨粒子32係選自二氧化鈽、二氧化矽、三氧 化二鋁、三氧化二釔 '三氧化二鐵或其所組成之群。較佳 地’該等研磨粒子32之粒徑係介於〇 〇1微米至微米之 間，以使該等研磨粒子32可較均勻地分佈於該等纖維3ιι 界定之該等網格空間312中，且於拋光時能達到較佳之研 磨效率。 114380.doc 1312307 5 rj刀子彈性體34覆蓋該基材η及該等研磨粒子μ，以 形成該具有研磨粒子之拋光材3。在該實施例中，該高分 T彈11體34係選自聚丙烯（PP)、聚自旨（PET)、聚胺醋樹 月曰，且該高分子彈性體34係為一連續發泡體。 本發明之料研磨粒扣可均自地分祕料有研磨粒 光材3故在拋光過程中能達到均勻佈覆研磨面之 政果再者，該基材3 i可避免該等研磨粒子32直接接觸被 • ^光70件而刮傷該被拋光元件’並且同時可提供掃除研磨 殘屬之功效。 准上述實施例僅為說明本發明之原理及其功效，而非用 乂限制本發明。因此，習於此技術之人士對上述實施例進 订〇改及變化仍不脫本發明之精神。本發明之權利範圍應 如後述之申請專利範圍所列。 【圖式簡單說明】 圖1顯示習知研磨墊之示意圖； 籲 示美國專利第5,692,95G號之習知研磨墊之示意 圖； 圖3顯示本發明基材之示意圖； 圖4顯示本發明基材浸入一含有複數個研磨粒子之高分 子溶液中之示意圖； 圖5顯示本發明具有研磨粒子之拋光材之剖面圖； =6顯示本發明具有研磨粒子之拋光材之表面經研磨後 暴露出部分纖雉之剖面圖；及 圖7顯示本發明具有研磨粒子之拋光材表面形成複數條 114380.doc -12- 1312307 溝槽之剖面圖。 【主要元件符號說明】 1 11 2 21 211 212 22 23 231 232 233 3 301 302 303 31 311 312 32 33 34 第一種習知之研磨墊 溝槽 美國專利第5,692,950號之研磨墊 基底 彈性層 堅硬層 黏著層 研磨層 背層 研磨結構 研磨粒子 本發明具有研磨粒子之拋光材 第一表面 第二表面 溝槽 基材 纖維 網格空間 研磨粒子 具有研磨粒子之溶液 高分子彈性體 114380.doc -13-By using the polishing material of the present invention and the manufacturing method thereof, the grinding particles can be uniformly distributed, and the uniform coating effect can be achieved in the polishing process. Therefore, the present invention has a polishing material for polishing particles and a method for producing the same, which can improve the polishing particles in the polishing liquid which are conventionally not containing abrasive particles, and can not uniformly disperse the abrasive particles in the polishing liquid, thereby reducing the grinding effect and the use of the polishing liquid. The problem of contamination of the slurry. Furthermore, the substrate of the present invention can prevent the abrasive particles from directly contacting the light-collecting member, so that the abrasive material of the conventional independent foam can be improved because the abrasive particles are present in the independent pores without fluidity, and the liquid is easily caused to be The problem of scratching the surface of the polishing element. In addition, the substrate of the present invention simultaneously provides the effect of sweeping away abrasive debris. [Embodiment] The present invention provides a polishing material having abrasive particles which are used for grinding or polishing a polishing element to be polished in a chemical mechanical polishing (CMP) process. The component to be polished includes, but is not limited to, a semiconductor, a storage medium substrate, an integrated circuit, an LCD flat glass, an optical glass, and an optoelectronic panel. Referring to Figures 3 through 7, there is shown a method of making a polishing material having abrasive particles of the present invention. Referring to Figure 3, a substrate 31 is first provided, the substrate 31 having 114380.doc 1312307 having a plurality of fibers 3 11 '. The fibers 3 11 define a plurality of grid spaces 312. Preferably, the fineness of the fibers 311 is between 〇〇 (H denier to 1 denier den. The substrate 31 may be a cloth material 'in this embodiment' The substrate 31 is a non-woven fabric. Preferably, the fibers 311 are selected from the group consisting of polypropylene (PP), polyester (PET), nylon (Nylon) or a group thereof. The substrate 31 is disposed in the polymer solution 33 containing a plurality of abrasive particles 32 such that the abrasive particles 32 are uniformly distributed in the mesh spaces 312. In this embodiment, the polymer solution 33 is It is selected from the group consisting of polypropylene (PP), polyester (PET), polyurethane resin, etc. Preferably, the abrasive particles 32 are selected from the group consisting of cerium oxide, cerium oxide, triterpenoid, and antimony trioxide. a group of ferric oxide or a group thereof, and the particle diameter of the abrasive particles 32 is between 0.01 micrometers and 10 micrometers. The curing is adhered to the substrate 3 1 with reference to FIG. 4 and FIG. The polymer solution 33' forms a polymer elastomer 34, and the polymer elastomer 34 covers the substrate 31 and the grid space 312. The particles 32 are ground to form a polishing material 3 having abrasive particles. The polishing material 3 having abrasive particles has a first surface 301 and a second surface 302, and the second surface 3〇2 corresponds to the first surface. In this embodiment, the polymer solution 33 attached to the substrate 31 is first solidified, followed by a water washing step, and finally a baking step is performed to cure to form the abrasive particles. Polishing material 3. Referring to Figure 6 'Better, after the curing step, a step of grinding the first surface 301 is included' such that the first surface 3〇1 has a better flatness of 114380.doc 1312307 degrees. Then, trimming The second surface 302 is such that the polishing material 3 having the abrasive particles has a suitable thickness. In this embodiment, the second surface serves as the polishing surface for the polishing work for the polishing material 3 having the abrasive particles. After the polishing material 3 having the abrasive particles is formed, the first surface 301 is first ground to obtain a relatively flat surface, thereby ensuring that the second surface 302 to be subsequently trimmed has better flatness. That is, the polishing material 3 having the abrasive particles has a uniform thickness, so that the polishing material 3 having the abrasive particles applied to the surface of the member to be polished is more uniform during polishing, and a flatter polishing surface can be produced. Since the polymeric elastomer 34 is a relatively hard material compared to the fibers 311 of the substrate 31, the polymer elastic layer is part of the second surface 3〇2 when the second surface 3〇2 is trimmed. The body 34 will be removed first, and a portion of the fibers 311 will blast out the second surface 302 of the polishing material 3 having abrasive particles. Referring to Figure 7, preferably, the second surface is trimmed 3〇2 After the step, a step of forming a plurality of trenches 303 on the second surface 3〇2 may be further included. Depending on the application, the grooves 303 may be square, triangular or rectangular in geometry. Referring again to Figure 7, there is shown a polishing material of the present invention having abrasive particles. The polishing material 3 having abrasive particles includes a substrate 31, a plurality of abrasive particles 32, and a polymeric elastomer 34. The substrate 31 has a plurality of fibers 311 that define a plurality of grid spaces 312. Preferably, the fineness of the fibers 311 is between 0 001 denier (heart...to (7) denier. The substrate 31 may be a cloth material. In this embodiment, the base The material 31 is a non-woven 114380.doc -10- 1312307 cloth. Preferably, the fibers 3 11 are made of polypropylene (pp), polyester (PET), nylon (Nylon) or the like. The polishing material 3 having abrasive particles has a first surface 3〇1 and a second surface 302, the second surface 302 corresponds to the first surface 3〇1, and the portions are the fibers 311 The first surface 302 of the polishing material 3 having the abrasive particles is exposed, so that the abrasive particles 32 can be prevented from directly contacting the object to be polished (not shown) by exposing the fibers 311, thereby improving the habit Knowing that the abrasive particles of the independent foam abrasive are present in the independent holes without the flow I1, which easily cause scratching of the surface of the polished member. Further, the present invention exposes the second surface 3〇2 Fiber 3 11 can also provide the effect of sweeping the grinding debris, and can improve the dyeing of the slurry after the slurry is used. In this embodiment, the polishing material 3 having abrasive particles further includes a plurality of grooves 303 formed on the second surface 3〇2, and the grooves 303 may be square, triangular or rectangular depending on the application. The grooves 303 can make the distribution of the abrasive particles in the polishing liquid more uniform, and match the abrasive particles 32 of the polishing material 3 having the abrasive particles to achieve a better grinding effect. Distributed in the space of the grid 3丨2. In this embodiment, the abrasive particles 32 are selected from the group consisting of cerium oxide, cerium oxide, aluminum oxide, antimony trioxide, ferric oxide or Preferably, the particle size of the abrasive particles 32 is between 微米1 μm and micrometer so that the abrasive particles 32 can be more evenly distributed among the fibers 3 ιι defined In the grid space 312, a better polishing efficiency can be achieved during polishing. 114380.doc 1312307 5 rj knife elastomer 34 covers the substrate η and the abrasive particles μ to form the polishing material 3 having abrasive particles. In this embodiment, the high score T 11 34 is selected from the group consisting of polypropylene (PP), poly(PET), and polyamine vine, and the polymeric elastomer 34 is a continuous foam. The abrasive particles of the present invention can be uniformly grounded. The secret material has the abrasive grain material 3, so that the polishing effect can be achieved evenly during the polishing process. The substrate 3 i can prevent the abrasive particles 32 from directly contacting the 70 pieces of the light. The material to be polished 'and at the same time can provide the effect of sweeping the grinding residue. The above examples are merely illustrative of the principles of the invention and its efficacy, and are not intended to limit the invention. Accordingly, those skilled in the art have The tampering and changes of the examples are still without departing from the spirit of the invention. The scope of the invention should be as set forth in the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 shows a schematic view of a conventional polishing pad; a schematic view of a conventional polishing pad of U.S. Patent No. 5,692,95G; Figure 3 shows a schematic view of a substrate of the present invention; FIG. 5 is a cross-sectional view showing a polishing material having a plurality of abrasive particles; FIG. 5 is a cross-sectional view showing a polishing material having abrasive particles of the present invention; and = 6 shows that the surface of the polishing material having abrasive particles of the present invention is polished to expose a part of the fiber. A cross-sectional view of the crucible; and Figure 7 shows a cross-sectional view of a plurality of trenches 114380.doc -12- 1312307 formed on the surface of the polishing material having abrasive particles of the present invention. [Explanation of main component symbols] 1 11 2 21 211 212 22 23 231 232 233 3 301 302 303 31 311 312 32 33 34 The first conventional polishing pad groove US Patent No. 5,692,950 polishing pad base elastic layer hard layer adhesion Layer polishing layer back layer polishing structure abrasive particle. The present invention has a polishing material for polishing particles, a first surface, a second surface, a groove substrate, a fiber mesh space, an abrasive particle, and a solution of the abrasive particles, a polymer elastomer 114380.doc -13-