曰期：98年4月21日 13 1 1^6^9590 號專利說明書修正本 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種基板校正裝置，特別是指應用於玻璃基板之校正 裝置。 【先前技術】 蝕刻機台10係用以蝕刻玻璃基板20，如第1圖所示，蝕刻機台1〇 内部包括輸送台(cassette station)ll、基板交換室(load lock chamber) 12、輸 送腔體(transfer module chamber)13、第一製程腔體(PCl，process chamber 1)14、第二製程腔體(PC2，process chamber 2)15、第三製程腔體(PC3,process chamber 3)16以及機械手臂17、18。玻璃基板20設於輸送台(cassette 8士&行〇11)11上’經由機械手臂17傳送到基板交換室(1〇&(11〇汰^^11仏]〇12, 使玻璃基板處於真空環境中，再將玻璃基板20輸送到輸送腔體(transfer module chamber)13中’並利用機械手臂18使玻璃基板20依序進入第一、 第二以及第三製程腔體(PCI、PC2以及PC3)14、15以及16中，以對玻璃 基板20進行蝕刻。 請搭配參閱第1、2圖’機械手臂π抓取玻璃基板20置入基板交換 室(load lock chamber)12時’若是玻璃基板2〇在搬運或置放時發生了偏 斜，機台10會發出基板警報(substrate alarm)，使機台10停止運轉，製程 中斷。 請參閱第1圖，玻璃基板20進入基板交換室(i〇ad l〇ck chamber) 12後 會再被機械手臂18傳送至第一製程腔體(pci，pr〇cesschamberl)14中，並 且第一製程腔體(PCl，process chamber 1)14之平台上具有一下電極層 141(請參閱第3圖），在玻璃基板20進行製程時，會透過電漿(piasma)狀態 〇632-A5〇527-TW/AU〇5〇4〇8〇 5 日期：98年4月21曰 13 1 1 §0039590號專利說明書修正本 的氣體對玻璃基板20進行银刻。若是玻璃基板2〇在搬運或置放時p 偏斜，則電漿(plasma)狀態的氣體會作用到下電極層⑷卜 、X生了 以口則頭所示）， 因而發生例如弧光放電(arcing)之情形’使下電極層14ι受到損壞者電萝 (plasma)狀態的氣體作用到下電極層ι41上時，機台1〇會發出警報 alarm，Electrostatic Charge alarm)，使機台 1〇 停止運轉，製程中斷。. 綜上所述，若是玻璃基板20在搬運及置放時產生了誤差，都可铲會 造成製程中斷，使機台10無法順利運轉，甚或損壞機台ω，而使成= 加。 曰曰期: April 21, 1998, 13 1 1^6^9590, the patent specification is amended. 9. The present invention relates to a substrate correcting device, particularly to a glass substrate. Correction device. [Prior Art] The etching machine 10 is used to etch the glass substrate 20. As shown in Fig. 1, the etching machine 1 includes a cassette station 11, a load lock chamber 12, and a conveying chamber. a transfer module chamber 13, a first process chamber (PC1, process chamber 1) 14, a second process chamber (PC2, process chamber 2) 15, a third process chamber (PC3, process chamber 3) 16 and Robotic arms 17, 18. The glass substrate 20 is disposed on the transport table (cassette 8 & 11) 11 and is transferred to the substrate exchange chamber via the robot arm 17 (1〇&(11〇^^11仏)〇12, so that the glass substrate is placed In a vacuum environment, the glass substrate 20 is transported into the transfer module chamber 13 and the glass substrate 20 is sequentially accessed into the first, second, and third process chambers by using the robot arm 18 (PCI, PC2, and In PC3) 14, 15 and 16, the glass substrate 20 is etched. Please refer to Figs. 1 and 2 for the mechanical arm π grabbing the glass substrate 20 when the substrate lock chamber 12 is placed. 2〇The deflection occurs during transportation or placement, and the machine 10 emits a substrate alarm to stop the machine 10 and the process is interrupted. Referring to Figure 1, the glass substrate 20 enters the substrate exchange room (i The 〇ad l〇ck chamber) 12 is then transferred by the robot arm 18 to the first process chamber (pci, pr〇cesschamberl) 14 and has a platform on the first process chamber (PC1, process chamber 1) 14 The electrode layer 141 (see FIG. 3) is processed on the glass substrate 20 At the time of the plasma (piasma) state 〇 632-A5 〇 527-TW / AU 〇 5 〇 4 〇 8 〇 5 date: April 21, 1998 13 1 1 § 0039590 patent specification revised gas to glass The substrate 20 is silver-engraved. If the glass substrate 2 is deflected when being transported or placed, the gas in the plasma state acts on the lower electrode layer (4), and the X-ray is shown in the head) Therefore, for example, in the case of arcing, when the lower electrode layer 14 is subjected to the damage of the plasma state of the plasma to the lower electrode layer ι41, the machine 1 will issue an alarm (Electrostatic Charge alarm), The machine 1 〇 is stopped and the process is interrupted. In summary, if an error occurs in the handling and placement of the glass substrate 20, the shovel can cause the process to be interrupted, so that the machine 10 cannot operate smoothly, or even damage the machine ω, and become = plus.曰
【發明内容】 為了改善上述缺點，本發明係提供一種機台之基板校正裝置，包括基 板交換室以及髓滚動件’施交換室包括複數側邊、麵以及感應器二 該感應器(S_*)設於底面上以確認基板是否擺至定位，而滾動件設於側邊 以及底社，當龜域械手臂傳送絲板賴室時，可藉姐動件校正 基板至基板交換室上的適當位置。 在-實施例中，滾動件包括有球體、容置槽以及固定部，球體以可轉 動的方式設於容置槽中，並且滾動件透過固定部與底面連接。此外，球體 係為絕緣材質。 為了讓本發明之上述和其他目的、特徵和優點能更明顯易懂，下文特 別舉出較佳實關，並配合_圖示，作詳細說明如下。 【實施方式】 請參閱第4圖，餘刻機台3〇内部包括輸送台(⑽咖stati〇n)3i、基板 X^t(loadlockchamber)32 . #M(transfermodule chamber)33 ^ process chamber 1)34 ^ process chamber 0632-A50527-TW/AU0504080 13 1 1 66239590號專利說囑修正本 曰期:98年4月21曰 2)35、第二製程腔體(pc3，pr〇cess chamber 3)36以及機械手臂37、％。玻 璃基板4〇放置於輸送台(cassette stati〇n)31上，透過機械手臂37的抓取傳 送到基板交換室(l〇adl〇ck Chamber)32，使玻璃基板40處於真空環境中， 之後再將玻璃基板40輸送到輸送腔體⑽加細m〇duie chamber)33，並利 用機械手臂38使玻璃基板40依序進入第一、第二以及第三製程腔體 (PCI、PC2以及PC3)34、35以及36中，以對玻璃基板40進行银刻。 於本發明中，雖然以飯刻機台為範例來說明，但是並不以钱刻機台為 限。本發明之基板校正裝置，亦可以適用到一般之薄膜機台，或是適用到 籲其他用來當成被傳送基板之位置校正中途站。於本發明中，雖然以玻璃基 板為範例來說明，但是並不以此為限。本發明之基板校正裝置，亦可以適 用至例如金屬材料基板，非金屬材料基板，有機材料基板或無機材料基板 等以任何材質形成之基板。於一較佳實施例中，係以傳輸易碎基板為主。 於另一實施例中，則可用於高精密度要求之基板傳輸作業中。 明參閱弟4及5A圖，以基板4〇由輸送台(cassette stati〇n)31傳送到基 板交換室(load Ιο—)32上為例，絲交換室(lGad lQek ehamber)32 包括底面321、側邊323以及感應器322。於圖式中，感應器322係凸設 φ於底面321之對角上，以確認基板40位置。實用上，感應器322之位置 可以依實際需求而設置，例如可以凸設於底面321之四角或四周，甚或是 設於非底面之位置，並無一定之限制。使用感應器322之目的之一可用來 侦測承載基板(例如玻璃)之有無，亦可以用來侧基板位置是否正確。感 應器322可以設置於基板交換室(1〇ad 1〇ck chamber)32内亦可以設置於 其他例如輸送腔體33之傳輸中途站内。並且複數滾動件39分別設於底面 321以及侧邊323上。當玻璃基板4〇被機械手臂37由輸送台㈣論 statical移動到基板交換室(badl〇ckchamber)32上 接第5B、7圖，第洲為第7圖㈣剖面線之_，== 〇632-A5〇527-TW/AU〇5〇4〇8〇 7 日期：98年4月21日 131 Μ^2959〇 械手臂37相對於基板交換室(1〇ad 1〇ck咖她邮2之位置可能會發生誤 差，以致於在玻璃基板4〇被置入基板交換室(l〇adl〇ckChamber)32時’玻 j基板40會先接觸到側邊323上的滾動件％。此時，利用基板本身的重 畺乂及滾動件39的/f動特性，可將玻璃基板4G滑至―預設位置，而可防 止基板位置偏斜之情況發生。設置於底面之滾動件39則可以利用其滑動 特性降低與底面之摩擦力，以協助玻璃基板40於水平方向之移動。亦即， 可藉由設於側邊323以及底面321上的滾動件39校正位置(如第5C圖所 示），在此同時，機械手臂37亦抽離基板交換室(load lock diamber)32(如第 φ 5D圖所示）。 另外，請參閱第4圖，設於底面奶上的滾動件％可提供玻璃基板 40於要求的範圍中滑動到最適當的位置。另請參閱第6Α、6β圖。於此圖 式中，滾動件39係例如包括有球體39卜容置槽392以及固定部3幻。球 體391以可轉動的方式設於容置槽败中，並且滾動件％透過固定部观 連接於底面321以及側邊323上(如第4圖所示）。滚動件％之設計，可以 視實際設計需求而改變，並不式之例示為L，於基板交換室上 可以2置有相對應之容置槽，以供球體别設置於針，而不需要另外設 參置固疋。Ρ。或者，於基板交換室上設置有複數個孔洞，滾動件39則設置 於相對應之孔洞下方，並露出至少部份球體391。在一較佳實施例中，球 體別係為輯材質。在另一實施例中，球體391係為抗靜電材質。 在-較佳實施例中，例如機械手臂之精確度為〇 5mm時，可以使用具 有例如0.6麵或是1O醜滾動半徑大於機械手臂精度〇 5臟之滾動件。 當然’於實際運用上’亦可以視需求而設計，並不以此為限。 上述結構可提供玻璃_4〇由輪送台(㈣_ stati〇n)31經過搬運而 loek diamber)32後仍可麟在最適當的位置，以避 免機台狀設備概；或是.料獅基板餘(_論a—)，使機台停 〇632-A5〇527-TW/AU〇5〇4〇8〇 曰期：98年4月21曰 13 1 1系629590號專利說明書修正本 止運轉、製程中斷，而導致成本增加。 上述結構可提供玻璃基板4〇由機械手臂％搬送至第一製程腔體 ($ 1 ’process chamber 1 )34後仍可保持在最適當的位置，以避免機台發出 靜電累積警報(ESC alarm，Electrostatic Charge alarm)，使機台停止運轉、製 程中斷，而導致成本增加。 雖然本發明已以較佳實施例揭露如上，然其並非用以限定本發明，任 何熟白此技藝者，在不脫離本發明之精神和範圍内，當可作些許之更動與 潤飾’因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。SUMMARY OF THE INVENTION In order to improve the above disadvantages, the present invention provides a substrate correcting device for a machine, comprising a substrate exchange chamber and a core rolling member, wherein the exchange chamber includes a plurality of sides, a surface, and a sensor (the sensor) (S_* ) is set on the bottom surface to confirm whether the substrate is placed to the position, and the rolling elements are arranged on the side and the bottom. When the turtle arm sends the wire board to the room, the correcting substrate can be used to correct the substrate to the substrate exchange chamber. position. In an embodiment, the rolling member includes a ball body, a receiving groove, and a fixing portion. The ball body is rotatably disposed in the receiving groove, and the rolling member is coupled to the bottom surface through the fixing portion. In addition, the sphere is made of insulating material. The above and other objects, features, and advantages of the present invention will become more apparent and understood. [Embodiment] Please refer to Fig. 4, the inside of the machine 3 includes a transport table ((10) coffee stati〇n) 3i, substrate X^t (loadlockchamber) 32. #M(transfermodule chamber)33 ^ process chamber 1) 34 ^ process chamber 0632-A50527-TW/AU0504080 13 1 1 66239590 Patent says that the revision period is: April 21, 1998 2) 35, the second process chamber (pc3, pr〇cess chamber 3) 36 and Robot arm 37,%. The glass substrate 4 is placed on a conveyor table 31 and conveyed by a robot arm 37 to a substrate exchange chamber 32 to place the glass substrate 40 in a vacuum environment, and then The glass substrate 40 is transported to the transport cavity (10) and the micro-disc chamber 33, and the glass substrate 40 is sequentially accessed into the first, second, and third process chambers (PCI, PC2, and PC3) by the robot arm 38. In the 35, 36, the glass substrate 40 is silver-engraved. In the present invention, although the rice carving machine is taken as an example, it is not limited to the money machine. The substrate correcting device of the present invention can also be applied to a general film machine or to a position correction intermediate station for use as a substrate to be transported. In the present invention, although a glass substrate is taken as an example, it is not limited thereto. The substrate correcting device of the present invention can also be applied to a substrate formed of any material such as a metal material substrate, a non-metal material substrate, an organic material substrate or an inorganic material substrate. In a preferred embodiment, the fragile substrate is primarily transported. In another embodiment, it can be used in substrate transfer operations where high precision is required. Referring to the drawings of the 4th and 5th, the substrate 4 is transported by the transport station (cassette stati〇n) 31 to the substrate exchange chamber (load Ιο-) 32. The wire exchange chamber (lGad lQek ehamber) 32 includes a bottom surface 321, Side 323 and sensor 322. In the drawing, the inductor 322 is convexly disposed on the opposite side of the bottom surface 321 to confirm the position of the substrate 40. Practically, the position of the sensor 322 can be set according to actual needs. For example, it can be protruded from the four corners or the periphery of the bottom surface 321 or even the non-bottom surface, and there is no limitation. One of the purposes of using the sensor 322 can be used to detect the presence or absence of a carrier substrate (e.g., glass) or to determine whether the side substrate is in the correct position. The sensor 322 may be disposed in the substrate exchange chamber 32 or in another intermediate station such as the transport chamber 33. Further, a plurality of rolling members 39 are provided on the bottom surface 321 and the side edges 323, respectively. When the glass substrate 4 is moved by the robot arm 37 from the transport table (4) to the substrate exchange chamber (badl〇ckchamber) 32, the 5th, 7th, and 7th (4) hatching, _, 〇 632 -A5〇527-TW/AU〇5〇4〇8〇7 Date: April 21, 1998 131 Μ^2959 Mechanical arm 37 relative to the substrate exchange room (1〇ad 1〇ckCai her post 2 position An error may occur such that when the glass substrate 4 is placed in the substrate exchange chamber 32, the glass substrate 40 first contacts the rolling member % on the side 323. At this time, the substrate is utilized. The weight of the roller and the moving characteristic of the rolling member 39 can slide the glass substrate 4G to the "preset position" to prevent the substrate from being skewed. The rolling member 39 disposed on the bottom surface can be slid by the sliding member 39. The characteristic reduces the friction with the bottom surface to assist the horizontal movement of the glass substrate 40. That is, the position can be corrected by the rolling members 39 provided on the side edges 323 and the bottom surface 321 (as shown in FIG. 5C). At the same time, the robot arm 37 is also pulled away from the load lock diamber 32 (as shown in the figure φ 5D). Referring to Fig. 4, the rolling member % provided on the bottom surface milk can provide the glass substrate 40 to slide to the most appropriate position within the required range. See also the 6th, 6th figure. In this figure, the rolling element 39 is For example, the spherical body 39 includes a receiving groove 392 and the fixing portion 3. The ball 391 is rotatably disposed in the receiving groove, and the rolling member is connected to the bottom surface 321 and the side edge 323 through the fixing portion (eg Figure 4). The design of the rolling element % can be changed according to the actual design requirements. The example is not L. On the substrate exchange chamber, there can be corresponding accommodating slots for the spheres. It is disposed on the needle, and does not need to be separately disposed. 或者. Or, a plurality of holes are arranged in the substrate exchange chamber, and the rolling member 39 is disposed under the corresponding hole, and at least a part of the sphere 391 is exposed. In a preferred embodiment, the spheres are made of a material. In another embodiment, the spheres 391 are made of an antistatic material. In the preferred embodiment, for example, when the accuracy of the robot arm is 〇5 mm, it can be used. Has, for example, 0.6 faces or 1O ugly scroll radius The accuracy of the robot arm 〇 5 dirty rolling parts. Of course, 'in practical use' can also be designed according to the needs, not limited to this. The above structure can provide glass _4 〇 by the wheel to the station ((4) _ stati〇n) 31 After handling, loek diamber) 32 can still be in the most appropriate position to avoid the machine-like equipment; or the lion substrate (_ on a-), so that the machine stops 632-A5〇527- TW/AU〇5〇4〇8〇曰期: April 21, 2011, 13 1 1 Department No. 629590, the patent specification revised the operation and the process was interrupted, resulting in an increase in cost. The above structure can provide that the glass substrate 4 can be kept in the most proper position after being transported by the robot arm % to the first process chamber ($ 1 'process chamber 1 ) 34 to prevent the machine from emitting an electrostatic accumulation alarm (ESC alarm, Electrostatic Charge alarm) causes the machine to stop running and the process to be interrupted, resulting in an increase in cost. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the invention, and any skilled person may make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
〇632-A5〇527-TW/AU〇5〇4〇8〇 1311662 第94139590號專利說明鼙修正本 【圖式簡單說明】 曰期：98年4月21 f 1圖料習知_機台之平面示意圖； ，圖係為s知麵基板傳送至基板交換室之示音 第圖係為習知破璃基板傳送至第一製程腔體之二意圖. 第4圖係為本發明機台之平面示意圖； ‘、、® 第5A〜5D圖係為本發日月玻璃基板傳送至基板交換室之作動八立 苐6A圖係為本發明之一實施例之滾動件外觀立體圖；；、圖 第6B圖係為第6A圖之剖面示意圖；〇 632-A5〇527-TW/AU〇5〇4〇8〇1311662 Patent description No. 94139590 鼙Revised this [Simplified description of the schema] 曰期: April 21, 1996 f 1Graphics _machine The schematic diagram is the indication that the substrate is transferred to the substrate exchange chamber. The figure is the intention of transferring the conventional glass substrate to the first process chamber. Figure 4 is the plane of the machine of the present invention. Fig. 5A to 5D are diagrams showing the movement of the glass substrate to the substrate exchange chamber of the present invention. The figure 8A is a perspective view of the rolling element according to an embodiment of the present invention; The figure is a schematic cross-sectional view of Figure 6A;
第7圖係為本發明玻璃基板傳送至基板交換室之俯視圖。 【主要元件符號說明】 習知技術 11〜承載台； 13〜輸送腔體； 141〜下電極層； 16〜第三製程腔體； 20〜玻璃基板。 31〜承載台； 321〜底面； 323〜側邊； 34〜第一製程腔體； 36〜第三製程腔體； 39〜滾動件； 392〜容置槽； 40〜玻璃基板。 10〜I虫刻機台； 12~基板交換室； 14〜第一製程腔體； 15〜第二製程腔體； 17、18〜機械手臂； 本發明 30~ϋ刻機台； 32~基板交換室； 322〜感應器； 33~輸送腔體； 35〜第二製程腔體； 37 ' 38〜機械手臂； 391〜球體； 393〜固定部；Figure 7 is a plan view showing the transfer of the glass substrate of the present invention to the substrate exchange chamber. [Main component symbol description] Conventional technology 11~bearing table; 13~ conveying cavity; 141~lower electrode layer; 16~third process cavity; 20~glass substrate. 31~bearing table; 321~bottom; 323~side; 34~first process cavity; 36~third process cavity; 39~rolling piece; 392~ accommodating groove; 40~glass substrate. 10~I insect engraving machine; 12~substrate exchange chamber; 14~first process cavity; 15~second process cavity; 17,18~mechanical arm; 30~ engraving machine of the invention; 32~substrate exchange Room; 322 ~ sensor; 33 ~ transport cavity; 35 ~ second process cavity; 37 ' 38 ~ mechanical arm; 391 ~ sphere; 393 ~ fixed part;