13096561309656
九、發明說明： 【發明所屬技術領域】 本發鴨有關於—種PI(pQlyimide)膜，特财關於一種表面 -j特殊處理以作為電路板壓合時之緩触或印綱路之積 、性基材的pi膜。 ' 【先前技術】IX. Description of the Invention: [Technical Field] The present invention relates to a PI (pQlyimide) film, and a special treatment for a surface-j is used as a product of a slow touch or a printing path when a circuit board is pressed. The pi film of the substrate. 'Prior art
’ 圖1A緣示了習知技術中’印刷電路板之壓合方式，如圖1A 雜=’这此麵合方式往往包含蓋板100、缓衝整胤、適型膜102、 在田Ί〇3以及待壓材1〇4(通常為印刷電路板）。其中緩衝塾101 ίΐίΪΪΐί並使溫度均勻分佈。因此這層緩衝墊除了需要具 ΪΙίΐ 的壓力及張力均勻的特性之外，亦需要可控制 …傳導、升溫速率穩定及耐高溫高壓的特性。 此雨種2 = 2業界皆採用牛皮紙或橡膠製品作為緩衝墊， 品土 if枓自疋糊材料本身組織疏密性或彈性以達到目的。然 的製造次’不符合成本效益且利用牛皮紙作緩衝塾 ===備=品較為昂責’且有出污 \ΐ：ί 如圖=繪=板 以及銅107。此膠材可A τρ心 η歡f生基材1〇6 ^(Ep〇Xy)^4^ P〇lyimide) ' ^ 高安高特性可因應現代產品㈣化以及 之積層軟性基材。ί而’，為用π膜作為銅箱基板 導入了血㈣南去$ 了順應有關早位所制定的環保政策’ 合後及路進行=製=此==製，?銘銅基板壓 脫離之現象。 守易產生銅省接著力不佳及銅線 [發=容】需要一贿的材料以克服上述的缺點。 5 .墊係此緩衝 特性。 又ri胰的結構以增強PI之材料 ，本發明之另一目的為提供一種使用於铜箔美 -材，此軟性基材係由至少—PJ膜所構成。且^ 、权性基 殊處理以提升PI膜與銅落之間的接著力。 Μ之表面經過特 气 因此’本發明提供一種pJ膜，盆胜外少 士 狀或=則狀的至少一溝渠，且溝渠之深度小規則 其中溝渠深度之較佳值為50 _以下。ΡΙ膜、、f度。 mil，可為〇.5 mil至u…，縣深度之平均佳值為 下，且溝渠深度之最大差異值為12 _以下。_為.0_以 而上述溝渠係利用選自於由針、砂 f以及噴砂所組成之群組其中任-者在PI膜的面=輪、水砂 加以形成。 胰的早面或雙面上磨刷 本發明另提供一種PI緩衝墊，俜借 上，此PI緩衝墊包含至少一 PI膜，刷電路板的壓合 或不規則狀的至少一溝渠，且溝渠、、$上具有呈規則狀 =__勝 ρι _ 敕性材p; ::=jj板上，此π 7則狀的至少-溝渠，且溝渠之跡規則狀或 L貫施方式】 圖2^將^由圖式詳細描述根據本發明之以膜的較佳實施如 綠示了_維_吻·FIG. 1A shows the pressing method of the printed circuit board in the prior art, as shown in FIG. 1A. The face-to-face method often includes a cover plate 100, a buffering tamper, a compliant film 102, and a field raft. 3 and the material to be pressed 1〇4 (usually a printed circuit board). The buffer is 塾101 ίΐίΪΪΐί and the temperature is evenly distributed. Therefore, in addition to the pressure and uniform tension characteristics of this cushion, it is also necessary to control the characteristics of conduction, temperature rise rate and high temperature and high pressure. This type of rain 2 = 2 industry uses kraft paper or rubber products as a cushion, and the quality of the material is self-adhesive or elastic to achieve the purpose. However, the manufacturing time is not cost-effective and uses kraft paper as a buffer. =================================================================== This rubber can be A τρ心 η欢f raw substrate 1〇6 ^(Ep〇Xy)^4^ P〇lyimide) ' ^ High-ampere high-performance can be adapted to modern products (four) and laminated soft substrates. ί而', in order to use the π film as a copper box substrate to introduce blood (4) South to go to the environmental policy formulated in accordance with the early position of the 'combination and road implementation = system = this == system, the Ming copper substrate pressure off phenomenon. Shouyi produces copper provinces with poor adhesion and copper wire [fat] Rong needs a bribe to overcome the above shortcomings. 5. The pad is tied to this cushioning feature. Further, the structure of the ri pancreas is a material for reinforcing PI, and another object of the present invention is to provide a copper foil-like material which is composed of at least a PJ film. And ^, the weight is treated to improve the adhesion between the PI film and the copper drop. The surface of the crucible is subjected to a special gas. Therefore, the present invention provides a pJ film which has at least one trench which is smaller or smaller than the shape of the trench, and the depth of the trench is small. The preferred value of the trench depth is 50 Å or less. Decor film, f degree. Mil, which can be 〇5 mil to u..., the average value of the county depth is below, and the maximum difference of the trench depth is 12 _ or less. _ is .0_ and the above-mentioned ditch is formed by using a face selected from the group consisting of a needle, sand f, and sandblasting in the surface of the PI film, the wheel, and the water sand. The invention relates to an early or double-sided brushing of the pancreas. The invention further provides a PI cushion, wherein the PI cushion comprises at least one PI film, at least one ditch of the brush circuit board pressed or irregular, and the ditch , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , ^ is a detailed description of the preferred embodiment of the film according to the present invention as shown in the figure.
:、立體圖。如圖2Α和圖2β所示，本發明 =貝J 面叙声，-Γ、Γ、或又面未'，、日不上形成多數溝渠2〇1以辦加JL矣 -k二溝渠的深度根據？1膜的厚度而決定，以不^透^ 6 / Γ_>ίβΙ__丨叫_ 丨胃丨1 备平/斤〉_(走)正替換頁I t> /Γ^ΙΤΓΤΓ~~^7T.~：~™—i 1309656 厚其溝 . 這些溝渠可使PI膜的排氣性增加，並使層 軟，並使Η膜保持彈性以利多次使用。而且: U隙得以使空氣進人，使得ΡΙ膜的升溫速率==== $二此外’因為PI膜本身的特性，使其得以 -、主ϋ 和溝渠之間的距離亦鱗，但並不表示本發 =木 緩衝==本:與其他 邦的Nor·纖維⑼的耐熱度皆在$( )=杜 Π膜(A)之耐熱度則可達到棚度以上。 根據本舍明之 狀尺Ϊ其據本發明之PI膜可依需求切割不同的形 外層墊入不同材質。並可在PI膜的内 =’舰項输在強Ϊ 印刷電路板壓合讀緩進行 PI膜所形成，如圖4所示，可利用固由—或多層本發明的 將多層ΡΙ膜搬固定住，並可於ρι ===釘或鉚釘)4〇1 緩衝材以符合實際需求。 、之間加入不同材質之 路板==¾¾ 1309656 祝’*1’ _ 丨*1"·*··-*1·*·»··»·^ 你年·（月'^日緣'(避)正替換頁 等ί::ί严此第一實施例在壓合時並不會有斷裂或折痕 ί”」具有良好的外觀，且溫度傳導均勻，升溫速率較快且釋 二趙壓合多讀，射_。須注意的是 种祕合方式巾具有第—蓋板_、適型膜 膜僅％f田膜/03以及待塵材504，但並不表示根據本發明之PI 膜僅此使时此類㈣印刷電軸及銅縣板之壓合上。 =示了根據本發明之f路板的第二較佳實酬。其與圖5 較佳實酬不_地方在於目6所示之第二較佳實施 姑如二Μ第一緩衝墊601，此第二緩衝墊601的材質可為矽膠、 衡轨咖⑽沒纖維或牛皮紙。須注意的是，雖然圖式中的第二緩 衝墊601位於第一緩衝墊5〇1和適型膜5〇2之間，但並不表示其 ?限定於此’熟知此項技藝者當可根據製造需求改變第二、 Ϊ ^…〇1的位置。在19(rC、20 kg/cm2的條件下測試結果，發覺 ，弟二較佳實施例在壓合時並不會有斷裂或折痕等情況，呈有良 ，的外觀，而温度傳導或升溫速率都較僅有PI膜的電路板慢，但 車父僅有牛皮紙緩衝墊的的電路板快而且穩定。 一固會示了根據本發明之電路板的第三較佳實施例。其與圖5 所不的第一較佳實施例不同的地方在於圖7所示之第三較佳實施 例更ί有一第二蓋板701以及第三缓衝墊702，此第三缓衝墊、7〇2 的材質可為矽膠、杜邦的N〇rmex纖維或牛皮紙。當然，熟知此項 技藝者可視需要疊合多層蓋板及多層缓衝墊。在19(TC、20kg/cm2 =條件下測試結果，發覺此第三較佳實施例在壓合時並不會有斷 折痕等情況，具有良好的外觀，且溫度傳導均勻，升溫速率 %定。 圖8繪示了不同膜厚及材質的缓衝墊之升溫曲線，其中$曲 8:, perspective view. As shown in Fig. 2A and Fig. 2β, the present invention = 贝 面 面 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , according to? 1 The thickness of the film is determined, so that it does not pass through ^ 6 / Γ _ > ίβ Ι _ _ _ 丨 丨 丨 备 / / / 斤 正 正 正 正 正 正 正 正 正 正 正 正 正 正 正 正 正 正 正 正 正 正 正 正 正 正 正 正 正 正 正 正 正:~TM—i 1309656 Thick groove. These trenches increase the venting of the PI film and make the layer soft and keep the enamel film elastic for multiple use. Moreover: the U-gap allows air to enter, so that the heating rate of the enamel film ==== $2. In addition, because of the characteristics of the PI film itself, the distance between the main raft and the ditch is also scaled, but not Indicates that this hair = wood buffer == this: the heat resistance of Nor's fiber (9) with other states is at $() = the heat resistance of the azalea film (A) can reach above the degree. According to the present invention, the PI film according to the present invention can be cut into different materials according to requirements. And the PI film can be formed in the inner layer of the PI film, and the PI film is formed by pressing and reading the printed circuit board. As shown in FIG. 4, the multi-layer film can be fixed by using the solid-or multi-layered invention. Live, and can be ρι === nail or rivet) 4〇1 cushioning material to meet actual needs. Between the different materials of the road board ==3⁄43⁄4 1309656 I wish '*1' _ 丨*1"·*··-*1·*·»··»·^ Your year · (月 '^日缘' ( Avoiding) replacing the page, etc. ί:: ί strict The first embodiment does not have cracks or creases during pressing. ”” has a good appearance, and the temperature is evenly distributed, the heating rate is faster, and the pressure is released. More reading, shooting _. It should be noted that the secret type towel has a first cover plate, a suitable film only %f film / 03 and the dust to be 504, but does not mean the PI film according to the present invention. Only this time, the (4) printing electric axis and the copper plate are pressed together. = The second preferred remuneration of the f-plate according to the present invention is shown. The second preferred embodiment shown in FIG. 6 is like a second cushion 601. The material of the second cushion 601 can be tantalum, balance rail (10), no fiber or kraft paper. It should be noted that although in the drawings The second cushion 601 is located between the first cushion 5〇1 and the compliant membrane 5〇2, but does not mean that it is limited to the one skilled in the art, when the second can be changed according to the manufacturing requirements. 〇1's position. In 19 (rC, 20 kg/cm2 test results, found that the preferred embodiment of the second embodiment does not have cracks or creases during pressing, showing a good appearance, and temperature conduction or heating rate Both are slower than the circuit board with only the PI film, but the circuit board with only the kraft pad of the driver is fast and stable. A third preferred embodiment of the circuit board according to the present invention will be shown. The first preferred embodiment of the present invention differs in that the second preferred embodiment shown in FIG. 7 further includes a second cover 701 and a third cushion 702. The third cushion is 7〇2. The material can be tannin, DuPont N〇rmex fiber or kraft paper. Of course, those skilled in the art can stack multi-layer covers and multi-layer cushions as needed. Test results at 19 (TC, 20kg/cm2 = condition, find out The third preferred embodiment does not have broken creases and the like during pressing, has a good appearance, and has uniform temperature conduction and a constant heating rate. Figure 8 shows cushions of different film thicknesses and materials. Temperature rise curve, where $8
fi E替換頁 j3〇9656 線表示6. 9刪牛皮紙的升溫曲線、Y曲線表示6· 9咖pi膜的 浪曲線H線表示3. 2 mm牛皮紙+3. 7 mm PI膜的升溫曲線、而 _ Q曲線表示1.5刪PI膜的升溫曲線。如圖7所示，厚度同樣 6. 9蘭之牛皮紙(X)及PI膜（¥)在13〇度以下升溫速率類似，但古 於130度’牛皮紙⑴的升溫產生停頓現象， 上升趨勢。而Η膜⑺則是穩定的上升至機器設定溫度。= ♦間杈牛皮紙短、熱傳速率較高。另外，測試3. 2麵牛皮紙與3 ΡΙ膜(Ζ)之組合層，則發現其曲線類似6.9細ρι膜⑺, 速率而較薄的1. 5mmPi膜⑼緩衝塾呈玉見最快之升溫速率: ，叫f 了將本發明之PI膜羽於鋪基板之軟性基材 ίΐΐϋ圖9所示’此種銅錄板亦如圖1B般包含膠材卯5、 性基材906以及銅箱907，所不同之處在於圖9中的 基材906係經過表面特殊處理的ρ][膜。此 中^膜相同，係利用針、砂紙、水砂紙、砂輪圖他2C ίίΪ同ίΐΐ裝置在其單面或雙面上形成多數溝渠以增加·^•表 過此處理後，其粗度以及與接著膠材的接著面ί 付以增加，進-步提升了 ΡΙ材料與接著膠材之接著力。妾者面積 較佳實施例中，PI膜的厚度為i㈤，而其 =句=2. 0 μι„以下，溝渠深度之最大差異值為6 ^以下1The fi E replacement page j3〇9656 line indicates the temperature rise curve of the hexagram of the khaki paper, and the Y curve indicates the wave curve of the 6.9 ga film. The H line represents the temperature rise curve of the 3. 2 mm kraft paper + 3. 7 mm PI film. The _ Q curve indicates the heating curve of the 1.5-fold PI film. As shown in Fig. 7, the temperature rise rate of the khaki paper (X) and the PI film (¥) of the same thickness is similar to that of 13 degrees below, but the temperature rise of the 130 degree 'kraft paper (1) is a standstill and an upward trend. The enamel film (7) is steadily rising to the machine set temperature. = ♦ The kraft paper is short and the heat transfer rate is high. In addition, the test of the combination of 3.2 face kraft paper and 3 enamel film (Ζ), the curve is similar to 6.9 fine ρ film (7), the rate is thinner 1. 5mmPi film (9) buffer 塾 shows the fastest heating rate : : : : : : : : : : : : : : : : : : : : : : : , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The difference is that the substrate 906 in Fig. 9 is a specially treated ρ] [film. In this case, the film is the same, using a needle, sandpaper, water sandpaper, grinding wheel, and other 2C ί Ϊ ΐΐ 形成 形成 形成 形成 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数 多数Then the adhesive surface of the glue is increased to further increase the adhesion of the enamel material to the subsequent glue. In the preferred embodiment, the thickness of the PI film is i (five), and the = sentence = 2. 0 μι„ below, the maximum difference value of the ditch depth is 6 ^ or less 1
至Π ^深度為25⑽町，而ΡΙ膜之較佳厚度為〇· 5mU ======而物嫩、二 【圖式簡單說明】 ί 知技術的印刷f路板及銅箔基板之壓合方式. 圖麟不了習知技術中使用PI膜為軟性基材形成印|電大路 9 1309656 私年ί叫日修(fc正韻頁 板及銅箔基板之剖面圖； 圖2A繪示了根據本發明之pi膜的剖面圖； 圖2B及2C繪示了兩種本發明之ρι膜的立體圖； 圖3係為各種緩衝墊材料之耐熱度比較的長條圖： 圖4繪示了將多層p!膜組合成ρι緩衝墊之實施方式； 例·圖5繪示了根據本發明之使用ρι膜的電路板之第一較佳實施 例·圖6繪示了根據本發明之使用ρι膜的電路板之第二較佳實施 圖7繪示了根據本發明之使用ρι膜的電路板之第錢佳實施 圖8係，不同膜厚及材質的缓衝塾之升溫曲線圖； 及 ㈣树狀PI縣難紐碱印刷電路板 【主要元件符號說明】 100蓋板 101緩衝墊 102適型膜 103離型膜 104待壓材 105膠材 106 PI軟性基材 107銅箔 200 PI 膜 201溝渠 401固定元件 402 PI 膜 500第一蓋板 501第一緩衝塾 1309656 502適型膜 503離型膜 504待壓材 601第二缓衝墊 701第二蓋板 702第三缓衝墊 905膠材 906 PI軟性基材 907銅箔To Π ^ depth is 25 (10) town, and the preferred thickness of the enamel film is 〇 · 5mU ====== and the object is tender, two [simple description of the drawing] ί know the technology of printing f-plate and copper foil substrate pressure The combination of the way. Tu Lin can not use the PI film for the soft substrate to form the printing | electric road 9 1309656 private year ί called the day repair (fc rhyme page board and copper foil substrate section; Figure 2A shows A cross-sectional view of a pi film of the present invention; FIGS. 2B and 2C are perspective views of two ρ films of the present invention; and FIG. 3 is a bar graph showing a comparison of heat resistance of various cushion materials: FIG. The embodiment of the p! film is combined into a ρι cushion; FIG. 5 illustrates a first preferred embodiment of a circuit board using a ρ film according to the present invention. FIG. 6 illustrates the use of a ρ film according to the present invention. FIG. 7 is a second embodiment of the circuit board. FIG. 7 is a diagram showing a temperature rise curve of a buffer layer of different film thicknesses and materials according to the present invention. PI County Dynasties Alkali Printed Circuit Board [Main Component Symbol Description] 100 Cover Plate 101 Cushion 102 Optimum Film 103 Release Film 104 Press material 105 glue material 106 PI soft substrate 107 copper foil 200 PI film 201 trench 401 fixing component 402 PI film 500 first cover 501 first buffer 塾 1309656 502 compliant film 503 release film 504 to be pressed 601 second Cushion 701 second cover 702 third cushion 905 glue 906 PI soft substrate 907 copper foil