TWI308853B - - Google Patents

Download PDF

Info

Publication number
TWI308853B
TWI308853B TW94141564A TW94141564A TWI308853B TW I308853 B TWI308853 B TW I308853B TW 94141564 A TW94141564 A TW 94141564A TW 94141564 A TW94141564 A TW 94141564A TW I308853 B TWI308853 B TW I308853B
Authority
TW
Taiwan
Prior art keywords
substrate
organic layer
wiring board
treatment
resin
Prior art date
Application number
TW94141564A
Other languages
English (en)
Chinese (zh)
Other versions
TW200721925A (en
Inventor
Fujimoto Masatoshi
Kubo Shigehiro
Original Assignee
Goo Chemical Co Ltd
Kyosha Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goo Chemical Co Ltd, Kyosha Co Ltd filed Critical Goo Chemical Co Ltd
Priority to TW094141564A priority Critical patent/TW200721925A/zh
Publication of TW200721925A publication Critical patent/TW200721925A/zh
Application granted granted Critical
Publication of TWI308853B publication Critical patent/TWI308853B/zh

Links

Landscapes

  • Laminated Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
TW094141564A 2005-11-25 2005-11-25 Manufacturing method of base material holding device for circuit board, base material holding device for circuit board, intermediate material for circuit board, and manufacturing method of circuit board TW200721925A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094141564A TW200721925A (en) 2005-11-25 2005-11-25 Manufacturing method of base material holding device for circuit board, base material holding device for circuit board, intermediate material for circuit board, and manufacturing method of circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094141564A TW200721925A (en) 2005-11-25 2005-11-25 Manufacturing method of base material holding device for circuit board, base material holding device for circuit board, intermediate material for circuit board, and manufacturing method of circuit board

Publications (2)

Publication Number Publication Date
TW200721925A TW200721925A (en) 2007-06-01
TWI308853B true TWI308853B (enExample) 2009-04-11

Family

ID=45071911

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094141564A TW200721925A (en) 2005-11-25 2005-11-25 Manufacturing method of base material holding device for circuit board, base material holding device for circuit board, intermediate material for circuit board, and manufacturing method of circuit board

Country Status (1)

Country Link
TW (1) TW200721925A (enExample)

Also Published As

Publication number Publication date
TW200721925A (en) 2007-06-01

Similar Documents

Publication Publication Date Title
TW595276B (en) A printed-circuit board (PCB), the components and producing method of PCB
TWI527504B (zh) 金屬系電路基板及金屬系電路基板之製造方法
TWI494337B (zh) 電路基板用環氧樹脂組成物,預浸體,積層板,樹脂片,印刷佈線板用積層基材,印刷佈線板及半導體裝置
TWI239224B (en) COF flexible printed wiring board and method of producing the wiring board
JP4893046B2 (ja) 電子機器用接着剤組成物、それを用いた電子機器用接着剤シート
TWI504327B (zh) 金屬基底基板之製造方法及電路基板之製造方法
TWI292740B (en) Metallic laminate and method for preparing thereof
WO2015029642A1 (ja) 電子デバイス封止用樹脂シート及び電子デバイスパッケージの製造方法
JPWO2016043180A1 (ja) 積層体およびフレキシブルデバイスの製造方法
TW200524504A (en) Multilayer printed wiring board and method for manufacturing the multilayer printed wiring board
JP5560746B2 (ja) 粘接着シート
JP2020059169A (ja) 積層体、及び、積層体の製造方法
JP7757795B2 (ja) 電子表示装置およびその製造方法
JP6582904B2 (ja) 電磁誘導加熱用ホットメルト接着シート、それを用いた接着構造物、及び接着構造物の製造方法
JP3484107B2 (ja) 静電チャック装置
TWI293177B (enExample)
JP2012054293A (ja) 半導体装置の製造方法
TWI308853B (enExample)
EP3749069A1 (en) Metal base substrate
TWI320053B (enExample)
TW201544316A (zh) 異向性導電膜及其製造方法
TW201215508A (en) Manufacturing method of substrate and structure capable of simplifying its manufacturing process
KR101975796B1 (ko) 반도체 패키지용 캐리어 및 이의 제조방법
JP4801874B2 (ja) 金属ベース回路基板の製造方法
JP2004238457A (ja) 熱硬化型粘接着剤組成物及び熱硬化型粘接着シート