1307756 九、發明說明： 【發明所屬之技術領域】 本發?係關於一種散熱模組及其所應用之顯示裝 ，，尤種應用於發光二極體之散熱模組及其所應 用之顯示裝置。 【先前技術】 由於科技的進步’各種電子產品對於功能的需求越 Λ越大，除了桌上型電腦的速度不斷 Π裳置例如筆記型電腦、手機、掌上型電 =品也成為重要的發展趨勢。然而，隨著產品性能越 ，越^所制的電子元件的⑽度（integmi〇n)越 冋，仏成發熱量提高，故散熱效能直接響 可靠性與使用壽命。 电于兀仵的 以發光二極體（Light Emitting Di〇de，led)作 源為例’現行的做法大多為在⑽的背面貼上錯 使用數根熱管，以主動或被動式的方法將熱 ΐίΐ 請參照第1圖，其為習知之發光二極體(_ 模組之示意圖。習知之LED散熱模組1〇係將多個發 先—極體11排列設置於金屬芯印刷電路板⑽如c⑽1307756 IX. Description of the invention: [Technical field of the invention] The present invention relates to a heat dissipation module and a display device thereof, and particularly to a heat dissipation module of a light-emitting diode and a display device thereof . [Prior Art] Due to advances in technology, the demand for functions of various electronic products has become more and more important. In addition to the speed of desktop computers, such as notebook computers, mobile phones, and palm-sized computers, products have become an important development trend. . However, as the performance of the product increases, the (10) degree (integmi〇n) of the electronic component is increased, and the heat generation is increased, so the heat dissipation performance directly responds to reliability and service life. For example, the light-emitting diode (Light Emitting Di〇de, led) is used as the source. Most of the current practices are to use a few heat pipes on the back side of (10) to actively or passively heat the heat. Please refer to FIG. 1 , which is a schematic diagram of a conventional light-emitting diode ( _ module. The conventional LED heat dissipation module 1 has a plurality of first-pole bodies 11 arranged on a metal core printed circuit board (10) such as c(10).
Circuit B〇ard ’ ·Β)12 上，並在印刷電路 ^的下方設置有多個散熱鰭片13與印刷電路板12 接觸’藉以將發光二極體u所產生的熱導離。然而，若 =自然對流的方式進行散熱，所1_片之數量將會很 旦=僅使得體積無法微小化且造成整個散熱模組的重 里與成本均十分高昂。再者，由於自然對流作用是利用 1307756 工氣的溫度不同而造成密度不同進而造成流體流動，备 下’片附近的空氣因為吸熱而往上流動，但流至最上方 時’本身已經吸收了很多的熱量，使得空氣溫度升高， 故上方鰭片附近的散熱效果變差。因此，當眾多的發 一極體設置在―起時’發光二極體最上-排與最下-排 皿度差’往往回達攝& 7_1G度左右。若外掛一風扇進 二強制對流的散熱’因受到風扇本身馬達的機構設計影 曰，位於散熱鰭片的中心點沒有風量通過，使得發光二 極體的均溫性無法得到有效的控制。 由於熱管(heat Pipe)是一種簡單卻極有效的散熱 ，因此已被廣泛地應用於各種電子散熱產品的需要 潛執來僂遞*,吾：：作”貝乱、液兩相間相變化的 二來傳卫作介質靠内部毛細結構（wick)提 供的毛細力流回至蒸發段進行相變化的循環，持續 效地將熱能從熱源傳輸至遠處散出。 然而 总柞… 寸的背投影電視而言，使用-般熱 =LED散熱模組之散熱機制的成效不彰。使用一般 雖能改善僅使用散熱鰭片而產生的發光二極體的均 ^生不佳的問題’但—般熱f仍有其長度（約略是5〇公 ^的限制’-旦熱管長度太長（大於5〇公分）時，則熱 二2 5作流體將無法快速的回水’故容易造成熱管 二，涸（Dry out)的現象，而使得熱管損壞失效。故一 •又σ 舨熱官無法應用於超過20吋的LED背光模組 上0 、' 均溫性良好且熱傳導特性良好:= = : 1307756 其所應用之顯示裝置，實為重要課題之一。 【發明内容】 搞科為解決上述問題，本發明係提出—種發光一 及其所應用之顯示裝置，可有效改匕 溫度保持其均勾性，進而維持顯示i 及使用空間 可靠度。另外，可有效的減少重量 =虞本發明的目的，提出—種發光二 一脈衝式熱管、複數個發光二極體以及複數:: ϋ片。脈衝式熱管具有一蒸發端與一相對之冷凝 鈿，夕個發光二極體係個別設置於脈衝式熱管上，且 體皆位於蒸發端處。多個散熱鰭片係與脈衝“ &連、，、口，且散熱鰭片皆位於冷凝端處。 么根據本發明的另一目的，提出一種顯示裝置，包括 :機殼、顯示面板以及複數個發光二極體散熱模組 不面板與機殼相結合，而多個發光二極體散熱模組 置^機殼内，每—發光二極體散熱模組係包括」脈^ 熱官、複數個發光二極體以及複數個散熱鰭片，且發^ 二極體係提供顯示面板所需之光源。脈衝式熱管具^一 蒸發端與一相對之冷凝端，多個發光二極體係個^設置 於脈衝式熱管上，且發光二極體皆位於蒸發端處。：個 散熱鰭片係與脈衝式熱管連結，且散熱鰭片皆位於冷凝 端處。 如上述之發光二極體散熱模組及其所應用之顯示 1307756 :置’其中發光二極體散熱模組係置於顯示面板之背 有丄光二極體係朝向顯示面板。脈衝式熱管内形成 如s::空：，且密閉空間内係充填有-工作流體，例 = ,、，、機化“勿、純水、醇類、嗣類、液態金屬、冷媒、 端或合物之一。其中，工作流體係在蒸發 y收發光二極體所產生之熱量，並蒸發彿騰後產生一 罐將位於蒸發端的工作流體推向冷凝端處並 2熱量後，再度回到蒸發端處，完成工作流體之循環 流動。 述之發光二極體設置於脈衝式熱管上的設置方 直接結合、黏合、貼合、焊接或其他等效方式。 脈衝式熱管包括-外部形狀為半圓弧、正矩形、三角形、 或嘉=:五角形、六角形、八角形、等邊多邊形 s 夕邊形之截面。或者，脈衝式熱管包括一内部 圓形，一外部方型之截面。 脈衝式熱管之材質係包括一高熱傳導材料，例如是 1呂、銅、欽、1目、銀、不鏽鋼、碳鋼或其它合金。上述 置更包括至少—風扇，且風扇係設置於靠近散 …”、曰片處，用以增加熱對流效率。再者，上述之顯示裝 置更包括1：路板’其係與發光二極體電性連結，且電 路板係具有-梳狀結構，使得發光二極體散熱模組係分 別置入梳狀結構的每一齒與齒之間。 為讓本發明之上述和其他目的、特徵、和優點能更 明顯易懂，下文特舉-較佳實施例，並配合所附圖式， 作詳細說明如下： 1307756 【實施方式】 以下將參照相關圖式，說明依本發明之散熱模組及 其熱管之實施例。 請同時參照第2A圖與第2B圖’第2A圖為依照 發明較佳實施例之一種發光二極體散熱模組之示意圖， 而第2B圖為第2A圖之側剖面示意圖。如第2a圖所示， 依照本發明較佳實施例之發光二極體散熱模組2〇，其勺 括複數個發光二極體21、一脈衝式熱管22以及複數= 散熱鰭片23。多個發光二極體21係個別設置於脈衝 熱管22上，而多個散熱鰭片23亦與脈衝式熱管22 ^ ，。脈衝式熱管22之材質係包括一高熱傳導材'料，例如 是鋁、銅、鈦、鉬、銀、不鏽鋼、碳鋼或其它合金。〇 以下先詳細說明脈衝式熱管22之運作原理。如 2B圖所示，脈衝式熱管22具有一蒸發端v與一相 冷，端c，且多個發光二極體21皆位於脈衝式熱管2 之瘵發端（vaporization ，而散埶赭 =於冷凝端―densation secti〇n)c 處/“ 3 ，内形成有一密閉空㈣，且密閉空間24内係= 有一工作流體w’例如是無機化合物、純水、醇： 類、液態金屬、冷媒、有機化合物或其混合物之一。 當脈衝式熱管22内之工作流體w在蒸 :光二極體2丨所產生的熱量時，位於蒸發 發7後產生氣泡b。由於位n 2乳泡增加，而冷凝端c處之氣泡少，因此產生 β迅逮將蒸發端吸熱的"·作㈣ V處推向冷凝端c處放熱，並再度㈣蒸發端M = 9 1307756 成工作流體w之循環流動，如此可持續而有效地將埶量 從發光二極體21傳輸至遠處散出。 ”、 ,由於氣泡B的產生與消滅造成了驅動工作流體评流 動，裱的脈衝式推動力（Pumping force)，故相較於傳統 熱管受限於毛細結構的毛細力有限而有其長度的限制， 本發明之脈衝式熱管22可將長度設計至數公尺長，可有 效改善一般熱管長度不可超過50公分限制的缺點，並增 加機構設計的彈性。 日 請再同時參照第2A圖與第2B圖，多個發光二極體 21係個別設置於脈衝式熱管22上，且多個發光二極體 21皆位於脈衝式熱管22之蒸發端v處，而多個散熱鰭 片23亦與脈衝式熱管22連結，且散熱鰭片23皆位於脈 衝，熱管22之冷凝端C處，故發光二極體21所產生的 熱置可直接由脈衝式熱管22吸收並快速導離發光二極 體21。再者，由於脈衝式熱管22内之工作流體w係處 於兩相（即氣相與液相）平衡區，因此脈衝式熱管2 2之溫 度即為該工作流體w之飽和溫度，使得脈衝式熱管22 之蒸發端可保持幾乎均溫的狀態，進而使得每一發光二 極體21的溫度可保持其均勾性。 發光二極體21設置於脈衝式熱管22上的設置方式 可以例如是直接結合（mount)於脈衝式熱管22之蒸發端 评之表面上，可降低發光二極體21與脈衝式熱管22之 間之一接觸熱阻，大幅提高發光二極體散熱模組2〇之熱 傳導施力。然本發明並不限制於此，發光二極體21亦可 以黏合、貼合、焊接或其他等效方式設置於該脈衝式埶 管22上。 1307756 笛9A ^，請同時參照第2A圖與第2C圖，第沈圖為 :二Ϊ發光二極體散熱模組之脈衝式熱管蒸發端處 内;=忍圖。如第2C圖所示’脈衝式熱管22具有-^ 外部方型之截面，如此可以使發光二極體 本Λ 的與脈衝式熱管22之蒸發端V接觸。再Circuit B〇ard ’·Β) 12 is provided with a plurality of heat dissipation fins 13 in contact with the printed circuit board 12 under the printed circuit ^ to thereby conduct heat generated by the light-emitting diodes u. However, if the natural convection method is used to dissipate heat, the number of 1_chips will be very large = only the volume cannot be miniaturized and the weight and cost of the entire heat dissipation module are very high. In addition, since the natural convection is caused by the difference in temperature of 1307756 working gas, the density of the fluid is different, which causes the fluid to flow. The air near the sheet is moved upward due to heat absorption, but when it flows to the top, it has absorbed a lot. The heat causes the air temperature to rise, so the heat dissipation effect near the upper fins becomes worse. Therefore, when a large number of hair-emitting bodies are disposed at the "up", the uppermost row of the light-emitting diodes and the lowermost-discharged degree are often returned to the photo & 7_1G degrees. If the fan is forced into the convection, the heat dissipation by the fan is affected by the mechanism design of the motor of the fan itself. At the center of the heat sink fin, no air flow is passed, so that the temperature uniformity of the light emitting diode cannot be effectively controlled. Since the heat pipe is a simple but extremely effective heat dissipation, it has been widely used in various electronic heat-dissipating products. The U.S.: "Because" is the second phase change between the two phases. The relaying medium flows back to the evaporation section by the capillary force provided by the internal capillary structure (wick) to continuously transfer the heat energy from the heat source to the distant place. However, the total rear projection television In fact, the use of the general heat = LED heat dissipation module's heat dissipation mechanism is not effective. The use of the general use of the heat sink fins can only improve the poor quality of the light-emitting diodes. f still has its length (approximately 5 〇 public ^ limit '--When the length of the heat pipe is too long (greater than 5 〇 cm), then the heat of 2 2 5 will not be able to return to the water quickly, so it is easy to cause heat pipe 2, 涸(Dry out) phenomenon, which causes the heat pipe damage to be invalid. Therefore, the σ 舨 heat officer cannot be applied to the LED backlight module of more than 20 0. 0, 'The temperature uniformity is good and the heat conduction characteristics are good: = = : 1307756 The display device applied is an important lesson In order to solve the above problems, the present invention proposes a light-emitting device and a display device thereof, which can effectively change the temperature to maintain its uniformity, thereby maintaining the display i and the reliability of the use space. In addition, the weight can be effectively reduced. 虞 The object of the present invention is to provide a light-emitting two-pulse heat pipe, a plurality of light-emitting diodes, and a plurality of:: a pulsed heat pipe having an evaporation end and a relative condensation.钿, the illuminating two-pole system is separately disposed on the pulse heat pipe, and the body is located at the evaporation end. The plurality of heat-dissipating fins are connected with the pulse "and", the port, and the heat-dissipating fins are located at the condensation end. According to another aspect of the present invention, a display device includes: a casing, a display panel, and a plurality of light emitting diode heat dissipation modules, the panel is combined with the casing, and the plurality of light emitting diodes are disposed. In the housing, each of the light-emitting diode cooling modules includes a pulse heat register, a plurality of light-emitting diodes, and a plurality of heat-dissipating fins, and the two-pole system provides a light source required for the display panel. The pulsed heat pipe has an evaporation end and a opposite condensation end, and a plurality of light emitting diode systems are disposed on the pulse heat pipe, and the light emitting diodes are located at the evaporation end.: a heat sink fin and a pulse The heat pipe is connected, and the heat sink fins are located at the condensation end. The above-mentioned light emitting diode heat dissipation module and the display thereof are applied 1307756: the light emitting diode heat dissipation module is placed on the back of the display panel. The dimming two-pole system faces the display panel. The pulsed heat pipe is formed like s:: empty: and the closed space is filled with - working fluid, for example, , , , , , , , , , , , , , , , , , , , , , , , , , , , , One of a liquid metal, a refrigerant, a terminal or a compound, wherein the working system evaporates the heat generated by the illuminating diode, and evaporates the fotten to produce a can to push the working fluid at the evaporation end toward the condensation end. After 2 heat, return to the evaporation end again to complete the circulating flow of the working fluid. The arrangement of the light-emitting diodes disposed on the pulsed heat pipe is directly combined, bonded, bonded, welded or otherwise equivalent. The pulsed heat pipe includes - the outer shape is a semi-circular arc, a regular rectangle, a triangle, or a jia: a pentagon, a hexagon, an octagon, an equilateral polygon, and a s-shaped section. Alternatively, the pulsed heat pipe includes an inner circular shape and an outer square cross section. The material of the pulse heat pipe includes a high heat conductive material such as 1 liter, copper, chin, 1 mesh, silver, stainless steel, carbon steel or other alloys. The above-mentioned device further includes at least a fan, and the fan is disposed near the ... ” , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Electrically connected, and the circuit board has a comb-like structure, such that the light-emitting diode heat dissipation module is respectively placed between each tooth and the tooth of the comb structure. To achieve the above and other objects, features, and features of the present invention, The advantages and advantages can be more clearly understood. The following is a detailed description of the preferred embodiment and the accompanying drawings, as follows: 1307756 [Embodiment] Hereinafter, a heat dissipation module according to the present invention will be described with reference to related drawings. Embodiments of the heat pipe. Please refer to FIG. 2A and FIG. 2B both. FIG. 2A is a schematic diagram of a light-emitting diode heat dissipation module according to a preferred embodiment of the present invention, and FIG. 2B is a side profile of FIG. 2A. As shown in FIG. 2a, a light-emitting diode heat dissipation module 2 〇 according to a preferred embodiment of the present invention includes a plurality of light-emitting diodes 21, a pulse-type heat pipe 22, and a plurality of heat-dissipating fins 23 Multiple LEDs 21 It is not disposed on the pulse heat pipe 22, and the plurality of heat dissipation fins 23 are also combined with the pulse heat pipe 22. The material of the pulse heat pipe 22 includes a high heat conductive material, such as aluminum, copper, titanium, molybdenum, silver. Stainless steel, carbon steel or other alloys. The operation principle of the pulsed heat pipe 22 will be described in detail below. As shown in Fig. 2B, the pulsed heat pipe 22 has an evaporation end v and a phase cold, end c, and a plurality of light emitting diodes. The pole body 21 is located at the burst end of the pulse heat pipe 2 (vaporization, and at the condensation end - densation secti〇n) c / "3, a closed air (four) is formed therein, and the closed space 24 has a The working fluid w' is, for example, one of an inorganic compound, pure water, an alcohol: a liquid metal, a refrigerant, an organic compound or a mixture thereof. When the working fluid w in the pulse heat pipe 22 is steaming: the heat generated by the photodiode 2, the bubble b is generated after the evaporation. Since the n 2 vesicles increase and the condensing end c has fewer bubbles, the β 迅 将 将 将 将 将 将 将 将 将 将 将 蒸发 蒸发 蒸发 将 蒸发 蒸发 蒸发 蒸发 蒸发 蒸发 蒸发 蒸发 蒸发 蒸发 蒸发 蒸发 蒸发 蒸发 蒸发 推 推 推 推 推 推 推 推 推 推 推 推 推 推 推 推1307756 is a circulating flow of the working fluid w, so that the amount of helium can be continuously and efficiently transmitted from the light-emitting diode 21 to a distant place. ", because the generation and elimination of the bubble B caused the driving work fluid to evaluate the flow, the pulsed pumping force, so compared with the traditional heat pipe limited by the limited capillary force of the capillary structure and its length limit The pulse heat pipe 22 of the present invention can be designed to a length of several meters, which can effectively improve the shortcoming of the general heat pipe length not exceeding 50 cm, and increase the flexibility of the mechanism design. Please refer to the 2A and 2B at the same time. The plurality of light-emitting diodes 21 are disposed on the pulsed heat pipe 22, and the plurality of light-emitting diodes 21 are located at the evaporation end v of the pulsed heat pipe 22, and the plurality of heat-dissipating fins 23 are also pulsed. The heat pipes 22 are connected, and the heat dissipation fins 23 are located at the condensing end C of the heat pipe 22, so that the heat generated by the light-emitting diodes 21 can be directly absorbed by the pulse heat pipe 22 and quickly guided away from the light-emitting diodes 21. Furthermore, since the working fluid w in the pulse heat pipe 22 is in a two-phase (ie, gas phase and liquid phase) equilibrium region, the temperature of the pulsed heat pipe 22 is the saturation temperature of the working fluid w, so that the pulsed heat pipe twenty two The evaporation end can maintain a state of almost uniform temperature, so that the temperature of each of the light-emitting diodes 21 can maintain its uniformity. The arrangement of the light-emitting diodes 21 on the pulse-type heat pipe 22 can be, for example, direct bonding. On the surface of the evaporation end of the pulsed heat pipe 22, the contact thermal resistance between the light-emitting diode 21 and the pulsed heat pipe 22 can be reduced, and the heat conduction force of the light-emitting diode heat-dissipating module 2 can be greatly improved. However, the present invention is not limited thereto, and the LED 21 can also be bonded, bonded, soldered, or other equivalently disposed on the pulsed manifold 22. 1307756 Flute 9A ^, please refer to FIG. 2A and 2C diagram, the first sinking diagram is: the end of the pulsed heat pipe evaporation end of the two-turn LED cooling module; = forbearing. As shown in Fig. 2C, the pulsed heat pipe 22 has a cross section of -^ external square shape, In this way, the light-emitting diode can be brought into contact with the evaporation end V of the pulse heat pipe 22.
’月…、鰭片23較佳地係位於脈衝式熱管22之冷凝端 一 =^以增加散熱面積。或者，亦可外加一風扇（圖未 不）於罪近散熱鰭片23處，可增加熱對流效率。 接著_’請參照第3圖，其為依照本發明較佳實施例 之、員示裝置之分解示意圖。本發明較佳實施例之一 種顯示裝置30，例如是—背投影電視，包括—機殼31、 :顯不面4反32 α及複數個發光二極體散熱额2〇。顯 不，板12與機殼31相結合，而發光二極體散熱模組2〇 係設置於機殼31 0。發光二極體散熱模組2{)包括複數 個發光一極體21、一脈衝式熱管22以及複數個散熱鰭 片23’其中發光二極體21係提供顯示面板犯所需^ 源。The month 23, the fins 23 are preferably located at the condensation end of the pulsed heat pipe 22 to increase the heat dissipation area. Alternatively, a fan (not shown) may be added to the sin near the heat sink fin 23 to increase the heat convection efficiency. Next, please refer to Fig. 3, which is an exploded perspective view of the pointing device in accordance with a preferred embodiment of the present invention. A display device 30, such as a rear projection television, includes a casing 31, a display surface 32, and a plurality of light-emitting diodes. Preferably, the board 12 is combined with the casing 31, and the light-emitting diode heat dissipation module 2 is disposed on the casing 31 0 . The light-emitting diode heat dissipation module 2{) includes a plurality of light-emitting diodes 21, a pulse-type heat pipe 22, and a plurality of heat-dissipating fins 23', wherein the light-emitting diodes 21 provide a display panel.
由於第3圖之發光二極體散熱模組2〇及其發光二 極體21、脈衝式熱管22以及散熱鰭片23等之結構特 =、實施態樣與功能特徵係如第2A圖之發光二極體散熱 模組20及其發光二極體21、脈衝式熱管22以及散熱鰭 片23所述’故在此便不贅述。 對於大尺寸的背投影電視而言，顯示裝置3〇中可 能需要使用到數百顆的發光二極體21來提供光源，因此 係將發光二極體散熱模組2〇置於顯示面板32之背後， 且發光二極體21係朝向顯示面板32，使發光二極體21 11 1307756 知以h供顯示面板3 2所需之光源，而發光二極體21所 產生之熱量則藉由脈衝式熱管22迅速帶至脈衝式熱管 22的冷凝端c散熱’並於冷凝端處c使用散熱鰭片23 來增加散熱面積。再者，顯示裝置30更包括至少一風扇 33 ’且風扇33係設置於靠近散熱鰭片23處，用以增加 熱對流效率。 然而’在此需特別注意的是’為了便於說明，第3 圖中並未繪示出電路板，然電路板實係與發光二極體21 電性連結，且電路板可例如是具有一梳狀結構，並於梳 狀結構的每一齒與齒之間係分別置入一如第2a圖所示 之發光二極體散熱模組20。 ’、 承上所述，本發明之發光二極體散熱模組及其所應 用之顯示裝置，相較於傳統熱管受限於毛細結構的毛細 力有限而有其長度的限制，本發明之脈衝式熱管可將長 度設計至數公尺長，可有效改善一般熱管長度不可超過 50公分限制的缺點，且脈衝式熱管可以任意的角度擺 放，故不受限於任何設置的位置，可增加設計的彈性。 再者，因脈衝式熱管之蒸發端可保持幾乎均溫的狀態， 故可使每一發光二極體的溫度保持其均勻性，進而維持 顯示裝置整體的顯色功能與可靠度。另外，與習知僅使 用散熱韓片來進行散熱的模組相較，使用本發明之發光 二極體散熱模組進行散熱，可有效的減少其重量及使用 空間。 八 然而，本發明並不限於此，如第2C圖所示之脈衝 式熱管22，其具有一内部圓形，一外部方型之截面。然 脈衝式熱管22亦可依照使用者之需求，設計為一内部; 狀為圓形之截面，並搭配上一外部形狀為半圓弧、正矩 12 1307756 形、三角形、四邊形、说 故、東々* 梯$、五角形、六角形、八角形、 等邊多邊形或不等邊多邊形 疋夕逯^之載面所任意組合而成。 錐太心/ 鱗例性，轉為限制性者。任何未脫 之精神與範_，而對其進行之等效修改或變 更，均應包含於後附之申請專利範圍中。 【圖式簡單說明】 =1圖為習知之發光二極體散熱模組之示意圖。 f A圖為依照本發明較佳實施例之一種發光二極 體政熱模組之示意圖。 ，2B圖為第2A圖之侧剖面示意圖。 第2C圖為第2A圖之發光二極體散熱模組之脈衝式 …、管蒸發端處之剖面示意圖。 第3圖為依照本發明較佳實施例之一種顯示裝置之 分解示意圖。 【主要元件符號說明】 11、21 :發光二極體 13、23 :散熱鳍片 2 2 :脈衝式熱管 B :氣泡 V :蒸發端 30 :顯示裝置 32 :顯示面板 10 . LED散熱模組The structure of the light-emitting diode heat-dissipating module 2 〇 and its light-emitting diode 21, the pulse-type heat pipe 22, and the heat-dissipating fin 23 of FIG. 3 is characterized by the illumination of the second aspect. The diode heat dissipation module 20 and its light-emitting diode 21, the pulse heat pipe 22, and the heat dissipation fins 23 are not described herein. For a large-sized rear projection television, it may be necessary to use hundreds of light-emitting diodes 21 to provide a light source in the display device 3, so that the light-emitting diode heat dissipation module 2 is placed on the display panel 32. In the back, the light-emitting diode 21 is directed toward the display panel 32, so that the light-emitting diodes 21 11 1307756 can be used to supply the light source required for the display panel 32, and the heat generated by the light-emitting diode 21 is pulsed. The heat pipe 22 is quickly brought to the condensing end c of the pulsed heat pipe 22 to dissipate heat and the heat sink fins 23 are used at the condensing end to increase the heat radiating area. Furthermore, the display device 30 further includes at least one fan 33' and the fan 33 is disposed adjacent to the heat dissipation fins 23 for increasing the efficiency of heat convection. However, 'special attention here is 'For the sake of explanation, the circuit board is not shown in FIG. 3, but the circuit board is electrically connected to the light-emitting diode 21, and the circuit board can have, for example, a comb. A light-emitting diode heat dissipation module 20 as shown in FIG. 2a is placed between each tooth and the tooth of the comb structure. According to the above description, the light-emitting diode heat-dissipating module of the present invention and the display device thereof are used, and the length of the conventional heat pipe is limited by the limited capillary force of the capillary structure, and the pulse of the present invention. The heat pipe can be designed to a length of several meters, which can effectively improve the shortcoming of the general heat pipe length not exceeding 50 cm. The pulse heat pipe can be placed at any angle, so it is not limited to any set position, and the design can be increased. Flexibility. Furthermore, since the evaporation end of the pulse heat pipe can maintain a nearly uniform temperature state, the temperature of each of the light-emitting diodes can be maintained uniform, thereby maintaining the color rendering function and reliability of the entire display device. In addition, compared with the conventional module that uses only the heat-dissipating Korean film for heat dissipation, the light-emitting diode heat-dissipating module of the present invention is used for heat dissipation, which can effectively reduce the weight and the use space. 8. However, the present invention is not limited thereto, and the pulse heat pipe 22 shown in Fig. 2C has an inner circular shape and an outer square cross section. However, the pulse heat pipe 22 can also be designed as an interior according to the needs of the user; the shape is a circular cross section, and the upper outer shape is a semi-circular arc, a positive moment 12 1307756, a triangle, a quadrangle, a saying, an east 々* Ladders, pentagons, hexagons, octagons, equilateral polygons, or unequal polygons. The cone is too hearty/scaled and turned into a restrictive one. Any changes or modifications to the spirit and scope of the invention shall be included in the scope of the appended patent application. [Simple description of the figure] =1 The figure is a schematic diagram of a conventional light-emitting diode heat-dissipating module. Figure f is a schematic diagram of a light-emitting diode thermal module in accordance with a preferred embodiment of the present invention. 2B is a schematic cross-sectional view of the side of FIG. 2A. 2C is a schematic cross-sectional view of the pulsed end of the light-emitting diode heat-dissipating module of FIG. 2A and the evaporation end of the tube. Figure 3 is an exploded perspective view of a display device in accordance with a preferred embodiment of the present invention. [Main component symbol description] 11, 21: LEDs 13, 23: Heat sink fins 2 2: Pulse heat pipe B: Bubble V: Evaporation end 30: Display device 32: Display panel 10. LED heat dissipation module
12 :印刷電路板 20 :發光二極體散熱模組 24 :密閉空間 c :冷凝端 W :工作流體 31 :機殼 33 :風扇 1312: Printed circuit board 20: Light-emitting diode cooling module 24: Confined space c: Condensing end W: Working fluid 31: Case 33: Fan 13