TWI307259B - Manufacturing method of copper clad laminate for via on pad - Google Patents

Description

1307259 IX. Description of the invention: [Technical field to which the invention pertains] The method m is a manufacturing method for a copper crucible for a blind hole on a tan pad, and the pot is allowed to be applied to a copper drop substrate of a blind hole on a solder pad. In the afternoon, the system of copper rabbit substrate, iL Gan + 'ten copper pig layer. 1 plate ~ where - blind hole system is formed in - ultra-thin

10 15 [Prior Art] = Digitalization and networking of sub-industries, printed circuit boards (p(3) are under development. With the high-band and high-speed signal specifications (4), companies are making new advances in ultra-thin metal (four) microcircuits. The design of the step technology is necessary. The system _ &,, the thick product is W Μ (four) ^ line width and interlayer mwoG _. However, the recent circuit line width and interlayer thickness are reduced to equal to or less than the thickness of the barrier, In addition, when the related industries enter the nanometer, Chiyou-Xi's new technologies such as micro-blind hole and layer-adding technology have attracted great attention, which is used to achieve high added value of high-accumulation and ultra-thin package substrates and mobile terminal substrates. The technology is also attracting attention. For double-sided PCBs, the technique of forming a via hole electro-porous via technology, (PTH) and then performing electrodeless electrominening and f-solvent copper electro- ore in the above-mentioned through-hole has been Use. However, 'the size of the package has been gradually reduced recently'. The number of wafers to be installed in the limited space on each PCB has increased rapidly. That is, a ball grid array (BGA) type double-sided pCB A larger number is required in each limited space of pc = In order to achieve this requirement, the size of the solder balls and the distance between the solder balls are gradually reduced by 20 1307259. That is, the solder ball pitch is reduced. In order to implement such fine soldering. Ball spacing, using the blind hole (V〇P) technology on the pad instead of plated through hole technology has become more and more common. The function of the blind hole formed by the plated through hole technology is only to realize the interlayer connection' and use V〇p technology. The formed blind vias provide a solder ball pad for solder balls while providing interlayer connections. Therefore, the V〇p technology has the advantage of greatly reducing the solder ball pitch. See Figures 1A through 1F below. DETAILED DESCRIPTION OF THE INVENTION A conventional method for manufacturing a copper foil substrate for V0p application is described. 10 15 a first copper foil substrate 4 is arranged by arranging copper foil layers 2 and 2 on both sides of the insulating layer, such as 1A, and the components are combined into a thin plate to form 'as shown in FIG. 1B. In the example, the protective layer 3 or 3' is formed on each copper foil layer 2戍2, and the 'protective layer is attached to Transport or stratification is used to protect the surface of copper (4) or 2. In addition, each - copper box layer 2 Forming with 2, the thickness is greater than ι〇μηι, because heat is generated in the subsequent laser process. After w, as shown in Figure (1), formed on the copper layer 2 or 2, above the fault # 3 or 3 ' is removed. ', and the mouth is also shown as shown in Figure (1). The part of the upper steel layer 2 is removed by etching or the like, and the insulating layer (5) is partially exposed. After the locating, as shown in Fig. 1E, the exposed portion of the insulation is privately separated, thereby forming a blind hole 5, blind hole field-釭2, phantom lower copper foil layer finally 'as shown in Fig. 1F The electric-providing electrode 20 is formed in the mesh hole 5 to form a copper foil substrate for VOP. The above-mentioned prior art copper foil substrate for VOP has a problem in that copper is avoided. The foil layer 2 is damaged by the heat generated in the laser process (the laser process is used to form the blind holes 5), and the thickness of the copper foil layers 2 and 2 must be maintained above a certain thickness. ,

10 15

20 _ Fig. 2 is a cross-section 圊 of a copper foil substrate for VOP, which is formed by a technique of manufacturing a VQp^mi substrate by a prior art, and the thickness of the copper > white layers 2 and 2, respectively Equal to or less than 5 microns. Referring to this illustration, the above problems will be discussed in detail. Figure 2 shows that in order to form a fine circuit pattern, each copper 'white layer 2142 has a thickness of less than 5 microns and is subjected to a laser process. The heat generated by a laser beam cannot be sufficiently lost. Therefore, a pinhole is transferred and formed in the lower (four) layer 2, among them. #, Therefore, since the thickness of each of the copper box layers 2 and 2 must be greater than - specific thickness = to prevent the above problems from occurring, it is difficult to manufacture - a method for p capable of utilizing a conventional manufacturing process mi substrate Subtle circuit and other issues. L Yi, Ming content] P Ming: This invention is used to solve the above problems of the prior art, and this iir (four) ❹ to provide a manufacturing - surgery (four) substrate. η forms a mesh hole on a steel foil layer, so that the micro circuit can achieve the above purpose. The present invention provides a copper 7 13 〇 7259 洎 扳 ' ' ' ' ' ' , , , , , , , , , , , , , , , , , , , , , , , , , (A) providing - a first copper box layer and a second copper box layer, each - the two copper fl layers - forming a protective layer on the surface; (B) ^ placing two sets of - copper layer, - insulation a layer and a second copper box layer on the - adhesion layer: and below; (C) removing the protective layer, the protective layer is formed on the second copper foil layer and a portion of the second copper layer (D laser process

Removing a portion of the insulating layer to form a blind via that penetrates a portion of the second copper box layer that was previously removed; and (8) forming a copper foil substrate by removing the protective layer, The protective layers are respectively formed on the surface of a copper foil layer and on the surface of one of the remaining first copper foil layers, and on the adhesion layer. L〇 In this method, the protective layer can be a metal layer. In this method, each of the first copper foil layers and each of the second copper foil layers has a thickness of 5 μm or less. 15 20 In this method, the adhesive layer may be composed of a material having high thermal conductivity. In this method, each of the second copper tank layers in step (C) can be removed using an etching process. The method may further comprise the step (F) after the step (E) to form an electric ore layer on the copper substrate. This method may further include the step (G) after the step (E) to fill the blind via with a conductive paste. [Embodiment] Referring now to the drawings, it is to be noted that the same reference numerals are used to refer to the same or similar elements. Figure 3 is a flow chart. (IV) The present invention is used to manufacture a VQP copper box substrate.

Milk!^' Fig. 4-8 to 41 are process diagrams'. The method of the present invention for manufacturing a VOP copper matte substrate. First, referring to Fig. 3, the VOP copper drop substrate of the present invention is as follows. In y U100, a first copper layer and a second copper box are provided, and a protective layer is formed on the surface of the copper layer. Since the first copper case layer and the second copper case layer 10 15 = face may be damaged during handling or storage, a surface 5 of the first and second copper (four) may be formed with a protective layer. Preferably, the protective layer is a metal layer which is referred to as copper, recorded or inscribed. Therefore, the two groups consist of a -copper layer, an insulating layer and a second (four) layer > structure in the step s, respectively placed above and below. In the second example, H is formed on the surface of the first and second layers, and the arrangement is such that the two protective layers do not contact the insulating layer and the elements thereof are layered. together. A semi-precured prepreg can be used as the adhesion layer. In particular, the scoop condition uses a material having high thermal conductivity as an adhesion layer. 2 'The sighs formed on the second copper box layer respectively in step S300 are removed while the portion of the second copper foil layer is also removed. In step S400, the laser process is used and will be moved. The insulating layer of the first white layer portion is removed to form a via. 20 1307259

Bp ) ΐΠΓ ρ ί rf 1 mj 八 M etched the second copper foil layer with the protective layer removed by etching, and the region where the second copper foil layer has been removed is removed by a laser process And through, (four) into a blind hole. In this example, the heat generated in the laser process can be easily conducted, and the protective layer formed on the surface of the first copper foil layer is lost, and the blind hole can be removed by only removing the insulating layer. In the case of the first copper box layer, even if the thickness of the first copper foil layer is less than 5 micrometers. After the step S500, in the step S500, the two copper foil substrates are formed by removing the protective layer and the adhesion layer, and the 'protective layer is formed on one surface of the first copper box layer and one of the other copper foil layers respectively. On the surface. ^也# 'By removing the protective I (the protective layer is formed on the surface of the first copper plating layer and the surface of the other copper foil layer respectively) and the adhesion layer, the copper box substrate can be lifted, each A blind hole is formed on the copper foil substrate. / After 纟 / ^ S6 〇〇 Medium' forms an electric ore layer on the copper box substrate to form a copper foil substrate. That is, 'to provide conductivity in the blind vias' plating layer can be formed on the copper :: substrate. In this case, according to this embodiment, the conductive holes can be filled in the blind holes to provide electrical conductivity. The method of the present invention for manufacturing VOP copper will be described in detail below with reference to Figs. 4A to 41 20 foil laminate. X. "White Plus i〇〇m - Second: The protective layer 130' is formed by the first surface of the first copper layer 100. The surface of the protective layer 130 is formed with a second copper pig layer. 10 1307259 When the clothes are shipped or stored, the first copper falling layer _ and the second copper are respectively in the first copper coffee. The first protective layer 110 and the first first softening 130' are formed on the table a of the first to protect the two copper waves n Μ . Brother's first layer of protection 5 10 15 盥 _ _ The first protective layer U 0 : = has the function of promoting heat loss in the laser process. The whole factory, brother - protective layer 110 and the second protective layer ". Preferably, it is a & genus layer, the thickness of which is between 徊^ imitation wood and 35 Yuan, and is composed of metal such as bronze or ming. In addition, Α^ ^ 笙ΛΠ ^ „ In addition, in order to process the brothers a tear layer 100 and the second copper box layer 120 and the second copper box layer 12 in a succession process, the first -1 to 110;:: in "_ 〇〇,, ', mouth and g ηο may be formed on the first copper foil layer 100 „ with a separator material (not shown) interposed therebetween, and the second protective layer 130 may be formed on the 坌_如Α On the surface of one of the copper enamel layers 120, a layer of separator material (not shown) is interposed between the two. In this example, in order to achieve - a circuit pattern, preferably 'per-layer (10) and second copper box layer 12. It is formed of a copper foil having a thickness equal to or less than 5 铽 water. = by arranging two sets of two-two brothers - (four) layer 1 (10), insulating layer 140 and - second copper box layer 120, 4n layer 16G' above and below the adhesion layer 150, as shown in Fig. 4C, and Each component is layered as shown in Figure 4D. The first protective layer and the second protective layer 13G' respectively formed on the surface of the first copper case layer 1GG and the surface of the second protective layer 13G must be arranged such that the above two The insulating layer 140 is not touched, and then the components are layered. 20 1307259 Semi-cured prepreg can be used as adhesion layer i5〇. In detail, the preferred "attachment layer 15G" is composed of an adhesive material having high thermal conductivity. On the only side of the adhesive layer 15G, there are a first copper-thick layer (10) and an insulating layer two (four) layer 12 (four). The disadvantage is that the layer may be bent/broken to avoid the above disadvantages by adhering A layer of the first copper foil layer 100, the insulating layer 140, and the second copper falling layer ' are respectively disposed above the layer 15 = = lower to form a layer 160 having a symmetrical structure. Then 'as shown in FIG. 4E', the second protective layer 130 (which is formed on the surface of the second layer 120 and placed on the outermost side of the layer 160) is applied to the pair by a spacer material system. The second protective layer 13 is separated from the second: the backup layer 120, so that the second protective layer 13 can be easily removed by physical means. Thereafter, as shown in FIG. 4F, the portion of each of the second copper foil layers 12 is shifted, that is, the portion of the second copper foil layer 12 corresponding to the portion of the blade that will form a blind hole is etched or the like. The technology is removed, thereby exposing each of the insulating layers 14: a file. For example, the etching process includes using a light-sensitive material-shaped photoresist pattern, using gasified iron, two-copper copper, and 20 liquid and a ruthenium-containing right-handed, J ^ 3 'knocking etching solution. In addition to a copper foil, an etched photoresist is then stripped and 'as shown in FIG. 4G' is formed by a laser process to form a blind via which penetrates the portion of the second copper foil layer 120 that has been removed. Eye hole 170 (where the portion of each insulating layer 14 has been removed) is 12 12307259 2 - carbon dioxide (called laser penetrates each of the insulating layer 14q) and the second copper layer 12 of the region has been Removed and exposed. Knife - This carbon monoxide laser has high energy because it is a specific infrared green, and its oxygen is two: in the::, due to the heat generated by the carbon dioxide laser process ^ via the brother - The protective layer 11 〇 (which is formed in each - the first copper = wide. Therefore, the blind hole can be in the thickness of the third or the thickness of the second - copper

Formed above the berth layer 100. No. 31J 10 15 20 That is, in the prior art manufacturing method, even if the controllable heat is generated: the generated heat passes only through the insulating layer 140 without passing through the first copper foil sound (10), the -(four) layer (10) is still easy. Affected by heat, the first copper of 5 micrometers is defective such as micropores. However, the root: the embodiment of the present invention, because the thickness of the first layer - called the protective layer is formed on each of the first copper box layer 1 ,, the heat generated in the laser process It can be easily lost, so blind holes can be formed! The first copper foil layer 100. Dean. Thereafter, as shown in FIG. 4H, 'by removing the first protective layer 11 from the disk adhesion layer 15 〇 (the first protective layer 110 is formed on one side of the -th copper box layer (10) and the other - (four) The layer 2 (9) is formed on the side of the layer 1 (9) to form a two-copper case substrate 1 800 because the barrier material is interposed between the first protective layer 110 and the first copper foil layer 100, and the Le-protective layer 11〇 The adhesive layer 15 can be easily removed. After the removal, as shown in Fig. 41, each of the -v〇ρ steel plates is formed by forming a plating layer 190 on each of the copper foil substrates 180. 13 1307259 ^ is used to connect the circuit patterns to %, and the circuit patterns are respectively formed on the copper name layer 100 and the second copper box layer 12A. Conductivity can be provided by forming the plating layer 190 on the f-hole. In this example, since the formation of the blind via 17 turns through the insulating layer 4, the plating layer 19 can be formed by copper electroless plating or copper plating. According to this, the conductivity is provided by filling the blind hole 17 0 with a conductive paste (not shown).

10 15 20 In the method for manufacturing a -V Ο P copper box substrate in the embodiment of the invention - the heat dissipation layer for assisting heat dissipation when forming the blind hole 17 铜 on the copper v white layer is not by using independent reinforcement Material or H (4) into, but use insurance. The germanium layers 11G and 13G (formed with the first copper box layer i (10) and the second copper flute layer 12) serve as a heat dissipating layer' thus forming a copper clad substrate without the need for extra-head and extra cost. A blind hole is formed in the copper matte substrate. As described above, the heat dissipation layer for fabricating a VOP copper foil substrate according to the present invention for heat dissipation in a laser process is not independently manufactured, and the first and second copper foil layers are formed together. The protective layer acts as a heat dissipation layer so that the copper foil can be fabricated without additional processes and costs, and blind holes can be formed in the copper drop substrate. In addition, in the method for manufacturing a VOP copper box substrate according to the present invention, defects such as micropores do not occur when an n-hole is formed on the copper falling layer, so that a VOP copper foil substrate for forming a fine circuit pattern can be manufactured. . The above-described embodiments are merely examples for the convenience of the description, and the scope of the claims is intended to be limited to the above-mentioned embodiments. Yi 14 1307259 [Simple description of the diagram] (d) The method used in the prior art to manufacture a v〇p (four) substrate. Figure 2 is a cross-sectional view of a (four) substrate, which

Manufactured by the steel shovel technique, wherein each copper layer has a thickness I; at or less than 5 microns. Figure 3 is a flow chart of the invention for fabricating a VOP copper foil substrate. 4A to 41 are diagrams of a method for manufacturing a v〇P copper foil substrate according to the present invention. FIG. 10 [Description of main components] 1 Insulation layer 2, 2, copper foil layer 3, 3, protective layer 15 5 blind 孑L 6 Electroplated layer 100 First copper foil layer 110 First protective layer 120 Second copper foil layer 20 130 Second protective layer 140 Insulating layer 150 Adhesive layer 160 Laminate 170 Blind hole 15 1307259 180 Copper pig substrate plating layer 190

Claims (1)

1307259 X. Patent Application Range: 1. A manufacturing method for a blind hole (v〇p) on a solder pad in a copper foil substrate, comprising the following steps: (A) providing a first copper foil layer and a second copper foil a layer, a protective layer is formed on one surface of each of the two copper foil layers; 10 20 (B) respectively placing two sets of first copper foil layers, an insulating layer and a second copper foil layer above and below an adhesion layer; (C) removing the protective layer, the protective layer is formed separately Above the second copper foil layer and over a portion of the second copper foil layer; (D) removing portions of the insulating layer by using field shots to form a blind hole-blind hole system penetrating the second portions a portion of the copper box layer that has been previously removed; and (E) forming a copper foil substrate by removing the protective layer, the protective layer is formed on a first copper foil layer One of the 4F1 sensation-± is on the surface and on the surface of one of the remaining first copper berth layers, and above the adhesion layer. Wherein the protective layer 2 is a metal layer as described in the scope of the patent application. / 3. As described in the scope of the patent application, the steel foil layer is prepared as a 坌-handle A ja Wan to 'the thickness of each of the β 畀 mother and the younger one copper berth layer ^ degree is itching or less than 5 Micron. 4. As described in item i of the patent application, it consists of a material with high thermal conductivity.彳法' wherein each of the adhesive layers 17 1307259 is as described in claim 1, the portion of the steel pig layer is in the step (C) of 6. In the claim 1 The ancient soil includes a method of _Bei, and a plating layer is formed on each copper foil substrate in step (E). 10 7. As described in the scope of the patent application, the following includes: Nai Zhongling in step (E) (G) Fill the blind holes with a conductive paste. 18