1305822 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種熱管，尤其係指一種應用於發熱電子元件散熱 之熱管。 【先前技術】 熱管作爲一種傳熱裝置，其係於密封低壓導熱性能良好之金屬殼 2内盛裝適量工作液體，並利用工作液體在殼體内作汽液兩相間轉化 時，吸收或放出大量熱之原理進行工作，當熱管一端與熱源接觸吸收 ^量時，其内工作液體受熱蒸發並吸收大量汽化熱，形成汽體快速擴 散至熱管另一端進行冷卻而放出熱量，冷卻後再次形成液體並沿殼體 内壁回流，如此往復循環即可將熱源産生熱量從熱管一端傳遞至另一 端而散發出去。爲加速冷卻後液體之回流速度，通常於殼體内壁設置 ^細結構。在毛細吸附力作用下，大大加速液體之回流速度。由於熱 官内之工作液體循環速度快，傳熱效率高，目前熱管在散熱領域得到 廣泛應用。 傳統熱管雖然具有較好之導熱性及等溫性，但熱管内工作液體有 2且熱管與發熱電子元件接觸面積較小，僅有蒸發段毛細結構内與管 體，觸之少量工作液體吸收熱量，使熱管之最大傳熱量受到限制，已 不能滿足發熱量不斷提高之發熱電子元件散熱要求。 ^是，業界人士利用改變熱管内部毛細結構來提高熱管之傳熱效 ^。但目前常用熱管加工方法使毛細結構産生缺陷，如粉末燒結方法 $成毛細結構較脆，内插絲網結構與熱管之管壁接觸不夠緊密，溝槽 型毛細結構受工具限制而使加工出之溝槽形狀及密度受到限制。此 外，毛細結構加工難度大，成本高。 。隨著電子元件體積越來越小，分佈越來越密集，熱管佈置在很大 程度^受到電子元件周圍空間限制。熱管對某一電子元件進行散熱同 寺谷易將熱量傳給周圍電子元件，從而增加周圍電子元件之溫度， 影響其正常工作溫度，更嚴重將損壞到電子元件。 因此，隨著發熱電子元件發熱量越來越多，如何有效增加熱管傳 效率、保護傳熱路徑中熱管周圍電子元件成爲業界解決此類問題之 1305822 【發明内容】 本發明之目的係提供一種增加熱管傳熱效率、保護傳熱路徑中熱 管周圍電子元件之熱管。 ‘ 本發明熱管，括-裝有工作流體之管體，該管體包括吸熱段、中 間段與放熱段，管體設有毛細結構，管體外壁上設有絕緣之包覆層。 本發明熱管外壁包覆層由絕緣材料製成，當包覆層厚度滿足一定 條件時，熱官吸熱段之傳熱效率增加，放熱段散熱效果提高，同時中 間段熱量散失減少。採用本發明之熱管可保證熱量由吸熱段有效傳至 放熱段，提高熱管之傳熱效率，快速冷卻電子元件；此外可保蠖傳熱 路徑中熱管周圍之電子元件。 【實施方式】 凊參閱第一圖，本發明熱管包括一裝有工作流體丨2之管體及 -包覆於管體10外壁之包覆層20。該管體10包括吸熱段16、放熱尸 18及連接吸熱段16與玫熱段18之中間段（圖未標號），其内壁設^ 細結構14。該包覆層20是由絕緣材料製成之絕緣層。 管徑爲R!之管體10外壁設置包覆層2〇後之熱管之 熱傳量之計算公式如下所示： = 其 (1) £ ΜΆ-Τ0)_ ln(i?2 -Rx)+k! -其中2爲熱管之傳熱量 τ=3.1415926 ; /=管長；， 乃=管體ίο管壁溫度；1305822 IX. Description of the Invention: [Technical Field] The present invention relates to a heat pipe, and more particularly to a heat pipe for heat dissipation of a heat-generating electronic component. [Prior Art] As a heat transfer device, the heat pipe is filled with a proper amount of working liquid in the metal shell 2 with good low-voltage heat conductivity, and absorbs or releases a large amount of heat when the working liquid is used for steam-liquid two-phase conversion in the casing. The principle works. When one end of the heat pipe is in contact with the heat source to absorb the amount, the working liquid in the heat is evaporated by heat and absorbs a large amount of heat of vaporization, and the vapor body is rapidly diffused to the other end of the heat pipe for cooling to release heat, and after cooling, the liquid is formed again. The inner wall of the casing is recirculated, and the heat generated by the heat source can be transferred from one end of the heat pipe to the other end to be dissipated. In order to accelerate the reflux speed of the liquid after cooling, a fine structure is usually provided on the inner wall of the casing. Under the action of capillary adsorption, the reflux speed of the liquid is greatly accelerated. Due to the fast circulation speed of the working liquid in the hot official and the high heat transfer efficiency, the heat pipe is widely used in the field of heat dissipation. Although the traditional heat pipe has better thermal conductivity and isothermality, the working liquid in the heat pipe has 2 and the contact area between the heat pipe and the heat-generating electronic component is small, and only the capillary structure inside the evaporation section and the pipe body touches a small amount of working liquid to absorb heat. In order to limit the maximum heat transfer of the heat pipe, it is unable to meet the heat dissipation requirements of the heat-generating electronic components with increasing heat generation. ^ Yes, people in the industry use the internal capillary structure of the heat pipe to improve the heat transfer efficiency of the heat pipe. However, the current hot tube processing method causes defects in the capillary structure. For example, the powder sintering method is brittle, the capillary structure is not tightly contacted with the tube wall of the heat pipe, and the groove type capillary structure is restricted by the tool to be processed. The shape and density of the grooves are limited. In addition, the capillary structure is difficult to process and costly. . As electronic components become smaller and smaller, the distribution becomes more and more dense, and the heat pipes are arranged to a large extent and are limited by the space around the electronic components. The heat pipe dissipates heat to an electronic component. The valley heat transfer heat to the surrounding electronic components, thereby increasing the temperature of the surrounding electronic components, affecting their normal operating temperature, and more serious damage to the electronic components. Therefore, as more and more heat is generated in the heat-generating electronic component, how to effectively increase the heat pipe transfer efficiency and protect the electronic components around the heat pipe in the heat transfer path becomes the industry to solve such problems. 1305822 [Invention] The object of the present invention is to provide an increase The heat pipe heat transfer efficiency and the heat pipe protecting the electronic components around the heat pipe in the heat transfer path. The heat pipe of the present invention comprises: a pipe body containing a working fluid, the pipe body comprising an endothermic section, an intermediate section and a heat releasing section, the pipe body is provided with a capillary structure, and an outer cladding wall is provided with an insulating coating layer. The outer wall coating layer of the heat pipe of the invention is made of an insulating material. When the thickness of the coating layer satisfies certain conditions, the heat transfer efficiency of the heat-sinking section is increased, the heat-dissipating effect of the heat-dissipating section is improved, and the heat loss in the middle section is reduced. The heat pipe of the invention can ensure the heat is effectively transferred from the heat absorption section to the heat release section, the heat transfer efficiency of the heat pipe is improved, the electronic component is quickly cooled, and the electronic components around the heat pipe in the heat transfer path can be protected. [Embodiment] Referring to the first figure, the heat pipe of the present invention comprises a pipe body containing a working fluid crucible 2 and a cladding layer 20 coated on the outer wall of the pipe body 10. The tube body 10 includes a heat absorbing section 16, a heat releasing body 18, and an intermediate section (not shown) connecting the heat absorbing section 16 and the heat absorbing section 18, and the inner wall is provided with a fine structure 14. The cladding layer 20 is an insulating layer made of an insulating material. The heat transfer amount of the heat pipe after the outer wall of the pipe body 10 is set to R! is calculated as follows: = (1) £ ΜΆ-Τ0)_ ln(i?2 -Rx)+ k! - where 2 is the heat transfer amount of the heat pipe τ = 3.1415926; / = pipe length;, is = pipe body ί ub wall temperature;
To =接觸管體10内流體之周圍溫度；To = contact temperature of the fluid in the body 10;
Ri =管體10之管徑； R2=管體10外壁包覆一絕緣層之後之熱管管徑； k =包覆材料之熱傳導係數； 二， h〇=流體熱傳導係數； 又因，當d0/dR2=O時’ ρ有最大值 （2) 因此，由（1)、（2)式可得如下結論： R^Who,即熱管最大之傳熱量出現在心^心處· 管有最大傳熱量時熱管之管徑。 "T &馬熟 1305822 爲減小總管徑，k宜小而h〇宜大，故包覆材料應爲絕緣材料。 本發明即糊此現象朝于鮮上，在曝露於環境巾之熱管部分 包覆低K值之絕緣材料： 曰（1)、當R2 '1、於=2e日村增加鮮吸熱段线熱量、放熱段之放熱 1 ’並以|於112。爲最佳。此日村增加熱管整體對外之傳熱量； ⑺s R2大於R2c時可減小熱量向外散發，以假蔓傳熱路徑中執管 之電子元件。 ’ ’ 當電子元件發熱i:較大’需要增加熱管之傳熱效率時，管體10外 ϋ置二包覆層包覆後熱管之管徑R2應取小於1^之情況，且以 官徑R2等於Rk爲最佳情況。此時將管體1〇裸露於環境之部分設置該 ^覆層20 ’可分簡強吸熱段、放熱段傳熱之能力，提管整體向 外之散熱效果。 f電子f*件分佈較密集時，熱管佈置受到周圍電子元件空間限 ^爲使熱t*在對其巾-電子元件散熱之同時不會損壞到傳熱路徑中 電子元件’在管體1G外壁上設置—包覆層20，包覆後之熱 二取大於R2e。此時將管體财間段設置該包懸2〇，減少 …官=間段向外散熱’保護傳熱路徑巾熱管關之電子元件，時由 於熱官向外散熱量減少’吸熱段吸收之熱量最大限度地傳送至放熱段。 心既要對發熱量大電子元件進行散熱，又要保護傳熱 顧電子元件時，可結合採壯述兩種方案。具體做法爲： 'B ^吸熱段與放熱段裸露於環境之部分設置該包覆層20 ,並使設 歧^^20後熱官之官徑R2小於R2c，增加熱管吸熱及放熱能力；同 =在官肢10中間段設置該包覆層2〇，並使設置包覆層2〇後熱管之管 俭R_2,於’達到保護熱管傳熱路徑中周圍電子元件之目的。 、’’示上所述本發明付合發明專利要件，差依法提出專利申請。惟， =上所述者僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士，在 ^依本發月精神所作之等效修飾或變化，皆應涵蓋於以下之中請專矛， fe圍内。 ’ 【圖式簡單說明】 第一圖係本發明熱管沿軸線之剖面示意圖。 1305822 【主要元件符號說明】 管體 10 包覆層 20 吸熱段 16 放熱段 18 毛細結構 14 工作流體 12Ri = pipe diameter of pipe body 10; R2 = heat pipe diameter after outer wall of pipe body 10 is covered with an insulation layer; k = heat transfer coefficient of cladding material; second, h〇 = fluid heat transfer coefficient; and because, when d0/ When dR2=O, ρ has the maximum value (2) Therefore, the following conclusions can be obtained from (1) and (2): R^Who, that is, the maximum heat transfer amount of the heat pipe appears at the center of the heart. The diameter of the heat pipe. "T & Ma cooked 1305822 In order to reduce the total pipe diameter, k should be small and h should be large, so the covering material should be insulating material. The present invention is to paste the phenomenon toward the fresh, and the low heat value of the insulating material is coated on the heat pipe exposed to the environmental towel: 曰(1), when the R2 '1, the =2e day village increases the heat of the fresh heat absorption line, The exotherm of the exothermic section is 1 'and is taken at |112. For the best. This day, the village increases the heat transfer capacity of the heat pipe as a whole; (7) When R2 is larger than R2c, it can reduce the heat emission to the outside, and the electronic components that are managed in the heat transfer path of the false vine. ' 'When the electronic component generates heat i: large' needs to increase the heat transfer efficiency of the heat pipe, the pipe diameter R2 of the heat pipe after the outer cover of the pipe body 10 is covered by the second cladding layer should be less than 1^, and the official diameter R2 is equal to Rk as the best case. At this time, the tube body 1 is exposed to the environment, and the cladding layer 20' can be divided into a heat-absorbing section and a heat-dissipating heat-dissipating heat-dissipating heat-dissipating effect. When the f-electronic f* parts are densely distributed, the heat pipe arrangement is limited by the space of the surrounding electronic components so that the heat t* does not damage the heat-dissipating path to the electron-elements in the heat-dissipating path of the electronic components' on the outer wall of the pipe body 1G. The upper layer is provided with a coating layer 20, and the heat after coating is taken to be larger than R2e. At this time, the pipe section of the pipe body is set to hang 2 〇, to reduce the ... official = interval to the external heat dissipation 'protects the heat transfer path towel heat pipe off the electronic components, when the heat is reduced by the heat officer's heat absorption section absorption The heat is transferred to the heat release section as much as possible. The heart needs to dissipate heat from the large electronic components and protect the heat transfer. When the electronic components are used, the two schemes can be combined. The specific method is as follows: 'B ^ The heat absorption section and the heat release section are exposed in the environment part, the cladding layer 20 is set, and the official diameter R2 of the heat officer is less than R2c, and the heat pipe heat absorption and heat release capability are increased; The cladding layer 2 is disposed in the middle section of the official limb 10, and the tube 俭R_2 of the heat pipe is disposed after the cladding layer 2 is disposed to achieve the purpose of protecting the surrounding electronic components in the heat transfer path of the heat pipe. The invention described above is a patent application for the invention of the invention. However, the above description is only a preferred embodiment of the present invention, and those who are familiar with the skill of the present invention should be included in the following equivalent modifications or changes in the spirit of this month. Within the fe. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a schematic cross-sectional view of the heat pipe of the present invention along the axis. 1305822 [Explanation of main component symbols] Body 10 Cladding layer 20 Endothermic section 16 Exothermic section 18 Capillary structure 14 Working fluid 12