TWI302227B - Method of manufacturing transparent pattern layer - Google Patents

Method of manufacturing transparent pattern layer Download PDF

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TWI302227B
TWI302227B TW94112903A TW94112903A TWI302227B TW I302227 B TWI302227 B TW I302227B TW 94112903 A TW94112903 A TW 94112903A TW 94112903 A TW94112903 A TW 94112903A TW I302227 B TWI302227 B TW I302227B
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Taiwan
Prior art keywords
pattern layer
substrate
multilayer film
layer
negative
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TW94112903A
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Chinese (zh)
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TW200638165A (en
Inventor
Shou Ling Sui
Chen Hsien Liao
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Au Optronics Corp
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Description

發明說明: 【發明所屬之技術領域】 本發明係關於一種圖案層(pattern layer)的製作方 法,特別是關於一種對可見光係為可穿透,且對一特定範 圍之波長的光線係為可反射之圖案層的製作方法。 【先前技術】 對可見光為可穿透且對特定範圍之波長的光線為可反 射的圖案層’其係並非一種全新的概念,例如,中華民國 專利申請號93135681之文獻,即曾經利用此種圖案層,以 做為位置識別之甩。而由於其對於可見光係為可穿透,因 此其可應用於電子裝置的顯不器的表面,而不會影塑人眼 視及其中所呈現的影像。 曰 請參照圖一,其係為中華民國專利申請號93135681 之文獻所揭示之手寫輸入裝置。手寫輸入裝置3〇可應用於 一電子裝置40中,電子裝置4〇具有一顯示器42,而手寫 輸入裝置30包括一筆型輸入器32以及一圖案層35。 筆型輸入器32之一端係具有一發射器321及一影像讀 取裝置323。發射器321可發射一特定範圍之波長的光線貝 36,而影像讀取裝置323則可讀取該特定範圍之波長的光 線36所傳來的影像。特定範圍之波長的光線%係指波長 係介於_〜130〇nm的紅外線。影像讀取裝置切則採用 CCD (Charged Coupled Diode,光電耦合二極體)4CM〇s (Complementary Metal_〇xide Semiconductor,性氧化金屬 半導體)。 ”蜀 1302227 圖案層35可使得可見光穿透,然而可反射該特定範圍 之波長的光線36。圖案層35包括複數個互不相同的位置 識別圖案351,分別用以將基板34上的各個不同位置予以 編碼。 當使用者利用筆型輸入器32對基板34進行手寫輸入 時,發射器32所發射之光線36係會經由位置識別圖層% 反射’而影像讀轉置323係可依序讀取個別位置識別圖 案35丨之影像,藉此得知筆型輸入器32之該端在基板34 表面所依序經過的不同位置,而得以識別使用者手寫輸入 之文字或圖形。其中,個別的位置識別圖案351係為一二 維條碼(2-D barcode)。 請參照圖二,其係為習知圖案層製作方法流程圖。如 圖一所7F ’要製作圖案層3S,習知技術的做法大體上是使 用微影製程,在_層35原始材料之賴步驟(401)之 後,接著進行的即為上光阻(4〇2)、曝光(4〇3)、顯影 (4〇4)、侧(405)以及去光阻(條)等微影製程中常見的 程已將該原始材料形成預定之贿層35,大致上共需 要/、道步驟’且難免需要光罩的使用,因此成本所費不皆。 ,除了成本偏1%的缺點之外,習知如圖二所示之圖案層 35製作方法更有另—項缺點-在進行_程序時(405), 由於圖案層35的原使材料係為高折射率的Ti〇2(或 H)與低折射率的Si〇2交互堆疊而成的多層膜,雜 11的^層膜’職触序(4G5)通常制以Na0H 為,,勤i液,而本案之發明人發現,浸泡過此_ 乂'攻之<,完成之圖案層35會容易有自基板 34剝離脫落 6 ’這可能是侧液造成圖案層35與基板34之 夕叮:Ζ "力父弱。如此說來,習知技術係具有圖案層35 之可罪度不足的問題。 如何改善習知技術的缺點,以提供更可靠的透 〜、層’改善其浸泡姓刻液後容易剝離的問題,且更進 -步地’ Ρ♦低製作圖朗時之生產成本,係為本發明之主 要發展方向。 【發明内容】 本發明之主要目的係在於提供一種圖案層的製作方 法。 本發明所提供之製作方法至少依序包括:1)提供一基 板,2)形成一負型圖案層於該基板上,該負型圖案層覆蓋 该基板表面之一第一預定部份,而曝露該基板表面之一第 二預定部份;3)形成—錢齡覆蓋該貞麵簡與該第 二預定部份;以及4)移除該負型圖案層與其正上方之部份 該多層膜。 本發明亦提供了關於:該負型圖案層的形成方法、該 多層膜的形成方法、以及移除該負型圖案層與其正上方之 部份該多層膜之方法的各種實施方式,以及相關可應用的 實施材料。且考慮到本發明所提供之圖案層的後續應用問 題,例如應用於手寫輸入裝置時之相關考量,因此本發明 亦提供了圖案層之表面粗糙化的實施例。以使得本發明更 符合各種後端應用之需求。 【實施方式】 請參照圖三A至圖三C,圖三A至圖三c顯示本發明 透明之圖案層製作方法示意圖。本發明係提供一種圖案層 65的製作方法,圖案層65對可見光係為可穿透,且對— 特定範圍之波長的光線係為可反射。可見光大體上係指波 長為400nm至750nm之光線,而上述該特定範圍之波長 的光線係為波長介於800〜1300nm的紅外線。 由圖三A,一基板51係首先被提供。基板51可採用 破璃或是耐熱塑膠等材質。接著則形成一負型圖案層 (anti-patternlayer) 61於基板51上,負型圖案層61覆蓋基 板51表面之一第一預定部份511,而曝露基板51表面之 一第二預定部份512。 圖三A顯示之實施例之中,負型圖案層61之形成方 法係為-網印步驟。其中負型圖案層61之材f係為一樹醋 漿料60。上述該網印步驟係可依序包括:1}設置一網印 模板(mask) 7G於基板51上,網印模板51係具有與 圖案層61相對應之至少一網孔701。2)對網印模板μ 進行樹S旨漿料6G之塗佈。3)進行—乾燥程序,利用高溫 爾料6G其中之至少—有機溶劑。4)移除網印 可為高黏度之高分子溶 類或酯類。上述該乾燥 ,大體上係為攝氏12〇 其中,樹酯漿料60之實施例係 液,而上述該有機溶劑則可能為醚 程序之高溫在本發明之實施例之中 度至180度。 、由圖二B’在負型圖案層61已形成之後,接續之步驟 係為形成一多層膜63以覆蓋負型圖案層61與第二預定部 份512 °其中,多層膜63係由一低折射率膜層638與一高 折射率膜層639所交互堆疊而成(如圖三〇所示)。以達到 對可見光係為可穿透,且對紅外光係為可反射的效果。 在本發明之各種實施例中,低折射率膜層之實施材料 係可為Si〇2 ;而高折射率膜層之實施材料係可為丁丨〇2或 Mb2〇5。可利用濺鍍(sputtering)或塗佈(⑺組叩)等方式 來形成多層膜63。多層膜63之層數係可介於3〜1〇層;而 多層膜63之厚度大體上係介於200nm〜1500nm。 請參照圖三B與圖三c,當多層膜63已形成之後, 則可移除負型圖案層61,與負型圖案層61正上方之部份 的多層膜63。如此一來,殘餘在基板51上的多層膜63即 為本發明所提供之圖案層65。 此步驟係利用負型圖案層61與基板51之間的結合應 力較弱,而多層膜63與基板51之間的結合應力較強的原 理,可直接由物理的方式將基板51之第一預定部份 上方之負型圖案層61與部份的多層膜63剝離。剝離的方 式例如利用一黏性滾輪,以在滚過多層膜63 (圖三B)上 表面時,將負姻賴61與其正上方之部份多層膜63黏 附,以直接與基板51分離。 由於本發明在形成圖案層65的過程之中,不需使用到 鴒知技術的政影製程’特別是不需使用到以Na〇H為主 體的蝕刻液,因此,完成的圖案層65確實已不具有習知技 術中谷易自基板51剝離脫落的問題。以本發明所提供之製 1302227 作方法所得之圖案層65具有相當高的可靠度。 f作=圖:A至圖四E,圖四A至圖四E顯示本發明 法另-實施例示意圖。圖四八係利用網印步驟以形 圖案層,方法類似於圖三A之實施說明,於此不 再头述。而在圖四D則顯示類似於圖三B所示之 =形成方法,在_ D形成多層膜61之步猶,本曰實施 例係對基板51表面進行—她该序,包括了-喷砂程序 (不於圖四B),以及-清洗程序(示於圖四c)。 如圖四B,喷砂程序係利用一砂材⑽以撞擊基板51 2 ^圖所示,基板51之第二預定部份512係因此而被 …出杉細小的簡’喊為粗糙的表面。之後,則進 行清洗程序,以清洗殘留於基板51上之砂材8〇,如圖四 C所示。如此-來,如圖四£所示,形成於第二預定部份 512表面的圖案層65亦會有粗糙化的效果,因此其在反射 、’工外日守,反射之方向可不侷限於單一方向,而可擴散反 射藉此,當本發明所提供之圖案層65欲應用於例如中華 民國專利f請號93i3568丨之文獻所鮮之手寫輸入裝置 時’更可使得手寫輸人裝置能_利運作。 關於使得圖案層65表面粗糙化,而達到擴散反射效果 的實施方式,另有一實施例,請參照圖三A,其係可在負 型,案層51形成以前,先行對基板51進行粗糙化的程序, 後績關於圖案層65的製作方法則如圖三A至圖三c所示。 矣示合以上所述,本發明係提供了 一種透明之圖案層的 製作方法’此圖案層可應用於例如手寫輸入裝置之中。本 發明所提供的方法中,避免了習知技術之微影製程的使 .1302227 用,因此,係可大幅地降低因為微影製程所需 用,而使得製作成本大幅下降。且,因為不再不 以NaOH為主體的餘刻液,因此本發明改善了習知技術 ^圖案層易自基板剝離脫落關題。整體而言,本發明係 提供了-種_層的製作方法,並具有低成本與高^靠度 的優點。 本發明雖峨佳實例卿如上,並_以限定本 發明精神與發明實體,僅止於上述實施糊。對熟悉此項 技術者,當可㈣了解並侧其它元件財絲產生相同 的功效。如,在不脫離本發明之精神與範圍崎作之修 改’均應包含在下述之_請專利範圍内。 【圖式簡單說明】 藉由X下洋、、、田之^田述結合所附圖示,將可輕易的了解 上述内容及此項發明之諸多優點,其中: 圖一係為中華民國專利申請號9313漏之文獻所揭 示之手寫輸入裝置; 圖二係為習知圖案層製作方法流程圖; 圖二A至圖二(:顯示本發明透明之圖案層製作方法示 意圖;以及 圖四A至圖四e顯示本發明製作方法另一實施例示意 圖。 1302227 【主要元件符號說明】 手寫輸入裝置30 筆型輸入器32 發射器321 影像讀取裝置323 基板34 圖案層35 位置識別圖案351 光線36 電子裝置40 顯示器42 基板51 第一預定部份511 第二預定部份512 樹酯漿料60 負型圖案層61 多層膜63 低折射率膜層638 高折射率膜層639 圖案層65 網印模板70 網孔701 砂材80SUMMARY OF THE INVENTION [Technical Field] The present invention relates to a method of fabricating a pattern layer, and more particularly to a light source that is transparent to visible light and reflective to a specific range of wavelengths The method of making the pattern layer. [Prior Art] A pattern layer that is transparent to visible light and is reflective to light of a specific range of wavelengths is not a completely new concept. For example, the document of the Republic of China Patent Application No. 93135681 once used such a pattern. Layer, as the location identification. Since it is permeable to the visible light system, it can be applied to the surface of the display of the electronic device without affecting the human eye and the image presented therein.曰 Please refer to FIG. 1 , which is a handwriting input device disclosed in the document of the Republic of China Patent Application No. 93135681. The handwriting input device 3A can be applied to an electronic device 40 having a display 42, and the handwriting input device 30 includes a pen-type input device 32 and a pattern layer 35. One end of the pen type input unit 32 has a transmitter 321 and an image reading device 323. The emitter 321 can emit a light beam 36 of a specific range of wavelengths, and the image reading device 323 can read the image transmitted by the light line 36 of the wavelength of the specific range. The % of light of a specific range of wavelengths means infrared rays having a wavelength of from _ to 130 〇 nm. The image reading device is cut by a CCD (Charged Coupled Diode) 4CM〇s (Complementary Metal_〇xide Semiconductor). The 图案1302227 pattern layer 35 may allow visible light to pass through, but may reflect light rays of the particular range of wavelengths. The pattern layer 35 includes a plurality of mutually different position identification patterns 351 for respectively different locations on the substrate 34. When the user uses the pen type input device 32 to perform handwriting input on the substrate 34, the light 36 emitted by the transmitter 32 is reflected by the position recognition layer %, and the image read transposition 323 can be sequentially read individually. The image of the position recognition pattern 35丨 is used to learn the different positions of the end of the pen type input device 32 on the surface of the substrate 34, thereby recognizing the text or graphic input by the user. Among them, the individual position recognition The pattern 351 is a 2-D barcode. Please refer to FIG. 2 , which is a flow chart of a conventional pattern layer manufacturing method. As shown in FIG. 1 , the pattern layer 3S is to be produced, and the conventional technique is generally practiced. The above is the use of the lithography process, after the _ layer 35 raw material depends on the step (401), followed by the upper photoresist (4 〇 2), exposure (4 〇 3), development (4 〇 4), side (405) and go The common process in the lithography process such as resistance (strip) has formed the original material into a predetermined bribe layer 35, which generally requires a / step, and inevitably requires the use of a reticle, so the cost is inconsistent. In addition to the disadvantage of a cost of 1%, it is known that the method of fabricating the pattern layer 35 as shown in FIG. 2 has a further disadvantage - in the process of performing the process (405), since the original layer of the pattern layer 35 is highly refractive The multilayer film of Ti 率2 (or H) and Si低2 with low refractive index are alternately stacked, and the film of the 11-layer film of the impurity 11 (4G5) is usually made of Na0H, and The inventor of the present invention found that the immersed _ 乂 'attacks <, the finished pattern layer 35 will easily peel off from the substrate 34 6 ' This may be the side liquid caused by the pattern layer 35 and the substrate 34 叮: Ζ &quot As a matter of fact, the conventional technique has the problem of insufficient sinfulness of the pattern layer 35. How to improve the shortcomings of the conventional technique to provide a more reliable transparent layer, after the layer is improved The problem of easy peeling, and the further step-by-step Ρ ♦ low production cost of the production time is the invention The main development direction of the present invention is to provide a method for fabricating a pattern layer. The manufacturing method provided by the present invention includes, at least in order: 1) providing a substrate, 2) forming a negative pattern layer on On the substrate, the negative pattern layer covers a first predetermined portion of the surface of the substrate to expose a second predetermined portion of the surface of the substrate; 3) forming a vacuum covering the surface and the second predetermined a portion; and 4) removing the negative pattern layer from the portion directly above the multilayer film. The present invention also provides a method for forming the negative pattern layer, a method of forming the multilayer film, and removing the Various embodiments of the method of the negative pattern layer and the portion of the multilayer film directly above it, and related applicable implementation materials. Further, in view of the subsequent application problems of the pattern layer provided by the present invention, for example, when applied to a handwriting input device, the present invention also provides an embodiment of surface roughening of the pattern layer. In order to make the invention more suitable for the needs of various back-end applications. [Embodiment] Referring to Figures 3A to 3C, Figures 3A to 3c are schematic views showing a method of fabricating a transparent pattern layer of the present invention. The present invention provides a method of fabricating a pattern layer 65 that is transparent to visible light and that is reflective to light of a particular range of wavelengths. The visible light generally refers to light having a wavelength of from 400 nm to 750 nm, and the light of the wavelength of the specific range is infrared light having a wavelength of from 800 to 1300 nm. From Fig. 3A, a substrate 51 is first provided. The substrate 51 may be made of a material such as glass or heat-resistant plastic. Next, an anti-pattern layer 61 is formed on the substrate 51. The negative pattern layer 61 covers one of the first predetermined portions 511 of the surface of the substrate 51, and exposes one of the surfaces of the substrate 51 to the second predetermined portion 512. . In the embodiment shown in Fig. 3A, the negative pattern layer 61 is formed by a screen printing step. The material f of the negative pattern layer 61 is a tree vinegar slurry 60. The screen printing step may include: 1} setting a screen printing mask 7G on the substrate 51, and the screen printing template 51 has at least one mesh 701 corresponding to the pattern layer 61. 2) The template μ is applied to the coating of the slurry 6G. 3) Perform a drying process using at least 6 G of high temperature solvent. 4) Remove screen printing It can be a high viscosity polymer soluble or ester. The above drying is generally in the range of 12 Torr, wherein the embodiment of the resin slurry 60 is liquid, and the organic solvent may be at a high temperature in the embodiment of the present invention to 180 degrees. After the negative pattern layer 61 has been formed by FIG. 2B', the subsequent step is to form a multilayer film 63 to cover the negative pattern layer 61 and the second predetermined portion 512 °, wherein the multilayer film 63 is composed of one The low refractive index film layer 638 and the high refractive index film layer 639 are alternately stacked (as shown in FIG. 3A). It is transparent to the visible light system and reflective to the infrared light system. In various embodiments of the present invention, the material of the low refractive index film layer may be Si〇2; and the material of the high refractive index film layer may be Db 2 or Mb2〇5. The multilayer film 63 can be formed by sputtering or coating ((7) group). The number of layers of the multilayer film 63 may be between 3 and 1 Å; and the thickness of the multilayer film 63 is substantially between 200 nm and 1500 nm. Referring to FIG. 3B and FIG. 3c, after the multilayer film 63 has been formed, the negative pattern layer 61 and the portion of the multilayer film 63 directly above the negative pattern layer 61 may be removed. As such, the multilayer film 63 remaining on the substrate 51 is the pattern layer 65 provided by the present invention. This step utilizes the principle that the bonding stress between the negative pattern layer 61 and the substrate 51 is weak, and the bonding stress between the multilayer film 63 and the substrate 51 is strong, and the first predetermined order of the substrate 51 can be directly and physically determined. The upper negative pattern layer 61 is peeled off from the partial multilayer film 63. The peeling method uses, for example, a viscous roller to adhere the negative affixing 61 to a portion of the multilayer film 63 directly above it when it is rolled over the upper surface of the multilayer film 63 (Fig. 3B) to be directly separated from the substrate 51. Since the present invention does not require the use of a shadowing process of the known technology in the process of forming the pattern layer 65, in particular, it is not necessary to use an etching liquid mainly composed of Na〇H, so that the completed pattern layer 65 is indeed There is no problem in the prior art that the valley is easily peeled off from the substrate 51. The pattern layer 65 obtained by the method of the method of 1302227 provided by the present invention has a relatively high reliability. f = Fig. A to Fig. 4E, and Figs. 4A to 4E show schematic views of another embodiment of the present invention. Figure VIII uses a screen printing step to form a pattern layer. The method is similar to the embodiment of Figure 3A, and will not be described here. In Fig. 4D, a method similar to that shown in Fig. 3B is shown, and in the step of forming the multilayer film 61, the present embodiment is performed on the surface of the substrate 51. Program (not shown in Figure 4B), and - cleaning program (shown in Figure 4c). As shown in Fig. 4B, the blasting process utilizes a sand material (10) to strike the substrate 51 2 ^, and the second predetermined portion 512 of the substrate 51 is thus called a rough surface by the thin stalk of the cedar. Thereafter, a cleaning process is performed to clean the sand material 8 残留 remaining on the substrate 51 as shown in Fig. 4C. Thus, as shown in FIG. 4, the pattern layer 65 formed on the surface of the second predetermined portion 512 also has a roughening effect, so that it is not limited to a single direction in reflection, 'outside the work, and the direction of reflection. Direction, but diffuse reflection, thereby, when the pattern layer 65 provided by the present invention is to be applied to, for example, the handwriting input device of the document of the Republic of China Patent No. 93i3568丨, the handwriting input device can be made more profitable. Operation. Regarding an embodiment in which the surface of the pattern layer 65 is roughened to achieve a diffuse reflection effect, another embodiment, please refer to FIG. 3A, which can roughen the substrate 51 before the negative layer and the formation of the layer 51. The procedure, the subsequent performance, the method of producing the pattern layer 65 is as shown in FIG. 3A to FIG. 3c. In view of the above, the present invention provides a method of fabricating a transparent pattern layer. This pattern layer can be applied, for example, to a handwriting input device. In the method provided by the present invention, the use of the lithography process of the prior art is avoided, so that the manufacturing cost can be greatly reduced because the lithography process is required to be greatly reduced. Moreover, since the residual liquid which is not mainly composed of NaOH is no longer used, the present invention improves the conventional technique that the pattern layer is easily peeled off from the substrate. In general, the present invention provides a method of fabricating a layer, which has the advantages of low cost and high reliability. Although the present invention is as described above, and in order to limit the spirit of the present invention and the inventive entity, it is only the above-described implementation paste. For those who are familiar with this technology, it is possible to (4) understand and side-by-side other components to produce the same effect. For example, modifications may be made without departing from the spirit and scope of the invention. [Simple description of the drawings] The above contents and the advantages of the invention can be easily understood by the combination of X Xiyang, and Tian Tian ^ Tian Shu, and the advantages of the invention are as follows: Figure 1 is a patent application for the Republic of China. Figure 7 is a flow chart of a conventional pattern layer manufacturing method; Figure 2A to Figure 2 (: shows a schematic diagram of a transparent pattern layer manufacturing method of the present invention; and Figure 4A to Figure 4 e shows a schematic diagram of another embodiment of the manufacturing method of the present invention. 1302227 [Description of main component symbols] Handwriting input device 30 Pen type input device 32 Transmitter 321 Image reading device 323 Substrate 34 Pattern layer 35 Position recognition pattern 351 Light 36 Electronic device 40 Display 42 Substrate 51 First predetermined portion 511 Second predetermined portion 512 Tree ester paste 60 Negative pattern layer 61 Multilayer film 63 Low refractive index film layer 638 High refractive index film layer 639 Pattern layer 65 Screen printing template 70 Hole 701 sand 80

Claims (1)

1302227 — I?年?月(¾修正替換頁 十、申請專利 p||^ : _"丨 _ m,丨一 • 〗· 一種圖案層(patternlayer)的製作方法,該圖案層 : 對可見光係為可穿透,且對一特定範圍之紅外線波長的光 線係為可反射,該方法至少依序包括下列步驟·· 提供一基板; 形成一負型圖案層(anti-pattemlayer)於該基板上,該 負型圖案層覆蓋該基板表面之一第一預定部份,而曝露該 基板表面之一第二預定部份; 瞻戦一多層膜以覆蓋該負麵案層與該第二預定部 份;以及 ' 移除該負型圖案層與其正上方之部份該多層膜; 其中該多層麟由不㈤之折射率賴交轉疊而成。 2·如申請專利範圍第丨項所述之製作方法,其中該多 I麟由-低折射麵層與—高折射物層所交互堆疊而 _ 成。 3. 如申請專利範圍第2項所述之製作方法,其中該高 折射率膜層係為Ti02或Mb205。 4. 如申請專利範圍第2項所述之製作方法,其中該低 折射率膜層係為Si02。 5.如申請專利範圍第1項親之製作方法,其中該多 13 層膜之層數係介於3〜10層。 6·如申請專利範圍第厂項所述之製作方法,其中該多 層膜之厚度係介於200nm〜1500nm。 7·如申請專利範圍第1項所述之製作方法,其中該多 層膜之形成方法係為濺鍍(Sp此ering)或塗佈。 8·如申請專利範圍第1項所述之製作方法,其中在形 成該多層膜之步驟前,更包括〆 v 對該基板表面進行一粗縫化程序。 9. 如申請專利範圍第8項所述之製作方法,其中該杈 一噴砂程序’其係利用一砂材以撞擊談基板表面:以 及 一清洗程序’以清洗殘留於該基板上之該砂材。 10. 如申請專利範圍第」項所述之製作方法,1中該 負型圖案層之形成方法係為-網印步驟。 ” 11·如申請專利範圍第丨項所述之製作方法,其中該 1302227 負型圖案層之材質係為一樹酯漿料。 12·如申請專利範圍第1〇項所述之製作方法,直中兮 網印步驟係包括^ ^ ^ ^ ^ ^ " 對該網印模板進行一樹醋漿料之塗佈 設置一網印模板(mask)於該基板上,該網印模板係 具有與該負型圖案層相對應之至少一網孔;以及、 13·如申請專利範圍第12項所述之製作方法,里 網印步驟更包括 ι ^ ^ ^ ^ ^ ^ 中該 進行一乾燥程序,利用咼溫以去除該樹酯漿料复中夕 至少一有機溶劑^ " ^ ^ ^ " 14·如申請專利範圍第13項所述之製作方半甘 移除該網印模板。 15·如申請專利範圍第1項所述之製作方法,发 移除該負型圖案層與其正上方之部份該多層膜之中該 移除方法係為將該負型圖案層自該基板剝離。驟該 16.如申請專利範圍第15項所述之製作方法, 將該負型圖案層自該基板剝離之方法,係為利▲二 15 1302227 輪,以在滚過該多層膜上表面時,將該負型圖案層與其正 上方之部份該多層膜黏附,以與該基板分離。 17·如申請專利範圍第1項所述之製作方法,其中該 特定範圍之紅外線波長的光線係為波長介於 800〜1300nm 〇1302227 — I? Year? Month (3⁄4 Correction Replacement Page 10, Patent Application p||^ : _"丨_ m,丨一• 〗· A method of making a pattern layer, which is transparent to the visible light system, and a specific range of infrared wavelengths of light is reflective, the method comprising, at least in sequence, the following steps: providing a substrate; forming a negative-type pattern layer on the substrate, the negative pattern layer covering the a first predetermined portion of the surface of the substrate, exposing a second predetermined portion of the surface of the substrate; viewing a multilayer film to cover the negative layer and the second predetermined portion; and 'removing the negative portion a pattern layer and a portion of the multilayer film directly above; wherein the multilayer lining is formed by stacking the refractive index of the (5). 2. The manufacturing method as described in the scope of the patent application, wherein the multi-lin The method of manufacturing the high-refractive-index layer is Ti02 or Mb205, as described in the second aspect of the invention. Production as described in item 2 of the scope of application for patents The method wherein the low refractive index film layer is SiO 2 . 5. The method according to claim 1 , wherein the number of layers of the 13 layers of the film is between 3 and 10 layers. The method of the present invention, wherein the thickness of the multilayer film is between 200 nm and 1500 nm. 7. The method according to claim 1, wherein the method for forming the multilayer film is sputtering (Sp The manufacturing method according to claim 1, wherein before the step of forming the multilayer film, 〆v is further subjected to a roughing process on the surface of the substrate. The manufacturing method of claim 8, wherein the first blasting process 'uses a sand material to strike the surface of the substrate: and a cleaning procedure' to clean the sand material remaining on the substrate. The method for forming the negative pattern layer in the method of claim 1, wherein the method for forming the negative pattern layer is a screen printing step, wherein the method of manufacturing the method of claim 301, wherein the Material layer of the pattern layer A resin ester slurry. 12. The method as claimed in claim 1, wherein the straight-line printing step comprises ^ ^ ^ ^ ^ ^ " coating the screen printing template with a tree vinegar slurry Forming a screen printing mask on the substrate, the screen printing template having at least one mesh corresponding to the negative pattern layer; and 13, the manufacturing method according to claim 12, The screen printing step further includes a drying process in which ι ^ ^ ^ ^ ^ ^ is used to remove the resin ester slurry to remove at least one organic solvent ^ " ^ ^ ^ " 14 The manufacturer described in item 13 of the scope removes the screen printing template. 15 . The method of claim 1 , wherein removing the negative pattern layer and a portion directly above the multilayer film is the method of removing the negative pattern layer from the substrate . The method of claim 15, wherein the method of peeling the negative pattern layer from the substrate is a wheel of 15 15 1302227 to roll over the upper surface of the multilayer film. The negative pattern layer is adhered to a portion of the multilayer film directly above it to be separated from the substrate. 17. The method of claim 1, wherein the specific range of infrared wavelengths is between 800 and 1300 nm.
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