TWI300524B - System-on-a-chip and test/debug method thereof - Google Patents

System-on-a-chip and test/debug method thereof Download PDF

Info

Publication number
TWI300524B
TWI300524B TW95112493A TW95112493A TWI300524B TW I300524 B TWI300524 B TW I300524B TW 95112493 A TW95112493 A TW 95112493A TW 95112493 A TW95112493 A TW 95112493A TW I300524 B TWI300524 B TW I300524B
Authority
TW
Taiwan
Prior art keywords
test
memory
data
access
signal
Prior art date
Application number
TW95112493A
Other languages
Chinese (zh)
Other versions
TW200636447A (en
Inventor
Steve Gianelle
Original Assignee
Via Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Via Tech Inc filed Critical Via Tech Inc
Publication of TW200636447A publication Critical patent/TW200636447A/en
Application granted granted Critical
Publication of TWI300524B publication Critical patent/TWI300524B/en

Links

Landscapes

  • Test And Diagnosis Of Digital Computers (AREA)
  • Tests Of Electronic Circuits (AREA)

Description

1300524 九、發明說明: 【發明所屬之技術領域】 本發明係為一種系統單晶片與應用於其中之測試以及 /或除錯方法,尤指具有一内建測試/除錯電路之系統單晶片 和一種可執行記憶體直接存取測試以及/或除錯之系統單 晶片測試方法。 【先前技術】 系統單晶片(System_on-a_Cliip,簡稱s〇C)或系統整合 (System-Level Integration,簡稱SLI)晶片,就目前的技術 而吾已成為了 一種重要的產品設計趨勢。這類的晶片盆主 要的設計概念是將晶片中的電路加以微型化和模組化,藉 由整合所有的功此於早顆積體電路(integrated circuit,簡稱 1C)之中的方式’使得所生產的產品其外型能更輕巧與便於 攜V ’而能付合現今電子產品的個人化需求。然而,由於 電路系統的複雜性和需要較長實現時間的緣故,可能會影 響其糸統早晶片或糸統整合晶片的進一步發展;舉例來 說’一般ic设计公司自產品設計、驗證(ver迅cati〇n)至 產出光罩繪圖檔(例如GDSII),再到晶圓廠投產至少需經 過8至12個月,換句話說,一個系統單晶片或系統整合晶 片從初期的開發到之後可能的獲利,期間可能會超過一年 6 1300524 m °而就f路纽來說,要整合許多各種不同的電路至 1 員積體電路中,技術上本身便會遇到許多問題,例如·· 在速數位电路和類比電路之間便可能會發生雜訊干擾。 另夕各石夕冬財(IntellectuaI卩卿时ies,簡稱奶)間供電電 魔的不同將產生複雜的電源管理線路以及功率浪費等問 ?€’、、、:而若疋還要更進一步地考慮嵌入式記憶體之整合與 驗證的話,對於IC薇商要進行產品的設計、生產製造到完 成,可能又需要另外耗上大概半年左右的時間,因此,要 加快產品㈣試、除錯與驗證的速度以脑產品完成的時 間,便成為了各家1C廠商的改進目標之一。 請參閱第一圖,係為一習用之系統單晶片(SoC)的功能 方塊示意圖。由圖所示,一中央處理單元1〇、一嵌入式記 憶體11與一記憶體控制器13係整合於一系統單晶片i之 中’而該中央處理單元10和該記憶體控制器13係藉由一 内部匯流排12而能和該嵌入式記憶體n進行信號連接, 因此,该中央處理單元1〇便是透過該記憶體控制器13的 控制來對該嵌入式記憶體U進行資料讀取與寫入之内部 傳輸。在此5又计結構之下,該系統單晶片1中之喪入式記 憶體11並不具有額外的外部接腳,可使該系統單晶片i 之外的電路可對其中的該嵌入式記憶體U進行資料的存 取,因此要從外部直接對該嵌入式記憶體π進行資料讀取 與寫入疋有困難的,如此對產品設計製造過程中所進行之 除錯(debug)程序及軟體開發皆有相當程度的不便。 另外’一般的測試機台無法提供現階段系統單晶片所 13005241300524 IX. Description of the Invention: [Technical Field] The present invention is a system single chip and a test and/or debug method applied thereto, especially a system single chip with a built-in test/debug circuit and A system single wafer test method that performs memory direct access testing and/or debugging. [Prior Art] System single-chip (System_on-a_Cliip, referred to as s〇C) or System-Level Integration (SLI) chips have become an important product design trend with current technology. The main design concept of this type of wafer basin is to miniaturize and modularize the circuits in the wafer, by integrating all the methods in the early integrated circuit (1C). The products produced are lighter and more portable, and can meet the individual needs of today's electronic products. However, due to the complexity of the circuit system and the need for a long implementation time, it may affect the further development of its integrated wafer or SiS integrated wafer; for example, 'general design company from product design, verification (ver It takes at least 8 to 12 months for a cati〇n) to produce a photomask plot (such as GDSII) and then to a fab. In other words, a system single-chip or system-integrated wafer may be developed from the initial stage to the possible The profit may be more than 6 1300,524 m ° a year. In the case of F Lun, there are many problems in integrating many different circuits into one-person integrated circuits. For example, ··· Noise interference may occur between the speed digit circuit and the analog circuit. On the other eve, each of the different electric powers of the Insects (Intellectua I 卩 时 ies, referred to as milk) will produce complex power management lines and power waste, etc.?,, and: If you want to go further Considering the integration and verification of embedded memory, it may take about half a year for IC Wei to design, manufacture and complete the product. Therefore, it is necessary to speed up the product (4) trial, debug and verification. The speed of brain products has become one of the improvement goals of various 1C manufacturers. Please refer to the first figure, which is a functional block diagram of a conventional system single chip (SoC). As shown, a central processing unit 1 , an embedded memory 11 and a memory controller 13 are integrated into a system single chip i ' and the central processing unit 10 and the memory controller 13 are The internal memory unit 12 can be connected to the embedded memory n by an internal bus bar 12. Therefore, the central processing unit 1 performs data reading on the embedded memory U through the control of the memory controller 13. Internal transfer of fetch and write. Under the 5 recalculation structure, the immersive memory 11 in the single chip 1 of the system does not have an additional external pin, so that the circuit other than the single chip i of the system can be embedded in the embedded memory. The body U accesses the data, so it is difficult to directly read and write the embedded memory π from the outside, so that the debug program and software for the product design and manufacturing process are performed. Development has a considerable degree of inconvenience. In addition, the general test machine can not provide the current system single chip 1300524

j的快速測試信號與大量測試圖樣(Test p敝㈣的儲存 間信號,因此域應付此項需求,便需要使用高速、 ^里但部是高價位的賴儀器來進行職,然而如果使 用的是較低價位的測試儀器作測試時,在即時性測試 (At-SpeedTest)上的結果則可能不會被滿足。此外,由於私 ^式記憶體的緊密結構特徵,使得系統單晶片容易受制於 、。種不利的缺關素而影響其表現,再者@記憶體陣列的 運作模式實質上來說係為類比的,因此其容錯能力較為不 所以,上述的這些設計特點都使得記紐陣列更容易 文到錯综複雜的製造缺㈣有所影響。而緊密的記憶體陣 歹J封衣k成相鄰單元的狀態在存在缺陷的情況下可能會產 生誤作業’而且某些缺陷可能只在特定的數據模式下會 暴露。此外,這些缺陷類型很多是具有時間相關性的,因 此只有在正常工作頻率下才會被發現。 為了解決此一問題,一内建自我測試(built_in_sdf_ test,簡稱BIST)之技術便被加以採用,它以合理的電路面 積來對嵌入式記憶體進行徹底的測試,其測試包括將測試 圖樣(test patterns)寫入記憶體之中並且接著將其讀回,以檢 視其所產生的測試圖樣是否符合預期,如此我們便可以大 量地節省其測試時間,而且使得一般的測試儀器也可以用 來作即時性測試(At-Speed Test)。 請參閱第二圖,係為具有自我測試功能之另一習用系 統單晶片的功能方塊示意圖。由此圖所示之設計結構,係 利用一内建自我測試控制器出18!^〇血〇11沉)21、一圖樣產 8 1300524j's fast test signal and a large number of test patterns (Test p敝 (4) storage signal, so the domain to cope with this demand, you need to use high-speed, ^ Li is a high-priced Lai instrument to work, but if you are using When the test instrument of lower price is tested, the result on the At-Speed Test may not be satisfied. In addition, due to the tight structural characteristics of the memory, the system single chip is easily subject to The unfavorable lack of factors affects its performance. Furthermore, the operation mode of the @Memory array is essentially analogous, so its fault tolerance is relatively small. These design features make the array easier. It is influential to the intricate manufacturing defects (4). The tight memory matrix 封J is the state of the adjacent unit, which may cause misoperation in the presence of defects' and some defects may only be specific. Data patterns are exposed. In addition, many of these defect types are time-correlated and therefore only found at normal operating frequencies. The problem of a built-in self-test (built_in_sdf_test, BIST for short) technique is used to thoroughly test embedded memory with a reasonable circuit area. The test involves writing test patterns. In the memory and then read it back to see if the test pattern produced by it is in line with expectations, so we can save a lot of test time, and make the general test instrument can also be used for immediacy test (At -Speed Test) Please refer to the second figure, which is a functional block diagram of another conventional system with self-test function. The design structure shown in this figure is based on a built-in self-test controller! ^〇血〇11 Shen)21, a pattern of production 8 1300524

生器(Pattern Generator)22與一反應分析器(以叩如叱 Analyzer)23來對一待測試電路20進行測試,藉由外部的 一 Bist一on信號的輸入,該内建自我測試控制器21便可在 控制該圖樣產生器22產生出測試圖樣與基本的控制信號 後,進入一 BIST模式;利用一多工器24來對該圖樣2 杰22所產生之測試圖樣進行選擇,經過一特定時間,輪出 信號便會被傳送至該反應分析器23中進行分析,最後:节 内建自我測試控制器21會發出一 Bist—d〇ne信號來= 佈測試程序已經完成。而根據—Pass/Fail輪出信^ 出,我們便可以判斷出對該待職電路2G的 為b : 正常或是無法被加以贼。 4€作 /然而,上述之内建自我測試卿τ)技術仍然限 統單晶片中的嵌入式記憶體透過外部電路 ” 以達到除錯和驗證之目的;為了解決此—問題取 些日日片上便提供了有額外的接腳, 某 式進行運作,因此,透過這些額外二:=有, 貪料/位址接腳便可以對該嵌入式記憶 之 製 是,這些額外接腳的設置不可避免地將會約^存二’但 體積以及製作成本,·而如何能在不f要增装 Ϊ額外接腳的情形下,使得外部電路能對系St 之目 令便成為本案發展的主要目的。 【發明内容】 9 1300524 -外呷ί二::吉系統單晶片其中之嵌入式記憶體可以和 不需增設額外麵’而能達刺試與除錯之目的而 由曰^ 7提供了系統單晶片的測試與除錯方法,可藉 ^片上既叙接腳錢行_試與除錯之獅,而不需 要特別地設計出執行運作之接腳。 只,勺^^帛内建測試/除錯電路之—系統單晶 匕3有·甘欠入式記憶體;-JTAG控制器,係包含 阜以與—外部裝置產生信號連接,用以接收來 ^ =卩衣置在—測5式/除錯模式下所發出的—測試/除錯 二’亚因應該測試/除錯信號而發出一控制信號;以及一 暫存器裝置,係和該嵌人式記鍾作錢連接,用以儲存 :亥测试/除錯信號上所載之存取該嵌人式記憶體所需之資 ,’亚因應該控繼號使該資訊相關之資料透過該存取測 試埠而於該嵌人式記憶體與該外部裝置之間轉移。 、根據上述構想’其巾該暫存器裝置包含有—可和該欲 ^式記憶體信號連接的記憶體存取資料暫存器,以及可和 η亥JTAG控制益信號連接的jTAG可存取移位暫存器,且 該記憶體存取資料暫存器和該JTAG可存取移位暫;器之 間互相連接。 根據上述構想,其中該系統單晶片更包含有··一内建 自我測試電路,用以執行一内建自我測試模式,該内建自 我測試電路更包含有一内建自我測試控制器;一第一多工 1300524 器,係和該記憶體存取資料暫 信號連接,用以因應由該 ;;:、/亥内建自我測試電路 控制信號,而選擇該内建自我2测試控制器所發出的一 該記憶體存取資料暫存器出二電=所輸出之信號或是 嵌入式記憶體中;—中央處理d及並力:_送至該 係和該第一多工器與該中 =一夕工益, JTAG控制器所發出的—=邮錢接,因應由該 所輸出之信號或是該中央處理二多工器 傳送至該嵌入式記憶體中。 粉出之亚加以 根據上述縣,其巾朗㈤除辭號 訊’係包含在-讀取動作中欲從該歲; =貝 入式記憶财的位址資訊與資料寫人動作中欲寫入至該嵌 根據上述構想,其中該外 和該存取賴相將器f置 中,並於後續經由該暫存$ : 人式疏體 式記崎讀取出該測試置==從該^ —測試模式下是否工作正常 心该歧式記憶體在 模式下分析經由 # 卜’ 5亥外部裝置在-測試 式記憶體中所讀取H子=置和該存取測試埠而從該嵌人 料,或是在一二以決定該資料是否為錯誤資 痒將資料寫入至該嵌人式_3存^ =該存取測試 本發明另-方面係為—種『二:::峨剛^ 方法包含下列步賢.^ 早^之㈣方法,該 肩.攸一外部裝置經由一系統單晶片中的 11 1300524 口亥糸統早日日片,因應該望 ,t μ^豕弟—測試信號而從該JTAG控制器 第χ別; 控制信號並且根_ Γ μ㈣之―位址資麵執行—資料寫入動 Γ::Γ寫,統單晶片中的-欲入式記憶體 讀取動取該嵌人式記憶體的資料 所读取屮ΐ::亥存取測試埠而將從該嵌入式記憶體中 置;;從心/二出至該外部裝置中;以及利用該外部裝 對t肷式s&憶體中所讀取出之資料進行分析。 f統:曰,ν亥方法包含下列步驟:從一外部裝置經由該 糸、、先早0日片中—;TAG控制器中的存取測試埠,將 :出控制㈣’該測試信號係包含有一位址資 =將_試信號±所載之該位址資訊儲存至—暫存哭參 =中,根據儲存於該暫存器裝置中的該位址資訊並因應‘ t制域’對該系統單晶片中的—嵌人式記憶體進行一資 ^買取動作,·經由該存取測試埠與該暫存器裝置而將從兮 敢入式記憶體中所讀取出之資料輸出至該外部裝置中^ 及利用該外部裝置對從該嵌入式記憶體中所讀取出之資料 丁分析。其中在資料輸出之步驟中,自該嵌入式記情 ===料並儲存於該暫存妓置中的―記憶體^ 貝枓暫存益中,接著將該資料從該記憶體存取資料 轉移至該暫存H裝置的—TTAG可存取移位暫存器中,子】 12 丄300524 =將該資料從該ITAG可存取移位暫存器輸出至該外部 取二:Γ:Γ係為一種系統單晶片的記憶體直接存 系==法,该方法包含下列步驟:從一外部裝置經由該 ;號:1片二:_控制器中的存取測試埠,將-除錯 資^ :糸統早晶片中’該除錯信號係包含有-位址 ^和弟資料;因應該除錯信號而從該職控制器 ^—次=將該除錯信號上所载之該位址資訊與該 至—暫存器裝置中;以及因應該控制信號而 事置中广動作’轉該絲,轉f鱗於該暫存器 弟—㈣覆寫至儲存於該系統單晶片的一嵌入 次42L 中的第H其中自該外部裝置接收該第-=亚=於該暫存器裝置中的_ JTAG可存取移位暫存A Pattern Generator 22 and a Reaction Analyzer (for example, Analyzer) 23 test a circuit to be tested 20, and the built-in self-test controller 21 is input by an external Bist-on signal. After controlling the pattern generator 22 to generate the test pattern and the basic control signal, the BIST mode is entered; a multiplexer 24 is used to select the test pattern generated by the pattern 2, and after a specific time. The turn-out signal is sent to the reaction analyzer 23 for analysis. Finally, the section built-in self-test controller 21 sends a Bist_d〇ne signal to = the test program has been completed. According to the Pass/Fail round-out message, we can judge that the standby circuit 2G is b: normal or cannot be thief. 4€ / However, the above built-in self-test τ) technology still limits the embedded memory in the single chip through the external circuit to achieve the purpose of debugging and verification; in order to solve this problem, take some daily on-chip There are additional pins that are used to operate. Therefore, through these extra two: = yes, the greedy/address pins can be used for the embedded memory. These extra pins are inevitable. The ground will save two's but the volume and production cost, and how to make the external circuit can be the main purpose of the development of the case. [Summary of the Invention] 9 1300524 - external 呷 二 2:: 吉 system single-chip embedded memory can be used without the need to add additional surface 'supplied and debugged by the 提供 ^ 7 provides a system The test and debugging method of the chip can be used to test the lions of the _ _ test and debug, without special design of the implementation of the operation of the pin. Only, spoon ^ ^ 帛 built-in test / Wrong circuit - system single crystal 匕 3 Memory controller--JTAG controller, which is connected to the external device to generate a signal connection for receiving ^=卩衣在在测5式/Debug mode-test/debug two A source should send a control signal to test/debug the signal; and a register device is connected to the embedded clock to store the access contained in the test/debug signal. For the embedded memory, 'Ayne should control the serial number to make the information related to the information transfer between the embedded memory and the external device through the access test. According to the above concept' The scratchpad device includes a memory access data register that can be connected to the memory signal, and a jTAG accessible shift register that can be connected to the η海 JTAG control signal. And the memory access data register and the JTAG accessible shift register are connected to each other. According to the above concept, the system single chip further comprises a built-in self-test circuit for Perform a built-in self-test mode, the built-in self-test circuit The utility model comprises a built-in self-test controller; a first multiplexer 1300524 is connected with the temporary access signal of the memory access data, and is selected according to the control signal of the self-test circuit; The built-in self-test controller sends a memory access data register to output the second power = the output signal or the embedded memory; - the central processing d and the force: _ sent to the And the first multiplexer and the middle=one eve, the JTAG controller sends out the -= postal money, according to the signal output by the output or the central processing two multiplexer is transferred to the embedded In the memory, according to the above-mentioned counties, the towel (5) in addition to the slogan 'includes in the - reading action to be from that age; = the address information and information writing action of the memory In order to write to the embedding according to the above concept, wherein the outer and the accessing phase f are centered, and subsequently read through the temporary storage $: human escaping The ^ - test mode is working normally. The disambiguated memory is analyzed in the mode via #卜5H external device reads the H sub = in the test memory and the access test 埠 from the embedded material, or in one or two to determine whether the data is an error itch to write data to The embedded _3 memory ^ = the access test of the present invention - the second type of "two::: 峨 ^ ^ method includes the following step xian. ^ early ^ (four) method, the shoulder 攸 an external device Through the 11 1300 524 糸 早 早 早 经由 一 一 一 一 一 一 一 一 一 一 因 因 因 因 因 因 因 因 因 因 因 因 因 因 因 因 因 因 因 因 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; Qualification execution - data writing Γ:: Γ , , , 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 欲 : : : : : : : : : : : : : From the embedded memory;; from the heart / two out to the external device; and using the external device to analyze the data read in the t s & f system: 曰, ν 方法 method includes the following steps: from an external device via the 糸, first 0 days in the film - TAG controller access test 埠, will: out control (four) 'the test signal system contains There is a site address = the address information contained in the _ test signal ± is stored in the temporary crying parameter = according to the address information stored in the register device and corresponding to the 't domain' The embedded memory in the system single chip performs a purchase operation, and outputs the data read from the input memory to the temporary memory device via the access test and the temporary memory device. And using the external device to analyze the data read from the embedded memory. In the step of outputting the data, the embedded memory is stored in the temporary storage of the memory, and then the data is accessed from the memory. Transfer to the TTAG access shift register of the temporary H device, sub] 12 丄 300524 = output the data from the ITAG accessible shift register to the external take: Γ:Γ The system is a system single-chip memory directly stored == method, the method comprises the following steps: from an external device via the number: 1 piece 2: _ controller access test 埠, will - error ^ : In the SiS early chip, 'the debug signal system contains the address ^ and the younger data; the debugger should respond to the signal from the controller ^ ^ times = the address contained on the debug signal Information and the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The second of the second 42L, wherein the first-sub-substance is received from the external device, and the _JTAG accessible shift temporary storage in the temporary register device

移至該暫:==_該JTAG可存取移位暫存器轉 ,資料從該記憶體存取資料暫存器轉移至該欲入式J 在該系統單晶片中運用了多工器,使得使用者 ==:=埠中的該嵌入 行除錯之時間以及軟州^ 士#效地減少了對晶片進 ,:::r 13 1300524 表現性的情況下得卜::===計之 【實施方式】 諝芩閱第 一 圖,係為本發明為改善習用技術所發展出Move to the temporary: ==_ The JTAG can access the shift register, and the data is transferred from the memory access data register to the desired J. A multiplexer is used in the system single chip. The time for the embedded line in the user ==:=埠 is debugged and the soft state is reduced to the wafer. :::r 13 1300524 Expressiveness::=== [Embodiment] Referring to the first figure, the invention is developed for improving the conventional technology.

糸、、先早晶⑽GC)3之較佳實施例功能方塊示意圖。由圖 所不^统單晶片3係包対-巾央處理單元30、-嵌 入式德體3卜—内建自我測試電路33、-内建自我測試 控制器33卜一第一多工器34和一咖_ w &如nA functional block diagram of a preferred embodiment of 糸, 早早晶(10)GC)3. The single-chip 3-system package-the towel central processing unit 30, the embedded body 3b-built-in self-test circuit 33, the built-in self-test controller 33, a first multiplexer 34 And a coffee _ w & such as n

Gr〇UP ’聯合測試行動組)控制器35,並以習用方法將這些 元件加以整合,於该巾央處理單元3()之巾係包含有可對該 甘欠入式纪憶體31進行一系統時脈控制3〇1和一記憶體存取 控制302之功能。而“JTAG”係指由JTAG組織(J〇intTestGr〇UP 'Joint Test Action Group' controller 35, and integrates these components in a conventional manner, and the towel system of the towel processing unit 3() includes a module for performing the stagnation mode System clock control 3〇1 and a memory access control 302 function. And "JTAG" refers to the organization of JTAG (J〇intTest

Action Group)所發展,正式名稱為IEEE 11491的晶片設 計規範,其目的在於透過制定指令集與通訊協定而建立出 基本晶片測试的架構。該JTAG控制器35主要包含有一存 取測試琿(Test Access Port,簡稱TAP) 350和一時脈控 制器351,其中“TAP”係指由JTAG組織所規範的一種測 試介面,係由資料輸入測試(Test Data In,簡稱TDI)、 資料輸出測試(Test Data Out,簡稱TDO )、時脈測試(Test Clock,簡稱 TCK)、模式選用測試(Test Mode Select, 簡稱TMS)和重置測試(TestReset,簡稱丁1181〇等信號 所組成,而為了簡潔其圖示,於第三圖之中係只顯示出本 14 1300524 發明有提及之該TDI信號接腳和該TD〇信號接聊。此外, 該存取測試埠350之功能係用來解譯其JTAG指令,而該 時脈控制器35!則用來提供出時脈予其他元件以進行= 作。 而本發明便是在使用了目前既存之jtag控制器的技 術與硬體架構外,於系統單晶片中再加入了一記憶 資料暫存器(memory access dataregister)36、— jtag(編^Developed by Action Group, the official name is the IEEE 11491 chip design specification, which aims to establish a basic wafer test architecture by developing instruction sets and communication protocols. The JTAG controller 35 mainly includes an Access Test Port (TAP) 350 and a clock controller 351, wherein "TAP" refers to a test interface specified by the JTAG organization, which is tested by data input ( Test Data In (TDI), Data Output Test (TDO), Test Clock (TCK), Test Mode Select (TMS) and Reset Test (TestReset, referred to as Ding 1181〇 and other signals are formed, and for the sake of brevity, in the third figure, only the TDI signal pin mentioned in the 14 1300524 invention and the TD〇 signal are shown. In addition, the deposit The function of the test module 350 is used to interpret its JTAG instruction, and the clock controller 35! is used to provide the clock to other components for the operation. The present invention uses the existing jtag. In addition to the controller's technology and hardware architecture, a memory access data register 36 is added to the system single chip.

Test Action Group,聯合測試行動組)可存取移位暫存器” 以及一第二多工器38,用以對該嵌入式記憶體執行測試和 除錯之運作程序,因此,藉由此概念於裝置設計上便就不 需要再增加額外之接腳;而在該記憶體存取㈣暫存器% ^便包含了有記憶體必要之控制信號、位址資訊和資料資 訊。其中該JTAG可存取移位暫存器37在實質上係和該記 憶體存取資料暫存器36具有相同之空間大小,並且係被用 =載入或卸载其儲存於該記憶體存取資料暫存器%中之 貝而在第三圖中的該系統單晶片3對外部之測試和除 錯的Λ知方法,根據本發明係作以下敘述。 在一測試模式下’-測試/除錯裝置3 ^於存取測試琿—虎接腳對該系統單 2該存取測試埠350輪出一測試信號,而該測試信號還 HI要被寫人之㈣和其位㈣訊,並且麵試信號接 二不、,至其中的該JTAG可存取移位暫存$ 37中。根據 ΐΓί貧訊以及因應在該測試模式下主宰著系統時脈的該 禮控制器351所產生的時脈信號,該JTAG控制器^便 1300524 . 可進一步地發出(asse_控制信號以將資料寫入至該鼓入 " 式記紐31中;而在寫人測試完成之後,便是將寫入至該 嵌入式記憶體31一中之資料加以讀取出肖作隨後的分析。另/ 外’包含了位址資訊之另一測試信號係藉由該存取測試 35〇而輸人至該线單晶片3巾,並錢信號接著被傳送 至該JTAG可存取移位暫存器37中,該jtag控制哭乃 便可發出:控制信號,並以該JTAG可存取移位暫存器π • 中之位址貧訊而載入至該記憶體存取資料暫存器36中。根 據該位址資訊以及因應在該測試模式下,控制著系統之時 脈⑽時脈控制器351上所產生的時脈信號,該似⑽ . ㈣3\便可進—步地發出控制錢以將該獻式記憶體 31 ^之資料加以棘,並加_存至該記憶體存取資料暫 存。。36中。接著,该資料可更進一步從該記憶體存取資料 f存器36上被移動至該ITAG可存取移位暫存器37中, Ik後亚從該存取測試埠35〇上輪出至該測試/除錯裝置% • 巾(例如m⑹;關時下—個存取動作便可被載入 至該JTAG可存取移位暫存器37之中。 在此實施例之中,因為目前的測試模式可以和内建自 我測式(BIST)模式共存,所以該第二多工器%便可被用來 亥内建自我測試模式或本發明所述之記憶體直接存取測 ^^S(direct memory access test mode)作選擇。因應從該 / 内建自我測試控制器331上所產生之一控制信號,選擇出 • 該内建自我測試電路33所輸出之信號或該記憶體存取資 料暫存态36所輸出之信號中之其一,在經由該第二多工器 16 1300524 38後並加以傳送至該第一多工器34中。透過該第一多工 器34, 一内建自我測試模式/記憶體直接存取測試模式、或 疋正㈤工作模式等’便可以因應由該JTAG控制器35所 發出之控制信號而加以進行選擇。Test Action Group, Joint Test Action Group) Accessible Shift Register and a second multiplexer 38 for performing test and debug operations on the embedded memory. In the design of the device, there is no need to add additional pins; in the memory access (4) register, the % ^ contains the necessary control signals, address information and data information of the memory. The access shift register 37 has substantially the same spatial size as the memory access data register 36, and is stored or unloaded in the memory access data register. The method of knowing the test and debugging of the system single chip 3 in the third figure in the third figure is described below according to the present invention. In a test mode, the 'test/debug device 3 ^ In the access test 珲 - Tiger pin to the system single 2 the access test 埠 350 round a test signal, and the test signal is also HI to be written by people (four) and its position (four), and the interview signal is not , to the JTAG accessible shift staging in $37. According to The TAGί poor news and the clock signal generated by the controller 351 that dominates the system clock in the test mode, the JTAG controller 1300524. may further issue (asse_ control signal to write data) To the drums " type note 31; and after the writer test is completed, the data written to the embedded memory 31 is read out and the subsequent analysis is performed. Another test signal containing the address information is input to the line single chip 3 by the access test, and the money signal is then transferred to the JTAG accessible shift register 37. The jtag controls the crying to issue a control signal to the memory access data register 36 in the JTAG accessible shift register π. The address information and the clock signal generated on the clock controller 351 according to the clock of the system (10) in response to the test mode, the like (10). (4) 3\ can further control the money to give the offer The memory of the memory 31 ^ is added to the data, and added to the memory access data temporary storage Then, the data can be further moved from the memory access data buffer 36 to the ITAG-accessible shift register 37, and the IK is from the access test. The last round to the test/debug device % • towel (eg, m(6); off-time-one access action can be loaded into the JTAG accessible shift register 37. In this embodiment Because the current test mode can coexist with the built-in self-test (BIST) mode, the second multiplexer% can be used to build the self-test mode or the memory direct access of the present invention. Test ^^S (direct memory access test mode) for selection. In response to a control signal generated from the / built-in self-test controller 331, the signal output by the built-in self-test circuit 33 or the signal output by the memory access data temporary state 36 is selected. First, after passing through the second multiplexer 16 1300524 38 and transmitted to the first multiplexer 34. Through the first multiplexer 34, a built-in self-test mode/memory direct access test mode, or a positive (five) mode of operation, etc. can be selected according to the control signal sent by the JTAG controller 35. .

艰上所述之實施過程可知,此種測試模式是藉由將附 加的測試資料寫入至該嵌入式記憶體中並且隨後加以讀取 出,用以檢查所讀取出之資料是否和所寫入之資料一致; 或者,一測試模式可以在該中央處理單元之運作期間,透 過讀取出運作時之資料以及檢查是否有錯誤出現來加以執 行。此種記憶體直接存取測試模式可作如下之概述:包含 有位址資訊的—戦信號從—外部裝置上,例如:該測^ 除錯裝置39,藉由該系統單晶片中的該TTAG控制器中°的 $取測試埠而被輸人至該魏單晶片中,而因應該測試信 〜該JTAG控制器便可加以發出—控制信號,同時,該 測試信號上㈣之該健訊便被儲存至—暫存器裝置/ 中’例如:該記憶體存取資料暫存器36以及幻tag it::: 37 ’而根據儲存於該暫存器裝置中的該位址 二===:系?晶片中_人式記 以執行,接著,尸m'a a卿lng 〇perati。雜可被加 經㈣存憶體中所讀取出之資料便可 裝置麵行=送至該外部裝財,並由該外部 而在該測試模式之後,如果測 料時則-除錯模讀可被加崎 士、有錯㈣ 开Η丁舉例來說,正確之資 17 4 1300524 t:可===喪入式記憶體中用a取代並移除錯誤之 述:首 39 ^ - °卩衣置上,例如:該測試/除錯裝置 埠而被輪人至該 =z及正確之資料,而因應該除心:該= &制讀可加以發出—控制In the implementation process described above, the test mode is to check whether the read data is written and written by writing additional test data into the embedded memory and then reading it out. The incoming data is consistent; alternatively, a test mode can be performed during the operation of the central processing unit by reading out the data at the time of operation and checking for errors. Such a memory direct access test mode can be summarized as follows: a signal containing address information from an external device, such as the debug device 39, by means of the TTAG in the system single chip The controller in the controller takes the test and is input to the Wei single chip, and the test signal can be sent to the control signal, and the control signal (4) of the test signal Stored in the scratchpad device / in 'for example: the memory access data register 36 and the magic tag it::: 37 ' and according to the address stored in the register device two === :system? In the chip, the _ human record is executed, and then, the corpse m'a aqing lng 〇perati. Miscellaneous can be added (4) The data read in the memory can be sent to the external loading, and the external and after the test mode, if the material is measured - debug programming Can be added by Kazaki, wrong (four) Kai Ding, for example, the correct capital 17 4 1300524 t: can === in the memory of the lost memory with a and replace the error statement: the first 39 ^ - °卩On the clothing, for example: the test/debug device is turned to the =z and the correct information, and because of the heart: the = & read can be issued - control

:之該位址資訊與該正確之細被儲存至 Z ,如.,憶體存取資料暫存器36以及該JTAG可存 作=暫存器37,接著,因應該控制信號,一資料寫入動 資7將^7 :ation)便可被加以執行,係根據該位址 ;=:ϊ暫梅置中的正彻對儲存於該系、統 ===二式記憶體中的錯誤資料進行覆寫,因此The address information and the correct details are stored to Z, such as , the memory access data register 36 and the JTAG can be stored as a register 37, and then, according to the control signal, a data write Into the capital 7 will ^7 : ation) can be executed, according to the address; =: ϊ 梅 置 置 置 置 置 置 储存 储存 储存 储存 储存 储存 储存 储存 储存 储存 储存 储存 储存 储存 储存 储存 储存 储存 储存 储存 储存 储存 储存Overwrite, so

上柄介紹之記憶體直接存取測試所使用之電路係 1在―系統單晶片中目前所使用既有之元件,而只要運 用最少的特料成本耗旨,便可在《彡響其f路設^之表 現性的情況下得到上述額外的記憶體除錯運作特徵。而^ "式人員在晶片產品設計的最後程序上係可以 1 裝置,來對晶片產品中各刺記健狀態進 (Hiterrogate/m〇dify)之除錯程序’而藉由本發明對 發之設計者來說,也會在其·之產品中相關的除錯^ 程序上得觀善’即對於嵌人式記Μ的直接存取方式將 可以有效地減少軟體本身在進行除錯過程中所需要^昉 18 13〇〇524 間’再者’對於負責產品測試之測試人員來說係可以利用 此技術之特徵來對於記憶體㈣元件進行祕,以便用來 改善產品之生產或是有助於其失誤發生時的分析。 、,盘本么月係以被認為最實際和最佳之方式作實施例之描 述與說明,而可以瞭_本發_不僅健於其實施例之 所能揭露之概念,減的,本發明是_於各種不同 =形和相_設計,且以最廣之㈣㈣吨含所有變 二相似的&構,然料合如附加於後之申料利其中所 包含之精神與範圍。 【圖式簡單說明】 ^得藉由下觸式及說明,俾得—統人之了解: =圖,係為制之系統單“的功能方塊示意圖。 功係ί具有自我職功能之另—制系統單晶片的 刀月匕万塊不意圖。 係為本發明為改善制技術所發展出系統單晶片 ,、車乂佳貝施例之功能方塊示意圖。 【主要元件符號說明】 /本案圖式中所包含之各元件列示如下: 二::曰曰片1 t央處理單元10 甘认式記憶體11 ㈣匯流排12 19 1300524 記憶體控制器13 内建自我測試控制器21 反應分析器23 系統單晶片3 系統時脈控制301 嵌入式記憶體31 内建自我測試控制器331 JTAG控制器35 時脈控制器351 JTAG可存取移位暫存器37The circuit system 1 used in the memory direct access test described in the upper handle is currently used in the system single chip, and as long as the minimum cost of the special material is used, it can be used in The above-mentioned additional memory debugging operation feature is obtained in the case of the performance of ^. And the ^ " type of personnel in the final program of the chip product design can be a device to the patching state of the chip product (Hiterrogate / m〇dify) of the debug program 'by the design of the invention In addition, it will also be good at the related debugging procedures in its products. That is, the direct access method for embedded recording can effectively reduce the software itself in the process of debugging. ^昉18 13〇〇524 'Re-' for testers responsible for product testing can use the characteristics of this technology to secretize the memory (four) components, in order to improve the production of the product or to help it Analysis at the time of the error. And the present invention is described and illustrated in the manner which is considered to be the most practical and optimal, and the present invention can be implemented not only by the concept disclosed in the embodiments, but also by the present invention. It is _ in a variety of different forms and phases _ design, and in the most extensive (four) (four) ton containing all the two similar &<RTIID=0.0>>> [Simple description of the diagram] ^ By means of the lower touch and the description, the acquisition of the system - the understanding of the system: = diagram, is a system block diagram of the system system. The system has another function of self-employment. The system is not intended to be a single-chip stencil. It is a functional block diagram of the system for developing a single-chip, and the 乂 乂 贝 。 。 。 。 。 。 。 。 。 。 。 。 。 功能 功能 功能 功能 功能 功能 功能 功能 功能The components included are listed as follows: 2: 曰曰 1 1 处理 processing unit 10 甘 记忆 memory 11 (4) bus 12 12 1300524 memory controller 13 built-in self-test controller 21 reaction analyzer 23 system Single Chip 3 System Clock Control 301 Embedded Memory 31 Built-in Self Test Controller 331 JTAG Controller 35 Clock Controller 351 JTAG Accessible Shift Register 37

測試/除錯裝置39 待測試電路20 圖樣產生器22 多工器24 中央處理單元30 記憶體存取控制302 内建自我測試電路33 第一多工器34 存取測試埠350 記憶體存取資料暫存器36 第二多工器38 信號接腳TDI、TDOTest/debug device 39 Circuit to be tested 20 Pattern generator 22 multiplexer 24 Central processing unit 30 Memory access control 302 Built-in self-test circuit 33 First multiplexer 34 Access test 埠 350 Memory access data Register 36 Second multiplexer 38 Signal pins TDI, TDO

2020

Claims (1)

l3〇〇524__^ I ^ ;v- 十、:= i.—種2建測試/除錯電路之—系統單晶片,包含有: 一嵌入式記憶體; .-外;動組控制11 ’係包含—存取測試埠以與 衣纟域連接,用以接收來自該外部I置在_ ‘試=錯=下所發出的—測試/除錯信號,並因應該測 ”、,曰L#U而發出一控制信號;以及 以辟六’係和該嵌4記憶體作錢連接,用 需2=戰/除錯錢上㈣之麵職人式記憶體所 存取二迨亚因應該控制信號使該資訊相關之資料透過該 mf 糾人式記紐無外«置之間轉移。 w、申二專利範圍第1項所述之系統單晶片,更包含有一 ===脈控制和對該嵌人式記憶體進行存取控制的 =申-t專利朗第2項所狀线單晶片,其中該聯合 組控制11包含有—時脈控制11,用以在該測試/ 矛、、’曰果式下對系統之時脈進行控制。 4器利範園第1項所述之系統單晶片,其中該暫存 取:料t 胃嵌~式記憶體信號連接的記憶體存 拉二;1:、子為’以及可和該聯合測試行動組控制器信號連 二欠祖式订動組可存取移位暫存器,且該記憶體存取 貝=μ和相合測試行動組可存取移位暫存器之間互 相連接。 申明專利㈣第4項所述之系統單晶片,更包含有·· 21L3〇〇524__^ I ^ ;v- 十,:= i.—2 kinds of test/debug circuits—system single-chip, including: an embedded memory; .-out; dynamic group control 11 ' The include-access test is connected to the clothing field to receive the test/debug signal from the external I placed under _ 'test=error=, and should be measured, 曰L#U And send a control signal; and use the six-series and the embedded memory to make money connections, use the 2= war/debug money (4) to access the memory of the person's memory should control the signal The information related to the information is transferred through the mf rehearsal note. The system single chip described in the first paragraph of the patent scope of the second patent includes a === pulse control and the embedded The memory of the memory is controlled by the application of the control unit, wherein the joint control 11 includes a clock control 11 for the test/spear, The clock of the system is controlled. The system single chip described in Item 1 of the Lifan Garden, wherein the temporary access: material t stomach embedded memory type signal The memory is connected to the second; 1:, the sub-' and the controller signal of the joint test action group can be connected to the ancestor-type group to access the shift register, and the memory accesses the shell = The μ and the matching test action group can access the shift register to interconnect with each other. The patent system (4), the system single chip described in item 4, further includes 21 建自我=多1器,係和該記憶體存取資料暫存器與該内 制哭所ίΓ路信號連接’用,應由該内建自我測試控 控制信號’而選擇該内建自我測試㈣ L麵是該記㈣存取_暫存 亚加以傳送至·人找憶料。 1。號Build self = more than one device, and the memory access data register and the internal system of crying Γ 信号 信号 连接 用 用 用 用 用 用 用 选择 选择 选择 选择 选择 选择 选择 选择 选择 选择 选择 选择 选择 选择 选择 选择 选择 选择 选择 选择 选择 选择 选择 选择 选择 选择The L side is the record (4) access _ temporary storage sub-transfer to the person to find the material. 1. number 寫入至該嵌入式記憶體中,並於後續經由該暫存器裝置和 该存取測試埠從該嵌入式記憶體中讀取出該測試資料,以 1300524 6.如h專利範圍第5項所述之系統單晶片,更包含有: 一中央處理單元;以及 信多工^ #、㈣第—多工器與該中央處理單元 ^ ,因應由該聯合測試行動組控制器所發出的一控 理^虎,而選擇該第^多卫器所輪出之信號或是該中央^ 早謂輪出之信號,並加以傳送至祕人式記憶體中。 获如申請專截圍第1項所叙系統單3,其中該外部 置係為可提供該測試/除錯信號之一電腦系統。 8.如申^請專·圍第1項所述之系統單“,其中制試/ ,錯彳5唬上所载之該資訊,係包含在一讀取動作中欲從該 耿入式記憶體中讀取之資料相關的位址資訊,以及在一寫 入動作中欲寫人至減人式記紐中的位址資訊與資料。 9壯如申請專利範圍第1項所述之系統單晶片 ,其中該外部 衣置係經由該暫存器裝置和該存取測試埠而將一測試資料 22 1300524 ^ 人式5己憶體在—戦模式τ是否玉作正常。 裝置在^^第1項所述之_晶片,其中該外部 埠而彳由該暫存器裝置和該存取消m 雜人式記憶體中所讀取出之資料,以決定該資料 錯力料,或是在—除錯模式下經由該暫存器裝置 ^存取職埠將資料“至該嵌 , 该錯誤資料。 後-Writing to the embedded memory, and subsequently reading the test data from the embedded memory via the register device and the access test, to 1300524 6. For example, the fifth item of the patent scope The system single chip further includes: a central processing unit; and a letter multi-worker ^, (four) first-multiplexer and the central processing unit ^, in response to a control issued by the joint test action group controller ^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^ For example, the system is listed in the first paragraph of the system item 3, which is a computer system that provides one of the test/debug signals. 8. If you apply for the system list described in item 1, the test information contained in the test item is included in the read-in action. The address information related to the data read in the body, and the address information and information in the writing action to write the person to the subtractive note. 9 Zhuang as the system list mentioned in the first paragraph of the patent application scope a wafer, wherein the external device is configured to pass a test data 22 1300 524 524 524 524 524 524 524 524 524 524 524 524 524 524 524 524 524 524 524 524 524 524 524 524 524 524 524 524 524. The chip described in the item, wherein the external device is configured by the register device and the data read from the memory device to determine the data error material, or In the wrong mode, the device is accessed via the register device to "send the data to the embedded data." Rear- ,系統單晶片之測試方法,該方法包含下列步驟: 批缶:一外部裝置經由一系統單晶片中的聯合測試行動組 。。曰k中的存取測鱗,將_第—測試信號輸人至該系統 曰曰片, 口應&quot;亥第一测試信號而從該聯合測試行動組控制器上 發出一第一控制信號;A test method for a system single chip, the method comprising the steps of: batching: an external device via a joint test action group in a system single chip. . The access scale in 曰k, the _th-test signal is input to the system slice, and the mouth should be &quot;Hai first test signal and a first control signal is sent from the joint test action group controller ; 一因應該第—控制信號並且根據該第一測試信號上所載 之位址貝訊而執行一資料寫入動作,以將資料寫入至該 系統單晶片中的—嵌入式記憶體中; ^根據該位址資訊而執行一讀取該嵌入式記憶體的資料 動作’並經由該存取測試埠而將從触人式記憶體中 所項取出之資料輪出至該外部裝置中;以及 利用4外部裝置對從該嵌入式記憶體中所讀取出之資 料進行分析。 12·如申明專利範圍第u項所述之方法,其中該資料讀取 動作係因應—第二測試信號而發出的-第二控制信號而由 該聯合測試行動組控制器來加以執行。 23 1300524 正替換頁 η.如申請專利項所述之方法,其中該第— k號載^㈣寫端作所t的—職轉與該測試 之位址貝訊’且該第二測試信號載有該資料讀取動 的該測試資料之位址資訊。 斤而 14·如申請專利範圍第13項所述之方法,更包含下列步驟. 將該測試貧料和該位址資訊儲存至該系統單晶片中的—於 合測試打動組可存取移位暫存器中,接著將該測試資: =址資訊轉移至該系統單晶片的—記憶體存取資料 态中,用以進行該資料寫入動作。 、暫存 15.如申請專利範㈣14項所述之方法,更包含 :該位㈣靖存至該聯合峨行動組可絲移位&amp;哭 ::者將該位址資訊轉移至該記憶體存取資料‘: 中,用以進行該資料讀取動作。 曰存口口 16·如申請專利範圍第15項所述之方法, 在該資料讀取動作中將從該嵌人式記憶體中所^^步驟: 科,該記憶體存取資料暫存器上轉移至 二出^貧 埠中用以輸出。 爾夕至鉢取測試 之 17·如申請專利範圍第16項所述之方法 藉由選擇_辭晶片巾的—_自;^下列步驟: :“虎與該記憶體存取資料暫存器所輪;路所輪出 測:式拉式輸出傳送至該嵌人式記憶體中,因作為 我測試模式和—外部測賴式間 -内建丨 18·如申請專利範圍第17項所述之方法換更。勺八 更包含下列步驟 24 1300524 ,一鱗該測試模式的輪出與該系統單晶片中-中央處理 二兀所輪出之信號之_傳送至該嵌入式記憶體中,因而在 「:機模式和厂正常模式間進行切換。 人·種系統單晶片的記憶體直接存取測試方法,該方法包 3下列步驟: #制2 +外部裝置經由該系統單晶片中一聯合測試行動組 片中的存取測試埠,將一測試信號輸入至該系統單晶 ㈣口應表則試信號而從該聯合測試行動組控制器發出-㈣信號,該_信號係包含有—位址資訊; 將該測試信號上所载之該位址資訊儲存至一暫存器裝 中, 制H細存於該暫存S裝置中的該位址資訊並因應該控 讀=作_系統單晶片中H人式記憶體進行一資料 ,丨咅Μ =存取'肖5辑與該暫存隸置㈣從該嵌入式記 L體中所讀取出之資料輪出至該外部裝置中;以及 料進Si外部I置對從鋪人式記憶體中所讀取出之資 第19項所述之記憶體直接存取測試方 出該資料並射^之步财,自軸人式記憶體中擷取 存器中,接著器裝f中的一記憶體存取資料暫 該暫存器裝置的r η該記憶體存取資料暫存器轉移至 ^ 、聯合測試行動組可存取移位暫存器中, 25 1300524 出至轉合戰行騎可存取移位暫存器輪 I1下一單雜體錢麵除財法,該方法包 控制信號; ㈣行動組控制器發出一 至—暫存之該位址資訊與該第一資料儲存 該系統單晶片置中的該第,覆寫至儲存於 22.如申請專利範第體中的—第二資料。 法,其中自該二^項所述之記憶體直接存取除錯方 裝置中的該第一資料並儲存於該暫存器 該第-資料從該聯1二:f取移位暫存器中,接著將 =tT 二 ==:= 中。〜讀存取資料暫存ϋ轉移至該嵌人式記憶體 26A data writing operation is performed according to the first control signal and according to the address message on the first test signal, to write the data into the embedded memory in the single chip of the system; Performing a data action of reading the embedded memory according to the address information and transferring the data extracted from the touched memory to the external device via the access test; and utilizing 4 The external device analyzes the data read from the embedded memory. 12. The method of claim 5, wherein the data reading action is performed by the joint test action group controller in response to the second control signal being issued by the second test signal. 23 1300524. The method of claim </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> The address information of the test data read by the data. The method of claim 13 further includes the following steps: storing the test poor material and the address information in the single wafer of the system - the test test group can access the shift In the register, the test information is transferred to the memory access data state of the single chip of the system for performing the data writing operation. Temporary deposit 15. The method described in the application for patent (4), 14 includes: (4) Jing Cun to the joint action group can be shifted &amp; cry:: the address information is transferred to the memory The access data ': is used to perform the data reading operation.曰 口 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 16 Transfer to the second out of the poor for output. 17: The method described in claim 16 is as follows: by selecting the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Round; road round out test: the pull output is transmitted to the embedded memory, as it is my test mode and - external measurement type - built-in 丨 18 · as described in claim 17 The method further comprises the following step 24 1300524, wherein the rounding of the test mode and the signal of the round-up of the central processing unit in the single chip of the system are transmitted to the embedded memory, thereby "Switch between the machine mode and the factory normal mode. The memory direct access test method of the human system system single chip, the method package 3 the following steps: #制2 + external device via the system single chip in a joint test action The access test in the group, a test signal is input to the single crystal (four) port of the system, and the test signal is sent from the joint test action group controller - (four) signal, the _ signal contains - address information ; the test signal is contained The address information is stored in a temporary storage device, and the address information stored in the temporary storage device is processed and the data is read by the H-type memory in the system. , 丨咅Μ = access 'Xiao 5 series and the temporary storage (4) the data read from the embedded L body is rotated out to the external device; and the material into the Si external I set to the slave The memory direct access test described in item 19 of the human memory reads the data and shoots the money, and the self-winding memory is used in the memory, and then the device is loaded. A memory access data in f is temporarily stored in the register device r η, the memory access data register is transferred to ^, the joint test action group can access the shift register, 25 1300524 The battle-riding can access the shift register register wheel I1 next single-body money face elimination method, the method package control signal; (4) the action group controller issues a 1-to-temporary address information and the first The data is stored in the system, and the system is overwritten to the second data stored in 22. The patent application body. The first data in the memory device directly accessed from the memory device is stored in the temporary register, and the first data is taken from the associated register: Then, =tT ===:=. The read access data is temporarily stored and transferred to the embedded memory.
TW95112493A 2005-04-13 2006-04-07 System-on-a-chip and test/debug method thereof TWI300524B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US67066605P 2005-04-13 2005-04-13

Publications (2)

Publication Number Publication Date
TW200636447A TW200636447A (en) 2006-10-16
TWI300524B true TWI300524B (en) 2008-09-01

Family

ID=36946964

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95112493A TWI300524B (en) 2005-04-13 2006-04-07 System-on-a-chip and test/debug method thereof

Country Status (2)

Country Link
CN (1) CN100392617C (en)
TW (1) TWI300524B (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI399550B (en) * 2007-11-30 2013-06-21 Hon Hai Prec Ind Co Ltd Testing system and method
CN101996686B (en) * 2009-08-17 2013-03-20 慧国(上海)软件科技有限公司 Method and device for writing test data into memory
TWI468943B (en) * 2010-11-03 2015-01-11 Apple Inc Methods and apparatus for access data recovery from a malfunctioning device
US8402314B2 (en) * 2010-12-09 2013-03-19 Apple Inc. Debug registers for halting processor cores after reset or power off
CN102999459A (en) * 2011-09-09 2013-03-27 上海华虹Nec电子有限公司 Communication method of silicon wafer testing machine and built-in self test (BIST) module
CN106229010B (en) 2011-09-27 2019-07-19 意法半导体研发(深圳)有限公司 Fault diagnosis circuit
KR102038414B1 (en) * 2013-06-20 2019-11-26 에스케이하이닉스 주식회사 Test device and operating method thereof
US9628787B2 (en) * 2014-04-16 2017-04-18 Texas Instruments Incorporated Ensuring imaging subsystem integrity in camera based safety systems
US9632137B2 (en) * 2015-04-22 2017-04-25 Apple Inc. Serial wire debug bridge
TWI546660B (en) 2015-09-22 2016-08-21 新唐科技股份有限公司 Debugging system and method
CN108628723B (en) * 2017-03-23 2022-03-11 瑞轩科技股份有限公司 Information processing method
CN109254883B (en) * 2017-07-14 2021-09-24 深圳市中兴微电子技术有限公司 Debugging device and method for on-chip memory
US10866283B2 (en) * 2018-11-29 2020-12-15 Nxp B.V. Test system with embedded tester
US11531061B2 (en) 2020-08-03 2022-12-20 Qualcomm Incorporated Interleaved testing of digital and analog subsystems with on-chip testing interface

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6427216B1 (en) * 1999-03-11 2002-07-30 Agere Systems Guardian Corp. Integrated circuit testing using a high speed data interface bus
CN1312588C (en) * 2004-04-02 2007-04-25 清华大学 Realizing method of cross regulator based on EJTAG components of targeting machine

Also Published As

Publication number Publication date
CN1828553A (en) 2006-09-06
TW200636447A (en) 2006-10-16
CN100392617C (en) 2008-06-04

Similar Documents

Publication Publication Date Title
TWI300524B (en) System-on-a-chip and test/debug method thereof
TWI259359B (en) Method and apparatus for testing embedded cores
JP3980827B2 (en) Semiconductor integrated circuit device and manufacturing method
TWI343482B (en) Wireless no-touch testing of integrated circuits
US6564347B1 (en) Method and apparatus for testing an integrated circuit using an on-chip logic analyzer unit
TWI220024B (en) Hierarchical built-in self-test for system-on-chip design
US20040006729A1 (en) Hierarchical test methodology for multi-core chips
TWI286609B (en) System and method for testing integrated circuits
US7979764B2 (en) Distributed test compression for integrated circuits
JP4267716B2 (en) SDRAM circuit test method using JTAG
TW411393B (en) Boundary scan test apparatus for integrated circuits
US20100312517A1 (en) Test Method Using Memory Programmed with Tests and Protocol To Communicate between Device Under Test and Tester
TW201443463A (en) Test IP-based A.T.E. instrument architecture
US20050065747A1 (en) Mixed-signal core design for concurrent testing of mixed-signal, analog, and digital components
WO2015048366A1 (en) Programmable interface-based validation and debug
US9086451B2 (en) Semiconductor integrated circuit and method for designing the same
Parulkar et al. A scalable, low cost design-for-test architecture for UltraSPARC/spl trade/chip multi-processors
TWM326153U (en) Circuit testing apparatus
US20030074620A1 (en) Configurable asic memory bist controller employing multiple state machines
Gillis et al. Test methodologies and design automation for IBM ASICs
JP2018190751A (en) Semiconductor device and semiconductor device test method
Han et al. A New Multi‐site Test for System‐on‐Chip Using Multi‐site Star Test Architecture
Dutta et al. A BIST Implementation framework for supporting field testability and configurability in an automotive SOC
US11984177B2 (en) Memory component provided with a test interface
Keller Design