TWI296553B - - Google Patents
Download PDFInfo
- Publication number
- TWI296553B TWI296553B TW95127878A TW95127878A TWI296553B TW I296553 B TWI296553 B TW I296553B TW 95127878 A TW95127878 A TW 95127878A TW 95127878 A TW95127878 A TW 95127878A TW I296553 B TWI296553 B TW I296553B
- Authority
- TW
- Taiwan
- Prior art keywords
- solder paste
- circuit board
- charge
- jig
- pressing
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 claims description 58
- 238000003825 pressing Methods 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 19
- 238000010168 coupling process Methods 0.000 claims description 18
- 238000005859 coupling reaction Methods 0.000 claims description 18
- 230000008878 coupling Effects 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 14
- 238000005476 soldering Methods 0.000 claims description 13
- 238000003466 welding Methods 0.000 claims description 13
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims 3
- 238000001816 cooling Methods 0.000 claims 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 229910052742 iron Inorganic materials 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95127878A TW200806413A (en) | 2006-07-28 | 2006-07-28 | Welding charge coupled device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95127878A TW200806413A (en) | 2006-07-28 | 2006-07-28 | Welding charge coupled device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200806413A TW200806413A (en) | 2008-02-01 |
| TWI296553B true TWI296553B (enrdf_load_stackoverflow) | 2008-05-11 |
Family
ID=44766338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW95127878A TW200806413A (en) | 2006-07-28 | 2006-07-28 | Welding charge coupled device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200806413A (enrdf_load_stackoverflow) |
-
2006
- 2006-07-28 TW TW95127878A patent/TW200806413A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW200806413A (en) | 2008-02-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI309330B (en) | Camera module and method of manufacturing the same | |
| TWI296905B (en) | Process for mounting electric parts and mounting apparatus | |
| TW200803669A (en) | Electronic component soldering structure and electronic component soldering method | |
| JP4432949B2 (ja) | 電気部品の接続方法 | |
| WO2008022530A1 (fr) | Brasure à l'étain et procédé de soudure par presse chauffante l'utilisant | |
| TWI296553B (enrdf_load_stackoverflow) | ||
| TW569062B (en) | Thermal bonding device and method | |
| TWI358978B (en) | Printed circuit board, printed circuit board assem | |
| JP3915765B2 (ja) | 接合方法 | |
| JP2000174059A (ja) | 電子部品の実装方法 | |
| TW200942352A (en) | Solder bonding structure and solder bonding method thereof | |
| WO2018168476A1 (ja) | 接合体の製造方法、絶縁回路基板の製造方法、及び、ヒートシンク付き絶縁回路基板の製造方法 | |
| CN100512568C (zh) | 电荷耦合元件的焊接方法及其夹具 | |
| CN109673110B (zh) | Led芯片的固晶方法及具有其的显示模组的封装方法 | |
| CN218050734U (zh) | 一种fpc焊接冶具和焊接系统 | |
| TWM250422U (en) | Electrical connector | |
| CN207020209U (zh) | 一种微型钎焊接头电迁移测试结构 | |
| TWI298611B (en) | Method for soldering circuit boards | |
| CN101213889B (zh) | 超微细部件的拆卸方法及装置 | |
| JP2009231379A (ja) | 半田付け方法 | |
| TWI335200B (enrdf_load_stackoverflow) | ||
| TW200911065A (en) | Thermocompression-bonding device and method of mounting electric component | |
| US20080061112A1 (en) | Method for soldering charge coupled device and tooling thereof | |
| WO2005041268A2 (en) | Aluminum heat sink for a solid state relay having ultrasonically welded copper foil | |
| CN100515643C (zh) | 恒温式热压接装置和热压接方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |