-42^5831 七、指定代表圖： (一) 本案指定代表圖為：第（4 )圖。 (二) 本代表圖之元件符號簡單說明： 402-1，402-2,402-3,402-4 夾指 404_ 1，404-2,404-3,404-4 夾指 408旋轉軸 412_1、412-2傳動機構 4〇6喷嘴 410轉盤 414液體管路-42^5831 VII. Designated representative map: (1) The representative representative of the case is: (4). (2) A brief description of the symbol of the representative figure: 402-1, 402-2, 402-3, 402-4 Finger 404_ 1,404-2,404-3,404-4 Clamp 408 Rotary shaft 412_1, 412-2 Transmission mechanism 4〇6 Nozzle 410 turntable 414 liquid line
八、 本案若有轉式時，請揭示最賴示發畴徵的化學式： 九、 發明說明： 【發明所屬之技術領域】 本發明係有關於-種以旋轉機台夾持晶機 以輪，晶圓之機 光阻、^藥輪流夹持晶圓而避免金屬或 【先前技術】 旋』中之微影及蝴製程中以化學劑喷灑於— 曰面以除去金屬圖案中之一部份，稱為撕去法 (^或“洗顯影晶UJ上之触劑。晶 士二般，持晶圓之方式有多種。如第i圖所示，第^ 則技指將晶圓固持在台座上之示意圖。如第i圖1)戶， I姓7 〇座i〇3上之晶圓101被一組夾指102-1，102-2，102-3 第1圖⑻所示’第1圖（B)為沿第1 _之从， 、水j_，晶圓1G1置於台座103上，為夾指102·卜隐2 夾持住，夾指可移動以夾住或鬆開晶圓。然後台座1的旋轉， 晶圓、101得以持在位置上而不至於鬆脫離開台座1〇3，即可進 行喷灑化學劑或純水106進行蝕刻而撕去晶圓上之金屬圖案 中應撕去之部份；或進行清洗。但一旦蝕刻完了，夾指1〇2_卜 102-2 ’ 102-3下之晶圓表面之金屬因被夾指壓住，化學劑不能 接觸，圓表面之金屬，致在夾指下殘留金屬，其形狀與夾指一 致。若為清洗顯影之光阻劑，則殘留之光阻劑在晶圓進入 爐時形成嚴重之污染，使晶圓上形成缺陷(defect)。另一固 式如第1圖(C)及⑼所示，係利用夾指之接觸塊與Γ 興南晶圓，可自晶圓之上表面及晶圓之下表面喷灑化 侧或清洗晶圓。$1圖(c)為晶圓被夾指之 接f塊夾持之示意圖。晶圓⑼被夾指之接觸塊104夾持住， =曰，圓之上表面喷灑化學劑或純水廳進行侧或清洗，同 S 表面喷麗化學劑或純水108進行侧或清洗。但 總Γ二接觸塊接觸之表面亦殘留金屬或光阻劑，其形狀與接 鬼一致。致钱刻不完全或清洗不完全而形成污染。、 缺點，一般改用真空吸持之台座。在台座上有真 通至真空泵，使凹槽内形成真空而吸持晶圓。但 飛離ίϊϊϋ有其缺點。在_斷電時真空消失，晶圓勢必 使曰曰=° Χ台座上若有汗染’真空不能形成亦有可能 曰曰Η躭離。此法之另一缺點為設備成本較高。 高壓ίίίί^ί為，靜電吸持晶圓於台座上，在台座下有 且靜電磁场而吸住晶圓，但亦有斷電而損及晶圓， 陷及污染t屬或光_有吸力，致清除不完全而有殘留形成缺 晶圓3全 供能確實爽持晶圓，又能完全侧 因此有或f底清洗光阻之裝置，使製程留有-大漏洞。 晶圓而又==晶圓上之金屬或清洗光阻時能雜夾住 疋王撕去不要之金屬膜，徹底清洗乾淨晶圓上之光 1295831 ._ . ^^— 阻之裝置，以提高製程之可靠性。 【發明内容】 械構造，供—以複數組夾指失持晶圓裝置之機 每次由一έ 上安裝二組以上之夾指’在餘刻或清洗時， 洗。、、且"曰夹持晶圓’以使晶圓之每-部份皆被侧或清 之機的在提供—以複數組夾指夾持晶圓裝置 構啦動，以達輪流夾持晶圓之目的。 成if目的及其他目的，本發明之第—觀點教導一種 ^轉機。以讀組夾指夹持晶圓之裝£，利用二組以上之夹指 irrtgir)在獨總錄晶®，使爛時祕下之金屬 或先侧或清洗*減少殘留，至少包含：—旋轉台座 詈仆興制可/二轴旋轉：供置放晶圓而自晶圓表面上喷灑或預 产，刻或清洗。複數組夹指，每組具有複數個夾 ί圓曰中夾持晶®—段_，俟另一組夾指爽住 二0^si ’ m行_前—組夾指下之金屬或清洗前 七:Ui光阻’再換下一組夾指夾持晶圓，以增加晶圓被 夾持部份曝露於钱刻液之時間。 明之以上及其他目的及優點參考以下之參照圖示及 最佳實施例之說明而更易完全瞭解。 【實施方式】 6 J295831 一—__ 參考第2圖，第2圖顯示依據本發明之一實施例以二組炎 指分階段夾持晶圓之第一階段之示意圖。第2圖(A)為以夾指 將晶圓固持在台座上之頂視圖。晶圓2〇1在蝕刻之前半段係利 用第1組夾指202-1、202-2、202-3、202-4夾住以進行餘刻， 此時夾指下之金屬膜因受夾指202-1、202-2、202-3遮蓋，不 能接觸敍刻液，因而仍留在晶圓2〇1上。 第2圖(B)為沿第1圖B-B，線之剖面圖，晶圖201以機械 手臂置於台座(chuck)204上，台座係可以旋轉之晶圓座，一般 以不锈鋼製造，然後，控制夾指202-1、202-2、202-3、2034 _ 下降以夾住晶圓，夾指202-1、202-2、202-3、203_4係固定在 台座204上，與台座及晶圓一同旋轉，以化學劑206自晶圓表 面喷灑以進行蝕刻。另外第2組夾指203-1、203_2、203-3、 203-4則升起不夾持晶圓，如第2圖(c)所示。夾指亦可令其向 外離開晶圓表面，以利化學劑喷灑向下。第2圖為以夾指 之，觸塊將晶圓固持之頂視圖。晶圓2〇1在蝕刻之前半段係利 用第1組夾指202’-1、202，_2、202，-3、202，-4夾住晶圓第2 圖(E)所示。另外第 2 組夾指 2〇3，-1、203，-2、203，-3、203，-4 則離開晶圓，如第2圖(F)所示。以化學劑206、208自晶圓之 上表面及下表面喷灑以進行蝕刻，此時接觸塊上晶圓之金屬膜 ’因受夾指202’-1、202’-2、202，-3、202，-4遮蓋，不能接觸蝕 刻液，因而仍留在晶圓201上。 請參考第3圖。第3圖係顯示依據本發明之一實施例以二 組3^指分階段夾持晶圓之第二階段之示意圖。第3圖(八)為以 夾指將晶圓固持在台座上之頂視圖。於姓刻一段時間以後，例 如一半之蝕刻時間後，台座204繼續旋轉，第2組夾指203-1、 203-2、203-3、203-4向下夾住晶圓201，再將第i組夾指夾指 升$或離開晶圓表面，再進行後半段之姓刻。以將第一階段蝕 刻時受第1組夾指202-1、202-2、202-3、202-4遮蓋之金屬膜 餘刻去除。第3圖(B)為沿第3圖A-A，線之剖面圖。第3圖(B) 1295831 顯=第1組夾指202-卜202_2、202-3、202_4離開晶圓之情形。 此時化學劑206自晶圓表面喷灑以進行蝕刻以將第一階段蝕 刻時受第1組夾指202-1、202_2、202-3、202_4遮蓋之金屬膜 蝕，去除。而第3圖(C)係沿第3圖(A)之B-B，線之剖面圖，顯 不第2組夾指203-1、203_2、203-3、203_4夾住晶圓201之情 形。以化學劑206自晶圓表面喷灑以進行姓刻。第3圖(D)為 以，指之接觸塊將晶圓固持之頂視圖。晶圓2〇1在蝕刻之後半 丰又係利用第2組夾指203’_1、203，_2、203，-3、203，-4炎住以 進行蝕刻’如第2圖(E)所示。而第一階段受夾指2〇2，_1、 202，_2、202 _3、203’·4 遮蓋之金屬膜，因夾指 2〇2，_1、2〇2，-2、 202 _3、203’·4離開晶圓201而接觸蝕刻液，因而完全將金屬 膜姓刻去除。 =上所述’餘刻時或清洗時係以兩組夾指先後夾持晶圓， 使夹指:之金屬或光阻能被完全蝕刻或移除，可增進製程之完 ，及可靠性。在第-階段清洗完成後，可不停止旋轉而先將第 且九}曰下降夾住晶圓，再升起第1組夾指，如此即不必停止 旋轉，晶圓亦不致飛離。 凊參考第4圖，第4圖係依據本發明之一實施例之旋轉台 座及夾持機構之透視圖。轉盤旋轉軸4〇8内有液體管路414供 應液體如侧液或去離子水(D Lwater)至噴嘴4〇6，以自晶圓’、 ^圖示)下供應液體以進行韻刻或清洗，轉盤4HM立於旋轉軸 之頂α卩’其上有複數組夾指，本例為2組，每組4個夾指， 弟 1 組夹指 402-1，402-2,402-3,402-4，帛 2 組夾指 1^(Η·^’404-3,404-4。夾指之動作由複數組傳動機構使其向 播4ϋι住甜圓’向外張開以離開晶圓，本例以兩組傳動機 ΪΓ ϋ 轉械獅縫对或以電力或 磁力之電動方式推動。 β十5圖’第5圖係依據本發明之一實施例之旋轉台座 及夾持機構之剖賴。朗時顯示不在剖面上之其他夾指 1295831 夹料製成，例如橡膠或娜材料。夹^ 2f寺臂504之另一端以軸承關節別與牽引機^2 氣動咬構貝1i與傳動機構412相連。在傳動機構412受 : =Ϊΐ離開晶圓，同時恢復彈簣508受壓縮而儲存動力。當 i力而5電動力消失時，夹持臂504之一端受恢復彈簧508之 ㈣使夾持臂5G4以夾持臂轉轴鄕為軸而向内扣合 定多卞if ’此時其他組夾指皆向外張開賴晶®，侧至一 王二後換另-組夾指扣合其他組夾指皆向外張開離開晶 而可以完全蝕刻或清洗晶圓之每一部份。 夾持ί Hi第5圖進—步放大之剖面圖。可以更清晰地看到 者本發明之另一實施例，夾指之組數不限於二組，而可為複 、且二例如二組、三組、四組…，使每一組夾持晶圓之時間縮 丑，二下之金屬或光阻受保護之時間較短，蝕刻即較徹底。 、+、士 ϊ ^上較佳之紐實麵之詳述，係輕能更加清楚描 ^作之特徵與精神，而並非以上述所揭露的較佳具體實例 二、十〒發明之範•加以限制。相反的，其目的是希望能涵蓋各 改麦及具相等性的安排於本發明所欲申請之專利範轉内。 【圖式簡單說明】 弟1圖係先釗技術以夾指夾持晶圓之示意圖， 9 伽觀 ΐ圓=顯7^依據本發明之—實施娜二喊持分階段夾持 曰曰W+之第一階段之示意圖。 ^ 2圖(Α)為以夾指將晶圓固持在台座上之頂視圖。 :2圖(Β)為沿第2圖(a)之α_α’線之剖面圖 ^ 2圖(C)為沿第2圖(Α)之Β-Β，線之剖面圖 =2圖(D)為以夾指之接觸塊將晶圓固持之頂視圖。 :2圖(Ε)為沿第2圖(D)之Α-Α’線之剖面圖 装第2圖(F)為沿第2圖(D)之β_Β，線之剖面圖 ^圖係顯示依據本發明之-實施例以二組夾指分階段夾持 日日5[之第二階段之示意圖。 ^ 3圖(Α)為以夾指將晶圓固持在台座上之頂視圖。 f 3圖(Β)為沿第3圖(Α)之Α-Α，線之剖面圖 ^ 3圖(C)為沿第3圖(A)之B-B，線之剖面圖 f 3圖(D)為以夾指之接觸塊將晶圓固持之頂視圖。 ，3圖(E)為沿第3圖(D)之A-A，線之剖面圖 #第3圖(F)為沿第3圖①)之B-B，線之剖面圖 第4圖係依據本發明之一實施例之旋轉台座及夾持機構之 視圖。 处 =^圖係依據本發明之一實施例之旋轉台座及夾持機構之剖 第6圖為第5圖進一步放大之剖面圖。 【主要元件符號說明】 102夾指 104接觸塊 108化學劑或純水 101晶圓 103台座 106化學劑或純水 201晶圓 202-1、202-2、202-3、202-4 夾指 10 .1295831 、 --------· 202，-1、202’-2、202’·3、202’-4 夾指 203-1、203-2、203-3、203-4 夾指 203’-1、203，-2、203，-3、203’·4 夾指 204 台座 206、208化學劑或純水 402-19402-2?402-3?402-4 夾指 4〇4·1，404-2,404-3,404·4 夾指 406 408旋轉軸 410 412-1、412-2 傳動機構 414 502接觸塊 504 506夾持臂轉軸 508 510轴承關節 512 喷嘴 轉盤 液體管路 夾持臂 恢復彈簧 牽引機構8. If there is a conversion in this case, please disclose the chemical formula that best depends on the domain name: IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a wheel that holds a crystal machine with a rotating machine. The photoresist of the wafer, the drug is used to hold the wafer in turn to avoid metal or [previously] lithography in the spin and the chemical process is sprayed on the surface to remove one part of the metal pattern. It is called the tear-off method (^ or "washing agent on the developing crystal UJ. There are many ways to hold the wafer. As shown in the figure i, the ^ technique refers to holding the wafer on the pedestal. Schematic diagram of the above. As shown in Fig. 1), the wafer 101 on the I 7 〇 〇 i 〇 3 is a group of fingers 102-1, 102-2, 102-3, as shown in Fig. 1 (8) Figure (B) shows that the wafer 1G1 is placed on the pedestal 103 along the first _, the water j_, and the finger 102 is held by the finger 102. The finger is movable to clamp or release the wafer. Then, the rotation of the pedestal 1, the wafer, 101 can be held in position without being loosened from the pedestal 1 〇 3, and the spraying chemical or pure water 106 can be etched to tear off the metal pattern on the wafer. Go to the part; or clean it. But once the etching is finished, the metal on the surface of the wafer under the finger 1〇2_卜102-2 '102-3 is pressed by the pinch, the chemical agent can not be contacted, the round surface Metal, which is a residual metal under the finger, and its shape is consistent with the finger. If it is used to clean the developed photoresist, the residual photoresist will form a serious contamination when the wafer enters the furnace, causing defects on the wafer. The other solid type, as shown in Figures 1(C) and (9), utilizes the contact block of the pin and the Xingnan wafer, which can be sprayed from the upper surface of the wafer and the lower surface of the wafer. The wafer is cleaned. $1 (c) is a schematic diagram of the wafer being clamped by the f-block. The wafer (9) is clamped by the contact block 104 of the pinch, =曰, the surface of the circle is sprayed with chemicals or The pure water hall is side or cleaned, and side or clean with the S surface spray chemical or pure water 108. However, the surface of the contact surface of the total contact layer also has metal or photoresist left, and its shape is consistent with the ghost. It is incomplete or incompletely cleaned to form pollution. Disadvantages, generally use the pedestal of vacuum suction. There is a real pass on the pedestal. The air pump makes a vacuum in the groove to hold the wafer. However, there is a disadvantage in flying away from it. The vacuum disappears when the power is off, and the wafer is bound to make 曰曰=°. If there is sweat on the pedestal, the vacuum cannot form. There is also the possibility of separation. Another disadvantage of this method is the high cost of the equipment. High pressure, the electrostatic holding wafer is on the pedestal, and there is an electrostatic field under the pedestal to attract the wafer, but There is also a power outage that damages the wafer, traps the pollution t or light _ has suction, so that the cleaning is not complete and there is residual formation of the missing wafer 3 full power supply does not hold the wafer, but also the full side so there is or The device for cleaning the photoresist at the bottom causes the process to have a large hole. The wafer and the == metal on the wafer or the cleaning photoresist can be mixed with the metal film that is removed by the king, and the wafer is thoroughly cleaned. Light 1295833 ._ . ^^ - Blocking device to improve the reliability of the process. SUMMARY OF THE INVENTION Mechanical construction, for use in a multi-array clip, means that the wafer device is lost. Each time two or more sets of clips are mounted on one turn, and are washed during the remainder or cleaning. , and "曰Clamp the wafer' so that each part of the wafer is provided by the side or the cleaning machine - the wafer holder is clamped by the multi-array clip to achieve the holding of the wafer The purpose of the wafer. For the purpose of the if and other purposes, the first aspect of the present invention teaches a turnaround. The reading of the wafer is used to hold the wafer, and the two or more sets of irrtgir are used in the singular granules to make the metal under the ruin or the flank or cleaning* to reduce the residue, including at least: The pedestal can be used for two-axis rotation: spraying or pre-production, engraving or cleaning from the surface of the wafer for wafer placement. Multiple array clips, each group has a plurality of clips ί 曰 夹持 晶 晶 晶 — — 俟 俟 俟 俟 俟 俟 俟 夹持 夹持 夹持 夹持 夹持 夹持 夹持 夹持 夹持 夹持 夹持 夹持 夹持 夹持 夹持 夹持 夹持 夹持 夹持 夹持 夹持 夹持 夹持 夹持 夹持 夹持 晶Seven: Ui photoresist 'replaces a set of clips to hold the wafer to increase the exposure time of the wafer to the liquid engraving. The above and other objects and advantages will be more fully understood from the following description of the preferred embodiments. [Embodiment] 6 J295831 I-__ Referring to Fig. 2, Fig. 2 is a view showing a first stage of clamping a wafer in stages by two sets of fingers according to an embodiment of the present invention. Figure 2 (A) is a top view of the wafer holding the wafer on the pedestal. The wafer 2〇1 is sandwiched by the first set of fingers 202-1, 202-2, 202-3, and 202-4 in the first half of the etching for the remainder, and the metal film under the finger is clamped. It means that 202-1, 202-2, and 202-3 are covered and cannot contact the engraving liquid, so they remain on the wafer 2〇1. Figure 2 (B) is a cross-sectional view taken along line BB of Figure 1, with the robot 201 placed on a chuck 204 with a robotic arm. The pedestal is a wafer holder that can be rotated, usually made of stainless steel, and then controlled. The clips 202-1, 202-2, 202-3, 2034 _ are lowered to clamp the wafer, and the clips 202-1, 202-2, 202-3, 203_4 are fixed on the pedestal 204, and the pedestal and the wafer Rotating together, a chemical agent 206 is sprayed from the surface of the wafer for etching. In addition, the second group of fingers 203-1, 203_2, 203-3, and 203-4 are raised without holding the wafer, as shown in Fig. 2(c). The clip can also be moved away from the wafer surface to allow the chemical to spray down. Figure 2 is a top view of the wafer held by the contact block. The wafer 2〇1 is sandwiched between the first set of fingers 202'-1, 202, _2, 202, -3, 202, and -4 in the first half of the etch, as shown in Fig. 2(E). In addition, the second group of fingers 2〇3, -1, 203, -2, 203, -3, 203, -4 leaves the wafer as shown in Fig. 2(F). The chemical agents 206, 208 are sprayed from the upper surface and the lower surface of the wafer for etching, and the metal film of the wafer on the contact block is contacted by the fingers 202'-1, 202'-2, 202, -3. , 202, -4 covers, can not contact the etching liquid, and thus remains on the wafer 201. Please refer to Figure 3. Figure 3 is a schematic diagram showing the second stage of wafer clamping in stages by two sets of 3^ fingers in accordance with one embodiment of the present invention. Figure 3 (8) is a top view of the wafer holding the wafer on the pedestal. After a period of time after the surname, for example, after half of the etching time, the pedestal 204 continues to rotate, and the second set of fingers 203-1, 203-2, 203-3, 203-4 sandwiches the wafer 201 downward, and then The i-group clip refers to the rise or left of the wafer surface, and then the second half of the last name. The metal film covered by the first set of fingers 202-1, 202-2, 202-3, 202-4 during the first stage etching is removed. Fig. 3(B) is a cross-sectional view taken along line A-A of Fig. 3. Fig. 3(B) 1295831 Display = the case where the first group of fingers 202-b 202_2, 202-3, 202_4 leave the wafer. At this time, the chemical agent 206 is sprayed from the surface of the wafer for etching to remove the metal film which is covered by the first group of fingers 202-1, 202_2, 202-3, and 202_4 during the first etching. Further, Fig. 3(C) is a cross-sectional view taken along line B-B of Fig. 3(A), showing that the second group of fingers 203-1, 203_2, 203-3, and 203_4 sandwich the wafer 201. The chemical agent 206 is sprayed from the surface of the wafer for the last name. Figure 3 (D) is a top view of the contact block holding the wafer. The wafer 2〇1 is etched after the etching by using the second set of fingers 203'_1, 203, _2, 203, -3, 203, -4 to etch" as shown in Fig. 2(E) . In the first stage, the metal film covered by the clamps 2〇2,_1, 202,_2, 202 _3, 203'·4 is clamped by 2〇2,_1,2〇2,-2,202_3,203' 4 leaves the wafer 201 and contacts the etching liquid, thereby completely removing the metal film. In the above-mentioned “remaining time or cleaning, the wafer is held by two sets of fingers, so that the metal or photoresist of the finger can be completely etched or removed, which can improve the process and reliability. After the first-stage cleaning is completed, the first and second}曰 can be clamped to the wafer without stopping the rotation, and then the first group of fingers can be raised, so that the wafer does not fly away without stopping the rotation. Referring to Figure 4, there is shown a perspective view of a rotating pedestal and a clamping mechanism in accordance with an embodiment of the present invention. A liquid line 414 is provided in the rotating shaft 4〇8 of the turntable to supply a liquid such as side liquid or deionized water (D Lwater) to the nozzle 4〇6 to supply liquid from the wafer ', ^ illustration) for rhyme or cleaning. The turntable 4HM stands on the top of the rotating shaft α卩' with a complex array of fingers, in this case 2 groups, each group of 4 fingers, the brother 1 group refers to 402-1, 402-2, 402-3, 402-4,帛 2 group of fingers 1 ^ (Η · ^ '404-3, 404-4. The action of the finger is moved by the complex array transmission mechanism to the broadcast 4 ϋ live sweet circle to leave the wafer, this example is two groups The transmission ΪΓ ϋ ϋ 狮 狮 或 或 或 或 或 β β β β β β β β β β β β β β β β β β β β β β β β β β β β β β β β β β β β β β β β The other clips on the section are made of 1295831 clamps, such as rubber or Na. The other end of the clamp arm 2b is connected to the traction mechanism 2 and the transmission mechanism 412 by the bearing joints. 412 is subjected to: = Ϊΐ leaving the wafer while the recovery magazine 508 is compressed to store power. When i force and 5 electric power disappears, one end of the clamping arm 504 is restored. The re-spring 508 (4) causes the clamping arm 5G4 to buckle inwardly with the clamping arm shaft axis as the axis. At this time, the other group of fingers are outwardly opened to the Lai Jing®, and the side is to the second king. Change the other-group clips and snap the other sets of clips to open outwards and leave the crystals completely to etch or clean each part of the wafer. Clamp ί Hi Figure 5 Step-by-step enlargement. It is clear to the reader that another embodiment of the present invention, the number of the fingers is not limited to two groups, but may be complex, and two, for example, two groups, three groups, four groups, ... so that each group holds the wafer Time is ugly, the time for the second metal or photoresist is protected, and the etching is more thorough. The details of the better new surface of the +, gentry are better understood by the lighter. The spirit is not limited by the preferred embodiment 2 and the tenth invention disclosed above. On the contrary, the purpose is to cover the various patents that are intended to be applied in the present invention. Fan to the inside. [Simple diagram of the diagram] The brother 1 is a schematic diagram of the technique of clamping the wafer with the first finger, 9 伽观ΐ圆=显7^ According to the present invention, a schematic diagram of the first stage of holding the phase-clamping 曰曰W+ by Na 2 is carried out. ^ 2 (Α) is a top view of holding the wafer on the pedestal by means of a finger. : 2 (Β) For the section along the α_α' line of Fig. 2(a), Fig. 2 (C) is the Β-Β along the second figure (Α), the sectional view of the line = 2 (D) is the contact with the finger The top view of the block holding the wafer. : 2 (Ε) is the cross-sectional view of the Α-Α' line along the second figure (D). Figure 2 (F) is the β_Β along the second figure (D). The cross-sectional view of the line shows a schematic diagram of the second stage of the day-to-day clamping of the two sets of fingers in accordance with the embodiment of the present invention. ^ 3 Figure (Α) is the top view of the wafer holding the wafer on the pedestal. f 3 (Β) is the Α-Α along the 3rd (Α), the cross-sectional view of the line ^ 3 (C) is the BB along the 3rd (A), the cross-sectional view of the line f 3 (D) A top view for holding the wafer with the contact block of the clip. 3 (E) is the AA along the 3rd (D), the cross-sectional view of the line # 3 (F) is the BB along the 3rd Figure 1), the cross-sectional view of the line 4 is in accordance with the present invention A view of the rotating pedestal and the clamping mechanism of an embodiment. Fig. 6 is a cross-sectional view showing a further enlarged view of Fig. 5, showing a rotary pedestal and a clamping mechanism according to an embodiment of the present invention. [Main component symbol description] 102 pin finger 104 contact block 108 chemical agent or pure water 101 wafer 103 pedestal 106 chemical agent or pure water 201 wafer 202-1, 202-2, 202-3, 202-4 pin finger 10 .1295831 , --------· 202,-1,202'-2,202'·3,202'-4 pin finger 203-1, 203-2, 203-3, 203-4 pinch 203'-1, 203, -2, 203, -3, 203'·4 pin finger 204 pedestal 206, 208 chemical or pure water 402-19402-2? 402-3? 402-4 pin finger 4〇4· 1,404-2,404-3,404·4 pinch 406 408 rotating shaft 410 412-1, 412-2 transmission mechanism 414 502 contact block 504 506 clamping arm shaft 508 510 bearing joint 512 nozzle turntable liquid line clamping arm recovery spring Traction mechanism
1111