1295423 九、發明說明： 【發明所屬之技術領域】 .本發明係關於一種散熱裝置，尤指一種可調節風流量 之散熱裝置。 【先前技術】 隨著積體電路製造技術日新月異之發展，電子元件朝 著更快之運算速度邁進。由於電子元件之運算速度愈來愈 快，電子元件在高速運作時伴隨產生之熱量亦愈來愈多， 若電子元件産生之熱量不被及時導出，會導致電子元件之 溫度持續升高，進而影響其運作之穩定性，嚴重時會使電 子元件燒毀。爲此，業界通常在産生熱量較多之電子元件 頂面裝設一鋁擠型散熱器，再透過一系統風扇協助排出熱 量。 請參閱圖1，習知技術鋁擠型散熱器10包括一方形底 座12及複數自該底座12頂部延伸之散熱鰭片。當該散 熱器10裝設於一電腦主機板16之某一電子元件18上時， 該電子元件18，即熱源便位於該底座12底部之中央。 請繼續參閱圖2,於該散熱器1〇 一定距離處設置一風 扇（圖未示）協助散熱時，該風扇産生之風流包括流經該 散熱器10之散熱鰭片14之第一風流21、流經該散熱器1〇 之底部與該主機板16之間之第二風流22及流經該主機板 16與機殼（圖未示）之間可用於該主機板16底部散熱之 第三風流23。 該第一風流21及該第二風流22流經該散熱器1〇， 12954231295423 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device capable of adjusting a wind flow. [Prior Art] With the rapid development of integrated circuit manufacturing technology, electronic components are moving toward faster computing speeds. As the computing speed of electronic components is getting faster and faster, the heat generated by electronic components is increasing with high speed. If the heat generated by electronic components is not exported in time, the temperature of the electronic components will continue to rise, which will affect the temperature. The stability of its operation will cause electronic components to burn out in severe cases. To this end, the industry usually installs an aluminum extruded radiator on the top surface of the electronic component that generates more heat, and then assists in discharging heat through a system fan. Referring to FIG. 1, the prior art aluminum extruded heat sink 10 includes a square base 12 and a plurality of heat radiating fins extending from the top of the base 12. When the heat sink 10 is mounted on an electronic component 18 of a computer motherboard 16, the electronic component 18, that is, the heat source, is located at the center of the bottom of the base 12. Referring to FIG. 2, when a fan (not shown) is disposed at a certain distance from the heat sink to assist heat dissipation, the wind flow generated by the fan includes the first airflow 21 flowing through the heat dissipation fins 14 of the heat sink 10. a second airflow 22 flowing between the bottom of the heat sink 1 and the motherboard 16 and a third flow between the motherboard 16 and the casing (not shown) for heat dissipation at the bottom of the motherboard 16 Merry 23 The first airflow 21 and the second windflow 22 flow through the heat sink 1〇, 1295423
1 I 惟，該散熱器10不能根據系統整體之散熱要求進行調節， 比如有時需要流經該等散熱鰭片14之第一風流21大一些 以滿足該電子元件18在工作時需要較大風流散熱之需 求’而有時又需要提高流經該散熱^ 1{)之底部與該主機板 =之間之第二風流22以滿足該電子元件Μ工作時產生熱 里不大而該散熱器10之底部與該主機板16之間之電子元 件需要更大風流散熱之需求。 因是，實有必要對習知之散熱裝置進行改良，以消除 上述缺失。 【發明内容】 鑒於以上内谷，有必要提供一種可對流經之風流量進 行調節之散熱裝置。 …一種散熱裝置，包括一散熱器，該散熱器包括一底座 及複數自胃底座上表面向±延伸之散熱鰭#，該散熱裝置 還包括一裝設於該底座面向風源之一側端面之調節件，該 調2件包括一裝設部、一第一擋風部及一第二擋風部，該 裝叹。卩裝ό又於該侧端面，該第一擔風部位於該裝設部之上 部，該第二擋風部位於該裝設部之下部，該調節件可透過 調卽該苐擔風部及第一擔風部相對於該底座之位置來調 節進入該等散熱鰭片之風流量之大小。 一種散熱裝置，包括一散熱器，該散熱器包括一底座 及複數自該底座上表面向上延伸之散熱鰭片，該散熱裝置 還包括一裝設於該底座面向風源之一側端面之調節件，該 調節件包括一設於該側端面之裝設部及設於該裝設部之一 1295423 擋風部，該調節件可透過調節該擔風部相對於該底座之位 置來調節進入該等散熱鰭片之風流量之大小 - J =技術，該散熱裝置之調節件可根據需要阻擋 "向該4政熱韓片底部或該底座下表面以下部分之風流， 被阻擋之風流轉而流向其他風道，達到調節風流從而滿足 系統整體散熱需求之目的。 / 【實施方式】 ==3’本發明散熱裝置之第一較佳實施方式包 括-繼及一調節件36’該散熱器包括一底座％及複 數自該底座32上表面向上延伸之散熱鰭片％。 該調節件36解板結構，該平板結構 設部362,上部作爲一笙―垆门如。^ f场衣 乍爲第一擋風部364,下部作爲一第二擋 風。Ρ 366。該調節件36設置於該底座％面向風源之一侧 =。該”件36之長度與該侧端面之長度相等，該調節 牛之見度可根據實際需要設定。該側端面設至少兩鎖固 孔322 ’該調節# 36之裝設部362對應該側端面之鎖固孔 322設開槽368，每—開槽368之延伸方向與該 34之延伸方向相同。安裝時，至少兩螺絲ι〇〇分別穿 調即件36之開们68並螺鎖於該側端面對應之鎖固孔奶 中，從而將該調節件36固定於該底座32。該鎖固孔Μ] _組成—滑動結構，該滑動結構可將該 調即件36岣動裝設於該側端面，該滑動結構還可由其他方 式實現，例如，該側端面設兩滑槽（圖未示），該兩滑 k伸方向與該等散熱鰭片34之延伸方向相同，該調節件 1295423 36對應該側端面之滑槽設兩具彈性 節件36之凸部可滑動， 夢 該散熱裝置在使用時固定 電子；Γ示)上，該… 明散熱褒置-定距離處用於散熱時，若在不、=置於本發 _速之情況下，需要增大流經該等散執讀片 文該^扇轉 則可旋鬆固定該調節件36 之風流量時’ 3_第二擋風部366 (見圖螺3 骨動該調節件 具體超出部分面積之大小可根據實超際mi32之底部’ 旋緊該螺絲_使該_牛36’然後 瞎兮Jif戶立丄^ 疋於該底座32。此 風二經該底座32與該主機板3δ之間之部分 風机被該第二擋風部366阻播而流向 ： 而使得流經該等散熱鯖片34之風流量增大。…韓片34,從 ==5’^要增^經該底座32與該主機板38 := 心時，可旋鬆固定該調節件36之螺絲100，向 等件36使該第一擋風部364 (見圖3)擋住該 部之部分面積’具體擋住部分面積之大小 ^據實際需—要進行調節，然後旋緊該螺絲1〇〇使該調節 _疋於該底座32。此時該風❹生之流經該等 ^、、|鰭片34底部之部分風流被該第一撐風部364阻撐而流 °該底座32與該主機板38之間’從而使得流經該底座％ /、該主機板38之間之風流量增大。 一 1295423 本么明散熱裝置之第一較佳實施方式之該調節件36 可根據需要在該底座32上進行上下調節，使該調節件36 在該等散熱鰭片34之底部與該底座32下表面以下之位置 之間移動，以此可阻擋流經該等散熱鰭片34底部之部分風 流或流經該底座32與該主機板38之間之部分風流，增大 流向^他風道之風流量，達到對風流量進行調節之目的。 、請參閱圖6及圖7,本發明散熱裝置之第二較佳實施 方式與第—較佳實财式㈣僅在於調節件之結構，本發 明散熱裝置之第二較佳實施方式之調節件包括—裝設部 4〇、一第一擋風部42及一第二擋風部 該裝設部40透過兩螺絲46鎖固於該散熱器之底座32 (見圖3)之該侧端面。該裝設部4〇之長度與該側端面之 長度相等，該裝設部40之寬度與該侧端面之寬度相等。該 第一擋風部42及該第二擋風部44分別透過一扭簧48及一 轉軸49與該裝設部40配合，該第一擋風部42及該第二擋 風部44之長度與該裝設部40之長度相等，該第一撐風; 42及該第二擋風部44之寬度之和不大於該裝設部4〇之寬 度。該裝設部40之中部設有一可轉動之τ字形鎖固件％。 在不需要對進入該等散熱鰭片34之風流進行調節時，該第 一擋風部42及該第二擋風部44折疊後貼於該裝設部4〇 上，然後透過該鎖固件50將該第一擋風部42及該第二擋 風部44鎖固於該裝設部40 〇 田 請參閱圖8’若需要對進入該等散熱鰭片％ (見圖 之風流進行調節，則旋開該鎖固件5〇,使該第二擋風部料 1295423 在該扭簧48之回復力作用下翻轉到該裝設部40之下部（但 該第-擋風部42依然被該鎖固件5〇鎖固於該裝設部 〇 ’此時風扇產生之流經該底座32(見圖3)與該主機板 3δ (見圖3)之間之部分風流被該第二擋風部⑷且撞而流 2等散熱鰭片34’從而使得流經該等散熱鰭片％之風 ^里增大。同理可操作該第—擋風部42阻擋流經該等散熱 片34底之部分風流而流向該底座％與該主機板％ 之間。 =上所述，本發㈣合發明專利要件，菱録提出專 ^淮，以上所述者僅為本發明之較佳實施方式，舉 凡本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化’皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係習知技術散熱器、發熱電子元件及主機板之主 視圖。 圖2係習知技術散熱器、發熱電子元件及主機板之右 侧視圖。 圖3係本發明散熱裝置之第一較佳實施方式及主機板 之部分立體分解圖。 圖4係本發明散熱裝置之第一較佳實施方式及主機板 之一使用狀態圖。 圖5係本發明散熱裝置之第一較佳實施方式及主機板 之另一使用狀態圖。 圖6係本發明散熱裝置之第二較佳實施方式之調節件 1295423 之立體圖。 圖7係圖6中VII部分之放大圖。 圖8係本發明散熱裝置之第二較佳實施方式之調節件 ♦ 之一使用狀態圖。 【主要元件符號說明】 [習知] 散熱器 10 底座 12 散熱鰭片 14 主機板 16 電子元件 18 第一風流 21 第二風流 22 第三風流 23 [本發明] 底座 32 鎖固iL 322 散熱鰭片 34 調節件 36 裝設部 362 、 40 第一擋風部 364 、 42 第二擋風部 366 ^ 44 開槽 368 主機板 38 螺絲 46 、 100 扭簧 48 轉軸 49 鎖固件 50 111 I, however, the heat sink 10 cannot be adjusted according to the overall heat dissipation requirements of the system. For example, the first airflow 21 flowing through the heat dissipation fins 14 is sometimes required to be larger to meet the large airflow of the electronic component 18 during operation. The need for heat dissipation' and sometimes the need to increase the second airflow 22 flowing between the bottom of the heat sink and the motherboard to meet the heat generated by the electronic component when the electronic component is not working. The electronic components between the bottom and the motherboard 16 require greater airflow cooling. Therefore, it is necessary to improve the conventional heat sink to eliminate the above missing. SUMMARY OF THE INVENTION In view of the above inner valleys, it is necessary to provide a heat sink that can adjust the flow rate of the wind flowing therethrough. A heat dissipating device includes a heat sink, the heat sink includes a base and a plurality of heat dissipating fins extending from the upper surface of the stomach base to the ±, the heat dissipating device further includes a side surface of the base facing the wind source The adjusting member comprises a mounting portion, a first wind blocking portion and a second wind blocking portion. The first wind support portion is located at an upper portion of the mounting portion, and the second wind shield portion is located at a lower portion of the mounting portion, and the adjusting member is configured to transmit the wind and the wind portion The position of the first wind-bearing portion relative to the base adjusts the amount of wind flow entering the fins. A heat dissipating device includes a heat sink, the heat sink includes a base and a plurality of heat dissipating fins extending upward from an upper surface of the base, and the heat dissipating device further includes an adjusting member mounted on a side end surface of the base facing the wind source The adjusting member includes a mounting portion disposed on the side end surface and a windshield portion disposed at one of the mounting portions 1295423. The adjusting member can adjust the position of the wind supporting portion relative to the base to adjust the access to the adjusting portion. The amount of wind flow of the fins - J = technology, the adjustment of the heat sink can block the flow of the bottom of the 4th hot Korean film or the lower part of the base as needed, and the blocked wind flows to Other air ducts achieve the purpose of regulating the airflow to meet the overall heat dissipation requirements of the system. The first preferred embodiment of the heat sink of the present invention includes a relay member 36 %. The adjusting member 36 is provided with a plate structure, and the flat plate is provided with a portion 362, and the upper portion serves as a door. ^ f field clothing is the first windshield 364, and the lower part is a second windshield. Ρ 366. The adjusting member 36 is disposed on the side of the base % facing the wind source. The length of the piece 36 is equal to the length of the side end face, and the visibility of the cow can be set according to actual needs. The side end face is provided with at least two locking holes 322 'the mounting portion 362 of the adjusting # 36 corresponds to the side end face The locking hole 322 is provided with a slot 368, and the extending direction of each slot 368 is the same as the extending direction of the 34. At the time of installation, at least two screws 穿 are respectively inserted into the opening 68 of the member 36 and are screwed to the The side end surface corresponds to the locking hole milk, thereby fixing the adjusting member 36 to the base 32. The locking hole Μ _ constituting a sliding structure, the sliding structure can be mounted on the adjusting member 36 The sliding end structure may be implemented by other methods. For example, the side end surface is provided with two sliding grooves (not shown), and the two sliding k-directions are the same as the extending direction of the heat-dissipating fins 34. The adjusting member 1295423 36 The convex portion of the two elastic members 36 is slidably disposed corresponding to the sliding groove of the side end surface, and it is dreamed that the heat dissipating device fixes the electronic device during use; the display is provided, and the heat dissipating device is disposed at a fixed distance for heat dissipation. If it is not, = placed in the case of the current _ speed, you need to increase the flow through these Reading the piece of text, the fan can be rotated to fix the wind flow of the adjusting member 36. 3_The second windshield 366 (see Figure 3, the bones of the adjusting member are specifically beyond the size of the area can be based on the actual super The bottom of the mi32 'tighten the screw _ so that the _ cow 36' and then 瞎兮Jif 立 丄 ^ 疋 on the base 32. This wind two through the base 32 and the main plate 3δ between the fan is The second windshield 366 blocks the flow and flows: the wind flow rate flowing through the heat dissipation fins 34 is increased.... The Korean film 34, from the ==5'^, is increased by the base 32 and the motherboard 38. When the heart is closed, the screw 100 for fixing the adjusting member 36 can be loosened, and the first windshield portion 364 (see FIG. 3) is blocked from the portion 36 to block the area of the portion to specifically block the size of the portion. Needed - to adjust, and then tighten the screw 1 〇〇 to make the adjustment 疋 to the base 32. At this time, the wind is flowing through the bottom part of the fins 34, the wind flow is the first The air holding portion 364 is restrained and flows between the base 32 and the main board 38 so that the air flow rate between the main board 38 and the base unit 38 is increased. The adjusting member 36 of the first preferred embodiment of the heat dissipating device can be adjusted up and down on the base 32 as needed, so that the adjusting member 36 is below the bottom surface of the heat dissipating fins 34 and below the lower surface of the base 32. Moving between the positions, thereby blocking part of the wind flow flowing through the bottom of the heat dissipation fins 34 or flowing through a portion of the airflow between the base 32 and the motherboard 38, increasing the flow of air to the air duct. The purpose of adjusting the wind flow is as follows. Referring to FIG. 6 and FIG. 7 , the second preferred embodiment of the heat dissipating device of the present invention and the fourth preferred embodiment (four) are only the structure of the adjusting member, and the heat dissipating device of the present invention The adjusting member of the second preferred embodiment includes a mounting portion 4 , a first wind blocking portion 42 and a second wind blocking portion. The mounting portion 40 is locked to the base 32 of the heat sink via two screws 46 ( See the side end face of Figure 3). The length of the mounting portion 4 is equal to the length of the side end surface, and the width of the mounting portion 40 is equal to the width of the side end surface. The first windshield portion 42 and the second windshield portion 44 are respectively engaged with the mounting portion 40 through a torsion spring 48 and a rotating shaft 49. The lengths of the first wind blocking portion 42 and the second wind blocking portion 44 The length of the first plenum 42 and the second wind dam 44 is not greater than the width of the mounting portion 4, as the length of the mounting portion 40 is equal. A portion of the mounting portion 40 is provided with a rotatable τ-shaped fastener. The first windshield portion 42 and the second wind shield portion 44 are folded and attached to the mounting portion 4A, and then passed through the locking member 50, when the airflow entering the heat dissipating fins 34 is not required to be adjusted. The first windshield portion 42 and the second windshield portion 44 are locked to the mounting portion 40. Please refer to FIG. 8 'If it is necessary to adjust the flow of the fins (see the wind flow of the figure) Unscrewing the locking member 5〇, causing the second windshield material 1295423 to be flipped under the restoring force of the torsion spring 48 to the lower portion of the mounting portion 40 (but the first windshield portion 42 is still retained by the locking member 5〇 is locked to the mounting portion 〇' at this time, a part of the wind flow generated by the fan between the base 32 (see FIG. 3) and the main board 3δ (see FIG. 3) is the second windshield (4) and The heat-dissipating fins 34' are caused to flow, so that the wind flowing through the heat-dissipating fins is increased. Similarly, the first wind-shielding portion 42 can be operated to block a part of the airflow flowing through the bottoms of the heat-dissipating fins 34. And flow to the base % and the motherboard %. = above, the hair (four) and the invention patent requirements, the legendary introduction of the Huaihua, the above is only the comparison of the present invention In the preferred embodiment, the equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. [Simplified Schematic] FIG. 1 is a conventional heat sink, Figure 2 is a right side view of a conventional heat sink, a heat-generating electronic component, and a motherboard. Figure 3 is a first preferred embodiment of the heat sink of the present invention and a partial perspective of the motherboard Fig. 4 is a view showing a first preferred embodiment of the heat sink of the present invention and a state of use of the motherboard. Fig. 5 is a view showing a first preferred embodiment of the heat sink of the present invention and another use state of the motherboard. Figure 6 is a perspective view of the adjusting member 1295423 of the second preferred embodiment of the heat dissipating device of the present invention. Figure 7 is an enlarged view of a portion VII of Figure 6. Figure 8 is an adjusting member of the second preferred embodiment of the heat dissipating device of the present invention. ♦ One of the state diagrams. [Main component symbol description] [General] Heat sink 10 Base 12 Heat sink fins 14 Mother board 16 Electronic components 18 First air flow 21 Second air flow 22 Airflow 23 [Invention] Base 32 Locking iL 322 Heat sink fin 34 Adjusting member 36 Mounting portion 362, 40 First windshield portion 364, 42 Second windshield portion 366 ^ 44 Slot 368 Motherboard 38 Screw 46, 100 torsion spring 48 shaft 49 lock 50 11