1293412 九、發明說明： 【發明所屬之技術領域】 種應用於電子元件之 本發明係關於一種散熱裝置，尤指_ 散熱裝置。 【先前技術】 隨著電腦系統越來越小型化，扨办& a ^ ~ ^ &1293412 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a heat dissipating device, particularly a heat dissipating device. [Prior Art] With the increasing miniaturization of computer systems, & a ^ ~ ^ &
内雜亂無章，不易於整理，另一 丨通思擺孜，一方面會使系統 一方面會影響系統之流場， 影響系統散熱。 【發明内容】 有鑒於此，有必要提供一種能既能散熱又可整理電腦 殼體内導線之散熱裝置。 一種散熱裝置，置於一電腦殼體中，該電腦殼體内設 籲有複數導線，該散熱裝置包括一散熱器組合及置於該散熱 -器組合上之一導風罩，該導風罩上形成有一整理及束缚導 線之理線結構。 與現有技術相比，該散熱裝置不僅可以對電腦殼體内之 發熱電子元件進行散熱，而且因為該散熱裝置具有理線結構 之導風罩’故還可對電腦殼體内之導線進行整理及束缚。 【實施方式】 睛參閱圖1及圖2，揭露本發明散熱裝置之較佳實施 命J胃政熱裝置安裝於電腦殼體（圖未示）内之電路板1〇上 6 1293412 •用以對其上之中央處理器12等發熱電子元件進行散数。複 數電源線20自電腦殼體之電源盒（圖未示）延伸而出電性連 接至殼體内之其他電子裝置上。肖散熱裝置包括—散熱器 組。、一安裝於散熱器組合一侧之風扇5〇及一導風罩。 其中該風扇罩60不僅可將風扇％産生的風有效導向散熱 益組合，而且還兼具理線之功能，可以將電腦殼體中雜亂 無旱的電源線20整理且束缚到該散熱裝置上。 Φ 該散熱器組合安裝於電路板10上，其包括一主散熱器 30、一安裝於主散熱器3〇上之輔助散熱器4〇。該主散熱器 30包括一與中央處理器12接觸之吸熱板32及自吸熱板％ 向上延伸之複數散熱鰭片34。該吸熱板32自其四角落分別 向外延伸设有四凸耳320。四扣具70穿過相應凸耳320同 置於電路板10背面之背板（圖未示）相螺合，從而使吸熱板 32與中央處理器12緊密貼合。辅助散熱器4〇為一鋁擠型 政熱器40，其包括一底板42及自底板42向上延伸設置之 籲複數散熱籍片44。該底板42平行於吸熱板32且置於主散 熱器30散熱鰭片34之頂部。輔助散熱器40相對兩侧之散 熱鰭片44上設有孔440。 一對平行散熱裝置80安裝於散熱器組合上，每一散熱 裝置80大致呈U形設置，其包括一吸熱段82、一平行於 吸熱段82之放熱段84及連接吸熱段82與放熱段84之絕 熱段83。吸熱段82夾置於吸熱板32與散熱鰭片34底部之 間，如此吸熱段82和吸熱板32連接，吸熱板32吸收之熱量 可迅速傳遞至吸熱段82。放熱段84夾置於底板42及散熱 7 -1293412 •鰭片34頂部之間，如此由吸熱段82吸收之熱量通過放熱 段84可迅速傳遞至主散熱器30散熱鰭片34之頂部及輔助 散熱器40之散熱鰭片44上。 風扇50安裝於散熱器組合上且朝向散熱鰭片34, 44 之前側面，以便將風扇50産生之氣流吹向散熱鰭片34, 44 之間的通道中。通道沿散熱鰭片34，44從前到後的方向延 伸設置。風扇50呈方形設置，其具有一頂部52及四角落 54。其中，頂部52高於輔助散熱器40散熱鰭片44之頂部。 •每一角落54設有一開孔540。 該較佳實施例中的導風罩60包括一安裝板62、一平行 於安裝板62的導向板64及一傾斜連接安裝板62及導向板 64的擋板63，即該擋板63相對於安裝板62具有一傾斜角 度。該安裝板62置於輔助散熱器40之散熱鰭片44頂部， 一對扣片620自安裝板62之相對二側緣垂直向下延伸設 置。每一扣片620上設有定位孔622，與輔助散熱器40上 鲁的孔440相對應，螺釘90穿過該等定位孔622進而與輔助 散熱器40上的孔440相螺合從而將安裝板62安裝於輔助 散熱器40的頂部。一理線結構形成於該安裝板62上，用 以整理及束缚殼體内潼亂的電源線20。該理線結構包括一 對拱橋624,該拱橋624自安裝板62上一體衝壓凸伸而出， 以使安裝板62相應拱橋624位置處形成一孔洞，拱橋624 朝遠離輔助散熱器40散熱鰭片44的頂部方向凸出，以使 拱橋624與其位置下方之散熱鰭片44頂部之間形成一收容 空間625。可以理解地，拱橋624亦可採用其他例如焊接方式焊接 8 1293412 •於安裝板62上，如此拱橋624與其下方之安裝板62之間形成所述收 容空間625，即安裝板62上相應拱橋624之位置處沒有孔 洞。每一拱橋624具有二相對端與安裝板62連接。導向板 64之位置高於安裝板62，其朝向風扇50 —側之相對兩端 垂直向下形成有片體640,每一片體640上形成有一具内螺 紋之凸柱642,該凸柱642與風扇50的靠近頂部52的開孔 540相對應，螺釘92穿過風扇50之開孔540進而與導風罩 60導向板64的凸柱642相螺合，另外該導風罩60結合一 *對風扇固定架96共同將風扇50安裝置該散熱器組合上。 由於風扇60頂部高於散熱器組合，導風罩60可阻擋 風扇50産生的部分氣流從散熱器鰭片44頂部泄漏，從而 使風扇50産生的氣流集中吹向散熱器組合的散熱鰭片 34，44以提高散熱裝置的散熱效率；另外，導風罩60上形 成有拱橋624，該拱橋624可用以整理殼體内之電源線20。 使用時，一綁帶15將雜亂的電源線20整理且收集起來，綁 ⑩帶15穿過收容空間625,再將綁帶15的末端打結，從而綁 帶15將電源線20束缚於收攬在一起且置於該導風罩60之 安裝板62上。 請參閱圖3，為本發明之第二實施例，其揭示一散熱裝 置，該散熱裝置之結構與較佳實施例中散熱裝置相似，不 同點僅在於第二實施例之拱橋626取代了較佳實施例中之 拱橋624。該拱橋626具有二相對端，其中一端與安裝板 62連接，另一端與安裝板62斷開以形成一缺口，電源線 20可直接從該缺口進入而卡制於拱橋626下方的收容空間 9 '1293412 ’625 中。 本發明之散熱裝置不僅可以對電腦殼體中之發熱電子 元件進行散熱，而且可以整理及束缚殼體中凌亂的電源線 2〇 ’使電腦殼體内之空間乾淨、整潔且利於散熱。 矣示上所述’本發明確已符合發明專利之要件，遂依法 提出專利申請。惟，以上所述者僅為本發明之較佳實施例， 自不邊以此限制本案之申請專利範圍。舉凡熟悉本案技蔽 隹之人士援依本發明之精神所作之等效修飾或變化，皆應涵 蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係本發明散熱裝置較佳實施例之部分組裝圖。 圖2係圖1不同角度之組裝圖。 圖3係本發明散熱裝置第二實施例之組裝圖。 【主要元件符號說明】 電路板 10 中央處理器 12 綁帶 15 電源線 20 主散熱器 30 吸熱板 32 凸耳 320 散熱鰭片 34 > 44 辅助散熱器 40 底板 42 孔 440 風扇 50 頂部 52 角落 54 開孔 540 導風罩 60 安裝板 62 扣片 620 1293412 定位孔 622 拱橋 624 、 626 收容空間 625 播板 63 導向板 64 片體 640 凸柱 642 数管 80 吸熱段 82 絕熱段 83 放熱段 84 螺釘 90、92 11The inside is chaotic, not easy to organize, and the other is controversial. On the one hand, the system will affect the flow field of the system and affect the heat dissipation of the system. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat sink capable of dissipating heat and arranging wires in a computer casing. A heat dissipating device is disposed in a computer casing, wherein the computer casing is provided with a plurality of wires, and the heat dissipating device comprises a heat sink assembly and an air hood disposed on the heat sink assembly, the air hood A wire structure is formed on which the wires are arranged and bound. Compared with the prior art, the heat dissipating device can not only dissipate heat from the heat-generating electronic components in the computer casing, but also can arrange the wires in the computer casing because the heat dissipating device has the air guiding structure of the cable structure. Bondage. [Embodiment] Referring to FIG. 1 and FIG. 2, a preferred embodiment of the heat dissipating device of the present invention is disclosed. The JV administration device is mounted on a circuit board 1 in a computer casing (not shown). The heat generating electronic components such as the central processing unit 12 are scattered. The plurality of power cords 20 extend from the power box (not shown) of the computer housing and are electrically connected to other electronic devices in the housing. The radiant heat sink includes a heat sink set. A fan 5 安装 and an air hood mounted on one side of the heat sink assembly. The fan cover 60 can not only effectively guide the wind generated by the fan to the heat dissipation combination, but also has the function of the cable management, and can arrange and bind the messy power cord 20 in the computer casing to the heat sink. Φ The heat sink assembly is mounted on the circuit board 10 and includes a main heat sink 30 and an auxiliary heat sink 4〇 mounted on the main heat sink 3〇. The main heat sink 30 includes a heat absorbing plate 32 in contact with the central processing unit 12 and a plurality of heat radiating fins 34 extending upward from the heat absorbing plate. The heat absorbing plate 32 has four lugs 320 extending outward from the four corners thereof. The four clips 70 are screwed through the corresponding lugs 320 to the back plate (not shown) on the back of the circuit board 10, so that the heat absorbing plates 32 are closely attached to the central processing unit 12. The auxiliary heat sink 4 is an aluminum extrusion type heat exchanger 40, which includes a bottom plate 42 and a plurality of heat-dissipating heat sinks 44 extending upward from the bottom plate 42. The bottom plate 42 is parallel to the heat absorbing plate 32 and is placed on top of the heat sink fins 34 of the main heat sink 30. Holes 440 are formed in the heat radiating fins 44 on opposite sides of the auxiliary heat sink 40. A pair of parallel heat sinks 80 are mounted on the heat sink assembly. Each heat sink 80 is generally U-shaped and includes a heat absorption section 82, a heat release section 84 parallel to the heat absorption section 82, and a heat absorption section 82 and a heat release section 84. The adiabatic section 83. The heat absorbing section 82 is interposed between the heat absorbing plate 32 and the bottom of the heat radiating fins 34. Thus, the heat absorbing section 82 is connected to the heat absorbing plate 32, and the heat absorbed by the heat absorbing plate 32 can be quickly transferred to the heat absorbing section 82. The heat release section 84 is interposed between the bottom plate 42 and the heat dissipation 7 -1293412 • the top of the fin 34, so that the heat absorbed by the heat absorption section 82 can be quickly transmitted to the top of the heat sink fin 34 of the main heat sink 30 through the heat release section 84 and assist heat dissipation. The heat sink fins 44 of the device 40. The fan 50 is mounted on the heat sink assembly and faces the front side of the heat sink fins 34, 44 to blow the airflow generated by the fan 50 into the passage between the heat sink fins 34, 44. The channels extend along the heat sink fins 34, 44 from front to back. The fan 50 is square in shape and has a top portion 52 and four corners 54. The top portion 52 is higher than the top of the heat sink fins 44 of the auxiliary heat sink 40. • Each corner 54 is provided with an opening 540. The air guiding cover 60 of the preferred embodiment includes a mounting plate 62, a guiding plate 64 parallel to the mounting plate 62, and a baffle 63 slantingly connecting the mounting plate 62 and the guiding plate 64, that is, the baffle 63 is opposite to the baffle 63 The mounting plate 62 has an oblique angle. The mounting plate 62 is placed on top of the heat dissipating fins 44 of the auxiliary heat sink 40, and a pair of cleats 620 extend vertically downward from opposite side edges of the mounting plate 62. Each of the buckles 620 is provided with a positioning hole 622 corresponding to the hole 440 of the auxiliary heat sink 40. The screw 90 passes through the positioning holes 622 and is screwed with the hole 440 of the auxiliary heat sink 40 to be mounted. The plate 62 is mounted on the top of the auxiliary heat sink 40. A wire management structure is formed on the mounting plate 62 for arranging and restraining the messy power cord 20 in the housing. The cable management structure includes a pair of arch bridges 624 which are integrally stamped from the mounting plate 62 so as to form a hole at the position of the corresponding arch bridge 624 of the mounting plate 62, and the arch bridge 624 is disposed away from the auxiliary heat sink 40. The top direction of the protrusion 44 is such that a space 625 is formed between the arch bridge 624 and the top of the heat dissipation fins 44 below its position. It can be understood that the arch bridge 624 can also be welded to the mounting plate 62 by other means such as welding, such that the receiving space 625 is formed between the arch bridge 624 and the mounting plate 62 below it, that is, the corresponding arch bridge 624 on the mounting plate 62. There are no holes in the location. Each arch 624 has two opposite ends that are coupled to the mounting plate 62. The guide plate 64 is located higher than the mounting plate 62, and a sheet body 640 is formed vertically downwardly opposite to the opposite ends of the fan 50. Each of the body 640 is formed with an internally threaded protrusion 642. The protrusion 642 is The opening 50 of the fan 50 adjacent to the top portion 52 corresponds to the opening 540 of the fan 50, and then the screw 540 of the fan cover 60 is screwed into the boss 642 of the air guiding cover 60, and the air guiding cover 60 is coupled with a pair. The fan mount 96 collectively mounts the fan 50 on the heat sink assembly. Since the top of the fan 60 is higher than the heat sink combination, the air guiding hood 60 can block a part of the airflow generated by the fan 50 from leaking from the top of the heat sink fin 44, so that the airflow generated by the fan 50 is concentratedly blown toward the heat sink fins 34 of the heat sink assembly. 44 to improve the heat dissipation efficiency of the heat sink; in addition, the wind guide cover 60 is formed with an arch bridge 624, which can be used to organize the power cord 20 in the housing. In use, a strap 15 organizes and collects the messy power cord 20, the strap 10 is passed through the receiving space 625, and the end of the strap 15 is tied, so that the strap 15 binds the power cord 20 to the collection. They are placed together on the mounting plate 62 of the air hood 60. Referring to FIG. 3, a second embodiment of the present invention discloses a heat dissipating device. The structure of the heat dissipating device is similar to that of the heat dissipating device of the preferred embodiment. The only difference is that the arch bridge 626 of the second embodiment replaces the better one. Arch bridge 624 in the embodiment. The arch 626 has two opposite ends, one end of which is connected to the mounting plate 62, and the other end is disconnected from the mounting plate 62 to form a notch. The power cord 20 can enter directly from the notch and be inserted into the receiving space 9' below the arch bridge 626. 1293412 '625. The heat dissipating device of the present invention not only dissipates heat from the heat-generating electronic components in the computer casing, but also organizes and restrains the messy power cord 2' in the casing to make the space inside the computer casing clean, tidy and convenient for heat dissipation. As stated above, the invention has indeed met the requirements of the invention patent and has filed a patent application in accordance with the law. However, the above description is only a preferred embodiment of the present invention, and the scope of the patent application of the present invention is limited thereto. Any equivalent modifications or variations made by persons skilled in the art to the spirit of the present invention are intended to be within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a partially assembled view of a preferred embodiment of a heat sink according to the present invention. Figure 2 is an assembled view of Figure 1 at different angles. Figure 3 is an assembled view of a second embodiment of the heat sink of the present invention. [Main component symbol description] Board 10 Central processor 12 Tie 15 Power cable 20 Main heat sink 30 Heat absorbing plate 32 Lug 320 Heat sink fin 34 > 44 Auxiliary heat sink 40 Base plate 42 Hole 440 Fan 50 Top 52 Corner 54 Opening 540 Air Shield 60 Mounting Plate 62 Clasp 620 1293412 Positioning Hole 622 Arch Bridge 624, 626 Containing Space 625 Board 63 Guide Plate 64 Sheet 640 Post 642 Number of Tubes 80 Heat Absorption Section 82 Insulation Section 83 Heat Release Section 84 Screw 90 , 92 11