TWI292212B - Substrate for electrical device - Google Patents

Description

1292212 V. INSTRUCTION DESCRIPTION (1) The electronic device according to the technical field of the invention belongs to θ. A circuit board structure and a circuit board are used. It is to improve the reliability of the product quality and save the material. [Prior Art] Figure 1 shows the characteristics of the $1,1, and the C-electricity: the circuit board 5, in which the insulator 30 and the first conductor 7, the second conductor 8 and a conductive through space 14, the first upper surface 31' of the first lower surface 32 and the first conductor of the conductor 7 are disposed on the insulator 3 The first upper surface 31, the first lower surface 32 of the slab 1 is // the periphery of the ray, and the second conductor 8 is electrically connected to make electrical conductivity. The white electric path 5 is the first and second conductors 7 8, the lower surface 32, which can be: the first surface of the insulator 30 is transferred into the first hole 6, and the through hole 6 is electrically connected, and the filling material 43 can be regarded as a conductive path. 5 ΓΛ intensity, wherein the first conductor 7 and the second conductor first, the conductors 7, 8 are so, the conductive path 5 can be extended by 32g, and the first upper and lower surfaces 31 of the filler body 30 , paste) and other substances, its ♦: ',, the edge glue or conductive paste (Conductive made of paste-like conductive material, ^ 7 from tin (Tin) as the main material> sheet 20, set in The circuit board is made of a paste-like conductive material; a crystal line is respectively connected to the wafer 20 and the interlayer 14; a conductive member 60 is electrically conductively connected; and a thick layer 7 is bonded to make the wafer 20 and the first Conductor 7 and the first conductor 7 -: ball 'package J circuit board wafer 2 〇, conductive = for external electrical connection 1 s 〇 er ball ) 50, joined to the second conductor 8 1292212 5, description of the invention (2) In the above-mentioned conventional electronic device 9, since it is necessary to use the solder ball 50, it is easy to electrically connect with the outside, thus increasing the product cost, and because the solder ball 50 is to be bonded to the second conductor 8 by the solder ball bonding pad 53. The solder ball 50 is easily peeled off from the second conductor 8 by the impact of external force, process pollution or thermal stress, causing the electronic device 9 to malfunction. At the same time, the conductive path 5 is hollow rather than solid, so In an environment with a large temperature change, it is susceptible to thermal stress and generates a crack E phenomenon, which causes electrical failure to be transmitted and causes product failure, and causes the electronic device 9 to malfunction; and conducts electricity in the electronic device 9.

The conductive member 60 is bonded to the wafer 20 and the first conductor 7 by a wire bonding process, so that the wafer 2 is electrically connected to the second V body 7; and the conductive member 60 is bonded. In the process, the circuit board 1 usually needs to be heated to 140~30 or to facilitate the bonding operation of the conductive member 60, wherein the conductive paste (filler 43) is filled in the through hole 6 of the conductive path 5 to increase the conductive path 5. The strength, but because the melting point temperature of the conductive paste is only 83, the conductive paste will become soft during the heating of the circuit board 1, so that the conductive member 6 is beneficially bonded to the conductive path 5 and must be bonded to the first conductor 7. In this case, the first conductor 7 is required to be provided, thereby increasing the cost and also limiting the 'utility'. [Invention] The main contents of the circuit board of the present invention include: an insulator having a first surface and a first lower surface, and a conductor having no hollow shape is insulated. The conductor has an electrical self-insulator. The surface is transferred to the body to cover the surface of the earth and the surface of the conductor is exposed on the surface of the insulator, and the surface of the exposed conductor is convex (or not protruding) on the surface of the insulator. Stomach

1292212

V. Inventive Note (3) In order to use, the circuit board can make the electronic device not have to be reduced in thickness and the overall height can be made thinner, so that the conductor is not easily affected by thermal stress. Produce ^ and make the conductive member directly engage the surface of the conductor. Turtle w phenomenon, [Embodiment] ~ ir month: The circuit board is the basic structure of the present invention, in which the conductor describes its structure and function: 牛卜夕" each view and details i surface 3 circuit board 1〇, including: An insulator 3〇 has a first upper I·face 31 and a lower surface 32 and a side 37; the first first guide 7n夂 has a first upper surface 71 from the T body 70 only _conductor 7〇, each first The upper surface 71 of the younger brother, the surface 72 of the younger brother, and the side 73 of the first side 73 are covered by the insulator 3, and the first conductor first ^ 71 and the first lower surface 72 are respectively exposed. The first surface of the insulator 3 is a power supply connection, wherein the first conductor 7 is protruded from the first lower surface 32 of the insulator 30 by a height H such that the first J is flat: The following table « 72 « is spaced apart from the first lower surface 32 of the insulator 30 as a heat sink having a first upper surface 81 , a lower surface 82 , a first side 83 , a recess 86 and an extension 85 . 1 The first side 83 is covered by the insulator 30, so that the first upper surface, the surface 1, and the first surface of the element 8 are exposed to the first upper and lower surfaces 3i of the insulator 3, J and the first lower surface 82 of the element 80 is also protruded from the insulator 3 〇 下 一 一, and the recess 86 of the element 80 is non-penetrating, and is used for the extension portion 85 of the π element 80 And attached to the insulator 3〇,

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Page 8 1292212 V. Description of the Invention (4) On the surface 32, therefore, the extension portion 85 can increase the bonding strength between the component 80 and the insulator 3〇 to improve the heat dissipation performance of the circuit board 1 ;; in this embodiment, the first The conductor 70 and the component gQ are implemented as a metal of the same material, which may be made of copper, a steel alloy or other suitable metal, and the following advantages (efficacy) can be summarized: Life 1 · The first conductor 70 is implemented as a solid solid The conductor does not have a hollow space, so that the first conductor 70 is less prone to cracking; 2. The first lower surface 72 of the first conductor 70 protrudes from the first lower surface of the insulator a + to make the circuit board 1 〇 easy Electrical connection with the outside world without the use of solder balls, the manufacturing cost of the circuit board 10 is reduced; because when the conductive member is implemented as a conductive wire, since the melting point of copper is about 丨0 8 3 1, not the circuit The board 10 has been heated to between 140 and 300 ° C, and the first conductor 7 is still softened, so that the conductive wire can be directly bonded to the first conductor 70 on the first upper surface of FIG. 11 , so that the circuit board 1 is It is not necessary to provide the first conductor 7 (see 8), ^ circuit board 1 〇 The application limit is reduced, and the cost is saved, and the reliability of the two boards 10 is also mentioned. As shown in FIG. 1B, a circuit board, including an insulator 3, has a first forming surface 31, 32 and a side 37, wherein the insulator 30 is in a filling manner, and the insulator 3 is made. The first lower surface 3 2 is in a non-planar shape, and an empty wafer 4 is placed on the first upper surface 31 of the insulator 30 for accommodating the object (for example, ί5, package, etc.); The first conductor 7〇, each of the first conductors: the upper and lower surfaces 71, 72, the first side 73 and the extension 75 extend. The 卩75疋 is integral with the first conductor 7〇, that is, a portion of the conductor 70, and the extension 75 is from the first conductor. The first upper surface 31 of the edge body 30 is extended and joined to the insulator

1292212 V. Inventive Note (5) 30 on the first upper surface 31, at the same time, the first side 73 of the first conductor 70 is covered by the insulator 30, so that the first conductor 70 is buried in the insulator 30, and the first The first upper and lower surfaces 71, 72 of the conductor 70 are respectively exposed and protruded from the outside of the first upper and lower surfaces 31, 3 of the insulator 30 for power supply connection; in this embodiment, the first of the circuit board 10 The conductor 70 has an extension 75, and thus, the following advantages can be summarized:

1. Since the first conductor 70 is not only joined to the insulator 30 by the first side 73, but also the extension portion 75 is also joined to the insulator 30, the joint area of the first conductor 70 and the insulator 30 is increased, thereby The first conductor 70 can be more stably bonded to the insulator 30 without being easily peeled off. 2. Since the extension portion 75 can be freely extended on the first upper surface 31 of the insulator 30 as needed, the utility of the circuit board 10 can be improved. . As shown in FIG. 1C, a circuit board 10 includes: an insulator 30 having first and lower surfaces 31, 32; and a through-space accommodating space 15 for arranging (accommodating) objects (eg, wafer, conductive wire, package) The plurality of conductors are respectively implemented as the first conductor 70 and the second conductor 70a, and the first side edges 73, 73a of the first and second conductors are covered by the insulator 30, so that the first and second conductors are 70.

70a is buried in the insulator 30, and the first upper surface 71' 71a and the first lower surface 72, 72a of the first and second conductors are exposed to the first upper and lower surfaces 31, 32 of the insulator 30 respectively for power connection. Each of the first conductors 70 has a convex portion 77 having an upper surface and the upper surface of the convex portion 77 is implemented as a first upper surface 71 of the first conductor 70 to make the first conductor The first upper surface 71 is protruded and does not protrude from the first upper surface 31 of the insulator 30, and the first upper surface 71a of the second conductor 70a is lower than the first surface of the insulator 30.

Page 10 1292212 V. Description of invention (6) ^ ------ Surface 3 1 ; This is true; ^ , Shape, whereby, in the thumb, '4, because the first upper surface 71 of the first conductor 70 is The projections make the circuit board 10: the joint area of the package (not shown) and the circuit board 10, and the body of the board 10 is bonded to be more stable and not easy to produce the package and the electric diagram 1 D - the edge body 3〇3 And a '_one can electric green road plate 1〇, comprising: an insulator 3〇, consisting of a first upper surface 71, ..., a rim body 30b; two first conductors 70, each having a first Each of the first side 7 and the second lower surface 72, the extending portion 75 and the first side are, wherein the 'insulator 30 is covered with a tilt/shape' and each of the extending portion 75 and the first side 73 are exposed to the insulator. 30---the first upper and lower surfaces 71, 72 of the conductor 70, the bare component 80, the material fish \ lower surface 31, 32 for power supply connection; a first upper surface 81 is exposed to the absolute ^ 14, set In the case of the component 8 , the first conductor 70 is extended on the kneading surface 81 for the object to be placed; More stable, hehe... With free extension. As shown in FIG. 1E, a circuit includes " upper and lower surfaces 31, 32", including: an insulator 30 having a first first conductor 70 and a first upper conductor 70 covered by an insulator 30, wherein The first upper surface and the first lower surface 72 are connectable to the power supply connecting member 8A, and have a through-wafer W" the first upper surface-side 84 of the insulator 30, the material of which is the first conductor 7, the hole 88, and the first side The side 83 and the second side are covered, and the second side 84 is exposed to H, and the side 83 of the crucible is subjected to an object such as a 'dead, a body 3 enveloping line, a package, or the like. The sheet, the conductive, upper surface 81 is protruded from the insulator 3

Page 11 1292212 V. INSTRUCTIONS (7) ____ Upper surface 3 1 ; This embodiment From t % a hole 88 to accommodate objects, what? The shape of 70 pieces 80 is changed to make the component 80 material. In this case, the thickness of the electronic device is thinned and the material is saved as shown in FIG. 1F. An electric upper and lower surface 31'32. _@〇 includes: an insulator 3〇, having a first edge 30 covering, j : The middle and the first conductor 70 and the second conductor 7〇a are all rejected 77. - - ^ 'The first conductor 70 convex portion 77 and the second conductor 70a are convex 7 7a to make the first conductor 7 and the 遐 / The first convex conductor 70 is convexly adjacent to the 77-disk-conductor 0 surface, and the exposed first body f: the convex portion 77 of the two-body 70a is convex and outside 77Ka. ^ ^ π upper surface 31, and the second conductor 70a (other) is not convex but exposed to the first lower surface 3 of the insulator; _):, the material is the same as the first conductor 7〇, * The first side 83 faces 3. = 2 and: - The upper surface 81 is exposed and protrudes from the insulator 3〇7. The "80 first upper surface 81 is implemented as the intermediate portion 14 for providing (accommodating) the object (wafer, conductive member, seal. In the blank embodiment, by changing the shape of the component, the wafer can be ^ _, etc.); when the 80th-upper surface 81 of the piece 80, the heat generated by the wafer (Heaf)= is placed on the element 8 of the element:: the body 8 can be more efficiently transferred to the electricity ~ plate buried &quot ;

As shown in FIG. 1G, a circuit board 1A includes: an insulator μ surface 31, a first lower surface 32 and a side edge 37; a through-shape, a first upper (receiving) object (wafer, conductive) a wire, a package, and the like: a donor 70 is disposed on the periphery of the through-hole accommodating space 15 and has a first upper first guiding first lower surface 72, a first side 73 and a second side 74, and the 71st, lower surface 71, 72 is exposed on the first upper and lower jaws of the insulator 30, the wide surface 31, 32 for

1292212 V. INSTRUCTION DESCRIPTION (8) For electrical connection, each of the first side edges 7 3 is covered by the insulator 30, and the second side 74 is exposed outside the through-hole accommodating space 15 This can shorten the distance between the first conductor 70 and the wafer (not shown) accommodated in the accommodating space 15 to shorten the length of the conductive line;

The second conductor 70a has a first upper surface 71a, a first lower surface 724a, a first side 73a and a second side 74a, wherein at least a portion of the first side 73a is covered by the insulator 30 Buried in the insulator 30, and at least a portion of the second side 74a is exposed outside the side of the insulator 30, and the first upper surface 71a and the first lower surface 72a are exposed to the first upper surface 31 of the insulator, respectively. And the first lower surface 32, whereby the second side 74a of the second conductor 70a is free of the insulator 30 (that is, the second side 74a is not covered by the insulator 30), thereby reducing the area of the circuit board 10, and The second side 74 a of the second conductor 70 a is exposed on the side 37 of the insulator 30 to increase the electrical connection area of the second conductor 70 a to the external electrical connection; in this example, the board 10 is accommodated. Space can also be implemented as non-penetrating according to demand, in order to benefit the use of industry.

As shown in FIG. 1H, a circuit board 10 includes an insulator 30 having a first upper surface 31 and a first lower surface 32. A recessed accommodating space 14 for arranging objects (wafer, adhesive, package) And the second conductor 70 is covered by the insulator 30, so that the first upper and lower surfaces 71, 72 are exposed to the first upper and lower surfaces 31, 32 of the insulator 30 for power supply connection; The material is not the same as the first conductor 70, which is implemented as a metal, and is disposed on the first lower surface 32 of the insulator 30, so that the first upper surface 81 of the component 80 and the first lower surface 32 of the insulator 30 Bonding, and having two holes 88 such that the first lower surface 72 of the first conductor 70 is still exposed outside the first lower surface 3 2 of the insulator; this embodiment

Page 13 1292212 V. Inventive Note (9) ____, since the component 80 is bonded to the insulator, the area of the outside is increased by 3 2, so that the component 80 is bare as shown in Figure II, the circuit: Π Λ 板 10 Cooling effect. Surface 3 - first to second table 1Q, package, : - insulation _, with the first - upper element ... on the side of the insulating surface 83 respectively with the insulator 3 苐 ^ surface W, the first, in addition to the lifting circuit The board is bonded to the insulator _ section (9) is thin. In addition to the effect of the bulk, the thickness of the circuit board 10 can also be

h矣& Π 1J, a circuit board 1〇, comprising: an insulator 3〇, having a first upper ΐ=, a first lower surface 32 and a hole 38; a accommodating space 14; An upper surface 71, a first lower surface 72, first side edges 73 and ^.卩75, the first upper surface 71 and the first lower surface 72 are exposed to the insulation

For the power supply connection, the extension portion 75 is disposed on the first upper surface 31 of the insulator 30, and the first side 73 is disposed in the insulator hole 38, and is not directly engaged with the insulator 30; in this embodiment The first conductor 7 〇 the first side edge 7 3 is not directly bonded to the insulator 30 , but in the process of manufacturing the electronic device, a conductive cathode 62 can be filled in the hole 38 of the insulator 30, so that The first side edge 73 of a conductor 70 is bonded to the insulator 30 by the conductive paste 62. According to the drying, the first conductor 70 can be stably fixed, and the first conductor 70 can be joined to the outside by the first side edge 73. The area of the electronic device is improved, wherein the conductive paste 62 can be implemented as a solder paste or made of other paste-like conductive materials, and a portion of the conductive paste 62 can be protruded and exposed to the insulator as needed. 3〇 The first lower surface 32.

Page 14 1292212 V. INSTRUCTIONS (10) _ The first type of circuit board is the first type and the second conductor in combination with the first type of two conductive paths or other conductors of the present invention, and the following views are further described and detailed Structure and function: 4-way, Figure ικ, a circuit board n, including an insulator 1 - face 31 and first lower surface 32; - component 80, disposed on the surface of the insulator 3 〇 ^ ^ 3! The first lower surface 81, the first lower surface 82 and the extension portion 085 are: the first lower surface 82 of the watch is also not covered by the insulator 3 未, and the accommodating space u; the second conductor 70 Each having a first upper surface surface 72, a first side edge 73, and an extension portion 75, the first conductor 7 is lowered

I cladding so that the first upper surface 71 and the first lower surface 72 are exposed to the insulation = an upper surface 31 and the first lower surface 32 for power supply connection, wherein the first lower surface 72 protrudes from the insulator 3 a first lower surface 32, ♦ two second conductors 70a, each of the second conductors 7〇a are respectively joined to the first upper surface 31 of the insulator 30 and each have a hole 78a; the third third conductor 7〇b and the second conductor respectively 7 mouth 〇'&

The first upper surface 71a and the first upper surface 81 of the element 80 are joined, wherein a third conductor 70b joined to the second conductor 70a has a portion disposed in the hole 78a of the second conductor 70a and coupled to the first conductor 7 The first upper surface η is bonded; in this embodiment, the second conductor 70a is electrically connected to the first conductor 7 by the third conductor 70b, so that the circuit board 11 can be implemented as a circuit board having two conductive layers. Practical. As shown in FIG. 1L, a circuit board π includes: an insulator 3 〇, which is composed of a first insulator 30a and a first insulator 30b, and has a first upper surface 31 and a first lower surface 3 2 and a hole 3 8; The component 80 is disposed on the first lower surface 32 of the insulator 3, having a first upper surface 81 and a first lower surface 82, wherein the first lower surface

Page 15 1292212 V. Description of the Invention αυ ------ 82 is exposed on the first lower surface 32 of the insulator 3, and the first upper surface ^ is covered by the second insulator 30b and is not exposed on the surface of the insulator 3; The accommodating space " is disposed on the first upper surface 31 of the insulator 30 for the object to be disposed; the second first conductor 〇 has a first upper surface 71, a first lower surface 72, an extension portion 75 and a first side Side 73, wherein the first lower surface 72 is exposed to the first lower surface 32 of the insulator, and the first upper surface 71 and the extension portion 75 are covered by the second insulator 3〇b without being exposed on the surface of the insulator 30; a second conductor 70a, set in insulator 30

An upper surface 31, wherein a portion of the second conductor 70a is disposed in the hole 38 of the insulator 30 and is engaged with the first upper surface 71 of the first conductor 70; a conductive pass__ path 69, which is a conventional The conductive path electrically connects the first conductor 70 and the third conductor 7Ob respectively. In this embodiment, not only the first conductor 70 can be directly connected to the second conductor 70a but also electrically connected, and the conductive path 69 can also be used. The first conductor 70 is in electrical communication with the third conductor 7 Ob such that the circuit board 11 can be implemented as a circuit board of three conductive layers.

As shown in FIG. 1M, a circuit board 11 includes an insulator 30 having a first upper surface 31, a first lower surface 32, two second lower surfaces 34, and four recesses 36. The first conductor 70 has a first An upper surface 71, a first lower surface 72, a first side 73, and an extension 75, the first conductor 70 is covered by the insulator 30, so that the first upper surface 71 protrudes and is exposed on the first upper surface of the insulator 30. 3 1 is used for the power supply connection, and the first lower surface 72 is exposed to the first lower surface 32 of the insulator 30 for power supply connection; the second conductor 70a is disposed in the four sides of the insulator, each having the first The surface 71a, the first lower surface 72a, the first side edge 33 and the second side edge 74a, the first upper surface 71a and the second side edge 73a are respectively joined to the insulator 30, wherein the first lower surface 72a and the first surface The two sides 74a are not subjected to the insulator 30

1292212 V. INSTRUCTIONS (12) Covered and exposed to the outside of the thundering body 30, the first lower surface 32\ § is used; and the second third conductor 70b is disposed on the yin 72b 苴 笛 各 each with the first upper surface 71b and the first lower surface are guided by the lower surface to make the first conductor 70 spot and the second conductor 7〇a first lower surface 723 connected to U徂%. 70a can be electrically connected; a receiving space is 14 for the object to be used, and the first conductor / U and the first conductor are conductors. 7 0 a Η?» 11 斋盛ΛΑ Φ1 is also electrically connected, so that the circuit board 1 1 can be implemented as a two-conductor Φ industry identifiable master, the rim body 30 has a recess 36 to make the circuit board 11 have a convex shape When the surface is made to have a % of the lightning, the third conductor 70h can be joined to other circuit boards, and is formed by plating or SPuttering or other means. #, a circuit board U, including: an insulator 30, having a first upper surface 32 and a hole 38; - an accommodation space 14 · - a guide (four), having a first-upper surface 71, a first lower surface 72, a first door 14 side; f3 and The extension portion 75 is configured to expose the first upper surface 71 and the first lower surface 72 to the insulator 30 for power supply connection, wherein the extension portion 75 is disposed on the first upper surface 31 of the insulator 3, and the first side 73 The first conductor 7〇a has a first upper surface 71a, a second lower surface 72a, a first side 73a and a second side 74a, wherein the second conductor 7〇a is disposed in the insulator hole 38. An upper surface > and a first side edge 73a are both covered by the insulator 30 and are not exposed to the surface of the insulator 3, wherein the second side 7 4 a is not covered by the insulator 30 and is exposed to the hole of the insulator 30 38. In this embodiment, the circuit board u can be implemented as a circuit board of two conductive layers by providing the second conductor 7〇a, and at the same time, although the second side 74a of the second conductor 7〇a is not directly connected to the insulator 3〇 Bonding, but in the process of manufacturing an electronic device

Page 17 1292212 5. In the invention description (13), the dental filling/second conductive paste 62 is on the insulator 3. In the hole 38, the first side of the first conductor 73 is bonded to the insulator 3, whereby the first conductor 70 can be fixed and the first conductor. 〇You can use the first side to increase the area of the joint with the outside world and increase the electric Gans Road + the ancient 62 is also the first conductor 7 and the 4th 7: 7 ^ Figure 10, a circuit board Η white red .^ ^ ^ 7 , 孜u' includes: - insulator 30; - I " I piece (wafer, point piece, conductive part, package ΓΛ; two stepped first conductor 7 〇, by the first - the upper surface 71, the i-th upper #rfr" ί first side 73, and covered by the insulator 30, so that the first

For the power supply connection of the insulator 30, wherein the first upper surface 31 of the pad body 30 extends into the accommodating space 14, and the second insulator 〇a, the insulating body 3 〇 The first upper surface 71a is insulated from being completely buried in the insulator 3, and at the same time, the first lower surface is protruded and the first lower surface 32 of the edge 30 is electrically connected; the second conductive path (3) And electrically connected to the first conductor 70 and the second conductor 7〇a, so that the utility of the circuit board 11 can be improved; wherein the first upper side of the second conductor 7〇a=7la can also be joined as needed It is connected to the first lower 32 of the insulator 3 for power supply connection. - Figure 1! > No, a circuit board 11 comprising: four first conductors 70, each having a

The upper surface 71, the first lower surface 72 and the first side edge μ; the four first conductive layer guides each have an upper surface 56, a lower surface 57 and a side edge 5, respectively, which are respectively disposed on the first body 70 An upper surface 71, and is bonded to the first conductor 7; the fourth second conductive layer &, each having an upper surface 56a, a lower surface 57a and a side 58a, respectively disposed on the upper surface 56 of the conductive layer 55, and First conductive layer 55 is bonded; an insulation

1292212

V. INSTRUCTION OF THE INVENTION (14) The body 30 has a first upper surface 31, a first lower surface 32 and side edges 37 which cover the first conductor 70, the first conductive layer 55 and the second conductive layer 55a to make the first conductor The first conductive layer 55 and the second conductive layer 55a are embedded in the insulator 3, wherein the upper surface 56a of the second conductive layer 55a is not covered by the insulator 30 and is exposed on the first upper surface 31 of the insulator 30 to supply power. For the connection of the circuit board, it can be known that since the conductors and the conductive layer are buried in the insulator, the thickness of the circuit board is reduced, and the conductive layer makes the circuit board easy to electrically connect with the outside, and can improve the The circuit board of the present invention relies on the quality of the external electrical connection. The third type circuit board of the present invention is a circuit board which is formed by electrically connecting the conductors with a conductive path or a conductor in combination with the first type or the second type of the present invention. The appropriate number of layers can be added as needed to facilitate industrial use; the following views are given and their structure and function are detailed: H1Q shows 'circuit board 12, which is composed of the first and first type of circuit boards of the present invention, wherein the circuit board ", there is a first insulator 3 〇 2 第 第 一 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 31 Powering the first upper surface 313 of the first polarity-3〇8 and the first lower surface 32 of the circuit board 12

- insulation = and a Ϊ 2 way board 1 〇, having a second insulator 3 〇 b, disposed on the second first upper surface 31a, and a second conductor 70a, disposed on the upper body 3 〇 b, and The first upper surface 71a is exposed to the first circuit 1 of the circuit board 12 for power supply connection, and the first lower surface 72a is electrically connected by the first lower surface 72 of the conductive paste 62 ψ _ body 70. This embodiment % will be the first type of circuit board of the present invention and the second type of electricity

1292212

The circuit board 11 is formed by a circuit board which is formed to form an electrically conductive layer, for example, so that the circuit board 丨 2 has a three-layer structure as shown in Fig. 1R, which means that the circuit board 12 is more practical. Formed in which the circuit board 10 female 12 is stacked by the first type of circuit board 1 - the lower surface 32, and the second 4: fn edge ... upper surface" and the first lower surface 72, and a f body having a first upper surface η and a first surface power supply connection, two surfaces 71, 72 exposed to the insulator 30 70 and the element 80 joined to make two == 4 bones 62, respectively, with the first conductor of the phase ^ ^ # SI 1 A circuit board 10 can electrically communicate with the conductive layer of the household by the conductive cymbal 62. In the embodiment, the circuit board 12 has three--one and three types of circuit boards, and the insulator can be glued. , ceramic = glass, resin or other suitable insulating material, and each conductor and each member exposed to the surface of the insulator 3 may be provided with at least one layer of suitable conductive layer material (nickel, gold, silver or palladium). Etc.) to improve the quality of the electrical connection, and each conductor, insulator and component can be made into different shape patterns (Patterns), or the side of the conductor can be exposed on the side of the insulator, and the insulator can be changed according to requirements. The shape and number of conductors and components used to improve the board's work The conductor and the component may be made of copper foil, steel alloy, nickel, metal alloy (metal 1 ic al l〇y) or other suitable materials. A solder mask may be provided as needed to protect the exposed The conductor, component or circuit board surface of the insulator. The effect of using the first type of circuit board 10 to form the electronic device 90 is as follows with reference to the following cross-sectional views: ' Figure 2 shows the first embodiment, one The electronic device 90 includes: a circuit board

Page 20 1292212 V. Inventive Description (16) 10, having an insulator 30, two first conductors 70 and an element 8〇, wherein the first conductor 70 has a first upper surface 71 and a first lower surface 72, wherein The first lower surface 72 is convex and exposed to the first lower surface 32 of the insulator 30, and the element 8 is implemented as a metal conductive material having a first upper surface 81, a first lower surface 82 and a recess 86, wherein the lower surface 82 protruding insulator 3 〇 first lower surface ^, recess 3 is implemented as a receiving space of the circuit board 10 for placing objects; a wafer 20, = placed in the recess 86 of the component 80; a plurality of conductive members 60, implemented as The conductive wire, the wafer 2, the first conductor 70 and the component 80 are bonded to electrically connect the wafer 20 to the ▲ 70 and the component 80; a package 40 encapsulating the wafer 20 and the conductor

The circuit board 10; as shown in the present example, since the circuit board 10 has a convex shape, the electrical connection can be reduced, whereby the electronic device 90 does not need to use a solder ball and a conductive i is connected and I is electrically conductive. The member 60 is directly connected to the first multiplexer 7 of the first one. Thus, the circuit board 10 can be provided without a picture, and the application limit of the circuit board 10 can be reduced, and the utility model can be saved with the convex portion 77. + 信赖 the reliability of the circuit board 10; and because of the first conductor 70, the problem of peeling off the surface of the circuit board 与 ο 封 繁 第一 第一 第一 第一 第一 因而 因而It is more stable to avoid the 10 element 80 being the reliability of the wire temporary electronic device 90, and at the same time, the circuit board can enhance the electronic device to expose the second lower surface 82 of the Qn to the circuit board 10,

Figure 3 shows the heat dissipation performance. The board 10 and the right sister consistently apply, an electronic device 90, including a Thunder 1U, an insulator 3〇, 2. The circuit-accommodating space 14J1 is composed of an I conductor, and a second conductor 7〇. a and 71, the second upper surface, 79, ί—stepped, having a first-side upper side 73, a second side 74, and an extension

1292212 V. Inventive Note (17) 75, the extension portion 75 is disposed on the first upper surface 31 of the insulator 30 and extends as far as possible toward the accommodating space 14, and the height of the first upper surface 71a of the second conductor 7A is lower than the insulator The first upper surface 3 1 ; - the wafer 20 is disposed on the accommodating space 14; the plurality of conductive members 60 are implemented as conductive lines, respectively, and the wafer 20, the first guide

The body 70 and the second conductor 7〇a are joined to electrically connect the wafer 20 to the first conductor 70 and the second conductor 70a; a package 4 〇 encapsulating the wafer 20, the conductive member 6〇 and the circuit board 10; Therefore, since the first upper surface 71 of the first conductor 7 and the first upper surface 71a of the second conductor 70a are disposed at different heights, the gap g between the conductive members 60 can be widened to prevent electrical short circuit. At the same time, since the first guiding body 70 has the extending portion 75, it can be closer to the accommodating space ι4, whereby the distance d between the wafer 20 and the first conductor can be shortened, thereby reducing the amount of the conductive member μ to save the cost. The second side 74 of the first conductor 70 is not covered by the insulator 3 裸 and is exposed outside the package 40 for increasing the area of the electrical connection. FIG. 4 shows a third embodiment. An electronic device 9A includes a circuit board 1A having an insulator 3〇, two first conductors 70, and a second conductor. 〇a, 〆Ϊ #, the first conductor 7〇a has -I wearing the accommodating space 79a, the 齅7ηι / / 日 日, the package and the like, and the ... ... extension 7 5 And disposed on the insulator 3 0 first upper face 3 i

The outer edge of the circuit board 10 has an extension portion 85, a concave surface portion 86, and is exposed to i: 8%%: The second side 84 is not covered by the insulator 30, for improving the heat dissipation efficiency. _ 曰Μ Μ哎 is placed in the accommodating space 15 · a flat, the 曰 21 and 6 〇 and the circuit The board 10. The package, the wafer 20, and the conductive member are encapsulated by the present invention, since the circuit board has a through space.

Page 22

1292212 V. Description of the Invention (18) 1 5 to accommodate the wafer 20, so that the overall thickness of the electronic device 90 is implemented to be thin, and at the same time, the second conductor 70a can be implemented as a positive power contact (P〇sitive The supply bus) or the negative supply bus makes the electronic device 90 more practical. FIG. 5 shows a fourth embodiment, an electronic device 90, which is composed of a first electronic device 91 and a second electronic device 92. The first and second electronic devices 91 and 92 respectively include: a circuit board 1 〇 having a 〆 insulator And the first and second conductors 7〇, 7〇a, wherein the first upper surface 71 of the first conductor 70 and the first lower surface 72 are bare chrome on the first upper surface 31 of the insulator 30 and the first r-shaped connection The second conductor 7〇a is disposed on the first upper surface 31 of the insulator 30 for power supply connection; a through-hole accommodating space 15; the two wafers 20 and 25 are disposed in the accommodating space 15, wherein The wafers 25 are disposed on the wafer 2 in a stacked manner; the plurality of conductive members 60 are implemented as conductive lines, respectively bonded to the wafers 2, 25, the first guide 70 and the second conductor 7A, so that the wafer 20 is bonded. 25 is electrically connected to the first and second conductors 7〇 and 170°; a package 40, encapsulating the wafer 20, the wafer 25, the conductive crucible 60 and the circuit board 1〇; It is possible to provide the eve wafers 20 and 25 with a plurality of electric power and through the accommodating spaces 15 formed by the respective circuit boards 10. Thus, it is necessary to improve the electronic equipment. 9 〇 ; ; ; 另 另 另 于 于 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装 封装U, so that the wafers 2, 25 are located on the side 37 of the circuit board 10, according to which the accommodating space 15 of the routing board 10 can be unrestricted, and the stretching day is particularly good!: According to this, the electric 1 R lover is stretched out. And will not be due to the area of the road board 10, which is more conducive to the electronic industry, not the fifth embodiment, the electronic device 90, including: a circuit

1292212 DESCRIPTION OF THE INVENTION (19) A board 1 has an insulator 30, an accommodating space 14 and four first conductors 70. Second, each f-conductor 70 has a plurality of convex portions 77, 77c for the first guide. The first upper surface 71 and the first lower surface 72 are respectively exposed to the upper surface 31 of the insulator 30 f and the lower surface 32 for power supply connection, wherein the first upper surface 1 protrudes from the first upper surface 31 of the insulator 3 A wafer 2 is implemented as a Flip chip, and is disposed on the accommodating space 14 of the circuit board 1 ,. The surface 21 has four conductive members 65, which are implemented as conductive protrusions, and each conductive a member 65 = joined to the wafer 20 and the first conductor 7 〇 convex portion 77 (first upper surface 71),

The sputum stomach 2 〇 is electrically connected to the first conductor 7 ;; a package 40 encapsulating the wafer, the V electrical component 65 and the circuit board 丨〇; as by this example, since the first conductor has j 7 7 That is, the contact area between the conductive member 65 and the first conductor 7 is increased, and the electric member 65 is more firmly bonded to the first conductor 70 to prevent the wafer 20 to be separated from the substrate 10 to cause a peeling problem, thereby lifting the electronic device 9 At the same time, the package 4 can be coated with the non-active surface 22 of the wafer 2 to make the wafer 20 more stably fixed on the circuit board 1 .

7 is not a sixth embodiment, an electronic device 9 includes: a circuit board 10 having an insulator 3, two first conductors, and a through-type receiving space 5, wherein the insulator 30 is filled Forming such that the first lower surface 32 of the insulator 3 is non-planar, and each of the first conductors 7 has an extension, first

^ f I3 and the second side? 4, wherein the first side edge 73 of the first conductor 70 is exposed to the tooth receiving space 15; the wafer 2 is disposed in the through space 151 and is joined to the circuit board 1 by an adhesive member 45; The conductive member 6〇 is implemented as a conductive line, respectively bonded to the wafer 20 and the first conductor 7〇, so that the wafer 2〇 is electrically connected to the first conductor 7〇; a package body 4〇, encapsulating the wafer 2〇, the conductive member 6〇, adhesive parts

Page 24 1292212 V. Description of invention (20) 3 = ί2 From this example, 'Because the first conductor is carved-side? 3 bare = in the circuit board 10 through the accommodating space 15, so that the first conductor? 〇 更 更 20 耩 耩 耩 耩 耩 耩 耩 耩 耩 耩 耩 20 20 20 20 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片〇 is the same material.

FIG. 8 is a seventh embodiment, an electronic device 90 includes: a circuit board 1 , a common insulator 30 , two first conductors 70 , and an accommodating space i 4 , wherein a portion of the first conductor 70 is The device is disposed in the accommodating space 14 and is disposed in the accommodating space 14 and disposed on the second upper surface 79 of the first conductor 70. The plurality of conductive members 电 are electrically conductive, respectively The wafer 2 Q and the first conductor γ q are bonded to electrically connect the wafer 20 to the first conductor 70; a package 40 encapsulating the wafer 2, the conductive member 60 and the circuit board 1; and the third solder resist layer 46 (s〇 The lder mask is disposed on the first lower surface 32 of the insulator 30 of the circuit board 10 for protecting the circuit board 10; as a result of this example, since a portion of the first conductor 7 is disposed in the accommodating space 14 The appearance of the electronic device 90 is reduced and the heat dissipation efficiency of the wafer 2 can be improved〇

FIG. 9 shows an eighth embodiment, an electronic device 90 comprising: a circuit board 10 having an insulator 30, two first conductors 7A and an element 80, wherein the first conductor 70 has a first upper surface 71 The first lower surface 71 and the extension portion 75 expose the first upper surface 71 and the first lower surface 72 to the first upper surface 31 and the first lower surface 32 of the insulator 30 for power supply connection, and the component 80 has a through-hole 8 8 is a through-hole accommodating space for the circuit board 1 供 for accommodating the object; a wafer 20, the active surface 2 1 of the wafer 20 and the surface of the circuit board 1 〇 Bonded and disposed on the through-shaped receiving space of the circuit board 10; multiple guides

Page 25 1292212

The electrical component 6 Ο is implemented as a conductive wire, which is respectively a fish 曰 刀 丨 丨 丨 晶片 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 , , , 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片 晶片7 0, 兀 8 〇 性 性 诵 μ μ μ μ μ μ μ , , , , μ μ μ μ μ μ μ μ μ μ μ μ 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘The wafer 2 is on the surface of the slab, the conductive member 60, the conductive member 〇, the Φ board 10, and the extension portion 75 of the first conductor 70. The circuit 丨 丨々 丨々 丨々 丨々 丨々 丨々 , , , , , , , , , , , , 7〇箆71 and the first lower surface 7 2 are not covered by 4n spoons and the package is covered by 4 〇, and can be electrically connected to each other; this example, because the first conductor 7〇 first The upper surfaces 71 and 72 are exposed on the surface of the circuit board 1G, so that the electronic device can be electrically connected to the outside by the solder ball 5 = line, and can be stacked with multiple electronic devices according to requirements. use. FIG. 10 is a ninth embodiment, an electronic device 9A includes: a circuit 10 having an insulator 30, a two-conductor 7 〇, and an accommodating space i 4, wherein the first upper surface of the insulator 30 31 is a protrusion p having a predetermined shape, whereby the protrusion P is disposed adjacent to the accommodating space 14; a wafer 2 〇 is disposed in the accommodating space 14; and a plurality of conductive members 6 〇, The wafers 20 and the first conductors 7 are respectively bonded to electrically connect the wafer 20 to the first conductor 70. A cover c is disposed on the protrusions P of the insulator 30, whereby the circuit board iq is formed with a recess. The accommodating space 17 and the conductive member 6 〇 are enclosed in the accommodating space 17 . The cymbal 20 can be implemented as an image sensor or the like according to the two requirements. The _body C can be implemented as a transparent substrate (transparent substrate). In this embodiment, the package can be filled in the accommodating space 7 to encapsulate the wafer 20, the conductive member 60, and the circuit board 1 〇, and the cover c can be implemented as a heat sink or other objects as needed. Figure 11 is a tenth embodiment, an electronic device 9Q, comprising: a circuit board

1292212 V. Description of invention (22)

11. The structure is similar to the structure of FIG. 1A of the second type of circuit board of the present invention, having an insulator 30, two first conductors 70, two second conductors 70a and two third conductors 70b, wherein the insulator 30 has the first The surface 31, the second upper surface 33, the first lower surface 32 and the two convex portions 39, the insulator 30 protrudes from the second upper surface 33 by the convex portion 39, and the first conductor 70 is insulated by the insulator 3. The first upper surface 71 and the first lower surface 72 are respectively exposed to the insulator 3, the first upper surface 31 and the first lower surface 32 for power supply connection, and the second conductor? The 〇3 is disposed on the second upper surface 3 3 of the insulator 30 and is disposed adjacent to the insulator 3 〇 convex portion 39. The third conductor 70b is disposed on the first upper surface 31 of the insulator 30 and respectively respectively with the first conductor 70. And the second conductor 7〇a is joined to electrically connect the first conductor 7〇 with the second conductor 70a; an accommodating space 14 is provided for the object to be disposed on the accommodating space 14; the plurality of conductive members 6〇, the conductive material is bonded to the wafer 20 and the third conductor 70b, respectively, so that the wafer 2 is electrically connected to the first conductor 7〇, a package 40, the packaged wafer 20, the conductive member 6〇, and the electrical implementation. In the example, it is shown that the second type of circuit board u can also be used in the electronic device 9 〇 〇 〇 1 1 1 1 1 1 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有The electronic device 90, (capaci t〇r) 89, wherein the circuit board 12 includes: an electrical insulation > an insulator 30a, a second absolute green aunt body 30, which is

The other is disposed on the surface of the second insulator 30b; and the third insulator 30c is covered, and each has a brother H=70, and is respectively engaged with the first insulator 30a, the first conductor JUa and the second insulator 3〇c. Order first

1292212 V. INSTRUCTION OF THE INVENTION (23) The upper surface 71 is respectively exposed to the insulator 3 〇 lower surface 32 for the power supply line connection, and the first surface Μ and the first conductor 7 〇 a hole 78a; three conductive paste 62 = 2 = placed in the second hole 78 a, and the first conductor 7 〇 and the _ ° and the second conductor electrically connected, · two accommodation space ", provided with: 70, the paste 62 and the accommodation space 14; a capacitor 89, disposed in the other: the sheet 2, disposed in the conductive paste 62 and the two first conductors 7 electrically connected, and by the wafer 20 and the first conductor 7 〇,曰A ^ conductive member is electrically connected; in this embodiment, each of the first core 7Q is exposed to the first upper surface 31 or the lower surface 72 of the insulator 30. The function of the connection is one = 32, so that the circuit body can make the circuit board 12 have four layers of conductive sound, and use the circuit board of the book layer, which is advantageous for the industry, and can be derived from the above embodiments. In the present invention, the surface of the insulator is covered on the lower surface of the circuit board, so that the electronic device can be easily electrically connected to the outside and can be It is not necessary to set the solder ball' to reduce the manufacturing cost, or to flip the circuit board to make it bare and protrude from the insulator. The conductor is not placed on the circuit (4) and covered by the insulator. 13A to 13E are the first manufacturing steps of the first type of circuit board. The method of the first manufacturing step is as follows: ' As shown in FIG. 13A, a first conductive plate 7〇p is provided, which is made of steel and is respectively first. The upper surface Ήρ, the first lower surface 72p is provided with a film 49, wherein the film 49 has a hole 48 for the first lower surface 72p of the first conductive plate 7〇p

Page 28 1292212 V. Part of the invention (24) is exposed to the film 4 9; Figure 13B does not, the first conductive plate 7〇p is formed by a chemical etching process, forming six preset shapes of convex portions 77p; FIG. 13C, after removing the film 49 on the first conductive plate 7〇p, an insulator 30 is provided and cured to cover the respective convex portions 7 7p of the first conductive plate 7〇p, wherein The first surface 72p of a conductive plate 7〇p is not covered by the insulator 30 and is exposed on the first lower surface 32 of the insulator 30. After the manufacturing step, the second conductive plate can be disposed on the first lower surface 32 of the insulator 30 as needed. 7〇s to make a circuit board of different structure (refer to FIG. 15A to 15C); FIG. 130 does not, the first upper surface 7ip of the first conductive plate 7〇p, the first lower surface 72P and the insulator 30 first The lower surface 32 is respectively provided with a film ", which: the film 49 has a hole 48, so that the first conductive plate 〇p first surface Μ and the lower surface 72p portion are exposed to the film 49; , the film fq 1 After the second conductive process, the portion of the first conductive plate 7 〇P exposed to the ruthenium film 49 is etched away, The shape includes: an insulator 30 having a first cymbal plate and an electric slab ^ ^ ^ ^ upper surface 31, a lower surface 32 and two holes 38; - a first conductor 70 having a first 72, a first side 73 and the extension portion 75 on the upper surface:: 71, the first-lower surface 30, the first upper surface 31, and the first side, the fifth side, and the second surface, the first upper surface 71 and the first lower surface 7 2 Han bare life in the insulator 30 hole 38, for electrical connection, and the first-upper surface table 71 surface convex 72 out of the road is outside the insulator 30 for ... - second conductor wind: the insulator 3° first-upper surface first side 73a, wherein the first side 7 is second: the slit first-lower surface 72a, the upper surface... and the first-lower upper body 30 are covered, and the second side is covered Bare road to insulator 30, to supply power

Page 29 1292212 V. Description of invention (25)

For the connection, 'a third conductor 70b, with the first upper surface? 1b, a first lower surface 72b, a first side 73b and an extension 75b, wherein the first upper surface 7ib and the extension 75b are disposed on the first upper surface 31 of the insulator 30, and the first side 73 is covered by the insulator 30 Covering and exposing the first upper surface 7lb and the first lower surface 721) to the outside of the surface of the insulator 30 for power supply connection, and the first upper surface 71b protrudes from the first upper surface 31 of the insulator 30; the fourth conductor 7〇c, having a first upper surface 71c, a first lower surface 72c and a first side edge 73c, wherein the first side edge 7 3c is covered by the insulator 30, and the first upper surface 71c and the first lower surface 72c are Exposed to the surface of the insulator 30, for power supply connection and the first upper surface Η c protrudes from the first upper surface 31 of the insulator 30; an element 8〇, which is the same as each conductor, has a first upper surface 81. The first lower surface 82, the first side 83, and the hole 88, wherein the first side 83 is covered by the insulator 3, and the first upper surface 81 and the first lower surface 82 are exposed on the surface of the insulator 3. In the above method, since the first upper surface of the fourth conductor 70c of the circuit board 10 is convex and exposed to the insulator 30, The circuit board 10 is easy to be electrically connected to the outside world. = The solder ball is used skillfully, and other materials such as lead are not required in the manufacturing process. The environment material can reduce the environmental pollution of the circuit board; at the same time, the upper and lower surfaces of the circuit board 10 can also be provided with a solder resist layer (s, mask) to protect the circuit board 10.

The first manufacturing step of the first type of circuit board is illustrated as follows from the following FIGS. 14A to 14F: / As shown in FIG. 14A, a first conductive plate 7〇p is provided, and the first conductive plate 7〇P is first. Each of the surface 71p and the first lower surface 72p is provided with a first conductive layer $5, so that each of the conductive layers 55 is bonded to the first conductive plate.

1292212 V. The invention (26) The first conductive layer 55 can be implemented as silver or palladium metal; as shown in FIG. 14B, a film 49 is provided, and the film 49 is respectively disposed on the upper surface 56 of each of the first conductive layers 55. The film 49 has a plurality of holes 48, such that a portion of the first conductive layer 55 is not covered by the film 49 and is exposed to the atmosphere. As shown in FIG. 14C, an etching process is provided, which is exposed to the atmosphere. The first conductive layer 55 and the first conductive plate 70p are partially removed, so that the first conductive plate 70p has two convex portions 77p, and the film 49 is removed, and the first conductive layer 55 that is not etched is still bonded separately. On the first conductive plate 7〇p;

As shown in FIG. 14D, an insulator 3 is provided, and the insulator 3 is wrapped around the convex portion 77p of the first conductive plate 70p and the first conductive layer 55. After the baking curing process, the insulator 30 is formed into a pre-formed shape. Appearance, wherein the upper surface 56 of the first conductive layer 5 5 is not covered by the insulator 30 and exposed to the atmosphere +. As shown in FIG. 14E, a film 49 is provided, and the film is respectively disposed on the upper surface of each of the first conductive layers 55. 56 and the insulator 3 〇 first - lower ^, wherein the film 49 has a large number of openings 4 /, so that a portion of the first conductive layer 55 is not covered by the film 49 and exposed to the atmosphere; As shown, an etch wadding is provided

A conductive plate 7〇P is exposed to the atmosphere, and the first conductive layer W and then the first type of circuit board 1 is formed, and then the film 49 is removed, and a conductor 70, each having The structure of the first upper surface road plate 10 includes: two first sides 73; four first conductive layers 55 each having an upper main lower surface 72 and a first side edge 58 disposed on the first surface of the first conductor 7 and the lower surface 56, respectively The surface 57 and the side 72 are respectively connected to the first conductor 70. The upper surface 71 and the first lower surface #口, the insulator 30, have the first upper surface

1292212 V. INSTRUCTION DESCRIPTION (27) The surface 31, the first lower surface 32, and the side edges are joined to the first conductor 7. The first table: the first conductor 70 and the first conductor 70 are bundled with a first conductive layer 55 so that the first upper surface 71 of the body 70 is not covered with the insulator 30 : Insulator 3. The first upper surface 3 i, and the first conductor 〇 一 一 一 一 , , , , , , 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘Package ^ : ί Ϊ 2 The first conductive layer 5 5 of the surface 71 is not connected by the insulator, but is bonded to the first conductor 7 〇 - the following table ί = : 55 is covered by the insulator 3 ,, and the upper surface thereof The first lower surface 32 of the edge body 30 is connected for power supply; the circuit board \ conductor and the conductive layer can be buried in the insulator, so that the circuit board can be reduced, which is advantageous for industrial use, and the first conductive layer This makes it easy to electrically connect with the outside world, and can improve the reliability of the circuit board 1 to the external electrical connection. The first manufacturing step and method of the second type of circuit board are illustrated as follows: As shown in FIG. 15A, first, a first conductive plate 70p having six convex portions 77p is provided and covered with an insulator 30. The first conductive plate 7〇p and each convex portion are formed, and the structure shown in FIG. 3C is the same, and then a second conductive plate 70s is disposed on the first lower surface 32 of the insulator 30 and the first lower surface 72p of the first conductive plate 7〇p. The second conductive plate 7〇s can be plated according to requirements (

Plating) or sputtering (Sputtering) or the like; FIG. 15B=showing that a film 49 is disposed on the first upper surface 71p of the first conductive plate 7〇p and the first lower surface 72s of the second conductive plate 70s, wherein the film 49 has a hole 48 for making a portion and a second portion of the first upper surface 71p of the first conductive plate 70p

Page 32 I292212 丨, 明^ ---

a portion of the first lower surface 7 2 s of the plate 7 〇s is exposed to the film 49; and as shown in FIG. 15C, a chemical etching process is provided to bond the first conductive plate 7〇p to a conductive plate 7 0 s The portion exposed to the film 49 is etched away, and the film is removed. Thus, a conductive plate 11 is formed, which comprises: an insulator 30 having a surface upper surface 31 and a first lower surface 32; The first conductors 70 each have a first upper surface 71, a first lower surface 72, and a first side edge 73, wherein each of the first side edge insulators 30 is wrapped so that the first upper surface 71 and the first lower surface The surface 72 is bare: on the surface of the insulator 30, for power supply connection, and each of the first upper surfaces 71 protrudes from the first upper surface 31 of the insulator ^3 0; five second conductors 7〇a, each having a first upper surface pa, The surface 72a and the first side 73a are respectively joined to the first lower surface 32 of the insulator 30 and the first lower surface 72 of the first conductor 70. In the above method, since the second conductor 70a of the circuit board 11 is disposed on the insulator 3〇 The first lower surface 32 is such that the circuit board forms a circuit board of a double-layer conductive layer. Figure 16A to Figure 16E show the second manufacturing steps and methods of the second type of circuit board, which are described as follows:

As shown in FIG. 16A, a first conductive plate 7p is provided, which has a first upper surface 71p, four first lower surfaces 7 2p and four convex portions 77p, and a second conductive plate 7〇s having a first The upper surface 71s, the first lower surface 72s and the recess 76s; the second conductive ridge 62 is filled in the two recesses 76s, wherein the two conductive pastes 62 have different horizontal levels; a filler 43 is filled in the other recesses 76s, Wherein, the horizontal heights of the two fillers 4 3 are different; 'the first and second conductive plates 70p and 70s are joined as shown in FIG. 16β, and the first lower surfaces 72p of the first conductive plates 70p are buried in the first The four concave portions 76s of the two conductive plates 7〇s are respectively covered by the conductive f62 and the filler 43

1292212 V. INSTRUCTION DESCRIPTION (29) The process of curing the conductive paste 62 and the filler 43 is such that the first conductive plate 7〇p and the second conductive plate 70s are connected together, and then a filling process is provided to the insulator 30. Filled between the first conductive plate 70p and the second conductive plate 70s, and solidifies the insulator 30; as shown in Fig. 16C, a film 49 is provided, which is respectively disposed on the first upper surface 71p of the first conductive plate 7〇p and The second conductive plate 70s is disposed on the first lower surface 72s, and the holes 4 8 are opened as required, so that the first conductive plate 70p first upper surface 7 1 p - portion and the second conductive plate 70s first lower surface 72s - Part of the film is exposed to the film 49; as shown in Fig. 16D, a process is provided to remove the portions of the first and second conductive plates 7〇p and 丨7 0 s exposed at the opening of the film 49. The first conductive plate 7 〇p forms two first conductors 70' and the second conductor 70a, and the second conductive plate 70a forms a second conductor 70b and an element 80. As shown in FIG. 16E, a cleaning process is provided, which will The filler 43 is removed to expose the first lower surface 72a of the second conductor 70a to the outside of the insulator 30. Thus, the circuit board 11 is shaped. And comprising: an insulator 3〇 having a first upper surface 31, a first lower surface 32, a second lower surface 34, a third lower surface 35, a recess 36 and a convex portion 39; and two first conductors 70, which are insulated 30, each having a first upper surface 71, a first lower surface 72, a first side 73, and an extension 75, and exposing the first upper surface 71 and the first lower surface 72 to the surface of the insulator 30 The power supply is connected, wherein the extension portion 75 is disposed on the first upper surface 31 of the insulator 30; the second conductor 70a is covered by the insulator 30, each having a first upper surface 71a, a first lower surface 72a, and a first a side edge 73a, and the first upper surface 71a and the first lower surface 72a are respectively exposed and protruded from the first upper surface 31, the second lower surface 34 or the third lower surface 35 of the insulator 30 for power supply connection; Third conductor

Page 34 1292212 V. Inventive Note (30) 70b, disposed on the third lower surface 35 of the insulator 30, each having a first lower surface 7 2b, respectively exposed and protruding from the insulator 30, the third lower surface 35 for power supply The second conductive paste 62 is disposed between the first lower surface 72 of the first conductor 70 and the third conductor 70b to electrically connect the first conductor 70 and the third conductor 70b. An element 80 is disposed on the insulator 30. The first lower surface 32 and the third lower surface 35 are disposed, and the first lower surface 82 is exposed and protrudes from the third lower surface 35 of the insulator 30. In the above method, the third conductor 70b can be third under the insulator 30 according to requirements. The surface 35 is freely extended to make the circuit board 11 a circuit board having a double layer of conductive layers.

From Fig. 17A~, the description is as follows: 17D is a second type of circuit board and a third manufacturing step and shown in Fig. 17A, a first conductive plate 70p is provided, which has a first upper surface 71p and two first lower surfaces. 72p and two convex portions 7 7p; providing a second conductive plate 70s, disposed on the adhesive tape 47, having a first upper surface 71s, a first lower surface 72s and a hole 78s, wherein the two fillers 43 are filled in the two holes 78s As shown in FIG. 17B, the first and second conductive plates 7 Op, 70s are joined, and the first lower surfaces 72p of the first conductive plates 70p are respectively embedded in the fillers 43 in the holes 78s of the second conductive plates 70s. And the first lower surface 72p is bonded to the adhesive tape 47, and the filler 43 is cured by a heating process. Thus, the first conductive plate 70p and the second conductive plate 70s are connected together, and then a filling process is provided. The insulator 30 is filled between the first conductive plate 7 〇p and the second conductive plate 70s, and the insulator 30 is cured; as shown in FIG. 17C, the adhesive tape 47 is removed, and then a film 49 is provided, which is respectively disposed on the first conductive Plate 7〇p first upper surface 71P and second conductive plate 70s first 1292212 Ming (31) lower surface 7 2 s, and open holes 4 § as required, so that the first conductive plate 7 〇p first upper surface 71p - part and the second conductive plate 7 〇 s first lower surface 72p - The parts are respectively exposed to the film 49; as shown in FIG. 17D, an etching process is provided to bond the first and second conductive plates 70p,

7Os is removed from the portion of the opening 49 of the film 49, and a cleaning process is provided to remove the film 49 and the filler 43 so that the first upper surface 71 and the first lower surface 71 of the first conductor 70 are exposed to the insulator 3. 0 outside, so far, the circuit board 11 has been formed, comprising: an insulator 3, having a first upper surface 31, a first lower surface 32, a second lower surface 34 and a recess 36; - an accommodation space 14; A conductor + 70, covered by the insulator 30, has a first upper surface 71, a first lower surface 72 and an extension 75, wherein the extension 75 is disposed on the first upper surface 31 of the insulator 30, and the first upper surface 71 and the first lower surface 72 are exposed and protrude from the first upper surface 31 and the second lower surface 34 of the insulator 30, and are connected to the first upper surface 31 of the insulator 30 by a second conductor 70a for power supply connection. a third conductor 70b disposed on the first lower surface 32 of the insulator 3, covered by the insulator 3, and exposing the first lower surface 72b to the first lower surface 32 of the insulator 30; The conductor 70b can be provided with an extension as required, so that the circuit board 11 becomes a circuit with a double-layer conductive layer. The board may also be provided in the manufacturing step as needed, without providing the second guide 70s so that the circuit board 11 does not have the third conductor 7 〇b and becomes the first type of circuit board (1〇).

Only the above is only a preferred example of the present invention, and the function of transmitting the electrical conductor from the first upper surface of the insulator to the first lower surface is not changed, and the scope of the present invention cannot be limited thereto, for example, As shown in FIG. 1A, the component 80 can also have a hole as required; as shown in FIG. 1E, wherein the component 8 is not

Page 36 1292212 弋, invention description (32) a " implemented as a heat sink and can also be implemented as a second conductor; as shown in Figure ι:, wherein the third conductor 7〇b and the second conductor 7〇a are Interchanged with each other, also the second conductor 7〇b can be implemented as a second conductor, and the second conductor 7〇a can be: a third conductor; as shown in FIG. 1N, wherein the conductive paste 62 can be required , the rim body is replaced by '· as shown in FIG. 1 H, 1 1 , the component 80 can be disposed on the first upper surface 31 or the first lower surface 32 of the body 30 as required without being subjected to the insulator 3 〇匕, or The first side 83 of the component 80 can be covered by the insulator 3〇 according to requirements, so that the circuit board can be made more practical; as shown in FIGS. 1M and 1N, the second conductor 7 can be disposed on the insulator as required. The first upper surface 31 or the first lower surface 32 of the 30 is not covered by the insulator 30, or the first side 7 4 a of the second conductor 7〇a may be covered by the insulator 30 as required, so that The circuit board is more practical and practical, as shown in FIG. 1P, wherein the insulator = ¥ body 70 and the first conductor 7 位于 located at the first lower surface 3 of the insulator can be A second conductor is provided, which electrically connects the first conductors, and the second conductor can be implemented as a tin or copper conductive path; as shown in FIG. 1Q, the circuit board 12 can have no The three conductors 7〇b are such that the first conductor 7〇 “the lower surface 72 is exposed and protrudes from the surface of the first insulator 3〇a, so that the effect of saving the material without setting the spheroidal ball can be achieved; 1 A, 1 e or 1 F, component 8 〇 can also be formed into different shapes according to requirements, and is disposed on the insulator, the first upper surface 31 of the 30, the surface 32 of the younger body, or the insulator 3, so The heat dissipation efficiency can be improved to make the circuit board more practical; and as shown in FIG. 4, when the right component 80 and the first and second conductors 70, 70a are both made of a conductive material, the component 80 and the first and second conductors 70 are 70a can be replaced as needed, such as implementing element 80 as a second conductor (70a) or implementing a second conductor 7a

Page 37 1292212 V. Inventive Note (33) is the component (80). Thus, the use of the circuit board can be made more flexible; as shown in FIG. 6, wherein the non-active surface 22 of the wafer 20 can also be set as required. a heat sink, as shown in the method of Figure 13, 3, 14, 5, 16 or 17, one or more insulators, conductors or components can be placed on the surface of the board as required, after being carved and removed The process is to form a circuit board of a plurality of conductive layers, and electrically connect the conductors between the conductive layers by using a conductive paste, a conductive path or a plating layer, wherein the first conductive plate 70p shown in FIG. 13A can be copper or A suitable material such as a metallic alloy is produced; as shown in FIG. 14A, wherein the number of layers of the conductive layers on the first upper and lower surfaces of the first conductive plate 70p can be determined according to requirements. Stacking and further having a second conductive layer or a third conductive layer and the like, and the first conductive layer 55 is disposed on the first lower surface 72p of the first conductive plate 7 Op as required, so that the first conductive layer 55 is provided in FIG. 14F. The first upper surface 71 of the first conductor 7 不 does not have the first conductive layer 55, and the material of each conductive layer The metal material may be changed according to requirements. For example, the first conductive layer is made of nickel, and the second conductive layer is made of a suitable metal material such as gold. At the same time, a preset shape may be set on the first guide plate 7 Op according to requirements. The first conductive layer 55 is used to facilitate the etching operation and to improve the usability of the circuit board 10. As shown in FIG. 1P or FIG. 1 , wherein the circuit board 11 of FIG. 1P is in the insulator 30 and the first conductor 7 (including Between the side of the first conductive layer 55 and the side of the second conductive layer 55a 58a), an insulating layer may be provided according to requirements, thereby making the first conductor 70 (including the first conductive layer 55 side) The edge 58 and the side edge 58a) of the second conductive layer 55a are more stably covered by the insulator 30 to improve the bonding property of the first conductor 70, the first conductive layer 55, the second conductive layer 55a and the insulator 30; As shown, an insulation may be provided between the first conductive plate 70p and the insulator 30 as needed.

Page 38 1292212 V. Inventive description (34), layer (insulati ng layer), according to which, the first conductive plate 7〇P is also more stably covered by the v-edge body 30 to enhance the first conductive plate 7〇 The bonding of P to the insulator 30, and a portion of the insulating layer can be removed during the etching process, such that a portion of the first upper surface 3 1 of the insulator 30 (see FIG. 16D) It can be exposed in the atmosphere, and at the same time, the insulating layer is implemented as part of the insulator 30; and as shown in Fig. 16 6; wherein the second lower surface 34 of the insulator 30 is The first lower surface 32 of the insulator 3 is 玎 interchangeable with each other, that is, the second lower surface 34 of the insulator 30 can be implemented as the second 而 2 and the first lower surface 32 of the insulator 〇 can be implemented as the second Therefore, the adhesive tape 174Α7:2^ the circuit board 11 can be opened, and only has the filler 43, so that the second shown in FIG. 17D (A, Β, C) is the first of the present invention. Class circuit board; at the same time, the body 70a is replaced; therefore, a conductive plate 70s can be applied for by a plurality of second guides according to requirements. , alteration or equivalent component replacement or in accordance with the scope of the present invention. Sentences and other changes and modifications should still belong to the invention patent

1292212 Brief description of the drawing [Simplified description of the drawings] Fig. 1 A to 1 J: sectional view of the first type of circuit board of the present invention; Fig. 1 K~1 P: sectional view of the second type of circuit board of the present invention; Fig. 1 Q~1 R. A cross-sectional view of a third type of circuit board of the present invention; FIGS. 2 to 10: a cross-sectional view of an embodiment of an electronic device to which the first type of circuit board of the present invention is applied; FIG. 11: an electronic device to which the second type of circuit board of the present invention is applied a cross-sectional view of an embodiment;

Figure 1 2 is a cross-sectional view showing an embodiment of an electronic device to which the third type of circuit board of the present invention is applied; Figure 1 3A to 1 3 E: a cross-sectional view of the first manufacturing method of the first type of circuit board of the present invention; Fig. 1 4A to 1 4 F: BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing a first manufacturing method of a second type of circuit board of the present invention; FIG. 1 6A to 1 6 E: a second type circuit of the present invention a cross-sectional view of a second manufacturing method of the board;

Figure 1 7A~1 7D is a cross-sectional view showing a third manufacturing method of the second type circuit board of the present invention; Fig. 18 is a cross-sectional view showing the structure of the conventional electronic device; [Description of main components] 1. Plate 5 ... conductive path 6 ..... conductive through hole 7 ... first conductor

Page 40 1292212 Brief description of the diagram 9 · · · • Custom electronic device 1 4 , 1 7 · · Accommodation space 2 0 , 2 5 · · · • Wafer 2 2 · · • Wafer non-active surface 3 1 · Insulator First upper surface 33·Insulator second upper surface 3 5 ·Insulator third lower surface 3 7 · · · Insulator side 3 9 · · · · Insulator protrusion 4 3 ... filler 4 6. ..... solder resist layer 4 8....... hole 5 0....... solder ball 8 ........ second conductor 10, 11, 12 · · circuit board 15· · · • Through-space accommodating space 2 1... wafer action surface 3 0.......•Insulator 32·· • Insulator first lower surface 34· · • Insulator second lower surface 3 6...Insulator recess 3 8...Insulator hole 4 0··......Package 4 5........Adhesive 4 7·... ....adhesive tape 4 9.........film 5 3 5 6 ..... bonding pad first conductive layer upper surface 5 5 5 7 first conductive layer conductive layer lower surface 5 8 _ • · · Conductive layer side 6 0 · Conductive member (conductive wire) 6 2 _ Conductive paste 6 5 • Conductive member (conductive bump) 6 9 _ Conductive path 7 0 • • . First - - conductor 7 1 · first conductor first upper surface 7 2 • first conductor lower surface 7 3 • first conductor first side 7 4 • first conductor second side 7 5 · • • first Conductor extension 7 7 • · • • Conductor protrusion 7 8 • • · _ conductor hole 7 9 • _ · conductor —— _ upper surface 8 0 · element 8 1 • · • element first upper surface 8 2 · • · Component No. — _ Lower surface 8 3 • · • • Side of the component

Page 41 1292212 Brief description of the diagram 8 4 ·————· The second side of the component 85.....The component extension 8 6.....•Component recess 88·.....Component hole 89 ........capacitor 90...electronic device 91··· • first electronic device 92··· • second electronic device 2 0 3 ..... 2nd chip 30a · · · First insulator 3 0 b · · · · Second insulator 3 0 c · · · · Third insulator 3 1a.............. First insulator first upper surface 3 2a ·.. . . . first insulator first lower surface 55a · · · second conductive layer 56a · second conductive layer upper surface

57a·second conductive layer lower surface 58a.·second conductive layer side 70a·····second conductor 70b.....third conductor 70c·····fourth conductor 70p···· a conductive plate 70s · · a second conductive plate 71a · a second conductor first upper surface 7 1b ... ... third conductor first upper surface 7 1c. ..... fourth conductor first upper surface 7 1 ρ...........first conductive plate first upper surface 7 1s...........second conductive The first upper surface of the board 7 2a ... the second lower surface of the second conductor 7 2b ... the first lower surface of the third conductor

7 2c............the fourth lower surface of the fourth conductor 7 2 ρ.....the first lower surface of the first conductive plate 7 2s..... ...the first lower surface of the second conductive plate 7 3a........the first side of the second conductor 7 3 b ·the first side of the third conductor 7 3 c ·The first side of the fourth conductor

Page 42 1292212 Brief description of the diagram 7 4 a · Second conductor second side 75a 75b · Third conductor extension 76s 77a, 77b........ 7 7c........ .... 7 7 p............ 7 8 a, 7 8 s • Hole 7 C... • Carcass D E... • Crack G Η... • Southern Ρ a • Second conductor extension • Second conductive plate recess • • Second conductor projection • • • First conductor projection • • First conductive plate projection The two conductors penetrate the accommodating space........distance........gap.......protrusion

Page 43

Claims (1)

1292212 6. Patent application scope 1. A circuit board structure for an electronic device, comprising: an insulator and a first conductor; wherein the insulator has a first upper surface, a first lower surface and a side edge; And the first conductor has a first upper surface, a first lower surface and a first side, and the first conductor is covered by the insulator, so that at least a portion of the first side of the first conductor is buried in the insulator And at least a portion of the first upper surface of the first conductor is convex and exposed outside the first upper surface of the insulator, and at least a portion of the first lower surface of the first conductor is exposed outside the first lower surface of the insulator Wherein the first conductor is not made of a conductive paste. 2. A circuit board structure for an electronic device according to claim 1, wherein the first conductor has an extension and the extension is bonded to the first upper surface or the first lower surface of the insulator . 3. The circuit board structure for an electronic device according to claim 1, wherein the circuit board has a through hole, and the hole can be implemented as a circuit board accommodation space. 4. The circuit board structure for an electronic device according to claim 1, wherein an element is provided on the first upper surface or the first lower surface of the insulator, the element having a first upper surface and a first lower surface and a first side, wherein the first lower surface of the component is bonded to the insulator, so that the first upper surface and the first side of the component are not covered by the insulator and exposed to the insulator, and the component can be implemented as a second conductor or heat dissipation The person. 5. The circuit board structure for an electronic device according to claim 1, wherein an element is provided on the first upper surface or the first lower surface of the insulator, the element having a first upper surface and a first lower surface and The first side, where the component Page 44 1292212 6. The first lower surface of the patent application scope is covered by an insulator and is not exposed to the outside of the insulator, and at least a portion of the first side is also covered by the insulator and is not exposed outside the insulator, and The first upper surface is not covered by the insulator and exposed to the outside of the insulator, and the element can be implemented as a second conductor or heat sink. 6. The circuit board structure for an electronic device according to claim 1, wherein an element is provided in the insulator, the element having a first upper surface, a first lower surface and a first side, wherein the component At least a portion of the first side is covered by the insulator and is not exposed to the outside of the insulator, and the first upper surface and the first lower surface are not covered by the insulator and are respectively exposed outside the insulator, and the component can be implemented as The second conductor or heat sink. 7. A circuit board structure for an electronic device according to claim 5, wherein the element has an extension and the extension is joined to the insulator. 8. A circuit board structure for an electronic device according to claim 6, wherein the element has an extension and the extension is joined to the insulator. 9. A circuit board structure for an electronic device according to claim 4, wherein the element is a hole having a through shape. 10. A circuit < </ RTI> structure for an electronic device according to claim 5, wherein the element is a hole having a through shape. 11. A circuit board structure for an electronic device according to claim 6, wherein the element is a hole having a through shape. 12. A circuit board structure for an electronic device according to claim 4, wherein the component has a recess, the component having a first upper surface and a first Page 45 1292212 VI. Scope of Patent Application 2. Upper surface, or with first lower surface and second lower surface. 13. A circuit board structure for an electronic device according to claim 5, wherein the element has a recess such that the element has a first upper surface and a second upper surface. 14. A circuit board structure for an electronic device according to claim 6, wherein the element has a recess, the element having a first upper surface and a second upper surface, or having a first lower surface and a second The lower surface. 15. The circuit board structure for an electronic device according to claim 1, wherein a second insulator is disposed on the circuit board, the second insulator having a first upper surface, a first lower surface and a side And a third conductor is disposed on the second insulator, and the third conductor is electrically connected to the first conductor of the circuit board, respectively, so that the circuit board is a circuit board having a plurality of conductive layers, and the third conductor and the first conductor are The electrical connection can be implemented by means of a conductive path, a conductive paste or a plated metal. 16. The circuit board structure for an electronic device according to claim 1, wherein the electronic device comprises: at least one circuit board having at least one circuit board after the electronic circuit device is disposed on the electronic device An accommodation space and at least one first conductor; At least one wafer disposed on the accommodating space of the circuit board; at least one conductive member respectively engaged with the first conductor of the wafer and the circuit board to electrically connect the wafer to the first conductor of the circuit board, wherein The conductive member is implemented as a conductive line or a conductive protrusion; and at least one package encapsulating the circuit board, the wafer, and the conductive member. </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; The at least one circuit board has at least one through-hole accommodating space and at least one first conductor; at least one wafer is disposed in the through-type accommodating space of the circuit board; at least one conductive member is respectively associated with the wafer and The first conductor of the circuit board is bonded to electrically connect the wafer to the first conductor of the circuit board, wherein the conductive member is implemented as a conductive line; and at least one package encapsulating the circuit board, the wafer and the conductive member. 18. The circuit board structure for an electronic device according to claim 3, wherein after the circuit board is disposed on the electronic device, the electronic device includes: at least one circuit board having at least one a penetrating accommodating space and at least one first conductor; at least one wafer, the active surface of the wafer is bonded to the surface of the circuit board, and disposed on the through-hole accommodating space of the circuit board; at least one conductive member, respectively The first conductor of the wafer and the circuit board is bonded to electrically connect the first conductor of the circuit board, wherein the conductive member j is implemented as a conductive line or a conductive protrusion; and at least one package encapsulating the circuit board , wafers and conductive parts. 19. A circuit board structure for an electronic device according to claim 1, wherein after the circuit board is disposed on the electronic device, the electronic device includes: Page 47 1292212 6. Patent application at least one circuit board having at least one accommodating space and at least one first conductor; at least one wafer disposed at a side of the circuit board; at least one conductive member, respectively Bonding the first conductor of the chip and the circuit board to electrically connect the wafer to the first conductor of the circuit board, wherein the conductive member is implemented as a conductive line; and at least one package encapsulating the circuit board, the wafer, and the conductive member By. 20. A circuit board structure for an electronic device, comprising: an insulator and a first conductor; wherein, | | the insulator has a first upper surface, a first lower surface and a side; and the first The conductor has a first upper surface, a first lower surface and a first side, and the first conductor is covered by the insulator, so that at least a portion of the first side of the first conductor is buried in the insulator, and At least a portion of the first upper surface of the conductor is convex and exposed outside the first upper surface of the insulator, and at least a portion of the first lower surface of the first conductor is convex and exposed outside the first lower surface of the insulator; Wherein the first conductor is not made of a conductive paste. 21. The circuit board structure for an electronic device according to claim 20, wherein the first conductor has an extension portion and the extension portion is bonded to the first upper surface or the first lower surface of the insulator on. The circuit board structure for an electronic device according to claim 20, wherein the circuit board has a through hole, and the hole can be implemented as a circuit board accommodation space. 23. A circuit board structure for an electronic device according to claim 20, wherein the component is provided on the first upper surface or the first lower surface of the insulator, Page 48 1292212 VI. Scope of Application This component has a first upper surface, a first lower surface and a first side, wherein the first lower surface of the component is bonded to the insulator such that the first upper surface and the first side of the component The element is exposed to the insulator without being covered by the insulator, and the element can be implemented as a second conductor or heat sink. 24. The circuit board structure for an electronic device according to claim 20, wherein an element is disposed on the first upper surface or the first lower surface of the insulator, the element having a first upper surface and a first lower surface and a first side, wherein the first lower surface of the component is covered by the insulator and is not exposed to the outside of the insulator, and at least a portion of the first side is also covered by the insulator and is not exposed The outer portion of the insulator is such that its first upper surface is not covered by the insulator and is exposed outside the insulator, and the element can be implemented as a second conductor or heat sink. 25. The circuit board structure for an electronic device according to claim 20, wherein the insulator has an element having a first upper surface, a first lower surface and a first side, wherein the component At least a portion of the first side is covered by the insulator and is not exposed to the outside of the insulator, and the first upper surface and the first lower surface are not covered by the insulator and are respectively exposed outside the insulator, and the component can be implemented as The second conductor or heat sink. 2. A circuit board structure for an electronic device according to claim 24, wherein the element has an extension and the extension is joined to the edge of the insulator. 27. A circuit board structure for an electronic device according to claim 25, wherein the element has an extension and the extension is joined to the insulator. 28. An electrical device for an electronic device as claimed in claim 23 Page 49 1292212 VI. Scope of Application Patent The structure of the road board, in which the component is a hole with a penetrating shape. 29. A circuit board structure for an electronic device according to claim 24, wherein the component is a hole having a through shape. 30. A circuit board structure for an electronic device according to claim 25, wherein the component is a hole having a through shape. 31. A circuit board structure for an electronic device according to claim 23, wherein the element has a recess, the element having a first upper surface and a second upper surface, or having a first lower surface and a second The lower surface. 3. A circuit board structure for an electronic device according to claim 24, wherein the element has a recess such that the element has a first upper surface and a second upper surface. 33. A circuit board structure for an electronic device according to claim 25, wherein the element has a recess, the element having a first upper surface and a second upper surface, or having a first lower surface and a second The lower surface. 4. A circuit board structure for an electronic device according to claim 20, wherein a second insulator is disposed on the circuit board, the second insulator having a first upper surface and a first lower surface and a third conductor is disposed on the second insulator, and the third conductor is electrically connected to the first conductor of the circuit board, so that the circuit board is a circuit board having a plurality of conductive layers, and the third conductor and the first conductor The electrical connection can be implemented by means of a conductive path, a conductive paste or a plated metal. 35. A circuit board structure for an electronic device according to claim 20, wherein after the circuit board is disposed on the electronic device, the electronic device includes: Page 50 1292212 VIII. Patent application at least one circuit board having at least one accommodating space and at least one first conductor; at least one wafer disposed on the accommodating space of the circuit board; at least one conductive member Engaging with the first conductor of the chip and the circuit board, respectively, electrically connecting the wafer to the first conductor of the circuit board, wherein the conductive member is implemented as a conductive line or a conductive protrusion; and at least one package encapsulating the circuit Board, wafer and conductive parts. 36. A circuit board structure for an electronic device according to claim 22, wherein the electronic device is provided after the electronic device is disposed, the electronic device includes: at least one circuit board having at least one a penetrating accommodating space and at least one first conductor; at least one wafer disposed in the through-type accommodating space of the circuit board; at least one conductive member respectively engaged with the first conductor of the wafer and the circuit board, The chip is electrically connected to the first conductor of the circuit board, wherein the conductive member is implemented as a conductive line; and at least one package encapsulating the circuit board, the wafer, and the conductive member. 37. The circuit board structure for an electronic device according to claim 22, wherein after the circuit board is disposed on the electronic device, the electronic device includes: at least one circuit board having at least one a through-shaped receiving space and at least one first conductor; at least one wafer, the active surface of the wafer is bonded to the surface of the circuit board, and is disposed on the through-shaped receiving space of the circuit board; Page 51 1292212 6. Patent application at least one conductive member, which is respectively engaged with the first conductor of the wafer and the circuit board, so that the wafer is electrically connected to the first conductor of the circuit board, wherein the conductive member is implemented as a conductive wire. Or a conductive protrusion; and at least one package encapsulating the circuit board, the wafer, and the conductive member. 3. The circuit board structure for an electronic device according to claim 20, wherein after the circuit board is disposed on the electronic device, the electronic device includes: at least one circuit board having At least one housing space and at least one first conductor; ^ at least one wafer disposed on a side of the circuit board; at least one conductive member respectively engaged with the first conductor of the wafer and the circuit board to electrically connect the wafer to the first conductor of the circuit board, wherein the conductive The device is implemented as a conductive wire; and at least one package encapsulating the circuit board, the wafer, and the conductive member. 39. A circuit board structure for an electronic device, comprising: an insulator and a first conductor; wherein the insulator has a first upper surface, a first lower surface, a side edge, and a through-shaped receiving space; and The first conductor is disposed on a periphery of the insulator-through accommodating space, and has a first upper surface, a first lower surface, a first side and a second side, wherein the first conductor is covered by the insulator, wherein The first side is covered by the insulator and is not exposed to the insulator, and the second side is a through-shaped receiving space that is not covered by the insulator and is exposed to the insulator, and the first upper surface and the first lower surface are respectively Exposed to the first upper surface of the insulator and the first lower surface; wherein, the first Page 52 1292212 VI. Scope of Patent Application A conductor is not made of conductive paste. 40. A circuit board structure for an electronic device according to claim 39, wherein the first conductor has an extension and the extension is bonded to the first upper surface or the first lower surface of the insulator. By. 41. A circuit board structure for an electronic device according to claim 39, wherein the first upper surface of the first conductor protrudes from the first upper surface of the insulator, or the first lower surface of the first conductor The surface is protruded from the first lower surface of the insulator. 4. A circuit board structure for an electronic device according to claim 39, wherein an element is provided on the first upper surface or the first lower surface of the insulator, the element having a first upper surface and a first lower surface And the first side, wherein the first lower surface of the component is bonded to the insulator such that the first upper surface and the first side of the component are not covered by the insulator and exposed to the insulator, and the component may be implemented as a second conductor or Heat sink. 4. A circuit board structure for an electronic device according to claim 39, wherein an element is provided on the first upper surface or the first lower surface of the insulator, the element having a first upper surface and a first lower surface And a first side, wherein the first lower surface of the component is covered by the insulator and is not exposed outside the insulator, At least a portion of the first side of the first side is also covered by the insulator and is not exposed to the outside of the insulator, and the first upper surface is not covered by the insulator and exposed outside the insulator, and the component can be implemented as a second conductor Or the heat sink. 4. A circuit board structure for an electronic device according to claim 39, wherein an element is provided in the insulator, the element having a first upper surface, a first lower surface and a first side, wherein At least one of the first side of the component Page 53 1292212 VI. The patent application scope is covered by an insulator and is not exposed to the outside of the insulator, and the first upper surface and the first lower surface are not covered by the insulator and are respectively exposed outside the insulator, and the component can be Implemented as a second conductor or heat sink. 45. A circuit board structure for an electronic device according to claim 43, wherein the element has an extension and the extension is joined to the insulator. 4. A circuit board structure for an electronic device according to claim 44, wherein the element has an extension and the extension is joined to the insulator. 4. A circuit board structure for an electronic device according to claim 42, wherein the element is a hole having a through shape. 4. A circuit board structure for an electronic device according to claim 43, wherein the element is a hole having a through shape. 49. A circuit board structure for an electronic device according to claim 44, wherein the component is a hole having a through shape. 50. A circuit board structure for an electronic device according to claim 42, wherein the element has a recess, the element having a first upper surface and a second upper surface, or having a first lower surface and a second The lower surface. 51. A circuit board structure for an electronic device according to claim 43, wherein the element has four portions, the element having a first upper surface and a second upper surface. 5. A circuit board structure for an electronic device according to claim 44, wherein the element has a recess, the element having a first upper surface and a second upper surface, or having a first lower surface and a Two under the surface. The invention relates to a circuit board structure for an electronic device according to claim 39, wherein a second insulator is disposed on the circuit board, and the second insulator has a first An upper surface, a first lower surface and a side edge, and a third conductor is disposed on the second insulator, so that the third conductor is electrically connected to the first conductor of the circuit board, respectively, so that the circuit board is a circuit board having a plurality of conductive layers. The electrical connection between the third conductor and the first conductor can be implemented by means of a conductive path, a conductive paste or a plated metal. 5. The circuit board structure for an electronic device according to claim 39, wherein after the circuit board is disposed on the electronic device, the electronic device includes: at least one circuit board having At least one through-hole accommodating space and at least one first conductor; at least one wafer disposed on the through-hole accommodating space of the circuit board; at least one conductive member respectively engaged with the first conductor of the wafer and the circuit board The chip is electrically connected to the first conductor of the circuit board, wherein the conductive member is implemented as a conductive line; and at least one package encapsulating the circuit board, the wafer, and the conductive member. 5. The circuit board structure for an electronic device according to claim 39, wherein after the circuit board is disposed on the electronic device, the electronic device includes: at least one circuit board having At least one through-hole accommodating space and at least one first conductor; at least one wafer disposed in the through-type accommodating space of the circuit board; at least one conductive member respectively connected to the first conductor of the chip and the circuit board Page 55 1292212 6. The scope of the patent application is such that the wafer is electrically connected to the first conductor of the circuit board, wherein the conductive member is implemented as a conductive wire; and at least one package encapsulating the circuit board, the wafer and the conductive The person. The circuit board structure for an electronic device according to claim 39, wherein after the electronic device is disposed on the electronic device, the electronic device includes: at least one circuit board having at least one a through-shaped receiving space and at least one first conductor; At least one wafer, the active surface of the wafer is bonded to the surface of the circuit board, and disposed on the through-hole receiving space of the circuit board; at least one conductive member is respectively engaged with the first conductor of the wafer and the circuit board, so that the wafer is The first conductor of the circuit board is electrically connected, wherein the conductive member is implemented as a conductive line or a conductive protrusion; and at least one package encloses the circuit board, the wafer, and the conductive member. 57. The circuit board structure for an electronic device according to claim 41, wherein after the electronic device is disposed on the electronic device, the electronic device includes: at least one circuit board having at least one An insulator and at least one first conductor; At least one wafer disposed on a side of the circuit board; at least one conductive member respectively engaged with the first conductor of the wafer and the circuit board to electrically connect the wafer to the first conductor of the circuit board, wherein the conductive member It is implemented as a conductive wire; and at least one package encapsulating the circuit board, the wafer, and the conductive member. Page 56 1292212 VI. Patent Application Range 58. A circuit board structure for an electronic device, comprising: an insulator, a first conductor and an element; wherein the insulator has a first upper surface, a first lower portion a first conductor having a first upper surface, a first lower surface and a first side, the first conductor being covered by the insulator, the first side of the first conductor having at least a portion Buried in the insulator, and at least a portion of the first upper surface and the first lower surface of the first conductor are respectively exposed on the first upper surface of the insulator and the outside of the first lower surface; wherein the first conductor is not made of a conductive paste And the component is disposed on the first upper surface of the insulator, having a first upper surface, a first lower surface and a first side, and the component is covered by the insulator, so that the first side of the component has at least A portion is buried in the insulator, and the first upper surface of the component is exposed outside the first upper surface of the insulator, and the first lower surface of the component is covered by the insulator and not exposed to the insulator. 59. A circuit board structure for an electronic device according to claim 58 wherein the first conductor has an extension and the extension is bonded to the first upper surface or the first lower surface of the insulator. . 60. A circuit board structure for an electronic device according to claim 58 wherein the circuit board has a through hole which can be applied to the circuit board accommodation space. 61. A circuit board structure for an electronic device according to claim 58, wherein an element is disposed on the first upper surface or the first lower surface of the insulator, the element having a first upper surface and a first lower surface and a first side, wherein the first lower surface of the component is bonded to the insulator such that the first upper surface of the component Page 57 1292212 VI. Scope of Application The first side is not covered by an insulator and exposed to an insulator, and this element can be implemented as a second conductor or heat sink. 62. A circuit board structure for an electronic device according to claim 58 wherein an element is disposed on the first upper surface or the first lower surface of the insulator, the element having a first upper surface and a first lower surface and a first side, wherein the first lower surface of the component is covered by the insulator and is not exposed to the outside of the insulator, and at least a portion of the first side is also covered by the insulator and is not exposed outside the insulator, and The first upper surface is not covered by the insulator and exposed to the outside of the insulator, and the element can be implemented as a second conductor or heat sink. 6 . The circuit board structure for an electronic device according to claim 58 , wherein an element is disposed in the insulator, the element having a first upper surface, a first lower surface and a first side, wherein At least a portion of the first side of the component is covered by the insulator and is not exposed to the outside of the insulator, and the first upper surface and the first lower surface are not covered by the insulator and are respectively exposed outside the insulator, and the component can be implemented For the second conductor or heat sink. 6. A circuit board structure for an electronic device according to claim 62, wherein the element has an extension and the extension is joined to the insulator. 65. A circuit board structure for an electronic device according to claim 63, wherein the element has an extension and the extension is joined to the insulator. 6. A circuit board structure for an electronic device according to claim 61, wherein the element is a hole having a through shape. Page 58 1292212 VI. Scope of Application Patent 67. A circuit board structure for an electronic device according to claim 62, wherein the element is a hole having a through shape. 68. A circuit board structure for an electronic device according to claim 63, wherein the element is a hole having a through shape. 6. A circuit board structure for an electronic device according to claim 61, wherein the element has a recess, the element having a first upper surface and a second upper surface, or having a first lower surface With the second lower surface. 70. A circuit board structure for an electronic device according to claim 62, wherein the element has a recess, the element having a first upper surface and a second upper surface, or having a first lower surface and The second lower surface. 71. A circuit board structure for an electronic device according to claim 63, wherein the element has a recess, the element having a first upper surface and a second upper surface, or having a first lower surface and a Two under the surface. The circuit board structure for an electronic device according to claim 58 , wherein a second insulator is disposed on the circuit board, the second insulator having a first upper surface and a first lower surface and a third conductor is disposed on the second insulator, and the third conductor is electrically connected to the first conductor of the circuit board, so that the circuit board is a circuit board having a plurality of conductive layers, and the third conductor and the first conductor Inter-electrical connection can be made by conductive path, conductive paste or electroplated gold Φ is implemented in a manner such as genus. The circuit board structure for an electronic device according to claim 58 , wherein after the circuit board is disposed on the electronic device, the electronic device includes: at least one circuit board having at least one a housing space and at least one first Page 59 1292212 6. Patent-scoped conductor; at least one wafer disposed on the accommodating space of the circuit board; at least one conductive member respectively engaged with the first conductor of the wafer and the circuit board to make the wafer and the circuit board The first conductor is electrically connected, wherein the conductive member is implemented as a conductive line or a conductive protrusion; and at least one package encloses the circuit board, the wafer, and the conductive member. The circuit board structure for an electronic device according to claim 60, wherein after the circuit board is disposed on the electronic device, the electronic device includes: at least one circuit board having At least one through-hole accommodating space and at least one first conductor; at least one wafer disposed in the through-type accommodating space of the circuit board; at least one conductive member respectively engaged with the first conductor of the wafer and the circuit board The chip is electrically connected to the first conductor of the circuit board, wherein the conductive member is implemented as a conductive line; and at least one package encapsulating the circuit board, the wafer, and the conductive member. The circuit board structure for an electronic device according to claim 60, wherein after the circuit board is disposed on the electronic device, the electronic device includes: at least one circuit board having At least one through-hole accommodating space and at least one first conductor; at least one wafer, the active surface of the wafer is bonded to the surface of the circuit board, and disposed on the through-hole accommodating space of the circuit board; at least one conductive member, respectively Connected to the first conductor of the chip and the board Page 60 1292212 6. The scope of the patent application is such that the wafer is electrically connected to the first conductor of the circuit board, wherein the conductive member is implemented as a conductive wire or a conductive protrusion; and at least one package encapsulating the circuit board , wafers and conductive parts. 76. The circuit board structure for an electronic device of claim 58, wherein the electronic device is provided with: at least one circuit board having at least one circuit board An accommodating space and at least one first conductor; at least one wafer disposed on a side of the circuit board; The at least one conductive member is respectively bonded to the first conductor of the wafer and the circuit board to electrically connect the wafer to the first conductor of the circuit board, wherein the conductive member is implemented as a conductive line; and at least one package body is It encapsulates circuit boards, wafers, and conductive parts. 77. A circuit board structure for an electronic device, comprising: an insulator, a first conductor and an element; wherein The insulator has a first upper surface, a first lower surface and a side edge; the first conductor has a first upper surface, a first lower surface and a first side, and the first conductor is covered by an insulator, At least a portion of the first side of the first conductor is buried in the insulator, and at least a portion of the first upper surface and the fourth lower surface of the first conductor are respectively exposed on the first upper surface and the first lower surface of the insulator Externally; wherein the first conductor is not made of a conductive paste; and the component is disposed on the first upper surface of the insulator, having a first upper surface, a first lower surface and a first side, so that the component is first The surface is bonded to the insulator, and the first upper surface and the first side of the component are uninsulated Page 61 1292212 VI. Scope of application for patents Covered and exposed outside the first upper surface of the insulator. 78. A circuit board structure for an electronic device according to claim 77, wherein the first conductor has an extension and the extension is bonded to the first upper surface or the first lower surface of the insulator . 79. A circuit board structure for an electronic device according to claim 77, wherein the circuit board has a through hole which can be implemented as a circuit board accommodation space. 80. A circuit board structure for an electronic device according to claim 77, wherein the component is provided on the first upper surface or the first lower surface of the insulator, The element has a first upper surface, a first lower surface and a first side, wherein the first lower surface of the component is covered by the insulator and is not exposed to the outside of the insulator, and at least a portion of the first side is also It is covered by an insulator and is not exposed to the outside of the insulator, and its first upper surface is not covered by the insulator and exposed to the outside of the insulator, and the element can be implemented as a second conductor or heat sink. 81. A circuit board structure for an electronic device according to claim 77, wherein an element is provided in the insulator, the element having a first upper surface, a first lower surface and a first side, wherein the component At least a portion of the first side is covered by the insulator and is not exposed to the outside of the insulator, and the first upper surface and the first lower surface are not covered by the insulator and are respectively exposed outside the insulator ►, and this element can be implemented as a second conductor or heat sink. 82. A circuit board structure for an electronic device according to claim 80, wherein the element has an extension and the extension is joined to the insulator. 8 3. An electric device for an electronic device as described in claim 81 Page 62 1292212 A slab structure in which the element has an extension and the extension is joined to the insulator. 84. A circuit board structure for an electronic device according to claim 77, wherein the component is a hole having an H shape. A device board structure for an electronic device according to claim 80, wherein the element is a hole having a through shape. 86. A circuit board structure for an electronic device according to claim 81, wherein the component is a hole having a through shape. The circuit board structure for an electronic device according to claim 77, wherein the element has a recess, the element having the first upper surface and the first upper surface, or having the first lower surface and the first Look at the surface. 8. The circuit board structure for an electronic device according to claim 8, wherein the component has a recess, the component having a first upper surface and a second upper surface, or having a first lower surface and The second lower surface. 89. A circuit board structure for an electronic device according to claim 81, wherein the element has a recess so that the element has a first upper surface and a second upper surface, or has a first lower surface and a Two under the surface. The invention relates to a battery structure for a electronic device according to the seventh aspect of the invention, wherein a second insulator is disposed on the road board, and the second insulator has a first upper surface and a first lower portion. a second conductor is disposed on the surface of the second conductor, and the third conductor is electrically connected to the first conductor of the circuit board. The circuit board is a circuit board having a plurality of conductive layers, and the third conductor is electrically connected to the first conductor. The sexual connection can be implemented by means of a conductive path, a conductive paste or a plated metal. 91. A circuit for an electronic device according to claim 77 1292212. The application of the patent range board structure, wherein the circuit board is disposed on the electronic device, the electronic device includes: at least one circuit board having at least one receiving space and at least one first conductor; at least one chip, The conductive member is electrically connected to the first conductor of the circuit board, and the conductive member is implemented as a conductive line or a conductive protrusion; at least one package encapsulating the circuit board, the wafer, and the conductive member. The circuit board structure for an electronic device according to claim 79, wherein the circuit board is disposed after the electronic device, the electronic device includes: at least one circuit board having At least one through-hole accommodating space and at least one first conductor; at least one wafer disposed in the through-type accommodating space of the circuit board; at least one conductive member respectively engaged with the first conductor of the wafer and the circuit board The chip is electrically connected to the first conductor of the circuit board, wherein the conductive member is implemented as a conductive line; and at least one package encapsulating the circuit board, the wafer, and the conductive member. The circuit board structure for an electronic device according to claim 79, wherein the electronic device is provided with: at least one circuit board, Having at least one through-shaped receiving space and at least one first conductor; Page 64 1292212 VI. The patent application scope is at least one wafer, the active surface of the wafer is bonded to the surface of the circuit board, and is disposed on the through-shaped receiving space of the circuit board; at least one conductive member, respectively, and the chip and the circuit board The first conductor is bonded to electrically connect the wafer to the first conductor of the circuit board, wherein the conductive member is implemented as a conductive line or a conductive protrusion; and at least one package encapsulating the circuit board, the wafer and the conductive member By. The circuit board structure for an electronic device according to claim 77, wherein after the circuit board is disposed on the electronic device, the electronic device includes: || at least one circuit board, The device has at least one accommodating space and at least one first conductor; at least one wafer disposed on a side of the circuit board; at least one conductive member respectively engaged with the first conductor of the wafer and the circuit board, so that the wafer and the circuit The first conductor of the board is electrically connected, wherein the conductive member is implemented as a conductive line; and at least one package encloses the circuit board, the wafer, and the conductive member. 9 5. A circuit board structure for an electronic device, comprising: an insulator and a first conductor; wherein the insulator has a first upper surface, a first lower surface, a side and a + hole; and The first conductor has a first upper surface, a first lower surface, a first side and an extension, and the first side of the first conductor is disposed in the hole of the insulator and is not covered by the insulator, and the first conductor The extension portion is disposed on the first upper surface of the insulator such that at least a portion of the extension of the first conductor is 1292212 6. The patent application scope is convex and exposed outside the first upper surface of the insulator, and at least a portion of the first surface of the first conductor is exposed outside the first lower surface of the insulator. 96. A circuit board structure for an electronic device according to claim 95, wherein the circuit board has a through hole which can be implemented as a circuit board accommodation space. 97. A circuit board structure for an electronic device according to claim 95, wherein an element is disposed on the first upper surface or the first lower surface of the insulator, the element having a first upper surface and a first lower surface and a first side, wherein the first lower surface of the component is bonded to the insulator, so that the first upper surface and the first side of the component are not covered by the insulator and exposed to the insulator, and the component can be implemented as a second conductor or heat dissipation The person. 9. The circuit board structure for an electronic device according to claim 95, wherein an element is disposed on the first upper surface or the first lower surface of the insulator, the element having a first upper surface, the first lower portion a surface and a first side, wherein the first lower surface of the component is covered by the insulator and is not exposed to the outside of the insulator, and at least a portion of the first side is also covered by the insulator and is not exposed outside the insulator, And the first upper surface is not covered by the insulator and exposed to the outside of the insulator, and the component can be implemented as a second conductor or a heat sink. [9] 9. A circuit board structure for an electronic device according to claim 95, wherein an element is provided in the insulator, the element having a first upper surface, a first lower surface and a first side, wherein At least a portion of the first side of the component is covered by the insulator and is not exposed to the outside of the insulator, and the first upper surface and the first lower surface are not covered by the insulator and are respectively exposed outside the insulator. 1292212 VI. Apply for the patent scope, and this component can be implemented as a second conductor or heat sink. A circuit board structure for an electronic device according to claim 98, wherein the element has an extension and the extension is joined to the insulator. A circuit board structure for an electronic device according to claim 99, wherein the element has an extension and the extension is joined to the insulator. A circuit board structure for an electronic device according to claim 97, wherein the element is a hole having a through shape. A circuit board structure for an electronic device according to claim 98, wherein the element is a hole having a through shape. 104. A circuit board structure for an electronic device according to claim 99, wherein the element is a hole having a through shape. 105. A circuit board structure for an electronic device according to claim 97, wherein the element has a recess, the element having a first upper surface and a second upper surface, or having a first lower surface and a second The lower surface. 106. A circuit board structure for an electronic device according to claim 98, wherein the element has a recess, the element having a first upper surface and a second upper surface, or having a first lower surface and a second The lower surface. A circuit board structure for an electronic device according to claim 99, wherein the element has a recess, the element having a first upper surface and a second upper surface, or having a first lower surface With the second lower surface. 108. A circuit board structure for an electronic device according to claim 95, wherein a second insulator is disposed on the circuit board, the second Page 67 1292212 6. The patent application scope has a first upper surface, a first lower surface and a side edge, and a third conductor is disposed on the second insulator, so that the third conductor is electrically connected to the first conductor of the circuit board, respectively. The circuit board is a circuit board having a plurality of conductive layers, and the third conductor and the first conductor are electrically connected to each other by a conductive path, a conductive paste or a plated metal. The circuit board structure for an electronic device according to claim 95, wherein after the circuit board is disposed on the electronic device, the electronic device includes: at least one circuit board having at least one An accommodating space and at least one first φ conductor; at least one wafer disposed on the accommodating space of the circuit board; at least one conductive member respectively engaged with the first conductor of the wafer and the circuit board to enable the wafer and the circuit The first conductor of the board is electrically connected, wherein the conductive member is implemented as a conductive line or a conductive protrusion; and at least one package encloses the circuit board, the wafer, and the conductive member. 110. A circuit board structure for an electronic device according to claim 96, wherein the electronic device is provided after the electronic device is disposed, the electronic device includes: at least one circuit board having at least one a penetrating accommodating space and at least a first conductor; at least one wafer disposed in the through-type accommodating space of the circuit board; at least one conductive member respectively engaged with the first conductor of the wafer and the circuit board, Electrically connecting the wafer to the first conductor of the circuit board, wherein the conductive member is implemented as a conductive line; Page 68 1292212 VI. Scope of Application At least one package, which encloses circuit boards, wafers and conductive parts. The circuit board structure for an electronic device according to claim 96, wherein after the circuit board is disposed on the electronic device, the electronic device includes: at least one circuit board having at least one a through-shaped receiving space and at least one first conductor; at least one wafer, the active surface of the wafer is bonded to the surface of the circuit board, and is disposed on the through-shaped receiving space of the circuit board; The at least one conductive member is respectively connected to the first conductor of the wafer and the circuit board to electrically connect the wafer to the first conductor of the circuit board, wherein the conductive member is implemented as a conductive line or a conductive protrusion; At least one package encapsulating the circuit board 'wafer and conductive member. The circuit board structure for an electronic device according to claim 95, wherein after the circuit board is disposed on the electronic device, the electronic device includes: at least one circuit board having at least one An accommodating space and at least one first conductor; at least one wafer disposed on a side of the circuit board; At least one conductive member is respectively connected to the first conductor of the wafer and the circuit board to electrically connect the wafer to the first conductor of the circuit board, wherein the conductive member is implemented as a conductive wire, and at least one package Body, which encapsulates circuit boards, wafers, and conductive parts. 113. A circuit board structure for an electronic device, comprising: an insulator and a first conductor; wherein Page 69 1292212 s. Patent Application Scope The insulator has a first upper surface, a first lower surface and a side edge; and the first conductor has a convex portion, a first lower surface and a first side, wherein The convex portion has an upper surface and the upper surface of the convex portion is implemented as a first upper surface of the first conductor, so that the first upper surface of the first conductor is protruded, and the first conductor is covered by an insulator Having at least a portion of the first side of the first conductor buried in the insulator, and at least a portion of the protrusion of the first conductor is exposed outside the first upper surface of the insulator, and the first lower surface of the first conductor At least a portion is exposed outside the first lower surface of the insulator; wherein the first conductor is not made of a conductive paste. 114. A circuit board structure for an electronic device according to claim 113, wherein the first conductor has an extension and the extension is bonded to the insulator. 115. A circuit board structure for an electronic device according to claim 113, wherein the circuit board has a through hole which can be implemented as a circuit board accommodation space. 1 1 6. A circuit board structure for an electronic device according to claim 13 , wherein an element is disposed on the first upper surface or the first lower surface of the insulator, the element having a first upper surface, first a lower surface and a first side, wherein the first lower surface of the component is bonded to the insulator such that the first upper surface and the first side of the component are not covered by the insulator and exposed to the insulator, and the component can be implemented as a second Conductor or heat sink. 117. The circuit board structure for an electronic device according to claim 113, wherein an element is disposed on the first upper surface or the first lower surface of the insulator, the element having a first upper surface and a first lower surface and The first side, its Page 70 1292212 6. In the patent application scope, the first lower surface of the component is covered by the insulator and is not exposed to the outside of the insulator, and at least a portion of the first side is also covered by the insulator and is not exposed to the insulator. Externally, and the first upper surface is not covered by the insulator and exposed to the outside of the insulator, and the element can be implemented as a second conductor or heat sink. 118. A circuit board structure for an electronic device according to claim 113, wherein an element is provided in the insulator, the element having the first upper table a first lower surface and a first side, wherein at least a portion of the first side of the element is covered by the insulator and is not exposed outside the insulator, and the first surface and the first lower surface are They are not exposed to the insulator and are exposed to the outside of the insulator, respectively, and the component can be implemented as a second conductor or heat sink. 119. A circuit board structure for an electronic device according to claim 117, wherein the element has an extension and the extension is joined to the insulator. 120. A circuit board structure for an electronic device according to claim 118, wherein the component has an extension and the extension is joined to the insulator. 121. A circuit board structure for an electronic device according to claim 116, wherein the component is a hole having a through shape. &lt;122. A circuit board structure for an electronic device according to claim 117, wherein the element is a hole having a through shape. 123. A circuit board structure for an electronic device according to claim 118, wherein the component is a hole having a through shape. 12 4. An electronic device for use in an electronic device as claimed in claim 16 Page 71 1292212 VI. Patent Application The circuit board structure in which the component has a recess, the component having a first upper surface and a second upper surface, or having a first lower surface and a second lower surface. 125. A circuit board structure for an electronic device according to claim 117, wherein the element has a recess, the element having a first upper surface and a second upper surface, or having a first lower surface and a second The lower surface. 126. A circuit board structure for an electronic device according to claim 118, wherein the element has a recess, the element having a first upper surface and a second upper surface, or having a first lower surface and a second The lower surface. 127. A P-board structure for an electronic device according to claim 113, wherein a second insulator is disposed on the circuit board, the second insulator having a first upper surface and a first lower surface and a third conductor is disposed on the second insulator, and the third conductor is electrically connected to the first conductor of the circuit board, so that the circuit board is a circuit board having a plurality of conductive layers, and the third conductor and the first conductor The electrical connection can be implemented by means of a conductive path, a conductive paste or a plated metal. The circuit board structure for an electronic device according to claim 13 , wherein after the circuit board is disposed on the electronic device, the electronic device includes: at least one circuit board, The device has at least one accommodating space and at least one first _ conductor; at least one wafer is disposed on the accommodating space of the circuit board; at least one conductive member is respectively engaged with the first conductor of the wafer and the circuit board, so that The wafer is electrically connected to the first conductor of the circuit board, wherein the conductive member is implemented as a conductive line or a conductive protrusion; 1292212 VI. Patent Application Scope At least one package, which encloses circuit boards, wafers and conductive parts. 129. A circuit board structure for an electronic device according to claim 115, wherein after the circuit board is disposed on the electronic device, the electronic device includes: at least one circuit board having at least one a through-shaped receiving space and at least one first conductor; At least one wafer disposed in the through-type receiving space of the circuit board; at least one conductive member respectively engaged with the first conductor of the wafer and the circuit board to electrically connect the wafer to the first conductor of the circuit board, wherein The conductive member is implemented as a conductive wire; and at least one package encapsulating the circuit board, the wafer, and the conductive member. 130. The circuit board structure for an electronic device according to claim 115, wherein the electronic device is disposed after the electronic device is disposed on the electronic device, the electronic device includes: at least one circuit board having at least one a through-shaped receiving space and at least one first conductor; at least one wafer, the active surface of the wafer is bonded to the surface of the circuit board, and is disposed on the through-shaped receiving space of the circuit board; At least one conductive member is respectively bonded to the first conductor of the wafer and the circuit board to electrically connect the wafer to the first conductor of the circuit board, wherein the conductive member is implemented as a conductive line or a conductive protrusion; and at least one package Body, which encapsulates circuit boards, wafers, and conductive parts. 1 3 1. A circuit board structure for an electronic device according to claim 1, wherein the circuit board is disposed after the electronic device Page 73 1292212 6. Patent application sub-device includes: at least one circuit board having at least one accommodating space and at least one first conductor; at least one wafer disposed at a side of the circuit board; at least one a conductive member that is respectively bonded to the first conductor of the wafer and the circuit board to electrically connect the wafer to the first conductor of the circuit board, wherein the conductive member is implemented as a conductive line; and at least one package encapsulating the circuit Board, wafer and conductive parts. 13 2. A circuit board structure for an electronic device, which comprises: An insulator, a first conductor and a first conductive layer; wherein the first conductor has a first upper surface, a first lower surface and a first side; the first conductive layer has an upper surface and a lower surface a side, wherein the first conductive layer is disposed on the first upper surface of the first conductor to be engaged with the first conductor; and the insulator has a first upper surface, a first lower surface and a side, wherein The first side of the first conductor and the side of the first conductive layer are covered by the insulator and buried in the insulator, and the first upper surface of the first conductor is lower than the first upper surface of the insulator, and the upper surface of the first conductive layer The surface is exposed to the insulator • One upper surface. 133. A circuit board structure for an electronic device according to claim 132, wherein the first conductor has an extension and the extension is bonded to the insulator. 134. An electronic device for use in an electronic device as claimed in claim 132. Page 74 1292212 VI. Scope of Application Patent The circuit board structure, in which the circuit board has a through hole, which can be implemented as a circuit board accommodation space. 135. The circuit board structure for an electronic device according to claim 132, wherein an element is disposed on the first upper surface or the first lower surface of the insulator, the element having a first upper surface and a first lower surface and a first side, wherein the first lower surface of the component is bonded to the insulator, so that the first upper surface and the first side of the component are not covered by the insulator and exposed to the insulator, and the component can be implemented as a second conductor or heat dissipation The person. 136. A circuit board structure for an electronic device according to claim 132, wherein an element is disposed on the first upper surface or the first lower surface of the insulator, the element having a first upper surface and a first lower surface and a first side, wherein the first lower surface of the component is covered by the insulator and is not exposed to the outside of the insulator, and at least a portion of the first side of the component is also covered by the insulator and is not exposed outside the insulator, and The first upper surface is uncovered by the insulator and exposed to the outside of the insulator, and the element can be implemented as a second conductor or heat sink. 137. A circuit board structure for an electronic device according to claim 132, wherein an element is provided in the insulator, the element having a first upper surface a first lower surface and a first side, wherein at least a portion of the first side of the element is covered by the insulator and is not exposed outside the insulator, and the first upper surface and the first lower surface are not affected The insulator is coated and exposed to the outside of the insulator, respectively, and the component can be implemented as a second conductor or heat sink. 138. A circuit board structure for an electronic device according to claim 136, wherein the component has an extension and the extension is engaged 1292212 VI. Application for patents Insulators. 139. A circuit board structure for an electronic device according to claim 137, wherein the element has an extension and the extension is joined to the insulator. 140. A circuit board structure for an electronic device according to claim 135, wherein the component is a hole having a through shape. 141. A circuit board structure for an electronic device according to claim 136, wherein the component is a hole having a through shape. 142. A circuit board structure for an electronic device according to claim 137, wherein the element is a hole having a through shape. 143. A circuit board structure for an electronic device according to claim 135, wherein the element has a recess, the element having a first upper surface and a second upper surface, or having a first lower surface and a second The lower surface. 144. A circuit board structure for an electronic device according to claim 136, wherein the component has a recess, the component having a first upper surface and a second upper surface, or having a first lower surface and a second The lower surface. 145. A circuit board structure for an electronic device according to claim 137, wherein the element has a recess, the element having a first upper surface and a second upper surface, or having a first lower surface and a second The lower surface. A circuit board structure for an electronic device according to claim 132, wherein a second insulator is disposed on the circuit board, the second insulator having a first upper surface and a first lower surface And a third side of the second insulator, the third conductor is electrically connected to the first conductor of the circuit board, so that the circuit board is a circuit board having a plurality of conductive layers, and the Page 76 1292212 VI. Scope of Application The electrical connection between the conductor and the first conductor can be carried out by means of a conductive path, a conductive paste or a plated metal. The circuit board structure for an electronic device according to claim 132, further comprising at least one second conductive layer having an upper surface, a lower surface and a side, the second conductive layer being disposed at the On the upper surface of a conductive layer, at least a portion of the upper surface of the first conductive layer is covered by the second conductive layer, wherein the side of the second conductive layer is covered by the insulator and buried in the insulator, and the second conductive The upper surface of the layer is exposed to the first upper surface of the insulator. 148. A circuit board structure for an electronic device according to claim 132, further comprising another first conductor and another first conductive layer, the other first conductor having a first upper surface, a first lower surface and a first side, and the other first conductive layer has an upper surface, a lower surface and a side, the other first conductive layer being disposed on the first upper surface of the other first conductor The other first conductor is combined with the other first conductive layer and covered by the insulator and buried in the insulator, wherein the first upper surface of the other first conductor is lower than the first lower surface of the insulator, The upper surface of the other first conductive layer is exposed to the first lower surface of the insulator. The circuit board structure for an electronic device according to claim 148, further comprising at least one second conductive layer disposed on the upper surface of the other first conductive layer, such that At least a portion of the upper surface of the other first conductive layer is covered by the second conductive layer, and the second conductive layer is covered by the insulator and buried in the insulator, wherein the upper surface of the second conductive layer is bare On the first lower surface of the insulator. 150. An electronic device for use in an electronic device according to claim 132. Page 77 1292212 VI. Patent Application The circuit board structure in which the first lower surface of the first conductor is exposed on the first lower surface of the insulator. 151. A circuit board structure for an electronic device according to claim 132, wherein after the circuit board is disposed on the electronic device, the electronic device includes: at least one circuit board having at least one An accommodating space and at least one first conductor; at least one wafer disposed on the accommodating space of the circuit board; at least one conductive member respectively engaged with the first conductor of the wafer and the circuit board to enable the wafer and the circuit board The first conductor is electrically connected, wherein the conductive member is implemented as a conductive line or a conductive protrusion; and at least one package encloses the circuit board, the wafer, and the conductive member. 152. A circuit board structure for an electronic device according to claim 134, wherein after the circuit board is disposed on the electronic device, the electronic device includes: at least one circuit board having at least one a through-shaped receiving space and at least one first conductor; At least one wafer disposed in the through-type receiving space of the circuit board; at least one conductive member respectively engaged with the first conductor of the wafer and the circuit board to electrically connect the wafer to the first conductor of the circuit board, wherein The conductive member is implemented as a conductive wire; and at least one package encapsulating the circuit board, the wafer, and the conductive member. 153. A circuit board structure for an electronic device according to claim 134, wherein the circuit board is disposed after the electronic device Page 78 1292212 6. The patent application sub-device includes: at least one circuit board having at least one through-shaped receiving space and at least one first conductor; at least one wafer, an active surface of the wafer and a surface of the circuit board Bonding and disposed on the through-hole accommodating space of the circuit board; at least one conductive member respectively engaged with the first conductor of the wafer and the circuit board to electrically connect the wafer to the first conductor of the circuit board, wherein the conductive The device is implemented as a conductive wire or a conductive protrusion; and at least one package encapsulating the circuit board, the wafer, and the conductive member. 5. The circuit board structure for an electronic device according to claim 132, wherein after the circuit board is disposed on the electronic device, the electronic device includes: at least one circuit board having At least one accommodating space and at least one first conductor; at least one wafer disposed on a side of the circuit board; at least one conductive member respectively engaged with the first conductor of the wafer and the circuit board to enable the wafer and the circuit board The first conductor is electrically connected, wherein the conductive member is implemented as a conductive line; and at least one package encloses the circuit board, the wafer, and the conductive member. 55. A circuit board structure for an electronic device, comprising: an insulator and a first conductor; wherein the insulator has a first upper surface, a first lower surface and a side; and the first conductor, Is a first upper surface, a first lower surface, a first side and a second side, the first conductor is covered by an insulator, wherein Page 79 1292212 VI. At least part of the side of the patent application area is covered by an insulator and buried in the insulator, and at least a portion of the second side is not covered by the insulator and exposed to the outside of the insulator. And the first upper surface and the first lower surface are respectively exposed on the first upper surface and the first lower surface of the insulator; wherein the first conductor is not made of a conductive paste. A circuit board structure for an electronic device according to claim 155, wherein the first conductor has an extension and the extension is joined to the insulator. 157. The @circuit board structure for an electronic device according to claim 155, wherein the circuit board has a through hole, and the hole can be implemented as a circuit board accommodation space. 158. A circuit board structure for an electronic device according to claim 155, wherein an element is disposed on the first upper surface or the first lower surface of the insulator, the element having a first upper surface and a first lower surface and a first side, wherein the first lower surface of the component is bonded to the insulator, so that the first upper surface and the first side of the component are not covered by the insulator and exposed to the insulator, and the component can be implemented as a second conductor or heat dissipation The person. 159. A circuit board structure for an electronic device according to claim 155, wherein a first element or a first lower surface of the insulator is provided with a element η having a first upper surface and a first lower surface And a first side, wherein the first lower surface of the component is covered by the insulator and is not exposed to the outside of the insulator, and at least a portion of the first side is also covered by the insulator and is not exposed outside the insulator, and The first upper surface is not covered by the insulator and exposed to the outside of the insulator, and the component can be implemented as a second conductor or heat sink Page 80 1292212 VI. The scope of application for patents. 160. A circuit board structure for an electronic device according to claim 155, wherein an element is provided in the insulator, the element having a first upper surface, a first lower surface and a first side, wherein the component At least a portion of the first side is covered by the insulator and is not exposed to the outside of the insulator, and the first upper surface and the first lower surface are not covered by the insulator and are respectively exposed outside the insulator, and the component can be implemented as The second conductor or heat sink. 161. A circuit board structure for an electronic device according to claim 159, wherein the component has an extension and the extension is bonded to the &gt; insulator. 162. A circuit board structure for an electronic device according to claim 160, wherein the element has an extension and the extension is joined to the insulator. 163. A circuit board structure for an electronic device according to claim 158, wherein the component is a hole having a through shape. 164. A circuit board structure for an electronic device according to claim 159, wherein the component is a hole having a through shape. 165. A circuit board structure for an electronic device according to claim 160, wherein the component is a hole having a through shape. 166. A circuit board structure for an electronic device according to claim 158, wherein the element has a recess, the element having a first upper surface and a second upper surface, or having a first lower surface and The second lower surface. 167. A circuit board structure for an electronic device according to claim 159, wherein the component has a recess, the component having a first upper surface Page 81 1292212 VI. Patent application scope and the second upper surface, or the first lower surface and the second lower surface. 168. A circuit board structure for an electronic device according to claim 160, wherein the component has a recess, the component having a first upper surface and a second upper surface, or having a first lower surface and a second The lower surface. The circuit board structure for an electronic device according to claim 155, wherein a second insulator is disposed on the circuit board, the second insulator having a first upper surface and a first lower surface and a third conductor is disposed on the second insulator, and the third conductor is electrically connected to the first conductor of the circuit board, so that the circuit board is a circuit board having a plurality of conductive layers, and the third φ conductor is first The electrical connection between the conductors can be implemented by means of a conductive path, a conductive paste or a plated metal. The circuit board structure for an electronic device according to claim 155, wherein after the circuit board is disposed on the electronic device, the electronic device includes: at least one circuit board having at least one An accommodating space and at least one first conductor; at least one wafer disposed on the accommodating space of the circuit board; at least one conductive member respectively engaged with the first conductor of the wafer and the circuit board to enable the wafer and the circuit board The first conductor is electrically connected, wherein the conductive member is implemented as a conductive line or a conductive protrusion; and at least one package encloses the circuit board, the wafer, and the conductive member. A circuit board structure for an electronic device according to claim 157, wherein the circuit board is disposed after the electronic device, and the electronic device includes: 82 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 a conductive member that is respectively bonded to the first conductor of the wafer and the circuit board to electrically connect the wafer to the first conductor of the circuit board, wherein the conductive member is implemented as a conductive line; and at least one package encapsulating the circuit Board, wafer and conductive parts. 172. A circuit board structure for an electronic device according to claim 157, wherein after the circuit board is disposed on the electronic device, the electrical device is included with: at least one circuit board Having at least one through-space and at least one first conductor; at least one wafer, the active surface of the wafer is bonded to the surface of the circuit board, and disposed on the through-hole receiving space of the circuit board; at least one conductive member Separatingly with the first conductor of the chip and the circuit board, respectively, electrically connecting the wafer to the first conductor of the circuit board, wherein the conductive member is implemented as a conductive line or a conductive protrusion; and at least one package, the package Seal circuit boards, wafers and conductive parts. A circuit board structure for an electronic device according to claim 155, wherein after the circuit board is disposed on the electronic device, the electronic device includes: at least one circuit board, Having at least one accommodating space and at least one first conductor; at least one wafer disposed on a side of the circuit board; Page 83 1292212 6. Patent application at least one conductive member, which is respectively engaged with the first conductor of the wafer and the circuit board, so that the wafer is electrically connected to the first conductor of the circuit board, wherein the conductive member is implemented to be electrically conductive. a wire; and at least one package encapsulating the circuit board, the wafer, and the conductive member.