1290870 九、發明說明： 【發明所屬之技術領域】 尤指一種可方便回收錫渣 ，本發明係關於一種焊錫爐 的焊錫爐之錫渣回收裝置。 【先前技術】 印刷電路板（PCB)係被廣用於電子工業，早期因 及元件較為簡單，故苴萝 电路 體 ”衣乍上車乂為♦易，而後來隨著電晶 :、IC f路m统的相繼問世，其功能及結構也 越來越複雜，且其製作技術也越來越精密了。 採用=’印刷電路板（PCB)的電子零件封裝技術-般係 體）上式封|」’即在裸板（未與電子零件焊接的板 设置複數導孔，將複數電子零件置於裸板的表面， 作零件上的各接腳插置於各導孔中，再藉由錫焊1290870 IX. Description of the invention: [Technical field to which the invention pertains] In particular, it is a convenient way to recover tin slag. The present invention relates to a tin slag recovery device for a soldering furnace of a soldering furnace. [Prior Art] Printed circuit board (PCB) is widely used in the electronics industry. In the early days, the components were relatively simple. Therefore, the dill circuit body was on the rut, and later with the electro-crystal: IC f The functions and structures of the roads have become more and more complicated, and their production technology has become more and more sophisticated. The use of = 'printed circuit board (PCB) electronic parts packaging technology - general system) upper type seal |"'In the bare board (the board is not connected with the electronic parts, a plurality of holes are placed, and the plurality of electronic parts are placed on the surface of the bare board, and the pins on the parts are inserted into the guide holes, and then by the tin weld
孔4接；2填人各導孔中，令*電子零件的接腳與各導 ❿7由於功能上的需求，現有技術印刷電路板表 =電子零件通常非常繁多且接點複雜，若以手焊方S 出:Γ、業速f太過緩慢，…不高，故後來 ’女I 種可運用於印刷電路板錫焊作業的焊錫爐。 ，第/、及七圖所示’焊錫爐内部一般設置有錫槽（6 忒錫槽（6〇)内盛置有熔融之 1 同噴錫裝置（6 T 1 且叹置有不 由-幫浦J ) ’其分別設有噴口（61〇)，可藉 出形成揚起 入’令液錫從喷口（610)向上溢流 〇 )從已的平流波或擾流波，如此’藉由輪送機構（7 ^向上對斜向上升輸送而來的裸板底面噴射，藉由 1290870 裸板底面的防焊漆塗佈區域來控制液錫進入各導孔内進行 填錫形成焊點。 订 而一般傳統之錫槽（60)，其噴錫裝置（61)的 鄰側係設有斜面（6丄丄），而斜面（6丄丄）之間具有 間隙，供接觸防焊漆而掉落的液錫得以沿斜面（6丄工） 回流至錫# ( 6 〇 )内重複利用’然而由於液錫在掉落入 錫槽（60)的過程中，部分會與空氣接觸而氧化，因而 :落入錫槽(6 〇 )後浮出形成一層固態的不溶錫，即所 謂錫渣，該錫渣若未及時移除而被幫浦抽送進入喷錫裝置 (61) θ ’極容易會造成喷口（61〇)或噴錫裝置内 部所設的濾網阻塞，因而影響到錫爐的正常作動；此外， 一盛而言錫渣内部除了包覆空氣之外，另有大量可加以還 原使用的液錫，此故’㈣落入錫槽後皆會被§起回收： 然而，因為錫渣係位於錫槽之内與可用的液錫相混合，故 其回收時還需小心翼翼的過渡，冑免§到可使用的二錫， 如此造成了回收上的不便。 【發明内容】 為使錫逢的回收上更為方便，並防止錫逢混合於锡槽 内造成阻塞而影響到錫爐的正常作動，本發明提供一 爐之錫渣回收裝置的設計。 干、 為達成前述本發明之目的，本發明所提供之焊錫爐之 錫渣回收裝置，其係於現有技術的錫槽中，進一步於^噴 錫裝置噴口的兩側斜面，沿噴錫方向裝設有盛片，各盛片 邊緣赵起且中央凹人形成流道，其底部上可設置有^滤 !29〇87〇 子匕 而其一端連接於錫槽内壁面上，另一端則連接至一錫 二濾&，s亥錫渣濾槽内部具容室空間，其底部設置有濾網 並與錫槽相通。 、田液錫由各噴錫裝置的噴口噴出後，若接觸裸板底部 所塗佈防焊漆而掉落，其會分別落入各盛片之内，其中， 仍可使用的液锡可經由盛片底部的濾孔回流至錫槽内重複 利用，而錫渣則可藉由幫浦的抽送力而沿著盛片流至錫渣 心才曰内田錫渣位於錫渣濾槽内時，藉由錫渣濾槽底部濾 網的過濾’可令錫渣無法通過回流至錫槽，如此以防止錫 漁被幫浦抽送進人噴錫裝置内，此外，前述錫㈣槽之中， 亦可裝設隔板而形成一還原槽，㈣原槽可供集中堆積位 於錫渣濾槽内的錫渣，#此令使用者可間接地以手動方式 進行攪拌研磨，而達到更進一步的錫渣還原。 【實施方式】 請參看第-、二及三圖所示，本發明之焊錫爐之錫淺 回收裝置’係包括有一錫槽（i 〇 )、一第一盛片（2 〇 ): -第二盛片（30)、一第三盛片（40)及 (5 0 )，其中： ^ 該錫槽（1 0 )之中設置有第一噴錫裝置（丄丄）、 第二喷錫裝置（1 2 )及二幫浦（1 3 )，該二噴錫裝3 (11)(12)各自設有長形噴口（11〇)(i2〇j 各長形噴口⑴0) (12〇)兩側分別成型有 : 1 1 ) ( 1 1 2 ) ( 1 2 1 ) ( 1 2 2 )，而該二幫浦； .1290870 3)分別位於一喷錫裝置（ii) (12) —端； 該第一盛月（2 0) —邊緣連接於第一噴錫裝置（ 1 )的斜面（1 1 1 )，而另一邊緣彎曲翹起令 γ τ天四入 形成流道且具有複數濾孔； 該第二盛片（3 0 )截面呈V形，其位於第一 置（1 1 )與第二喷錫裝置（1 2)之間，兩邊緣各自、 接相對的二斜面（112) (121)，其中央凹入連 、、去、蓄口日士 …y夹凹入形成 心道’且具有複數濾孔； 2 形 開 片 槽 前 ) 成 孔 述 4 設置 違第二盛片（4〇)—邊緣連接於第二噴錫裝 的斜面（1 2 2 )，而另一邊緣彎曲輕起令中 流道，且具有複數濾孔； 該錫渣濾槽（5 0 )呈一中空箱體，其一側壁 可供第一盛片（2 0 )、第二盛片（3 〇 )及 4 0 )穿入相通，其底部設置有濾網（5工） 1 0 )相通。 請t看第四及五圖所示，於本發明的另一實施 之第-盛>1 (20)、第二盛片（3〇)及第 〇)亦可為呈管狀的第一盛片（20，）、第 〇’）及第三盛片（40’），其中央形成流道 有濾孔’且各自相對至少一斜面（丄丄丄）（: l)(122)s免有開口（21， ） （31，^ 、丄丄 1 ) ( 1 1 2 ) ( 1 2 1 ) 伸入。 置 央 面 第 且 例 凹入 設有 ^~盛 與錫 中， 盛片 盛片 底部L 2 ) (4 1 2 备液錫由各喷錫裝置 11) (12)的長形噴〇 1290870 1 〇 ) ( 1 2 0 ) τ出後，若接觸裸板底部所塗佈防焊漆 而掉落，其會沿著各斜面（工(工工2 )(丄2工) (1 2 2 )分別流入各盛片（2 0 ) ( 3 0 ) ( 4 0 )¾ 者管狀盛片（2 〇,） （ 3 〇,） （ 4 〇,）之内，如此，則 仍可使用的液錫可經由其底部的濾孔回流至錫槽（丄〇 ) 内重複利用，而錫渣可藉由幫浦（1 3 )的抽送力而沿著 各盛片（20) (30) (40)或者管狀盛片盛片（2Hole 4 is connected; 2 is filled in each of the guide holes, so that the pins of the electronic parts and the respective guides 7 are functionally required. The prior art printed circuit board table = electronic parts are usually very complicated and the joints are complicated, if hand soldering Fang S out: Γ, the industry speed f is too slow, ... not high, so later 'female I can be used in soldering furnaces for printed circuit board soldering operations. , the first /, and seven figures show 'the inside of the soldering furnace is generally provided with a tin bath (6 忒 tin bath (6 〇) contains a molten 1 with a tin spray device (6 T 1 and sighs can not help - pump J) 'There are separate spouts (61〇), which can be borrowed to form a lift-in squirting liquid from the spout (610) upwards from the existing smoothing wave or turbulent wave, so 'by rotation The mechanism (7 ^ upwardly sprays the bottom surface of the bare plate which is transported obliquely upward, and controls the liquid tin to enter the respective guide holes to form the solder joint by the solder resist coating area of the 1290870 bare plate bottom surface. The conventional tin bath (60) has a bevel (6丄丄) on the adjacent side of the tin spraying device (61), and a gap between the inclined surfaces (6丄丄) for contacting the solder resist paint. Tin can be recirculated along the bevel (6 丄) to tin # (6 〇) for reuse. However, due to the liquid tin falling into the tin bath (60), some of it will be oxidized by contact with air, thus: falling into After the tin bath (6 〇) floats out to form a layer of solid insoluble tin, the so-called tin slag. If the tin slag is not removed in time, it is pumped into the tin-filled tin. Setting (61) θ ' can easily cause the nozzle (61〇) or the filter screen inside the tin-spraying device to block, thus affecting the normal operation of the tin furnace; in addition, the inside of the tin slag is coated with air. In addition, there are a large number of liquid tin that can be used for reduction. Therefore, '(4) will be recovered by § after falling into the tin bath: However, since the tin slag is located in the tin bath and is mixed with the usable liquid tin, When recycling, it is necessary to carefully transfer the thief to the usable tin, which causes inconvenience in recycling. [Summary of the Invention] In order to make the recycling of tin slab more convenient, and prevent the tin from mixing in the tin bath The invention provides a design of a tin slag recovery device for a furnace. The present invention provides a design of a tin slag recovery device for a furnace. The purpose of the present invention is to provide a tin slag recovery device for a soldering furnace provided by the present invention. In the tin bath of the prior art, the slopes on both sides of the nozzle of the tin-spraying device are further arranged in the direction of the tin-spraying direction, and the edges of the wafers are raised and the central concave person forms a flow channel, and the bottom portion thereof can be provided with ^ Filter! 29〇87〇子匕The end is connected to the inner wall surface of the tin bath, and the other end is connected to a tin-two filter & the inner chamber of the sigma slag filter tank has a chamber space, and a filter mesh is arranged at the bottom thereof and communicates with the tin bath. After the nozzles of the tin-spraying devices are sprayed, if they are dropped by the anti-welding paint applied to the bottom of the bare board, they will fall into the respective sheets. Among them, the liquid tin that can still be used can be filtered through the bottom of the sheet. The pores are recirculated to the tin bath for reuse, and the tin slag can be flowed along the sheet to the tin slag heart by the pumping force of the pump. When the tin slag is located in the tin slag filter tank, the tin slag filter tank is used. The filtration of the bottom filter can prevent the tin slag from passing back to the tin bath, so as to prevent the tin fishing from being pumped into the tin spraying device. In addition, the tin (four) groove may be provided with a partition to form a spacer. A reduction tank, (4) the original tank can be used to concentrate the tin slag located in the tin slag filter tank, which allows the user to indirectly perform the agitating and grinding in a manual manner to achieve further reduction of the slag. [Embodiment] Please refer to the first, second and third figures, the tin shallow recovery device of the soldering furnace of the present invention includes a tin bath (i 〇), a first wafer (2 〇): - second a sheet (30), a third sheet (40) and (50), wherein: ^ the tin bath (10) is provided with a first tin-spraying device (丄丄) and a second tin-spraying device ( 1 2 ) and 2 pumps (1 3 ), the two spray tins 3 (11) (12) are each provided with a long spout (11 〇) (i2〇j each elongated spout (1) 0) (12 〇) on both sides Formed separately: 1 1 ) ( 1 1 2 ) ( 1 2 1 ) ( 1 2 2 ), and the two pumps; .1290870 3) are respectively located in a tin-spraying device (ii) (12)-end; a full moon (20)—the edge is connected to the inclined surface (1 1 1 ) of the first tin-spraying device ( 1 ), and the other edge is curved and tilted to make γ τ into the flow channel and has a plurality of filtering holes; The second piece (30) has a V-shaped cross section, and is located between the first place (1 1 ) and the second tin-spraying device (12), and the two edges are respectively opposite to the opposite two inclined faces (112) (121) , its central concave into,, go, accumulate Japanese ... y clip concave into the heart of the 'and has a plural Hole; 2 in front of the opening slot) The hole is set to 4 Set against the second piece (4〇)—the edge is connected to the bevel of the second tin-filled device (1 2 2), and the other edge is bent to make the middle flow path And having a plurality of filter holes; the tin slag filter tank (50) is a hollow box body, one side wall of which can be penetrated by the first piece (20), the second piece (3 〇) and 40) In the same way, the bottom of the screen is provided with a filter (5 work) 10 0). Please see the fourth and fifth figures, in the other embodiment of the present invention, the first - Sheng > 1 (20), the second Sheng (3) and the third) can also be a tubular first Sheng The sheet (20,), the third sheet () and the third sheet (40') have a filter hole formed in the center of the flow channel and are respectively free from at least one slope (丄丄丄) (: l) (122)s The opening (21, ) (31, ^, 丄丄1) (1 1 2 ) (1 2 1 ) extends. The central surface of the central surface is recessed and provided with ^~ Sheng and tin, the bottom of the sheet is L 2 ) (4 1 2 preparation liquid tin by each tin spraying device 11) (12) long sneeze 1290870 1 〇 (1 2 0 ) After τ is out, if it touches the solder resist on the bottom of the bare board and falls, it will flow along each slope (worker 2) Each piece (2 0 ) ( 30 ) ( 4 0 ) 3⁄4 is in the tubular piece (2 〇,) (3 〇,) (4 〇,), so that the liquid tin that can still be used can pass through it. The bottom filter hole is recirculated to the tin bath (丄〇) for reuse, and the dross can be transferred along the respective sheets (20) (30) (40) or tubular sheets by the pumping force of the pump (1 3 ). Sheng tablets (2
0 ) ( 3 0，） （ 4 0,)流至錫渣濾槽（5 〇 )内。 當錫渣位於錫渣濾槽（5 〇 )内時，藉由錫渣濾槽（5 〇 )底部渡網（5 1 )的過滤，可令錫渣無法通過，而存 留於錫渣濾槽（5 〇 )巾，如此防止錫渣回流至錫槽（1 〇)中被幫浦（13)抽送進入噴錫裝置（丄丄）（12、 内而造成損壞。 ’ 此外，再請參看第五圖所示，前述錫渣濾槽（5 〇) 之中亦可於其角落處裝設隔板而形成一還原槽（5 2), 該還原槽（5 2 ) τ供集中堆積位於錫㈣槽（5 〇 )内 的錫逢，如此令使用者可間接地以手動方式進行攪拌研 磨’而達到更進一步的錫渣還原。 ‘【圖式簡單說明】 第一圖係本發明之端面剖視圖。 第二圖係本發明之上視圖。 第二圖係本發明之側面剖視圖。 :四圖係本發明另一實施例之端面剖視圖。 第五圖係本發明另一實施例之上視圖。 1290870 第六圖係現有技術焊錫爐之示意圖。 第七圖係現有技術錫槽之端面剖視圖。 【主要元件符號說明】0) (3 0,) ( 4 0,) flows into the dross filter tank (5 〇). When the tin slag is located in the tin slag filter tank (5 〇), the bottom slag (5 1 ) of the slag filter tank (5 〇) can be filtered to prevent the tin slag from passing through and remaining in the tin slag filter tank ( 5 〇) towel, so as to prevent the dross from flowing back into the tin bath (1 〇) and pumped into the tin spraying device (丄丄) (12), causing damage. ' In addition, please refer to the fifth figure. As shown, the tin slag filter tank (5 〇) may also be provided with a partition at a corner thereof to form a reduction tank (52) for concentration accumulation in the tin (four) tank ( 5 〇) in the tin, so that the user can indirectly manually stir and grind 'to achieve further dross reduction. ' [Simplified schematic] The first figure is the end view of the present invention. Figure 2 is a side elevational view of the present invention. Figure 4 is a cross-sectional view of another embodiment of the present invention. Figure 5 is a top view of another embodiment of the present invention. A schematic view of a prior art soldering furnace. The seventh drawing is a cross-sectional view of an end face of a prior art tin bath. To reference numerals DESCRIPTION
(1 〇)錫槽 (1 1 0 )長形喷口 (1 1 2 )斜面 (1 2 0 )長形噴口 (1 2 2 )斜面 (2 0 )第一盛片 (21’ ）開口 (3 0 ’）第二盛片 (4 0 )第三盛片 (41’ ）開口 (5 1 )濾網 (6 0 )錫槽 (6 1 0 )噴口 (1 1 )喷錫裝置 (1 1 1 )斜面 (1 2 )第二噴錫裝置 (1 2 1 )斜面 (1 3 )幫浦 (2 0 ’）第一盛片 (3 0 )第二盛片 (31’ ）開口 (40’）第三盛片 (5 0 )錫渣濾槽 (5 2 )還原槽 (6 1 )喷錫裝置 (7 0 )輸送機構 10(1 〇) tin trough (1 1 0) long spout (1 1 2) bevel (1 2 0) long spout (1 2 2) bevel (2 0) first piece (21') opening (3 0 ')Second sheet (4 0) Third sheet (41') Opening (5 1 ) Filter (6 0 ) Tin bath (6 1 0 ) Spout (1 1 ) Tin casting device (1 1 1 ) Bevel (1 2) second tin-spraying device (1 2 1 ) bevel (1 3 ) pump (2 0 ') first piece (30) second piece (31') opening (40') third Sheet (50) tin slag filter tank (5 2 ) reduction tank (6 1 ) tin spraying device (7 0 ) conveying mechanism 10