TWI289652B - Loop-type heat exchange device - Google Patents

Abstract

A loop-type heat exchange device is disclosed, which includes an evaporator, a condenser, an outgoing duct for transferring vapor and an incoming duct for transferring condensate. The evaporator defines therein a chamber in which a working fluid is contained. The chamber is divided into an evaporating region and an adjacent liquid micro-channel region for providing condensate. The working fluid in the evaporating region evaporates after absorbing heat and the generated vapor flows, via the outgoing duct, to the condenser, where the vapor releases its latent heat of evaporation and is condensed into condensate. The condensate returns back to the evaporator via the incoming duct to thereby form a heat transfer loop. The evaporator has such a configuration that can reduce the amount of vapor accumulated in the liquid micro-channel region, to thereby lower the flow resistance of the condensate from the liquid micro-channel region toward the evaporating region and ensure that the heat is transferred along the heat transfer loop effectively.

Description

1289652 ' Nine, invention description · · : [Technical field of invention]: This hair 8 secret belongs to _ kind of heat-dissipating device 'turning thinner than - kind of no need to apply power · Thin loop that heats the heat of the heating element quickly Heat sink ^ 【Previous technology】 _ Electronic information industry · rapid development, high-tech electronic products are moving towards a lighter and thinner • More mixed, fast _ exhibition, silk in the electronic components, fresh and speed will continue to promote The heat (heat flux) released per unit area is becoming more and more serious, threatening the operation performance and stability of 70 pieces of electrons, and even burning such expensive electronic ploughing bases due to high temperature. The life and operation quality of the sub-components, and the normal operation of the sub-components, must be performed on the electronic components quickly and quickly. Only a single view of the woven cold type _ _ _ meet the development of high-frequency high-speed electronic cake * ^ La f seeking, the county, such as the bribe pure fan view will be slightly more material and vibration problems if the increase in heat dissipation area and violate the light and small Market product demand. In order to make high-tech electronic products play the proper Wei, design high-efficiency, light-weight 'ultra-quiet, money electronic components, different operating power, automatic adjustment of heat transfer, and the product is narrow and small. The heat sink has become an important challenge and opportunity for the industry to develop next-generation advanced electronic products. The heat dissipation of the processor (CPU), fruit, and its care and management. A typical example is the heat transfer of the tube to improve heat transfer efficiency.

When there are different heat dissipation devices of different structures and types, it can be applied to the computer micro-location (1). Only the conventional knowledge is mainly reflected in the fact that the steam and the reflux system 1289652 are reversed in the same way as f, which hinders the recirculation of the liquid by the capillary force, thereby limiting the maximum heat transfer capacity of the heat pipe, and when the returning body is insufficient to provide evaporation. When the required amount occurs, the drying (di:y-0Ut) phenomenon causes the computer microprocessor to heat up rapidly. Therefore, in order to avoid the above disadvantages, there is a loop type heat pipe trigger. The structure of the loop-type heat pipe is usually Baocheng, 11, cold-sense, and New-cavity tube. "Wei has a capillary, and has a proper amount of hull. The conduit and the return conduit are respectively connected to the evaporator. The condenser is configured to form a loop heat transfer path. The operating principle is that the evaporator absorbs the liquid working fluid system of the electronic component, and the generated steam is transferred to the condensing enthalpy via the steam conduit to release heat and condense into a liquid. The return pipe returns to the evaporator and continues to the next ship. The __ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The evaporator is such that the flow of the two phases does not interfere with each other and the heat is transferred to the condenser for dissipation. Only in practice, Wei-style fresh-swords are overtaken by money. The ship is heated by steam in the working fluid. The pressure will force the generated steam to travel along the direction of the guide f, and will also flow back along the return duct, thus destroying the original The mechanism of single-direction heat transfer also hinders the amount of working fluid that is condensed and replenishes the amount of evaporation in time, which easily causes the evaporator to dry out. ·····[Summary of the invention] In order to solve the technical problem that the return flow of the working fluid in the loop heat pipe is not smooth and the heat transfer in one direction is steamed/1 destroyed, it is necessary to provide a thin type which can circulate in a single direction and efficiently transfer heat. Loop type heat sink. The thin loop heat dissipating device comprises an evaporator, a condenser, a steam conduit and a return conduit, wherein the evaporator forms a cavity and is filled with a working fluid, and the cavity is divided into an evaporation zone and a liquid phase micro a passage area of the flow, the working fluid generates heat after absorbing heat in the evaporation zone and reaches the condenser via the steam conduit to be cooled to a liquid state, and the coolant is returned to the evaporator via the return conduit to form a closed heat conduction. In the loop, the evaporator is provided with a structure for reducing steam accumulation in the passage area.

Claims (1)

1289652 96· 8· S 修 年 年 日 、 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , A cavity is formed in the device and filled with a working fluid. The cavity is divided into an evaporation zone without a red cross surface. After the amount is generated, the rainbow generates steam and reaches the condenser through the steam conduit to be cooled to a liquid state. The conduit is returned to the evaporator to form a closed heat transfer loop. The second improvement is that the funer is provided with a structure for reducing steam accumulation in the passage region. 2. The thin loop heat sink according to claim 1, wherein the chamber of the (4) left hair unit is formed by sealing the upper cover and the lower cover. Xσ 3.=Please use the thin loop heat sink described in item 2, wherein the structure of the reduced plugging in the pass zone is a thicker Wing riding position on the evaporator facing the evaporation zone. The so-called view-type loose wire is placed, and the soaking section is formed on the lower cover plate and facing the evaporation zone of the evaporator. 5' t: The thin loop heat sink according to item 2, wherein the steam reduction is reduced. 6. The second heat sink is disposed on the evaporator in the channel region. S j _ thin loop heat sink Wherein the reduced basis = the structure of the channel region is positive for the neon red and the thicker uniform segment for the evaporation region. U 7. If the heat dissipation part is a plurality of heat dissipation fins, as described in Item 5 or Item 6. ^Road-type political heating device, wherein = the thin-type loop type loose-travel device described in claim 5 or claim 6. The at least one of the plates is on the cover plate and facing the _ region. The chamber is provided with a heat chamber, wherein the evaporator is in the hair zone. w hair, , , , , , , ° ° spanned in the channel area of the evaporator and steamed melon as the application paste _9 Pecher ring _ run, where the capillary knot 16 HI 1289652 % % And the rest of the capillary structure extends into the evaporation zone η. The cavity of the thin loop described in claim 9 of the patent scope is formed in a part of the evaporation zone - Ronglin Steaming Steam Storage Co., Ltd. The thin loop heat dissipating device described in the item is connected to the steaming and channel region of the evaporator. X-1 The thin loop planting device described in the l_U item, _ ¥ official and back tube riding metal or torsion surface pipe fittings. W 14. 14. Please have a capillary structure in the thin loop type of bulk tube as described in item j of the patent scope. The backflow guide 15. =#Special_The first job of the thin loop type of the diffuser connection has two heat conduction loops, each loop routing the base hair and the condensing H rib conduit are sequentially formed to form . ...flying guide 16. If you apply for patent scope! The thin loop heat sink described in the section is provided with a plurality of steam conduits in parallel to reduce the steam flow resistance. z, ',,, material Π. - A thin loop heat sink, including a ginseng, a steam conduit and a reflow guide; "1 constitutes one;; body = ^ - condensate is divided into evaporation The channel region of the zone and the liquid phase microfluid is improved by providing a non-thermal section and a soaking section corresponding to the channel zone and the evaporation zone, and the thin loop type described in the 17th item of the evaporation application patent scope The heat sink, the cavity of the t is formed by the upper cover and the lower cover being sealed. Wherein the upper and lower I9·the thin loop heat sink cover plate described in the ls patent application scope is at least one of which is provided with a plurality of heat dissipation fins. Wherein the plural number 2〇·such as the thin loop heat dissipating device described in the w-th aspect of the patent scope, the heat radiating fin is facing the channel area. t 2ΐ·If you apply for the _loop type heat sink as described in Item 17 of the special Nawei, the cavity of the benefit _ is provided with a capillary structure, which is set across the evaporation correction channel = 17 1289652 曰 modified supplementary evaporation zone . 22. The thin loop heat sink of claim 17, wherein the return conduit is provided with a capillary structure. 18 1289652 μ XI, schema: 19