I2868Q9 1/472twf.doc/r 九、發明說明： 【發明所屬之技術領域】 本發明是有關於—種 應用此測試探針的測試模;^木針，且特別是有關於一種 【先前技術】 通常都會使二^C::片在封裝成為晶片封裝體之後， 不良之晶;^= ^進行讀階段的電性測試，以剔除 配合而腦系統以後，其能與系統 這對於古!^ t、更了對日日片封裝體進行系統階段測試， 、依：本之Ic晶片的封裝體來說是有必要的。 試模έ且之封裝型態的不同，晶片封裝體之測 視不同。圖1緣示習知之-種測試模組的側 ===圖。請參考圖！，習知之測試模组⑽用以測 t=land_a卿，闕封裝型態之晶片封 j木針120。測試電路板no具有多個接點112，而這些測 雜針12G分別適於與這些接點112接觸。由圖！ # , 爾針m之排财式是對應於待狀遍晶片 ί衣肢cp的多個接點c與對應於測試電路板ιι〇的這些 夺要點112而配置。 杯考圖2，其繪示圖1之測試探針的側視剖面示意 圖。各個測試探針120包括一筒身122、一彈箬124、上 針126與下頂針128。彈簧124配置於筒身I22内，上頂 5 1286809 17472twf.doc/r 彈黎12: Z針128分別穿過筒身122的兩開孔122a而與 弹頁124的兩端相連接，且％ 與下頂針似於筒身122内。j4以咖上頂針126 些測言ί探ί : f，21當LGA晶片封裝體cp安裝至這 大小而抽… 呀，這些測試探針120可因應所受力量 別接奶因而確保這些測試探針12G之上頂針126分 cp盥、、目丨丨·η、干、八如針〇將分別作為LGA晶片封裝體 測4¾路板110之間的電性通道。因此，lga曰 試探針120而電性連接至:試 f體CP內^使侍習知之測試模組100可對LGA晶片封 t 、内的日日片（未綠示）進行電性測試。 於彈性賴的過程巾，由於筒身122的電阻值小 1 m電流的絕大部分在各個賴探針m 將因過度磨損而接觸不良==二 【發明内;】f知之測試模組⑽實有改進之必要。 身之的是提供—種測試探針，以解決頂針與筒 身之間□❹磨損而阻抗值增加的_。 本發明之另一目的是提供一種測試模組，以解決測試 1286809 17472twf.doc/r 為達i述:C使用磨損而阻抗值增加的問題。 包括-筒身:^雕其他目的，本發明提出—種測試探針， 蓋體與筒身連接:;、中 於筒身内。彈性元件配而導電膠體配置 浸泡於導電膠I#中，且、Θ ’其中彈性元件係部分 性元件的;電膠體的電阻值小於筒身以及彈 元件用以支撐頂針於開ί=件連接， 性元件係完全浸泡 _性元件時，彈 電膠體中。 、、书 >肚且頂針係部分浸泡於導 在本發明之一實施例中 在本發明之一實施例中 米級金屬粒子。 在本發明之一實施例中 米級金屬粒子。 在本發明之一實施例中 在本發明之一實施例中 ，上述之導電膠體包括銀膠。 上述之導電膠體可包含有微 上述之導電膠體可包含有奈 上述之彈性元件包括彈簧。 〜1死例中，上述之頂針包括一桿體座一 =====細，卿與桿體 =其中探針部無法穿過開孔。此外，上述之十以 配置於蓋體上之播座（StGpping Pedestal)，當頂 、’差縮彈性元件時’擋座係與探針部接觸，以限制頂^的 7 1286809 17472twf.d〇c/r 為達上述或是其他目的，本笋 包括一筒身、一蓋體、一導電粉末X 種戦探針， 蓋體與筒身連接，其巾#|# 件與一頂針。 於筒身内。彈性元件配;： 埋入於導電粉料，且 ，、中祕兀件係部分 性元件的電阻值。頂針穿=、电阻值小於筒身以及彈 性元件當頂針魏彈性元件時，彈 粉末中。 於¥_末中’且頂針係部分埋入於導電 米級ί屬本 =之一實施例中，上述之導電粉末可包含有微 米級Ϊ屬本ίΓ—實施例中’上述之導電粉末可包含有奈 士述之彈性元件包括彈簧。 探針部。桿體穿過開“彈性元$3針體與一 連接，其中探針部無法穿過開孔件連接而缺部與捍體 在本發明之一實施例辛，上 探針部。桿體穿過開孔與彈性元料】體與- =探針部無法穿過開孔=，:== 产配置於蓋體上之播座，當頂縮彈性元件時， 匕座係躲針部接觸，以限制頂針的位移。 為達上述或是其他目的，本發明提出一種測試模組， 1286809 17472twf.d〇c/r 接點，而:測試探針。測試電路板具有多個 針包括-^、ί 與這些接點_ °各個測試探 針。蓋體與筒身連二其中頂 配置於筒身内。彈性元件“二::久開孔，而導電膠體 部分浸泡於導命勝雕_ ;间身内’其中彈性元件係 及彈性元件的：：：中’且j電膠體的電阻值小於筒身以 彈性元#田、电值。頂針穿入開孔與彈性元件連接，且 π;，於筒身内，當頂顺 泡於導電膠王浸泡於導電膠體中，且頂針係部分浸 施例中’上述之導電膠體包括銀膠。 米級金屬叔子。μ〜例中’上述之導轉體可包含有微 米級之—實補巾，上叙導轉财包含有奈 探針部。桿體穿入二中性 連接’其中探針部無法穿=件連接，而探針部與桿體 探針，上述之頂針包括-桿體與- ，’其中探:部===件:而探針部與桿體 ^針更包括-配置於蓋體 ^^各個測試 I猜座係與探針部接觸，以限制頂性元件 9 1286809 17472twf.doc/r 包括疋其他目的，本發明提出-_气掇, ^括測4電路板與多個測試探針。^^式拉組， 妾黑’而這些測試探針適於接：反具有多個 針包括一筒身、一# — 二接2接觸。各個測試探 針。蓋體與筒身連接，其中二雜元件與-項 :置:筒身内。彈性元件配;二開:中^電粉末 口P刀埋入於導電粉末中，且 /、早性7L件係 及彈性元件的電阻 末^阻值小於筒身以 時，彈性元件係完全埋入於導t/;1龍縮彈性元件 入於導電粉末中。 、' "刀中且頂針係部分埋 米級之—實_ t ’上述之導電粉末可包含有微 在本發明之一實施例Φ， 米級金屬粒子。、 上述之h粉末可包含有奈 在在=::= 探針部。捍體穿過開孔與彈性針包括—桿體與一 連接，其中探針部無法穿=件連接’喊針部與捍體 本^!ί 一實施例中，上述之頂針包括-桿體盘-板針部。卜體穿入開孔與彈性元 杆I、 連接，其中探針部無法穿過開孔 探針更包括-配置於蓋體上之擋座，當7貝針==測= 時’擋座係與探針部接觸’以限制頂針的位移’、。70 1286809 17472twf.doc/r ，、、且在使用夕次之後，測試探針之 】I2868Q9 1/472twf.doc/r IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a test die for applying the test probe, and to a wooden needle, and more particularly to a prior art. Usually, the ^^C:: chip is badly crystalized after being packaged into a chip package; ^= ^ Conducting the electrical test during the read phase, in order to eliminate the cooperation and the brain system, the system and the system can be used for the ancient! In addition, the system phase test of the Japanese chip package is necessary, according to: the package of the Ic chip. The chip package is measured differently depending on the package type. Figure 1 shows the side of the conventional test module === diagram. Please refer to the picture! The conventional test module (10) is used to measure t=land_a qing, 阙 package type wafer seal j wood needle 120. The test board no has a plurality of contacts 112, and the pins 12G are adapted to be in contact with the contacts 112, respectively. By the map! # , 尔针m's defensive type is corresponding to the plurality of contacts c of the limpet cp and the corresponding points 112 corresponding to the test circuit board. Figure 2 is a side cross-sectional schematic view of the test probe of Figure 1. Each test probe 120 includes a barrel 122, a magazine 124, an upper needle 126 and a lower ejector pin 128. The spring 124 is disposed in the barrel body I22, and the upper top portion 5 1286809 17472 twf.doc/r is slid 12: the Z needle 128 is respectively connected to the two ends 122a of the barrel body 122 to be connected to both ends of the bullet page 124, and % and The lower thimble is like the inside of the barrel 122. J4 with a thimble 126 some test words ί ί : f, 21 when the LGA chip package cp is installed to this size and pumping ... Yeah, these test probes 120 can be used according to the strength of the milk to ensure these test probes Above the 12G, the ejector pins 126, cp, 丨丨, η, 、, 八, 针, respectively, will be used as the LGA chip package to measure the electrical path between the landslips 110. Therefore, the test probe 120 is electrically connected to the test body 120, so that the test module 100 can perform electrical test on the LGA wafer seal and the daily Japanese film (not shown). For the flexible process towel, the majority of the current of the barrel 122 is less than 1 m, and the majority of the current will be contacted by the excessive wear of the probe m == two [invention;] the known test module (10) There is a need for improvement. The body is provided with a test probe to solve the problem of increased wear resistance between the thimble and the barrel. Another object of the present invention is to provide a test module to solve the problem of testing 1286809 17472 twf.doc/r for the increase in impedance value of C using wear. Including - barrel: ^ other purposes, the present invention proposes a test probe, the cover is connected to the barrel:;, in the barrel. The elastic component is matched with the conductive colloidal configuration and immersed in the conductive adhesive I#, and Θ 'where the elastic component is a partial component; the electrical resistance of the electrocolloid is smaller than that of the cylinder and the elastic component for supporting the thimble; The sexual element is completely immersed in the _ sexual element, in the elastic colloid. The book and the thimble portion are partially immersed in an embodiment of the invention. In one embodiment of the invention, the rice metal particles. In one embodiment of the invention, the rice grade metal particles. In an embodiment of the invention, in one embodiment of the invention, the conductive paste comprises silver paste. The above conductive paste may comprise a plurality of the above-mentioned conductive colloids, and the elastic member may include a spring. In the ~1 death case, the above thimble includes a rod body ======fine, and the shaft and the body = where the probe portion cannot pass through the opening. In addition, the above ten is arranged on the cover body (StGpping Pedestal), when the top, 'differential elastic element', the stop block is in contact with the probe portion to limit the top of the 7 1286809 17472twf.d〇c /r For the above or other purposes, the bamboo shoots include a barrel, a cover, a conductive powder X type of probe, the cover is connected to the barrel, and the towel #|# is a thimble. In the barrel. The elastic component is matched with: the electrical resistance of the partial component of the conductive powder, and the secret component. The thimble wear =, the resistance value is smaller than the barrel body and the elastic element is in the powder when the thimble is elastic. In the embodiment in which the thimble is partially embedded in the electrically conductive grade, the conductive powder may include a micron-sized enamel. In the embodiment, the conductive powder may include The elastic elements of Nassau include springs. Probe section. The rod body passes through the "elastic element $3 needle body and a connection, wherein the probe portion cannot be connected through the opening member, and the missing portion and the body are in the embodiment of the invention. The upper probe portion. The rod body passes through Opening and elastic element] Body and - = The probe part cannot pass through the opening =,:== The positioning seat is placed on the cover body. When the elastic element is retracted, the squatting system contacts the needle part to Limiting the displacement of the thimble. For the above or other purposes, the present invention provides a test module, 1286809 17472 twf.d 〇 c / r contact, and: test probe. The test circuit board has a plurality of pins including -^, ί With these contacts _ ° each test probe. The cover body and the barrel body are connected to the top of the barrel. The elastic element "two:: long-opening, and the conductive colloid part is soaked in the guide life _; Among them, the elastic component and the elastic component of the ::: and the electrical resistance of the j electrocolloid are smaller than the elastic body of the cylinder and the electric value. The thimble penetrates into the opening and is connected with the elastic member, and π; in the barrel, when the top blister is immersed in the conductive paste, and the thimble is partially immersed in the immersion embodiment, the conductive paste comprises silver paste. Rice grade metal uncle. In the case of μ~, the above-mentioned guide body may include a micro-scale-real-filled towel, and the upper-style guide-transfer contains a probe portion. The rod body penetrates into the two neutral connection 'where the probe portion cannot be worn = the member is connected, and the probe portion and the rod probe, the above-mentioned thimble includes - the rod body and -, 'where the part: === piece: The probe portion and the rod body are further included - disposed in the cover body, and each test I is in contact with the probe portion to limit the top member 9 1286809 17472twf.doc / r includes other purposes, the present invention proposes - _ 掇, ^ Include 4 circuit boards with multiple test probes. ^^-type pull group, blackened' and these test probes are suitable for connection: the reverse has a plurality of needles including a barrel body, a #-two connection 2 contacts. Individual test probes. The cover body is connected with the barrel body, wherein the two components and the item are placed in the barrel body. The elastic element is matched; the second opening: the middle electric powder port P knife is embedded in the conductive powder, and /, the early 7L part and the elastic element have the resistance end value less than the barrel body, the elastic element is completely buried In the guide t /; 1 shrink elastic element into the conductive powder. And '" in the knives and the thimble portion is partially buried - the actual conductive powder may comprise Φ, a grade of metal particles in one embodiment of the invention. The above-mentioned h powder may contain a nep in the =::= probe portion. The mortise body passes through the opening and the elastic needle includes a rod body and a connecting body, wherein the probe portion cannot be worn and the member is connected to the squeaking needle portion and the scorpion body. In an embodiment, the thimble includes a rod body plate - Needle plate. The body penetrates into the opening and the elastic element I, and the connection, wherein the probe portion cannot pass through the opening probe, and further includes a seat disposed on the cover body, and when the 7-beat pin == measurement = Contact 'with the probe portion to limit the displacement of the thimble'. 70 1286809 17472twf.doc/r , , and after the use of the evening, test the probe]
電谬體之間幾無摩擦損耗，因 ς =電性的V 抗值不會增加，進而使得本發明之^ 體之間的阻 探針的測試模組可維持較佳的测試良率。衣、Μ應用此測試 為讓本發明之上述和其他目的、特徵和優點 2下了文特舉較佳實施例，並配合所附圖式，作詳細： 【實施方式】 請簽考圖3，其繪示本發明一每 晶片封裝體CP，，其可為墊格陣 用- 些接點2!2接觸。由圖3可知^ 220適於與， 地排列於一排針插座230上，且220可整齊 測之晶片封襄體CP，的多個接點c、，之===連，待 板210的接點212之一。有關測試探針2、〇愿於，试電;路 見圖4A及圖4B。 、 之細部結構洋 請參考圖4A，其繪示圖3之 的側視剖面示意圖。各個測試探針22；=受縮 一蓋體222、一導電膠體223、 ，—同身22卜 奶。蓋體222與筒身221連^^件以與一頂針 安始、接合，且蓋體222 1286809 17472twf.doc/r 具有一開孔222a，而導電膠體223則配置於筒身221内。 此外，彈性元件224 (例如為彈簀）配置於筒身221内， 其中彈性元件224係部分浸泡於導電膠體223中，且導電 膠體223的電阻值小於筒身221以及彈性元件224的電阻 值。頂針225穿入開孔222a而與彈性元件224連接，且彈 性元件224用以支撐頂針225於筒身221内。There is no friction loss between the electric rafts, because the 抗 = electrical V-resistance value does not increase, so that the test module of the resistive probe between the present invention can maintain a better test yield. The above and other objects, features and advantages of the present invention are set forth in the accompanying drawings. It shows a per-chip package CP of the present invention, which can be used for the pad array - some contacts 2! 2 contact. It can be seen from FIG. 3 that the 220 is adapted to be arranged on a row of pin sockets 230, and the plurality of contacts c, which are neatly measured by the wafer package body CP, are === connected, and the board 210 is One of the contacts 212. For the test probe 2, hope, test power; road see Figure 4A and Figure 4B. Referring to Figure 4A, a side cross-sectional view of Figure 3 is shown. Each test probe 22; = reduced by a cover 222, a conductive colloid 223, - the same body 22 milk. The cover body 222 is connected to the barrel body 221 to be engaged and engaged with a thimble, and the cover body 222 1286809 17472twf.doc/r has an opening 222a, and the conductive paste 223 is disposed in the barrel 221 . In addition, the elastic member 224 (for example, a magazine) is disposed in the barrel 221, wherein the elastic member 224 is partially immersed in the conductive paste 223, and the resistance of the conductive paste 223 is smaller than the resistance of the barrel 221 and the elastic member 224. The thimble 225 is inserted into the opening 222a to be coupled to the resilient member 224, and the resilient member 224 is adapted to support the thimble 225 within the barrel 221.
在本貫狍例T，導電膠體223就材質而言内含有高導 電性的微米級金屬粒子或奈米級金屬粒子，例如是銀膠或 錫嘗等導電物，而頂針225則包括一桿體225a與一探針部 225b。桿體225a穿入蓋體222之開孔222a而與彈性元件 224連接，且探針部225b與桿體225a連接，i中探針部 225b之外徑實質上大於開孔⑽之口徑，故無法穿過開 孔222a。此外，各個测試探針220更包括一配置於蓋體222In the present example T, the conductive colloid 223 contains high-conductivity micro-scale metal particles or nano-sized metal particles, such as silver rubber or tin-like conductive materials, and the thimble 225 includes a rod body. 225a and a probe portion 225b. The rod body 225a penetrates into the opening 222a of the cover 222 and is connected to the elastic member 224, and the probe portion 225b is connected to the rod body 225a. The outer diameter of the probe portion 225b in i is substantially larger than the diameter of the opening (10), so Pass through the opening 222a. In addition, each test probe 220 further includes a cover body 222.
i之ΐί 22Γ用以限制頂針225往筒身221Θ部的位移 里。八中，私座226與蓋體222可一體成 體222之上表面限制頂斜註 乂直接以I 之外，蓋體222是可 及彈性元件224安心身= 厂堅時;為了減少筒身功内部受 遭受外域二探針 至這些__2〇上時，這些測二 12 1286809 !7472twf.doc/r 大小而伸縮，因而確保這些測試22 =220將刀別作為晶片封裝體邙，之這些接點c，與測試電 路板210之這些接點212之間的電性通道。因此， =cp’將可經由這些測試探針22(^電^^ ，训，以使得本實施例之測試模組 二: 體⑼内的晶片（未緣示）進行電性測試。f曰曰片封衣 W在進1電性測試的過程中，頂針225會壓縮彈性元件 ，因此彈性7L件224係完全浸泡於導電膠體223中，且 ，針225之才于體22%係部分浸泡於導電膠體223中。此 :十與頂針225之探針部225b接觸，以限制頂 、十25向下的位移。由於導電膠體223具有冑導電性 1由測5式電路板21 〇所發出之測試電流的絕大部分 =摊抗路徑傳輪至^封錢cp，，也就是藉:各個 序經過㈣221的底部、導電膠體223 :、、，口而傳達至晶片封裝體CP，，接著再由晶片封裝 版CP、回傳至測試電路板21〇。與習知技術相較，本發明 之測式探針220與應用此測試探針22G的測試模組⑽由 :^ =損而接觸不良的問題，因此使得頂針225 ，、¥，¥體223之f麵阻抗財會增加。 最後’必須說明的是，在本發明另一實施例中，在 :衫#亡述的設計需求下，導電膠體Μ3可以導電粉末或讓 壬^導電性的流體加以代替，以使受壓狀態之騎^ 的桿體225a能部分埋入於導電粉末中，藉由導電粉末來降 d〇c/r I286809wf 低習，筒身122(見圖2)在訊號傳遞時之阻抗與磨損。由 ，銀疋孟屬界中導電性最佳的物質，因此以奈米銀粒子或 n、'及的銀粉末來傳導測試電流時，其阻抗值非常小，故 =度比傳統的探針可高出數倍以上，進而提高測試的可 罪义三以解決導電不良等問題。此外，雖然本發明以單動 =采針結構為範例而加以具體實施，但雙動式探針結 式探針結構均可適用。另外，彈性元件224亦可配 置或套設於筒身221之外，且不限定县骚望. 者亦可以其他構件來取代彈簧，在此不一二費^此技蟄 試模㈣難繼蝴試探針的测 組二試探針的測試模 體之間幾無摩擦損耗。與ί知導電性的導電膠 針與應用此賴探針的•擔X树明之測試探 觸不良的問題，因===度磨損而接 會增加，進而使得本發明 π彡^間的阻抗值不 测試模組可維持較佳的测試良率。衣〜、怎用此測試探針的 (二）由於本發明之測試探針盘 极祖採用蓋體以密封筒身與之^測物針的測 行電性測試時，筒身内的露币y 0 ◊間隙，因此在進 件而溢出。 ⑹電膠體不會因頂針麼縮彈性元 (二）由於本發明之測試广鱼 試模組採用檔座以限制頂針的、夕人怎用此測試探針的測 、、立移’因此頂針壓縮彈性元 1286809 17472twf.doc/r 件的最大位移量為固定。 雖然本發明已以較佳實施例揭露如上，狹盆 二=、:壬何熟習此技藝者，在不脫離:發:之3 和乾圍内，當可作些許之更動與潤 =月之4神 範圍當視後附之申請專利範圍所界定者^本务明之保護 【圖式簡單說明】 玄马丰。 :2二:广種測試模組的側視剖面示意圖。 二二不f1之测試探針的側視剖面示意圖。 示意圖/曰不㈣—實施例之一種測試模組的側视剖面 示意圖圖。4A繪示圖3之測試探針未受外減縮的側视剖面 示意圖圖。4B緣示圖3之測試探針遭受外減縮的側視剖面 【主要元件符號說明】 100、200 :測試模組 110、210 :測試電路板 112、212:測試電路板的接點 120、220 :測試探針 122、221 :筒身 122a、222a :開孔 124 :彈簧 126 :上頂針 128 :下頂針 I2868lQ§twfdoc/r 222 :蓋體 223 :導電膠體 224 :彈性元件 225 :頂針 225a :桿體 225b :探針部 226 :槽座 230 :排針插座 C、C’ ：晶片封裝體的接點 CP、CP’ ：晶片封裝體i ΐ Γ 22 is used to limit the displacement of the thimble 225 to the crotch of the barrel 221 . In the eighth, the private seat 226 and the cover 222 can be integrated into the upper surface of the body 222 to limit the top oblique injection directly to the outside of the I, the cover 222 is accessible to the elastic member 224, and the body is firm; When the internal is subjected to the outer domain two probes to these __2 ,, these measurements are stretched by the size of 12 1286809 !7472twf.doc/r, thus ensuring that these tests 22 = 220 will be the chip package, these contacts c, an electrical path between the contacts 212 of the test circuit board 210. Therefore, =cp' will be electrically tested by the test probes 22 of the test module 2: the wafers in the body (9) (not shown). In the process of the electric seal test, the thimble 225 compresses the elastic member, so that the elastic 7L member 224 is completely immersed in the conductive colloid 223, and the needle 225 is partially immersed in the conductive portion of the body 22%. In the colloid 223. This: ten is in contact with the probe portion 225b of the thimble 225 to limit the displacement of the top and the lower portion of the tenth. Since the conductive paste 223 has the conductivity of the crucible 1 the test current is emitted by the 5th type circuit board 21 The vast majority of the = anti-path path to the ^ 钱 cp, that is, the borrowing: each order through the (four) 221 bottom, conductive colloid 223:,, the mouth is transferred to the chip package CP, and then by the chip package The version CP is returned to the test circuit board 21 〇. Compared with the prior art, the test probe 220 of the present invention and the test module (10) to which the test probe 22G is applied have a problem of poor contact due to damage. Therefore, the f-surface impedance of the thimbles 225, ¥, ¥ 223 is increased. Finally, it must be said In another embodiment of the present invention, the conductive colloidal crucible 3 may be replaced by a conductive powder or a conductive fluid to replace the rod in a pressurized state. The body 225a can be partially buried in the conductive powder, and the conductive powder is used to reduce the impedance and wear of the tube 122 (see FIG. 2) during signal transmission. The best conductivity of the material, so when the nano-silver particles or n, 'and silver powder to conduct the test current, the impedance value is very small, so the degree can be several times higher than the traditional probe, and then The test can be improved to solve the problem of poor conduction, etc. Further, although the present invention is embodied by the single-action=needle structure, the double-action probe-junction probe structure can be applied. The elastic member 224 can also be disposed or sleeved outside the barrel 221, and does not limit the county voyage. The other members can also replace the spring, and there is no such thing as a technique. There is no friction loss between the test phantoms of the two test probes of the needle test. The conductive conductive needle and the problem of poor detection of the X-ray test using the probe are increased due to the wear of the === degree, so that the impedance value between the π彡^ of the present invention is not tested. The group can maintain a better test yield. The clothing ~, how to use the test probe (b) because the test probe disk of the present invention is the ancestor of the cover body to seal the barrel and the measurement of the object needle During the electrical test, the dew y 0 ◊ gap in the barrel is overflowed, so it overflows during the feeding. (6) The electrocolloid does not shrink the elastic element due to the thimble. (2) Because the test of the invention is based on the test block How to limit the thimble, how to use the test probe's measurement, and the vertical shift 'Therefore the maximum displacement of the thimble compression elastic element 1286809 17472twf.doc/r is fixed. Although the present invention has been disclosed in the preferred embodiment as above, the narrow basin two =,: those who are familiar with the art, in the absence of: hair: 3 and dry circumference, when you can make some changes and run = month 4 God's scope is defined by the scope of the patent application attached to it. ^Protection of the law [Simplified description of the schema] Xuan Mafeng. : 2 2: A schematic view of a side view of a wide variety of test modules. A side cross-sectional view of the test probe of the second and second f1. Schematic/曰不(4)—Side view of a side view of a test module of an embodiment. 4A is a schematic cross-sectional view showing the test probe of FIG. 3 without external shrinkage. 4B edge shows the side view of the test probe of FIG. 3 subjected to external reduction [main component symbol description] 100, 200: test module 110, 210: test circuit board 112, 212: test circuit board contacts 120, 220: Test probes 122, 221: barrel 122a, 222a: opening 124: spring 126: upper thimble 128: lower thimble I2868lQ § twfdoc / r 222: cover 223: conductive colloid 224: elastic element 225: thimble 225a: rod body 225b: probe portion 226: socket 230: pin header C, C': contact of the chip package CP, CP': chip package
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