且特別是有關於一種And especially about one kind
I286661 2l 162twf.doc/g 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種噴墨製程 噴墨圖案轉移製程。 【先前技術】 傳統以喷墨印刷（inkjet printing)製程來形成預定圖 案具有下列優點，例如不需使用光罩或網版，僅需進行單 〜^ “即可將光阻油墨任意印刷成所需之圖案（包括文 予、規則或不規則等複雜圖案），使得圖案化線路的製作更 為方便，一而且能縮短製程時間。另外，由於喷墨印刷製程 僅需進行圖案處理、喷墨、印刷以及固化等簡單步驟，而 不需進行曝光、顯影等步驟，因此無須 ％保問題的產生。此外，喷墨印㈣賴使用之設備 ^材料使^率南以及製程週期短，因此可降低製程成本。 ^圖+1 %不一種具有通孔的基板的示意圖，而圖2繪示 ^的，墨印刷製程直接在基板表面上形成預定圖案的示 思圖。請參考目！，習知基板簡械鑽孔方式形成通 孔102 ’並以電鑛製程形成導電層104於通孔1〇2的内壁 及孔緣之後，再㈣2之喷頭直接在基板的上方 f出光阻油墨202，以形成預錢案。然而，因為油墨2〇2 具有流動性，、遇到較大孔徑的通孔1G2時，會陷入於通孔 _中除非通孔102的孔徑报小加上特殊配方的油墨（如 南黏度）；亦或是通孔1〇2内已被填孔材料或油墨填滿，才 1286661 21162twf.doc/g 可阻擋油墨202陷入’否則就不能有效地遮蔽通孔1〇2上 方和周圍表面。 特別是在光阻喷墨製程中，若光阻油墨2〇2不能有效 地遮蔽通孔102上方和周圍表面，將使通孔1〇2内及孔緣 上的導電層104暴露於光阻油墨2〇2之外而被後續的蝕刻 ‘私知钮，因而造成斷路或可靠度不佳等問題。 【發明内容】I286661 2l 162 twf.doc/g IX. Description of the Invention: [Technical Field] The present invention relates to an ink jet process ink jet pattern transfer process. [Prior Art] Conventionally, an inkjet printing process for forming a predetermined pattern has the following advantages, for example, without using a photomask or a screen, it is only necessary to perform a single image to print the photoresist ink as desired. The pattern (including complex patterns such as text, rules or irregularities) makes the production of patterned lines more convenient, and can shorten the processing time. In addition, since the inkjet printing process only requires pattern processing, inkjet, and printing. And simple steps such as curing, without the need for exposure, development and other steps, so there is no need to maintain the problem of the %. In addition, the inkjet printing (four) depends on the equipment used to make the rate and the process cycle is short, thus reducing the process cost ^ Figure +1% is not a schematic view of a substrate with a through hole, and Figure 2 shows a schematic diagram of the ink printing process directly forming a predetermined pattern on the surface of the substrate. Please refer to the item! The through hole 102' is formed by the drilling method, and the conductive layer 104 is formed in the inner wall and the edge of the through hole 1〇2 by the electric ore process, and the nozzle of the (4) 2 directly emits the light resistance directly above the substrate. The ink 202 is formed to form a pre-money case. However, since the ink 2〇2 has fluidity, when a through-hole 1G2 having a large aperture is encountered, it will fall into the through-hole _ unless the aperture of the through-hole 102 is small and special The ink of the formula (such as the south viscosity); or the through hole 1 〇 2 has been filled with the hole filling material or ink, only 1286661 21162twf.doc / g can block the ink 202 into 'otherwise it can not effectively block the through hole 1 Above and around the surface of 〇2. Especially in the photoresist inkjet process, if the photoresist ink 2〇2 cannot effectively block the upper and surrounding surfaces of the via 102, it will conduct electricity in the via 1b and on the edge of the hole. The layer 104 is exposed to the photoresist ink 2〇2 and is subsequently etched by the 'private button, thus causing problems such as open circuit or poor reliability.
本發明的目的就是在提供一種喷墨圖案轉移製程，可 ，印一預定的成顧案於基板上，以改善習知噴墨印刷製 程 首先，：:3:種案轉移製程’包括下列步驟: 案;將成膜圖案與一基板的二:::二以形成-成膜圖 ::圖案;最後’移除载具以使成膜圖案板=SUMMARY OF THE INVENTION The object of the present invention is to provide an ink jet pattern transfer process which can be printed on a substrate to improve the conventional ink jet printing process. First, the ::3: seed transfer process includes the following steps: Case; forming a film pattern with a substrate of two::: two to form a film-forming pattern:: pattern; finally 'removing the carrier to make a film-forming pattern plate=
驟:首本=:=^ 膜圖案;半固化成膜圖案;將成 具上以形成-成 行面對面接觸;最後，移除==:-基板的表面進 的表面上。 /、使成勝圖案轉印到基板 一固贿，故-載具以及 ，的表面:對 1286661 21162twf.doc/g 依照本發明的實施例所述，上述之基板具有至少一通 孔或盲孔，通孔或盲孔中具有一導電層，而成膜圖案對應 覆蓋於通孔或盲孔上方及周圍表面。 依照本發明的實施例所述，上述之載具包括一硬板、 一軟板或一離型紙，其具有可承載成膜圖案之一平坦表 面。在另一實施例中，載具之平坦表面與成膜圖案之間還 具有一脫膜層。 _ 地，上现之固化器例如是光| 化器，其產生的光能照射於成膜圖案，使其固化。 依照本發_所述，上述之削以例如是熱[ 匕卯其產生的熱能加熱於成膜圖案，使i固化。 •載时墨_轉移製程，可形翻定圖案方 载/、上，而非直接形成於基板的表面 表面上存在有财或盲孔時，本發ϋ基板白、' 案轉印到通孔或盲孔上方及周圍表面了=的預定圖 或盲孔中，進而提高製程可靠度。4入於通孔 易懂為==_他目的、特徵和優點能物 明如下特舉較佳賞施例，並配合所附圓式，作^ 【實施方式】 製程的流程圖。請先::圖之噴墨圖案轉移 =載上:=:任其:，：是^^ 了以疋任何適當可做為裁具的圖索轉 1 ’包括 I28662^Ldoc/g 硬板、軟板或離型紙等材質，通常具有平坦且均勻的表面。 此外，載具310可依據油墨的性質做表面處理，例如親水 性、疏水性或易脫膜處理專，以形成一脫膜層308，I可 以依據不同的油墨配方做搭配，例如需要照光的uv光阻 油墨，可以搭配可透光的載具/離型紙；熱固型的抗蝕刻阻 劑油墨，可以搭配耐熱型的載具/離型紙。Step: First ===^ film pattern; semi-cured film forming pattern; the mold is formed to form a face-to-face contact; finally, the surface of the substrate is removed ==:-. /, transferring the winning pattern to the substrate, fixing the bribe, so the surface of the carrier and: 1286661 21162twf.doc / g According to an embodiment of the invention, the substrate has at least one through hole or blind hole, The through hole or the blind hole has a conductive layer, and the film forming pattern covers the upper surface and the surrounding surface of the through hole or the blind hole. According to an embodiment of the invention, the carrier comprises a hard board, a soft board or a release paper having a flat surface that can carry a film forming pattern. In another embodiment, the release surface of the carrier has a release layer between the flat surface and the film formation pattern. _ Ground, the emerging curing device is, for example, a photo-chemical device, and the generated light energy is irradiated onto the film forming pattern to cure it. According to the present invention, the above-described cutting is performed, for example, by heat [heat generated by the heat generated in the film forming pattern to cure i. • When the ink-on-transfer process is carried out, the pattern can be folded on the surface, and the surface of the substrate is not directly formed on the surface of the substrate. When there is a wealth or a blind hole, the substrate of the bun is white, and the film is transferred to the through hole. Or in the predetermined pattern or blind hole above the blind hole and the surrounding surface, thereby improving the process reliability. 4 into the through hole Easy to understand == _ his purpose, characteristics and advantages can be described as a special preferred embodiment, and with the accompanying round, ^ [Embodiment] process flow chart. Please first:: The inkjet pattern transfer of the figure = loaded: =: Ren::: Yes ^^ 疋 Any suitable can be used as a cutting tool to turn 1 'including I28662^Ldoc/g hard board, soft Materials such as plates or release papers usually have a flat and uniform surface. In addition, the carrier 310 can be surface-treated according to the properties of the ink, such as hydrophilic, hydrophobic or easy to release film, to form a release layer 308, I can be matched according to different ink formulations, such as uv requiring illumination The photoresist ink can be used with a light-transmissive carrier/release paper; the thermosetting anti-etching resist ink can be matched with a heat-resistant carrier/release paper.
在本實施例中，油墨經由喷頭300的控制噴印於載具 310上，先形成一負圖案，待負圖案於載具31〇上成膜^ 後，再將負圖案與待移轉的元件表面進行面對面接觸，經 過油墨固化程序，將載具310移除之後，即可將負圖案^ 印到元件的表面，而在元件表面形成正圖案。In this embodiment, the ink is printed on the carrier 310 via the control of the head 300, and a negative pattern is formed first. After the negative pattern is formed on the carrier 31, the negative pattern and the image to be transferred are removed. The surface of the component is in face-to-face contact, and after the carrier 310 is removed by the ink curing process, the negative pattern is printed onto the surface of the component to form a positive pattern on the surface of the component.
在圖4中，由於先以喷印方式在載具31〇上形成成膜 圖案312,故不受基板320上通孔322或盲孔324的影響、， 因此可以在基板32〇上很均勻的成膜，尤其是針對具有通 孔322及/或盲孔324的基板320,本發明可將成膜圖案312 完整地覆蓋於通孔322或盲孔324的上方及周圍表面，不 會有習知油墨陷入於通孔322或盲孔324中而流失的問題。 以下針對圖4、圖5的喷顯案轉移製程進—步說明。 請參考圖4 ’將製作完成的成膜圖案312與—基板32〇的 表面進行面對面接觸時，丨光固化器、33〇所產生的光能 光或雷射光）照射成膜圖案312，或以熱固化器二 所產生的熱能加熱成膜圖案312，以使抗 單體產生聚合反應而固化。當然，以喷印方式絲且^ 上形成-成膜圖案312時，亦可先進行半固化程序，、使喷 1286661 21162twf.doc/g 印的成膜圖案312半固化後，再以接觸轉印、熱轉印或壓 合的方式，將成膜圖案312轉移到基板320的表面，最後 再以光或熱固化器，將成膜圖案312完全固化，然後脫模。 如此，載具310不限定放置在待移轉基板32〇的下方，而 可以放置在基板320的上方或任意角度。尤其是可以在基 板320的雙面同時進行，且半固化的成膜圖案312較不易 改變。 最後，請參考圖5，完成油墨固化程序之後，載具31〇 與成膜圖案312之間的附著力將小於成膜圖案312與基板 320之間的固持力，因而當载具31〇被施加外力時，成膜 圖案312很容易自載具31〇上脫離，並使成膜圖案阳 印到基板32〇表面上，尤其是成膜圖案祀可對 通孔322或盲孔324上方和周圍表面 ς、 製議通細或盲細内壁及孔緣上 ==6刻 預定==明而因案轉移製程，可形成 Α、戟^上而非直接形成於基板的表面上，故 文土板的通孔或盲孔的影響，當户 盲孔上方及周C面月了 1 字载具上的預定圖案轉印到通孔或 克服直接嘴印陷人於通孔或盲孔中，進而 題。 、基私，綠於上枝卵成膜的問 巧定太二、，明已以較佳實施例揭露如上n廿非田 限疋本备日片，任何所屬技術領 :〜、亚非用以 離本發明之精神 ^ 一有、〶知4者，在不脫 乾圍内’當可作些許之更動與_，因 1286661 21162twf.doc/g 此本發明之保護範圍當視後附之申請專利範 【圖式簡單說明】 圖1繪示一種具有通孔的基板的示意圖。 圖2繪示習知的喷墨印刷製程直接 預定圖案的示意圖。 土表面上形成In FIG. 4, since the film formation pattern 312 is formed on the carrier 31 by the printing method, it is not affected by the through hole 322 or the blind hole 324 on the substrate 320, so that it can be uniformly on the substrate 32. Film formation, especially for the substrate 320 having the through holes 322 and/or the blind holes 324, the present invention can completely cover the film formation pattern 312 over the upper and surrounding surfaces of the through holes 322 or the blind holes 324 without conventional knowledge. The problem that the ink is trapped in the through hole 322 or the blind hole 324 is lost. The following is a description of the injection molding process of FIG. 4 and FIG. Referring to FIG. 4 'when the formed film formation pattern 312 is in face-to-face contact with the surface of the substrate 32 丨, the photo-curable light or laser light generated by the phosphor curing device, 33 照射 is irradiated to the film formation pattern 312, or The heat generated by the thermosetting device 2 heats the film forming pattern 312 to cause the anti-monomer to undergo polymerization to be solidified. Of course, when the film-forming pattern 312 is formed by the printing method, the semi-curing process may be performed first, and the film forming pattern 312 of the printing 1268661 21162 twf.doc/g is semi-cured, and then contact transfer is performed. The film formation pattern 312 is transferred to the surface of the substrate 320 by thermal transfer or press bonding, and finally, the film formation pattern 312 is completely cured by a light or a heat curing device, and then demolded. As such, the carrier 310 is not limited to be placed below the substrate to be transferred 32, but may be placed above the substrate 320 or at any angle. In particular, it can be simultaneously performed on both sides of the substrate 320, and the semi-cured film formation pattern 312 is less likely to be changed. Finally, referring to FIG. 5, after the ink curing process is completed, the adhesion between the carrier 31〇 and the film formation pattern 312 will be less than the holding force between the film formation pattern 312 and the substrate 320, and thus when the carrier 31 is applied When the external force is applied, the film formation pattern 312 is easily detached from the carrier 31, and the film formation pattern is positively printed on the surface of the substrate 32, especially the film formation pattern 对 can be on the upper and surrounding surfaces of the through hole 322 or the blind hole 324. ς, the regulation of the fine or blind inner wall and the edge of the hole ==6 engraved == Ming and due to the transfer process, can be formed on the surface of the substrate, not directly formed on the surface of the substrate, so the soil plate Through the influence of through holes or blind holes, the predetermined pattern on the 1st character carrier is transferred to the through hole above the blind hole and the surface of the C face, or the direct mouth mark is trapped in the through hole or the blind hole. , the basis of private, green in the upper branch of the egg formation of the problem is too two, Ming has been exposed in the preferred embodiment of the above n 廿 田 疋 疋 疋 备 备 , , , , , , , , , , , , , , , The spirit of the present invention is as follows: if there is any, knowing 4, in the absence of drying, 'when there can be some changes and _, because 1286661 21162twf.doc / g, the scope of protection of the present invention is attached to the patent application BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a substrate having a through hole. Figure 2 is a schematic illustration of a conventional inkjet printing process direct predetermined pattern. Formed on the soil surface
圍所界定者為 實施例之嘴墨圖案轉移 圖3〜圖5緣示本發明一較佳 製程的流程圖。 【主要元件符號說明】 100 ·_基板The definition of the mouth ink pattern of the embodiment is shown in Fig. 3 to Fig. 5 as a flow chart of a preferred process of the present invention. [Main component symbol description] 100 ·_ substrate
102 :通孔 104 :導電層 200 :喷頭 202 :油墨 300 :喷頭 308 :脫膜層 310 :載具 312 :成膜圖案 320 :基板 322 :通孔 324 :盲孔 326 :導電層 330 :光固化器、熱固化器 10102: through hole 104: conductive layer 200: shower head 202: ink 300: shower head 308: stripping layer 310: carrier 312: film forming pattern 320: substrate 322: through hole 324: blind hole 326: conductive layer 330: Photocuring device, heat curing device 10