TWI285736B - Digital-image measuring method and device thereof - Google Patents
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!285736 八、本案若有化學式時，請揭示最能顯示發明特徵的化學式!285736 VIII. If there is a chemical formula in this case, please reveal the chemical formula that best shows the characteristics of the invention.
九、發明說明： 【發明所屬之技術領域】 本發明係提供一種數位光學影像量測方法及其裝 置，係於檢測流程中運用〜組標準物件之影像以驗証比對 物件之差異程度，進而達到快速比對之效果。IX. Description of the Invention: [Technical Field] The present invention provides a digital optical image measuring method and apparatus thereof, which use an image of a standard object in a detection process to verify the degree of difference between the comparative objects, thereby achieving Quick comparison effect.
【先前技術】 目前各種電路板（PCB，Printed Circuit Board)之製 程’係在一電路基板（Printed Circuit Board Panel)上， 因應各種不同大小尺寸或製程之需要，而製造出多個電路 板，而其排列方式亦有所不同。又，因應客戶要求或品管 規定’使每一電路基板上電路板之不良率有不同限制，如 在電路基板上可能容許一個電路板為不良品，或在電路基 板上可能容許三個電路板為不良品，即不良率在客戶所要 求的規定值下，仍可被接受為可用的電路基板，進行後續 製程。 1285736 因此’不良率在規定值以上之電路基板即為棄用之電 路基板；然而，以電路板製造商而言，華 仍具有為數不少之電路板為仍可制之良品電路板 1棄之 可惜’ N·間與彳b費成本亦相對增加，因而開始發展各種除 壞更新之錢’_人謂財式时棄用電路基板上之 良品電路板，並將可用電路基板上之不良電路板用人工對 位模具移除’再以工触料補人良品電路板以取代 之。最後’以工方式_尺具交#量_位定位點或參 考點相互間之相對距離，進而檢查其補入之良品電路板是 否介於一預設範圍之標準位置間。 然而，隨著電路板趨向奈米級的精密程度盘高產量之 生產速度，以人工方式之運作流程已無法符合現今產業界 的需求，因此研發出許多精密機械以替代人工方式之運作 流程，其中又以電路板之檢查流程因其攸關出產料板於 市面上之良率與廠商之商譽，而顯示其重要性。 如上所述，目前已有不少檢查流程相關的專利案件被 揭露，例如中華民國發明專利公告號第4 8 4 3 5 〇號 「多層印刷電路板及其層間偏位之測定方法」中，揭^一 種多層印刷電路板之層間偏位之測定方法，其特微為在 多廣印刷電路板内層的導體層上形成去除導體的多個引 導標記框；該引導標記框處於前述各導體層的相同位置， 其所形成的大小納入在前多層印刷電路的 以觀測前述引導標記的觀測裝置中顯像部的視_;二 配置在前述引導標記框的内部，由空心引導標記内部配置 的前述實心引導標記和前述空心引導標記組成的至少一 組引導標記組的引導標記群，並在—次觀剩中取入一個引 1285736 導標記群内的全部引導標記組的圖像。又，如在中華民國 發明專利公告號第5 2 0 1 3 0號之「多層印刷電路板之 對準度及漲縮程度之量測構造」中，揭露一種多層印刷電 路板之對準度及張縮程度之量測構造，其主要係包含：四 透光區，其係分別設置於一多層印刷電路板之各單層板之 中心往外水平延伸之四個方位上；及數個位置標記，其係 位於各透光區内並具有數字、符號供分別代表各種相對位 置之順序，當各單層板複熱壓合後，藉由強光源取得各透 光區内位置標記之上視重合影像以分析各位置標記之整 體相對偏移及漲縮程度。另外，在中華民國發明專利公告 號第5 6 5 1 0 4號之「多層電路板之疊合檢知裝置」 中’揭露一種多層電路板之疊合檢知裝置，其加工裝置之 平台處至少包括有識別裝置及測厚裝置所組成，而平台為 可透過人工或自動方式置放層層間隔的銅箔基板與絕緣 膠片進行疊合，以完成多層電路板於疊合時的前置加工作 業；其中，該識別裝置為可監控其銅箔基板與絕緣膠片所 屬之識別記號是否吻合預設值；該測厚裝置為可監控其鋼 箔基板與絕緣膠片之疊合厚度是否吻合預設值；藉上，而 可於加工裝置在逐層將銅箔基板與絕緣膠片疊合過程中， 可以識別裝置及測厚裝置同時監控其所屬之識別記號及 疊合厚度是否吻合預設值，來使銅箔基板與絕緣膠片之疊 合過程可輕易達成，以完成多層電路板於疊合時的前置加 工作業。 ^ 然，在上述之專利技術中，不論是「多個弓丨導標記 框」、「數個位置標記」或「其銅箔基板與絕緣膠片所屬之 識別記號」，其皆需在電路板上設定數個定位點或參考 1285736 點，並運用「觀測裝置」、「儀器」或「識別裝置」以交替 量測數個定位點或參考點相互間之相對距離，並由其相對 β 距離以檢測電路板是否位於電路基板中之標準位置。其 ' 中，因運用「觀測裝置」、「儀器」或「識別裝置」於數個 參考點間移動以計算數個參考點間距離，而需耗費極長的 時間以精準移動「觀測裝置」、「儀器」或「識別裝置」， 且若因提高精確度而需更多參考點以計算參考點間距 離，則所需耗費移動「觀測裝置」、「儀器」或「識別裝置」 之時間將更加龐大。另外，若因產品流程中因製成誤差或 ^ 人工破壞而使參考點不完整，將直接影響精確度，造成無 法正確地檢測電路板是否位於電路基板中之標準位置而 使市面上之電路板良率下降與電路板廠商的商譽受損。 習知技術中相關於產品檢查量測方法及其裝置係採 . 用數個參考點相互間交替量測之方式，對於現今兼具快速 與方便性之精準量測需求卻可能無法提供全面而完整解 決方案。因此，提供一種完善的量測方式已具有極為迫切 需求。[Prior Art] At present, various printed circuit board (PCB) processes are fabricated on a printed circuit board panel, and a plurality of circuit boards are manufactured according to various sizes and processes. The arrangement is also different. In addition, in accordance with customer requirements or quality control regulations, the defect rate of the circuit board on each circuit board is different. For example, one circuit board may be allowed to be defective on the circuit board, or three circuit boards may be allowed on the circuit board. For defective products, that is, the defect rate is required to be the available circuit board under the specified value required by the customer, the subsequent process can be carried out. 1285736 Therefore, the circuit board whose defective rate is above the specified value is the discarded circuit board; however, as far as the circuit board manufacturer is concerned, China still has a large number of circuit boards for the good circuit board 1 that can still be manufactured. Unfortunately, the cost of 'N· and 彳b fees has also increased relatively, so we began to develop various kinds of bad and updated money'. When people use the financial system, they will use the good circuit board on the circuit board and use the bad circuit board on the available circuit board. Use the manual aligning mold to remove 'replace the good circuit board to replace it. Finally, the relative distance between the positioning points or the reference points is checked by the working method, and the quality of the printed circuit board is between the standard positions of a predetermined range. However, as the circuit board tends to the nanometer-level precision production speed, the manual operation process can not meet the needs of today's industry, so many precision machinery have been developed to replace the manual operation process. In addition, the board inspection process shows its importance because it cuts off the yield of the production board on the market and the goodwill of the manufacturer. As mentioned above, a number of patent cases related to the inspection process have been disclosed, for example, in the Republic of China Invention Patent No. 4 8 4 3 5 「 "Multilayer printed circuit board and its method for determining the deviation between layers" A method for measuring interlayer misalignment of a multilayer printed circuit board, which is characterized in that a plurality of guide mark frames for removing conductors are formed on a conductor layer of an inner layer of a multi-wide printed circuit board; the guide mark frame is in the same shape as each of the foregoing conductor layers a position formed by the image forming portion of the observation device of the front multilayer printed circuit for observing the aforementioned guiding mark; and a second solid inside the guiding mark frame, and the solid guiding disposed inside the hollow guiding mark The marker and the aforementioned hollow guide mark constitute at least one set of guide mark groups of the guide mark group, and take in an image of all the guide mark groups in the 1285736 guide mark group in the first view. Further, as disclosed in the "Measurement of Alignment and Shrinkage Degree of Multilayer Printed Circuit Boards" of the Republic of China Invention Patent Publication No. 5 2 0 1 3 0, a alignment of a multilayer printed circuit board and The measurement structure of the degree of contraction mainly includes: four light-transmissive areas respectively disposed in four directions extending horizontally outward from the center of each single-layer board of a multi-layer printed circuit board; and a plurality of position marks It is located in each light-transmitting area and has numbers and symbols for respectively representing the order of various relative positions. When each single-layer board is reheated and pressed, the positional coincidence of the position marks in each light-transmitting area is obtained by a strong light source. The image is used to analyze the overall relative offset and degree of contraction of each position marker. In addition, in the "Multi-layer circuit board superimposition detecting device" of the Republic of China Invention Patent No. 5 6 5 1 0, a superimposed detecting device for a multilayer circuit board is disclosed, at least on the platform of the processing device The utility model comprises an identification device and a thickness measuring device, and the platform is a copper foil substrate which can be placed at intervals by manual or automatic manner, and is laminated with the insulating film to complete the pre-processing operation of the multilayer circuit board during the lamination. Wherein the identification device is configured to monitor whether the identification mark of the copper foil substrate and the insulating film is in agreement with the preset value; the thickness measuring device is configured to monitor whether the overlapping thickness of the steel foil substrate and the insulating film meets a preset value; By means of the processing device, during the process of stacking the copper foil substrate and the insulating film layer by layer, the identification device and the thickness measuring device can simultaneously monitor whether the identification mark and the overlapping thickness of the device are in agreement with the preset value, so that the copper is made. The process of laminating the foil substrate and the insulating film can be easily achieved to complete the pre-processing of the multilayer circuit board during the lamination. ^ However, in the above-mentioned patent technology, whether it is "multiple bow mark mark frame", "several position mark" or "the identification mark of the copper foil substrate and the insulating film", it is required to be on the circuit board. Set several positioning points or reference 1285736 points, and use "observation device", "instrument" or "identification device" to measure the relative distance between several positioning points or reference points, and detect them by their relative β distance. Whether the board is in the standard position in the circuit board. In the process of using the "observation device", "instrument" or "identification device" to move between several reference points to calculate the distance between several reference points, it takes a very long time to accurately move the "observation device", "Instrument" or "Identification Device", and if more reference points are needed to improve the accuracy to calculate the distance between reference points, the time required to move the "observation device", "instrument" or "identification device" will be even more huge. In addition, if the reference point is incomplete due to the manufacturing error or the manual destruction in the product flow, the accuracy will be directly affected, resulting in the failure to correctly detect whether the circuit board is in the standard position in the circuit substrate and the circuit board on the market. The drop in yield and the goodwill of board manufacturers are compromised. In the prior art, the product inspection measurement method and its device system are used. With several reference points alternately measuring each other, it is impossible to provide comprehensive and complete measurement requirements for fast and convenient precision measurement. solution. Therefore, there is an urgent need to provide a sophisticated measurement method.
【發明内容】 本發明之目的為提供一種數位光學影像量測方法及 其裝置，係僅需藉由一標準物件内可供辨識之一組影像， 而無需特定參考點，並於兼顧快速、方便與精準檢測的情 形下驗証比對物件之差異程度。 本發明係提供一種數位光學影像量測方法，係利用一 標準電路基板内位在電路板標準位置之複數個標準電路 1285736 板以驗証一比對電路基板内之複數個比對電路板，進而檢 測該比對電路基板内所補回置入之該比對電路板是否介 於電路板標準位置之一預定範圍内，該數位光學影像量測 方法運用於一數位光學影像量測裝置，該數位光學影像量 測裝置至少具有複數個數位光學影像擷取裝置及至少— 處理器’该數位光學影像量測方法首先運用該數位光學$ 像擷取裝置於一固定狀態下由該標準電路板上可供二二 之一位置内以擷取一標準組數位光學影像，且將所擷取^ 該標準組數位光學影像轉換為數位形式之一標準組影像 資訊，並將該標準組影像資訊傳送到該處理器，接著再運 用該數位光學影像擷取裝置於同一固定狀態下由該比 電路板上可供辨識之同一位置内以擷取一比對組^位光 學影像’絲所擷取之該崎組數位光學影雜換為數位 形式之-比對組影像資訊，並將該比對組影像資訊傳 該處理器，隨後由該處理器經處理運算以產生於同—固〜 位置内該標準㈣像資訊與該比對組影像資訊之相ς 度，且依其相似度以檢測該比對電路基板内所補回置入 該比對電路板是否介於電路板標準位置之一預定a 内’進而產生該處理H朗該比對電路板是否補回該= 電路基板㈣纽置之縣，最後制-㈣裝置以 該處理器產生之判別結果。 見 此外’本發明更提供-數位光學影像 用一標準電路基板内位在雷政此掷.隹v ^直係利 電板標準位置之複數個禪準 電路板驗比對電路基㈣之複數個比對電路板， =1 對電路基板内所補回置入之該比對電路板是否介 於電路板標準位置之-狀範_，該數位鮮影像 1285736 裝置係包含：複數個數位光學影像擷取裝置，係用以擷取 電路基板内電路板上可供辨識一位置内之數位光學影 像’且將所擷取之數位光學影像轉換為數位形式之影像資 訊’並傳送該影像資訊，其中該數位光學影像擷取裝置可 為複數個數位攝影鏡頭，該數位攝影鏡頭可為下列裝置之 一 · CMOS (Complementary Metal-Oxide Semiconductor，SUMMARY OF THE INVENTION An object of the present invention is to provide a digital optical image measuring method and a device thereof, which are capable of recognizing a group of images by using a standard object without a specific reference point, and which is quick and convenient. Verify the difference in the object compared to the case of accurate detection. The invention provides a digital optical image measuring method, which utilizes a plurality of standard circuit 1285736 plates in a standard circuit substrate at a standard position of a circuit board to verify a plurality of comparison circuit boards in a pair of circuit substrates, thereby detecting Comparing whether the comparison circuit board placed in the circuit substrate is within a predetermined range of a standard position of the circuit board, the digital optical image measuring method is applied to a digital optical image measuring device, the digital optical The image measuring device has at least a plurality of digital optical image capturing devices and at least a processor. The digital optical image measuring method first uses the digital optical image capturing device to be available on the standard circuit board in a fixed state. A standard group digital optical image is captured in one of the two positions, and the standard group digital optical image captured by the standard image is converted into one standard image information of the digital form, and the standard group image information is transmitted to the processing. And then using the digital optical image capturing device to be identified by the same circuit board in the same fixed state The inside of the set is used to capture a pair of optical images of the group, and the digital optical image of the array is converted into a digital form, and the image information of the comparison group is transmitted to the processor. And then processed by the processor to generate a correlation between the standard (4) image information and the comparison group image information in the same position, and the similarity is used to detect the comparison in the circuit substrate. Resetting whether the comparison board is within a predetermined one of the board standard positions, and then generating the processing H, whether the comparison board replaces the = circuit board (four) of the county, the last system - (four) device The discrimination result produced by the processor. See also 'The present invention is further provided - digital optical imaging with a standard circuit substrate in the position of Lei Zheng. 隹v ^ straight system of the standard position of the zen circuit board test comparison circuit base (four) of the plural Comparing the board, =1 Whether the comparison board placed in the circuit board is in the standard position of the board, the digital image 1285736 device includes: a plurality of digital optical images撷The device is configured to capture a digital optical image in a position on a circuit board of the circuit substrate and convert the captured digital optical image into digital image information and transmit the image information, wherein the image information is transmitted The digital optical image capturing device can be a plurality of digital photographic lenses, which can be one of the following devices: CMOS (Complementary Metal-Oxide Semiconductor,
互補性氧化金屬半導體）鏡頭、CCD(Charge Coupled Device ，感光耦合元件）鏡頭、Super CCD鏡頭或 VPS(VariablePixel Size)鏡頭；及至少一處理器，係與 該數位光學影像娜裝置有電氣連接關係，用以接收該影 像資訊，且依於同—位置内各個影像資訊間之相似度以檢 測電路基板_補回置人之電路板是否介於電路板標準 位置之-預定範_，進而產生該處理 補回電路基板内適當位置之結果。 极疋金 _ 吻取叫疋字彩彳豕彌取裝置可搭配至少一步驾 作裝置’該步進馬達係用以移動該數位光學景 =裝置，賴作裝置剌㈣制該數位光學影像獅 馬達之騎綠動叙控制㈣ 乍動$亥數位光學影像量測奘番 置，係與該處理器有電氣連接關:用以呈：：:-顯开 Ο ' 回電路基板内‘當位=之 用，個及其㈣ 光學影像，且將所獅之數對物件之絮 影像資訊，再由該處理器比對換為數位形式 位置内各個影像資 10 間之差異程度，最後依其差異程度是否介於一預設範圍内 以產生一判別結果，故於檢測流程中，僅須利用一組標準 物件之影像即能以此檢測多組比對物件，讓判別結果能便 捷且快速地呈現於使'用者面前。而相較於先前之量測方法 或量測裝置運用量測距離之方式，若需利用數個參考點以 精確量測，則需經由數個參考點相互間繁瑣且多次地交替 量測’相較之下，本發明之數位光學影像量測方法及其裝 置所花費的時間及所須運用之人力均微乎其微。因此，本 發明之數位光學量測方法及其裝置可減少運用數個參考 點相互間交替量測之方式所造成的不便，確認比對物件的 精準程度，同時兼顧快速、方便與精準檢測，使得產品檢 測流程中的重要性得以完全發揮。 【實施方式】 請參閱第1圖，第1圖係為本發明一較佳實施例之架 構圖，本發明係提供一種數位光學影像量測方法，係利用 一標準電路基板20内位在電路板標準位置之複數個標準 電路板22驗証一比對電路基板30内之複數個比對電路板 32 ’以檢測該比對電路基板3〇内所補回置入之該比對電 路板32是否介於電路板標準位置之一預定範圍内，該數 位光學影像量測方法係運用於一數位光學影像量測裝置 1 〇 ’ δ亥數位光學影像里測裝置1 Q包含有兩個數位光學影 像顧取裝置12、一處理斋14及一顯示裳置19。 请參閱第2圖、弟3a圖與第3b圖，第2圖係為本發 明一較佳貫施例之流程圖’第3a圖係為本發明一較佳實 施例之示意圖一，第3b圖係為本發明—較佳實施例之示 1285736a complementary oxidized metal semiconductor lens, a CCD (Charge Coupled Device) lens, a Super CCD lens or a VPS (Variable Pixel Size) lens; and at least one processor is electrically connected to the digital optical image device. For receiving the image information, and according to the similarity between the image information in the same position, to detect whether the circuit board _returning the circuit board is at a predetermined position of the board standard position, thereby generating the processing The result of replenishing the appropriate position in the circuit substrate. Extremely 疋金_ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The riding green control (4) 乍 亥 亥 数 光学 光学 光学 光学 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Using, and (4) optical images, and comparing the number of lions to the image information of the object, and then comparing the processor to the degree of difference between the 10 images in the digital position, and finally depending on the degree of difference Between a predetermined range to produce a discriminating result, in the detection process, only a group of standard object images can be used to detect multiple sets of matching objects, so that the discriminating result can be presented conveniently and quickly. 'Users in front of you. Compared with the previous measurement method or the measuring device using the measuring distance, if several reference points are needed for accurate measurement, it is necessary to measure the multiple reference points cumbersomely and repeatedly. In comparison, the time and labor required for the digital optical image measuring method and apparatus of the present invention are negligible. Therefore, the digital optical measuring method and the device thereof of the invention can reduce the inconvenience caused by the method of alternately measuring the plurality of reference points, and confirm the accuracy of the comparison object, and at the same time take the quick, convenient and accurate detection, so that The importance of the product inspection process is fully realized. [Embodiment] Please refer to FIG. 1 , which is a block diagram of a preferred embodiment of the present invention. The present invention provides a digital optical image measuring method using a standard circuit substrate 20 in a circuit board. A plurality of standard circuit boards 22 in the standard position verify a plurality of comparison circuit boards 32' in the circuit substrate 30 to detect whether the comparison circuit board 32 inserted in the comparison circuit substrate 3 is interposed. The digital optical image measuring method is applied to a digital optical image measuring device within a predetermined range of the standard position of the circuit board. The δ' δ hai digital optical image measuring device 1 Q includes two digital optical image capturing devices. The device 12, a processing module 14 and a display skirt 19 are provided. Please refer to FIG. 2, FIG. 3a and FIG. 3b, and FIG. 2 is a flow chart of a preferred embodiment of the present invention. FIG. 3a is a schematic diagram 1 and a third diagram of a preferred embodiment of the present invention. Is the invention - the preferred embodiment of the display 1285736
意圖二，該數位光學影像量測方法首先運用該數位光學影 像擷取裝置12於一固定狀態下由該標準電路板22上可供 辨識之一位置内以擷取一標準組數位光學影像（S10)，且 將所擷取之該標準組數位光學影像轉換為數位形式之一 標準組影像資訊，並將該標準組影像資訊傳送到該處理器 14(S12)，接著再運用該數位光學影像擷取裝置12於同一 固定狀態下由該比對電路板32上可供辨識之同一位置内 以擷取一比對組數位光學影像（S14)，且將所擷取之該比 對組數位光學影像轉換為數位形式之一比對組影像資 訊，並將該比對組影像資訊傳送到該處理器14(S16)，隨 後由該處理器14經處理運算以產生於同一位置内該標準 組影像資訊與該比對組影像資訊之相似度（S18)，且依其 相似度以檢測該比對電路基板内所補回置入之該比對電 路板是否介於電路板標準位置之一預定範圍内，進而判別 該比對電路板是否補回該比對電路基板内之適當位置以 產生一判別結果（S20)，最後運用該顯示裝置19以呈現該 處理器產生之判別結果（S22)。In the second embodiment, the digital optical image measuring method first uses the digital optical image capturing device 12 to capture a standard set of digital optical images from a position on the standard circuit board 22 in a fixed state (S10). And converting the standard set digital optical image captured into one of the digital form standard image information, and transmitting the standard group image information to the processor 14 (S12), and then applying the digital optical image撷Taking the device 12 in the same fixed state from the same position on the comparison circuit board 32 for capturing a pair of digital optical images (S14), and taking the compared digital optical image Converting to one of the digital forms to compare the group image information, and transmitting the comparison group image information to the processor 14 (S16), and then the processor 14 processes the operation to generate the standard group image information in the same location. Similarity with the comparison group image information (S18), and according to the similarity thereof, detecting whether the comparison circuit board placed in the comparison circuit substrate is placed in a predetermined standard of the board standard position Further, it is determined whether the comparison board replenishes the appropriate position in the comparison circuit substrate to generate a discrimination result (S20), and finally the display device 19 is used to present the discrimination result generated by the processor (S22).
此外，請參閱第4圖，第4圖係為本發明另一較佳實 施例之立體圖，本發明更提供一數位光學影像量測裝置 100，係利用一標準電路基板内位在電路板標準位置之複 數個標準電路板以驗証一比對電路基板内之複數個比對 電路板，進而檢測該比對電路基板内所補回置入之該比對 電路板是否介於電路板標準位置之一預定範圍内，該數位 光學影像量測裝置100係包含：兩個數位光學影像擷取裝 置120，係用以擷取電路基板内電路板上可供辨識一位置 内之數位光學影像，且將所擷取之數位光學影像轉換為數 12 1285736 位形式之影像資訊’並傳㈣f彡像資訊，其巾該數位光 影像操取裝置12 G可為下狀置之—：隱鏡頭,鏡 頭、Super CCD鏡頭或VPS鏡頭；及至少一處理器（圖中 未示）’係與該數位光學影像擷取1置120有電氣連接關 係，用以接收該影像資訊，且依於同—位置内各個影像資 訊間之相似度以檢測電路基板内所補回置人之電路板是 否介於電路板標準位置之1定範圍内，進而產生該處理 器判別電路板是^_電路基_適#位置之結果。 另外，該數位光學影像擷取装置1〇〇可搭配至少一步 進馬達（圖中未示）及-操#裝置（圖中未示），該步進馬達 係用以移動該數位光學影像触裝置12Q，該操作裝置係 用以控制魏位光學影賴取裝置12Q崎電路基板内 電路板之影像齡動作及控職步進馬達之作動。該數位 光學影像量測裝置更可配置複數個光學尺（圖中未示）及 =不裝置（圖巾未示），該光學尺係用㈣確量測該數位 ^子影像練裝置12〇之位置，並可搭配該步進馬達及該 細作裝置以㈣錄位光學影侧取裝置m之精準移 :’該顯示裝置係與該處理器有電氣連接關，用以呈現該 木理器判別電路基板内之電路板是否補回電路基板内適 S位置之結果及該光學尺之量測數值。 ^注意者’由於本發明係運用該數位光學影像操取裝 擷取標準物件與比對物件之同一位置數位光 ί點因上t本發日柯於鮮物件飢對物件内可供辨識之i 取可供賴之數位絲影像，以進行標準物件與 比對物件内可供辨識的任意點其相似度之判別，另外，若 本發明用叫對之物件並非電路基板或電路_，如電路 13 1285736 板顯影所運用之W，仍可利本發狀該數位光輿 量測方法及其裝置運用一組標準物件之影像以驗：： 物件之差異程度，進而達到快速比對之目的。 對In addition, referring to FIG. 4, FIG. 4 is a perspective view of another preferred embodiment of the present invention. The present invention further provides a digital optical image measuring apparatus 100 using a standard circuit substrate in a standard position of a circuit board. The plurality of standard circuit boards are used to verify a plurality of comparison boards in the comparison circuit board, and thereby detecting whether the comparison circuit board inserted in the comparison circuit substrate is in a standard position of the circuit board The digital optical image measuring device 100 includes: two digital optical image capturing devices 120 for capturing digital optical images in a position on the circuit board of the circuit substrate, and The captured digital optical image is converted into image information of 12 1285736 bit form and transmitted (four) f image information, and the digital light image manipulation device 12 G can be under the shape - hidden lens, lens, Super CCD lens Or a VPS lens; and at least one processor (not shown) is electrically connected to the digital optical image capture 1 to receive the image information, and is in the same position The similarity between the image information is to detect whether the circuit board of the circuit board in the circuit substrate is within a certain range of the standard position of the circuit board, thereby generating the processor discriminating circuit board is ^_circuit base_suit# position The result. In addition, the digital optical image capturing device 1 can be combined with at least one stepping motor (not shown) and a device (not shown) for moving the digital optical image sensing device. 12Q, the operating device is used to control the image age action of the circuit board in the 12Q circuit substrate of the Wei position optical imaging device and the operation of the stepping motor. The digital optical image measuring device can further configure a plurality of optical scales (not shown) and = no devices (not shown), and the optical ruler uses (4) to accurately measure the digital image processing device. Position, and can be matched with the stepping motor and the fine-graining device to (4) accurately move the recording optical side picking device m: 'The display device is electrically connected to the processor for presenting the wooden device discriminating circuit Whether the circuit board in the substrate replenishes the result of the appropriate S position in the circuit substrate and the measured value of the optical scale. ^Attention' Because the present invention uses the digital optical image to capture the same position of the standard object and the comparison object, the digital light is identifiable due to the fact that it is identifiable in the object. The digital image of the wire can be used to determine the similarity between the standard object and any point that can be identified in the object. In addition, if the object of the invention is not a circuit substrate or a circuit, such as circuit 13, 1285736 The development of the board can still be used for the development of the digital diaphragm measurement method and its device using a set of standard object images to check: the degree of difference between the objects, and thus achieve the purpose of rapid comparison. Correct
綜上所述’由於本發明之數位光學影像量測方法及i 裝置係利用複數個數位光學影像擷取裝置以擷取比對^ 件之數位光學影像，且將所擷取之數位光學影像轉換為數 位形式之影像資訊，再由該處理器比對同一位置内各;影 像資訊間之差異程度，最後依其差異程度是否介於_預^ 範圍内以產生一判別結果，故於檢測流程中，僅須利用一 組標準物件之影像即能以此檢測多組比對物件，讓判別矣士 果能便捷且快速地呈現於使用者面前。而相較於先前之量 測方法或量測裝置運用量測距離之方式，若需利用數個參 考點以精確量測，則需經由數個參考點相互間繁瑣且多次 地交替量測，相較之下，本發明之數位光學影像量測方法 及其裝置所花費的時間及所須運用之人力均微乎其微。因 此，本發明之數位光學影像量測方法及其裝置可減少運用 數個參考點相互間交替量測之方式所造成的不便，確認比 對物件的精準程度，同時兼顧快速、方便與精準檢測，使 得產品檢測流程中的重要性得以完全發揮，因此本發明極 具進步性及符合申請【發明】專利之要件，爰依法提出申 讀，祈鈞局早日賜准專利，實感德便。 以上已將本章明做一詳細說明，惟以上所述者，僅爲 本發明之一較佳實施例而已，當不能限定本發明實施之範 園。即凡依本發明申請範圍所作之均等變化與修飾等，皆 應仍屬本發明之專利涵蓋範圍内。 14 1285736 【圖式簡單說明】 第1圖係為本發明一較佳實施例之架樽圖； 第2圖係為本發明一較佳實施例之流程圖； 第3a圖係為本發明一較佳實施例之示意圖一； 第3b圖係為本發明一較佳實施例之示意圖二； 第4圖係為本發明另一較佳實施例之立體圖。 【主要元件符號說明】In summary, the digital optical image measuring method and the i device of the present invention utilize a plurality of digital optical image capturing devices to capture digital optical images of the matching components, and convert the captured digital optical images. For digital image information, the processor compares the difference between the image information and the image information, and finally determines whether the difference is within the range of _ pre-^ to generate a discriminating result, so in the detection process It is only necessary to use an image of a standard object to detect multiple sets of comparison objects, so that the discriminating gentleman can be presented to the user conveniently and quickly. Compared with the previous measurement method or the measuring device using the measuring distance, if several reference points are needed for accurate measurement, it is necessary to measure the multiple reference points cumbersomely and repeatedly. In comparison, the time and labor required for the digital optical image measuring method and apparatus of the present invention are negligible. Therefore, the digital optical image measuring method and the device thereof of the invention can reduce the inconvenience caused by the method of alternately measuring the plurality of reference points with each other, and confirm the accuracy of the comparison object, and at the same time, consider fast, convenient and accurate detection. The importance of the product testing process can be fully exerted. Therefore, the present invention is highly progressive and conforms to the requirements of the patent for the application of the invention, and the application is made according to law, and the praying office grants the patent as soon as possible. The above description of the present invention has been described in detail, and the foregoing is merely a preferred embodiment of the present invention. That is, the equivalent changes and modifications made by the scope of the present application should remain within the scope of the patent of the present invention. 14 1285736 BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a preferred embodiment of the present invention; FIG. 2 is a flow chart of a preferred embodiment of the present invention; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 3b is a schematic view of a preferred embodiment of the present invention; FIG. 4 is a perspective view of another preferred embodiment of the present invention. [Main component symbol description]
10 數位光學影像量測裝置 12 數位光學影像擷取裝置 14 處理器 19 顯不裝置 20 標準電路基板 22 標準電路板 30 比對電路基板 32 比對電路板 100 數位光學影像量測裝置 120 數位光學影像擷取裝置 S10 用數位光學影像擷取裝置擷取標準組數位光 學影像 S12 將標準組數位光學影像轉換為標準組影像資 15 1285736 訊並傳送到處理器 S14 用數位光學影像擷取裝置擷取比對組數位光 學影像 S16 將比對組數位光學影像轉換為比對組影像資 訊並傳送到處理器 S18 由處理器產生標準組影像資訊與比對組影10 digital optical image measuring device 12 digital optical image capturing device 14 processor 19 display device 20 standard circuit substrate 22 standard circuit board 30 comparison circuit substrate 32 comparison circuit board 100 digital optical image measuring device 120 digital optical image The capturing device S10 uses the digital optical image capturing device to capture the standard group digital optical image S12. The standard group digital optical image is converted into the standard group image image 15 1285736 and transmitted to the processor S14. The digital optical image capturing device is used to capture the ratio. For the group digital optical image S16, the comparison group digital optical image is converted into the comparison group image information and transmitted to the processor S18. The standard group image information and the comparison group image are generated by the processor.
像資訊之相似度 S20 依相似度產生判別結果 S22 用顯示裝置呈現處理器產生之判別結果Similarity of information S20 According to the similarity, the discrimination result is generated. S22 The display device is used to present the discrimination result generated by the processor.
1616
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