1285445 九、發明說明： 【發明所屬之技術領域】 本發明係涉及發光源模組，尤其係指一種具有散熱裝置以同時 對發光源進行散熱之發光二極體模組。 $ 【先前技術】 發光一極體(LED，Light-emitting Diode)作為發光源由於具有古 效益的特性，而在汽車、交通信號燈指示、螢幕顯示，甚至照明等 領域得到廣泛應用。作為固體光源本身的-個特點，led發光源在 工作時也將發出熱量，而它所散發出的熱量能否及時導出或散發出 去，將成爲影響LED發光品質與壽命的關鍵因素，這是因為，隨著1285445 IX. Description of the Invention: [Technical Field] The present invention relates to a light source module, and more particularly to a light emitting diode module having a heat sink for simultaneously dissipating heat from a light source. $ [Prior Art] Light-emitting diodes (LEDs) are widely used in automotive, traffic signal indication, screen display, and even illumination because of their inherent benefits. As a feature of the solid light source itself, the LED light source will also emit heat during operation, and whether the heat emitted by it can be exported or dissipated in time will become a key factor affecting the LED light quality and life, because ,along with
_溫度的升高，LED的發光效益將顯著下降，嚴重影響其發光亮度及 縮短其使用壽命D 目前，業界已開始採用散熱裝置對LED進行辅助散熱，其中一 種方式係在LED之封裝過程中，即將散熱板或散熱塊等散熱裝置一 1 并封裝在内，但此種方式所能結合的散熱裝置往往體積較小，導致 散熱能力有限：聽種方式由於LED與散熱裝置储定結合在一_ The temperature rise, the luminous efficiency of LED will be significantly reduced, seriously affecting its luminous brightness and shorten its service life. D At present, the industry has begun to use the heat sink to assist the LED heat dissipation, one of which is in the LED packaging process. Heat sinks such as heat sinks or heat sinks are packaged in one, but the heat sinks that can be combined in this way tend to be small in size, resulting in limited heat dissipation: the mode of listening is due to the combination of LEDs and heat sinks.
_ 起，導致可互換性及朝錄差，不概節省魏，不便根據LED 所需散熱需求而選擇合適之散熱裝置。 為此，業界亦有採用將預先封裝好之LED再貼設於散熱裝置上 ，方法對LED進行散熱，如第—圖所示，預先封裝好之LED 1〇穿 ，通過電路板12上預設之穿孔m而直接貼設在金屬散熱板13上， 猎此將該等LED 10所產生之熱量即可藉由該金屬散熱板13而散發 出去ϋ，此種散熱方式較適合LED 1()之導電接腳14設於兩側 之凊形而針對led之另一種封裝模式即導電接腳設置在LED底部 之障形’如第二圖所示之直立式LED而言，則會出現輸人電源的導 電接腳與所需安裝的散熱裝置產生干涉的問題，而為將導電接腳與 散熱裝置的干涉處避開，通常需要犧牲大量之散熱面積，導致無法 6 1285445 . 兼顧考慮輸入電源及散熱效果。 【發明内容】 有鑑於此，在此實有必要提供一種具高散熱效率之發光二極體 模組，同時避免出現安裝干涉問題。 $發光二減歡包括-崎完紅發光二極體以及一散熱裝 置，該發光二極體具有正負極性之導電接腳，該等導電接腳係延伸 至該發光二極體的底部，該發光二極體其中_極性之導電接腳係結 合在該散熱裝置上，該散織置接設在-魏之其巾_個極性上。 • 上述發光二極體模組係利用散熱裝置來做為電源輸入的極性， 即不影響電源輸入，又可使散熱裝置完全貼於所需散熱的發光二極 體上，且散減置互換性強，討視情形而增大散熱面積，增加散 …熱效果，不須為將發光二極體之導電接腳與散練置的干涉處避開 -而犧牲大量散熱面積，更可將散熱片與發光二極體之間模組化，成 為隨插即用的裝置，同時兼具考慮散熱效果以及輸入電源的便利性。 【實施方式】 f二圖為直立式發光二極體之其中一？知雜結構，基本構成 為-發光二極體晶片(die)20、-封裝層22及兩支架24、25，該晶片 20放置在其中-支架25所形成的碗部空間内，其工作時產生的熱量 將藉由該等支架24、25而傳導出去。 第三圖至帛五圖齡為本發明發光二減漁之第―實施例， 包括一封裝完成之發光二極體3〇、一聚光片4〇、一散熱裝置5〇、一 外殼60及一電源線70。其中，該發光二極體3〇係為直立式結構， 沿其底部延伸具有複數導電接腳&，圖巾揭示為具有八個導電接腳 32 ,相應地該發光二極體30内封裝有七個發光二極體晶片（die)，以 增加整體發光亮度，其中-導電接腳34係當作公共電極並可通過該 電源線70以拉出的方式而接設在一外部電源(圖未示)之一個極性 上。該散熱裝置50係與發光二極體3〇之導電接腳32結合，包括複 7 1285445 數圓盤狀平行堆疊排列的散熱鰭片52， 30之導電接腳32相互結合的一士盖、口 <發光二極體 幻、、力合機構，此結合機構於太眚你作丨士 為-凸伸部54 ’该凸伸部54上設 、 藉此該發光二極體3G之導電接腳g制4如參第四圖）， 中並使發光二極❹人至該等孔洞- 而達成將該發光二極體30 ^至^錄°卩54之頂部表面接觸， 、、、口 〇至該散熱裝置5〇上， 32與孔洞542的大小可藉由精確設計而達成緊密結合 二極體30在工辦產生之熱量可藉由發光二極體3〇之二以=_, resulting in interchangeability and poor recording, not saving Wei, it is not convenient to choose the appropriate heat sink according to the heat demand of LED. To this end, the industry also uses the pre-packaged LEDs to be attached to the heat sink, in order to dissipate the LEDs. As shown in the figure, the pre-packaged LEDs are worn through the board 12 The hole m is directly attached to the metal heat sink 13 , and the heat generated by the LED 10 can be dissipated by the metal heat sink 13 , and the heat dissipation method is more suitable for the LED 1 () The conductive pin 14 is disposed on the sides of the two sides, and the other package mode for the LED, that is, the conductive pin is disposed at the bottom of the LED. As shown in the second figure, the input power is generated. The problem that the conductive pins interfere with the heat sink to be installed, and to avoid the interference between the conductive pins and the heat sink, usually requires a large amount of heat dissipation area to be sacrificed, resulting in failure of 6 1285445. Considering input power and heat dissipation effect. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a light-emitting diode module with high heat dissipation efficiency while avoiding installation interference problems. The illuminating dioxin comprises a singular red light emitting diode and a heat dissipating device, the illuminating diode having positive and negative conductive pins extending to the bottom of the illuminating diode, the illuminating In the diode, the conductive pin of the _ polarity is coupled to the heat sink, and the scatter is disposed on the _ polarity of the wei. • The above-mentioned LED module uses the heat sink as the polarity of the power input, that is, it does not affect the power input, and the heat sink can be completely attached to the light-emitting diode required for heat dissipation, and the interchangeability is reduced. Strong, depending on the situation, increase the heat dissipation area, increase the heat effect, do not need to avoid the interference between the conductive pins of the LED and the scattered position - and sacrifice a large amount of heat dissipation area, and the heat sink Modularized with the light-emitting diode, it becomes a plug-and-play device, and has the convenience of considering heat dissipation and input power. [Embodiment] F is a picture of one of the vertical light-emitting diodes? The structure is basically composed of a light-emitting diode die 20, an encapsulation layer 22, and two holders 24 and 25, and the wafer 20 is placed in a bowl space formed by the holder 25, which is generated during operation. The heat will be conducted out through the supports 24, 25. The third to fifth figures are the first embodiment of the invention, comprising a packaged light-emitting diode 3〇, a concentrating sheet 4〇, a heat sink 5〇, a casing 60 and A power cord 70. The light-emitting diode 3 is an upright structure, and has a plurality of conductive pins extending along the bottom thereof. The towel is disclosed as having eight conductive pins 32. Accordingly, the light-emitting diodes 30 are packaged therein. Seven light-emitting diode chips to increase the overall light-emitting brightness, wherein the conductive pin 34 is used as a common electrode and can be connected to an external power source through the power line 70 (Fig. Show one of the polarities. The heat dissipating device 50 is combined with the conductive pins 32 of the LEDs 3, and includes a plurality of heat-dissipating fins 52 arranged in parallel in a disk shape, and the conductive pins 32 of the 30 are combined with each other. <Light-emitting diode phantom, force-combining mechanism, this bonding mechanism is provided in the 丨 眚 凸 凸 凸 凸 凸 凸 ' ' ' ' ' ' ' ' ' ' ' ' ' ' 导电 导电 导电 导电 导电 导电 导电 导电 导电 导电 导电 导电 导电 导电 导电 导电 导电g system 4, as shown in the fourth figure), and the light-emitting diodes are smashed to the holes - and the top surface of the light-emitting diodes 30 ^ to ^ 卩 54 is contacted, and, The size of the heat sink 5, 32 and the hole 542 can be achieved by precise design to achieve a close combination of the diode 30. The heat generated in the work can be achieved by the light emitting diode 3
該底部延伸轉電接腳32而直接傳遞錢散絲置π冰乘2 分地散發出去，同時該散教f i % t 戚熟衮置50亦作為該發光二極體30之另一 極性輸入而接設在該外部電源的另一極性上。 =殼60係設置在該散熱裝置料圍，可將散熱裝置％與發 $-極體30起蚊與倾的_，此外殼6()並可做她裝電源極 性及分離電雜狀_，域毅體實賴減結做計。在實 =’該散«置5㈣絲可設置—凹孔56，而料殼⑹上對應 以凹孔56位置延伸設置—導電桿62，其可伸人至該凹孔兄内並盘 該散熱裝置50 _，藉此，料部魏之正貞極侧可分難 «源^70及該導電桿62接設，而實現對該發光二極體3〇供電。 第，、圖及第七圖揭示為本發明發光二極體模組之第二實施例， 其與上述第—實施例之區別在於所設之散熱裝置50a之底部裝設有 -導電結構80，此導電結構8〇之底緣亦延伸設置一導電桿82，該 導電桿82穿過外殼咖后即可與上述外部電源之其巾一極性接設， 藉此:本實施例所設置之此導電結構8〇可供模組化時的極性使用。 第八圖至第十圖揭示為本發明發光二極體模組之第三實施例， 在i實知例中，該發光二極體3此之底部延伸有導電接腳％、34。 該實施例所設之散熱裝置5〇b對發光二極體3〇b進行散熱並同時亦 2一極性輪人’包括複數輻射排列之散熱則52b ’且沿頂部至底 P貝穿開-又有-溝槽58 ’以供電源線7〇b穿設並與發光二極體幾 8 1285445 的其中一導電接腳34接設，該散熱裝置50b之頂部設置一具有凹陷 部54b的結合機構，且於該凹陷部54b所在的位置上設置一孔洞 • 542b，當該發光二極體30b結合至該散熱裝置5〇b上時，其另一導 電接腳32則可伸入至該孔洞542b中而與該散熱裝置5〇b電性接通。 該實施例所設外殼60b之底部亦設置有一導電桿62b，其可伸入對應 «又於《亥政熱裝置5〇b底部之凹孔56中。藉此，外部電源之正負極性 則可分別與該電源線7〇b及該外殼60b之導電桿62b接設，而實現 對該發光一極體30b供電，且同時該散熱裝置5〇b對發光二極體 φ 在工作時產生的熱量進行散發。 本發明之上述實施例中，散熱裝置5〇、5〇a、5〇b與發光二極體 30、30b的結合方式靈活，可互換性大大增強，可根據不同使用場合 ，方便地為發光二極體3〇、3〇b配備不同型式之散熱裝置；且散熱裝 置5〇、5以、501)在散發發光二極體30、301)熱量之同時，亦作為外 部輸入電源之其中-極性而對發光二極體3〇、通供電，有效解決 發光二極體3(3、3()b用於輸入電源的導電接腳32、34與所需安裝的 散熱裝置產生干涉_題，達職顧考慮輸人魏及散熱效果/ 上綜上所述，本發明確已符合發明專利之要件，遂依法提出專利 • 申請。惟，以上所述者僅為本發明之較佳實施例，自不能以此限制 本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之 所作之等效修飾或變化，皆應涵蓋於以下中請專利範圍内。 【圖式簡單說明】 第一圖係發光二極體之其中-習知散熱結構示意圖。 第二圖係直立式發光二極體之其中一習知封裝結構示意圖。 ^圖係本發明發光二極體模組第—實施例之立體分解示意圖。 =四圖係第三圖所示發光二極體模组之另__視角之分解示意圖。 第五圖係第三圖之立體組裝圖。 第六圖係本發明發光二極體模組第二實施例之立體分解示意圖。 9 1285445 第七圖係第六圖之立體組裝圖。 第八圖係本發明發光二極體模組第三實施例之立體分解示意圖。 第九圖係第八圖之另一視圖。 第十圖係第八圖之立體組裝圖。 【主要元件符號說明】 發光二極體 30、30b 聚光片 40 散熱鰭片 52、52b 凹陷部 54b 凹孔 56 外殼 60、60a、60b 電源線 70、70b 導電接腳 32、34 散熱裝置 50、50a、50b 凸伸部 54 孔洞 542、542b 溝槽 58 導電桿 62、82、62b 導電結構 80The bottom extends the electric pin 32 and directly transfers the money to the π ice by 2 points, and the distracting device 50 also serves as the other polarity input of the LED 30. Connected to the other polarity of the external power supply. = The shell 60 is placed in the heat sink, and the heat sink can be used to raise the mosquito and tilt of the $-pole body 30. The shell 6 () can be used to install the power polarity and separate the electrical impurities _, The domain is determined by the reduction. In the actual = 'the scattered « set 5 (four) wire can be provided - a recess 56, and the shell (6) correspondingly extends from the position of the recess 56 - a conductive rod 62, which can extend into the recessed hole and the heat sink 50 _, by this, the material part Wei Zhizheng can be divided into the hard side «source ^ 70 and the conductive rod 62 connected to achieve power supply to the light-emitting diode 3 。. The second embodiment of the light emitting diode module of the present invention is different from the above-mentioned first embodiment in that the bottom of the heat dissipating device 50a is provided with a conductive structure 80. A conductive rod 82 is further disposed on the bottom edge of the conductive structure. The conductive rod 82 is connected to the outer power source of the external power source through the outer casing, thereby: the conductive layer disposed in the embodiment. Structure 8〇 can be used for polarity when modularizing. 8 to 10 are a third embodiment of the LED module of the present invention. In the embodiment of the present invention, the bottom of the LED 3 has conductive pins %, 34 extending from the bottom. The heat dissipating device 5〇b provided in this embodiment dissipates the light emitting diodes 3〇b and at the same time also has a heat radiating 52b′ of the plurality of radiating arrays and passes through the top to the bottom P. The groove-shaped portion 58' is disposed for the power supply line 7〇b and is connected to one of the conductive pins 34 of the light-emitting diodes 8 and 1285445. The top of the heat-dissipating device 50b is provided with a coupling mechanism having a recessed portion 54b. And a hole 542b is disposed at a position where the recessed portion 54b is located. When the light emitting diode 30b is coupled to the heat sink 5b, the other conductive pin 32 can extend into the hole 542b. And electrically connected to the heat sink 5b. The bottom of the outer casing 60b of this embodiment is also provided with a conductive rod 62b which can be inserted into the corresponding recessed hole 56 in the bottom of the 5th b. Thereby, the positive and negative polarities of the external power source can be respectively connected to the power line 7〇b and the conductive rod 62b of the outer casing 60b, thereby realizing power supply to the light-emitting body 30b, and at the same time, the heat-dissipating device 5〇b is illuminated. The heat generated by the diode φ during operation is dissipated. In the above embodiment of the present invention, the heat-dissipating devices 5〇, 5〇a, 5〇b and the light-emitting diodes 30, 30b are combined in a flexible manner, and the interchangeability is greatly enhanced, and can be conveniently illuminated according to different use occasions. The pole body 3〇, 3〇b are equipped with different types of heat sinks; and the heat sinks 5〇, 5, 501) radiate the heat of the light emitting diodes 30, 301), and also serve as the external polarity of the input power source. The light-emitting diode 3 〇, power supply, effectively solve the interference of the light-emitting diode 3 (3, 3 () b for the input power supply of the conductive pins 32, 34 and the required installation of the heat sink _ questions, the job Considering the input and the heat dissipation effect / the above, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above is only a preferred embodiment of the present invention, This is to limit the scope of the patent application in this case. Any equivalent modifications or changes made by the person skilled in the art to the present invention should be included in the scope of the following patents. [Simplified illustration] The first picture is luminous Among the diodes - the known heat dissipation The second figure is a schematic diagram of one of the conventional package structures of the vertical light-emitting diode. The figure is a three-dimensional exploded view of the first embodiment of the light-emitting diode module of the present invention. FIG. 5 is an exploded perspective view of the third embodiment of the light-emitting diode module. The sixth figure is a perspective exploded view of the second embodiment of the light-emitting diode module of the present invention. 1285445 The seventh figure is a three-dimensional assembly diagram of the sixth figure. The eighth figure is a perspective exploded view of the third embodiment of the light-emitting diode module of the present invention. The ninth figure is another view of the eighth figure. The three-dimensional assembly diagram of the eighth figure. [Description of main components] Light-emitting diodes 30, 30b Condenser 40 Heat-dissipating fins 52, 52b Recessed portion 54b Recessed hole 56 Housing 60, 60a, 60b Power supply lines 70, 70b Conductive connection Feet 32, 34 heat sink 50, 50a, 50b protrusion 54 hole 542, 542b groove 58 conductive rod 62, 82, 62b conductive structure 80