TWI285082B - Heat conduction method for electronic elements - Google Patents

Abstract

The present invention relates to a heat conduction method for electronic elements, and in particular to a method in which a surface of a high conducting metal material that has been treated with cleaning previously is treated with electrolytic oxidation to form an insulation dielectric layer featuring both high temperature resistance and high voltage resistance. Then, a layer of conducting metal film or several conducting metal films required are formed made on a specific area on the insulation dielectric layer so as to tightly bond the high conducting metal material, the insulation layer and the conducting metal film t together. Electronic elements are set on the high conducting metal material. Thus, heat generated after the electronic elements are energized can be quickly transferred to the high conducting metal material to achieve the heat conducting method for the electronic elements with excellent heat exchange effect.

Description

1285082 IX. Description of the invention: [Technical field to which the invention belongs]

The invention relates to a method for heat conduction of an electronic component, in particular to an insulating dielectric layer which is formed by electrolytic oxidation treatment on the surface of the highly conductive metal material which has been cleaned and treated, and which has high temperature resistance and high voltage resistance. A specific position on the insulating dielectric layer is made as a conductive conductive gold-made conductive metal in a specific position on the insulating dielectric layer. When the vehicle is driven, a conductive metal film line can be disposed thereon, and the electronic component can be electrically conductive to generate heat. A method of transferring heat to electronic components of the high-transmission metal material to achieve an excellent heat exchange effect. [Prior Art] ^: 'The method of making the surface insulating layer of metal materials used for heat dissipation of electronic components is mainly to make the stone powder, the resin and the molten ship to adjust and form each other - the insulating coating, and the insulating coating will be sprayed. Ploughing, directly suppressing the surface of the metal material that has been cleaned and dried, and then baking at a high temperature to form a „insulating layer, and then making a conductive layer thereon, when the components attached to the conductive layer The heat energy generated by the surface of the guide and the surface is transmitted to the gold miscellaneous materials. The know-how is _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The printing process can not be achieved with the metal 枓 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Technical problem&gt; In view of the poor thermal conductivity of the above-mentioned insulating film technology and the lack of improvement, it is hoped to provide a breakthrough design to enhance the efficiency of practical use. It is a research and design system, and has been engaged in related product design for many years. The professional technical knowledge and practical experience of production and sales and the results of research and design, finally researched a method of heat conduction of electronic components of the present invention to provide users. j <Technical means to solve the problem> In order to achieve the aforementioned purpose, The invention is processed by electrolytic oxidation on a highly conductive metal material to produce an oxidized insulating surface layer, which is resistant to high temperature and high voltage, forms a state of close contact with a highly conductive metal surface, and then forms a layer on the insulating layer. The conductive gold system makes the high-conducting gold-hui material, the bar, the water layer and the electric metal film tightly combined. When the high-conducting metal material is attached with electrons, the 7G material can provide a high-quality metal. The material has excellent heat exchange effect. _&lt;Effects on the prior art> The present invention has the following advantages: (1) Oxide insulating layer and high The golden lung system is in a zero-closed state, and the absence of _ does not produce heat conduction barriers, and the heat conduction efficiency is higher. The working heat generated by the electronic 7G pieces is uniformly and completely transmitted to the high-conductivity metal. (3) Oxidation &amp; thickness of the edge layer (4), the transduction efficiency is higher. (4) The sulfur insulation layer can withstand the entanglement and temperature. 1285082 (5) It can be processed with the surface of the object. [Embodiment] Please refer to the first figure and As shown in the second figure, it is a real drama when the present invention is applied to a Le 〇 lighting device, and the present invention screams that the heat transfer is faster than the fast-moving high-metal material (A) for electrolytic oxidation treatment. The surface of the highly conductive metal material (A) forms an oxidized insulating dielectric layer (8) having a high temperature resistance and a high voltage resistance, and is further formed at a specific position on the oxidized insulating dielectric layer (B). One layer of the conductive material used for energization is all 臈 (6), and the connectable wire (iii) is energized to one or more electronic components (A work) disposed on the high-conductivity metal chair material (A), when the electronic component (a work) can quickly pass when heat is generated after conduction To the highly conductive metal material (A), and the electronic component (generated by the A U __, _ and the age of the person is difficult, before __⑹ can be formed by electroplating. Step by step in == general surface high material metal _ (a) face cleaning oxygen (four) ΓΓ (4)% butterfly coffee · plum, its production ( 7 ) ^ ( 8 } ^ (^ ( 6 &gt; (B), then proceed to the first Secondary chemical surface grinding is a process of insulating dielectric layer and dry supply (12), and if (1) and third water washing (11), it is necessary to form the conductive metal layer by oxidizing insulating medium. In the case of the membrane (C), the electro-hydraulic (1 3 ), the electro-mineral conductive crucible (work 4), and the conductive metal material (A) are immersed to form a conductive metallographic phase (C), by which the method is high (1 6) The shape of the form of the metal material (4) forms an oxygen 1280082 insulation _ (8), said high temperature and resistance to hiding, Ke directly in the oxidized dielectric layer (8) ± her machine - series coffee (c) or according to Need to record the conductive surface _ (ci), the material produces scales, the thermal temperature generated by the electronic component (A 1) is directly and quickly transmitted to the high-conductivity metal material (a) and the heat is quickly taken away, « The Wei Jinjia (c) shot-bonding method is applied to the oxidized insulating medium layer (B) on the surface of the highly conductive metal material (A) (as shown in FIG. 5), or is bent to be a 匸-type conductive metal ( C 3) straight The buckle is set on the high-conductivity metal material (A), and the positioning hook (c 4 ) provided by the type-type conductive metal (C 3 ) is buckled on the positioning concave hole of the high-conductivity metal material (4) to reach the positioner (such as _ As shown, the Weijinjia (C) can also be applied by coating or printing on the surface of the high-material metal material (A). Please refer to the seventh figure, which is the application of the present invention. In the case of c (integrated circuit), the hybrid high-metal machine (A) forms an oxidized insulating dielectric layer (3) on the surface of the two conductive metal materials (A) by the aforementioned method of financing to 'will The internal electronic component (D) is directly disposed on the high metal (A) or in the recess (A 3 ) preset thereon, and then encapsulated by an encapsulant, and then the insulating dielectric layer (B) ), the power-on money and the electronic component (8) inside the IC (8), the conductive wire film (c 1), and the conduction point (D丄) of the electronic component (9) inside the IC The conductive metal wire film (C1) can be connected to the pin (c2) provided around the high-conductivity metal material (A), and the electronic component of the C-key can be used. D) The instantaneous energy charm clever temperature between a high conductive metal conductive material (A) will be taken away by the temperature of the working temperature substantially lower the Ic

The descender. X 1285082 is not the above-mentioned method of electrolyzing gentleman, 1 ^ edge medium a ... method of making high-conductivity metal surface gas i, can improve the efficiency of heat transfer, for - is a new head Innovative and invented inventions, fp is the human eight κ, the industry should be the patent of the patent, and the six patents are filed according to law, and the reviewer can review the case and give the honey as soon as possible. Mussels - the patents granted in this case on the dry day are actually German. [Simplified illustration]

BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a cross-sectional view of a preferred embodiment of the method of the present invention when it is applied to an L-shaped device. The second drawing is a test of the method of the present invention. The third embodiment of the method of the present invention is an electrolytic oxygen meter of the method of the present invention. And the process of reading the conductive metal wire film. The fourth picture of the county's financial method will be high-transmission area oxidation insulation as light _= she is the same as the 嶋 嶋 ^ ^ ^ ^ ^ 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二Material gold 4# material on the material. /Tt丄 < The sister-in-law, the conductive gold shown in the second figure of the figure is a large amount of coins, and the other is the three-dimensional division of the type of the conductive metal directly buckled on the genus (four). - Figure 0 The younger brother of the 7th 7th method of the financial method of Yunlin τ ^ body circuit stereo decomposition [main component symbol description] (Α) high-conductivity metal material (Α 2) positioning concave hole (Α 1) electronic components / ρ X ^ (Α 3) Oxidized insulating dielectric layer in the depressed portion

1285082 (c) Conductive metal film (C 2) pin (C 4) positioning hook (D) Electronic components inside the IC (1) Degreasing treatment (2) Chemical surface grinding treatment (3) Water washing (4) Neutralization treatment (5) Electrolytic oxidation treatment (6) Second water washing (7) Sealing treatment (8) Hot water immersion (9) Surface hardening (10) Second chemical surface grinding treatment (11) Third water washing (1 2) drying (13) Soaking conductive liquid (14) Electroplating conductive film (15) Washing (1 6) Drying (C1) Conductive metal wire film (C 3) Conductive metal (D1) Conducting point (111) Conductor 10

Claims (1)

1285082 X. Patent application scope: 1. A method for heat conduction of electronic components, the method is as follows: The main method is to use the high-conductivity gold-strength material with fast heat conduction efficiency as the heat dissipation base of the electronic component to perform electro-learning, and secret The surface of the high-conductivity metal (4)-oxidized insulating dielectric layer, the oxidized insulating dielectric layer has the characteristics of high temperature resistance and high voltage resistance, and then a layer is made as a power source at a specific position on the yttrium oxide dielectric layer. The conductive metal film, the connection between the wire and the wire is electrically connected to one or more electronic components provided on the high-conductivity metal material. By the above method, when the electronic component generates heat after being electrically conductive, it can be quickly It is transmitted to the highly conductive metal material, and the heat energy generated by the electronic component is quickly taken away, and the heat exchange target is excellent. 2. According to the method of heat conduction of electronic components according to Item 1 of the patent application scope, the process for preparing the oxidized barrier layer comprises the following steps: (a) degreasing the highly conductive metal material first; (b) performing chemical surface grinding again. (c) water washing; (d) neutralization treatment; (e) electrolytic oxidation treatment; (Ο second water washing; (g) sealing treatment; (h) hot water immersion; (i) surface hardening to form an oxidized insulation (j) performing a second chemical surface grinding treatment; 1285082 (k) third water washing, (1) drying. 3. The method of thermally conducting electronic components according to claim 1, wherein the conductive metal film If it is formed by electroplating, the high-conductivity metal material which completes the oxidized insulating medium layer needs to be immersed in the conductive liquid, electroplated conductive film, washed and dried to form a conductive metal film. 4. According to the first item of the patent application scope The method for thermally conducting electronic components, wherein the conductive metal film can be formed as needed to form a plurality of conductive metal wires in a conductive line shape. I 5. According to the first item of the patent application scope The method of thermally conducting a component, wherein the conductive metal film is adhered to the oxidized insulating dielectric layer on the surface of the high-conductivity metal material. 6. The method for thermally conducting the electronic component according to claim 1 of the patent application scope, wherein The bent conductive metal is directly buckled on the high-conductivity metal material, and the positioning fishing clip set by the 导电-shaped conductive metal is positioned in the positioning concave hole of the local conductive metal material to reach the locator. The method of thermally conducting an electronic component according to the above aspect, wherein the conductive metal film is also coated or printed on the surface of the high-conductivity metal material. For the surface of highly conductive metal materials, partially or fully oxidized dielectric layers can be fabricated as required.