1283787 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種在陣列基板上直接安裝驅動器 IC(integrated circuits ·•積體電路）的液晶顯示裝置。 【先前技術】 習知之液晶顯示裝置，係使陣列基板與彩色濾光片基板 相對，並藉由使填充於該等基板間之液晶動作，即可進行 顯示。將陣列基板與彩色濾光片基板相對，且於基板間填 充液晶者稱為液晶早7G。 陣列基板，係縱橫配置複數條信號線及複數條閘極線， 並於其交叉部設有被稱為TFT(thin film transistor :薄膜電 晶體）的開關元件。TFT之閘極係連接在閘極線上，而源極 係連接在信號線上。在TFT之汲極上連接有像素電極，當對 像素電極施加電壓時，就會在該像素電極與設於彩色濾光 片基板上的共通電極上產生電場，並使液晶動作。換言之， 閘極線上會施加閘極電壓，而使TFT呈導通，此時當對信號 線施加信號電壓時像素電極上就會施加電壓，而使液晶動 作。 為了施加閘極電壓或信號電壓，而在液晶單元上安裝驅 動器1C，且從驅動器1C對閘極線或信號線施加所期望之電 壓。對液晶單元進行驅動器1C之安裝，係使用習知之 TAB (tape automated bonding :捲帶式自動搭接）或 COF (chip on flexible printed circuit ··可撓性電路板上之晶片）的安裝 方式、或在被稱為 FPC(flexible printed circuit board:可撓 92296TW-無劃線 1283787 性電路板）之可撓性印刷電路板上搭載驅動器ic的技術來 進行。 在將陣列基板形成橫長之長方形的情況，驅動器1C之安 裝，由於在陣列基板之橫側介以TAB/COF來進行，而在縱 側介以TAB或FPC來進行，所以要使用多數個TAB/COF。因 此，為了沒必要使用TAB/COF，以減低對該等之成本，而 有一種將取代TAB/COF或FPC之匯流排配線直接配線於陣 列基板上的技術。在圖8所不之液晶早元51的陣列基板52 中，係於未與彩色濾光片基板54相對的部位之驅動器搭載 部58上拉出匯流排配線。然後，利用被稱為COG(chip on glass:晶片在玻璃上）之安裝方法，在陣列基板52上直接安 裝驅動器IC56。 為了對陣列基板52上之驅動器IC56進行供電，如圖9所 示，有時以匯流排配線60來連接複數個驅動器IC56，而從 一部位對全部的驅動器1C進行供電。該情況，係在晶片56 内部與晶片56下方設置貫穿配線61以進行配線。此對於當 驅動器搭載部58太窄，且在每一驅動器IC56上拉不出供電 用之匯流排配線60的情況很有效。由於不加寬驅動器搭載 部58之面積，所以液晶單元51不會變大。例如，驅動器搭 載部58之寬度約為2 mm，配線60、61之寬度約為200 μιη。 隨著液晶顯示裝置50之大型化及高精細化，已增加流入 液晶顯示裝置50之全體的總電流量。例如，XGA(extended graphics array :擴展圖形陣列）之液晶顯示裝置50係有3072 條之信號線，即使每1條流入1mA之電流，總電流量亦會變 92296TW-無劃線 1283787 成約3A。因而，由於流至配線60、61之電流的值亦變高， 所以有必要加寬配線60、61之截面積。由於可在陣列基板 52之製造步驟中形成的配線60、61之膜厚非常薄至約 2000〜3000A，所以有必要加寬該配線60、61部分之寬度。 但是，隨著液晶顯示裝置50之窄框化的進展，驅動器搭載 部58之寬度未被加寬之中該種情況亦會造成問題。又，為 了減少該配線60、61之數目，如圖9所示，串聯設置配線6〇、 61。結果，由於對配線60、61流入大電流，所以會對驅動 器IC56及配線60、61之接合部帶來大負擔，有時亦會發生 配線60、61被溶斷的情況。 【發明内容】 (發明所欲解決之問題） 本發明之目的係在於提供一種對應液晶單元之窄框化， 而減低因流至配線之大電流對驅動器1C與配線之連接部之 負擔的液晶顯示裝置。 (解決問題之手段） 本發明之液晶顯示裝置的要旨，係包含有··陣列基板， 其於縱橫形成複數條電極線；彩色濾光片基板，其使上述 陣列基板之周緣部的電極線露出，以一定間隔與該陣列基 板相對；絕緣層，其形成於上述陣列基板之非顯示區，且 形成於與上述彩色濾光片基板相對的位置上用以覆蓋上述 電極線；供電配線，其形成於上述絕緣層上；驅動器1C， 其配置於未與上述陣列基板之上述彩色濾光片基板相對的 位置上，而與上述電極線連接；以及引出配線，用以連接 92296TW-無劃線 1283787 上述供電配線與驅動器ic。由於在上述之非顯示區形成絕 緣層，並於其上形成供電配線，所以供電配線之配線寬度， 變得比習知供電配線寬。因而，在對驅動器1C流出高電流 時，就少有供電配線被熔斷之虞。 上述絕緣膜為樹脂（聚合物）。由該樹脂所構成的絕緣 層，係利用塗敷液體之樹脂並使之硬化的方法、以黏著劑 或熱壓接來黏接薄膜狀之樹脂的方法所形成，可簡單地形 成樹脂之層。 上述供電配線與引出配線係分別有複數條，在該供電配 線上設置絕緣膜，而該供電配線與引出配線係介以該絕緣 膜而交叉。供電配線之條數雖可由驅動器1C之端子數而決 定，但是當供電配線變成複數條時引出線之條數就會變成 複數條。因而，使之介以絕緣膜而立體交叉。 上述供電配線與引出配線係分別有複數條，在該供電配 線與引出配線以非接觸方式交叉的部位上將該供電配線分 割成二條，而在上述絕緣層下設置用以連接被分割成二條 之供電配線的旁通線。除了在供電配線上設置絕緣膜，亦 可利用絕緣層，來實現供電配線與引出配線之立體交叉。 【實施方式】 使用圖式說明本發明之液晶顯示裝置的實施形態。本發 明之液晶顯示裝置10 ,係在圖1(a)、（b)所示之液晶單元11 的陣列基板12之非顯示區20上設置絕緣層22 ,於該絕緣層 22上形成供電配線24 ’利用自該供電配線24分歧之引出配 線26，對驅動器1C 16進行供電。另外，在圖1(b)中，省略陣 92296TW-無劃線 1283787 列基板12上之閘極線等。如圖2所示，在與驅動器ici6之端 子（凸塊）30b連接的閘極線28等上施加所期望之信號電壓， 俾使液晶顯示裝置10動作。 詳言之，如圖1(a)、（b)及圖3(a)、（b)所示，液晶顯示裝 置10，係包含有陣列基板12 ;以一定間隔與陣列基板12相 對的彩色渡光片基板14 ;在陣列基板12中，與彩色渡光片 基板14相對’且形成於非顯示區20上的絕緣層22 ;形成於 絕緣層22上的供電配線24 ;在陣列基板12中，配置於未與 彩色濾光片基板14相對之區域之驅動器搭載部18上的驅動 器1C 16;以及連接供電配線24與驅動器1C 16的引出配線26。 另外，在圖3(a)、（b)中，雖然供電配線24之條數不同， 但疋此係依液晶顯示裝置1〇之製品而異所致，供電配線24 之條數為任意。又，在圖3(b)中，設有轉移器33 ,該轉移器 3 3係對彩色渡光片基板14供給共通電位。 陣列基板12 ,係在玻璃基板之表面於縱橫形成有信號線 或閘極線等的電極線，且於周緣部拉出該等的電極線。於 信號線與閘極線之交又部設有TFT。於TFT之閘極連接有閘 極線，於TFT之源極連接有信號線。於TFT之汲極連接有像 素電極。在陣列基板12與彩色濾光片基板14之間密封液 晶，藉由對像素電極施加電壓俾使液晶動作。藉由使液晶 動作，而進行液晶顯示裝置1〇之顯示。另外，顯示區19， 係密封有液晶之區域，而非顯示區2〇係在構成作為液晶顯 示裝置10時，隱藏於支持液晶單元丨丨之框體内的區域。一 般而言雖然驅動器搭栽部18亦為非顯示區，但是在本說明 92296TW-無劃線 •10- 1283787 書中’係將陣列基板12與彩色濾光片基板14所相對的部位 之周緣部稱為非顯示區。又，液晶係可依密封32而不會從 液晶单元11茂漏。 如圖2所示，從驅動器IC16對閘極線28或信號線施加所期 望之電壓。陣列基板12與彩色濾光片基板14之大小有差 異。當陣列基板12與彩色濾光片基板14相對時，會使由陣 列基板12之周緣部拉出的閘極線28或信號線之一部分露 出。驅動器IC16，係在陣列基板12上，安裝於未與彩色濾 光片基板14相對之區域的驅動器搭載部18上。亦即，驅動 器IC16係直接安裝在陣列基板12上。 絕緣層22，係在陣列基板12中，層疊於陣列基板12與彩 色濾光片基板14相對，且未密封液晶之非顯示區2〇上。該 絕緣層22，係由感光性或非感光性之有機樹脂絕緣膜所形 成。絕緣層22,係利用塗敷液狀之樹脂（聚合物）並使之硬化 的方法、或以黏著劑或熱壓接而黏接薄膜狀之樹脂的方法 所形成。該絕緣層22，係在非顯示區20中，與後述之鈍化 層當作絕緣物，用以覆蓋閘極線28或信號線。作為其一例， 可列舉在絕緣層22上使用感光性之丙烯酸系樹脂，於塗敷 後，在曝光/顯像中設置特定之接觸孔後予以燒成並使之硬 化的方法。 另外，藉由將形成絕緣層22之樹脂亦設於陣列基板12之 顯示區19上，即可使信號線與像素電極重疊，且可使液晶 顯示裝置10之開口率提升。又，絕緣層22，係層疊於用以 保護在構成陣列基板12之玻璃基板上所形成之閘極線28或 92296TW-無割線 1283787 k號線的鈍化層(未圖示）上。鈍化層係由氧化膜或氮化膜等 之絕緣體所構成。 對驅動器1C 16之供電，係在絕緣層22上形成供電配線 24，且藉由從供電配線24至驅動器1(：16形成引出配線26來 進行。在引出配線26之一端連接有驅動器IC16之端子（凸 塊）30a，而另一端連接在供電配線24上。 供電配線24或引出配線26，係藉由使用週知之光微影、 真空蒸鍍、電鍍等之手法，形成銀、銅、或金等的材料而 設在絕緣層22上。 一般而言驅動器1C 16之端子30a有複數個。供電配線24及 弓丨出配線26之數目亦成為複數條。因而，如圖1(b)或圖4所 示，使供電配線24與引出配線26介以絕緣膜34而立體交 又。如圖5所示，絕緣膜34，係形成於進行立體交叉之部位 的供電配線24上。 本發明利用從未使用之技術，係陣列基板12與彩色濾光 片基板14相對後在非顯示區20上形成供電配線24。因而， 可形成寬度比習知寬的供電配線24，且供電配線24之電阻 會變小，可流出高電流至供電配線24及引出配線26。其一 例中，供電配線24之寬度約為300 μηχ，供電配線24之間隔 約為100 μιη，引出配線26之寬度約為50 μπι，引出配線26 之間隔約為50 μπι。該情況，即使流出約3Α之電流，亦可 承受不會使供電配線24或引出配線26被熔斷。 以上，雖係就本發明之實施形態加以說明，但是本發明 並非被限定於上述實施形態。如圖4或圖5所示，雖係設置 92296TW·無割線 .12- 1283787 絕緣膜34並於其上形成引出配線26，但是亦可利用其他方 法使供電配線24與引出配線26立體交叉。例如，如圖6所 示，供電配線24與引出配線26係形成於相同的絕緣層22 上。在進行立體交又的位置上供電配線24係分割成二條， 而被分割的供電配線24係由旁通線40所連接。旁通線40， 係形成於用以保護閘極線28等的鈍化層上。換言之，旁通 線40係形成於絕緣層22之下面。供電配線24與旁通線40之 連接’係猎由在絕緣層22上設置接觸孔42，而於該接觸孔 42内埋設導體所進行。 如圖7所示’亦可為了保護供電配線24或引出配線26而形 成鈍化層38。鈍化層38係由氧化膜或氮化膜所形成。鈍化 層38，係在陣列基板中，形成於連接驅動器IC16之端子 30的區域以外。鈍化層38，係以週知之光微影、分配法、 或光學步驟形成聚醯亞胺等之有機物，或以在光蝕刻步驟 中賤鍵或遮罩濺鍍等之方法，形成以濺鍍或C VD(chemical vapor deposition :化學氣相沉積）法所成膜的氮化矽膜〇 圖3(a)、（b)中雖係在由聚合物所形成之絕緣層22上設置 供電配線24 ’但是亦可在保護閘極線28之絕緣層的鈍化層 (未圖示）之上形成供電配線24。如圖4或圖5所示，在供電配 線24與引出配線26交又的部位上，設置絕緣膜34。 如圖1所示，陣列基板12係長方形，於其兩邊設有驅動器 搭載部18。一般而言，雖於非顯示區2〇之内，與驅動器搭 載部18鄰接的非顯示區2〇形成有供電配線24，但是亦可按 照需要在未與驅動器搭載部18鄰接的非顯示區2〇上形成供 92296TW·無刻線 -13· 1283787 電配線24 〇 以上，雖係就本發明之實施形態加以說明但是本發明並 未被限定於上述實施形態。其他，本發明亦可在未脫離其 主旨之範圍内根據熟習該項技術者之知識而以施加各種之 改良、修正、變更的態樣來實施。 (發明效果） 本發明係藉由對先前技術中未施予配線之部位進行供電 配線，即可進行配線寬度寬、且低電阻之配線。在對骚動 器1C進行供電時，由於供電配線之配線寬度寬，所以少有 供電配線因高電流而被熔斷之虞。又，由於對先前技術中 未形成供電配線之區域進行配線，所以可有效利用陣列基 板之空間，而可對應所謂液晶顯示裝置之窄框化。 【圖式簡單說明】 圖1係顯示本發明之液晶顯示裝置的示意圖，其中圖1(a) 為上視圖，圖1(b)為放大陣列基板之主要部分的示意圖。 圖2係顯示對驅動器1C之供電配線及閘極線之連接的示 意圖。 圖3係圖1(b)之Χ-Χ’的剖面圖，其中圖3(a)為供電配線有8 條之剖面圖，圖3(b)為設有轉移器之位置的剖面圖。 圖4係顯示引出配線設於供電配線上之絕緣膜上之位置 的圖1(b)之Υ-Υ’的剖面圖。 圖5係顯示設於供電配線上之絕緣膜的示意圖。 圖6係設置旁通線並使供電配線與引出配線立體交叉的 示意圖。 92296TW-無劃線 14 1283787 圖7係在供電配線上設置鈍化膜的示意圖。 圖8係在驅動器搭載部安裝驅動器1C之液晶顯示裝置的 示意圖。 圖9係串聯連接驅動器1C的示意圖。 【主要元件符號說明】 10、50 液晶顯不裝置 11、51 液晶早元 12 > 52 陣列基板 14、54 彩色渡光片基板 16、56 驅動器晶片（驅動器1C) 18、58 驅動器搭載部 19 顯示區 20 非顯示區 22 絕緣層（聚合物） 24 供電配線 26 引拉出配線（引入線） 28 閘極線 30a、30b 端子（凸塊） 32 密封 33 轉移器 34 絕緣膜 36 保護膜 38 鈍化膜 40 旁通線 92296TW-無劃線 -15- 1283787 42 接觸孔 60 匯流排配線 61 穿孔配線 92296TW-無劃線 -16-1283787 IX. Description of the Invention: The present invention relates to a liquid crystal display device in which a driver IC (integrated circuit) is directly mounted on an array substrate. [Prior Art] A conventional liquid crystal display device can display an array substrate and a color filter substrate by operating a liquid crystal filled between the substrates. When the array substrate is opposed to the color filter substrate and the liquid crystal is filled between the substrates, it is called liquid crystal 7G. The array substrate is provided with a plurality of signal lines and a plurality of gate lines in a vertical and horizontal direction, and a switching element called a TFT (Thin Film Transistor) is provided at an intersection thereof. The gate of the TFT is connected to the gate line, and the source is connected to the signal line. A pixel electrode is connected to the drain of the TFT. When a voltage is applied to the pixel electrode, an electric field is generated on the pixel electrode and the common electrode provided on the color filter substrate, and the liquid crystal is operated. In other words, the gate voltage is applied to the gate line, and the TFT is turned on. At this time, when a signal voltage is applied to the signal line, a voltage is applied to the pixel electrode to cause the liquid crystal to operate. In order to apply a gate voltage or a signal voltage, a driver 1C is mounted on the liquid crystal cell, and a desired voltage is applied from the driver 1C to the gate line or the signal line. The mounting of the driver 1C to the liquid crystal cell is performed by using a conventional TAB (tape automated bonding) or a COF (chip on flexible printed circuit) chip mounting method, or It is carried out by a technique in which a driver ic is mounted on a flexible printed circuit board called an FPC (flexible printed circuit board: flexible 9212TW-free line 1283787 circuit board). In the case where the array substrate is formed into a horizontally long rectangular shape, the mounting of the driver 1C is performed by interposing TAB/COF on the lateral side of the array substrate and TAB or FPC on the vertical side. Therefore, a plurality of TABs are used. /COF. Therefore, in order to reduce the cost of the TAB/COF, there is a technique in which the bus bar wiring replacing the TAB/COF or FPC is directly wired on the array substrate. In the array substrate 52 of the liquid crystal cell 51 of Fig. 8, the bus bar wiring is pulled out from the driver mounting portion 58 where the color filter substrate 54 is not opposed. Then, the driver IC 56 is directly mounted on the array substrate 52 by a mounting method called COG (chip on glass). In order to supply power to the driver IC 56 on the array substrate 52, as shown in Fig. 9, a plurality of driver ICs 56 are connected by the bus bar wiring 60, and power is supplied to all of the drivers 1C from one portion. In this case, the through wiring 61 is provided inside the wafer 56 and below the wafer 56 to perform wiring. This is effective for the case where the driver mounting portion 58 is too narrow and the bus bar wiring 60 for power supply is not pulled out on each of the driver ICs 56. Since the area of the driver mounting portion 58 is not widened, the liquid crystal cell 51 does not become large. For example, the width of the driver mount 58 is about 2 mm, and the width of the wires 60, 61 is about 200 μm. With the increase in size and definition of the liquid crystal display device 50, the total amount of current flowing into the entire liquid crystal display device 50 has been increased. For example, an XGA (Extended Graphics Array) liquid crystal display device 50 has 3,072 signal lines. Even if a current of 1 mA flows, the total current amount becomes 92296 TW - no scribe line 1283787 is about 3 A. Therefore, since the value of the current flowing to the wirings 60, 61 also becomes high, it is necessary to widen the cross-sectional areas of the wirings 60, 61. Since the film thicknesses of the wirings 60, 61 which can be formed in the manufacturing steps of the array substrate 52 are extremely thin to about 2,000 to 3,000 Å, it is necessary to widen the width of the portions of the wirings 60, 61. However, as the narrow frame of the liquid crystal display device 50 progresses, the width of the driver mounting portion 58 is not widened, which also causes a problem. Further, in order to reduce the number of the wirings 60, 61, as shown in Fig. 9, wirings 6A, 61 are provided in series. As a result, a large current flows into the wirings 60 and 61, which causes a large load on the junction portion between the driver IC 56 and the wirings 60 and 61, and the wirings 60 and 61 may be melted. SUMMARY OF THE INVENTION (Problems to be Solved by the Invention) An object of the present invention is to provide a liquid crystal display that reduces the load on a connection portion between a driver 1C and a wiring due to a narrow frame of a liquid crystal cell and a large current flowing to the wiring. Device. (Means for Solving the Problem) The liquid crystal display device of the present invention includes an array substrate in which a plurality of electrode lines are formed in the vertical and horizontal directions, and a color filter substrate in which the electrode lines of the peripheral portion of the array substrate are exposed. The insulating layer is formed on the non-display area of the array substrate, and is formed at a position opposite to the color filter substrate to cover the electrode line; the power supply wiring is formed. On the insulating layer, the driver 1C is disposed at a position opposite to the color filter substrate of the array substrate, and is connected to the electrode line; and the lead wire is connected to the 92296TW-non-line 1283787. Power supply wiring and driver ic. Since the insulating layer is formed in the non-display area described above and the power supply wiring is formed thereon, the wiring width of the power supply wiring is wider than the conventional power supply wiring. Therefore, when a high current flows to the driver 1C, there is little possibility that the power supply wiring is blown. The above insulating film is a resin (polymer). The insulating layer made of the resin is formed by a method of curing a resin coated with a liquid, a method of adhering a film-form resin with an adhesive or thermocompression bonding, and a layer of a resin can be easily formed. Each of the power supply wiring and the lead wiring has a plurality of wires, and an insulating film is provided on the power supply wiring, and the power supply wiring and the lead wiring cross each other via the insulating film. Although the number of power supply wirings can be determined by the number of terminals of the driver 1C, when the power supply wiring becomes a plurality of lines, the number of the lead lines becomes plural. Therefore, it is three-dimensionally intersected by an insulating film. Each of the power supply wiring and the lead wiring system has a plurality of strips, and the power supply wiring is divided into two at a portion where the power supply wiring and the lead wiring intersect in a non-contact manner, and is disposed under the insulating layer to be connected and divided into two. The bypass line of the power supply wiring. In addition to providing an insulating film on the power supply wiring, an insulating layer can also be used to realize a three-dimensional intersection of the power supply wiring and the lead wiring. [Embodiment] An embodiment of a liquid crystal display device of the present invention will be described with reference to the drawings. In the liquid crystal display device 10 of the present invention, an insulating layer 22 is provided on the non-display area 20 of the array substrate 12 of the liquid crystal cell 11 shown in FIGS. 1(a) and 1(b), and a power supply wiring 24 is formed on the insulating layer 22. The power supply to the driver 1C 16 is performed by the lead wires 26 that are branched from the power supply wiring 24 . Further, in Fig. 1(b), the gate line and the like on the substrate 12 of the array 12296TW-non-line 1283787 are omitted. As shown in Fig. 2, a desired signal voltage is applied to the gate line 28 or the like connected to the terminal (bump) 30b of the driver ici6, and the liquid crystal display device 10 is operated. In detail, as shown in FIGS. 1(a) and 1(b) and FIGS. 3(a) and 3(b), the liquid crystal display device 10 includes an array substrate 12; and a color crossing opposite to the array substrate 12 at regular intervals. a light sheet substrate 14; an insulating layer 22 formed on the non-display area 20 opposite to the color light-receiving sheet substrate 14 in the array substrate 12; a power supply wiring 24 formed on the insulating layer 22; in the array substrate 12, The driver 1C 16 disposed on the driver mounting portion 18 that is not in the region facing the color filter substrate 14; and the lead wiring 26 that connects the power supply wiring 24 and the driver 1C 16 . Further, in FIGS. 3(a) and 3(b), although the number of the power supply wirings 24 is different, the number of the power supply wirings 24 is arbitrary depending on the products of the liquid crystal display device 1A. Further, in Fig. 3(b), a transfer unit 33 for supplying a common potential to the color light guide substrate 14 is provided. In the array substrate 12, electrode lines such as signal lines or gate lines are formed on the surface of the glass substrate in the vertical and horizontal directions, and the electrode lines are pulled out at the peripheral portion. A TFT is provided at the intersection of the signal line and the gate line. A gate line is connected to the gate of the TFT, and a signal line is connected to the source of the TFT. A pixel electrode is connected to the drain of the TFT. The liquid crystal is sealed between the array substrate 12 and the color filter substrate 14, and the liquid crystal is operated by applying a voltage to the pixel electrode. The liquid crystal display device 1 is displayed by operating the liquid crystal. Further, the display area 19 is a region in which the liquid crystal is sealed, and the non-display area 2 is hidden in a region of the casing supporting the liquid crystal cell when the liquid crystal display device 10 is constructed. In general, although the driver mounting portion 18 is also a non-display area, in the description 92296TW - no scribe line 10 - 1283787, the peripheral portion of the portion where the array substrate 12 and the color filter substrate 14 are opposed is used. It is called a non-display area. Further, the liquid crystal system can be prevented from leaking from the liquid crystal cell 11 in accordance with the sealing 32. As shown in Fig. 2, the desired voltage is applied from the driver IC 16 to the gate line 28 or the signal line. The size of the array substrate 12 and the color filter substrate 14 are different. When the array substrate 12 faces the color filter substrate 14, a part of the gate line 28 or the signal line drawn by the peripheral portion of the array substrate 12 is partially exposed. The driver IC 16 is mounted on the array substrate 12 and mounted on the driver mounting portion 18 which is not in the region opposed to the color filter substrate 14. That is, the driver IC 16 is directly mounted on the array substrate 12. The insulating layer 22 is laminated on the array substrate 12, and is laminated on the array substrate 12 opposite to the color filter substrate 14, and is not sealed on the non-display area 2 of the liquid crystal. The insulating layer 22 is formed of a photosensitive or non-photosensitive organic resin insulating film. The insulating layer 22 is formed by a method of applying a liquid resin (polymer) to cure it, or a method of adhering a film-form resin with an adhesive or thermocompression bonding. The insulating layer 22 is provided in the non-display area 20 and serves as an insulator with a passivation layer to be described later for covering the gate line 28 or the signal line. As an example, a photosensitive acrylic resin is used for the insulating layer 22, and after coating, a specific contact hole is provided in the exposure/development, and then fired and hardened. Further, by providing the resin forming the insulating layer 22 on the display region 19 of the array substrate 12, the signal line can be overlapped with the pixel electrode, and the aperture ratio of the liquid crystal display device 10 can be improved. Further, the insulating layer 22 is laminated on a passivation layer (not shown) for protecting the gate line 28 or 92296TW-cut line 1283787 k formed on the glass substrate constituting the array substrate 12. The passivation layer is composed of an insulator such as an oxide film or a nitride film. The power supply to the driver 1C 16 is formed on the insulating layer 22, and is formed by forming the lead wiring 26 from the power supply wiring 24 to the driver 1 (: 16). The terminal of the driver IC 16 is connected to one end of the lead wiring 26. (bump) 30a, and the other end is connected to the power supply wiring 24. The power supply wiring 24 or the lead wiring 26 is formed of silver, copper, or gold by using well-known photolithography, vacuum vapor deposition, plating, or the like. The material is provided on the insulating layer 22. Generally, the number of terminals 30a of the driver 1C 16 is plural. The number of the power supply wiring 24 and the bowing wiring 26 also becomes plural. Therefore, as shown in Fig. 1(b) or As shown in Fig. 4, the power supply wiring 24 and the lead wiring 26 are three-dimensionally intersected via the insulating film 34. As shown in Fig. 5, the insulating film 34 is formed on the power supply wiring 24 where the three-dimensional intersection is performed. In the unused technique, the power supply wiring 24 is formed on the non-display area 20 after the array substrate 12 is opposed to the color filter substrate 14. Therefore, the power supply wiring 24 having a wider width than the conventional one can be formed, and the electric resistance of the power supply wiring 24 becomes small. Can flow out The current is supplied to the power supply wiring 24 and the lead wiring 26. In one example, the width of the power supply wiring 24 is about 300 μη, the interval between the power supply wirings 24 is about 100 μm, and the width of the lead wiring 26 is about 50 μm, and the interval between the lead wires 26 is about In this case, even if a current of about 3 Torr flows, the power supply wiring 24 or the lead wiring 26 can be prevented from being blown. Although the embodiment of the present invention has been described above, the present invention is not limited to the present invention. In the above-described embodiment, as shown in FIG. 4 or FIG. 5, the insulating film 34 is provided in the 92296 TW, secant-free 12-12485787, and the lead wires 26 are formed thereon. However, the power supply wiring 24 and the lead wiring 26 may be formed by other methods. For example, as shown in Fig. 6, the power supply wiring 24 and the lead wiring 26 are formed on the same insulating layer 22. The power supply wiring 24 is divided into two at the position where the three-dimensional intersection is performed, and the divided power supply wiring is divided. The 24 series is connected by a bypass line 40. The bypass line 40 is formed on the passivation layer for protecting the gate line 28, etc. In other words, the bypass line 40 is formed under the insulating layer 22. The connection between the wiring 24 and the bypass line 40 is performed by providing a contact hole 42 in the insulating layer 22 and embedding a conductor in the contact hole 42. As shown in Fig. 7, 'to protect the power supply wiring 24 or to be taken out The passivation layer 38 is formed by the wiring 26. The passivation layer 38 is formed of an oxide film or a nitride film. The passivation layer 38 is formed in the array substrate and is formed outside the region of the terminal 30 of the driver IC 16. The passivation layer 38 is Knowing the light lithography, distribution method, or optical step to form an organic substance such as polyimide, or by sputtering or C VD (chemical vapor deposition) in a photolithography step, such as sputtering or mask sputtering. The tantalum nitride film formed by the chemical vapor deposition method is shown in FIGS. 3(a) and 3(b), but the power supply wiring 24' is provided on the insulating layer 22 formed of a polymer. The power supply wiring 24 is formed on the passivation layer (not shown) of the insulating layer of the electrode line 28. As shown in Fig. 4 or Fig. 5, an insulating film 34 is provided at a portion where the power supply wiring 24 and the lead wiring 26 intersect. As shown in Fig. 1, the array substrate 12 has a rectangular shape, and a driver mounting portion 18 is provided on both sides thereof. In general, although the power supply wiring 24 is formed in the non-display area 2A adjacent to the driver mounting portion 18 in the non-display area 2A, the non-display area 2 not adjacent to the driver mounting portion 18 may be required as needed. The present invention is not limited to the above embodiment, but the embodiment of the present invention is described with reference to the embodiment of the present invention in which the 92296 TW and the non-marking-13 - 1283787 electric wiring are formed. In addition, the present invention can be carried out with various modifications, modifications, and alterations in accordance with the knowledge of those skilled in the art without departing from the spirit and scope of the invention. According to the present invention, it is possible to perform wiring having a wide wiring width and low resistance by supplying power to a portion where wiring is not applied in the prior art. When power is supplied to the turret 1C, since the wiring width of the power supply wiring is wide, there is little possibility that the power supply wiring is blown due to high current. Further, since the area where the power supply wiring is not formed in the prior art is wired, the space of the array substrate can be effectively utilized, and the narrow frame of the liquid crystal display device can be handled. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a liquid crystal display device of the present invention, wherein Fig. 1(a) is a top view, and Fig. 1(b) is a schematic view showing an enlarged main portion of the array substrate. Fig. 2 is a view showing the connection of the power supply wiring and the gate line of the driver 1C. Figure 3 is a cross-sectional view of the Χ-Χ' of Figure 1(b), wherein Figure 3(a) shows a cross-sectional view of eight power supply wirings, and Figure 3(b) is a cross-sectional view of the position where the transfer device is provided. Fig. 4 is a cross-sectional view of Fig. 1(b) showing the position where the lead wiring is provided on the insulating film on the power supply wiring. Fig. 5 is a schematic view showing an insulating film provided on a power supply wiring. Fig. 6 is a schematic view showing a bypass line and a three-dimensional intersection of the power supply wiring and the lead wiring. 92296TW-No underline 14 1283787 Figure 7 is a schematic diagram of a passivation film on a power supply wiring. Fig. 8 is a schematic view showing a liquid crystal display device in which a driver 1C is mounted on a driver mounting portion. Fig. 9 is a schematic view showing the drive 1C connected in series. [Description of main component symbols] 10, 50 LCD display device 11, 51 Liquid crystal display element 12 > 52 Array substrate 14, 54 Color light-receiving substrate 16, 56 Driver chip (driver 1C) 18, 58 Driver mounting portion 19 Display Zone 20 Non-display area 22 Insulation (polymer) 24 Power supply wiring 26 Pull-out wiring (introduction line) 28 Gate line 30a, 30b Terminal (bump) 32 Seal 33 Transferr 34 Insulation film 36 Protective film 38 Passivation film 40 bypass line 92296TW-without scribe line-15-1283787 42 contact hole 60 bus bar wiring 61 perforation wiring 92296TW-without scribe line-16-