1281173 九、發明說明: 【發明所屬之技術領域】 本發明是有關於-種繞組元件及其製造方法,特別是 指一種電路板式繞組元件及其製造方法。 【先前技術】 吊見的繞組元件如電感器、變壓器、網路濾波器···等 、在叹计上都具有預定數量之鐵心,及繞設於鐵心上之一BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a winding element and a method of manufacturing the same, and more particularly to a circuit board type winding element and a method of manufacturing the same. [Prior Art] Hanging winding components such as inductors, transformers, network filters, etc., have a predetermined number of cores on the sniffer, and are wound around one of the cores.
或多數線圈’列的繞組元件料,會隨所需求之特性、 ,格與使料合的差異而有所不同,冑的是由鐵心與線圈 、、且成獨立…有些則是由鐵心與線圈搭配設計在電路板 上所構成。 就電感器與變壓器而言,較容易由鐵心與線圈組成獨 立凡件’當然也有籍由單層戋多戶 曰及夕層電路板上之銅箔層來構 ,繞狀之線圈,再以兩片組合方式將兩半邊之鐵心,分 別由電路板兩相反面對接而 u疋仕电路板上,使設置在電 t上之線圈對應繞設在鐵心上,而組成所需之繞組元件 ^人以可具有較小之體積,但其鐵心部份由兩半邊固 疋接5之構造,仍有進—步改良之需 黏合方式,或利用如杜^ 勹…娜疋才』用 過程定兩半邊之鐵心,不僅製造 通…丄 與鐵心間,免存在空隙·,除了 通電運作時容易產生振動與噪音外,並會造成較大的磁損 卜’網路濾波器通常是由車交容旦 ,, 車乂夕數置之鐵心與線圈搭 而難以單獨由鐵心 配連接所組成,在安裝上較無一體性, 5 1281173 與線圈架構而成,必須將多數結μ , 竹夕数、、凡δ又有預定數量線圈之鐵心 配合安裝在附有線路之電路板上, 文衣日寸母一線圈之繞减 必須與電路板上之電路預作連 ^ ^ 二… ?貝作運接,因此不僅安裝甚為麻煩 ,而且較無一體性之結構,f項 、 一 μ 構t須配合其他後續之相關加工 二输型態被使用’此處所稱之後續相關加 工料@疋!再配合引出導線架,並利用封裝技術以絕緣 封膠包復於荊述基板與該等鐵、 執 、、果圈外部,而將整體網 路濾波器組裝成為具有一體性 心、凡、、且几件,使整體繞組元 件具有一般ic元件之外顴刑能 〜i, 卜硯型悲,以利於插裝並焊接在較大 型之電路板。 【發明内容】 因此,本發明之目的,即在提供一種利用將導磁材料 -體模製成型為可供預設在電路板上之線圈繞設之鐵心, 使製程簡單且導磁材料與電路板間不致存在空隙之電路板 式繞組元件及其製造方法。 於是,本發明電路板式繞組元件之製造方法,所述電路 板式繞組元件包含-電路板及至少—固結在該電路板上之鐵 心’該電路板包括-水平之板本體,及至少—被覆在該板本 體上並環繞預定圈數之線圈,該鐵心、是以導磁粉末一體模製 成型地固結在該電路板之板本體上,且該鐵心呈環狀並穿繞 過該線圈之-中心。該製造方法包含··⑷備製—電路板,使 該電路板包括一水平板本體,及至少一被覆在該板本體上並 環繞預定圈數之線圈。⑻備製一模具。⑹將該電路板放置 在該模具内,以導磁粉末掩埋該電路板上、下方,並固結成 6 1281 型出-呈環狀且穿繞過該線圈 T。的鐵心。 L貫施方式】 有關本發明之前述及豆他 、汉,、他技術内容、特點與功效,在 以下配合參考圖式之三較隹每 一旱么只知例的詳細說明中,將町清 楚的呈現。 对 在本發明被詳細描述以前,要注意的是,在以下的說 明内各中’類似的元件是以相同的編號來表示。Or the winding component materials of the majority of the coils will vary according to the required characteristics, the grid and the difference of the materials. The core is the core and the coil, and is independent... Some are made of iron core and coil. The matching design is made on the circuit board. In the case of inductors and transformers, it is easier to form separate parts from the core and the coil. Of course, there are also copper foil layers on a single-layer, multi-family and slab circuit board. The chip combination method connects the cores of the two halves, respectively, to the opposite sides of the circuit board, and the circuit board is arranged on the circuit board, so that the coils disposed on the electric power t are correspondingly arranged on the iron core, and the required winding components are formed. In the structure which can have a small volume, but the core portion is fixedly connected by the two halves, there is still a need for further improvement of the bonding method, or use the process such as Du ^ 勹 疋 疋 疋 』 』 The core of the iron is not only made between the 丄 and the core, but there is no gap. In addition to the vibration and noise generated during the energization operation, it will cause a large magnetic loss. The network filter is usually made by the car. The car core and the coil are placed together with the coil and are difficult to be composed of the iron core. The installation is relatively non-integral. 5 1281173 is formed with the coil structure, and the majority of the knot must be μ, the number of bamboo eves, and δ There is a predetermined number of coil cores Installed on the circuit board with the line attached, the winding of the coil of the clothing on the board must be pre-wired with the circuit on the board ^ ^ two...? It is not only difficult to install, but also has no integrated structure. The f-item and the one-structure t must be used in conjunction with other subsequent processing two-transmission types.疋! With the lead frame, and using the packaging technology to cover the substrate and the outside of the iron, handle, and fruit ring with insulating sealant, the whole network filter is assembled into a unitary heart, And a few pieces, so that the overall winding components have general ic components in addition to the 颧 能 i i i i i i 〜 〜 〜 〜 , , , , , , , , , , , , , , , , , , , SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a core that is formed by winding a magnetically permeable material into a coil that can be pre-set on a circuit board, thereby making the process simple and magnetically permeable. A circuit board type winding component in which a gap does not exist between circuit boards and a method of manufacturing the same. Thus, in the method of fabricating a circuit board type winding component of the present invention, the circuit board type winding component comprises a circuit board and at least a core affixed to the circuit board. The circuit board comprises a horizontal board body, and at least - is covered The core of the board is surrounded by a predetermined number of turns, and the core is integrally molded on the board body of the circuit board by magnetically conductive powder, and the core is annular and passes through the coil. -center. The manufacturing method includes (4) preparing a circuit board such that the circuit board includes a horizontal board body and at least one coil covered on the board body and surrounding a predetermined number of turns. (8) Prepare a mold. (6) The circuit board is placed in the mold, and the magnetic conductive powder is buried on the circuit board and below, and is consolidated into a 6 1281 type-out-loop and wound around the coil T. Iron heart. L. The method of the above-mentioned, and the technical contents, characteristics and effects of the Bean, Han, and He are described in the following detailed description of each of the droughts. Presentation. Before the present invention is described in detail, it is to be noted that in the following description, similar elements are denoted by the same reference numerals.
圖 2所示,本杳明第一實施例之製造方法所製造 出的電路板式繞組元件2包含右一堂攸。立 , 丁 匕各百電路板3,及一模製成型 地固結在該電路板3上之鐵心4。As shown in Fig. 2, the circuit board type winding element 2 manufactured by the manufacturing method of the first embodiment of the present invention includes the right one. Each of the plurality of circuit boards 3 and the core 4 are integrally molded on the circuit board 3.
該電路板3包括有-水平之板本體31、一被覆在該板 本體31❻面上並環繞職圈數之線圈32,及—覆蓋在該線 圈32頂面以提供絕緣、保護效果之絕緣層33。該板本體 31疋由絕緣材料製成,並具有二間隔之第一、第二穿孔3Π 、312。該線圈32便是圍繞在第一穿孔311周圍,也就是說 線圈32是以該第一穿孔311為中心環繞被覆在板本體3丨頂 面上’且該第二穿孔312是位在線圈32外圍。 该鐵心4是以模製成型方式固結在該電路板3上,實 施上可採用如壓鑄成型、射出成型…等一體模製成型方式 ’在本實施例中是以壓鑄成型方式為例作說明。該鐵心4 在製造時是將粉末狀之導磁材料,以壓鑄成型方式固結在 该電路板3之板本體31上,使該鐵心4呈環圈狀並穿繞過 弟、第一穿孔3 11、3 12,也就是說該鐵心4固結在板本 體3 1上時,是穿繞過該線圈32中心。 7 1281173 、如W 3户斤示,本發明第一實施例藉以達成上述電路板 式繞組元# 2 tit方法之製造模具大至支是包含有一下模5, 及一可對應壓合在該下模5上之上模6。 /其製造過程’大致是使電路板3定位在該模具期間, 讓電路板3上、下方欲固結鐵心、4之部位受導磁粉末掩埋 亚固結成型出該鐵心4。 /下扠5包括了杈座5卜及一安裝在該下模座”内 ^下模仁52。該下模座51呈水平長片狀板體,具有—凹陷 广了員面中央之長方下模穴511。該下模仁52可容裝入 ^下模座^之下模穴511内,且其—頂端面521是設計成 L凹面狀’该弧凹形狀是對應於該鐵心4底面形狀。 該上模6包括—用來對應壓合在該下模座Μ頂面之上 /1,及—可往下壓覆地安裝在該上模座61内之上模仁 2。该上模座61呈可盘命、十、y 、, 、刚述下杈座5丨對應蓋合之長片狀 板體,並具有—由盆& —s /、底面中央往上延伸且對應於前述下模 之上輪611 ’及二對稱連通於該上模穴611中間高 度處並^斜:^延伸貫穿之人料通道⑴。該上模仁62是可 t地谷衣在该上模穴611内,且其-底端面621的形 狀也疋壬弧凹狀,而對應於該鐵心4頂面形狀。 有關利用該模具來製造出電路板式繞組元件2之過程 如下· Η \ ^ —欠人料:如圖4在上、下模6、5未對應蓋合 之下拉仁52容置入下模座5丨之下模穴511 W,並將定量之導磁粉末7倒入下模穴川内,使導 8 1281173 tf末堆積在下模仁52上方,也就是容裝在下模穴川上 而:内A過私所倒入之導磁粉末,大致是用來成型出前 述鐵心4下端部。 旛:放置電路板:如圖1 2所示,在上、下模6、5未對 應盍5以前’將該電路板3放置在該下模座Μ頂面,並覆 蓋:下模:51所容裝之導磁粉末7上方,設計上電路板3 之弟一、弟二穿孔311、312是對應於下mu的左、右 側上方。 第人入料,如圖3所示,將上模座61蓋合在下 模座51頂面’並經由上模座6!之該等人料通道612倒入 定量之導磁粉末4,使導磁粉末堆積在電路板3上方,當然 電路板3之弟-、第二穿孔311、312也已填滿導磁粉末7 。該過程中所倒人之導磁粉末7,大致是絲成型出鐵心4 上端部。 1 、進行壓鑄:如圖4所示,藉由上、下模仁62、52 相向壓合力,將電路板3上、下方之上、下模穴“:”内 的導磁粉末壓鑄成型為固態之鐵4,而 經由該二穿孔311、312連通固#把μ ± 1 埂通固結在一起,此時便已完成如 2 前述圖1、2所示電路板式繞組元件2之整體構造。 3 本實施例上述利用壓鑄成型之製造方法具有如下多項 優點: 、 4 1、在將導磁粉末壓鑄成固態鐵心4的同時,便完成 其鐵心4與電路板3的結合’並使鐵心4成型為穿繞:電 路板3之線圈32中^的環形結構’因此製程非常簡單,完 1281173 全不需要進行如發左 °方法所進行的黏合或扣接等加工組裝 作業,可有效降低製造成本。 …2、所製成的電路板式繞組元件2由於其鐵心4是壓 麵成型地固結在雷政^ m、 板3上’且與f路板3間不會存在空 ” &可避免產生振動與噪音,並能減少磁損。 值得一提的是,—體模製成型該鐵心4之方式,另< 利用射出成型方式,脸、六^ 將⑺L悲V磁粉末注入模具内,同樣矸 藉由導磁粉末經第—、第二穿孔3li、3i2充填於電路板3 ^下方’而成型出—體固結在該電路板3上並穿繞過線 圈32中心之環形鐵心4。 雨圖9所7’本發明第二實施例之製造方法所製造 出的電路板式繞組元件2盤命、+、隹 ^ 兀件2與則述弟一實施例不同處在於: 本實施例之繞組元件2的電路板3是採用—般多層式電路 板,使本實施例之電路板3包括有多數相疊接之板本體Μ ’及多數分別右、左間隔被覆在該等板本體3ι τ頁面之線圈 32、32。該等線圈32、32,是分別圍繞在第一、第二穿孔 扣、312周圍。為避免圖示過於複雜,本實施例中每一線 圈二:3:都只:環繞一圈為例揭露於圖式中。由於該鐵心 U第、弟一牙孔311、312,因此也同時穿繞過每-線圈32、32’中心。 此外,在此須進-步說明的是,該電路板3所設置的 線圈32數量可視需要增加’例如更可在電路板3之板本體 31底面也被覆線圈32、32,,來被覆更多數量的線圈32。 且可視設計需求,將各層板本體31間經由導通孔技術作電 10 1281173 連接,使各線圈32間獲得所需的連接關係。 如圖10、11所f ; 丄心 V不,本發明第三實施例之製造方法 造出之電路板式繞組 义 — 牛 吳弟一實施例不同處在於:第 一實施例之繞組元件2僅勺人 、 一 匕5 一鐵心4,而本實施例之繞組 兀件2則包含有多數個 、、 4,相對地本實施例中該電路板 3之板本體31上,#門< 1更開故有多數對相間隔對應之第一、篦 二穿孔311、312,以分別供該等鐵心4固結。 本實施例所採用之模具與第一實施例的不同處在於·· 為了因應所要設置鐵心找 数里雙多,除了上、下模座須 設對應數量之上、下模 、頁開 镇八U外,也要增設對應數量的上、 下模仁(不再以圖式詳兩 ^ ^ 、、 1路),至於製造過程同樣必須進行 刖述之弟一次入料、定/ # 耸兒路板、第二次入料及進行壓鑄 等過私,而旎一次壓鎮屮 ~出、,Ό合在電路板3上之該等鐵心4, 並使σ鐵心4成型為穿繞過所對;Λ垮圈D + 程非常簡單。 斤對I表圈32之中心,因此製 猎此所製成具備右吝者} 爾有夕數鐵心4之繞組元件2,適合作為 網路濾波器使用,由於爷笨 卞局 田於34鐵心4是與電路板3 ,使整體繞線元件2 mu 版 / 、 具備甚佳之一體性結構,而能免除以 彺網路濾波器組裝時,必須 ’、 ^ 員$政地將多數繞設有預定數量 線圈之鐵心女裝在電路板上 .A 〕焦頊I耘’更!須進行線圈 與線圈之線端間,以及岣圃+ μ 以及、'表圈之線端與電路板間的連接,因 此本貫施例之設計確實可 煩之困擾。 、”'、、耆文“知網路濾波器製造麻 此外’值得一提的是’因應一般網路濾波器之設計, 1281173 通常其所設置之多數鐵心’往往不會全部採用相同的導磁 材料’以提供不同特性,針對此,,當本實施例中該 等鐵心4有採用不同導磁材料之需要時,例如有些鐵心* 採用第-種導磁粉末材料、其餘鐵4採用第:種導磁粉 末材料,則其製造過程,只要將不同的導磁粉末材料填入 所對應之模穴中即可,至於壓鑄過程,可—次壓鑄成型, 也可分兩次壓鑄成型。 又,為了使本實施例之繞組元件2能配合插裝在大型 之電路板上,該繞組元件2更可如圖12所示,設計成更包 含有多數間隔由該電料3兩彳目反録下延伸分別用來電 連接於該料圈32之線端料、㈣21,及—封裝於電路板 3與各鐵心4外部之封裝體22,使整體繞組元件2.具有- 般1C元件之外觀型態,以利於插裝並焊接在較大型之電路 板0 歸納上述,本發明之製造方法藉由模製成型方式,將 導磁粉末-體包覆於具有_ 32之電路板3上所製成之電 路板式繞組元件2,不僅製造過程簡單,並可使所製成結合 -體之鐵心4與電路板3間不會存在空隙,而可降低製造 成本,並有效提升品質,故確實能達到發明之目的。 ▲惟以上所述者’僅為本發明之三較佳實施例而已,當 不能以此限定本發明實施之範圍,即大凡依本發明申嗜專 利範圍及發明說明内容所作之簡單的等效變化與修飾,皆 仍屬本發明專利涵蓋之範圍内。 【圓式簡單說明】 12 1281173 圖1是本發明之製造方法的第一較佳實施例所 電路板式徺組元件的立體圖; ' 圖2是圖1中該電路板式繞組元件的正視剖面圖; #圖3是一製造模具之簡略立體分解圖,說明本發明該 弟—較佳實施例之製造方法; 囷4疋圖3中该模具進行第一次入料時之狀態; 圖5是圖3中該模具放置一電路板時之狀態; 圖6疋圖3中该模具進行第二次入料時之狀態; 圖7是圖3中該模具進行壓鑄時之狀態; “圖8是本發明之製造方法的第二較佳實施例所製成之 一電路板式繞組元件的立體圖; · 圖9是圖8中該電路板式繞組元件的正視剖面圖; 圖10是本發明之製造方法的第三較佳實施例所製成之 電路板式繞組元件的立體圖; 圖11是圖10中該電路板式繞組元件的正視剖面圖;及 圖12是該第三較佳實施例所進一步製造出呈型態 之電路板式繞組元件的立體圖。 13 1281173 【主要元件符號說明】 ^ ί .? Ψ νί- 繞組元件 5 1 * …* 1 巧 Ψ »:.今‘ ΐ 丨 》 > 導線架 5 11,… 封裝體 5 2 — ^ 電路板 5 2 1 …, 3 1…"… 板本體 )♦ * JC * « 1 1 *r ® ^ ^ ^ 第一穿孔 6 1 ”… 3 12…… 第二穿孔 6 11* … 32 、 32’ 線圈 6 12,… 33……… 絕緣層 6 2…… 4…《…… 鐵心 6 21 …, 下模 η……" …下模座 Μ下模穴 "下模仁 …頂端面 …上模 …上模座 …上模穴 …入料通道 …下模仁 …底端面 …導磁粉末 14The circuit board 3 includes a horizontal plate body 31, a coil 32 covering the surface of the plate body 31 and surrounding the number of turns, and an insulating layer 33 covering the top surface of the coil 32 to provide insulation and protection. . The plate body 31 is made of an insulating material and has two first and second perforations 3, 312 spaced apart. The coil 32 is surrounded by the first through hole 311, that is, the coil 32 is wrapped around the top surface of the plate body 3 around the first through hole 311' and the second through hole 312 is located at the periphery of the coil 32. . The core 4 is fixed on the circuit board 3 in a molding manner, and can be implemented in an integral molding manner such as die casting, injection molding, etc. In this embodiment, a die casting method is taken as an example. Give instructions. The core 4 is manufactured by laminating a powder-like magnetic conductive material on the board body 31 of the circuit board 3 by a die-casting method, so that the core 4 is looped and passed around the first through hole 3 11, 3 12, that is to say, when the core 4 is fixed on the plate body 31, it is wound around the center of the coil 32. 7 1281173, as shown in FIG. 3, the manufacturing method of the first embodiment of the present invention for achieving the above-mentioned circuit board type winding element #2 tit method includes a lower mold 5, and a corresponding press fit in the lower mold 5 above the upper mold 6. / The manufacturing process is substantially to position the circuit board 3 during the mold, and the portion of the circuit board 3 on which the cores 4 are to be consolidated is immersed by the magnetic conductive powder to form the core 4. / The lower fork 5 includes a cymbal 5 and a lower mold core 52 mounted in the lower mold base. The lower mold base 51 is a horizontal long sheet-like plate body having a concave-shaped wide square in the center of the member. a lower mold hole 511. The lower mold core 52 can be accommodated in the lower mold base 511, and the top end surface 521 is designed to be a concave surface. The arc concave shape corresponds to the bottom surface of the iron core 4. The upper mold 6 includes - for correspondingly pressing on the top surface of the lower mold base / 1, and - can be pressed down to be mounted on the upper mold base 61 above the mold core 2. The die holder 61 has a long sheet-like plate body which can be covered by the disk, ten, y, and just the lower jaw 5 丨, and has a basin & s /, the bottom surface extends upward and corresponds to The upper mold upper wheel 611' and the second symmetry are communicated with the intermediate mold hole 611 at an intermediate height and are obliquely: extending through the human material passage (1). The upper mold core 62 is a tready valley coat on the upper mold cavity. 611, and the shape of the bottom end surface 621 is also concave and concave, and corresponds to the top surface shape of the core 4. The process for manufacturing the circuit board type winding component 2 by using the mold is as follows: Η \ ^ - owing Material: as shown in Fig. 4, after the upper and lower molds 6, 5 are not correspondingly closed, the puller 52 is received into the mold hole 511 W under the lower mold base 5, and the quantitative magnetic conductive powder 7 is poured into the lower mold hole. Therefore, the end of the guide 8 1281173 tf is deposited on the lower mold core 52, that is, it is accommodated on the lower mold hole: the magnetic conductive powder poured into the inner A is used to form the lower end portion of the iron core 4. Place the circuit board: as shown in Fig. 12, before the upper and lower dies 6, 5 are not corresponding to 盍5, 'put the circuit board 3 on the top surface of the lower mold base, and cover: lower mold: 51 Above the magnetic conductive powder 7, the design of the first circuit board 3, the second two holes 311, 312 correspond to the left and right sides of the lower mu. The first person feeds, as shown in Fig. 3, the upper mold base 61 is covered. The magnetic conductive powder 4 is poured into the top surface of the lower mold base 51 and passed through the human material passages 612 of the upper mold base 6 to deposit the magnetic conductive powder on the circuit board 3, of course, the brother of the circuit board 3 The second perforations 311, 312 are also filled with the magnetic conductive powder 7. The magnetically permeable powder 7 which is poured in the process is roughly formed by the upper end of the iron core 4. 1. Die casting: as shown in Fig. 4. As shown, the magnetically permeable powder in the upper and lower mold holes ":" of the circuit board 3 is die-cast into solid iron 4 by the opposing pressing force of the upper and lower mold cores 62, 52. The through holes 311 and 312 are connected to each other to fix the μ ± 1 turns, and the overall structure of the circuit board type winding component 2 as shown in the above Figs. 1 and 2 is completed. 3 This embodiment uses the die casting molding described above. The manufacturing method has the following advantages: 4, while the magnetic conductive powder is die-cast into the solid core 4, the bonding of the core 4 and the circuit board 3 is completed, and the core 4 is formed to be wound: the coil of the circuit board 3 The circular structure of 32 is so simple that the process is very simple, and the processing and assembly work such as bonding or fastening performed by the left-hand method is not required, and the manufacturing cost can be effectively reduced. ... 2, the circuit board type winding component 2 is formed because the core 4 is press-formed and fixed on the Lei Zheng ^ m, the board 3 'and there is no space between the f-way board 3 & Vibration and noise, and can reduce the magnetic loss. It is worth mentioning that - the phantom is made into the core 4, and the other is [injection molding, the face, six ^ (7) L sad V magnetic powder is injected into the mold, Similarly, the magnetically permeable powder is formed on the circuit board 3 by the first and second through holes 3li, 3i2 being filled under the circuit board 3^ and is wound around the annular core 4 at the center of the coil 32. The circuit board type winding component 2 manufactured by the manufacturing method of the second embodiment of the present invention is different from the embodiment of the present invention in the winding method of the second embodiment of the present invention. The circuit board 3 of the component 2 is a multi-layer circuit board, so that the circuit board 3 of the embodiment includes a plurality of stacked board bodies Μ 'and most of the right and left partitions are respectively covered on the board body 3 ι τ page The coils 32, 32. The coils 32, 32 are respectively wrapped around the first and second perforating buckles, 312. In order to avoid the complexity of the illustration, in the present embodiment, each coil 2:3: only: surrounds one circle as an example to expose in the drawing. Since the core U, the younger brother a hole 311, 312, therefore also At the same time, it is wound around the center of each coil 32, 32'. In addition, it should be further explained here that the number of coils 32 provided in the circuit board 3 can be increased as needed, for example, the board body 31 of the circuit board 3 can be further provided. The bottom surface is also covered with coils 32, 32 to cover a larger number of coils 32. Depending on the design requirements, each of the laminating bodies 31 is electrically connected to each other via a via hole technology to obtain a desired connection relationship between the coils 32. As shown in FIGS. 10 and 11; the core V is not, the circuit board type winding of the manufacturing method of the third embodiment of the present invention is different from that of the embodiment of the present invention: the winding element 2 of the first embodiment is only The scoop man, the 匕 5 ferrule 4, and the winding element 2 of the embodiment comprises a plurality of, 4, relatively on the plate body 31 of the circuit board 3 in this embodiment, #门<1 There are a plurality of first and second perforations 311, 312 corresponding to the interval. In order to consolidate the cores 4 respectively, the difference between the mold used in the embodiment and the first embodiment lies in that, in order to set the number of cores in accordance with the requirements, in addition to the upper and lower mold bases, a corresponding number is required. The upper and lower molds and the page open towns are eight U. In addition, the corresponding number of upper and lower molds must be added (no more details are shown in the figure), and the manufacturing process must also be described once. Feeding, setting / # 儿儿路板, the second feeding and die casting, etc., and 旎 压 出 出 出 出 出 出 出 出 出 出 出 出 出 出 出 Ό Ό Ό Ό Ό Ό Ό Ό Ό Ό Ό 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路Formed to be worn around; the circle D + process is very simple. Jin is on the center of the I bezel 32, so the hunting is made with the right-hander} The winding element 2 of the core 4 is suitable for use as a network filter, because the clumsy is in the 34 iron core 4 It is with the circuit board 3, so that the overall winding component 2 mu version /, has a very good physical structure, and can be exempted from the assembly of the 彺 network filter, must be ', ^ member $ politically, the majority will be set to a predetermined number The core of the coil is on the circuit board. A] 顼 顼 I耘' more! The connection between the coil and the coil end, and the connection between the 岣圃+μ and 'the bezel's wire end and the board must be made, so the design of the present example is really annoying. "',, 耆文" knowing the network filter manufacturing Ma is not worth mentioning is 'in response to the design of the general network filter, 1281173 usually the majority of the core set' often does not use the same magnetic permeability The material 'is provided with different characteristics. For this reason, when the core 4 has different magnetic conductive materials in the embodiment, for example, some cores adopt the first magnetic powder material, and the remaining iron 4 adopts the first type: For the magnetic conductive powder material, the manufacturing process is as long as different magnetic conductive powder materials are filled into the corresponding cavity, and as for the die casting process, it can be formed by secondary die casting or by two die casting. Moreover, in order to enable the winding component 2 of the embodiment to be inserted and mounted on a large circuit board, the winding component 2 can be further configured as shown in FIG. 12 to further include a plurality of intervals from the electrical material 3 The package end 22 for electrically connecting to the bead 32, (4) 21, and the package 22 packaged on the circuit board 3 and the outside of each core 4 are recorded, so that the integral winding component has an appearance of a general 1C component. State, in order to facilitate the insertion and soldering on a larger type of circuit board 0. In summary, the manufacturing method of the present invention is formed by molding a magnetic conductive powder body on a circuit board 3 having _32 by a molding method. The circuit board type winding component 2 is not only simple in manufacturing process, but also can prevent a gap between the core 4 and the circuit board 3 which are formed, and the manufacturing cost can be reduced, and the quality can be effectively improved. The purpose of the invention. ▲ 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 And modifications are still within the scope of the invention patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a circuit board type group component of a first preferred embodiment of the manufacturing method of the present invention; FIG. 2 is a front cross-sectional view of the circuit board type winding element of FIG. Figure 3 is a schematic exploded perspective view of a manufacturing mold, illustrating the manufacturing method of the preferred embodiment of the present invention; 囷4疋 Figure 3 shows the state of the mold at the time of the first feeding; Figure 5 is the state of Figure 3 Figure 6 is a state in which the mold is subjected to the second feeding; Figure 7 is a state in which the mold is die-cast in Figure 3; "Figure 8 is the manufacture of the present invention. A perspective view of a circuit board type winding component formed by a second preferred embodiment of the method; Fig. 9 is a front cross-sectional view of the circuit board type winding component of Fig. 8; and Fig. 10 is a third preferred embodiment of the manufacturing method of the present invention. FIG. 11 is a front cross-sectional view of the circuit board winding component of FIG. 10; and FIG. 12 is a circuit board of the third preferred embodiment. A perspective view of a winding element. 13 1281173 [Description of main component symbols] ^ ί .? Ψ νί- Winding component 5 1 * ...* 1 Qiao Ψ »:.今' ΐ 丨》 > Lead frame 5 11,... Package 5 2 — ^ Circuit board 5 2 1 ..., 3 1..."... board body)♦ * JC * « 1 1 *r ® ^ ^ ^ First perforation 6 1 ”... 3 12... Second perforation 6 11* ... 32 , 32' Coil 6 12,... 33......... Insulation layer 6 2... 4..."... Iron core 6 21 ..., lower mold η..." ... lower mold base under the mold cavity " lower mold core... top surface... upper mold... Upper mold base... Upper mold hole... Feeding passage... Lower mold core... Bottom end surface... Magnetic conductive powder 14