201021059 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種電感元件製造方法及其製造裝 置’特別是指一種運用粉末冶金模壓成形手段的電感元件 製造方法及其製造裝置。 【先前技術】 ' 如圖1與圖2所示，為本案申請人之第M278046號「電 • 感元件」新型專利案，所揭露之電感元件1是包含一線圈 • 11、一塞置在該線圈11中之金屬製導磁柱12，以及一將 該線圈11與該導磁柱12 —併包埋其中之扁平長方塊體狀 的包覆塊13。該線圈11具有二分別穿伸出該包覆塊13外 且彎折嵌覆在該包覆塊13之一底面上的導線腳hi，以及 一用以連接該二導線腳111且供該導磁柱12塞置並包埋於 該包覆塊13中的圈繞本體112。 另外’用以製造出上述電感元件1的製造裝置，是包 含一下模具3,及一可對應壓合在該下模具3上之上模具 • 5 〇 該下模具3包括一其一頂面凹陷形成一下模穴32的 下模座31、一固設在該下模座31内且位在該下模穴32之 底面處的下模仁33，以及一可動地插裝在該下模仁33内 且可向上頂伸入該下模穴32中的頂推稈34。該下模仁33 具有二分別凹陷形成於其頂面之相反二侧處且連通該下 模穴3 2的插槽3 5。 該上模具5包括一能對應壓合在該下模座31之頂面 201021059 上的上模座51，以及一可於該上模座51中縱向移動的上 模仁52。該上模座51具有一上下貫穿且能對應連通該下 模穴32的上模穴53，以及二斜向貫穿且左右對稱地連通 該上模穴53的入料道54 ^該上模仁52是能於該上模穴 53中上下位移，並進一步地通伸入該下模穴32中。 因此’利用該製造裝置來製造出電感元件丨的過程主 要如下： 首先’在該上、下模具3、5尚未對應蓋合以前，將 該線圈11放置入該下模穴32中，並讓該二仍呈直立狀之 導線腳111的末端部分別對應插裝入該下模仁33的二插槽 35中’以使該圈繞本體112懸空在該該下模穴32内。 接著’在該下模穴32内倒入適量導磁粉末，讓導磁 粉末量大概及於該圈繞本體112的底端部處，再將該導磁 柱12塞裝入該圈繞本體112内。再來，將該上模座^壓 合在下模座3 1頂面，並經由該二入料道54繼續倒進入導 磁粉末，以讓該線圈11(除了其導線腳lu的末端部外）與 該導磁柱12等全被導磁粉末所掩埋。 續而，將該上模仁52下壓並使其通伸入該下模穴32 中’以將容裝在下模穴32㈣導磁粉末壓鑄成固化的包 覆塊13,此時，該線圈11(除了其導線腳iu的末端部外） 與該導磁柱12等便被包埋在該包覆塊13中。 最後’將該上模具5向上升移以遠離該下模具3，並 控制該下模具3之頂推桿34往上頂推於該包覆塊13之底 面，使該包覆塊13與該線圈u之導線聊ui整體脫出該 201021059 下模穴32並被取離’之後’再將該二導線腳1^之末端部 相向彎折以嵌貼在該包覆塊13之底面，至此即完成該電 感元件1之製作。 然而，本案發明人發現’在該電感元件1的製造過程 中’由於僅是仰賴該線圈11之導線岬^的末端部插裝在 e亥下模仁33的插槽35中，以讓該線圈11之圈繞本體】 在支撐較薄弱的狀況下被懸置在該下模穴32内，使得在 二次導磁粉末填倒過程與導磁粉末壓鑄過程中，便可能造 成該圈繞本體112偏移的現象，即所製成電感元件丨之圈 繞本體112較難以準確控制是位在該包覆塊13的正中央 處，如此一來，便會影響到該電感元件丨的品質與良率。 且上揭製法僅能一次模壓成型個別獨立的元件，較難一次 製程可成排成型多個元件。 【發明内容】 因此，本發明之目的，即在提供—種有效提高所產製 電感元件之品質與良率的電感元件製造方法及其.製造裝 置。 於是’本發明之電感元件製造方法，該電感元件包含 一固化包覆塊、一包埋在該包覆塊中的線圈，以及二成對 地大伸在該固化包覆塊外的端子，該線圈具有二分別連接 該二端子的線腳，以及一連接該二線腳的圈繞本體，該電 感元件製造方法依序包含下列步驟：（A)備製一端子架， 其包含至少一對端子，該二端子是相間隔；（B)準備至少 201021059 一線圈，將該線圈之二線腳分別連接該二端子，且使其圈 繞本體疋位在該二端子之間；（c)將相結合之該端子架與 該線圈整體夾壓定位在一壓制模具與一下模具之間，並讓 該線圈容置在該壓制模具與該下模具所相配合界定出之 一向上開放的填粉孔穴中；（D)讓該填粉孔穴填充入導磁 粉末，並使該線圈被完全掩埋；以及（E )使一上模具、 該壓制模具與該下模具三者相配合，將該填粉孔穴中的導 磁粉末模壓成一固化包覆塊。 本發明之電感元件製造裝置，能將申請專利範圍第1 項所述組合成一體之該端子架與該線圈夾壓定位，並予進 行導磁粉末之填充與模壓，以成型出將該線圈包埋其中的 該固化包覆塊。該電感元件製造裝置是包含一下模具、一 壓制模具，以及一上模具。該下模具包括一固定模盤，以 及一可升降地設置在該固定模盤下方的活動模座；該固定 模盤具有至少一呈縱向貫穿的下填充空間；該活動模座具 有至少一可升降地緊密插置在該下填充空間中的頂推 桿。該壓制模具是可脫離地壓合在該下模具之固定模盤 上’以相配合壓制住該端子架且使該線圈定位，該壓制模 具具有至少一呈縱向貫穿且對應連通該下填充空間的上 填充空間，該上、下填充空間是對接成一供該線圈容置且 能填充導磁粉末以將該線圈完全掩埋的填粉孔穴。該上模 具包括一可脫離地壓合在該壓制模具上的可動模座，以及 至少一突設在該可動模座之一下表面且可脫離地緊密插 置在該上填充空間中的模壓桿’該模壓桿能將該填粉孔穴 201021059 中的導磁粉末壓鑄成該固化包覆塊。 本發明之功效在於，將相結合之線圈與端子‘架移至壓 制模具與下模具間時，壓制模具與下模具主要是相配合將 端子架緊密壓制住，並使線圈懸置在填粉孔穴中，讓線圈 在端子架的穩固支撐下，不會於導磁粉末之填倒或粉末冶 金模壓成形過程中產生偏移，藉以提高所製造電感元件的 • 品質與良率。並可藉此達成一次製程可方便成排成型多個 • 元件的功效。 鲁 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之一個較佳實施例的詳細說明中，將可 清楚的呈現。 如圖4、圖5與圖9所示，本發明之電感元件製造裝 置2的該較佳實施例，包含一下模具21、一壓制模具、 一上模具23，以及一熱處理單元24。 該下模具21包括一固定模盤211，以及一可升降地設 • 置在該固定模盤211下方的活動模座212。該固定模盤211 具有五相間隔且呈縱向貫穿的下填充空間213，每一下填 充空間213的橫截面是為正四方形；該活動模座212具有 五分別可升降地緊密插置在該五下填充空間213中的頂推 桿214,每一頂推桿214是能封閉所相對應下填充空間 的下開口’並控制該下填充空間213的可用容積大小，例 如，當該頂推桿214下移時，該下填充空間213的可用容 積增大，反之，當該頂推桿214上移時，該下填充空間 7 201021059 的可用容積便縮小。 該壓制模具22是為盤狀，其可壓合在該下模具2 固定模盤211上，並具有五相間隔且呈縱向貫穿的 上填充” 221的橫截面是為正四方形。 在該壓制模具22壓合於該固定模盤211上時，該五上填 空間221是能分別對應連通該固定模盤2ιι的五下填充空 間2U，而且，每一上填充空間221能與所相對應下填： 空間對接成-呈下封閉上開放狀的填粉孔穴加：換 f話說’隨著該下模具21之頂推桿2U的升降作動，便 旎控制填粉孔穴222的可用容積大小。 該上模具23包括-可合在該壓制模具22之一頂面 的可動模座23 1 ’以及五相間隔地向下突伸設置在該可 動模座231之一底面的㈣桿加。在該可動模座231壓 合在該壓制模具22上時，該五模廢桿232是分別緊密插 置入該壓制模具22之五上填充空間221 _，再者，每一 模壓桿232的長度是小於所相對應上填充空$ 221的深 度；即，若每一模壓桿232的長度是匕毫米（麵），而每 上填充工間221的深度是H毫米，貝1，每一模壓桿232 在所對應上填充空Μ 221中的插伸深度是固定在l毫米 時’其便小於該上填充空間211的深度米者。 該熱處理單兀24包括一加熱器241，以及一容置在該 加熱器241中的夹具242。該夾具242包括一概呈橫〇型 的基座243 ’以及五相間隔排列在該基座243上的可伸縮 壓桿244。本實施例中，該加熱器241是一烤箱。 201021059 如圖3~圖9所示，本發明之電感元件製造方法的該較 佳實施例，是依序包含步驟（A)〜⑺，主要利用上述電 感元件製造裝置2,以-次成型出如圖1〇所示之排組成一 體的五個電感元件4。其中，每個電感元件4是包含一呈 扁平矩方體狀㈣化包覆塊41、—包埋在㈣化包覆塊 W中的線圈42、-塞置在該線圈42中且—併包埋在該固 • 化包覆塊41中的金屬製導磁柱43,以及二成對且排呈一 - ㈣地突伸在該固化包覆塊4丨外的金屬製端子44;該線 _ 圈42具有一分別連接該二端子44的線腳，以及一連 接該二線腳421且供該導磁柱43塞置其中的圈繞本體 422 〇 如圖3所示，首先進行步驟（A):備製一長條狀的端 子架A。所預先成型之該端子架a是包含一矩框形的框架 體al、五對間隔排列地跨置在該框架體ai中的端子44， 以及四跨置在該框架體al中且交錯排列在該五對端子44 之間的結構肋a2 ;成對之二端子44是排成一字型，每一 攀 端子44是概呈Y字型片狀且具有二接點44丨、442，該二 端子44的接點441、442是隔空相對的。 接著’進行步驟（B):先將該五線圈42分別固定在 該多數對端子44上’使每一線圈42的二線腳421是分別 連接所相對應的二端子44，特別是，該二線腳421是分別 焊接在該二端子44之隔空斜向對應的二接點441、442 上’並讓該圈繞本體422是懸置在該二端子44之間。之 後’再將該五導磁柱43分別插塞並黏固在該五線圈42之 201021059 圈繞本體422中。 另要說明的是，在將該五線圈42分別焊固在該五對 端子44上時，通常，因線圈“之二線腳421的位置可能 不會剛好對準所欲焊接之隔空斜向對應的二接點441、442 處故線圈42之二線腳421便必須被迫旋移調整，因而 造成線圈42内部蓄積一股抗形變應力。由於此種抗形變 應力可能有造成端子44移位與框架體&1扭曲之虞，故透. 過該多數結構肋a2的設計，便能夠強化該框架體ai與該 五對端子44間的結構穩定性，以有效抗除上述端子架A參 的變形疑慮。 如圖4與圖5所示’進行步驟（c):見圖4,先將相 結合之端子架A、五線圈42與該五導磁柱43整體嵌放至 該下模具21之固定模盤211的一頂面上，這時候，該端子 架A (是包含圖3所示的該框架體“、該五對端子與 該四結構肋a2等元件）整體是平嵌放置在該固定模盤2ιι 的頂面上的凹溝215中，且該五線圈42與五導磁柱43則 是分別懸置在該固定模盤21丨之五下填充空間213的頂部 · 處。見圖5,再將該壓制模具22往該下模具21方向下壓， 使該端子架A是緊密地壓制定位在該壓制模具22與該固 定模盤211之間，而該五線圈42與該五導磁柱43則是分 別穩固地懸置在該五填粉孔穴222中，也就是每一線圈42 . 與所相對應導磁柱43是近乎位在所相對應上、下填充空 間221、213的對接處。 如圖6所示’進行步驟（D):讓每一填粉孔穴222填 10 201021059 充入導磁粉末（合右拍 "*、鐵與黏合劑等成分），所填入導 磁粉末覃是小於填粉孔穴 札八222的可用容積，並足以讓綠願 42與導磁柱43被完全掩埋。 …線圈 • · 如圖7所示，進杆牛 壓制槎具29 士 控制該上模具23往該 壓制模具22方向下壓，使人 ^了動模座231壓合在該壓制 模具22之頂面上，丨卜卜卩主 上此時，該五模壓桿232便會分別插伸 入該壓制模具22之五上填 伸 具兄二間221中’以將每一填粉BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an inductor element and a manufacturing apparatus thereof, and particularly to a method of manufacturing an inductor element using a powder metallurgy press molding method and a manufacturing apparatus therefor. [Prior Art] As shown in Figure 1 and Figure 2, the applicant's M278046 "Electrical and Sensing Component" new patent case, the disclosed inductive component 1 includes a coil. A metal magnetic pole 12 in the coil 11 and a flat block-shaped covering block 13 in which the coil 11 and the magnetic pole 12 are embedded. The coil 11 has two wire legs respectively extending out of the covering block 13 and bent on a bottom surface of the covering block 13 , and a connecting wire 111 for connecting the two wire legs 111 . The post 12 is tucked and encased in the wrap body 13 in the wrap body 13. In addition, the manufacturing device for manufacturing the above-mentioned inductance element 1 comprises a lower mold 3, and a mold which can be press-fitted onto the lower mold 3, and the lower mold 3 includes a top surface depression. a lower mold base 31 of the cavity 32, a lower mold core 33 fixed in the lower mold base 31 and located at the bottom surface of the lower mold cavity 32, and a movable mold inserted into the lower mold core 33 And the jacking stalk 34 can be extended upward into the lower cavity 32. The lower mold core 33 has two slots 35 which are recessed and formed at opposite sides of the top surface thereof and communicate with the lower mold hole 32. The upper mold 5 includes an upper mold base 51 that can be press-fitted to the top surface 201021059 of the lower mold base 31, and an upper mold core 52 that is longitudinally movable in the upper mold base 51. The upper mold base 51 has an upper mold cavity 53 penetrating up and down and corresponding to the lower mold cavity 32, and two feed passages 54 extending obliquely and bilaterally symmetrically communicating the upper mold cavity 53. The upper mold core 52 It is possible to move up and down in the upper mold cavity 53 and further extend into the lower mold cavity 32. Therefore, the process of manufacturing the inductive component by using the manufacturing apparatus is mainly as follows: First, 'the coil 11 is placed in the lower cavity 32 before the upper and lower molds 3, 5 are not correspondingly capped, and the The end portions of the two upright wire legs 111 are respectively inserted into the two slots 35 of the lower mold core 33 so that the ring is suspended around the body 112 in the lower cavity 32. Then, an appropriate amount of magnetic conductive powder is poured into the lower mold cavity 32, and the amount of magnetic conductive powder is approximately around the bottom end of the body 112, and the magnetic conductive column 12 is plugged into the coiled body 112. Inside. Then, the upper mold base is pressed against the top surface of the lower mold base 31, and the magnetic conductive powder is continuously poured through the two feed passages 54 to make the coil 11 (except for the end portion of the wire leg lu). The magnetic conductive powder 12 and the like are completely buried by the magnetic conductive powder. Then, the upper mold core 52 is pressed down and passed into the lower mold cavity 32 to die-cast the magnetic conductive powder contained in the lower mold cavity 32 (four) into a solidified coating block 13, at this time, the coil 11 (except for the end portion of the lead leg iu), the magnetic conductive column 12 and the like are embedded in the covering block 13. Finally, the upper mold 5 is moved upward to move away from the lower mold 3, and the top push rod 34 of the lower mold 3 is controlled to push up on the bottom surface of the covering block 13, so that the covering block 13 and the coil are The wire of the u talks ui out of the 201021059 lower die cavity 32 and is taken away from the 'after' and then the end portions of the two wire legs 1^ are bent toward each other to be embedded on the bottom surface of the cover block 13, and the completion is completed. The fabrication of the inductive component 1. However, the inventor of the present invention found that 'in the manufacturing process of the inductive element 1', since only the end portion of the lead wire of the coil 11 is inserted into the slot 35 of the lower die 33, the coil is made The loop around the body is suspended in the lower mold cavity 32 under the condition that the support is weak, so that the coil around the body 112 may be caused during the secondary magnetic powder filling process and the magnetic powder powder die casting process. The phenomenon of offset, that is, the coiled body 112 of the fabricated inductive component is more difficult to accurately control is located at the center of the covering block 13, so that the quality and the goodness of the inductive component are affected. rate. Moreover, the upper uncovering method can only mold individual components at one time, and it is difficult to form a plurality of components in a row. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an inductor element manufacturing method and apparatus therefor that effectively improve the quality and yield of an inductive component produced. Thus, in the method of manufacturing an inductive component of the present invention, the inductive component comprises a cured clad block, a coil embedded in the clad block, and a terminal extending in pairs in the outer portion of the cured clad block. The coil has two legs respectively connected to the two terminals, and a wound body connecting the two legs. The manufacturing method of the inductive component sequentially comprises the following steps: (A) preparing a terminal frame, which comprises at least one pair of terminals, The two terminals are spaced apart; (B) preparing at least a coil of 201021059, connecting the two legs of the coil to the two terminals respectively, and clamping the coil around the body between the two terminals; (c) combining the two terminals The terminal frame and the coil are integrally clamped between a pressing mold and a lower mold, and the coil is received in the pressing mold and the lower mold to define one of the upwardly filling powder filling holes; (D Causing the powder filling hole into the magnetic conductive powder and completely burying the coil; and (E) cooperating an upper mold, the pressing mold and the lower mold to magnetically conduct the powder filling hole Powder molding A cured cover block. In the inductor component manufacturing apparatus of the present invention, the terminal frame and the coil are integrally positioned and integrated with the coil according to the first aspect of the patent application, and the magnetic conductive powder is filled and molded to form the coil package. The cured coating block buried therein. The inductive component manufacturing apparatus includes a lower mold, a press mold, and an upper mold. The lower mold includes a fixed mold plate, and a movable mold base that is vertically disposed below the fixed mold plate; the fixed mold plate has at least one lower through space filled in a longitudinal direction; the movable mold base has at least one movable height The push rod is tightly inserted in the lower filling space. The pressing mold is detachably press-fitted on the fixed mold plate of the lower mold to press and hold the terminal frame in a cooperative manner, and the pressing mold has at least one longitudinally penetrating and correspondingly communicating the lower filling space. The upper filling space is a powder filling hole that is butted to be accommodated in the coil and can be filled with magnetic conductive powder to completely bury the coil. The upper mold includes a movable mold base detachably press-fitted on the pressing mold, and at least one molded rod protruding from a lower surface of the movable mold base and detachably tightly inserted in the upper filling space The molded rod can die-cast the magnetic conductive powder in the powder filling hole 201021059 into the solidified coating block. The effect of the invention is that when the combined coil and terminal 'frame is moved between the pressing mold and the lower mold, the pressing mold and the lower mold are mainly matched to closely press the terminal frame, and the coil is suspended in the filling hole. In the case of the coil frame under the stable support of the terminal frame, it will not be offset during the filling of the magnetic conductive powder or the powder metallurgy molding process, thereby improving the quality and yield of the manufactured inductive component. It can be used to achieve a process that can easily form multiple components in a row. The above and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the preferred embodiments. As shown in Figs. 4, 5 and 9, the preferred embodiment of the inductive component manufacturing apparatus 2 of the present invention comprises a lower mold 21, a pressing mold, an upper mold 23, and a heat treatment unit 24. The lower mold 21 includes a fixed mold 211, and a movable mold base 212 that is movably disposed below the fixed mold 211. The fixed mold plate 211 has a five-phase interval and a longitudinally penetrating lower filling space 213, and each of the lower filling spaces 213 has a square cross section; the movable mold base 212 has five vertically movable and closely inserted in the five The jacking rods 214 in the filling space 213, each of the jacking rods 214 is a lower opening that can close the corresponding lower filling space and control the available volume of the lower filling space 213, for example, when the jacking rod 214 is under When moving, the available volume of the lower filling space 213 is increased. Conversely, when the pushing rod 214 is moved up, the available volume of the lower filling space 7 201021059 is reduced. The pressing mold 22 is in the form of a disk which is press-fitted to the lower mold 2 fixing die 211, and has a five-phase spacing and a longitudinally penetrating upper filling" 221 whose cross section is a square shape. When the pressure is applied to the fixed mold plate 211, the five upper filling spaces 221 are respectively corresponding to the five lower filling spaces 2U of the fixed mold plate 2, and each upper filling space 221 can be correspondingly filled. : The space is butted into a closed-filled open-filled hole. In other words, if the lifting of the top pusher 2U of the lower mold 21 is performed, the available volume of the filling hole 222 is controlled. The mold 23 includes a movable mold base 23 1 ' which is engageable on one of the top surfaces of the press mold 22 and a (four) rod which is disposed downwardly from the bottom surface of the movable mold base 231 at five intervals. In the movable mold When the seat 231 is pressed against the pressing mold 22, the five-die waste rod 232 is closely inserted into the filling space 221 _ of the pressing mold 22, and the length of each of the molding rods 232 is smaller than the phase. Corresponding to the depth of filling the empty $ 221; that is, if each of the molded rods 232 The length is 匕 mm (face), and the depth of each upper filling chamber 221 is H mm, and the displacement of each of the embossing rods 232 in the corresponding filled space 221 is fixed at 1 mm. It is smaller than the depth of the upper filling space 211. The heat treatment unit 24 includes a heater 241, and a clamp 242 housed in the heater 241. The clamp 242 includes a substantially horizontal base 243. And a retractable pressing rod 244 which is arranged in five stages at intervals on the base 243. In the present embodiment, the heater 241 is an oven. 201021059 As shown in FIGS. 3 to 9, the manufacturing method of the inductive element of the present invention In the preferred embodiment, the steps (A) to (7) are sequentially included, and the inductive component manufacturing apparatus 2 is mainly used to form five inductive components 4 integrally formed as shown in FIG. Each of the inductive elements 4 includes a flat rectangular body (four) cladding block 41, a coil 42 embedded in the (four) cladding block W, - plugged in the coil 42 - and embedded in The metal magnetically conductive column 43 in the solidification cladding block 41, and the two pairs are arranged in a one-(four) ground a metal terminal 44 protruding from the curing cover block 4; the wire coil 42 has a wire connecting the two terminals 44, and a wire 421 is connected to the magnetic pole 43 The winding body 422 is first shown in Fig. 3. First, the step (A) is performed: preparing a long terminal frame A. The pre-formed terminal frame a is a frame body including a rectangular frame, and five a terminal 44 spanned in the frame body ai, and a structural rib a2 spanned in the frame body a1 and staggered between the five pairs of terminals 44; the pair of terminals 44 are arranged In a single shape, each of the climbing terminals 44 has a substantially Y-shaped sheet shape and has two contacts 44A and 442. The contacts 441 and 442 of the two terminals 44 are opposed to each other. Then, the step (B) is performed: firstly, the five coils 42 are respectively fixed on the plurality of pairs of terminals 44. The two legs 421 of each coil 42 are respectively connected to the corresponding two terminals 44, in particular, the two legs. 421 is soldered to the two contacts 441, 442 corresponding to the diagonally opposite sides of the two terminals 44, and the coil around the body 422 is suspended between the two terminals 44. Thereafter, the five magnetic columns 43 are respectively plugged and adhered to the body of the five coils 42 around the body 422. It should be noted that when the five coils 42 are respectively soldered to the five pairs of terminals 44, usually, the position of the two legs 421 of the coil may not be exactly aligned with the oblique direction of the space to be welded. At the two contacts 441, 442, the two legs 421 of the coil 42 must be forced to adjust the rotation, thereby causing a deformation resistance stress to be accumulated inside the coil 42. Since the deformation resistance stress may cause the terminal 44 to shift and the frame After the body & 1 is distorted, the design of the plurality of structural ribs a2 can enhance the structural stability between the frame body ai and the five pairs of terminals 44 to effectively resist the deformation of the terminal frame A As shown in FIG. 4 and FIG. 5, step (c): see FIG. 4, the terminal frame A, the five coils 42 and the five magnetic columns 43 are integrally embedded into the lower mold 21. a top surface of the die plate 211, at this time, the terminal frame A (which includes the frame body shown in FIG. 3, the five pairs of terminals and the components such as the four-structure rib a2) are integrally placed in the fixing The groove 215 is on the top surface of the die plate 2 ιι, and the five coils 42 and the five magnetic columns 43 are divided into Suspending the fixed die plate 213 to fill the space at the top of the 500 · 21 of Shu. Referring to FIG. 5, the pressing mold 22 is pressed downwardly in the direction of the lower mold 21, so that the terminal frame A is tightly pressed and positioned between the pressing mold 22 and the fixed mold 211, and the five coils 42 and the The five magnetic columns 43 are respectively stably suspended in the five powder filling holes 222, that is, each coil 42. The corresponding magnetic column 43 is adjacent to the upper and lower filling spaces 221, The docking point of 213. As shown in Figure 6, 'Step (D): Fill each filling hole 222 with 10 201021059 Fill the magnetically conductive powder (with right-handed "*, iron and binder, etc.), filled with magnetically conductive powder覃It is smaller than the available volume of the powder filling hole 832, and is sufficient for the green 42 and the magnetic column 43 to be completely buried. ...coil • · As shown in Fig. 7, the rod-pressing cooker 29 controls the upper mold 23 to be pressed in the direction of the press mold 22, so that the movable mold base 231 is pressed against the top surface of the press mold 22. On the other hand, at this time, the five-molded plunger 232 will be inserted into the five of the pressing molds 22, and the two of the two molds 221 will be inserted to fill each powder.
孔穴222中的導磁粉末藉粉末冶金模壓成型的方式壓鑄成 型為固化包覆塊4卜而讓該線圈42與該導磁柱Μ能居中 :偏倚地被完全包埋在該固化包覆塊41巾，至此，即已 元成電感元件4的整體結構。 於步驟（D)、（E)的過程中，由於該端子架入整體是 緊密炎壓定位在該壓制模具22與該下模具21的固定模盤 211之間，能提供線圈42穩固的支撐定位作用，故在導磁 粉末填充入填粉孔穴222與被粉末冶金模壓成形時，可有 效確保線圈42不會產生偏移。 如圖8與圖9所示，進行步驟（F):見圖8，:控制該 上模具23與該壓制模具22上升以遠離該下模具21，並讓 該下模具21之頂推桿214進一步地向上升移以將該五固 化包覆塊41同步頂推出該五卞填充空間213外，同時該 端子架A會一併被頂離該固定模盤211之頂面，這時候， 便可見五個排組成一體的電感元件4浮升至該固定模盤 211的上方處’以能供輕鬆一次取離多件元件。 見圖9，把排組成一體的五個電感元件4脫模後，續 11 201021059 將之夾固定位在該夹具242上並予送進入該加熱器241 中’使該五電感元件4的固化包覆塊41是分別被夾壓在 該基座243冬一底壁與該五可伸縮壓桿244之間，每一可 伸縮壓桿244會施予所相對應電感元件4之固化包覆塊41 彈性壓抵作用。主要是，在該加熱器241開始作動以對電 感元件4進行熱改質處理的過程中，由於固化包覆塊41 與包埋其中之線圈42兩者的熱膨脹係數差異，為了避免 -固化包覆塊41之結構形變過於劇烈甚至產生裂痕的狀 況’利用可伸縮壓桿244所施予之彈性壓抵作用，可使所 〇 述不良狀況獲得控制與改善，並有效提高電感元件4之品 質與良率。 如圖10所示，最後，排組成一體的五個電感元件4 於凡成熱處理後，進一步施予裁切，以使該五個電感元件 4被裁離該端子架A之框架體al與結構肋a2，而能各自 獨立。 要補充說明是’當然，本發明之電感元件製造方法及 其製造裝置也可以一次成型出一個電感元件4,這時候，〇 該端子架A只需包含一對端子44，相應地，該下模具21 之下填充空間213與頂推桿214、該壓制模具22之上填充 空間221、該上模具23之模壓桿232，與該夾具242之可 伸縮壓桿244等構件的數量便都只要一個即可。所以，有 - 關電感元件4的一次產製成型量，及上述構件的相對應數 量並不偈限於本實施方式所載。 綜上所述，本發明之電感元件製造方法及其製造裝 12 201021059 置，能一次成型出多個排組成一體的電感元件4 :，且增加 成品取出便利性，並有效提高所產製電感元件4之品質與 良率，故確實能達成本發明之目的。 惟以上所述者，僅為本發明之較佳實施例而已，當不 能以此限定本發明實施之範圍’即大凡依本發明申請專利 範圍及發明說明内容所作之簡單的等效變化與修飾，皆仍 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 圖1是一成型示意圖，說明本案申請人之第M278〇46 號「電感元件」新型專利案，其電感元件的成型過程； 圖2是一剖視圖，說明上述該電感元件的結構； 圖3是一立體圖，說明本發明之電感元件製造方法的 較佳實施例’是將-端子架、多數線圈與多數導磁柱組 合成一體； 圖4疋結構不意圖，說明該較佳實施例將相結合之 該端子架、該多數線圈與該多數導磁柱整體錢到-下模 具的一固定模盤上； 圖5是一結構示意圖，說明該較佳實施例將一壓制模 具壓合在該固定模盤上； 圖6是一結構示意圖，說明該較佳實施例於每—填充 粉孔中倒人導磁粉末，將其中的線圈與導雜完全掩埋； 圖7疋、構tf意圖，說明該較佳實施例將一上模具 壓合在㈣㈣具上’使每—填充粉孔巾的導磁粉末壓禱 成固化包覆塊； 13 201021059 圖疋構示意圖，說明該較佳實施例是使該下模 具之一活動模座上升，以將該端子架與該多數固化包覆塊 頂離該固定模盤； 圖9是一結構示意圖，說明該較佳實施例是將脫模後 之端子架與固化包覆塊整體移放至一熱處理單元中；以及 圖10是一立體圖，説明該較佳實施例所製出之排組 成一體的多數電子元件。 ❹The magnetic conductive powder in the cavity 222 is die-cast by powder metallurgy molding to form the solidified coating block 4, so that the coil 42 and the magnetic conductive column can be centered: the embedded cladding block 41 is completely embedded in the biasing manner. The towel, at this point, has been integrated into the overall structure of the inductive component 4. In the process of the steps (D) and (E), since the terminal frame is integrally positioned between the pressing die 22 and the fixed die plate 211 of the lower die 21, the coil 42 can be stably supported and positioned. Therefore, when the magnetic conductive powder is filled into the powder filling hole 222 and is subjected to powder metallurgy molding, it is possible to effectively ensure that the coil 42 does not shift. As shown in FIG. 8 and FIG. 9, step (F) is performed: see FIG. 8, the upper mold 23 and the pressing mold 22 are controlled to rise away from the lower mold 21, and the pusher 214 of the lower mold 21 is further advanced. The ground is moved upward to push the five solidified cladding blocks 41 out of the five-filled space 213, and the terminal frame A is also pulled away from the top surface of the fixed mold plate 211. The row of integral inductive elements 4 floats above the fixed die plate 211 to enable easy removal of multiple components at a time. Referring to FIG. 9, after the five inductive components 4 integrated into one row are demolded, 11 201021059 is fixed on the clamp 242 and fed into the heater 241 to make the curing package of the five inductive components 4. The cover 41 is respectively clamped between the bottom wall of the base 243 and the five retractable pressing rods 244, and each of the retractable pressing rods 244 applies a solidified covering block 41 of the corresponding inductive element 4. Elastic pressure. Mainly, in the process in which the heater 241 starts to operate to thermally reform the inductor element 4, due to the difference in thermal expansion coefficient between the solidified clad 41 and the coil 42 embedded therein, in order to avoid - cure coating The structural deformation of the block 41 is too severe or even cracked. The elastic pressing force exerted by the retractable pressing rod 244 can control and improve the described poor conditions, and effectively improve the quality and good quality of the inductive component 4. rate. As shown in FIG. 10, finally, the five inductive elements 4, which are integrated into one body, are further subjected to cutting after heat treatment, so that the five inductive elements 4 are cut off from the frame body a and structure of the terminal frame A. The ribs a2 can be independent of each other. It should be added that, of course, the inductor element manufacturing method and the manufacturing apparatus thereof of the present invention can also form one inductor element 4 at a time. At this time, the terminal frame A only needs to include a pair of terminals 44, and correspondingly, the lower mold 21, the filling space 213 and the pushing rod 214, the filling space 221 above the pressing mold 22, the molding rod 232 of the upper mold 23, and the retractable pressing rod 244 of the clamp 242 are all required by one can. Therefore, the primary production amount of the -inductive element 4 and the corresponding amount of the above-described members are not limited to those in the present embodiment. In summary, the manufacturing method of the inductive component of the present invention and the manufacturing device 12 201021059 can form a plurality of integrated inductive components 4 at one time, and increase the convenience of taking out the finished product, and effectively improve the produced inductive component. The quality and yield of 4, indeed, can achieve the object of the present invention. However, the above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention, All remain within the scope of the invention patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a molding process of a novel type of "inductive component" of the applicant's No. M278〇46, the molding process of the inductor component; FIG. 2 is a cross-sectional view showing the above-mentioned inductor component 3 is a perspective view showing a preferred embodiment of the method for manufacturing an inductive component of the present invention, which is a combination of a terminal block, a plurality of coils and a plurality of magnetic columns; FIG. 4 is not intended to illustrate the preferred embodiment. In an embodiment, the terminal frame, the plurality of coils and the plurality of magnetic poles are integrated into a fixed mold plate of the lower mold; FIG. 5 is a schematic structural view showing that the preferred embodiment presses a pressing mold Figure 6 is a schematic structural view showing the preferred embodiment in which the magnetically permeable powder is poured into each of the filled powder holes, and the coil and the conductive impurities are completely buried; Fig. 7 It is intended that the preferred embodiment presses an upper mold onto (4) (4) with the magnetic powder of each of the filling powder apertures being pressed into a solidified coating block; 13 201021059 The movable mold base of the lower mold is raised to lift the terminal frame and the plurality of solidified covering blocks away from the fixed mold; FIG. 9 is a schematic structural view showing that the preferred embodiment is after demolding The terminal frame and the curing cover block are integrally transferred into a heat treatment unit; and FIG. 10 is a perspective view showing a plurality of electronic components integrally formed by the preferred embodiment. ❹
14 201021059 【主要元件符號說明】 2 電感元件製造裝置 243 基座 21 下模具 244 可伸縮壓桿 211 固定模盤 4 電感元件 212 活動模座 41 固化包覆塊 213 下填充空間 42 線圈 214 頂推桿 421 線腳 22 壓制模具 422 圈繞本體 221 上填充空間 43 導磁柱 222 填粉孔穴 44 端子 23 上模具 441 接點 231 可動模座 442 接點 232 模壓桿 A 端子架 24 熱處理單元 al 框架體 241 加熱器 a2 結構肋 242 夾具 ❹ 1514 201021059 [Explanation of main component symbols] 2 Inductive component manufacturing device 243 Base 21 Lower die 244 Retractable press bar 211 Fixed die plate 4 Inductive component 212 Movable die block 41 Solidified cover block 213 Underfill space 42 Coil 214 Push rod 421 Wire 22 Pressing die 422 Circle around body 221 Filling space 43 Magnetic column 222 Filling hole 44 Terminal 23 Upper die 441 Contact 231 Movable die holder 442 Contact 232 Molded rod A Terminal frame 24 Heat treatment unit a Frame body 241 Heating A2 structural rib 242 fixture ❹ 15