CN212303363U - Processing device for encapsulated high-frequency transformer - Google Patents

Processing device for encapsulated high-frequency transformer Download PDF

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Publication number
CN212303363U
CN212303363U CN202021522987.0U CN202021522987U CN212303363U CN 212303363 U CN212303363 U CN 212303363U CN 202021522987 U CN202021522987 U CN 202021522987U CN 212303363 U CN212303363 U CN 212303363U
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China
Prior art keywords
transformer
support
mould
fixedly connected
semi
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CN202021522987.0U
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Chinese (zh)
Inventor
潘秀丽
张鸿飞
吴昊
孙小丽
田文涛
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Baoyan Electrical Co ltd Shandong
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Baoyan Electrical Co ltd Shandong
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Abstract

The utility model relates to a processing device of a potting high-frequency transformer, which solves the technical problems that the operation of the potting process of the prior potting transformer is complicated, the efficiency is low, and the epoxy glue in the shell of the product is easy to generate bubbles, and comprises a potting high-frequency transformer demoulding tool and a mould, wherein the potting high-frequency transformer demoulding tool comprises a base, a top supporting plate, a cylinder, a sliding plate, a top pressing block, a support and a support connecting plate, the cylinder is connected with the top supporting plate, a telescopic rod of the cylinder passes through the top supporting plate, the sliding plate is fixedly connected with the telescopic rod of the cylinder, the support connecting plate is fixedly connected with the base, the support is fixedly connected with the support connecting plate, two guide rods are fixedly connected between the top supporting plate and the support connecting plate, the two guide rods respectively pass through the two sides of the sliding plate, the top pressing block, the mould is box-like, and the mould is equipped with the surrounding edge all around, and the bottom of mould is equipped with a plurality of transformer semi-manufactured goods standing grooves. The method can be widely applied to processing encapsulated transformers.

Description

Processing device for encapsulated high-frequency transformer
Technical Field
The utility model relates to an ammeter power supply technical field particularly, relates to an encapsulation formula high frequency transformer processingequipment.
Background
It is well known that in the field of electrical appliances such as electric meters, transformers in power supply switching power supplies are important components. The existing high-frequency transformer is composed of a framework, a magnetic core, a coil winding and the like, for example: the chinese utility model patent with patent number 201620188537X discloses a transformer; the chinese utility model with patent number 2012206186763 also discloses a transformer bobbin. Along with the miniaturized development of high frequency transformer, the application of encapsulation formula high frequency transformer is more and more extensive, for example patent number is 2012202680557, and the utility model patent of the high frequency transformer who is named as a novel embedment structure just discloses an embedment structure transformer, for example patent number is 2019210241835, and the utility model patent of name for novel high frequency embedment transformer also discloses an encapsulation formula transformer.
In the production process of the potting type transformer, the epoxy resin potting process is performed through a potting machine, for example, 2018204026748, the name of which is automatic potting equipment, and the name of 201821388267.2, which is a full-automatic potting device for the transformer, also discloses potting equipment. A plurality of semi-manufactured products of transformer that wait to the encapsulating are placed in the location tray, and the encapsulating machine pours epoxy into the semi-manufactured goods of transformer's plastic casing in, and the function of insulating isolation structure has just been realized protecting inside magnetic core, coil to the intussuseption epoxy of plastic casing intussuseption, however, the encapsulating operation is more complicated, and efficiency is lower, and the glue in the plastic casing produces the bubble easily.
Disclosure of Invention
The utility model is to solve the encapsulating technology operation complicacy of current encapsulation formula transformer, efficiency is lower, and the epoxy in the product shell glues the technical problem who produces the bubble easily, provides an easy operation, efficient, avoids the encapsulation formula high frequency transformer processingequipment who produces the bubble.
The technical scheme of the utility model is, including encapsulation formula high frequency transformer drawing of patterns frock and mould, encapsulation formula high frequency transformer drawing of patterns frock includes the base, the top backup pad, the cylinder, the sliding plate, the top briquetting, the support connecting plate, four spinal branch posts and two guide bars, the top backup pad is through four spinal branch posts and base fixed connection, the cylinder is connected with the top backup pad, the telescopic link of cylinder passes the top backup pad, the sliding plate is fixed connection with the telescopic link of cylinder, the support connecting plate passes through support fixed connection on the base, the support is fixed connection with the support connecting plate, two guide bars fixed connection are between top backup pad and support connecting plate, two guide bars pass the both sides of sliding plate respectively, the top briquetting is equipped with a plurality of pressure heads, the support is equipped with a plurality of transformer holding tanks, the; the number of the pressure heads is the same as that of the transformer accommodating grooves;
the mould is box-shaped, surrounding edges are arranged on the periphery of the mould, and a plurality of transformer semi-finished product placing grooves are formed in the bottom of the mould; when the mold is buckled on the support, the transformer semi-finished product placing groove corresponds to the transformer accommodating groove of the support up and down; the material of the mould is polypropylene.
Preferably, the number of indenters is 24, distributed in four rows of 6 each; the number of the transformer accommodating grooves is 24, the transformer accommodating grooves are distributed in four rows, and each row is provided with 6 transformer accommodating grooves; the number of the transformer semi-finished product placing grooves is 24, the transformer semi-finished product placing grooves are distributed in four rows, and each row is provided with 6 transformer semi-finished product placing grooves.
The utility model has the advantages that compared with the prior art that the plastic shell is filled with glue, the plastic shell component is saved, after the glue is filled, the epoxy glue is solidified to form a shell, and the magnetic core and the coil are completely wrapped by the shell; no air bubble exists in the shell, and the product quality is improved. The product which is taken out of the die and completes the glue pouring operation is simple and convenient to operate and high in efficiency. The process of filling the epoxy glue is simple and the efficiency is high. The utility model discloses specially adapted processes miniature embedment transformer, for example the length and width height is 26mm, 22mm, 23mm, and the length and width height is 32mm, 27mm, 24 mm.
Further features and aspects of the present invention will become apparent from the following description of specific embodiments with reference to the accompanying drawings.
Drawings
FIG. 1 is a perspective view of a mold stripping tool for an encapsulated high-frequency transformer;
FIG. 2 is a rear view of the mold release tool for the potted high-frequency transformer;
FIG. 3 is a right side view of the mold release tool for the potted high-frequency transformer;
FIG. 4 is a perspective view of another view of the mold release tool for the potted high-frequency transformer;
FIG. 5 is a schematic structural view of a pedestal;
FIG. 6 is a perspective view of the mold;
FIG. 7 is a front view of the mold shown in FIG. 6;
FIG. 8 is a top view of the mold shown in FIG. 6;
FIG. 9 is a left side view of the mold shown in FIG. 6;
FIG. 10 is a right side view of the mold shown in FIG. 6;
FIG. 11 is a perspective view of the mold;
FIG. 12 is a schematic view of a mold with a transformer semi-finished product placed therein;
fig. 13 is a schematic view of the mold with the transformer completed product buckled to the support.
The symbols in the drawings illustrate that:
1. the transformer comprises a base, 2. a support column, 3. a top support plate, 4. an air cylinder, 5. a sliding plate, 6. a guide rod, 7. a top pressing block, 7-1. a pressing head, 8. a support, 8-1. a transformer accommodating groove, 9. a support connecting plate, 10. a mould and 13. a transformer semi-finished product.
Detailed Description
The present invention will be described in further detail with reference to the following detailed description of the preferred embodiments with reference to the accompanying drawings.
As shown in fig. 1-11, the potting high-frequency transformer processing device comprises a potting high-frequency transformer demolding tool and a mold, the potting high-frequency transformer demolding tool comprises a base 1, a pillar 2, a top support plate 3, a cylinder 4, a sliding plate 5, guide rods 6, a jacking block 7, a support 8 and a support connecting plate 9, the top support plate 3 is fixedly connected with the base 1 through four pillars 2, the cylinder 4 is installed on the top support plate 3, an expansion link of the cylinder 4 penetrates through the top support plate 3, the sliding plate 5 is fixedly connected with the expansion link of the cylinder 4, the support connecting plate 9 is fixedly installed on the base 1 through a bracket, the support 8 is fixedly connected with the support connecting plate 9, the two guide rods 6 are fixedly connected between the top support plate 3 and the support connecting plate 9, the two guide rods 6 respectively penetrate through two sides of the sliding plate 5, the jacking block 7 is provided with a, the holder 8 is provided with a plurality of transformer receiving slots 8-1. The figure shows that the number of the pressing heads 7-1 of the pressing block 7 is 24, and the pressing heads are distributed in four rows, and each row is provided with 6 pressing heads; the number of the transformer accommodating grooves 8-1 is 24, the transformer accommodating grooves are distributed in four rows, and each row is provided with 6 transformer accommodating grooves; the number of the pressure heads 7-1 is the same as that of the transformer accommodating grooves 8-1, and the pressure heads 7-1 correspond to the transformer accommodating grooves 8-1 up and down.
The mold 10 is substantially box-shaped, the periphery of the mold 10 is provided with a surrounding edge 10-2, and the bottom of the mold 10 is provided with a plurality of transformer semi-finished product placing grooves 10-1. Referring to fig. 11, a plurality of transformer semi-finished product placing grooves 10-1 are protruded from the back of the mold. The number of the transformer semi-finished product placing grooves 10-1 is 24, the transformer semi-finished product placing grooves are distributed according to four rows, each row is provided with 6 transformer semi-finished product placing grooves, and the transformer semi-finished product placing grooves 10-1 correspond to the transformer accommodating grooves 8-1 of the support 8 up and down. The material of the mold 10 is polypropylene (PP), which is beneficial to the separation of the epoxy glue shell of the transformer finished product in the transformer semi-finished product placing groove 10-1 from the mold.
The operation method of the potting type high-frequency transformer processing device is described as follows:
first, 24 transformer semi-finished products 13 are placed in 24 transformer semi-finished product placement slots 10-1 of the mold 10 (as shown in fig. 12), the transformer semi-finished products 13 including a bobbin, a magnetic core, and a coil. Then, the mold 10 is placed into a glue-pouring machine, the glue-pouring machine pours epoxy resin into each transformer semi-finished product placing groove 10-1, after the mold 10 is output from the glue-pouring machine, the epoxy resin is poured into the transformer semi-finished product placing groove 10-1 and is solidified to form a shell, the shell completely wraps the magnetic core and the coil, and then a transformer finished product is formed. Then, as shown in fig. 13, the mold 10 is fastened on the support 8 of the demolding tool, the cylinder 4 is started, the telescopic rod of the cylinder 4 drives the pressing block 7 to move downwards, 24 pressing heads 7-1 of the pressing block 7 press the positions 10-1 of the 24 transformer semi-finished product placing grooves 10-1 of the mold 10, the mold 10 slightly deforms, and the transformer finished products in the transformer semi-finished product placing grooves 10-1 are separated and fall into the transformer accommodating grooves 8-1 of the support 8. Finally, the top press block 7 is returned upward to the initial position, and the operator removes the mold 10 by hand and takes out the transformer product in the transformer accommodating groove 8-1.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the present invention, as various modifications and variations will be apparent to those skilled in the art.

Claims (2)

1. A processing device of an encapsulated high-frequency transformer is characterized by comprising an encapsulated high-frequency transformer demoulding tool and a mould, wherein the encapsulated high-frequency transformer demoulding tool comprises a base, a top supporting plate, an air cylinder, a sliding plate, a top pressing block, a support connecting plate, four supporting columns and two guide rods, the top supporting plate is fixedly connected with the base through the four supporting columns, the air cylinder is connected with the top supporting plate, an expansion rod of the air cylinder penetrates through the top supporting plate, the sliding plate is fixedly connected with the expansion rod of the air cylinder, the support connecting plate is fixedly connected onto the base through a support, the support is fixedly connected with the support connecting plate, the two guide rods are fixedly connected between the top supporting plate and the support connecting plate, the two guide rods respectively penetrate through two sides of the sliding plate, the top pressing block is provided with a plurality of pressing heads, the pressure head corresponds to the transformer accommodating tank up and down; the number of the pressure heads is the same as that of the transformer accommodating grooves;
the mould is box-shaped, surrounding edges are arranged on the periphery of the mould, and a plurality of transformer semi-finished product placing grooves are formed in the bottom of the mould; when the mold is buckled on the support, the transformer semi-finished product placing groove corresponds to the transformer accommodating groove of the support up and down; the material of the mould is polypropylene.
2. The potted high frequency transformer fabrication apparatus of claim 1 wherein the number of said headers is 24, distributed in four rows of 6; the number of the transformer accommodating grooves is 24, the transformer accommodating grooves are distributed in four rows, and each row is provided with 6 transformer accommodating grooves; the number of the transformer semi-finished product placing grooves is 24, the transformer semi-finished product placing grooves are distributed in four rows, and each row is provided with 6 transformer semi-finished product placing grooves.
CN202021522987.0U 2020-07-28 2020-07-28 Processing device for encapsulated high-frequency transformer Active CN212303363U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021522987.0U CN212303363U (en) 2020-07-28 2020-07-28 Processing device for encapsulated high-frequency transformer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021522987.0U CN212303363U (en) 2020-07-28 2020-07-28 Processing device for encapsulated high-frequency transformer

Publications (1)

Publication Number Publication Date
CN212303363U true CN212303363U (en) 2021-01-05

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113643891A (en) * 2021-07-15 2021-11-12 洛阳隆盛科技有限责任公司 Transformer core bonding device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113643891A (en) * 2021-07-15 2021-11-12 洛阳隆盛科技有限责任公司 Transformer core bonding device
CN113643891B (en) * 2021-07-15 2024-04-23 洛阳隆盛科技有限责任公司 Transformer magnetic core bonding device

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