1277090 " 九、發明說明： 【發明所屬之技術領域】 毛月係關於一種用以於各種碟片基板上形成既定膜 厚皮膜之碟片製造方法及製造裝置。 【先前技術】 般而5，當對碟片基板形成記錄膜或保護膜等皮膜 係使用旋塗法。此旋塗法係使碟片基板以既定轉速 ^ ^使噴嘴邊從碟片基板之外周側移動至内周側，邊從 貝紫喷出液狀皮膜材料，藉此將皮膜材料螺旋狀地供應至 碟片基板上，利用離心力使皮膜材料延展來形成皮膜。 例如，形成光記錄膜之際所使用之皮膜材料係由溶劑 和色素材料所構成，使溶劑揮發來形成皮膜。這種情形， 1錄膜隨著延展，從内周側向外周側乾燥。還有，通常此 時之乾燥不完全，有數％左右之溶劑殘留在記錄膜中，在 後續之乾燥製程中，將溶劑大致完全除去。本說明書中， • 所明「乾燥」係指旋塗中所產生之乾燥之意。 前述般所形成之記錄膜，係藉由旋轉，從碟片基板内 周向外周延展皮膜材料來形成。此時，僅將轉速保持一定， 則膜厚從内周向外周呈現變厚之傾向。 +為了校正此種膜厚之變化，在碟片基板全面形成同樣 膜厚之記錄膜，至今，提案了各種旋轉模式。業已提案有 例如：從一定低速之初期速度，使得速度隨時間而以一定 T度上升之旋轉模式、或從一定低速之初期速度使得速= 隨時間而以一定梯度上升後，保持某短期間一定轉速，= 5 ΐ277〇9〇 灸又用一疋梯度使轉速上升或下降之旋轉模式（參昭專利 ,,υ;或對時間，使轉速依照某範圍之2次曲線上升之 疋轉模式（參照專利文獻2)等。 專利文獻1 :曰本專利特開平06-004910號公報 專利文獻2 .日本專利特開2〇〇〇_285533號公報 :旋轉模式係從旋轉程式(係預先輸入從各種測定結果 =出之記制之膜厚變化和碟片基板轉速關 =際之製造裝置中，會因為以控制因子組入旋轉程式 中非常困難之製造環境（溫度 ⑽厣 ^ ^ ”、、度^碟片基板之狀態（其 :二 度)、碟片基板之成形條件等之不同，而在碑 二=膜之膜厚出現差異。因此，即使用同一旋轉程 2 ㈣成於碟片基板，光碟之品質仍會變化，不易 製造一致品質之光碟。 《夂化不易 習知，當判斷條件變化時，、 錄膜形成完成時刻之所需時間出/述所形成之記 以其資料和記錄膜之測定數據為乾燥速度， 此努力校正記錄膜膜厚不均句性/·交更旋轉程式，藉 但是，為了校正記錄膜膜厚 環境之狀態嚴格控制—定，將包含〜:性’若不將製造 其溫度、吸水程度等狀態保持…板之成形狀態' 有再引起膜厚變化之位置變動之問題則即使進行校正，仍 又，為了變更旋轉程式，各種诚. 更所需時間變很長，尚有旋轉 t重新修正等，變 而不同之問題。 X之好壞因操作者之能力 6 1277090 【發明内容】 發日見/斤欲解決之譯靡 本發明之課題在於：當採用旋塗法將 基板之際，依據皮膜乾燥狀態之檢測結果，來碟片 板之轉速，藉此’即使成膜條件發生變：更碟片基 持在設定膜厚範圍内。 仍此將皮膜維 1.以解決誤顳夕手巴 本發明之碟片製造方法，且 片基板-邊塗佈皮膜材料並使皮膜物碟 碟片基板上形成皮膜；檢測旋轉中之皮膜❼在5亥 燥區域之邊界的移動；測量乾焊後、c、’區域和未乾 以及，依據該檢測出之邊界移動和該 、布’ 控制該碟片基板之轉速。 、刀布之關係，來 右依本發明，可依據乾燥邊界之移動和膜 係，來控制碟片基板之轉逮，調^刀布關 置之塗膜厚度，故能將最 ；土 、禮方向各位 膜厚節圖h 取、、所仔到之皮膜膜厚維持在所欲 要：二：還有’本發明中所謂碟片係不限定在光碟，只 S將皮膜材料塗佈在圓形基板上使其乾燥而形成皮膜者 制程中：4皮胲之乾煉區域和未乾燥區域之邊界移動之 衣枉干’亦可測定該碟一 皮膜乾燥時間。在控制碟…：向：以上測定位置之 碟M其 土板轉速之製程中，亦可從該 之r 之敎轉開始經過對應各測定位置之皮膜乾燥時間 '丁' ’文更該碟片基板之轉速。若依此構成，僅需檢測出 7 Μ 1277090 預定：測定位置之乾燥狀態即可，故易於控制。 檢測該皮膜之乾燥區域和未乾燥區域之邊 牙壬，亦可具備下述製程：對於 ’夕 1 41 ^ ^ m 、'"皮膜自内周側朝外周側在 是數個^位置，依序檢測出㈣狀g ; 久以及檢測出該皮膜之膜厚超出設定範圍之半=: 又，控制碟片基板轉速之製程， 區域釦去私#广， 刀J * *亥皮Μ之乾燥 置未“區域之邊界到達該超出設定範 位置之際，ft更該碟片基板之轉方6 記錄膜之瞄；将逆丈更5亥轉速後，當該 二膑尽超出該設定範圍時’亦可再變更該轉速。 記錚胺^錄膜之形成中’亦可設置乾燥檢測製程（檢測該 ⑺=二内周側向外周側依序乾燥之狀態）、膜厚測定製程 L二：記錄膜之膜厚)、檢測出該記錄膜之膜厚超出 已圍之位置來計算該位置記錄膜之乾燥時間之製 在該位置之該乾燥時間變更該碟片基板之轉速之 二=a種情形’當皮膜之膜厚達到上限值或下限值時， :’:更轉速加以控制使厚度保持在設定範圍内，故即使發 :兄“件义化、製造碟片基板時條件之變動等，仍能將 皮膜膜厚保持在設定膜厚範圍内。 成待您之控制亦可藉由變更旋轉程式來進行。這種情 形，從能預先設定之碟片基板轉速梯度之許多旋轉模： 中，選擇最㊣的旋轉模式，易於實現既定之轉速梯度。 在榀測皮膜之乾燥區域和未乾燥區域之邊界移動之製 私中亦可利用該皮膜所致光反射率及穿透率中至少一者 之又化來檢測該邊界。但是，本發明不限定此構成，亦可 8 1277090 檢測因乾燥所產生之其 化、靜電容量變化、導電性c皮膜之重量變 射㈣透率等)來檢測出乾;狀態广外之其他能束之反 才欢測皮膜之齡、择γ 程、及、Β ’、πσ 5 口未乾燥區域之邊界移動之製 ?王及測x乾燥後皮膜八 ! ^ 、、厚刀布之製程，係對第II片（η係 以上之任意整數）之 製程，係對第n+a片(:传；數：，控制碟片基板轉速之 板谁；^。、 ，、㊉數，為1以上之整數）之碟片基 。廷種情形，因使用處理 資料，對該碟片基板起算第a片/^碟片基板所得到之 控制，故裝置構成能簡潔化 碟片基板之旋轉進行 程和膜厚分布測量， a值只要藉由在皮膜形成製 置裟私間之時滯來適當設定即可。 又，亦可係對連續之_宏 n+m(m 係常數，$ 丨以 片（例％ n，n+1，n+2··· 累積加以平均化，使…）)，將膜厚分布測量結果 碑片某板_ . / 資料’來控制—定片數後之 石系片暴扳（例如··第n+r片r筏 藉此，萬一僅胜— 片（Γ係較m為大之整數）之旋轉。 曰 疋之碟片基板發生皮膜異常時，亦能減 對控制之影響。 疋此/咸小 檢測皮膜之乾燥區域 程、刺量乾燥後皮媒膜厚;Λ1?區域之邊界移動之製 速之製程，可對同一製程、及控制碟片基叛轉 -碟片基板進行測定和旋：二：仃。這種情形’因針對同 變化。 …疋轉控制’故能對應更急驟之狀態 本發明之碟片製造裝置，其特徵在於， 構，係使碟片基板旋韓·法 靛轉機 轉，I佈機構，係將皮膜材料塗佈至 9 1277090 磲片基板；乾燥檢測機構，係 區域和未乾痒膜旋轉中之乾操 域之邊界移動；膜厚测定機構，係測 邊=之膜厚分布；以及控制機構，係依據所檢乙 =動和膜厚分布之關係，來控制碟片基板之轉速。之 /右依本裝置，則依據乾燥之邊界移動和 係，來控制碟片基板之轉速，、刀之關 各位置之塗膜厚度，故能 方向 所希望之膜厚範圍。.取、、所件到之皮膜膜厚維持在 卿LT下述做法:該控制機構具備旋轉程式化機構， 程式化機構純輪人旋轉程式，該旋轉程式具有複 =表示碟片基板之旋轉時間—轉速特性之旋轉模式 疋轉程式化機構，在形成該皮膜過程中必須變更轉速時， 係對於應變更轉速之位置以後之旋轉模式做變更。 該旋轉機構亦可具備用來載置碟片基板之載台、及以 所需轉速使該載台旋轉之旋轉驅動裝置。 該膜厚測定機構亦可具備判定機構，該判定機構係將 :得到之膜厚資料和預先設定之設定膜厚範圍加以比較， 士出表不膜厚係在碟片基板半徑方向之設定膜厚範圍或範 因？Ί <力 < 机现，该旋轉程式化機構在接收到判定訊號與 來自乾燥檢測機構之乾燥訊號時，乃變更旋轉模式。該旋 :程式化機構亦可具備：⑴乾燥檢測機構，在接收到該判 定-TL號和來自该乾燥檢測機構之乾燥訊號時，計算變更該 旋轉模式之該皮膜乾燥時間；⑼膜厚測定機構，測定該皮 膜之膜厚並輪出膜厚資料；㈣膜厚判定機構，依據該膜 1277090 厚資料和設定膜厚範圍，輸出1277090 " IX. Description of the Invention: [Technical Field of the Invention] Maoyue is a method and apparatus for manufacturing a disc for forming a predetermined film thick film on various disc substrates. [Prior Art] As a general rule, a spin coating method is used to form a film such as a recording film or a protective film on a disc substrate. In this spin coating method, the disk substrate is moved from the outer peripheral side to the inner peripheral side of the disc substrate at a predetermined number of revolutions, and the liquid film material is ejected from the shell purple, whereby the film material is spirally supplied. On the disc substrate, the film material is stretched by centrifugal force to form a film. For example, the film material used for forming the optical recording film is composed of a solvent and a pigment material, and the solvent is volatilized to form a film. In this case, the film is dried from the inner peripheral side to the outer peripheral side as it is stretched. Further, in general, the drying is incomplete at this time, and about several % of the solvent remains in the recording film, and the solvent is substantially completely removed in the subsequent drying process. In this manual, • “Dry” is used to mean the dryness produced by spin coating. The recording film formed as described above is formed by stretching the film material from the inner periphery of the disk substrate by rotation. At this time, only when the number of revolutions is kept constant, the film thickness tends to become thicker from the inner circumference to the outer circumference. + In order to correct such a change in film thickness, a recording film having the same film thickness is formed on the entire disk substrate, and various rotation modes have been proposed so far. For example, the initial speed from a certain low speed is adopted, and the speed is increased by a certain T degree in a rotation mode with time, or the initial speed from a certain low speed is made such that the speed is increased by a certain gradient with time, and a certain short period is maintained. Rotating speed, = 5 ΐ 277 〇 9 moxibustion and using a gradient to make the rotation speed increase or decrease the rotation mode (refer to the patent, υ; or the time, the rotation speed according to a certain range of the second curve rises the reference mode (refer to the patent) Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. 2-285533. = In the manufacturing device where the film thickness change and the disk substrate rotation speed are turned off, the manufacturing environment (temperature (10) 厣 ^ ^ ”, degree ^ disc) which is very difficult to incorporate into the rotation program by the control factor The state of the substrate (the second degree), the molding conditions of the disc substrate, and the like are different, and the film thickness of the film is different. Therefore, the same rotation process 2 (4) is used for the disc substrate, and the optical disc is used. The quality will still change, and it is not easy to manufacture a disc of consistent quality. "It is not easy to know, when the condition is changed, the time required to complete the film formation completion is described by the data and the recording film. The data is the drying speed, and this effort is to correct the film thickness unevenness of the recording film/······················································· The state of the temperature, the degree of water absorption, and the like are maintained. The shape of the sheet is changed. If there is a problem that the position of the film changes again, even if the correction is made, the time required for changing the rotation program becomes longer. There are problems such as re-correction of rotation t, etc. X is good or bad due to the ability of the operator 6 1277090 [Summary of the invention] The problem of the invention is that when the spin coating method is used At the time of the substrate, according to the detection result of the dry state of the film, the rotation speed of the disc plate is used, so that even if the film formation conditions are changed: the disc substrate is held within the set film thickness range. Dimension 1. In order to solve the problem of manufacturing a disc according to the invention, the substrate is coated with a film material and a film is formed on the substrate of the film disc; the film in the rotation is detected in the 5 dry area. The movement of the boundary; after the dry welding, c, 'area and not dry, and according to the detected boundary movement and the cloth, the speed of controlling the disc substrate. The relationship between the knife and the cloth, according to the invention According to the movement of the dry boundary and the film system, the rotation of the disc substrate can be controlled, and the thickness of the coating film which is closed by the knife cloth can be adjusted, so that the film thickness diagram of each of the soil and the direction of the ceremony can be taken. The film thickness of the film is maintained at the desired level: 2: There is also a description in the present invention that the disk system is not limited to the optical disk, and only the coating material is coated on a circular substrate to dry the film to form a film. The drying time of the film can also be determined by the drying of the skin of the dry skin of the skin and the boundary of the undried area. In the process of controlling the disc...: to: the above-mentioned measuring position of the disc M, the speed of the soil plate can also be from the turn of the r to the film drying time corresponding to each measuring position, the Ding's disc substrate The speed of rotation. According to this configuration, only 7 Μ 1277090 is required to be scheduled: the dry state of the measurement position is sufficient, so it is easy to control. The detection of the gingival area of the dry area and the undried area of the film may also have the following process: for the 'Eat 1 41 ^ ^ m , '" the film is from the inner circumference side to the outer circumference side at several positions, The sequence detects (four) shape g; long time and detects that the film thickness of the film exceeds half of the set range =: Again, the process of controlling the rotation speed of the disk substrate, the area deducts the private #广, the knife J * *Heipi dry If the boundary of the area reaches the set-out position, the ft is the target of the recording film of the disc substrate 6; after the reversal of the 5 rpm, when the two 膑 exceed the setting range, The rotation speed can be changed. In the formation of the recording film, the drying detection process can also be set (detecting the state in which (7) = two inner peripheral sides are sequentially dried toward the outer peripheral side), and the film thickness measuring process L: recording film The film thickness is detected, and the film thickness of the recording film is detected beyond the surrounding position to calculate the drying time of the recording film at the position. The drying time at the position changes the rotation speed of the disk substrate. When the film thickness of the film reaches the upper limit or the lower limit, :': more speed plus Controlling the thickness maintained within a set range, so even if the fat: brother "sense of the member, when the variation of manufacturing conditions of the disc substrate and the like, still holding the film thickness of a film thickness within a set range. Your control can also be done by changing the rotation program. In this case, the most accurate rotation mode is selected from a plurality of rotary modes of a disc substrate rotational speed gradient which can be preset, and it is easy to achieve a predetermined rotational speed gradient. The boundary may be detected by at least one of the light reflectance and the transmittance caused by the film in the process of detecting the boundary between the dry region and the undried region of the film. However, the present invention is not limited to this configuration, and it is also possible to detect the change due to drying, the change in electrostatic capacitance, the weight change of the conductive c film (four) permeability, etc., in the case of 8 1277090, and to detect the dryness; The opposite of the beam is to measure the age of the film, choose the gamma process, and the 移动 ', π σ 5 port undried area boundary movement system? Wang and test x dry after the film eight! ^, thick knife cloth process, system For the second piece (any integer of η or more), the process is for the n+a piece (: pass; number: the board that controls the rotation speed of the disc substrate; ^., ,, ten, which is 1 or more The base of the integer). In the case of the case, since the processing of the data is used to control the substrate of the a/disk substrate, the device configuration can simplify the measurement of the rotation process and the film thickness distribution of the disk substrate. It can be appropriately set by setting the time lag between the private film formation and the private film. Alternatively, the continuous _macro n+m (m-system constant, $ 丨 in slices (example % n, n+1, n+2··· accumulation is averaged, so...)) Distribution measurement results in a tablet _ . / data 'to control - the number of pieces after the stone system violently pull (for example, the n + r piece r 筏 , , , , , , , , , , , , , , 万 万 — — — — — — — — For the rotation of the large integer), when the film is abnormal, the influence of the control can be reduced. 疋 This / salty detection film drying area, the amount of skin film thickness after drying; Λ1? The process of making the boundary movement speed can measure and rotate the same process, and control the disc-based rebel-disc substrate: two: 仃. This situation is changed by the same purpose. Corresponding to a more rapid state, the disc manufacturing apparatus of the present invention is characterized in that the disc substrate is rotated, and the I cloth mechanism is applied to the 9 1277090 cymbal substrate; The detection mechanism, the boundary movement of the dry region of the region and the undamaged film rotation; the film thickness measuring mechanism is the film for measuring the edge = The distribution mechanism and the control mechanism control the rotational speed of the disc substrate according to the relationship between the detected B = motion and the film thickness distribution. The right/right device controls the disc substrate according to the boundary movement and the drying boundary. The speed of the coating, the thickness of the coating at each position of the knife, so that the desired film thickness range can be obtained. The film thickness of the film is maintained in the following manner: The control mechanism has a rotating stylized mechanism , a stylized mechanism pure wheel rotation program having a rotation mode indicating a rotation time-rotational speed characteristic of the disk substrate, and a rotation mode conversion mechanism must be changed when the rotation speed must be changed during formation of the film The rotation mode is changed after the position of the rotation speed. The rotation mechanism may further include a stage for placing the disk substrate and a rotation driving device for rotating the stage at a required number of revolutions. The judging means compares the obtained film thickness data with a preset set film thickness range, and sets the film thickness in the radial direction of the disc substrate. The thickness range or the range factor Ί < force < the machine now, the rotation stylized mechanism changes the rotation mode when receiving the determination signal and the dry signal from the drying detection mechanism. The rotation: the stylization mechanism can also have: (1) The drying detecting means calculates the film drying time for changing the rotation mode when receiving the determination-TL number and the drying signal from the drying detecting means; (9) measuring the thickness of the film and measuring the film thickness Film thickness data; (4) Film thickness judging mechanism, according to the film thickness of the film 1277090 and the set film thickness range, output
Jt φτ< ^ ^ # 係在該碟 M A ^ ^方向之錢^膜厚範圍内或範圍外之判^基板 (JV)旋轉程式化機構，係輸 °唬，以及 示哕磔… 具有複數個旋轉模式(用來声 =基板之旋轉時間-轉速特性)之旋轉程式。 μ乾燥檢測機構亦可係影像處理裝 易於檢列出壬音命罢士 2 種情形’能 知成（出任思位置皮膜之乾燥狀態。 该乾燥檢測機構亦可具備. ^ 0δ ^ ^ 嗎皮膜乾餘感測器，具備將 先照射至皮膜之發光機構與接收從 八備將 膜的光之受光^ M . 、射的光或穿透皮 J〜 < 又尤機構，以及齡檢 — 收之# b 5|、& 卞判疋機構，在受光機構所接 收之先ϊ到達設定位準時合 再叮按 抑制裝置之成本。^輪出乾無«。此種情形，能 光二=光=Γ產生雷射光之雷射產生機構、或發 皮膜之乾燥。月…利用光之反射或穿透來正確測定 该受光機構亦可传1 | ” 備CCD攝影機之影像處理裝置、 或在该碟片基板之内周和 ^ τ邓周之間延伸之長方形CCD感測 裔。此種情形，蕻ώ 〜像處理能正確測定任意位置之皮膜 又’該受光機構亦可係沿著碟片基板之半徑排 列之1個或複數個發光二極體。 發明效1 右依本發明之碟片製造方法及製造裝置，則即使各種 ‘U 1能將皮膜之膜厚保持在設定範圍内。 【實施方式】 其人，况明用來實施本發明之最佳形態。但是，本發 11 J277090 之…二/、限疋於以下之各實施形態’在本申請項目所記載 ::圍内亦能採用各種形態。例如，亦可適當組合以下之 :二成’亦可將各實施形態之構成替代眾所皆 〔實施形態1〕 本I明係利用藉由旋塗法所形成之皮膜在旋轉中從内 :側向外周側依序乾燥之想法、及在旋轉製程中乾燥之皮Jt φτ< ^ ^ # is a system of the substrate (JV) rotation stylized in the range of the thickness of the film in the MA ^ ^ direction of the disk, the system is transformed, and the display has a plurality of rotations. The rotation mode of the mode (for sound = rotation time of the substrate - speed characteristic). The μ dry detection mechanism can also be used for image processing equipment to easily list the two cases of 壬 命 命 ' ' 能 能 能 能 ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( 。 。 。 。 。 。 。 。 。 。 。 ^ ^ ^ ^ ^ The residual sensor has an illuminating mechanism that first illuminates the film and receives light from the octagonal film, and emits light or penetrating the skin J~< and the mechanism, and the age-checking # b 5|, & 卞 卞 疋 , , , , , , , , , 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在The laser generating mechanism for producing laser light or the drying of the hair film. The moon...using the reflection or penetration of light to accurately measure the light receiving mechanism can also transmit the image processing device of the CCD camera, or the optical disk substrate Rectangular CCD sensing between the inner circumference and the ^ τ Deng Zhou. In this case, the processing can correctly measure the film at any position and the light receiving mechanism can be arranged along the radius of the disc substrate. One or a plurality of light-emitting diodes. According to the disc manufacturing method and manufacturing apparatus of the present invention, even if various 'U 1 ' can keep the film thickness of the film within the set range. [Embodiment] It is a matter of course that it is best to implement the present invention. However, the present invention is limited to the following embodiments. As described in the application of the present application, various forms can be used in the surrounding area. For example, the following may be appropriately combined: The configuration of each embodiment can be replaced by the following [Embodiment 1] The present invention is based on the idea that the film formed by the spin coating method is sequentially dried from the inside to the side to the outer side in rotation, and is rotated. Dry skin in the process
月果即使因其後之旋轉所造成之離心力亦不移動，膜厚不變 化之想法。 《、十對利用方走塗法，將皮膜（此種情形係指記錄膜）2形成 方;：片基板D之例，藉由第1A圖〜第1E圖來加以說明。 如第1A圖所示，在以既定速度旋轉之碟片基板d上，位 =其上方位置，從碟片基板D之外周向内周方向移動之噴 背N係供應皮膜材料w。液狀之記錄材料通常係由溶劑和 溶入該溶劑中之有機色素等所組成者。 ^ 一旦噴嘴N移動至箭頭方向之碟片基板D之内周，噴 嘴N就會停止供應皮膜材料w，返回原本位置，另一方面， 渠片基板D係用以預定梯度增大的轉速來進行高速旋轉。 相r %汉肤啊科延展至碟片基板上；剩餘之皮膜材料％被甩 開（弟1B圖 將皮膜材料W延展至碟片基板D上之過程中，内周側 之皮膜材料w開始乾燥，漸漸形成皮膜w。此係如前述， 由於碟片基板D之旋轉所產生之離心力，皮膜材料*中之 溶劑移動至外周方向所產生（第1C圖〜第1£圖^ 一旦形 12 1277090Even if the centrifugal force caused by the subsequent rotation does not move, the film thickness does not change. "Ten pairs of the use of the side-coating method, the film (in this case, the recording film) 2 is formed; the example of the sheet substrate D is illustrated by the first to the first. As shown in Fig. 1A, on the disk substrate d which is rotated at a predetermined speed, the film N is supplied from the nozzle N which is moved from the outer circumferential direction of the disk substrate D to the upper position. The liquid recording material is usually composed of a solvent and an organic pigment dissolved in the solvent. ^ Once the nozzle N moves to the inner circumference of the disc substrate D in the direction of the arrow, the nozzle N stops supplying the film material w and returns to the original position. On the other hand, the slab substrate D is used to rotate at a predetermined gradient. High speed rotation. The phase r % Han skin is stretched onto the disc substrate; the remaining film material % is cleaved (the process of stretching the film material W onto the disc substrate D in the middle of Fig. 1B, the film material w on the inner peripheral side starts to dry The film w is gradually formed. As described above, due to the centrifugal force generated by the rotation of the disc substrate D, the solvent in the film material* is moved to the outer peripheral direction (1CFig. 1st FIG. 1 once formed 12 1277090)
成於碟片基板D之皮膜Μ面乾燥，則停止碟片基板D 之旋轉，用未圖示之移載機構(省略圖示），從旋轉 略圖示）取出。 、 使用第2圖〜第5圖，來說明本發明一實施形能。第 2圖係表示本發明一實施形態之光碟之皮膜形成裳置_ 之方塊圖。第3圖係說明碟片基板D旋轉中之皮膜乾燥檢 測方法及裝置圖。帛4圖係說明皮臈對碟片半徑方向之皮 膜膜厚變化圖’第5圖係表示碟片基板之轉速對皮 品乾餘時間之關係圖。 3旋^裝置^本^^要-般裝置就可以，具有：塗佈室 來防止商速旋轉時被甩開之皮膜材料之飛散；載△ 7(用來载置碟片基板D)、旋轉驅動裝置9(用來使载△ 7旋 轉）、旋轉柱11(用來結合載台7和旋轉驅動裝置及^ 轉控制裝置13(用來控制旋轉驅動裝置9之旋轉）。 疋 _ 方疋軺控制敫置13為了用離心力來使得供應至碟片基板 D上之皮膜材料延展，將初期控制指令p送至旋轉驅：裝 ==既定之低轉速，使載台7旋轉。然後，旋轉 係用旋轉模式（例如定轉速、或轉速隨時 间叩Μ机夂比率增加之轉速、或用預定時間之。一 7 | 择、| 升之轉速等）使載台7旋轉。旋轉控制裝置13 知控制裝置所不具之後述功能。 ^白 在碟片基板D之上方，設置了皮膜乾燥感測器 光機構15和受光機構17所構成)。本發明者係確認:、 一旦皮膜乾燥則其顏色會變化，光之反射率和穿透率2方 13 1277090 後不同。針對市售之各種皮膜材料進行 ';，雖因皮膜材料而不同，但在特定波， 以上光之反射量和穿透量增大。 在本實施形態中，為了主要利 u A ^ 矛用先反射率來檢測出 基板D之旋轉中皮膜之乾燥，具備發光機構15(將光 知射皮膜W)和受光機構17(接收從皮膜反射的光）。 還有，從發光機構15所照射之光線係如第10圖所示’ 其一部分被皮膜W直接反射，剩下之—部分則穿透皮膜 W’進而穿透基板材料(例如聚碳酸酯），其—部分被載台7 之表面反射，再通過皮膜w和碟片基板d，到達受光㈣ 1 7 〇 這種情形’載台7之表面亦可係鏡面，亦可係將反射 率降低到既定值之狀態。並且，將載台7之表面加以黑消 光加工，如第12圖所示’能將反射率抑制在大致〇。這種 情形，僅檢測出來自皮膜w之反射率。亦可配合光之波長， 調整載台7之表面色，俾使得到適當之反射率。 依本發明者等之實驗，瞭解到載台7表面之反射率在 所使用之h測光之波長中若& Q〜3()%則能更易於進行乾 燥邊界之檢測。較佳係載台7表面之反射率為G〜i5%。 為了有效檢測出從皮膜W返回的光，如f n圖所示，亦 可在叉光兀件之正M方’設置光I 28’來隔離來自其他來 源的光。亦可設置透鏡等，來取代光罩28,能得到同樣之 光選擇效果。 使用第3A圖〜第3C圖，針對碟片基板D旋轉中皮膜 1277090 乾魅之檢測方法及裝置加以說明。本實施形態之皮膜乾燥 感測器19係設置在碟片基板D之上方，例如：設置在3〜、 ::Γ左右之位置。但是，不限定在此高度。皮膜乾燥感 ，、益19具有發光機構15(係產生某位準的光，照射至碟片 ^板D上之皮膜w)和受光機構17(係接受反射光，轉換為 電氣訊號）。發光機構15係如第3B圖及第3C圖所示，、將 複數個發光二極體或雷射元件沿著碟片基板半徑方向配置 成1列者’或由單一或複數個燈所構成。在這種實施形能 中，受光機構1 7係且備/丨、φ5许r^ ^ 備J中田度CCD列之CCD線型攝影機 先一極體列，其CCD係接收從碟片基板D上之皮膜 W之預定之小單位面積所反射的光。 、 作為受光機構17之CCD線型攝影機係接受從碟片基 板〇上之皮貞W t内周部到外周部所預定之小幅度面二 圍所反射之光’影像處理機構21係對來自小幅度面 之光’進行料處理。純咖線㈣㈣^彡像广 前之皮膜W之色係深灰色’但只要乾燥就會變成淡灰色:、 也就疋說變成趨近白色。影像處理機構η係將此色 化進;：影像處理’當之色為深灰色時，輸出零（0) m〜、…乂淡灰色5也就是說；變成趨近白色，則 輸出1的訊號。 、 在弟3圖中，若皮膜w全區域不乾燥 Π之二騎受光元件)之圖面左端之⑷部= 之(小P刀…P知出〇訊號。另—方面，隨乾燥之進行， 若皮膜W㈣周側到X點乾燥’則受光機構17之CCD列 15 1277090 之⑷、⑻、⑷之部分係輪出】訊號，⑷〜 出〇訊號。也就是說，接受 刀係輪 土人I 术自乾燦則皮膜之反射朵0士 軔出0訊號’接受來自乾 守， 號。 反膜之反射先化’輪出1訊 影像處理機構2 1係脾9 μ > 傅係將2值訊號進行 至碟片基板D之皮膜w之乾燥位置之時間，係 =而將碟片基板D開始旋轉之時刻起經過何種程=了 =長。也就是說’―片基板之乾燥完成;I: 使皮:二延ϋ片基板1分鐘Π轉(rPm)之轉速， =膜之乾燥中，將用咖線型攝影機17所得到之^ :加以衫像處理，例如：測定從碟片基板D之内周到 2 ^心心叫叫位置之乾燥所需時間’藉此易於 =這些㈣時間，在該時刻，影像處理 冓21係輸出表示皮膜乾燥之乾燥訊號以。因此，影像 处理機構21具有進行判定皮膜乾燥之功能，並且，亦具 有' 定或運算皮膜之徑向位置之乾燥所需時間之功能。-成皮膜之碟片基板D係從旋轉裝置i取出s在大致 *之狀悲下，藉由未圖示之檢查裝置之膜厚測定機構 Μ，進行皮膜膜厚之測定。此皮膜之膜厚測定即使採用習 矣之檢查裝置亦能進行’故不詳加說明，此處，在半捏方 向（亦即從皮膜之内周朝外周）所選擇部位之膜厚係用^數 口既疋點或連績進行測定。該膜厚測定數據係當作第2圖 16 1277090 之膜厚訊號傳送至膜p … 膜尽判心機構25。膜厚測定機構25 係判定從膜厚測定機槿^ J疋械構23所送來之皮膜之膜 保持在設定膜厚範圍。 貝寸十疋否 判定訊號S 3，係在盘士 n试 予在與皮膜之膜厚達到設定膜厚範 上限值或下限值之大致间栌 之 守，或檢查完成1片或既定片蠢 之該碟片基板D後輸出。1 + 疋方數 便别出因此，檢查完成後，當產 訊號S3之情形，判定訊声 J疋 孔唬Μ係例如以〇和丨來表示 值訊號，當該皮膜之胺；戶,^ 範圍時為卜、、厂子“定膜厚範圍時為超出其 2設定膜厚範圍通常係以所欲膜厚為中心，肖卜2% 左右範圍來決定。但是， 〜 ° 不限疋在此範圍，能任意設定。 只要從膜厚判定機構25接 叹列疋όίΐ 5虎S3，則旌餘招4'外 機構27係從内設之複數 ㈣轉私式化 候数個紅轉程式，變更為使轉速上升 之旋轉程式。 ^ 針對旋轉程式之具體例， 稭由弟4圖及弟5圖加以說 月。如第4圖所示，在和& 仏向用寻間隔來分割從皮膜内周到 外周附近，例如：進行4公剌θ / 刀割（但是，不限定4分割，亦可 =2分割以上之任意分割數）。取距離内周rl、r2、r3、r4 …從内周爾周.偽卜抱區域…、Α'Τ ' ίπ、Γ/。 第5圖中之橫軸之皮膜乾烽 “ 钇各知間U、t2、t3、t4係表示第 4圖之各皮膜位置（點）rl、r2、β ^ ^ r2、r3、r4之乾燥所需時間。 旋轉程式化機構27係如舒、拉一 你如别述，係在乾燥時間tl、t2、 t3、t4所表示之時刻，從影像 俄褥2 1接收乾焯訊號S 1。 灰轉程式化機構27例如罝有 一有下述耘式··以旋轉時間 17 1277090 當o^tsti，則選定表示轉速梯度之轉速梯度vl，當tl^ t g t2，則選定轉速梯度V2，當t2 g t ^ t3，則選定轉速梯 度v3，當t3 $ t $ t4，則選定轉速梯度v4。因此，旋轉程 式化機構27，在初期，係將用轉速梯度vl來動作之訊號 S4送至旋轉控制裝置13，若於時間u從影像處理機構21 接收乾燥訊號s 1，則將用轉速梯度v2來動作之訊號S4送 至旋轉控制裝置13，若於時間t2從影像處理機構21接收 乾燥訊號S1，則將用轉速梯度v3來動作之訊號S4送至旋 轉控制裝置13，若於時間t3，從影像處理機構21接收乾燥 訊號，則將用轉速梯度v4來動作之訊號s4送至旋轉控 制裝置13。旋轉控制裝置13係對應前述之判定訊號^， 輸出以轉速梯纟vl〜v4來驅動旋轉驅動裝置9之控制指 令Q 〇When the film surface of the disc substrate D is dried, the rotation of the disc substrate D is stopped, and the transfer is performed by a transfer mechanism (not shown) (not shown). An embodiment of the present invention will be described using Figs. 2 to 5 . Fig. 2 is a block diagram showing the film formation of the optical disk according to an embodiment of the present invention. Fig. 3 is a view showing a method and apparatus for detecting the drying of the film in the rotation of the disc substrate D. Fig. 4 is a graph showing the change in the film thickness of the skin in the radial direction of the disk. Fig. 5 is a graph showing the relationship between the rotational speed of the disk substrate and the dry time of the leather. 3 旋 ^ device ^ This ^ ^ to the general device can have: coating chamber to prevent the scattering of the film material that is opened when the speed is rotated; load △ 7 (used to mount the disc substrate D), rotation The driving device 9 (for rotating the load Δ 7) and the rotating column 11 (for combining the stage 7 and the rotary driving device and the rotation control device 13 (for controlling the rotation of the rotary driving device 9). 疋_ 方疋轺In order to extend the film material supplied onto the disc substrate D by centrifugal force, the control device 13 sends an initial control command p to the rotary drive: mounting == a predetermined low rotation speed to rotate the stage 7. Then, the rotation system is used. The rotation mode (for example, a fixed rotation speed, or a rotation speed at which the rotation speed increases with time, or a predetermined time, a predetermined time, a rotation speed, etc.) causes the stage 7 to rotate. The rotation control device 13 knows the control device The function described later is not provided. ^ White is disposed above the disc substrate D, and the film drying sensor optical mechanism 15 and the light receiving mechanism 17 are provided). The inventors confirmed that the color of the film changes as soon as the film is dried, and the reflectance and transmittance of the light are different after the two sides are 13 1277090. For various kinds of film materials that are commercially available, the amount of reflection and the amount of penetration of light are increased in specific waves due to the difference in the film material. In the present embodiment, in order to detect the drying of the film in the rotation of the substrate D by the primary reflectance, the light-emitting mechanism 15 (the light-receiving film W) and the light-receiving mechanism 17 (received from the film are provided). Light). Further, the light irradiated from the light-emitting means 15 is as shown in Fig. 10, a part of which is directly reflected by the film W, and the remaining portion penetrates the film W' and penetrates the substrate material (for example, polycarbonate). The part is partially reflected by the surface of the stage 7, and then passes through the film w and the disc substrate d to reach the received light (4) 1 7 〇. The surface of the stage 7 may also be a mirror surface, or the reflectance may be lowered to a predetermined one. The status of the value. Further, the surface of the stage 7 is subjected to black extinction processing, and as shown in Fig. 12, the reflectance can be suppressed to approximately 〇. In this case, only the reflectance from the film w is detected. The surface color of the stage 7 can also be adjusted in accordance with the wavelength of the light to achieve an appropriate reflectance. According to experiments by the inventors of the present invention, it is understood that the reflectance of the surface of the stage 7 can be more easily detected in the wavelength of the h metering used, if & Q~3 ()%. Preferably, the reflectance of the surface of the stage 7 is G to i5%. In order to effectively detect the light returning from the film W, as shown by the figure f n, the light I 28' may be disposed on the positive M side of the forked light element to isolate light from other sources. Instead of the photomask 28, a lens or the like can be provided to obtain the same light selection effect. The method and apparatus for detecting the dry film 1277090 of the disc substrate D will be described with reference to Figs. 3A to 3C. The film drying sensor 19 of the present embodiment is disposed above the disc substrate D, for example, at a position of about 3 to, ::Γ. However, it is not limited to this height. The film drying feeling, the benefit 19 has an illuminating mechanism 15 (which generates a certain level of light, irradiates the film w on the disc plate D) and a light receiving mechanism 17 (which receives reflected light and converts it into an electrical signal). As shown in Figs. 3B and 3C, the light-emitting means 15 is formed by arranging a plurality of light-emitting diodes or laser elements in a row along the radial direction of the disk substrate or by a single or plural lamps. In this embodiment, the light-receiving mechanism 17 is provided with a CCD line type camera CCD line type camera first column, and the CCD system is received from the disk substrate D. The light reflected by the predetermined small unit area of the film W. The CCD line camera as the light receiving means 17 receives the light reflected from the inner peripheral portion to the outer peripheral portion of the inner surface of the disk substrate '. The image processing mechanism 21 is a small amplitude. The light of the surface is processed. Pure coffee line (four) (four) ^ 彡 广 之 之 前 前 前 前 前 前 前 前 前 前 前 前 前 但 但 但 但 但 但 但 但 但 但 但 但 但 但 但 但 但 但 但 但The image processing mechanism η is to color this into; image processing 'when the color is dark gray, the output is zero (0) m~, ... 乂 light gray 5 that is; when it becomes white, the signal of 1 is output . In the picture of brother 3, if the whole area of the film w is not dry, the second part of the picture of the light-receiving element is (4) = (small P-knife...P knows the signal. On the other hand, with the drying, If the film W (four) is dried to the X point on the circumference of the film (the part of (4), (8), (4) of the CCD column 15 1277090 of the light receiving mechanism 17 is signaled, (4) ~ the signal is output. That is, the knife wheel is accepted. From the dry can be the reflection of the film, 0 轫 轫 out 0 signal 'accepted from the defensive, No.. Anti-membrane reflection pre-ization' round out 1 message image processing mechanism 2 1 line spleen 9 μ > Fu system will be 2 values The time during which the signal is applied to the dry position of the film w of the disc substrate D is = which course is changed from the time when the disc substrate D starts to rotate. That is, the drying of the sheet substrate is completed; : The skin: the rotation speed of the two-twisted substrate for 1 minute (rPm), = in the drying of the film, the image obtained by the coffee-line camera 17 is processed by a shirt image, for example, the measurement from the disk substrate D The inner week to 2 ^ heart call called the position to dry the time required 'by this easy ~ these (four) time, at this moment, image processing 冓 21 series The output indicates the drying signal for drying the film. Therefore, the image processing mechanism 21 has a function of determining the drying of the film, and also has a function of determining the time required for the radial position of the film to be dried. The substrate D is taken out from the rotating device i, and the thickness of the film is measured by a film thickness measuring mechanism 检查 of an inspection device (not shown). The film thickness measurement of the film is even if it is adopted. The inspection apparatus can also perform the description. Therefore, the film thickness of the selected portion in the half pinch direction (that is, from the inner circumference to the outer circumference of the film) is measured by the number of points or the performance. The film thickness measurement data is transmitted to the film p ... film core mechanism 25 as the film thickness signal of Fig. 2, Fig. 1677090. The film thickness measuring mechanism 25 is determined to be sent from the film thickness measuring machine 槿^J疋The film of the film is kept within the set film thickness range. The film size of the film is determined by the thickness of the film thickness of the film and the lower limit value of the film thickness. Keep it, or check to complete 1 piece or a fixed piece Stupidly output the disc substrate D. The 1 + 疋 square is not displayed. Therefore, after the inspection is completed, when the signal S3 is produced, it is determined that the signal J, for example, 〇 and 丨 are used to indicate the value signal. When the film is amine, the range of the household, ^ is the size of the film, and the thickness of the film is set to exceed the thickness of the film. The film thickness is usually determined by the desired film thickness, and the range is about 2%. , ~ ° Not limited to this range, can be arbitrarily set. As long as the film thickness judgment mechanism 25 sighs the column 疋ό ΐ ΐ 5 tiger S3, then the 招 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 4 The number of red-shift programs is changed to a rotation program that increases the rotation speed. ^ For the specific example of the rotation program, the straw is said to be the month of the brother 4 and the 5th. As shown in Fig. 4, the distance from the inner circumference to the outer circumference of the film is divided by the summation interval, for example, 4 mm θ / knife cutting is performed (however, 4 divisions are not limited, and 2 divisions or more may be used. The number of divisions). Take the distance from the inner circumference rl, r2, r3, r4 ... from the inner circumference of the week. Pseudo-hub area ..., Α 'Τ ' ίπ, Γ /. The film on the horizontal axis in Fig. 5 is dry. "The U, t2, t3, and t4 systems are the drying places of the film positions (points) rl, r2, β ^ ^ r2, r3, and r4 in Fig. 4 It takes time. The rotating stylized mechanism 27 is like Shu, La, and you can receive the dry signal S 1 from the image Russian 2 1 at the time indicated by the drying time tl, t2, t3, t4. For example, the stylized mechanism 27 has the following formula: · Rotation time 17 1277090 When o^tsti, the speed gradient v1 indicating the speed gradient is selected, and when tl^tg t2, the speed gradient V2 is selected, when t2 gt ^ T3, the speed gradient v3 is selected, and when t3 $ t $ t4, the speed gradient v4 is selected. Therefore, the rotation stylizing mechanism 27 sends the signal S4, which is operated by the speed gradient v1, to the rotation control device 13 at an initial stage. If the drying signal s1 is received from the image processing unit 21 at time u, the signal S4 that is operated by the rotation speed gradient v2 is sent to the rotation control device 13. If the dry signal S1 is received from the image processing unit 21 at time t2, it will be used. The signal S4 of the speed gradient v3 is sent to the rotation control device 13, if at time t3 Receiving the dry signal from the image processing unit 21, the signal s4 operated by the rotational speed gradient v4 is sent to the rotation control device 13. The rotation control device 13 corresponds to the aforementioned determination signal ^, and the output is driven to rotate by the rotational speed ladders v1 to v4. Control command of drive device 9 〇
SU疋轉私式之具體例係如前述’故第5圖所示之旋; 模式⑷係在從内周到位置（點）Η之區域！，用最小上升; 來增大之轉速梯度V1來旋轉，在_ π，係用較轉以 度？為大之上升率之轉速梯度ν2來旋轉，在區域Κ 二父：速梯度ν2為大之上升率之轉速梯⑨Μ，來旋轉 係用較轉速梯度ν3，為大之上料之轉速梯方 (:來：：卜1“2“3’“4’)。也就是說，按照旋轉模3 置之/>。轉速梯度Μ旋轉後，保持轉速梯度Vl到也 過時間t2後立二二到位置(點)以之乾燥時間t2，經 P交更為轉速梯度v3，。 18 1277090 以W述方式變化轉速梯度之旋轉模式（A)使碟片基板旋 轉而形成皮膜時之皮膜膜厚變化係示於第4圖之曲線⑻， 皮膜之膜厚係假定成在皮膜位置。和r3間之位置η，超出 上限。此時，如前述，膜厚判定機構25係用第4圖之皮 膜位置（點）r2,之乾燥所需時間t3,，將表示膜厚超出設定範 圍之判定訊號S3供應至旋轉程式化機構。 …-旦旋轉程式化機構27接受前述之判定訊號幻，對 後續形成皮膜之碟片基板，以例如從帛5圖所示之旋轉模 式⑷變更為旋轉模式（B)的方式，將相當於旋轉模式⑻之 況唬S4送至旋轉控制裝置13。因此，旋轉控制裝置η， 對後續形成皮膜之碟片基板，用旋轉模式（B)來旋轉。旋轉 h(B)在區域！係用轉速梯度vl來旋轉；在區域n用轉 相度V2來旋轉，皆和旋轉模式（A)相同；但在區域出， ，用上升率較轉速梯度以為大之轉速梯度W來旋轉，在 _ 區域IV係用上升率較轉速梯度V4,為大之轉速梯度v4來 方疋轉（vl$ V2g ν3$ v4)。 為号如前述，若旋轉程式化機構27從膜厚判定機構M接 厚超出設定範圍之判定訊號S3，則旋轉驅動裝置 ^ 碟片基板起周旋轉模式⑻來旋轉，故皮膜膜厚 各=出上限值。一般而言’旋轉模式係以皮膜厚度不致 :」變動、皮膜之定點的轉速不致突然大幅變更的方式來 2 =。但是，即使用轉速模式（B)來旋轉，有時亦會因皮膜 料之特性等，而在例如皮膜之位置（點）r3和r4之中間點， 皮膜滕声 ”、、 、 人起出上限值。此種情形，變更為具有較旋轉 19 l277〇9〇 松式（B)為大轉速梯度之未圖示之轉速模式例如：未 °尸、之#速模式（C)之轉速梯度vl〜v3係相同，皮膜位置 (2)r3和r4間之轉速梯度係以具有較上述轉速梯度為 大之上升率之方式來設定。 在以上所述之實施形態中，係把碟片基板D之位置r3 4間區域IV之轉速梯度當作v4來預定控制，但基本上， f變更内周位置之轉速梯度，外周皮膜之膜厚也會受到影 每 文I域IV之轉速梯度亦與區域III之轉速梯度V3相 同以轉速梯度之旋轉模式（B，）來控制，當皮膜之膜厚未超 出&定膜厚則仍然用轉速梯度v3控制到最後。但是，在 =域IV之過程中，當皮膜之膜厚超出設定膜厚範圍時， 當然亦可針對後續形成皮膜之碟片基板，在區域IV之最 初便用轉速梯度v4來進行控制。又，轉速梯度未必設定 成（vl $ V2 S v3 g V4)般階段性上升之轉速梯度，彼此相等 之轉速梯度亦無妨。 % 以前述方式對於上升率大之轉速梯度組合之旋轉模式 做一次變更，則絕大多數之情形，能將皮膜厚度保持在設 定範圍内。又’皮膜材料之特性即使係特殊者，藉由對於 上升率大之轉速梯度組合之旋轉模式做再次變更，則於後 續形成皮膜之碟片基板，能將皮膜厚度保持在設定範圍 内。還有，本發明中之皮膜設定厚度，從碟片之内周側到 外周側不需要一定，亦能從内周側向外周側變厚方式或變 薄方式來形成。而且，亦能以僅在半徑方向之特定位置變 厚或變薄之方式來控制厚度。 20 1277090 又，本實施形態，雖開始旋轉後，將用以決定從轉速 開士。到旋轉結束之轉速梯度的旋轉模式變更在每個旋轉模 式做變更，但亦可僅變更既定區域之轉速梯度。 以上所述之貫施形態，係用影像處理機構Η邊測定皮 膜之乾燥邊變更旋轉程式，自動地變更旋轉模式來改變轉 速=度’但未必要自動地變更旋轉程式，$ 了減低成本， 在實際裝置中亦可不測定乾燥狀態。這種情形，在實際之 皮膜成形裝置中’不必具備影像處理機構，而是將由對前 述預，求出之相對於轉速梯度之乾燥時間數據、皮膜膜厚 數據等所形成之旋轉程式輸入至旋轉程式化機構，使實際 之皮膜形成裝置運轉，藉由膜厚測定機構，當皮膜之膜厚 達到上限值（設定值）時，如前述般變更旋轉模式、也就是 變更載台7之轉速梯度亦可。 在上述實施形態中，係對第η片（η係丨以上之任意整 數）之碟^基板’進行檢測製程（用來檢測出皮膜乾燥區域 和未乾燥區域之邊界移動）及測量製程（用來測量乾燥後之 皮膜之膜厚分布）’控制碟片基板轉速之製程係對第n+a片 U係常數，1以上之整數）之碟片基板來進行。這種情形， 因使用依據處理完成之碟片基板所得到之資料，對=該磾 片基板起算a片後之碟片基板之旋轉進行控制，故裝置2 構成能夠簡潔化。言亥a值只要依據皮膜形成製程和膜厚分 布測量製程間之時滯來適當設定即可。 又，亦可採用以下構成：對連續一定片數之 月（例如： ιι，ιί+15π+2…n+m(m係常數，！以上之整數， n 系積膜厚分 21 !277090 % 布測里結S力π以平均化，使用此平均：資料，來控制一定片 數後之碟片基板（例如：n+r(r係較m為大之整數））之旋轉。 〔實施形態2〕 其次’使用第6圖，針對本發明之第2實施形態加以 况月本貫施形恶亦如前述，在從内周到位置（點妙丨之區 或I用最小上升率來增大之轉速梯度Vl來旋轉，在區域 11，用較轉速梯度vl為大之上升率之轉速梯度v2來旋轉， 在區域in和區域IV，用較轉速梯度v2為大之上升率之轉 迖梯度v3來旋轉，使碟片基板D旋轉以延展皮膜材料。 如第6圖所不，當自碟片基板D内周起算位置〇點片2, 之皮膜膜厚超出設定範圍之上限值之情形，在區域ιπ、區 域IV分別求出被實際膜厚值和設定膜厚範圍之上限值所 匕圍之面# Y1、Υ2 ’將該面積大小當作皮膜膜厚之超出 里，劃分為既定階段、例如丨〜5階段來數值化。也就是 5兄，針對各區域將超出設定膜厚範圍上限值之膜厚值加以 時間積分當作超出量。 測定各區域I〜IV之膜厚後，輸出表示各區域超出量 之判定訊號S3。若判定訊號S3在區域J用〇來表示，在 區域II用0來表示，在區域⑴周i來表示5在區域^周 5來表示，則在區域m，設定為與皮膜膜厚超出量！相^ 之轉速梯度，在區域IV，設定為與皮膜膜厚超出量5相當 之傾斜之大轉速梯度。因此，對後續形成皮膜之碟片基板， 在區域I、區域π不變更轉速梯度，在區域J、區域II，嗖 定為與超出量1相當之轉速梯度，在區域IV，設定為與= 22 1277090 出里5相#之轉速梯度，使其旋轉。若以此方式設定轉速 梯度，則能於短時間内更高精度地控制膜厚。 又’若在區域III以相當於超出i i之轉速梯度來旋 軺茱片基板D ’則區域Iv之皮膜厚度亦變化，故亦可將區 域ΙΠ之轉速梯度預先設定在考慮了區域…之超出量$之 轉速梯度，使得區域IV與區域m以同樣轉速梯度來旋轉。 欠更之轉速梯度使碟片基板D旋轉來形成皮膜之結 主區域IV之過矛王中，f皮膜之膜厚超出設定範圍上 限之情形，只要如前述般再度變更區_ Iv之轉速梯度即 〇 〔實施形態3〕 八久，藉由第13圖來說明本發明之其他實施形態。在 ，前所說明之帛2圖之裝置中’形成皮膜後，在後製程進 行膜厚測定，但本實施形態之特徵係使用同一裝置來進行 皮膜形成和膜厚測定。 D 位The specific example of the SU疋 private type is as described above, so the rotation shown in Fig. 5; the mode (4) is in the area from the inner circumference to the position (point)! , use the minimum rise; to increase the speed gradient V1 to rotate, in _ π, use the turn to degree? Rotate the speed gradient ν2 for the large ascent rate. In the area Κ second parent: the speed gradient ν2 is the speed of the large rise rate of the ladder 9 Μ, the rotation system uses the speed gradient ν3, which is the speed of the upper material ( :来::卜1"2"3'"4'). That is to say, according to the rotation mode 3 />. After the rotation speed Μ rotation, keep the speed gradient Vl to the time t2 and then the second to the second The position (dot) is dried by the time t2, and the P-crossing is further rotated by the velocity gradient v3. 18 1277090 The rotation mode of the rotational speed gradient is changed in a manner described (A) The film thickness variation when the disk substrate is rotated to form a film In the curve (8) shown in Fig. 4, the film thickness of the film is assumed to be at the film position, and the position η between r3 and the upper limit exceeds the upper limit. At this time, as described above, the film thickness determining means 25 uses the film position of Fig. 4 ( Point) r2, the drying time t3, the determination signal S3 indicating that the film thickness exceeds the set range is supplied to the rotation stylizing mechanism. The rotation stylizing mechanism 27 accepts the aforementioned determination signal illusion, and subsequently forms a film. The disc substrate is changed, for example, from the rotation mode (4) shown in FIG. In the rotation mode (B), the rotation mode (8) is sent to the rotation control device 13. Therefore, the rotation control device η is used to rotate the mode (B) for the disk substrate on which the film is formed. Rotate. Rotate h(B) in the area! Rotate with the speed gradient vl; Rotate in the region n with the phase transition V2, which is the same as the rotation mode (A); but in the area, the rate of rise is higher than the speed gradient. It is thought that the large speed gradient W is rotated, and the rate of increase in the _ area IV is higher than the speed gradient V4, and the speed gradient v4 is large (vl$ V2g ν3$ v4). When the mechanism 27 thickens the determination signal S3 whose thickness exceeds the set range, the rotation drive unit rotates the disk substrate in the circumferential rotation mode (8), so that the film thickness is equal to the upper limit value. Generally, the rotation is performed. The mode is based on the fact that the thickness of the film does not change: "The speed at which the film is fixed at a fixed point does not suddenly change significantly 2 =. However, even if the rotation speed mode (B) is used for the rotation, sometimes due to the characteristics of the coating material, etc., for example, at the middle of the position (dot) r3 and r4 of the film, the film is sounded, and the person is lifted up. Limit. In this case, change to a speed mode with a rotation of 19 l277〇9〇 loose (B) for a large speed gradient. For example, the speed gradient vl of the #speed mode (C) The v3 system is the same, and the film position (2) The rotational speed gradient between r3 and r4 is set so as to have a larger rate of increase than the above-described rotational speed gradient. In the above-described embodiment, the disc substrate D is used. The rotational speed gradient of the region IV between the positions r3 and 4 is predetermined as v4, but basically, f changes the rotational speed gradient of the inner circumferential position, and the film thickness of the outer peripheral membrane is also affected by the velocity gradient of the region I and the region III. The speed gradient V3 is controlled by the rotation mode (B,) of the speed gradient. When the film thickness of the film is not exceeded, the film thickness is still controlled to the end by the speed gradient v3. However, in the process of = domain IV, When the film thickness of the film exceeds the set film thickness range, of course For the subsequent disc substrate on which the film is formed, the rotation speed gradient v4 is used for the control at the beginning of the area IV. Further, the rotation speed gradient is not necessarily set to the (vl $ V2 S v3 g V4) stepwise rising speed gradient, which is equal to each other. The speed gradient can also be used. % In the above-mentioned way, the rotation mode of the combination of the speed gradient with a large rate of increase is changed. In most cases, the film thickness can be kept within the set range. In particular, by changing the rotation mode of the combination of the rotational speed gradients having a large rate of increase, the thickness of the film can be kept within the set range in the subsequent formation of the disk substrate of the film. Further, the thickness of the film in the present invention is set. It is not necessary to be constant from the inner peripheral side to the outer peripheral side of the disc, and it can be formed by thickening or thinning from the inner peripheral side to the outer peripheral side. Moreover, it can be thickened or changed only at a specific position in the radial direction. The thickness is controlled in a thin manner. 20 1277090 In addition, in this embodiment, after the rotation is started, the speed gradient from the speed of rotation to the end of rotation is determined. Although the rotation mode change is changed for each rotation mode, it is also possible to change only the rotation speed of the predetermined area. The above-described embodiment is to change the rotation program by the image processing mechanism while measuring the dryness of the film, and automatically change the rotation. Mode to change the speed = degree ', but it is not necessary to automatically change the rotation program, the cost is reduced, and the dry state can not be measured in the actual device. In this case, in the actual film forming device, it is not necessary to have an image processing mechanism. The rotation program formed by the drying time data, the film thickness data, and the like obtained with respect to the rotational speed gradient obtained in the above-described pre-measurement is input to the rotational stylized mechanism to operate the actual film forming apparatus, and the film thickness measuring mechanism is used. When the film thickness of the film reaches the upper limit (set value), the rotation mode may be changed as described above, that is, the rotation speed gradient of the stage 7 may be changed. In the above embodiment, the detection process of the n-th sheet (any integer of η system or more) is performed (to detect the boundary movement between the dry region and the undried region of the film) and the measurement process (for The film thickness distribution of the film after drying is measured, and the process of controlling the rotation speed of the disk substrate is performed on the disk substrate of the n+a piece U-factor constant, an integer of 1 or more. In this case, by using the data obtained from the processed disc substrate, the rotation of the disc substrate after the a sheet is controlled is controlled, so that the configuration of the apparatus 2 can be simplified. The value of haihai a can be appropriately set according to the time lag between the film formation process and the film thickness distribution measurement process. Further, the following configuration may be employed: for a certain number of consecutive months (for example: ιι, ιί+15π+2...n+m (m-system constant, ! integer above, n-system film thickness 21!277090% cloth) The S-force π is averaged, and the average: data is used to control the rotation of a certain number of disc substrates (for example, n+r (r is a larger integer than m)). [Embodiment 2 〕 Next, using the sixth figure, the second embodiment of the present invention is also subjected to the above-mentioned situation, as described above, in the range from the inner circumference to the position (the point where the point is slightly or the minimum increase rate is used. The gradient V1 is rotated, and in the region 11, the rotation is performed with the rotation speed gradient v2 of the higher rotation speed gradient v1, and the rotation is performed with the rotation speed gradient v3 of the higher rotation speed gradient v2 in the region in and the region IV. The disc substrate D is rotated to extend the film material. As shown in Fig. 6, when the position of the film 2 is calculated from the inner circumference of the disc substrate D, the film thickness of the film exceeds the upper limit of the set range, in the region. Ιπ and area IV respectively determine the surface #Y surrounded by the actual film thickness value and the upper limit of the set film thickness range. 1. Υ2 'The area size is regarded as the excess of the film thickness, and is divided into a predetermined stage, for example, 丨~5 stage to be numerically. That is, 5 brothers, the film which exceeds the upper limit of the set film thickness range for each region The thick value is time-integrated as the excess amount. After the film thickness of each of the regions I to IV is measured, a determination signal S3 indicating the excess amount of each region is output. If the determination signal S3 is indicated by 〇 in the region J, 0 is used in the region II. In the region (1), the week i indicates that the region 5 is represented by the region ^5, and the region m is set to have a rotational speed gradient with the film thickness exceeding the amount of the film thickness, and in the region IV, the thickness is exceeded with the film thickness. 5, the slanting large speed gradient. Therefore, for the disc substrate on which the film is formed, the rotation speed gradient is not changed in the region I and the region π, and the rotation gradient corresponding to the excess amount 1 is determined in the region J and the region II. In the area IV, set the rotation speed gradient of 5 phase # with = 22 1277090 to rotate it. If the speed gradient is set in this way, the film thickness can be controlled with higher precision in a short time. III is equivalent to the speed exceeding ii The gradient is used to rotate the substrate D', and the film thickness of the region Iv also changes. Therefore, the rotational speed gradient of the region 预先 can also be set in advance to the rotational speed gradient considering the excess amount of the region, so that the region IV and the region m are the same. The rotation speed gradient is rotated. The lower speed gradient causes the disc substrate D to rotate to form the main region IV of the film. In the case where the film thickness of the f film exceeds the upper limit of the set range, the area is changed again as described above. The rotational speed gradient of Iv is 〇 [Embodiment 3] For a long time, another embodiment of the present invention will be described with reference to Fig. 13. In the apparatus of Fig. 2 described above, after the film is formed, the film is formed in the post process. Although the thickness was measured, the characteristics of the present embodiment were measured by film formation and film thickness using the same apparatus. D bit
旋轉 膜厚測定機構24係邊使配置於載台7之碟片基板 ，邊在碟片基板D之半徑方向，在連續個或複數個 置’間歇性地測定形成其上之皮膜w之膜厚。使用膜厚測 疋成構24之測定時機可為以下之2種。 (1)皮膜w之乾燥全部完成後，接著邊使載台7旋轉 邊進行皮膜W之膜厚測定。 (2)與皮膜W之塗佈乾燥並行，在較皮膜w之乾燥邊 界更内側，以緊追乾燥邊界之方式來進行皮膜w之膜厚 定。 ' + 23 ^ 1277090 上述（2)之情形，亦可將社 膜之磾片A、、°果適用於接下來進行塗 《磲片基板，亦適用於現在進行 控制。 腰之碟片基板之回饋 右依弟1 3圖之構成因的 塗裝置中，故不义猶☆ 測定機構24裝入旋 24,在裝置之… 疋“置之外設置膜厚測定機構 你衣置之小型化之點較有利。 將藉由膜厚測定機構24之測定結果 膜之碟片基板之旋轉控制之情在進仃塗 中’用非接觸方式檢測出皮膜形成==於碟片基板 ，於該時刻即時變更碟片基板〇之二 果’來回授控制該碟片基板 子’J“ 急條件變化之優點。將此# 异度，故具有能對應緊 极.，沾將此種情形之控制方法說明如下。 8圖^#71係表不皮膜半徑方向之皮臈膜厚之變化圖，第 严产二不皮膜之乾燥時間和碟片基板轉速之關係圖。膜 :=機構24係檢測出於碟片基…形成之皮膜W: 2後之膜厚，制厚判定機構25送出表 圖所I’皮膜〜之膜厚係在碟片基板父 判定機槿’直…^超出設定膜厚範圍之上限值，則膜厚 ”、、員不膜厗超出設定膜厚範圍上限值之判 疋訊號S3。一曰絲Μ ρ *4'儿η 一疋轉私式化機構27接收此判定訊號S3， 則如弟8圖所示，名1¾ LJ « » 碟片基板之位置L1之皮膜乾燥時間u 將轉速梯度變更為v2。因此，以轉速梯度vi旋轉至位置 L1之碟片基板係在位置L1轉換為轉速梯度v2。還有，此 24 1277090 處所使用之膜厚檢測機構只要利 可以，在榉H η 先反射者等一般機構就 在碟片基板D形成皮膜之過程中，對於半徑方向之 、予以連績性或複數個既定位置進行檢測。 =轉速梯度以碟片基板旋轉4皮膜膜厚未超出設 ，圍之上限值’則仍用轉速梯度ν2來進行皮膜之形成。 -疋’如帛7圖所示’如皮膜之膜厚在位置L2 :值，則在碟片基板之位置L2 <皮膜乾燥時間U，將轉 ^梯度變更為v3。如以上所述，本實施形態之皮膜形成製 耘’在形成皮膜過程中，檢測出皮膜之膜厚，當超出設定 乾圍時’即時變更皮膜形成中之碟片基板之轉速梯度。 在本實施形態中，從膜厚異常之檢測到向膜厚控制之 :饋’因發生時滞’故將膜厚範圍設定成較實際容許膜厚 範圍為小，在達到實際之容許膜厚範圍之上限或下限之前 控制旋轉，使保持裕度較佳。 〔實施形態4〕 第9圖係表示有關本發明其他實施形態之光碟之皮膜 形成裝置200之圖。與第2圖同一符號所示之構成係表示 與第2圖相同之構成。本實施形態係使用皮膜乾燥感測器 1 y 此反版孔燥®i %说1 9係忐發光機構1 5 (係複數個發光 二極體等發光元件排成一列）和受光元件1 7(係接收各發光 元件所產生光中從皮膜之既定小面區域反射的光，產生對 應受光量之電氣訊號）所構成。針對檢測皮膜乾燥之機構， 因已在實施形態1加以敘述，故予以省略。 在第2圖之實施形態中，多數（例如100〜2000個）之 25 1277090 受光元件係使用沿著碟 μ , 卞仏万向並排一列之Φ出- 件列’但本發明亦可如第15圖 凡 圖所不’僅設置盘進杆f絲 =制階段數對應之個數（在圖示之例M I構。乾燥檢測機構對於碟片半徑 , 無特別限定，但-般而言，較㈣ 置雖 认、，仙 你3點以上。若設置乾烨 膜厚控制。還有，本，开」碟片能用充分精度來進行 u本只㈣'悲'，就發光元件而言亦能使用The rotating film thickness measuring means 24 measures the film thickness of the film w formed thereon in a continuous or plural number in the radial direction of the disk substrate D while being placed on the disk substrate of the stage 7. . The measurement timing using the film thickness measuring structure 24 can be either of the following two. (1) After the drying of the film w is completed, the film thickness of the film W is measured while the stage 7 is rotated. (2) In parallel with the coating and drying of the film W, the film thickness of the film w is adjusted so as to closely follow the dry boundary on the inner side of the dry boundary of the film w. ' + 23 ^ 1277090 In the case of (2) above, the film A and the film can also be applied to the next coating of the enamel substrate, which is also suitable for current control. The feedback of the substrate of the waist disc is in the coating device of the composition of the right picture of the brothers. Therefore, the measuring mechanism 24 is loaded with the screw 24, and the device is placed in the device. The miniaturization of the garment is advantageous. The measurement of the film thickness of the film by the film thickness measuring mechanism 24 is controlled by the non-contact method of the film formation in the squeegee coating == on the disc The substrate, at this moment, immediately changes the disc substrate, and the effect of controlling the disc substrate 'J" is changed. This # is different, so it has the ability to correspond to the tightness. The control method of this situation is explained as follows. Fig. 2#71 shows the change of the film thickness in the radial direction of the film, and the relationship between the drying time of the second film and the rotation speed of the disk substrate. Membrane: = mechanism 24 detects the film thickness after the film W: 2 formed by the disc substrate, and the thickness determining mechanism 25 sends out the film thickness of the film I's to the disc substrate. Straight...^Exceeding the upper limit of the set film thickness range, the film thickness "," does not exceed the upper limit of the set film thickness limit signal S3. A 曰 Μ * * * * * * 疋The patterning mechanism 27 receives the determination signal S3, and as shown in the figure 8, the film drying time u of the position L1 of the disk substrate is changed to v2. Therefore, the rotation speed gradient vi is rotated to the position. The disc substrate of L1 is converted to the rotational speed gradient v2 at the position L1. Further, as long as the film thickness detecting mechanism used in the 24 1277090 is good, a general film such as 榉H η first reflects the film on the disc substrate D. In the process of the process, the radial direction of the joint performance or a plurality of predetermined positions are detected. = The speed gradient is rotated by the disc substrate 4 The film thickness is not exceeded, and the upper limit is still used by the rotational speed gradient ν2 The formation of the film is carried out. -疋' as shown in Figure 7 When the film thickness is at the position L2: the value is changed to v3 at the position L2 of the disk substrate, and the film drying time U is changed. As described above, the film formation process of the present embodiment is in the process of forming the film. The film thickness of the film is detected, and when the set dry circumference is exceeded, the rotational speed gradient of the disk substrate during film formation is changed in time. In the present embodiment, from the detection of the abnormal film thickness to the control of the film thickness: When the time lag occurs, the film thickness range is set to be smaller than the actual allowable film thickness range, and the rotation is controlled until the upper limit or the lower limit of the actual allowable film thickness range is reached, so that the holding margin is better. [Embodiment 4] The figure shows a film forming apparatus 200 for an optical disk according to another embodiment of the present invention. The same reference numerals as those in the second drawing show the same configuration as that of Fig. 2. In this embodiment, a film drying sensor 1 is used. y This counter-version hole ® % % 1 1 1 1 1 1 1 1 1 1 1 ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( 和 和Established facets The light reflected by the field is generated by the electric signal corresponding to the amount of received light. The mechanism for detecting the drying of the film is described in the first embodiment, and therefore omitted. In the embodiment of Fig. 2, many (for example, 100~) 2000) 25 1277090 Light-receiving components are used along the disc μ, 卞仏 universally arranged in a column of Φ-items' but the invention can also be as shown in Figure 15 where the figure does not set only the disk feed rod f wire = The number of stages corresponds to the number of stages (in the example of the MI structure. The drying detection mechanism is not limited to the radius of the disc, but in general, it is better than (4). If you set it, you will be 3 or more points.烨 film thickness control. Also, this, open "disc" can be used with sufficient precision only (four) 'sad', can also be used for illuminating components
極體’就受光元件而言亦能使用光電二極體。 受光元件17(接收來自預定之位置（點）的反射光）所產 2訊號’在皮膜乾燥前和乾燥後之值不同，乾燥後較乾 燥前為大（例如1()%以上）。乾燥判定機構31係將來自受光 兀*件17之訊號值與設定值比較，若該訊號值為該設定值 、 則產生表示该位置之皮膜已乾燥之乾燥訊號S1，輸 入至程式化機構27。 在本實施形態中，係使用膜厚測定機構23(具有與實 她形態1所使用者同樣的功能）、及膜厚判定機構25，該 等之功能、動作，因在實施形態丨中業已敘述，故予以省 略，惟可使用皮膜乾燥感測器丨9(由發光機構丨5和受光元 件1 7所構成）與乾燥判定機構3 1 ;闬與前述之方法完全同 樣之方法實現皮膜之形成。 還有，在本實施形態中，發光元件和受光元件可取一 定間隔來排列，亦可彼此密接排列。發光元件亦可係與從 碟片基板之内周到外周之長度為大致相等長度之單一燈。 但是’各受光元件係僅接收來自皮膜既定之各小面區域之 26 1277090 反射光。 在以上之貫施形悲中’係針對受光元件接收來自皮膜 反射光之例加以欽述’但如第14圖所示，亦可接收穿透 碟片基板D和皮膜W之光。一般而言，碟片基板大多係 由透明之聚碳酸酯樹脂所構成，通常波長區域之可視光線 大部分可穿透。又，因皮膜W之膜厚很薄，通常為 m左右’故通常波長區域可視光線之一部分會穿透。本發 明者等已確認了穿透皮膜W之光線量在乾燥前和乾燥後不 同，乾燥後較乾燥前為多。因此，檢測出皮膜穿透光之情 形亦與實施形態丨〜實施形態3同樣，能檢測出皮膜之乾 燥。 利用皮膜之穿透光之情形，在第2圖或第9圖之裝置 中，較佳係如第14圖所示，用透明之材質（例如：玻璃、 陶瓷或塑膠等）來形成載台7,將發光機構15(或受光機構 17)配置於載台7上方，另一方面，將受光機構17(或發光 機構15)配置於載台7之下方。或在載台7之内部，設置 發光機構15(或受光機構17)。 這種情形，可在受光機構所接收之光量成為設定值以 上時判斷處於乾燥。又5當然亦可將發光機構或受光機構 之一者检向配置，藉由反射鏡或稜鏡來折射光。 當在載台7之内部設置前述般之發光機構之情形能以 下述方式實現：用透明之玻璃基板來構成搭載碟片基板D 之上面，在載台内部設置發光機構或受光機構，在載台上 方设置党光機構或發光機構。這種情形，從外部對於載台 27 1277090 之内部發光機構或受光機構供應電力之構造而言，能使 各：提案：機構，例如，在第2圖或第9圖之旋轉柱" 之前端’安裝未圖示之旋轉滑動機構，通過旋轉柱内呷， :外部將電力供應線(未圖示)連接於該旋轉滑動機構之固 疋部’在該旋轉滑動機構之旋轉部（省略圖示）連接電力供 應線（未圖示，係連接於發光機構15或受光機構）即可。/、 又，亦可將加熱之氣體喷過碟片基板之皮膜，或照射 紅外線來促進乾燥並且檢測乾燥。 就檢測出於碟片基板所塗佈之皮膜材料之乾燥方法而 s 如上述’不僅可使用檢測出反射率或穿透率變化之 方=，亦可使用檢測出其他物理特性，例如：皮膜之靜電 谷：變化、重量變化、導電性變化’對光以外之能束之反 射率或穿透率之變化。例如：檢測靜電容量之情形，亦可 罪近皮膜設置丨個或複數個靜電容量感測器，從靜電容量 隨乾無之變化來檢測出乾燥邊界之位置。χ，當測定重量 ，化j形，亦可在載台設置_計UW)，藉由應變 感測裔等來檢測載台之轉矩變化。 又，在上述實施形態中’皆塗佈含有溶劑之皮膜材料， k溶劑揮發來達成乾燥，但本發明所謂之乾燥’亦包含例 如硬:匕性樹脂從液狀變化為固體之相變化者。因此，本發 :亦能適用於在旋塗熱硬化性樹脂或能束硬化性樹脂後， 從内周向外周硬化之情形。 【圖式簡單說明】 第1A圖係用以說明在本發明之碟片製造方法中，旋 28 1277090 塗時皮膜乾燥之進行狀態。 第1B圖係用來說明旋塗中之皮膜乾燥之進行狀態。 第1C圖係用來說明旋塗中之皮膜乾燥之進行狀態。 第1D圖係用來說明旋塗中之皮膜乾燥之進行狀態。 第1 E圖係用來說明旋塗中之皮膜乾燥之進行狀態。 第2圖係本發明一實施形態之碟片製造裝置之方塊 圖。 第3 A圖係表示該實施形態之邊界檢測機構之俯視圖。 第3B圖係第3A圖中之ΙΙΙΒ_ ΙΠΒ線視截面圖。 第3C圖係第3A圖中之IIIC—nic線視截面圖。 第4圖係表示皮膜膜厚對碟片半徑方向之變化圖。 第5圖係表示碟片基板轉速之經時變化圖。 第6圖係表示其他實施形態中皮膜厚度對碟片半徑方 向位置之皮膜厚度之變化圖。 二 第7圖係表示皮膜厚度對碟片半徑方向位置之 度之變化圖。 予 第8圖係表示碟片基板轉速之經時變化圖。 第9圖係表示其他實施形態之碟片製造裝置 圖。 乃观 第1 〇圖係表示乾燥檢測機構一例之截面圖。 第1 1圖係表示乾燥檢測機構其他例之截面圖。 第 12圖在主一 ^ 表示乾燥檢測機構其他例之截面圖。 第13圖係有關其他實施形態之碟片製造裝 «I 〇 〜4塊 29 1277090 弟14圖係表示其他實施形態之 截面圖。 知仏測機構其他例 第15圖係表示其他實施形態之 側面圖。 *心測機構其他例 之 之 【主要元件代表符號】 1 旋轉裝置（旋轉機構） 3 塗佈室 5 噴嘴（塗佈機構） 7 載台 9 旋轉驅動裝置 11 旋轉柱 13 .旋轉控制裝置（控制機 15 發光機構 17 受光機構 19 皮膜乾燥感測器（乾燥 23 膜厚测定機構 25 膜厚判定機構 27 旋轉程式化機構 31 乾燥判定機構 30The polar body can also use a photodiode for the light receiving element. The light-receiving element 17 (receiving reflected light from a predetermined position (dot)) produces a difference in the value of the signal before and after drying, and is larger (e.g., 1 (%) or more) before drying. The drying determining means 31 compares the signal value from the light-receiving member 17 with a set value, and if the signal value is the set value, a dry signal S1 indicating that the film of the position is dry is generated, and is input to the stylizing mechanism 27. In the present embodiment, the film thickness measuring means 23 (having the same function as the user of the actual form 1) and the film thickness determining means 25 are used, and the functions and operations are described in the embodiment. Therefore, the film drying sensor 丨9 (which is composed of the light-emitting means 丨5 and the light-receiving element 17) and the drying determining means 3 1 can be used to form the film in exactly the same manner as the above-described method. Further, in the present embodiment, the light-emitting element and the light-receiving element may be arranged at a certain interval or may be arranged in close contact with each other. The light-emitting element may be a single lamp having a length substantially equal to the length from the inner circumference to the outer circumference of the disc substrate. However, each of the light-receiving elements receives only 26 1277090 reflected light from each of the predetermined facet areas of the film. In the above description, the light-receiving element receives the light reflected from the film, but as shown in Fig. 14, it is also possible to receive light that penetrates the disk substrate D and the film W. In general, the disc substrate is mostly composed of a transparent polycarbonate resin, and most of the visible light in the wavelength region is transparent. Further, since the film thickness of the film W is very thin, usually about m, it is usually a part of the visible light region that penetrates. The inventors have confirmed that the amount of light penetrating through the film W is different before drying and after drying, and is much more dry before drying. Therefore, in the same manner as in the third embodiment, the film can be detected to be dry, and the drying of the film can be detected. In the case of penetrating light of the film, in the device of Fig. 2 or Fig. 9, it is preferable to form the stage 7 with a transparent material (for example, glass, ceramic or plastic, etc.) as shown in Fig. 14. The light-emitting mechanism 15 (or the light-receiving mechanism 17) is disposed above the stage 7, and the light-receiving mechanism 17 (or the light-emitting mechanism 15) is disposed below the stage 7. Or, inside the stage 7, an illuminating mechanism 15 (or a light receiving mechanism 17) is provided. In this case, it is judged to be dry when the amount of light received by the light receiving means becomes equal to or higher than the set value. Further, of course, it is also possible to detect the arrangement of one of the light-emitting means or the light-receiving means, and refract the light by a mirror or a crucible. The case where the above-described light-emitting means is provided inside the stage 7 can be realized by arranging the upper surface of the disk substrate D with a transparent glass substrate, and providing an illuminating mechanism or a light-receiving mechanism inside the stage. A party light mechanism or a light-emitting mechanism is arranged above. In this case, from the outside, the structure for supplying electric power to the internal light-emitting mechanism or the light-receiving mechanism of the stage 27 1277090 can be: each proposal: the mechanism, for example, at the front end of the spin column " in Fig. 2 or Fig. 9 'Installing a rotary slide mechanism (not shown), by rotating the inside of the column, externally connecting a power supply line (not shown) to the fixed portion of the rotary slide mechanism in the rotary portion of the rotary slide mechanism (not shown The power supply line (not shown, connected to the light-emitting mechanism 15 or the light-receiving mechanism) may be connected. /, Alternatively, the heated gas may be sprayed through the film of the disc substrate or irradiated with infrared rays to promote drying and dry detection. For detecting the drying method of the film material applied to the disc substrate, as described above, 'not only the square where the reflectance or the transmittance change is detected can be used, but other physical properties can also be detected, for example, the film is used. Static Valley: Change in change in reflectance, change in conductivity, or change in reflectance or transmittance of energy beams other than light. For example, in the case of detecting the electrostatic capacity, it is also possible to set a single or a plurality of electrostatic capacitance sensors close to the film, and detect the position of the dry boundary from the change in the electrostatic capacity with nothing. χ, when measuring the weight, the shape of the j, can also be set in the stage _ count UW), by the strain sensing sense, etc. to detect the torque change of the stage. Further, in the above-described embodiment, the film material containing the solvent is applied, and the k solvent is volatilized to achieve drying. However, the term "drying" in the present invention also includes, for example, a change in the phase in which the inert resin changes from a liquid state to a solid phase. Therefore, the present invention can also be applied to a case where the thermosetting resin or the energy curable resin is spin-coated and then hardened from the inner periphery to the outer periphery. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1A is a view for explaining the state in which the film is dried during the application of the disk 28 in the method for producing a disk of the present invention. Fig. 1B is a view for explaining the progress of drying of the film in spin coating. Fig. 1C is a view for explaining the progress of drying of the film in spin coating. Fig. 1D is a view for explaining the progress of drying of the film in spin coating. Fig. 1E is a view for explaining the progress of drying of the film in spin coating. Fig. 2 is a block diagram showing a disc manufacturing apparatus according to an embodiment of the present invention. Fig. 3A is a plan view showing the boundary detecting mechanism of the embodiment. Fig. 3B is a cross-sectional view of the ΙΙΙΒ ΙΠΒ line in Fig. 3A. Fig. 3C is a cross-sectional view of the IIIC-nic line in Fig. 3A. Fig. 4 is a graph showing changes in film thickness in the radial direction of the disk. Fig. 5 is a graph showing the temporal change of the rotational speed of the disk substrate. Fig. 6 is a graph showing changes in film thickness with respect to the film thickness in the radial direction of the disk in the other embodiment. Fig. 7 is a graph showing the change in film thickness to the position in the radial direction of the disc. Fig. 8 is a graph showing the temporal change of the rotational speed of the disc substrate. Fig. 9 is a view showing a disk manufacturing apparatus of another embodiment. Fig. 1 is a cross-sectional view showing an example of a drying detecting mechanism. Fig. 1 is a cross-sectional view showing another example of the drying detecting mechanism. Fig. 12 is a cross-sectional view showing another example of the dry detecting mechanism in the main one. Fig. 13 is a cross-sectional view showing another embodiment of a disc manufacturing apparatus relating to other embodiments, "I 〇 〜 4 block 29 1277090 。 14". Other examples of the sensing mechanism Fig. 15 is a side view showing another embodiment. *Other components of the heartbeat mechanism [Main component symbol] 1 Rotating device (rotating mechanism) 3 Coating chamber 5 Nozzle (coating mechanism) 7 Carrier 9 Rotary drive unit 11 Rotating column 13. Rotary control device (control machine 15 illuminating mechanism 17 light receiving means 19 film drying sensor (drying 23 film thickness measuring means 25 film thickness determining means 27 rotation stylizing means 31 drying determining means 30