TWI275663B - Substitution type electroless gold plating solution - Google Patents
Substitution type electroless gold plating solution Download PDFInfo
- Publication number
- TWI275663B TWI275663B TW092129129A TW92129129A TWI275663B TW I275663 B TWI275663 B TW I275663B TW 092129129 A TW092129129 A TW 092129129A TW 92129129 A TW92129129 A TW 92129129A TW I275663 B TWI275663 B TW I275663B
- Authority
- TW
- Taiwan
- Prior art keywords
- plating solution
- gold plating
- substitution type
- type electroless
- electroless gold
- Prior art date
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title abstract description 5
- 239000010931 gold Substances 0.000 title abstract description 5
- 229910052737 gold Inorganic materials 0.000 title abstract description 5
- 238000007747 plating Methods 0.000 title abstract description 4
- 238000006467 substitution reaction Methods 0.000 title abstract 3
- JAJIPIAHCFBEPI-UHFFFAOYSA-N 9,10-dioxoanthracene-1-sulfonic acid Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2S(=O)(=O)O JAJIPIAHCFBEPI-UHFFFAOYSA-N 0.000 abstract description 2
- 239000002738 chelating agent Substances 0.000 abstract description 2
- 239000003112 inhibitor Substances 0.000 abstract description 2
- 238000010301 surface-oxidation reaction Methods 0.000 abstract description 2
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 125000004433 nitrogen atom Chemical group N* 0.000 abstract 1
- 150000002894 organic compounds Chemical class 0.000 abstract 1
- 230000003647 oxidation Effects 0.000 abstract 1
- 238000007254 oxidation reaction Methods 0.000 abstract 1
- 239000013557 residual solvent Substances 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 210000003296 saliva Anatomy 0.000 description 4
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- JSIAIROWMJGMQZ-UHFFFAOYSA-N 2h-triazol-4-amine Chemical compound NC1=CNN=N1 JSIAIROWMJGMQZ-UHFFFAOYSA-N 0.000 description 2
- VVZRKVYGKNFTRR-UHFFFAOYSA-N 12h-benzo[a]xanthene Chemical compound C1=CC=CC2=C3CC4=CC=CC=C4OC3=CC=C21 VVZRKVYGKNFTRR-UHFFFAOYSA-N 0.000 description 1
- QWENRTYMTSOGBR-UHFFFAOYSA-N 1H-1,2,3-Triazole Chemical compound C=1C=NNN=1 QWENRTYMTSOGBR-UHFFFAOYSA-N 0.000 description 1
- GOJUJUVQIVIZAV-UHFFFAOYSA-N 2-amino-4,6-dichloropyrimidine-5-carbaldehyde Chemical group NC1=NC(Cl)=C(C=O)C(Cl)=N1 GOJUJUVQIVIZAV-UHFFFAOYSA-N 0.000 description 1
- JWYUFVNJZUSCSM-UHFFFAOYSA-N 2-aminobenzimidazole Chemical compound C1=CC=C2NC(N)=NC2=C1 JWYUFVNJZUSCSM-UHFFFAOYSA-N 0.000 description 1
- QRZMXADUXZADTF-UHFFFAOYSA-N 4-aminoimidazole Chemical compound NC1=CNC=N1 QRZMXADUXZADTF-UHFFFAOYSA-N 0.000 description 1
- NSPMIYGKQJPBQR-UHFFFAOYSA-N 4H-1,2,4-triazole Chemical compound C=1N=CNN=1 NSPMIYGKQJPBQR-UHFFFAOYSA-N 0.000 description 1
- KLSJWNVTNUYHDU-UHFFFAOYSA-N Amitrole Chemical compound NC1=NC=NN1 KLSJWNVTNUYHDU-UHFFFAOYSA-N 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76841—Barrier, adhesion or liner layers
- H01L21/76871—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers
- H01L21/76874—Layers specifically deposited to enhance or enable the nucleation of further layers, i.e. seed layers for electroless plating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Chemically Coating (AREA)
Abstract
This invention provides a substitution type electroless gold plating solution that can prevent oxidation of the metal surface to be plated without employing reduction agent, and can form a gold film with good solder bonding characteristics. The substitution type electroless gold plating solution comprises a water soluble gold salt, an electric conductivity enhancing agent, a chelating agent having an imino-2-acetic acid structure, a surface oxidation inhibitor formed by an organic compound having at least 2 nitrogen atoms in the main chain or ring, and a residual solvent.
Description
第92129129號專利申請案申請專利範圍替換本更正曰期：101年7月20曰 中.前述表面氧化抑制劑係選自於由。比唾、3-胺基°比〇坐、 4-胺基D比唾、5-胺基°比唾、味唾、2-胺基°米嗅、.4-胺基 咪唑、5-胺基咪唑、1，2,3-三唑、4-胺基-1，2,3-三唑、5-胺基-1，2,3-三唑、1,2,4-三唑、3-胺基-1,2,4-三唑、5-胺 基-1,2,4-三。坐、四吐、5-胺基-四。坐、苯并σ米唾、2-胺基 -苯并咪唑、苯并三唑及其混合物所構成之群者。 8.如申請專利範圍第1或2項之取代型無電解金電鍍液，其 中前述水溶性金鹽的濃度為0.5〜5.0.g/L，前述導電性促 進劑的濃度為10〜200g/L，前述螯合劑的濃度5〜 100g/L、前述表面氧化抑勧劑的濃度為10〜lOOOOppm。Patent Application No. 92,129,129, the entire disclosure of which is incorporated herein by reference. Than saliva, 3-amino group, squat, 4-amino D, saliva, 5-amino group, saliva, saliva, 2-amino group, 4-aminoimidazole, 5-amino group Imidazole, 1,2,3-triazole, 4-amino-1,2,3-triazole, 5-amino-1,2,3-triazole, 1,2,4-triazole, 3- Amino-1,2,4-triazole, 5-amino-1,2,4-tri. Sitting, four spit, 5-amino-four. A group consisting of benzoxanthene, 2-amino-benzimidazole, benzotriazole, and mixtures thereof. 8. The substituted electroless gold plating solution according to claim 1 or 2, wherein the concentration of the water-soluble gold salt is 0.5 to 5.0 g/L, and the concentration of the conductivity promoter is 10 to 200 g/L. The concentration of the chelating agent is 5 to 100 g/L, and the concentration of the surface oxidation inhibitor is 10 to 100 ppm.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002306826 | 2002-10-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200422430A TW200422430A (en) | 2004-11-01 |
| TWI275663B true TWI275663B (en) | 2007-03-11 |
Family
ID=32170918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092129129A TWI275663B (en) | 2002-10-22 | 2003-10-21 | Substitution type electroless gold plating solution |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2004038063A1 (en) |
| KR (1) | KR100797515B1 (en) |
| AU (1) | AU2003301573A1 (en) |
| TW (1) | TWI275663B (en) |
| WO (1) | WO2004038063A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4955315B2 (en) * | 2005-06-16 | 2012-06-20 | メタローテクノロジーズジャパン株式会社 | Electroless gold plating solution for forming gold plating film for wire bonding |
| JP5013077B2 (en) | 2007-04-16 | 2012-08-29 | 上村工業株式会社 | Electroless gold plating method and electronic component |
| KR101161968B1 (en) * | 2010-07-19 | 2012-07-04 | 롯데알미늄 주식회사 | Liquid for improving conductivity and process of forming conductive pattern using thereof by gravure printing method |
| JP6111058B2 (en) * | 2012-12-07 | 2017-04-05 | 東洋鋼鈑株式会社 | FUEL CELL SEPARATOR, FUEL CELL CELL, FUEL CELL STACK, AND METHOD FOR MANUFACTURING FUEL CELL SEPARATOR |
| KR102364679B1 (en) | 2016-01-13 | 2022-02-18 | 엘지전자 주식회사 | Method and user equipment for transmitting uplink data, and method and base station for receiving uplink data |
| KR101857596B1 (en) * | 2018-01-31 | 2018-05-14 | (주)엠케이켐앤텍 | Substitution type electroless gold plating bath using a nitrogen-containing heteroarylcarboxylic acid and substitution type electroless gold plating using the same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3148428B2 (en) * | 1992-11-13 | 2001-03-19 | 関東化学株式会社 | Electroless gold plating solution |
| JP3466521B2 (en) * | 1999-10-04 | 2003-11-10 | 新光電気工業株式会社 | Substitution type electroless gold plating solution and electroless gold plating method |
| JP3831842B2 (en) * | 2002-03-25 | 2006-10-11 | 奥野製薬工業株式会社 | Electroless gold plating solution |
-
2003
- 2003-10-16 JP JP2004546414A patent/JPWO2004038063A1/en active Pending
- 2003-10-16 AU AU2003301573A patent/AU2003301573A1/en not_active Abandoned
- 2003-10-16 WO PCT/JP2003/013243 patent/WO2004038063A1/en active Application Filing
- 2003-10-16 KR KR1020057006374A patent/KR100797515B1/en active IP Right Grant
- 2003-10-21 TW TW092129129A patent/TWI275663B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2004038063A1 (en) | 2006-02-23 |
| WO2004038063A1 (en) | 2004-05-06 |
| TW200422430A (en) | 2004-11-01 |
| KR100797515B1 (en) | 2008-01-24 |
| AU2003301573A1 (en) | 2004-05-13 |
| KR20050067181A (en) | 2005-06-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK4A | Expiration of patent term of an invention patent |