TW201002859A - Catalyst-imparting liquid for solder plating - Google Patents

Abstract

A catalyst-imparting liquid which, when used in conducting electroless reductional solder plating directly on a copper-based conductor circuit material, can give an even coating film free from thickness unevenness and enables the formation of a solder deposit having no bridge between fine wiring lines. Also provided is a solder deposit formed using the catalyst-imparting liquid. The catalyst-imparting liquid, which is for conducting electroless reductional solder plating on a copper-based metal, is characterized by comprising a water-soluble gold compound and a chelating agent. The deposit is a solder deposit formed on a copper-based metal, and is characterized by being obtained by using the catalyst-imparting liquid to conduct electroless reductional solder plating. Furthermore provided is a solder deposit formed over a copper-based metal which has gold in an amount of 3x10-5 g/cm2 or smaller on the surface thereof, the deposit having been formed on the gold.

Description

201002859 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a catalyst-imparting liquid which is obtained by electroless liquid electroplating on a copper-plated metal for solder plating. [Previous technology] The solder joint of the electronic material is made of electrolysis shovel, copper wire conductor electrolysis tin, and electrolytic tin plating Pure tin is formed: mineral deposits such as tin-silver, electrolysis and surface are industrialized. The method of the alloy film has been circumvented in recent years. In order to respond to electroplating of electronic materials, it is not only high in terms of /,, and type, and high density. In fact, the demand for practical use of μ solution and tin plating increases. However, this has already been industrialized. The electroless replacement of bismuth or tin alloy pittan b, in order to form a pure tin material, is the result of a fine copper-based conductor circuit circuit. In a, y shape, there is too much dissolved amount and the conductor base steel (4) 2 = _ thin material is expected to be accompanied by the base (10), the conductive electric H electroless replacement of the soldering bell, but not industrialization. Electroless reduction solder plating of East Wood is used as a non-electrolytic reduction ruthenium bath containing a number of divalent ions of tin. In Patent Document 1, the ionic ion, the dissolving agent and the reducing agent 201002859 have been disclosed. A plating bath of trivalent titanium ions. The electroless reduction solder plating bath is related to the precipitation mechanism by the reducing agent. In order to form the plating film, the substrate (4) conductor circuit material is not dissolved, but (4) the bath itself has copper solubility. It is confirmed that the copper is dissolved in the plating bath between the original bismuth tin plating, and the conductor circuit is still cut. Thus, the present inventors have developed a copper solubility which inhibits the bath itself, and mainly inhibits the welding of the non-casting county into the continent (10), the number of the application: P (10) 2 ° _ 564). However, such electroless reduction soldering _ If the copper "on the road straight (four) line, then the brake response of the circuit table to the money line is sparse, the job change is slow, the reason for the thick film thickness, so In some cases, it is not possible to obtain a uniform film. Therefore, in order to make the axis of the reduction reaction uniform, and to improve the reaction record of the electroless wrapstock Wei bath, the light liquid stability is impaired, causing precipitation between the wires of the fine wire, and In other cases, the method of activating the copper-based conductor circuit is known as the method of activating the copper-based conductor circuit, and it is known that the method of the electroless reduction plating is used in the prior art (2). 'Special for the absence of __ welding _ the front of the coating is therefore not applicable to the thermal electrolytic reduction of the solder deposit. In recent years, the miniaturization of the decorative line, accompanied by the base copper-based conductor circuit element (four) solution two = strong expectations Industrialization, but the above-mentioned early electroless tin plating [previously read] fine private shirt, industrialization of the prefecture. 098116843 4 201002859 [Patent Document] Patent Document 1: Japanese Patent Laid-Open No. Hei 6-101056 Patent Document 2: Japanese Patent Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. JP-A-2003-082468 SUMMARY OF INVENTION (Problems to be Solved by the Invention) The present invention has been made in view of the above-described background art, and its subject matter is to provide electroless direct electrolysis on copper-based conductor circuit materials. Reducing solder deposits can be obtained as a uniform coating film with no uneven film thickness, and can form a catalyst-imparting liquid for a fine-wired tin-plated coating without a jumper.

In order to solve the above problems, the inventors have repeatedly tried to make a review in order to make the sizzling raw silk begin to be self-contained, D ★ sees the 曰 曰 ec, i the paper enemy with the electroless swarf: In this case, the reduction welding is damaged, and the precipitation of the substrate is not likely to occur in the fine wiring, and the substrate wiring failure of the so-called "jumper" is caused. Therefore, in terms of practical use, it has been found that it is necessary to reduce the soldering phase of the solder plating, that is, the electroless liquid stability, and only the copper-based conductor of the plating object = soldering number 098116843 surface activation After 5 201002859, the electroless reduction is carried out. Thus, as a method of activating only the copper-based conductor circuit, electroless substitution of solder plating is performed. The order of the pure tin film or the self-catalyst mechanism is used to push an & I anti-membrane, and the sputum, the sputum, the electroless reduction, the fine cloth, the money without the wire = material method, but there is concern about the conductor caused by the dissolution of the copper circuit material =, because the above problem has not been solved. Therefore, although in the electroless reduction mineralization other than electroless nickel, electroless reductive yttrium, f test only the steel body "activation method known to give this conductor circuit In the method of imparting a palladium catalyst, it was found that the electroless tin-free coating was not activated by the catalyst core. In order to solve the above problem, the inventors of the present invention have only repeated the activation of the copper channel. Committed to the results of the test, the use of hair shirts

(3) The catalyst-imparting liquid having a water-based gold compound and a chelating agent, and the obtained "reduced solder plating film has no fine wiring jumper, and the film is heated to complete the present invention. That is, the present invention provides a catalyst-based liquid for performing electroless reduction solder on a (four) metal, which is characterized by containing a water-soluble gold-forming person and a catalyst-imparting liquid. And the chelating agent of the present invention provides a solder plating method 2 which is characterized by electroless reduction solder plating using the above-mentioned catalyst ejector*, and is provided by using the above-mentioned catalyst. Electrolyte without liquidation = 098116843 201002859 The number of solder plating on the copper-based metal characterized by solder plating. Further, the present invention provides a soldering bell skin which is formed on a copper-based metal and has a gold of 3 x 1 Wg/cm2 or less. (Effect of the Invention) According to the present invention, it is possible to obtain a uniform ruthenium-free reduction solder deposit film having no unevenness in film thickness on a copper-based metal, and a copper-based conductor circuit can be formed without a jumper wire even if it is finely wired. The electroless reduction solder plating is used to prevent voids from occurring when the solder balls are joined. [Embodiment] The present invention will be described below, but the present invention is not limited to the specific embodiments described below, and may be arbitrarily changed within the scope of the technical idea. The present invention is a catalyst-imparting liquid for performing electroless reduction soldering on a copper-based metal. In the present invention, the term "copper-based metal" means a copper alloy of copper alone or § 60 mils or more. It is preferably copper alone or a copper alloy containing a mass of copper. The copper or copper alloy to which the present invention is applicable is not particularly limited as long as it is generally used for forming a conductor circuit. In other words, the metal other than copper in the steel alloy is not particularly limited as long as the above effects of the present invention are obtained. In the present invention, the "solder" of "electroless reduction solder plating" is a single tin or a tin alloy containing tin, and has a melting point of 35 Å or less. The metal other than the tin (Sn) constituting the tin alloy is not particularly limited, and examples thereof include lead (Pb), bismuth (Sb), silver (Ag), copper (Cu), aluminum (A1), and cadmium. , zinc (Zn), indium (In), and the like. The metal other than the above tin is i type or two or more types, and 098116843 201002859 is used to form a tin alloy together with tin. That is, it is not limited to tin-lead alloys, but also contains lead-free solder. The so-called "solder" '"solder" also contains a separate tin (hyun point 232;) dry. ,. Further, in the present invention, the "ruthenium tin" is preferably Μ 6 (; Μ 90 mass ° / 〇 or more, particularly preferably 95 quality, more preferably in order to obtain the above-mentioned materials and other materials. Kick-alloy, which does not contain the ship's welding kick, 'because it is environmentally friendly: negative: no: not limited', but the effects of the present invention are described, etc., and it is preferable to obtain the catalyst-imparting liquid of the present invention. In the present invention, it is necessary to contain a water substance and a chelating agent. In the present invention, "the concentration in the water-soluble oxime-based gold-based vehicle-imparting liquid is a suitable compound", if it is in a thixotropic gold compound, There is no particular limitation, and the hydrated gold salt, gasified gold salt, and gold sulfite sulphate in the degree of water, such as the stability of cyanago I, sulfuric acid sulfate, and the easy production of medicines. Salt, especially good for cyanide gold salt 戋 _ and Q, preferably cyanide gold I and I gold salt. It is dangerous, but as a modulation catalyst to give liquid 昉 子 子 子 子 子 子Potassium salts are particularly good. 'Kings are better with alkali metal salts, by using water-soluble gold.

The catalyst of the chelating agent + Y copper-based metal has no film thickness unevenness. The "media-enhancing liquid" can be obtained from the above-mentioned water-soluble gold compound: electrolytic reduction of bismuth tin coating film. The total amount of the liquid is given to the two sub-species of the conversion of gold. The relative to the catalyst is less than 2000 Ppm, preferably 2 is preferably ^Ppm or more 勹 ιρι^ above 1000 ppma u 098116843 is U. When the concentration of the gold compound of the water-soluble 201002859 is too large, there is a case where the catalyst-imparting liquid is precipitated in the catalyst-imparting liquid, and the catalyst-imparting liquid is unstable. When the temperature is too small, the catalyst is incomplete and the electroless reduction solder may be caused. The case where plating does not precipitate. Although it is not particularly limited, it is preferable that the catalyst-imparting liquid of the present invention contains substantially no I bar compound. The reason is that the electroless reduction of the coal-tin bond is not activated by the I-bar catalyst core, so it becomes vainly contained. If the palladium compound is contained, the liquid stability of the catalyst-imparting liquid is lowered, and there is a touch. The medium gives the case where metal gold is formed in the liquid. The chelating agent in the present invention is not particularly limited as long as it can dissolve the copper-based metal of the copper-based conductor circuit in the catalyst-imparting liquid. By containing a chelating agent as an essential component, the copper-based metal can be prevented from being uniformly dissolved in the catalyst-imparting liquid, and the copper-based metal can be prevented from being re-precipitated. Therefore, the catalyst core can be uniformly and surely supplied, and the fineness can be prevented. The wiring between the wirings is caused by the jumper of the fine wiring caused by the adhesion of the metal to the insulator. As the chelating agent, a chelating agent having an iminodiacetic acid structure or a fluorenylphosphonic acid structure is preferable. Specific examples of the chelating agent having such an iminodiacetic acid structure include ethylenediaminetetraacetic acid, hydroxyethyliminodiacetic acid, nitrosotriacetic acid, and hydroxyethylethylenediaminetriacetic acid. , di-ethyltriamine pentaacetic acid, tri-ethylidenetetraamine hexaacetic acid, dicarboxymethylproline, propanediaminetetraacetic acid, 1,3-diamino-2-hydroxypropanetetraacetic acid, etc., or These water soluble salts. The water-soluble salt is not particularly limited, and examples thereof include a sodium salt, a potassium salt, and an ammonium salt. These may be used alone or in combination of two or more. 098116843 9 201002859 Further, examples of the chelating agent having a methylene phosphonic acid structure include aminotrimethylenephosphonic acid, hydroxyethylidene diphosphonic acid, ethylenediaminetetramethylenephosphonic acid, and diethylidene ethyl ester. An amine penta methylene phosphonic acid, hexamethylene diamine tetramethylene phosphonic acid or the like or a water-soluble salt thereof. The water-soluble salt is not particularly limited, and examples thereof include a sodium salt, a potassium salt, and an ammonium salt. They may be used in combination or in combination of two or more. Among them, a chelating agent having an iminodiacetic acid structure is particularly preferable from the viewpoint of enhancing the action of dissolving a copper-based metal. The chelating agent is preferably in the range of lg/L to 100 g/L, more preferably 2 g/L to 60 g/L, and particularly preferably 3 g/L to 40 g/L, based on the total amount of the catalyst-imparting liquid. When the concentration of the chelating agent is too large, it may be precipitated in the catalyst-imparting liquid. In the case where the concentration is too small, the effect of suppressing the occurrence of the jumper of the fine wiring may be insufficient. In the catalyst-imparting liquid of the present invention, it is preferred to further contain "a heterocyclic compound having two nitrogens in the molecule". The electroless plating nitrile formed by the contact liquid containing "two heterocyclic compounds in the molecule" is used to form a void in the JL, and (4), when the ball is bonded, the solder is not threatened, ΎUse as a good mounting terminal. The "heterocyclic compound having one or more molecules in the molecule" is a "heterocyclic ring" of a chemical person: an aromatic ring (hereinafter, with no impurity formed in the compound molecule) In the case of a heterocyclic nitrogen, a total of two or more compounds are formed. 098116843 An element other than the carbonaceous material constituting the hetero ring (hereinafter referred to as "heterocarbon" 10 201002859 is not particularly limited, and examples thereof include nitrogen. The heterocyclic element is preferably a nitrogen atom. The heterocyclic ring having a "heterocyclic compound having two or more nitrogens in the molecule" is not particularly limited, and examples thereof include a D-ratio ring, a whistle ring, and β. The ceramide ring, the taste σ ring, the rugged ring, the anthracene ring, the π ratio β ring, the u ratio σ ring, the σ dense σ ring, the outer ring, the π quinidine ring, the isoindole ring, Odor 0 seat ring, 1,2,3-three 11 seat ring, 1,2,4-tri-sigma ring, four-ring ring, 4 丨 σ ring, benzo-p-methane ring, benzo 4 σ ring a benzopyrene sine ring, a benzotriazole ring, etc., wherein a heterocyclic ring having one or more nitrogen atoms in the hetero ring is more preferred. In the present invention, the amine group, the alkyl group, the alkyl group, and the like are preferably an amine group. In the present invention, the "heterocyclic compound having two or more nitrogens in the molecule" may be exemplified by π ratio. 3-amino 吼σ sitting, 4-amino σ ratio, 5-amino σ ratio 口, 嗤米嗤, sitting, 4-amino ρ rice 嗤, 5-amine based '1 sitting, 1, 2 , 3-III. Sodium, 4-amino-1,2,3-triazole, 5-amino-1,2,3-triazole, 1,2,4-triazole, 3-amino-1 , 2,4-triazole, 5-amino-1,2,4-triazole, tetraterpene, 5-aminotetrazole, 2-aminobenzimidazole, benzotriazole, etc. The heterocyclic compound, an alkyl group-substituted product thereof, or an amino group-substituted product, etc., may be used alone or in combination of two or more. Among them, imidazole and 2-amino group are particularly preferable in obtaining the effects of the present invention described above. Imidazole, 4-aminoimidazole, 5-aminoimidazole, 1,2,4-triazole, 3-amino-1,2,4-tris-sigma, 5-aminotetrazole, etc. 098116843 11 201002859 " The concentration of the heterocyclic compound having two or more nitrogen atoms in the molecule is not particularly limited, and is preferably 1 ppm or more and 1 OOO ppm or less with respect to the total amount of the catalyst-imparting liquid, and is 50 p or less. It is particularly preferable that pm or more is 5,000 ppm or less. When such a concentration is too large, a precipitate may be formed. When the concentration is too small, voids may occur when solder balls are joined. In the catalyst-imparting liquid of the present invention, The pH buffering agent is not particularly limited as long as it does not adversely affect the properties of the catalyst-imparting liquid and can alleviate the change in pH. The organic or inorganic substance can be appropriately blended. The acid or a salt thereof is added, and specific examples thereof include inorganic acids such as boric acid, phosphoric acid, and pyrophosphoric acid; organic acids such as citric acid, acetic acid, malic acid, succinic acid, and tartaric acid; and salts thereof. The catalyst-imparting liquid of the present invention is preferably pH 3 or higher and pH 9 or lower, and is preferably pH 4 or higher and pH 8 or lower. If the pH is too low, the catalyst-imparting liquid may be unstable as a precipitated gold. If the pH is too high, the catalytic activity may be lowered and electroless reduction solder plating may be difficult. The treatment temperature of the catalyst-imparting liquid of the present invention is preferably from 10 ° C to 95 ° C, more preferably from 20 ° C to 90 ° C. Further, the treatment time of the catalyst-imparting liquid of the present invention is preferably 5 seconds or longer and 15 minutes or shorter, and more preferably 10 seconds or longer and 10 minutes or shorter. The amount of catalyst metal supported by the catalyst-imparting liquid of the present invention, that is, the amount of gold imparted on the copper-based metal, is 〜. 5 to 3 mg/dm 2 (0.05 x l 〇 -5 to 3 x 10.5 g / Cm3) is preferred, and is preferably 098116843 12 201002859 with 0.1 〜2 mg/dm2 (0.1xl 〇-5~2xl0_5g/cm3). In this range, the effects of the present invention described above are easily obtained. In other words, the "gold-plated metal having 3 mg/dm 2 or less (3 x 10 - 5 g/cm 2 or less) and the solder plating film formed thereon" as the other aspect of the present invention has the aforementioned effects. Therefore, it is better. In the gold, it is necessary to visually confirm that the gold is "gold plating", and it is necessary to have a precipitation amount of 6 mg/dm2 (6xl (T5g/cm3, thickness: 30 nm) or more, and the usual substitution gold plating is 12 mg/dm2). (12 g/em 'thickness: 6Qnm) or so. That is, 'the catalyst of the present invention imparts a liquid phase to the copper-based gold compared to the substituted electroless gold alloy. Therefore, the catalyst liquid is supplied. The amount of the catalyst-based nuclear metal can be clearly distinguished from the "electroless gold". In addition, the gold given by the liquid of the catalyst of X Ming is used to give the liquid to the catalyst of the present invention. The gold film is formed. 1 The copper-based metal of the conductor circuit is selectively selected: ^^There is no electricity. The original 赖 赖 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Epoxy, ceramics, and polyaniline, etc. are based on the glass-forming circuit. (4) On the gold-formed substrate, the copper-based gold can be used to enumerate the number of plates, the surface, and the Cu plate. The method is not limited, and the catalyst is applied by using the catalyst of the present invention, according to the usual electroless mineral deposit. The treatment step is not particularly limited to the pretreatment method. 098116843 13 201002859 before the application of the catalyst to the liquid is not particularly limited, and all of them can be used. In addition, a carboxylic acid (salt) such as citric acid (salt), a pH adjuster, etc. may be contained, and EDTA (Ethylenediaminetetraacetic Acid) may be mentioned as the organic compounding agent. "Ethylenediaminetetraacetic acid), NTA (Nitrilotriacetic Acid, Ammonia Triacetate), etc. "Organic error-modifying agent having an iminodiacetic acid structure"; "Organic oxidation agent having a fluorenylphosphonic acid structure" The metal compound which is a trivalent phosphorus organic compound or the like may contain a metal compound other than tin according to the definition of "solder" in the above-mentioned invention. [Examples] Hereinafter, the examples and comparative examples will be more specifically described. The present invention is not limited to the embodiments as long as it does not exceed the gist of the invention. [Examples 1 to 8] <Adjustment of catalyst-imparting liquid> "In the case of the material", in order to convert the metal gold, the catalyst is read as the mass is in ppm, and the "agent" shown in the silk is separated from the catalyst by the sputum, in the examples 4~7" For the whole of the catalyst-providing liquid having two or more nitrogen atoms, the total amount of the catalyst-imparting liquid is adjusted to pH 5.0 with the total amount of the catalyst-imparting liquid. In Example, the amount of H is dissolved in pure water. #高液. Correction, pH adjustment 1 Emulsified sodium aqueous solution, hydrochloric acid was used when it was lowered. 098116843 14 201002859 [Comparative Example 1 to 2] As Comparative Example 1, the commercially available No. 3 was used for electroless reduction. The catalyst-imparting liquid for nickel plating (KAT-450, manufactured by Ueki K.K., Ltd.) is adjusted to the state of normal use. Further, as a comparative example 2, a commercially available catalyst-free liquid for electroless nickel plating containing palladium (1:1 > Acusela, manufactured by Okuno Pharmaceutical Co., Ltd.) was used to prepare a state of normal use. [Comparative Examples 3 to 6] (} The compound shown in the leftmost column of Table 1 is a chelating agent with respect to the catalyst as indicated by the mass of the conversion metal to the catalyst-imparting liquid. The whole solution was dissolved in pure water at 2 〇g/L, and adjusted to pH 5. 〇 to prepare each catalyst-imparting liquid. The pH adjustment was carried out using hydrochloric acid when the pH was lowered, and hydrochloric acid was used. / Liquid mixture, 09δ116843 15 201002859 [ Table i]

No. Water-soluble gold compound chelating agent Heterocyclic compound having a nitrogen atom in the molecule Example 1 Cyanidation First Admiral Ethylenediaminetetraacetic acid - Example 2 Cyanidation of the first gold potassium tri-ethyltetramine hexaacetate - Example 3 Cyanidation of the first gold potassium di-ethyltriamine pentaacetic acid - Example 4 Cyanidation of the first gold potassium ethylenediamine tetraacetic acid mouth U sit (intramolecular nitrogen is 2) Example 5 Cyanide One gold potassium ethylenediamine tetraacetic acid 2-aminoimidazole (three intramolecular nitrogens) Example 6 Cyanidation of the first gold potassium ethylenediamine tetraacetic acid 3-amino-1,2,4-triazole (molecule Example 4: Cyanidation of the first gold potassium ethylenediamine tetraacetic acid 5-aminotetrazole (5 intramolecular nitrogen) Example 8 Cyanidation of the first gold potassium ethylenediamine tetraacetate pyridine bite (1 in the intramolecular nitrogen) Comparative Example 1 Activator KAT-450 (manufactured by Uemura Kogyo Co., Ltd.) - Comparative Example 2 Activator of the market, ICPAcusela (manufactured by Okuno Pharmaceutical Co., Ltd.) - Comparative Example 3 Palladium - Comparative Example 4 Gasification 1 bar ethylenediaminetetraacetic acid - Comparative Example 5 Cyanide 1 bar - Comparative Example 6 Cyanide One gold potassium - [Evaluation] The catalyst-donating liquids obtained in Examples 1 to 8 and Comparative Examples 1 to 6 were used, and the following electroless reduction solder plating solutions (a) and (b) were used, as shown in Table 2. The steps were carried out by electroless reduction solder plating, and the obtained electroless reduction solder plating film was evaluated by the following method. <Preparation of Electroless Reduction Solder Plating Solution> The components are dissolved in pure water in the ratio shown below to prepare the electroless reduction solder plating solution (a) and b). In addition, in the case of containing crystal water, it is a part converted into "no crystal water". 16 098116843 201002859 Electroless reduction solder plating solution (a)

Trisodium citrate 100g/L

Ethylenediamine tetraacetate di-nano 30g/L

Nitrosotriacetic acid 38g/L

Gasification tin 18g/L

Lead chloride 0.4g/L

Titanium trichloride 6g/L

Electroless reduction solder plating solution (b)

Sodium sulphate 10g/L

Nitrosotrimethylenephosphonic acid 50g/L

Potassium citrate 30g/L

Titanium trichloride 5 g/L &lt;Production of evaluation substrate&gt; (§ Flat evaluation of substrate 1) The evaluation substrate of the form shown in Fig. 1 and Fig. 2 was produced. It is used on a substrate made of polytheneimide resin having a length of 4 mm x 4 mm x mm x 1.0 mm thick, and a circular copper pad having a diameter of 76.76 mm is arranged in a horizontal grid shape, and each copper pad is surrounded by light. The solder resist is covered by the solder. Each steel pad is formed of copper having a thickness of m, and the thickness of the photoresist of the soldering agent is the center m, and the diameter of the opening of the solder ball is 0.62 mm ° (evaluation substrate 2) 40 mmx horizontally as shown in FIG. 3 and FIG. Evaluation of the morphology of the substrate. In the longitudinal direction 098116843 17 201002859 40mm x 1.0mm thick polyimine resin substrate, copper wiring width 80 / z mx thickness 40 / zm is arranged at a width of 120 / / m. &lt;Method for Evaluating Precipitability of Electroless Reduction Solder Plating&gt; Using the catalyst-imparting liquids obtained in Examples 1 to 8 and Comparative Examples 1 to 6 and the electroless reduction solder plating solution (a) or (b), The electroless reduction solder plating was performed using the above-described evaluation substrate 1 and evaluation substrate 2, and the processing conditions of the following Table 2. Further, the treatment conditions of the respective catalyst-imparting liquids were carried out under the conditions of a carrier gold metal gold loading of 0.6 mg/dm2 (0.6 x 1 CT5 g/cm3). [Table 2] Step &lt;Split treatment agent treatment conditions Defatting PAC-200 (unit) Mulata system) 50 °Cx5 water wash soft type #刻 MEOX (股)Mulata system) 30 °Cxl water wash pickling 10% sulfuric acid room temperature x30 (2) or (b) 65t: x60 points of the electroless reduction solder plating film obtained as described above in each of the examples and the comparative examples obtained at 65 ° C x 2 parts of the electroless reduction solder plating. Column method evaluation. <Evaluation Method for Precipitation Uniformity of Electroless Reduction Solder Plating> The film thickness of the electroless reduction solder film formed on the solder ball pad copper of the substrate 1 was evaluated, and a fluorescent X-ray film thickness meter (SEA 5120, Seiko Instruments) was used. Co., Ltd.), 10 points were measured, and the precipitation uniformity of the electroless reduction solder plating was evaluated under the comparison of the average film thickness, the maximum film thickness, and the minimum film thickness. Further, the minimum measurement value of the minimum film 098116843 18 201002859 was evaluated as "precipitation". <Evaluation method of the jumper of the fine wiring> The steel wiring of the board 2 is observed by a scanning electron microscope (10), a Japanese clothing (hereinafter referred to as "(10)"), and the evaluation of the jumper of the fine wiring is performed. On the poly-polyamine, there was no precipitation in the material, and only the surface of the copper wiring formed an electroless reduction solder coating was judged as "good" and the non-electrolytic reduction solder precipitated on the umbrella imine resin. In the first example, the judgment (the representative example) of the determination of "good" is used as the criterion (denoted example) for determining "good". If the observation is not shown in Fig. 5, the ratio of the criterion (representative example) of the "defect" is %^example 6 The observation photograph of the situation is shown in Fig. 6. <Evaluation method of occurrence of voids> Evaluation of voids occurred when solder ball bonding was performed using a Bebe substrate. The evaluation of the precipitation of the above-mentioned electroless reduction solder paste was similarly treated and according to Table 2 The substrate for evaluation for forming a solder film on the ball pad is heated by IK U ^ for 5 hours. This heating condition is a heat treatment assuming a mounting step applied to the substrate. The flux pad is applied to the ball pad of the heat-treated substrate, A Sn-Ag-Cu lead-free solder ball with a diameter of 0.76 mm was used, and it was melted in a reflow oven (RF-430-M2, manufactured by Japan Puise Technology Co., Ltd.). The solder ball was melted. Comment The substrate 1 was cut to a size of about 15 mm x 15 mm to facilitate the operation, and was placed in a molding mold for cold-embedded resin, and a cold-embedded resin (No. 105, manufactured by Marumoto Stolus Co., Ltd.) and 098116843 19 were poured into the molding model. 201002859 The hardening agent hardens. The hardened sample is ground using a batch of abrasive paper and a grinder to expose the profile to see the joint section of the tin ball and the ball pad. Electron Microscope (3) 4300, manufactured by Nippon Seisakusho Co., Ltd.) Observe 5 balls, which is "None". Even if no gap is observed in the solder ball, it will be regarded as "a gap". "." In addition, the diameter of the gap between the pro, the τ, and the knuckle is judged as "the helmet of the helmet, and the brackets in Table 4 are shown in parentheses. The observation (4) of the case of the judgment _ 4 is shown in Fig. 7. The observation photograph of the case of Comparative Example 1 of the representative example is shown in Fig. 4, and the catalyst-containing liquid containing the water-soluble gold chemical substance 5 and the chelate of the present invention as an essential component has a ... The electrocatalytic reduction of solder deposits has sufficient effect on the catalyst: no wiring of the wiring, and (4) bismuth film. ^ 5, another factor is ^ ' does not contain the ratio of water-rich compounds _ 1 to the comparative example The thin film Γ original reaction begins to be sparse, so the hairline _ thick part becomes = Γ: 'even if it contains a water-soluble gold compound, but does not contain, 匕 is compared with the case 0, solder deposits occur in the insulator part, that is, jumper The substrate is defective. The electroless reduction solder plating film formed by the contact system containing a heterocyclic compound having two or more gases in the molecule is used for solder ball bonding on the skin. There is no void in the solder (the embodiment is the core. [Using electroless reduction welding Evaluation plating solution (a) of] 098 116 843 20 201 002 859 [Table 3]

No. Evaluation of the precipitation of electroless reduction solder plating. Evaluation of voids (maximum void diameter) Evaluation of precipitation uniformity if ( ^ m) Evaluation of the average thickness of the microwire wiring jumper The maximum film thickness Minimum film thickness Example 1 1.0 1.2 0.9 Good Yes (8 # m) Example 2 1.0 1.2 0.8 Good Yes (7 # m) Example 3 1.0 1.1 0.9 Good Yes (8 # m) Example 4 1.0 1.2 0.8 Good No Example 5 1.0 1.1 0.9 Good None Example 6 1.0 1.2 0.8 Good No Example 7 1.0 1.2 0.9 Good No Example 8 1.0 1.1 0.9 Good (7 //m) Comparative Example 1 0.5 0.7 〇.1 (uneven precipitation) Good (16#111 Comparative Example 2 0.5 0.7 〇.1 (uneven precipitation) Good (lSym) Comparative Example 3 0.5 0.7 〇.1 (uneven precipitation) Good (15//m) Comparative Example 4 0.5 0.7 〇.1 (precipitation) Uneven) Good (16#111) Comparative Example 5 0.5 0.7 〇.1 (uneven precipitation) Good (17#m) Comparative Example 6 0.9 1.0 0.7 Bad (16#111)

098116843 21 201002859 [Evaluation of electroless reduction solder plating solution (b) [Table 4]

(Industrial Applicability) The catalyst-imparting liquid for the electroless reduction soldering of the present invention is uniform in the genus, and is uniform (four), and can obtain the self-free and gold-origin soldering service without the jumper, and , village _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ In June, the content of the special August 4th is quoted here, and is incorporated in the specification of the invention of Taian. [Brief Description of the Drawings] Fig. 1 is a plan view showing the evaluation substrate 1 used in the examples and comparative examples of the present invention. 098 098116843 22 201002859 Fig. 2 is a cross-sectional view showing the evaluation substrate 1 used in the examples and comparative examples of the present invention. Fig. 3 is a plan view showing the evaluation substrate 2 used in the examples and comparative examples of the present invention. Fig. 4 is a cross-sectional view showing the evaluation substrate 2 used in the examples and comparative examples of the present invention. Fig. 5 is a SEM photograph (100 magnifications) showing a criterion for determining "good" by the evaluation of the jumper of the fine wiring, and is an example of SEM photograph (100 times) of Example 1. 6 is an SEM photograph (100 times) which is a criterion for judging the determination of "defect" in the evaluation of the jumper of the fine wiring, and is an example of the SEM photograph of Comparative Example 6 (100 times). FIG. 7 is a view showing the occurrence of voids. The SEM photograph (5000 times) which is a criterion for judging "none" is an example of SEM photograph (5000 times) of Example 4. Fig. 8 is a SEM photograph (5000 magnifications) showing a criterion for determining that the void evaluation is "Yes", and is an SEM photograph example (5000 magnifications) of Comparative Example 1. 098116843 23

Claims (1)

201002859 VII. Patent application scope: 1·- Kind of catalyst-donating liquid, made by steel-based solder ore deposit, characterized by H 1 reduction containing water 2. If applying for special _ 2 === A heterocyclic compound having two or more nitrogen atoms therein. M 3. If the catalyst is read in the scope of patent application, the gold compound is a gold cyanide salt. 8. Water sulphate 4. In the first to third patent applications, the above-mentioned chelating agent W is a catalyst-imparting liquid, and d is a chelating agent having a sub-private diacetate structure. In the catalyst-providing liquid's tank of any of the first to third aspects of the patent range, the palladium compound is not contained in the permeate. 8. If the catalyst-donating liquid of the fourth application of the patent system contains a palladium compound. The manufacturing method of the film on the μ shell is characterized in that the patent application and the catalyst-donating liquid of any one are used, and the original solder plating is performed on the copper-based metal. Ding 2: A method for manufacturing a 47-hour coating film, which is characterized in that it is subjected to electroless reduction of Tan Xi Qian on a copper-based metal by using a touch-reading of the patent application. 9. A method for soldering a tin film (4), which is characterized by a patent application: a catalyst-donating liquid, and an electroless reduction of bismuth tin on a copper-based metal. 098116843 24 201002859 10. A copper-based metal The solder plating film on the top is characterized by using the catalyst of any one of the first to third items of the patent application, and performing the electroless reduction of the known tin ore. 11. A solder on a copper-based metal The plating film is characterized in that it is subjected to an electroless reduction solder joint using the touch method of the fourth item of the patent application: (12. - A solder film on a copper-based metal, which is characterized by the use of the patent scope 5 kinds of catalyst liquid, electroless reduction soldering money: get. Also 13.- kinds of copper-based metal soldering film, which is characterized by the use of the test = the scope of the sixth item of the catalyst, The electroless reduction soldering deposit is obtained: 14·- soldering film, which is characterized by having gold of 3 lO'/cm2 or less on the copper-based metal and formed thereon. ', X 098116843 25