1275446 九、發明說明： 【發明所屬之技術領域】 本發明係涉及一種晶圓研磨環的製造方法以及構造， 特別疋扣该金屬環之表面係更施以研磨加工處理之創新設 計者。 【先前技術】 _ 按’習知晶圓研磨環的製造方法步驟，係先分別製作 一金屬環以及一塑膠環，復將該塑膠環貼合固定於金屬環 之一側面’其中該金屬環係僅藉由精密車製加工成型，為 增加其貼合面膠劑結合之牢固性，業界通常會於該金屬環 之貼合面再施以喷砂處理以獲得粗糙面效果，藉此以提增 膠劑之附著面積；惟，上揭習知晶圓研磨環的製造方法於 實際應用上仍存在下述之問題點： 該金屬環之貼合面施以噴砂處理後，其貼合面於微觀 φ 下係呈現不平整狀態，再加上膠劑層在尚未硬化之前亦為 不穩定之構造型態，如此所產生的誤差，使得該塑膠環於 完成貼合固定狀態後，其預定之研磨面平整度將出現相當 大的偏斜誤差值，以目前業界製造之實際現況而言，該塑 膠環研磨面之誤差值通常高達〇· 2mm ;惟，晶圓研磨環 成品於上機之後，其塑膠環之研磨面旋轉時必須具備最佳 之平整度方能符合預期之研磨精度及效果，但習知晶圓研 磨環成品卻如前所述存在過大之誤差值，為修正此一誤差 值，目前的作法，係在晶圓研磨環初次上機使用時，得先 5 1275446 進行無工件之前置研磨作業，亦即令該晶圓研磨環之研磨 、，直接工作平台進行接觸磨耗，直至其研磨面被磨耗至 平整狀態後，才能進行實際工件之研磨作業；而該前 磨作業若以前述研磨面之誤差狀態而t，—般必須耗用3 ~4小時才能完成，“匕可想而知，顯然造成研磨作業工時 的徒a浪費，且研磨機械進行此項前置研磨作業更將增 力:龐大的電能、機械耗損以及人事成本請（須有操作二 員看顧），實不符合較佳之產業利用效益。 ▲再者，該晶圓研磨環也將因為前揭因素所作之長時間 ^置研磨作業之故，使其在尚未進行實際工件研磨作業之 前’即必須隸㈣〇.2mm之㈣環厚度，這對於原本可 利用研磨厚度即相當淺薄之塑膠環而言（註：該塑膠環可 利用研磨厚度一般僅有3〜5mm )，如此顯然更造成該塑膠 環磨耗加速、使用壽命縮短之問題及缺弊。 疋以，針對上述習知晶圓研磨環製造方法所造成之問 題點及缺弊，如何研發出一種能夠大幅提昇晶圓研磨環成 口口精度，使其旎夠降低業界研磨加工成本之創新設計，實 有待相關業界再加以思索突破者。 有鑑於此，發明人本於多年從事相關產品之製造開發 與設計經驗，針對上述之目標，詳加設計與審慎評估後， 終得一確具實用性之本發明。 【發明内容】 ι27·5446 即’本發明之主要目的，係在提供-種晶圓研磨環製 造方法藝構造，JL所欲紘i — 八所欲解決之問題點，其係針對習知晶圓 研磨環製造方法係將JL塑膠援 灯/、型膠％貼合於金屬環一侧面即形成 其成品’ $而存在塑膠環之研磨面平整精密度誤差過大， 須進行長時間之無工件前置研磨作業而造成研磨工時延君 以及成本提高等問題點加以思索突破；所述晶圓研磨環製 以方法係先分別製作一金屬環以及一塑膠環，復將該塑膠 環貼合固定於金屬環之箆一 衣之弟側面，本發明解決問題之技術 特點，主要係於該金屬環之第二側面再施以研磨加工處理 、；藉此而相對令塑膠環之研磨面達到較佳之平整精密度， 進以大幅降低晶圓研磨環$如 -上機使用日可其研磨面平整精 逾、度之誤差值，得以大φ5始 、 巾田縮知:無工件之前置研磨作業時間 ’達到降低研磨機械之耗損、 冤此及人事成本、延長晶圓 研磨環之塑膠環使用喜合 > 击 衣便用可〒之較佳產業利用效益及進步性者 【實施方式】 、❸閱第1、2圖所示，係本發明晶圓研磨環製2 一構，之幸乂乜實施例’惟此等實施例僅供說明之用， 專^請上並不受此結構之限制；首Μ於該所述晶！ 磨裱製造方法的部份，其步驟係包括： a、分別製作一金屬環（1 0 )以及-塑膠環（2 0 ) “I該！屬％ ( 1 〇)係為具有預定厚度及内、夕 一 Q衣體型恶，其係可採用車削加工成型其外養 "^ 2膠％ ( 2 0 )則一般採用高分子塑膠材米 1275446 ’以具備足夠耐磨硬度，得作為一研磨晶圓之 介面者； b、 將該塑膠環（2〇)貼合固定於金屬環（1 〇)之第 一側面（1 1 ); c、 該塑膠環（2 0 )貼合固定於金屬環（1 〇 )第一側 (1 1)之後，係再以塑膠環（2〇)之研磨面（ 2 1 )為基準面（如第2圖之L線所示）對該金屬環 (1 0 )之弟一側面（1 2 )施以研磨加工處理，夢 參 此’構成該金屬環（1 0 )之第二側面（1 2 )係為 一種經過研磨處理、光滑而無車痕（指車床之車刀所 形成的刀痕）之表面型態；藉此即製成一晶圓研磨環 (A )成品者。 其中，該金屬環（〇 )與塑膠環（2 〇 )相貼合面 係可施以噴砂、塗膠手段達成貼合固定效果者。 其中’該塑膠環（2 〇)可在進行金屬環（1 〇)第 一側面（1 2 )研磨步驟之前或之後，於其研磨面（2 1 )没製數個廢物槽（2 2 )，此所述廢物槽（2 2 )係I 牙塑膠環（2〇)的内、外周緣，各廢物槽（22)夕、 、距間隔排列，其作用係用以向外摔出塑膠環（2 進行研磨時所產生之廢物。 ° 亦即，本發明藉由上揭製造方法所得之晶圓研磨環 構造，如第3、4圖所示，其中該第3圖所示為=圓 1275446 所磨環（A)之正面角度立體圖’第4圖所示則為晶圓研 磨環（A )之背面角度立體圖；該晶圓研磨環（a )係包 栝一金屬環（1〇)以及貼合固定於該金屬環（1〇)第 ，側面（1 1 )之-塑膠環（2 〇 );而其有別於習知構 造之處主要在於本發明金屬環（i 〇)之第二侧面（工2 )係為一種經過研磨加工處理、光滑而無車痕之表面型鎮 者。 〜BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and a structure for fabricating a wafer grinding ring, and in particular, an innovative designer who applies a polishing process to the surface of the metal ring. [Prior Art] _ According to the manufacturing method of the conventional wafer grinding ring, a metal ring and a plastic ring are separately prepared, and the plastic ring is attached and fixed to one side of the metal ring, wherein the metal ring system only borrows It is formed by precision car processing. In order to increase the firmness of the bonding of the bonding surface, the industry usually applies sand blasting to the bonding surface of the metal ring to obtain a rough surface effect, thereby increasing the glue. The attachment area; however, the manufacturing method of the conventional wafer grinding ring has the following problems in practical application: After the bonding surface of the metal ring is subjected to sand blasting, the bonding surface is presented under the microscopic φ The unevenness state, together with the gel layer before it is hardened, is also an unstable structural type. The error caused by the plastic ring is such that the predetermined polishing surface flatness will appear after the plastic ring is completed and fixed. The value of the deflection error of the plastic ring is usually as high as 〇·2mm. However, after the wafer grinding ring is finished, the plastic is plastic. The polishing surface must have the best flatness to meet the expected grinding precision and effect. However, the conventional wafer grinding ring product has an excessive error value as mentioned above. To correct this error value, the current practice, When the wafer grinding ring is used for the first time on the machine, the 5 1275446 first grinding operation without workpieces is performed, that is, the grinding ring of the wafer is ground, and the direct working platform is subjected to contact wear until the polished surface is worn until After the flat state, the actual workpiece grinding operation can be performed; and if the pre-grinding operation is in the error state of the grinding surface, it usually takes 3 to 4 hours to complete, "It is conceivable that the grinding is apparently caused by grinding. The working hours are wasteful, and the grinding machine will increase the force of this pre-grinding operation: huge electric energy, mechanical wear and personnel costs (required to operate two members), which does not meet the better industrial utilization benefits. ▲ Moreover, the wafer grinding ring will also be subjected to the grinding operation for a long time due to the precautionary factors, so that the actual workpiece grinding operation has not yet been performed. 'That must be (4) 〇. 2mm (four) ring thickness, which can be used to the thickness of the plastic ring that is relatively shallow (note: the plastic ring can be used only 3~5mm grinding thickness), so obviously The problem of the wear of the plastic ring is accelerated, the service life is shortened, and the disadvantages are lacking. In view of the problems and shortcomings caused by the above-mentioned conventional method for manufacturing the wafer grinding ring, how to develop a precision of the wafer grinding ring into a mouth can be greatly improved. In order to reduce the cost of the industry's grinding and processing, the innovative design has to be considered by the relevant industry. In view of this, the inventor has been engaged in the manufacturing development and design experience of related products for many years. After the design and careful evaluation, the invention is finally practical. [Abstract] ι27·5446 The main purpose of the present invention is to provide an art structure for the manufacture of a wafer grinding ring, which JL desires. i — Eight problems to be solved. The method for manufacturing the known wafer grinding ring is to attach the JL plastic lamp/type glue to the metal ring side. That is to say, the finished product '$ is formed, and the grinding surface of the plastic ring has too large precision precision, and it is necessary to carry out a long time without the workpiece pre-grinding operation, causing problems such as the length of the grinding time and the cost increase; In the method of the circular grinding ring, a metal ring and a plastic ring are separately prepared, and the plastic ring is attached and fixed to the side of the metal ring. The technical feature of the present invention is mainly based on the metal. The second side of the ring is further subjected to a grinding process, thereby achieving a better flatness of the polished surface of the plastic ring, thereby greatly reducing the number of wafer grinding rings, such as the use of the grinding surface. The error value of the precision and degree can be as large as φ5, and the towel field shrinks: the grinding time before the workpiece is 'reduced to reduce the wear of the grinding machine, and the cost of the personnel and the plastic ring of the wafer grinding ring. </ br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br><br> Example NIE qe 'provided that such other embodiments for illustrative purposes only, are not specifically limited thereto ^ Please structures; the crystal to the first Μ! The steps of the honing manufacturing method include the steps of: a. respectively forming a metal ring (10) and a plastic ring (20) "I: the % (1 〇) is a predetermined thickness and inner, Xiyi Q is a kind of body-like evil, which can be formed by turning and shaping it. "^ 2 glue% (20) is generally made of polymer plastic material meter 1275446" to have sufficient wear resistance and can be used as a grinding wafer. The interface of the plastic ring (2〇) is fixed to the first side (1 1 ) of the metal ring (1 ;); c, the plastic ring (20) is attached and fixed to the metal ring (1) 〇) After the first side (1 1), the grinding surface (2 1 ) of the plastic ring (2 )) is used as a reference surface (as shown by the L line in Fig. 2) to the metal ring (10) One side of the younger brother (1 2) is subjected to grinding processing, and the second side (1 2 ) constituting the metal ring (10) is a kind of polished, smooth and no car mark (referring to the lathe car) The surface shape of the knife mark formed by the knife; thereby forming a wafer grinding ring (A), wherein the metal ring (〇) and the plastic ring (2 〇) fit the surface It can be applied by sandblasting or gluing to achieve the effect of bonding. Among them, 'the plastic ring (2 〇) can be ground before or after the grinding step of the first side (1 2) of the metal ring (1 〇) No (1 2 ) no waste trough (2 2 ), the waste trough (2 2 ) is the inner and outer circumference of the I tooth plastic ring (2〇), and each waste trough (22) Arranged at intervals, the function is to fall out of the plastic ring (2 waste generated during grinding. ° That is, the wafer grinding ring structure obtained by the above manufacturing method, such as the third and fourth figures As shown in the third figure, the front angle perspective view of the ring (A) of the round ring 1275 is shown in Fig. 4, and the back angle angle view of the wafer grinding ring (A) is shown in Fig. 4; a) is a metal ring (1〇) and a plastic ring (2 〇) that is attached to the metal ring (1〇), side (1 1 ); and is different from the conventional structure Mainly in the second side of the metal ring (i 〇) of the present invention (Work 2) is a surface-type town that has been subjected to grinding processing, smooth and has no car marks.
【本發明之優點】 本發明對照習知之功效增進事實分析如下： 習知技術： =知晶圓研磨環製造方法係將其塑膠環貼合於金屬 環-側面即形成其成品，進而存在塑膠環之研磨面 平整精密度誤差過大’須進行長時間之無工件前置 研磨作業（3〜4小時）而造成研磨工時延宕以及 成本提高（包括研磨機械之耗損、電能以及人事成 本）之問題點。 2、晶®研磨環並因為研磨面平整精密度誤差過大，使 其在尚未進行實際卫件研磨作業之前即須磨耗掉相 當多的塑膠環厚度，此對於原本可則研磨厚度即 相當淺薄之塑膠環而言，顯將造成該塑朦環磨耗加 速、使用壽命縮短之問題及缺弊。 本發明： 1275446 毛明藉由在該塑勝環「 /衣（2〇)貼合®定於金屬環 〇 ) ^第—侧面（1 1 )後，再對該金屬環㈠ 特點·2側面（12)施以研磨加工處理之技術 俾可相對令塑膠環（2〇)之研磨面（2ι 磨，到較佳之平整精密度，進以可大幅降低晶圓研 衣（A )初次上機使用時其研磨面（2 1 )平整 精密度之誤差值，得以 正 ‘鈿紐無工件之前置研磨 間（至少可縮短至0 · 5小時），藉此而確Advantages of the Invention The present invention compares the known effect enhancement analysis to the following facts: Conventional technology: = The known wafer grinding ring manufacturing method is to laminate the plastic ring to the metal ring - the side surface to form the finished product, and then the plastic ring The grinding surface is flat and the precision error is too large. It is necessary to carry out the long-time workpiece-free pre-grinding operation (3 to 4 hours), which causes the grinding time delay and the cost increase (including the wear and tear of the grinding machine, electric energy and personnel cost). . 2, Crystal® grinding ring and because the grinding surface flatness precision error is too large, it must wear a considerable amount of plastic ring thickness before the actual grinding operation of the guard, which is the thickness of the plastic In terms of the ring, it will obviously cause the problem of accelerated wear and shortened service life of the plastic ring and its shortcomings. The present invention: 1275446 Mao Ming by the plastic ring " / (2 〇) bonding ® is set in the metal ring ^ ^ ^ side (1 1), then the metal ring (a) features · 2 sides ( 12) The technology of grinding processing can be used to relatively close the grinding surface of the plastic ring (2 〇), to the better flatness precision, which can greatly reduce the wafer coating (A) when it is used for the first time. The grinding surface (2 1 ) flattened the precision error value, so that the workpiece can be placed in front of the workpiece (at least shortened to 0.5 hours).
Λ達到降低研磨機械之耗損、電能及人事成本之較 佳產業利用效益。 2由於本發明所製出之晶圓研磨環（a )成品其研磨 面（2 1 )之平整精密度誤差值將可減降至^ # ®，因此使得該晶圓研磨環（A)初次上機使用時 進行無工件前置研磨作業時所磨耗掉之塑膠環（2 〇 )厚度可降至最少，讓塑膠環（2 Q )原本可利 用研磨厚度之不必要磨耗降至最低，進而達到延長 晶圓研磨環使用壽命之實用進步性者。 上述實施例所揭示者係藉以具體說明本發明，且文中 雖透過特定的術語進行說明，當不能以此限定本發明之專 利範圍；熟悉此項技術領域之人士當可在瞭解本發明之精 神與原則後對其進行變更與修改而達到等效之目的，而2 等變更與修改，皆應涵蓋於如后所述之申請專利範圍所1 定範_中。 10 1275446 【圖式簡單說明】 第1圖：係本發明晶圓研磨環製造方法之方塊示意圖。 第2圖：係本發明晶圓研磨環製造方法之平面簡示圖。 第3圖：係本發明晶圓研磨環成品之正面角度立體圖。 第4圖：係本發明晶圓研磨環成品之背面角度立體圖。 【主要元件符號說明】 金屬環 （10) 第一側面 （11) 塑膠環 （20) 研磨面 （21) 晶圓研磨環 （A ) 第二側面 （12) 廢物槽 （22)Λ Achieve better industrial utilization benefits by reducing the wear and tear of grinding machinery, electrical energy and personnel costs. 2 Due to the flatness of the wafer grinding ring (a) produced by the present invention, the flatness precision error value of the polished surface (2 1 ) can be reduced to ^ # ® , thus making the wafer grinding ring (A) first The thickness of the plastic ring (2 〇) worn during the pre-grinding operation without the workpiece can be minimized, so that the plastic ring (2 Q ) can be used to minimize the unnecessary wear of the grinding thickness. Practical advancement of the life of the wafer grinding ring. The above embodiments are intended to be illustrative of the present invention, and are not to be construed as limiting the scope of the invention. The principle is changed and modified to achieve the equivalent purpose, and the changes and modifications of 2 are to be included in the scope of the patent application as described later. 10 1275446 [Simple description of the drawings] Fig. 1 is a block diagram showing the manufacturing method of the wafer grinding ring of the present invention. Figure 2 is a plan view showing a method of manufacturing a wafer grinding ring of the present invention. Figure 3 is a front perspective view of the finished wafer grinding ring of the present invention. Figure 4 is a perspective view of the back side of the finished wafer grinding ring of the present invention. [Main component symbol description] Metal ring (10) First side (11) Plastic ring (20) Grinding surface (21) Wafer grinding ring (A) Second side (12) Waste chute (22)
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