1273927 九、發明說明： 發明所屬之技術領域 本發明提供—種粉末塗裝科法，尤指-種電場影響電 荷分佈形成預定圖樣之粉末塗裴方法。 先前技術 現今很多日常生活用品都需要經過表面處理，例如喷塗技術 或粉末塗料技術，以達職觀及賴產品的效用。祕傳統的 喷塗技術必須制溶劑來溶合塗料，因此需要花費大量的溶劑成 本並對溶船讀_作_處理，哺合環似X及生態的要求， 而粉末塗裝技術在製程上因為不f賴溶劑，_可以降低製作 成本，故已被業界大量使用。 立明參考圖一’圖一為習知利用電暈喷塗之粉末塗裝方法的示 心圖平板10為-欲進行縣塗裝之齡覆蓋紐。在進行電晕 、塗夺喷私12之喷嘴Μ會施加一電壓，以使經由喷嘴Μ喷出的 私flH有電何’並隨著対崎仙之氣流方向(圖巾箭頭方向） 而流動，然後咖於平板H)的表面上 ，最後再利用一光硬化或熱 1273927 硬化製程，使粉末16_於平板1G表面上，形成—平面膜。 傳統上，粉末塗織術只能對平坦的產品表面或已具有凹凸 ，案的覆蓋基材進行整面的粉末塗裝處理，並無法直接以粉末塗 裝技術在產^表面製作丨如浮雕醜的變化，也 形成特定圖樣’所以粉末塗裝處理後的產品外觀較為制式、固^。 因此’現行粉末錄技觸變通方法都是先_财_的模具 將產品表面罩住，留下具有_雜的細，隨後再彻電晕喷 塗法對產品表面噴塗粉末，以使粉末吸附在由模具孔洞中露出的 f品表面。然而，上述變通方法的壞處是，針對不_圖形和產 :尺寸都必須製作特定的模具，才能配合粉末塗裝技術製作出 需要的圖案。此外’習知粉末塗裝技術所製作出的塗層皆有一定 ，厚度’而為了滿足產品的尺寸需求，在設計時還必須考量公^ 變化’才能以習知粉末錄技術逐—對日漸普及的資訊、電腦及 消費性電子等產品分別作一適當的處理。 由前述可知，目前業界仍須對粉末塗裝技術做進一步的研發 及改良，才能突破以吨末塗裝技術產品呆_及缺少變化的限 制。 义 1273927 · 發明内容 •根據本㈣粉末錄方法之申請專利關，其包含有下列步 射、復蓋紐，於輯蓋紐表面定義&—預定圖樣，並 使定義有顧定隨之輕基材表_電荷分料未定義有 該預定圖樣之覆蓋基材表_電荷分佈，以及進行—電暈喷塗製 程’以使帶有铺之粉末倾於職蓋紐表面。 、 根據本發_末··之巾請專職圍，更揭露—種使定 義有預定®樣之覆蓋基材表面的電荷分佈不同於未定義有該預定 圖樣之覆蓋基材表面的電荷分佈方法，其係利用一化學方法所完 成，δ亥方法包含有下列步驟：在覆蓋基材表面上預定圖樣處塗饰 一化學塗料，並對該覆蓋基材施加一電壓，以使塗佈有該化學塗 料之覆蓋基材表面的電荷分佈不同於未定義有該預定圖樣之覆蓋 基材表面的電荷分佈。 根據本發明粉末塗裝方法之申請專利範圍，另揭露一種使定 義有該預定圖樣之覆蓋基材表面的電荷分佈不同於未定義有該預 1273927 定圖樣之覆蓋基材表_枝，其係—物财法航成，該 方法包s有下列步驟·_覆蓋紐提供—外加場，用以影響該 覆蓋基材表_電荷雛錢荷運祕徑，並·覆蓋基材施加 -電壓，以使該覆蓋基材表面的電荷隨該外加場而呈不同的電荷 分佈。 由於本t月之％末塗裝方法係在覆蓋基材表面塗上特殊化學 塗料或對覆蓋基材提供-外加場，峡帶有電荷的粉末被喷塗於 覆蓋基材上時，會自輯紅述料駐基材耕加條件而形成 -預定圖案或厚度；F同輸末料，故可有效突破習知粉末塗裝 技術中只能呆板地對物體做整面表面處_關，並大幅節省製 程時間和成本。 實施方式 清參考圖二至圖三，圖二至圖三為本發明粉末塗裝方法之第 -實施例的示意圖。首先，提供-個需要進行粉末塗裝製程的覆 蓋基材3G，覆蓋基材30可以為塑性材質或者齡金、鎂合金等金 屬材質，且依覆蓋基材30的材質或餘需要，覆蓋基材3味面可 以另外塗上-層導電漆作為底漆。然後在覆蓋基材3味面定義出 -預定圖樣32，並將摻混了緩衝劑的電荷中荷劑％塗佈至覆蓋基 1273927 材30表面具有預定圖樣32的位置處。其中，塗佈電荷中荷劑弘至 預定圖樣32表面的方式有很多種，習於此技藝者可以利用任何方 式來將電荷巾荷娜均勻塗佈於覆蓋紐3G上的默圖樣32處， 例如，利用網版印刷或是利用一喷嘴開口很小的喷搶34將電荷中 荷劑36喷塗至覆蓋基材3〇表面，如圖二所示。 接著如圖二所示，對覆蓋基材施加一電壓，使得覆蓋基 材30表面塗佈有電荷中荷劑36之處不具有電荷或僅有微弱電荷分 佈而復蓋基材3〇上沒有塗佈電荷中荷劑36之表面則會具有高量 的電何。然後進行—電暈喷塗製程，使用喷槍38，將帶有相反電 荷的私末40噴塗至覆蓋基材3味面，此時，粉末4〇會吸附在覆蓋 基材3味面沒有塗佈電射荷船6之處，而覆蓋基_表面上塗 佈有電何中荷劑36的位置則會完全不吸附或吸附些微的帶電荷粉 末4〇。取後再進行—粉末硬化製程，使粉末侧定於覆蓋基材30 上。其中，_末硬化製程可為—使用紅外線、料線等光硬化 製程或熱硬化製程。 在本么明之第二實施例巾，係湘—物理松使帶電荷的粉 末在復蓋基材50上形成一預定的圖樣。請參考圖四，圖四為本 發明2塗裝方法之第二實施例的示意圖。首先，在欲喷塗粉末 的復蓋基材5〇上提供一外加場(未顯示），例如，將能夠產生磁力 1273927 線54之裝置架&在覆蓋基材SG的周遭，以使覆蓋基材$味面產生 ’並對覆蓋基材50提供一電壓ν〇，使覆蓋基材5味面的 電他著外加％而呈不同的分佈。接著再以喷槍％將帶有電荷之 私末52喷塗於覆蓋基材5〇上，因此帶有靜電荷的粉末52會隨著磁 力線的刀佈’ _u不同的厚度麵狀吸附在覆蓋基_表面，最後 再進仃&末硬化製程’即可得到表面具有預定圖樣之覆蓋基材 5〇。在本發明之第二實施例十’對覆蓋基材％所提供的外加場包 2場、磁場、力場和風場，也可以結合上述不同之外加場，對# 復蓋基材50提供一更後雜的環境條件，使粉末幻在覆蓋基材％表 面形成各種不同的預定圖樣。 、 〜t I村同時彻上述之化學及物 法，來完成覆蓋基材表面之粉末塗裝製程。換句話說，本發BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention provides a powder coating method, and more particularly to a powder coating method in which an electric field affects a charge distribution to form a predetermined pattern. Prior Art Many of today's daily necessities require surface treatments, such as spray coating or powder coating technology, to achieve the benefits of the product and the product. The traditional spray technology must make a solvent to dissolve the paint, so it takes a lot of solvent cost and the processing of the tank is processed, the feeding ring is like X and ecological requirements, and the powder coating technology is in the process because It does not depend on solvents, _ can reduce the production cost, so it has been widely used in the industry. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic drawing plate 10 of a conventional powder coating method using corona spraying for the purpose of ageing a county. After the corona and the spray nozzle 12 are applied, a voltage is applied to make the private flH that is ejected through the nozzle 有, and flow with the direction of the gas flow of the 対崎仙 (the arrow direction of the towel). Then, it is applied to the surface of the flat plate H), and finally a photohardening or heat 1273927 hardening process is used to form the powder 16_ on the surface of the flat plate 1G to form a flat film. Traditionally, powder coating has only been able to apply a full-surface powder coating to a flat product surface or a surface that has been embossed, and it cannot be directly coated with powder coating technology. The change also forms a specific pattern. Therefore, the appearance of the product after powder coating treatment is relatively standard and solid. Therefore, the current method of powder recording technology is to cover the surface of the product with the mold of the first _ _ _, leaving a fine with _ miscellaneous, and then spray the powder on the surface of the product by corona spray method to make the powder adsorb The surface of the product exposed by the hole in the mold. However, the disadvantage of the above-described workaround is that a specific mold must be made for both the pattern and the size of the product to be able to produce the desired pattern in accordance with the powder coating technique. In addition, the coatings produced by the conventional powder coating technology have a certain thickness, and in order to meet the size requirements of the products, it is necessary to consider the public changes in the design to be able to become popular with the conventional powder recording technology. Information, computers and consumer electronics are handled separately. It can be seen from the above that the industry still needs to further develop and improve the powder coating technology in order to break through the limitations of the coating technology products and the lack of changes.义1273927 · SUMMARY OF THE INVENTION • According to the application of the (4) powder recording method, the patent application includes the following steps, covering the button, defining the surface of the cover and the predetermined pattern, and making the definition a light basis. The material table _ charge material is not defined with the cover sheet table_charge distribution of the predetermined pattern, and the -corona spray process is performed to allow the powder with the paving to be placed on the surface of the cover. According to the hair of the present invention, it is necessary to disclose the charge distribution method of the surface of the cover substrate which is defined by the predetermined pattern, and the charge distribution method of the surface of the cover substrate which is not defined with the predetermined pattern, The method is completed by a chemical method comprising: coating a chemical coating on a predetermined pattern on the surface of the covering substrate, and applying a voltage to the covering substrate to apply the chemical coating. The charge distribution covering the surface of the substrate is different from the charge distribution of the surface of the cover substrate on which the predetermined pattern is not defined. According to the patent application scope of the powder coating method of the present invention, a charge distribution of the surface of the cover substrate defining the predetermined pattern is different from that of the cover substrate which is not defined with the predetermined pattern 1273927. The method of the money method, the method package s has the following steps: _ cover the new offer - the additional field is used to affect the cover substrate table _ charge chicks to transport the secret path, and cover the substrate to apply - voltage, so that The charge covering the surface of the substrate exhibits a different charge distribution with the applied field. Since the % final coating method of this month is to apply a special chemical coating on the surface of the covering substrate or to provide an external field to the covering substrate, the charged powder of the gorge is sprayed on the covering substrate, and will be self-assembled. The red material is formed in the substrate to form a predetermined pattern or thickness; the F is the same as the final material, so it can effectively break through the conventional powder coating technology and can only make the entire surface of the object in a rigid manner. Save process time and cost. Embodiments Referring to Figures 2 to 3, Figures 2 to 3 are schematic views of a first embodiment of a powder coating method of the present invention. First, a cover substrate 3G that needs to be subjected to a powder coating process is provided. The cover substrate 30 may be a plastic material or a metal material such as gold or magnesium alloy, and cover the substrate according to the material of the cover substrate 30 or the remainder. The 3 flavors can be additionally coated with a layer of conductive paint as a primer. Then, a predetermined pattern 32 is defined on the cover substrate 3, and the charge-loading agent % blended with the buffer is applied to a position where the surface of the cover 1273927 material 30 has a predetermined pattern 32. There are many ways to apply the charge charge agent to the surface of the predetermined pattern 32. Those skilled in the art can apply the charge towel to the uniform pattern 32 on the cover 3G in any way, for example, The charge charge agent 36 is sprayed onto the surface of the substrate 3 by screen printing or by using a nozzle 34 having a small nozzle opening, as shown in FIG. Next, as shown in FIG. 2, a voltage is applied to the covering substrate so that the surface of the covering substrate 30 is coated with the charge carrier 36 without charge or only a weak charge distribution to cover the substrate 3 without coating. The surface of the charge charge 36 will have a high amount of electricity. Then, a corona spraying process is performed, and the oppositely charged private 40 is sprayed to cover the surface of the substrate using the spray gun 38. At this time, the powder 4〇 is adsorbed on the cover substrate and the taste surface is not coated. The location of the electric boat 6 is covered, and the position of the coating substrate on which the surface of the coating agent 36 is applied does not adsorb or adsorb a slight amount of charged powder 4〇. The powder hardening process is then carried out to set the powder side to cover the substrate 30. Among them, the _ final hardening process can be - using a light hardening process such as infrared rays or a material line or a heat hardening process. In the second embodiment of the present invention, the charged-physical loosely charged powder forms a predetermined pattern on the covering substrate 50. Referring to Figure 4, Figure 4 is a schematic view of a second embodiment of the painting method of the present invention. First, an additional field (not shown) is provided on the cover substrate 5 of the powder to be sprayed, for example, a device holder & which is capable of generating a magnetic force 1273927 line 54 to cover the periphery of the substrate SG so as to cover the substrate The material has a different distribution of the surface of the substrate 50. Then, the charged 52 is sprayed on the covering substrate 5〇 with the lance%, so that the electrostatically charged powder 52 is adsorbed on the covering base with the thickness of the knives of the magnetic lines of force. The surface, and finally the 硬化 & final hardening process, can be used to obtain a cover substrate having a predetermined pattern on the surface. In the second embodiment of the present invention, the applied field 2 field, the magnetic field, the force field and the wind field provided by the cover substrate % may also be combined with the above-mentioned different addition fields to provide a more cover for the #covered substrate 50. The post-mixing environmental conditions cause the powder to form a variety of different predetermined patterns on the surface of the substrate. ~~I Village simultaneously completes the above chemical and physical methods to complete the powder coating process covering the surface of the substrate. In other words, this hair
=實_是先在錢基材絲具有默赚處塗上能夠教 =佈的化學塗料，例如電荷中荷劑，接著對該覆 ^，蝴恤_繼紐表 = 佈，然後再對覆蓋基材提供-外加場，例如電場、磁場、力 原耗蓋基材表面㈣荷雜錢荷運動路徑: /、有特疋圖樣之覆蓋基材。 10 1273927、 請參考圖五，圖五為本發明粉末塗裝方法之第四實施例的示 意圖。在本實施财’係_會辟縣物職或分佈的外加 場’使帶電荷的粉末62被喷塗於覆蓋基材6〇上時自然形成一預定 的圖樣。如圖五所示’先在欲喷塗粉末_覆蓋基上提供一 外加場(未顯示），例如’將能夠產生電力線64之裝置架設在覆蓋基 材60的周遭1使覆蓋基表面產生—電場，接著再以喷_ 將帶有電荷之粉末㈣塗於覆蓋基_上，使帶有靜電荷的粉末 62隨著電力線64的分佈，於覆蓋基獅表面形成_特定的形狀。 最後再進行-粉末魏製程，即可得職面料敢囉之覆蓋 基材60。在本實施财，對覆蓋基獅所提供的外加場包括電場、 磁場、力場和風場，也可結合不同之外加場，城蓋 更複雜的魏餅，錄末62在輕基_表娜^種不同的 預定圖樣。 相較於習知技術，本發明係對覆蓋基材塗佈化學電荷中荷劑 或藉由施加可控_外加場’來影響帶電荷粉末之分佈及運動途 径’以使粉末在吸附至肢基材表鱗，便能形成預定的圖樣， 科需另外使用其他模具或加以式，甚至相使粉末具有不同 之厚度’形成如浮雕㈣化，能大幅改㈣末塗裝技術的限 制’製作出具有豐富變化性的產品。 1273927 、上所述僅本發明之較佳實細，凡依本發日种請專利範圍 所做之均等舰與修飾1應屬本發明糊之涵蓋範圍。 圖式之簡單說明 圖一為習知利用電暈喷塗之粉末塗裝方法的示意圖。 圖二至圖三為本發明粉末塗裝方法之第一實施例的示意圖。 圖四為本發明粉末塗裝方法之第二實施例的示意圖。 圖五為本發明粉末塗裝方法之第四實施例的示意圖。 圖式之符號說明 平板 14 噴嘴 覆蓋基材 34喷搶 38噴搶 5G覆蓋基材 54磁力線 6G覆蓋基材 64電力線 12噴搶 16粉末 32預定圖樣 36電荷中荷劑 40粉末 52粉末 56噴搶 62粉末 66噴搶= Real _ is to first apply a chemical coating that can teach = cloth in the money base silk, such as the charge of the charge, and then the cover, the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Material supply - external field, such as electric field, magnetic field, force source cover substrate surface (four) load-loaded movement path: /, with a special pattern covering the substrate. 10 1273927, Please refer to FIG. 5, which is a schematic view of a fourth embodiment of the powder coating method of the present invention. In the present implementation, the charged field 62 is sprayed onto the cover substrate 6 to naturally form a predetermined pattern. As shown in FIG. 5, 'an additional field (not shown) is provided on the powder to be sprayed onto the substrate, for example, 'the device capable of generating the power line 64 is mounted on the periphery of the covering substrate 60 to generate an electric field on the surface of the covering substrate. Then, the charged powder (4) is applied to the cover substrate by spraying _, so that the electrostatically charged powder 62 forms a specific shape on the surface of the covered lion with the distribution of the electric power line 64. Finally, the powder-Wei process can be used to cover the substrate 60. In this implementation, the external field provided by the cover lion includes electric field, magnetic field, force field and wind field. It can also be combined with different additions. The more complex Wei cake in the city cover, recorded at the end of the light base _ table Na ^ Different kinds of predetermined patterns. Compared with the prior art, the present invention applies a chemical charge charge to the cover substrate or affects the distribution and movement path of the charged powder by applying a controllable_applied field 'to make the powder adsorb to the limb base. The material scale can form a predetermined pattern. The department needs to use other molds or formulas, and even make the powder have different thicknesses. The formation of the embossing (four) can greatly change the (four) limit of the final coating technology. Rich and versatile products. 1273927, the above is only the preferred embodiment of the present invention, and the equivalent ship and modification 1 made according to the scope of the present invention should be covered by the paste of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view of a conventional powder coating method using corona spraying. 2 to 3 are schematic views showing a first embodiment of the powder coating method of the present invention. Figure 4 is a schematic view showing a second embodiment of the powder coating method of the present invention. Figure 5 is a schematic view showing a fourth embodiment of the powder coating method of the present invention. The symbol of the figure shows the flat plate 14 nozzle covering the substrate 34 spray grab 38 spray grab 5G cover substrate 54 magnetic line 6G cover substrate 64 power line 12 spray grab 16 powder 32 predetermined pattern 36 charge medium load 40 powder 52 powder 56 spray grab 62 Powder 66 spray