TWI272298B - Silicone adhesive composition and adhesive tape thereof - Google Patents
Silicone adhesive composition and adhesive tape thereof Download PDFInfo
- Publication number
- TWI272298B TWI272298B TW92133415A TW92133415A TWI272298B TW I272298 B TWI272298 B TW I272298B TW 92133415 A TW92133415 A TW 92133415A TW 92133415 A TW92133415 A TW 92133415A TW I272298 B TWI272298 B TW I272298B
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive composition
- unit
- polyorganosiloxane
- silicone adhesive
- diorganopolysiloxane
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract description 8
- 239000002390 adhesive tape Substances 0.000 title abstract description 3
- 239000013464 silicone adhesive Substances 0.000 title abstract 4
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 229920005645 diorganopolysiloxane polymer Polymers 0.000 abstract 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 abstract 2
- 125000003342 alkenyl group Chemical group 0.000 abstract 1
- -1 amine compound Chemical class 0.000 abstract 1
- 239000003054 catalyst Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 150000002978 peroxides Chemical class 0.000 abstract 1
- 229910052697 platinum Inorganic materials 0.000 abstract 1
- 229910001220 stainless steel Inorganic materials 0.000 abstract 1
- 239000010935 stainless steel Substances 0.000 abstract 1
- 238000010030 laminating Methods 0.000 description 1
- 239000002530 phenolic antioxidant Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
This invention is to provide a silicone adhesive composition and an adhesive tape thereof which can be peeled off without leaving adhesive residue when applied on an object made of metal, particularly stainless steel, to mask them and heated to a temperature as high as 300 DEG C. This invented peroxide curable silicone adhesive composition comprises a diorganopolysiloxane (A), a polyorganosiloxane (B) comprising R<1>3SiO0.5 unit and SiO2 unit in a molar ratio of the R<1>3SiO0.5 unit to the SiO2 unit of from 0.6 to 1.7. Also provided are an addition-reactive silicone adhesive composition comprising a diorganopolysiloxane (A') having 2 or more alkenyl groups, a polyorganosiloxane (B), a hindered amine compound (C) a polyorganosiloxane (E) having SiH group, a retarder (F), and a platinum catalyst (G).
Description
1272298 組成物,其中該聚二有機砂氧院爲含有1〜35莫耳°/°二苯 基甲矽院氧基單位者。 5.如申請專利範圍第3項之聚矽氧黏著劑組成物,其 中使做爲(Η )成份含有對1 00 重量份(A ) 、( B )合計 而言爲〇·1〜1〇重量份之苯酚系抗氧化劑。 6· —種黏著膠帶,其特徵係於塑膠薄膜之至少單面 上進行層合如申請專利範圍第1項或第3項之聚矽氧黏著劑 組成物之硬化物層者。1272298 Composition, wherein the polydiorganotate is a oxy unit containing 1 to 35 mol/° diphenylcarbendazim. 5. The polyoxyxene adhesive composition according to item 3 of the patent application, wherein the composition of the (Η) component is 〇·1~1〇 in weight for 100 parts by weight of (A) and (B). A portion of the phenolic antioxidant. 6. An adhesive tape characterized by laminating at least one side of a plastic film, such as a hardened layer of a polyoxyxide adhesive composition of claim 1 or 3.
-3--3-
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002344919 | 2002-11-28 | ||
JP2003389464A JP4727139B2 (en) | 2002-11-28 | 2003-11-19 | Silicone adhesive composition and adhesive tape |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200417591A TW200417591A (en) | 2004-09-16 |
TWI272298B true TWI272298B (en) | 2007-02-01 |
Family
ID=32774840
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW92133415A TWI272298B (en) | 2002-11-28 | 2003-11-27 | Silicone adhesive composition and adhesive tape thereof |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4727139B2 (en) |
TW (1) | TWI272298B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI481691B (en) * | 2009-11-10 | 2015-04-21 | Shinetsu Chemical Co | Silicone adhesive composition and adhesive film |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005272697A (en) * | 2004-03-25 | 2005-10-06 | Shin Etsu Chem Co Ltd | Curable silicone resin composition, sealing material for optical semiconductor and optical semiconductor device |
JP2006028311A (en) * | 2004-07-14 | 2006-02-02 | Shin Etsu Chem Co Ltd | Silicone adhesive composition having excellent heat resistance and production method |
FR2879612B1 (en) * | 2004-12-21 | 2007-05-04 | Rhodia Chimie Sa | SILICONE ELASTOMER COMPOSITION, ADHESIVE, MONOCOMPONENT AND CROSS-LINKABLE BY POLYADDITION |
JP2006199498A (en) * | 2004-12-22 | 2006-08-03 | Konica Minolta Holdings Inc | Inkjet printer and recorded product produced thereby |
JP4516008B2 (en) * | 2005-12-12 | 2010-08-04 | 信越ポリマー株式会社 | Manufacturing method of holding jig |
US7560166B2 (en) * | 2005-12-28 | 2009-07-14 | 3M Innovative Properties Company | Adhesive article, composite article, and methods of making the same |
JP4505644B2 (en) * | 2006-02-17 | 2010-07-21 | フジコピアン株式会社 | Fixed sheet |
JP4505645B2 (en) * | 2006-02-17 | 2010-07-21 | フジコピアン株式会社 | Affixing the fixed sheet |
JP4505646B2 (en) * | 2006-02-20 | 2010-07-21 | フジコピアン株式会社 | Fixed sheet |
JP4505649B2 (en) * | 2006-03-23 | 2010-07-21 | フジコピアン株式会社 | Fixed sheet |
JP5019893B2 (en) * | 2007-01-26 | 2012-09-05 | リンテック株式会社 | Re-peelable pressure-sensitive adhesive sheet and coating film protection method |
JP5309714B2 (en) * | 2007-07-04 | 2013-10-09 | 信越化学工業株式会社 | Silicone pressure-sensitive adhesive composition having antistatic properties and silicone pressure-sensitive adhesive tape |
FR2919615A1 (en) * | 2007-08-02 | 2009-02-06 | Bluestar Silicones France Soc | ADHESIVE SILICONE ELASTOMERIC COMPOSITION |
WO2009028455A1 (en) | 2007-08-27 | 2009-03-05 | Lintec Corporation | Releasable adhesive sheet and method for protecting incompletely cured coating film |
JP5963395B2 (en) * | 2011-03-04 | 2016-08-03 | タツタ電線株式会社 | Protective tape |
JP5592330B2 (en) * | 2011-10-07 | 2014-09-17 | 信越化学工業株式会社 | Temporary adhesive composition and thin wafer manufacturing method using the same |
US9840594B2 (en) | 2014-01-31 | 2017-12-12 | Shin-Etsu Chemical Co., Ltd. | Organopolysiloxane compound and method for producing the same, and addition-curable silicone composition |
KR20180028404A (en) | 2015-07-01 | 2018-03-16 | 디아이씨 가부시끼가이샤 | Stabilizer compounds, liquid crystal compositions and display elements |
CN108699444B (en) | 2016-03-08 | 2020-02-28 | Dic株式会社 | Liquid crystal composition and liquid crystal display element using same |
JP6733241B2 (en) | 2016-03-18 | 2020-07-29 | 信越化学工業株式会社 | Addition curable silicone rubber composition, method for producing the same and cured product |
JP6691802B2 (en) * | 2016-03-29 | 2020-05-13 | アイカ工業株式会社 | Silicone adhesive composition and adhesive tape |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0726085B2 (en) * | 1988-09-21 | 1995-03-22 | 信越化学工業株式会社 | Silicone pressure sensitive adhesive composition |
JP2962645B2 (en) * | 1993-12-28 | 1999-10-12 | 積水化学工業株式会社 | Surface protection film |
JP2000265646A (en) * | 1999-03-19 | 2000-09-26 | Sekisui Chem Co Ltd | Floor component |
JP4838926B2 (en) * | 2000-07-18 | 2011-12-14 | リンテック株式会社 | Adhesive composition and adhesive optical member using the same |
JP4619486B2 (en) * | 2000-06-01 | 2011-01-26 | 日東電工株式会社 | Lead frame laminate and method for manufacturing semiconductor component |
JP3751186B2 (en) * | 2000-06-14 | 2006-03-01 | 信越化学工業株式会社 | Silicone adhesive composition |
JP4823431B2 (en) * | 2001-01-30 | 2011-11-24 | 東レ・ダウコーニング株式会社 | Room temperature curable silicone rubber composition |
-
2003
- 2003-11-19 JP JP2003389464A patent/JP4727139B2/en not_active Expired - Fee Related
- 2003-11-27 TW TW92133415A patent/TWI272298B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI481691B (en) * | 2009-11-10 | 2015-04-21 | Shinetsu Chemical Co | Silicone adhesive composition and adhesive film |
Also Published As
Publication number | Publication date |
---|---|
JP2004190013A (en) | 2004-07-08 |
TW200417591A (en) | 2004-09-16 |
JP4727139B2 (en) | 2011-07-20 |
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Legal Events
Date | Code | Title | Description |
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MM4A | Annulment or lapse of patent due to non-payment of fees |