TWI272121B - Waste gases treatment apparatus and method - Google Patents

Abstract

A waste gases treatment apparatus is provided with a waste gases pre-treatment apparatus for treating waste gases discharged from semiconductor (or LCD) manufacturing equipment by using a dry-type treatment method to lengthen a life span of the waste gases treatment apparatus, and provided with a humidity eliminating device for eliminating moisture contained in the finally treated gases to prevent an exhaust duct from dewing. In addition, composing a shield unit in a heating chamber for combusting the waste gases prevents an inner part of the heating chamber from corroding by fluorine gases, improving a cooling structure for cooling a lower part of the heating chamber prevents powder clogging, and improving a supply structure of the waste gases supplied to the heating chamber lengthen a staying time of the waste gases in the heating chamber.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exhaust gas treatment apparatus that can more efficiently process exhaust gas discharged from a semiconductor or LCD fabric. method. Description of the Prior Art « Various manufacturing equipment and manufacturing methods are necessary in the case of m semiconductor devices, and due to the 10 CVD (chemical vapor deposition), plasma etching, and epitaxial evaporation in the method for fabricating the semiconductor device Process characteristics such as sputtering and sputtering have previously used various toxic, corrosive and flammable gases such as 33⁄4, SiA, SiF4, SiA, DCS (SiH2Cl), NH3, AsH3 4PH3, B2H6, GeH4, WF6. , TEOS, TEB, TEPO, TMB, TDMAT, NF3, CF4, C2F6, C3F8 〇15 Therefore, when toxic gases are used in the semiconductor device manufacturing method to be discharged into the air without any purification process, these toxic gases will be contaminated. The air has a serious impact on the human body and the ecosystem, so a conventional semi-conductor device production line has an exhaust gas treatment device installed at a predetermined position, and the exhaust gas treatment device is used to purify the semiconductor device manufacturing method. The toxic gas generated reaches below a reference value, and the toxic gas is discharged into the air. At present, there are usually three conventional exhaust gas treatment methods for achieving the aforementioned purposes, that is, the first method is a wet method in which an exhaust gas mainly containing a water-soluble composition is dissolved in water, and the second is contained in an exhaust gas at a high temperature. It can be 6 1272121. The third part is the physical law or chemical material. . However, in consideration of the stability and the effect of the industrial use, the exhaust gas treatment I, which is really widely used, usually uses a combination of the wet method, the sintering method and the absorption method. In particular, conventionally, the combination of the species ' and the σ ▲ wet method and the combustion method (hereinafter referred to as a combustion/wet method exhaust gas treatment device) is used to perform the effective purification treatment of the exhaust gases. · The combustion-wet process exhaust gas treatment device purifies the exhaust gases by burning the flammable substances contained in a combustion chamber and oxidizing them: 10 utilizing the exhaust gas in which the water is sprayed In order to separate a powder such as Shixia oxide which is produced during the combustion process, and at the same time remove the water-soluble ones at the same time! However, the problem with this combustion-wet exhaust gas treatment device is that powder clogging and corrosion are still present in general similar to other types of exhaust gas treatment devices. In the tncvD chamber, the exhaust gas 15 treatment device enters the exhaust gas 15 treatment device, and the fine powder contained in the exhaust gas gradually adheres to the inner wall, the pipe structure or the conduit of the combustion chamber to cause powder blockage, so it is necessary to The exhaust gas treatment device is often repaired. At the same time, the corrosive gas contained in the F or F2 can easily adhere to the inner wall of the pipe structure or the guide wall, so that they can be rotted, thereby reducing the exhaust gas treatment device. in. In general, shortening the maintenance cycle of such exhaust gas treatment devices is directly related to the use of semiconductors or LCD costs. Therefore, in order to solve these problems, a concept of installing a wet pretreatment device having a first removal at the front end of the exhaust gas treatment device before the exhaust gas enters the exhaust gas treatment device is produced. The function of corrosive 1272121 gas or fine powder contained in the exhaust gas. A conventional exhaust gas treatment system using the wet pretreatment apparatus is disclosed in U.S. Patent Nos. 5,955,037 and 5,649,985, the entire disclosure of which is incorporated herein by reference. A wet pretreatment unit which is installed to remove fine powder or acid gas contained in the exhaust gas before the exhaust gas enters the oxidation chamber. Accordingly, the wet pretreatment unit uses a wet spray tower method of adhering gas, bubbles, and the like to the exhaust gas so that the particles agglomerate to separate and remove the particles. In detail, the wet spray tower 10 method utilizes a fine particle nozzle at the upper portion of the wet pretreatment unit to spray water down in a micro-atomized state, and simultaneously allows the exhaust gas to pass through. Into the manhole at the lower part of the «pretreatment unit, the incoming pretreatment is pre-processed π and moved upwards, so that the fine particles or acid gases can be removed by bringing the argon into contact with each other in the process. Although the cost of installation, maintenance and management can be reduced, the repair is very convenient: the disadvantage of touching this method is that the water particles and the exhaust gas reduce the processing efficiency of the scale exhaust gas, because the toxic semiconductor material of the exhaust gas generated by the continuous disposal The wet pretreatment unit is installed as a pretreatment unit, and the gas is removed to remove water-soluble components from the semiconductor heating unit (4), which can be hydrolyzed into the exhaust gas, and the patent is included in the waste gas. Exposure - at least the method of spraying ^. In particular, the method of removing the granules by the method of removing the granules is to narrow the cross section through which the exhaust gas passes. The thin waist tube is a person who sprays the washing water at a high speed to accelerate the fluid. The exhaust gas entering the mouth of the thin waist tube is cleaned by the high pressure of water particles sprayed from the nozzle, and the sprayed water particles are pressurized so that the fine waist can be passed at a high speed. Throat. At this time, since the water particles are similar in flow direction to the fluids of the exhaust gases, an effective contact can be made between the exhaust gases and the water particles. By this contact, the water-soluble component, the hydrolyzable component and the dust in the exhaust gas can be removed by a process such as hydrolysis or dissolution. Although these 10 methods have extremely high exhaust gas treatment efficiency in combination with the spray tower method and the thin waist tube method, the disadvantage of this method is due to the high-speed flow of water particles and exhaust gas at the throat of the thin waist tube. The resulting pressure drop, the rapid pressure drop in the wet pretreatment unit, creates a problem that prevents the thermally decomposed exhaust gas in the oxidation chamber as the next unit from being discharged to the outside of the chamber. In fact, in order to solve this problem, the 985 patent uses an exhaust fan to easily discharge the pyrolyzed gas to the outdoor portion, but the installation table of the exhaust fan does not have to be added to a gas scrubber. A new component will therefore increase the manufacturing cost of the scrubber. On the other hand, if it is a conventional combustion device, the inside of a heating chamber is cleaned after a predetermined combustion process is completed through a heating chamber for the shaft-combustion space, in which case the Fluorine gas such as WCF4, c2f6, NF3. A disadvantage of the burner is that the process gas supplied to the interior of the chamber, such as the fluorinated gas as a cleaning gas for the plating apparatus, will react under the heating of a heater of 1272121 to corrode the chamber. Further, in the prior art, the combustion apparatus has a cooler for cooling the heated gas in the heat environment of the heating chamber for forming a combustion space, and therefore, the disadvantage of the combustion apparatus is The cooling 5 water supply generates a sharp temperature difference between the portion of the cooler and the heating to the inside of the heat environment, so that powder clogging may occur due to vapor backflow, or the powder may be blocked due to cooling. The vortex produced by water spreading or powder blockage is more serious. Further, in the prior art, a disadvantage of the combustion apparatus is that the exhaust gas and the air supplied to the heating chamber are rapidly moved from the upper side of the heating chamber to the lower side of the heating chamber, so that staying in the heating chamber The time in the reduction is shortened, and therefore, the heat treatment conditions are not sufficiently satisfied and the treatment efficiency is lowered. A disadvantage of the conventional exhaust gas treatment device is that if a final exhaust gas contains a large amount of moisture, when the exhaust gas in this state enters an exhaust pipe, 15 condensed water is generated to corrode the exhaust pipe. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an exhaust gas treatment device (burning method, wet method, absorption method) for performing a wet pretreatment process before exhaust gas is supplied to the exhaust gas treatment device. All kinds of exhaust gas treatment devices in combination with these methods). Another object of the present invention is to provide an exhaust gas treatment device which can reduce moisture contained in the final exhaust gas. It is still another object of the present invention to provide an exhaust gas treating apparatus which can prevent a heating chamber from being corroded by fluorine 1272121. It is still another object of the present invention to provide an exhaust gas treatment device which can improve the supply time of exhaust gas or air supplied to a heating chamber by increasing the time during which the exhaust gas stays in the heating chamber. Increase 5 plus exhaust gas treatment efficiency. Another object of the present invention is to provide an exhaust gas treating apparatus which can smoothly flow exhaust gas by improving the cooling structure of the heating chamber. A first feature of the present invention provides an exhaust gas wet pretreatment apparatus installed at a front end of an exhaust gas treatment apparatus, and characterized in that the exhaust gas 10 wet pretreatment apparatus comprises a particulate droplet generator for particles Spraying a reactant for pretreatment of the exhaust gas; and a reaction portion for forming a space for reacting the exhaust gas with the particulate sprayed reactant and comprising an outer cylinder and an inner cylinder; Wherein the reaction portion has an inlet hole for the exhaust gas to enter, and 15 droplets of the reactant liquid for the particulate sprayed reactant enter the hole, and the waste gas enters the hole through the exhaust gas and the particulate matter The reaction of the sprayed reactant discharges the discharge hole through the wet pretreated exhaust gas, and a discharge hole for discharging the contaminant generated by the reaction of the particulate spray with the exhaust gas. A second feature of the present invention provides a wet pretreatment method for exhaust gas, 20 being completed at a front end of an exhaust gas treatment device, characterized in that the method comprises the steps of: feeding the exhaust gas into a reaction portion; The ground sprayed reactant is sent to the reaction portion; the exhaust gas is reacted with the particulate sprayed reactant by a cyclone effect in the reaction portion; and the wet pretreatment exhaust gas is discharged to a discharge hole And letting the contaminants flow to a discharge orifice. 11 1272121 A third feature of the present invention provides an exhaust gas treatment device comprising a right pre-processing unit for supplying a water-soluble gas and removing a water-soluble gas contained in the exhaust gas from the semi-V body manufacturing apparatus; The dry unit is configured to oxidize untreated exhaust gas by heating to a predetermined temperature 5 through the pretreatment unit; a wet pretreatment unit for dissolving unreacted exhaust gas treated by the non-transparent and dry processing unit And capturing a fine powder, a wet processing unit for receiving the untreated exhaust gas and the fine powder through the wet pretreatment unit and spraying a predetermined solvent to dissolve the exhaust gas' and collecting the fine powder through a collection filter And a discharge stream for removing solvent mixed with the powder processed through the pretreatment unit, the wet pretreatment unit, and the wet processing unit. A fourth feature of the present invention provides an exhaust gas treatment method comprising: a pretreatment step of supplying a water-soluble gas to a passage through which exhaust gas supplied from a semiconductor manufacturing facility passes and removing the exhaust gas contained in the waste gas a water-soluble gas; a dry treatment step of generating a powder by heating the untreated waste gas supplied from the pretreatment step to a predetermined temperature. A wet pretreatment step captures untreated by the dry treatment step a fine powder and dissolving the water-soluble gas by filling therein a filler and rotating the porous round tube which is immersed in the water-soluble solvent at one end thereof; and a wet processing step of dissolving the exhaust gas And collecting the fine powder by passing the untreated exhaust gas and the fine powder passing through the wet pretreatment step and spraying the solvent. A fifth feature of the present invention provides an exhaust gas treatment apparatus comprising: a heating chamber for heating an exhaust gas to change its chemical characteristics; 12 1272121 but a unit 'connecting with the heating chamber to cool the heat generated by the heating chamber Purifying the gas to capture the liquid components contained in the purified gas and to condense the liquid components. A sixth feature of the present invention provides an exhaust gas treatment apparatus comprising: a heating chamber having a plurality of inlet holes at the upper and lower ends thereof to form a predetermined space for accommodating the exhaust gas to be processed by the semiconductor manufacturing equipment Exhaust gas; a heater for forming a processing condition for heating the exhaust gas to a predetermined temperature; and a shielding unit installed inside the heating chamber to prevent the heating chamber from being affected by the exhaust gas The high temperature reacts with the reaction of the heat of the heater 10 to corrode. A seventh feature of the present invention provides an exhaust gas treatment device comprising: a heating chamber for heating a gas mixed with exhaust gas, an inert gas and air to transform its chemical characteristics; a wet processing unit Heating to communication for water treatment and accumulating ash 15 dust particles generated in the heating chamber; and a liquid separation/cooling unit for absorbing the flow rate of the purified gas discharged from the wet processing unit to The liquid component is separated from the purified gas, and the purified gas is cooled to capture and condense the liquid component contained in the purified gas. An eighth feature of the present invention provides an exhaust gas treatment device comprising: a heating chamber for heating a mixed gas mixed with exhaust gas, an inert gas and air to transform its chemical characteristics; a wet processing unit The heating chamber is fluidly connected to perform water treatment and accumulate dust particles generated in the heating chamber, and uses a spray nozzle to spray water particles below a predetermined size in a mist state; and a cooling unit The purified gas produced by treating the single % by cold 13 to process and condense the liquid component contained in the converted gas. 5 1272121 H ninth special _ provides a waste gas dry treatment device, which has an improved heating chamber, characterized in that the device comprises: a heating chamber, which is used to form a pre-treatment space; a manifold is installed in The heating chamber has two upper and upper exhaust gas supply holes thereon; and a plurality of strips t are vertically red-mounted on the inside of the heating chamber. The tenth feature of the present invention provides an exhaust gas treatment device comprising a heating chamber having a plurality of inlet holes at the upper and lower ends thereof to form a predetermined space for accommodating the exhaust gas to be processed by the semiconductor manufacturing equipment. The waste fluorine, a heater, is formed by heating the exhaust gas to a predetermined temperature rate to form processing conditions of the exhaust gas; and a shielding unit is installed inside the heating chamber to prevent the heating chamber from being The reaction due to the high temperature 15 of the exhaust gases and the heat of the heater is corroded. An eleventh feature of the present invention provides an exhaust gas treating apparatus having an improved cooling structure, characterized in that the apparatus comprises: a dry processing unit for heating and oxidizing exhaust gas in a thermal environment so that The exhaust gas phase is changed into a powder phase; a cooling unit is composed of a hollow official road having a convex 2 rim, the hollow pipeline has a cooling water storage tank, and the cooling water storage tank and the dry processing unit The lower portion is connected to receive a cooling water and overflows to the inside if it is full; and a gas supply is supplied to supply the gas preheated to a predetermined temperature to the upper portion of the cooling water overflow .

The invention will be further described in the following detailed description of the embodiments of the invention, and the scope of BRIEF DESCRIPTION OF THE DRAWINGS The following and other features and advantages of the present invention will become more apparent from the detailed description of the accompanying drawings in which: FIG. A diagram of an example of a pretreatment apparatus; Fig. 4 is a graph showing that the removal efficiency of ammonia gas can be as high as 80% by the wet pretreatment apparatus; 10 Fig. 5 is a view showing the use of Fig. 3 multiple times FIG. 6 and FIG. 7 are structural diagrams showing the exhaust gas treatment device of the present invention for removing liquid components contained in exhaust gas; FIG. Examples; Figures 8 through 11 show examples of cooling units suitable for use in the present invention; 15 Figures 12 through 14 show an embodiment of a liquid separation/cooling unit suitable for use in the present invention; Figure 15 is a diagram showing a multi-stage manner FIG. 16 is a view showing a structure 20 of the exhaust gas dry processing apparatus of the present invention; FIG. 17 is a longitudinal cross-sectional view of FIG. 16; Show the invention FIG. 19 and FIG. 20 are diagrams showing the structure of an exhaust gas treatment apparatus having the apparatus for preventing corrosion of a heating chamber of the present invention; FIG. 21, and FIG. A structure in which the concentration of the exhaust gas is measured by the medium-shaped f-imaginary hole in the structure of FIG. 19; FIG. 22 is related to the relationship between the heating chamber and the inner chamber. A diagram of the measured value of the change in concentration resulting from the flow rate of the helium supplied from Fig. 21; Fig. 23 is a view showing the exhaust gas treatment device (heating chamber) of the embodiment of the present invention a part of the figure; 'Fig. 24 岐 23 of β_Β, _ face diagram; $25Affil7^ with the explicit pulse unit combined with the cooling water for the structure of the storage tank in Figure 24; A diagram showing the structure in which the _pulse unit is incorporated in the cooling water supply line of the %th diagram; FIG. 26 is a diagram for showing an example in which the gas supply unit of the first drawing is configured as another 15 type; And the 27th kitchen is used to display the cooling unit pipe at a predetermined angle A diagram of an oblique example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT OF THE INVENTION The present invention will be described in more detail in conjunction with the drawings in which preferred embodiments of the present invention are shown, but the invention may be embodied in different forms and should not be limited to This proposed embodiment. Moreover, these embodiments are intended to be thorough and complete, and to fully convey the scope of the present invention to those of ordinary skill in the art. In the drawings, the thickness of the plurality of layers and the 16 1272121 region are exaggerated for clarity, and like numerals are used to denote like elements throughout the specification. [Embodiment 1] Fig. 1 is a view showing an example of a wet pretreatment device of the exhaust gas treating device of the present invention; and Fig. 2 is a view showing wet pretreatment of the exhaust gas treating device of the present invention Fig. 3 is a view showing another example of the wet pretreatment apparatus of the exhaust gas treating apparatus of the present invention; and Fig. 4 is a view showing that the removal efficiency of an ammonia gas can be obtained by The wet pretreatment unit reached an 80% chart. As shown in Fig. 1, the wet pretreatment apparatus 10 for performing the exhaust gas treatment of the present invention mainly comprises an exhaust gas inlet hole 11 through which the exhaust gas enters, and a reactant inlet hole 12 for the reactant for the exhaust gas treatment, The reaction portion 2 for wet-pretreating the exhaust gas may be subjected to a fluorine-containing 15 spinning method, a discharge hole 21 for discharging the wet-processed exhaust gas, and a discharge hole 31 for discharging the pollutant. The reaction portion 20 of the wet pretreatment apparatus of the present invention separates the solid particles contained in the gas 20 by the cyclone separation method using the centrifugal force generated by the fluid vortex. When the exhaust gas discharged during a semiconductor manufacturing process or an LCD manufacturing process is vortexed inside the wet pretreatment device by the cyclone separation method, the reactant is sprayed to remove water solubility in the exhaust gas. Substance or fine powder. The reaction portion 2 has an inner cylinder 19 and an outer cylinder 10a, and the outer cylinder i〇a has a cylindrical cylinder 17 and a pyramidal cylinder 18 extending downward from a lower end of the cylindrical cylinder 1272121 . According to this structure, the radius of the outer cylinder is reduced from the interface between the cylindrical cylinder 17 and the pyramidal cylinder 18 to the lower end of the outer cylinder 10a, and therefore, the outer cylinder has an inverted The overall structure of the bottle. The cylindrical barrel 17 is provided at its upper end with an outer-inner barrel connection 5 portion 17a, and the pyramidal tube 18 is provided at its lower end with a discharge hole 3''. In the past, 'the longer the total length of the outer cylinder is constituted by the cylindrical cylinder 17 and the pyramidal cylinder 18', the greater the possibility that the exhaust gas is in contact with the reactant, but it is still most appropriate to use a conventional one. A cyclone separator of the size is preferred. The overall structure of the inner cylinder 19 has a funnel shape, and this forms a neck 10 having a neck portion that maintains a certain radius, and the radius gradually decreases toward the direction from the upper end to the lower end of the inner same 19, and then Keep it from the neck to the lower end. The inner cylinder 19 is provided with a discharge hole 21' at its upper end and an inner-outer cylinder connecting portion 19a which is attached to the lower side and directly below the neck. The lower end of the inner cylinder 19 extends to the vicinity of the lower end of the cylindrical outer cylinder 'I5 because the width of the reactant is sprayed in the lower direction of the reaction portion 20 by a microfinishing nozzle 15 which will be described below. It is large, so it is necessary to prevent the last pre-spot exhaust gas from being discharged into the discharge hole 21; and contact with the reactant again. The outer-inner tube connecting portion 17a and the inner-outer tube speed connecting portion 19a are fixed to each other to connect the inner tube 19 and the outer tube 19 and the pyramidal tube 18 L〇a. When the outer cylinder 10a and the inner cylinder 19 are fixedly connected in consideration of the necessity of repairing the wet pretreatment apparatus due to powder plugging/removal, it is preferable to fix the joint by a jig or the like. Referring to the drawing, a portion of the inner cylinder 19 inserted into the reaction portion 20 is shown by a dashed line and the fixed connection portions of the portions are shown in a schematic manner to avoid the formation of the volts 18 1272121 1 too complicated. The cylindrical cylinder 17 has an exhaust gas inlet hole 11 installed in an outer wall thereof and accessible by exhaust gas discharged from a cvd main chamber, the exhaust gas inlet hole being installed to allow the exhaust gas to enter the direction of the cylindrical cylinder 17 Vertically hangs 5 straight. That is, the exhaust gases enter in the direction of all the lines of the outer wall of the cylindrical cylinder 17. The cylindrical barrel 17 also has a reactant inlet opening 12' mounted at the outer wall and is similar to the exhaust gases which enter the tangential direction of the outer wall of the cylindrical barrel 17. That is, the exhaust gas inlet port and the reactant inlet port 12 are installed such that the exhaust gas entering direction and the reactant entering direction 10 are similar to each other. Due to this configuration, the exhaust gas entering the direction perpendicular to the outer wall of the cylindrical cylinder 17 flows in a direction similar to each other and can be rotated in the cylindrical cylinder 17 and the pyramidal cylinder 18 Move down 'thus to maximize a cyclone separation effect. Since the entry of the reactant is completed above the incoming exhaust gas, the reactant inlet hole 12 is installed 15 above the exhaust gas inlet hole 11 to further increase the purification treatment efficiency of the exhaust gas. 0 Installed in the reactant inlet hole 12 The above is a microfinishing nozzle 15 for finely spraying the reactants, which increases the efficiency of exhaust gas treatment. The microfinishing nozzle 15 connecting the two injection holes uses a direct pressurization method, and the two 20 injection holes are a gas injection hole 13 and a reactant injection hole 14, respectively; a gas injection hole valve 13a and a reactant injection hole valve 14a is installed in front of each injection hole. The front end of the refining nozzle 15 passes through the reactant inlet port 12, and the atomized reactant 16 is finely sprayed into the reaction portion 2 to react with the helium exhaust gas. 19 1272121 A humidity reducing portion 23 is mounted above the discharge hole 21, and the discharge hole 21 is attached to the upper end of the inner tube 19 of the reaction portion 20. The inner cylinder 19 and the humidity reducing portion 23 of the reaction portion 20 are connected to the humidity reducing portion inlet hole 22 by fixedly connecting the discharge hole 21, and the humidity reducing portion inlet hole 22 is mounted 5 at the humidity reducing portion 23. Lower end. The discharge hole 21 and the humidity reducing portion inlet hole 22 are also similar to the outer cylinder i〇a and the inner cylinder 19, and are preferably fixedly connected by a heater or the like. The humidity reducing portion 23 is a cylindrical pipe structure connecting the discharge hole 21 and the exhaust gas treating device, and a heat insulating member 24 is mounted on the outer wall of the humidity reducing portion to uniformly heat the entire outer wall. Mounted on the humidity reducing portion 23 is a gas pressurizing device 25 for passing pressurized gas through the outer wall of the humidity reducing portion 23 into the humidity reducing portion 23. In this manner, preferably, the gas The pressurizing device 25 is installed at a position where the pressurized gas enters the humidity reducing portion 23 and reaches the inlet hole of the exhaust gas treating device, and the gas pressurizing device 25 has the gas 15 injection hole of the chlorine pressurizing device. 26 and a valve 26a connected thereto. Reference is made in this specification to the exhaust gas treatment device inlet port, the exhaust gas treatment device and the discharge cell not shown for a simple view. Further, in the wet pretreatment apparatus 1 used for the exhaust gas treatment of the present invention, a part and a tube structure which are in contact with the corrosive exhaust gas are preferably coated with a poly 2 conjugate, and coated with a TeflonTM. The fluororesin material is better. A method of wet pretreating exhaust gas using the wet pretreatment apparatus 10 of the present invention in accordance with Embodiment 1 will be described below. First, the exhaust gas generated in the manufacture of a semiconductor or an LCD or the like passes through the exhaust gas inlet hole 11 in the tangential direction of the outer wall of the cylindrical cylinder 17 to enter the wet pretreatment apparatus of the invention of the invention, and on the other hand, The reactant reacting with the exhaust gas entering the exhaust gas inlet hole 11 also enters the wet pretreatment device through the reactant inlet hole 12 installed at the outer wall of the cylindrical cylinder 17 in the tangential direction of the outer wall of the cylindrical cylinder 17. 1〇. As described above, in the present invention, 5 the reactant enters in a direction similar to the flow of the exhaust gas, and the reactant used in the wet pretreatment apparatus used for the exhaust gas treatment of the present invention may comprise as usual Diluted solution of chemical substances such as neutral water, tap water, NaOH or CaOH2 and electrolyzed water. Further, the reactant is introduced into the micronizing nozzle 15 through the reactant injection hole 14, and in this case, the flow rate of the neutral water generally ranges from about 10 to 300 cc/min, preferably from about 200 to about 2,000 Å. Better between 300cc/min. As described above, since the preferred flow rate of the general neutral water used as the reactant does not exceed 300 cc/min, the wet pretreatment apparatus 10 of the present invention can increase the exhaust gas treatment efficiency and minimize the waste water discharge. Therefore, the wet pretreatment apparatus of the present invention is environmentally friendly and can greatly reduce the amount of reactants used to reduce the cost of semiconductors or LCDs. Hereinafter, the present invention will explain the case when the general water is used as the reactant. As described above, the wet pretreatment apparatus 1 of the present invention uses the micro-nozzle 15 of the direct press method as a fine spray atomizer to increase the treatment efficiency of the exhaust gas. The reactants reacted with the exhaust gases meet the finely sprayed gas at the micro-twisting nozzle 15 and can be injected into the reaction portion 20 through the reactant inlet holes 12, in fact, when used in the general When the water is used as the reactant, the fine refining nozzle 15 ejects the general neutral water with a fine spray gas having a particle size of 50 μm or less, and is compared with a conventional method of a particle size of 5〇〇|11111. This particle size value is less than about 1 其. Since the treatment efficiency of the exhaust gas in the wet pretreatment apparatus at 1272121 is mainly determined by the contact area between the exhaust gas and the reactant and the temperature of the reactant, when the reactant is in fine droplets When it is injected and reacted with the exhaust gases, the treatment efficiency of the exhaust gases increases for the following reasons. First, the overall surface area of the micro-sprayed atomized reactant is increased, so that the likelihood of contact with the specialized exhaust gas and the area of contact increases as it increases. Secondly, the fine spray atomization process of the reactants by the micronizing nozzle can be regarded as a pseudo-adiabatic expansion process, and therefore, the temperature of the reactants will be sprayed and atomized in the process of finely spraying the reactants. It will be lowered to increase the solubility of the reactants of the water-soluble substance to be treated. Generally, the lower the temperature, the higher the solubility of the gas to the liquid phase. Nitrogen gas enters the micronizing nozzle 15 through the gas injection hole 13, and at this time, the flow rate of nitrogen gas is preferably in the range of about 5 to 201 pm, and more preferably in the range of about 10 to 201 pm. I5 The flow rate of the reactant and the nitrogen gas is adjusted by the gas injection hole valve 13a and the liquid injection hole valve 14a installed in front of each hole, and the reactant to be mixed with the nitrogen gas is passed through the micronization nozzle The pressure is applied to form a fine droplet 16 which is to be injected into the reaction portion 20 through the reactant inlet hole 12 in a circular mist shape. 2. As previously described, the wet pretreatment apparatus 10 utilizes cyclone separation to wet pretreat the exhaust gases, and the reactants entering the pores 12 through the reactants are rotated similarly to the exhaust gases and along The cylindrical barrel 17 and the inner wall of the pyramidal cylinder 18 are moved downward; at this time, the rotational speed at the pyramidal can is increased to obtain the maximum separation effect' and the fineness in the exhaust gas 22 1272121 5 10 15 20 , the end is collected by centrifugal force and gravity and collected in the pyramidal crucible. The water-soluble gas system in the special exhaust gas is dissolved in the reactant and can be contained in the reactant. Next, it is separated by centrifugal force and force and collected at the lowermost end of the pyramidal cylinder 18. As the reactants rotate and react with each other within the crucible tube 7 and the pyramidal cylinder 18, the contact time of the exhaust gases with the reactants increases 'and the reactants The pure flowing materials are flowed in a similar direction to maximize the cyclone separation effect. The pretreatment apparatus of the present invention using the cyclone separation method has the following gamma as compared with the prior art spray tower method (U.S. Patent No. 5,955,03:) and the thin waist tube method patent No. 5,649,985. Compared with the sprinkler tower method, the hairline Wei County has a pure treatment efficiency. In the wet pretreatment apparatus disclosed in the method of the money bank of the '37 patent towel, 'the flow of the exhaust gas and the flow of the reactants are not mutually similar directions' a this is compared with the separation method, When the contact between the exhaust gas and the water particles is short, the correction will reduce the treatment efficiency of the exhaust gas. In addition, if it is disclosed in the pre-treatment device of the 985 special-purpose thin waist tube method, the flow of the exhaust gas and the flow of the reactants are in a similar direction to each other, and The filament is pressurized at a high speed, which is compared with the cyclone separation method of the present invention. The milk device has high waste enthalpy treatment efficiency, and (4) the shortcoming of the thin waist tube method is that the pressure drop is very large. In the past, it has been known that the fine waist material level is about 1 times the pressure drop of the large tidal tower. Conversely, the wet type financial device of the present invention can produce a hurricane separation method that is smaller than the pressure drop. "An additional 23 1272121 exhaust fan must be installed to address the pressure drop as in the f985 patent. The contaminant in which the reactants and sludge deposits of the fine powder and the water-soluble gas which have been separated and collected are dissolved are stored in the storage tank (not shown) through the discharge hole 31, and conversely, The fine powder which has been removed from the water-soluble gas 5 and which has been subjected to wet pretreatment in the reaction portion 20 and the exhaust gas are formed at the center of the reaction portion 20 and are movable along the inner cylinder 19 through the discharge hole 21 Rotate the airflow upwards. The wet pretreatment gas discharged to the discharge hole 21 passes through the humidity reducing portion 23 to which the heat insulating member 24 is mounted and can enter the hole treating device through the exhaust gas treatment device, and at this time, the wet pretreatment The gas contains a large amount of atomized reactants and vapor. Therefore, the purpose of the humidity reducing portion 23 is to prevent the entire life of the exhaust gas treating device from being in the exhaust gas treating device when a gas containing a large amount of fine droplets or vapor passes through the discharge hole 21 and directly enters the exhaust gas treating device. The corrosion of the heating unit such as I5 is reduced. First, the humidity of the pretreatment gas is reduced in the humidity reducing portion 23 by the effect of gravity, that is, the exhaust gas containing a large amount of droplets discharged to the discharge hole 21 does not pass through the humidity reducing portion 23 due to its gravity. And can be withdrawn at the lowest end of the pyramidal cylinder 18 and discharged to the discharge hole 31 again. Another reason for the decrease in humidity is the low humidity of the gases. Due to the low humidity, a low-humidity gas can be injected to the humidity reducing unit 23 via the gas pressurizing device 25 installed at the humidity reducing portion 23. To reduce the humidity of the pretreatment exhaust gases. The low-humidity gas is injected into the humidity reducing portion 23 via the gas pressurizing means, and the low-humidity gas injected can be adjusted by the flow rate of the valve 26a. At this time, the low-humidity gas is preferably such that the 1272121 is made of mouse gas or processed dry air, and the heated nitrogen gas is more preferable. In addition to the foregoing purposes, the gas pressurizing device 25 installed at the humidity reducing portion 23 can be used for another purpose. When the wet pretreatment waste gas enters the salty exhaust gas treatment device, the exhaust gas reacts with oxygen which may be present in the exhaust gas treatment device at the inlet port of the exhaust gas treatment device to produce the powder, thus causing powder clogging. Therefore, if the pressurized gas in the gas pressurizing means 25 can be sprayed toward the inlet port of the exhaust gas treating means to remove the powder, powder clogging at the inlet port of the exhaust gas treating means can be prevented. In order to achieve the above two objectives, the gas pressurizing means 25 in the humidity reducing portion 23 10 is preferably installed such that the pressurized gas is ejected toward the inlet hole of the exhaust gas treating device. At this time, it is preferable that the pressurized gas system uses nitrogen gas or processed dry air in a manner similar to the low humidity gas for lowering the humidity, and it is more preferable to use heated nitrogen gas. The heat insulating member 24 is installed to prevent the pretreatment exhaust gas from being deposited on the pipeline structure or the like when moving to the exhaust gas treating device, because the pretreatment exhaust gas has high humidity, and the exhaust gas is deposited On a relatively low temperature piping structure or the like, and thus causing powder clogging. The heat insulating member 24 is preferably maintained in the range of about 50 ° C to 200 ° C, and more preferably in the range of about 100 ° C to 150 °. Fig. 2 is a view showing the structure of the wet pretreatment apparatus 30 in another example, except that the reaction unit 20 has the cyclone separation effect, and its structure is completely the same as that of the wet pretreatment apparatus 1 of Fig. 1. Although the outer tube of the reaction portion 20 of the wet pretreatment device 10 of Fig. 1 has the cylindrical tube 17 and the pyramidal tube 18, the reaction portion 20 of the wet pretreatment device 3 of Fig. 2 1272121 The outer cylinder 10a has only the cylindrical cylinder 17. The reaction portion 20 having the outer cylinder 10a formed only by the cylindrical cylinder 17 cannot obtain the maximum separation effect because the rotational speed of the exhaust gas at the pyramidal cylinder is increased. Therefore, although the wet pretreatment apparatus 30 of Fig. 2 has the effect of reducing the cyclone separation effect 5 and reducing the pretreatment effect of the exhaust gases, the manufacturing cost of the wet pretreatment apparatus can be reduced. When considering the optimum size of the cyclone to obtain maximum exhaust gas treatment efficiency, the manufacturing cost of the cylindrical cylinder and the pyramidal cylinder is higher than the manufacturing cost of only the cylindrical cylinder, and finally, the wet pretreatment device is reduced. The manufacturing cost will have the effect of reducing the manufacturing cost of semiconductors or LCDs. Fig. 3 is a view showing a double wet pretreatment apparatus 40' for treating exhaust gas according to another embodiment of the present invention, wherein the duplex means that the wet pretreatment apparatus 1 is composed of at least two exhaust gas treating apparatuses. Figure 3 shows a structure consisting of three wet pretreatment devices 10 wherein each wet pretreatment device is identical I5. In Fig. 3, the main components are numbered only on a wet pretreatment apparatus for the purpose of simplification, in which the gas injection holes 13 and the reactant injection holes 14 are omitted and combined with the fine The valves 13a and 14a are connected to the nozzle 15. Further, similar to the wet pretreatment apparatus of Fig. 2, it is permissible that only the wet pretreatment apparatus 1 having the cylindrical cylinder 17 is outside the casing, in this case, The multiple wet pretreatment apparatus can reduce manufacturing costs as previously described. Referring to FIG. 3, the multi-stage wet pretreatment apparatus 40 for exhaust gas treatment of the present invention has a pre-storage tank 32 which is formed in a circular shape and is installed in front of the storage tank. The discharge hole 31 is fixedly connected to the upper end of the connection pipe 39. The connecting tube enters the 26 1272121 hole 39a'. Therefore, each wet pretreatment device is connected to the pre-storage tank η. The water level holder 33' for maintaining the water level of the general neutral water stored in the pre-storage tank 32 at a predetermined water level and the water level holder as described below. 33 is composed of a conventional pipe member 5. The water level holder 33 must preferably be mounted above the upper end of the pre-sink because its mounting position is very important. The preferred configuration of the official member of the water level holder is as shown in FIG. 3, and the tubes extend upwardly from one side of the pre-storage tank 32 to a discharge hole 31 and the pre-storage chamber The intervening water level maintains line 34 and extends horizontally with the pre-storage tank 32 so that the ring 10 extends downwardly about the pre-shot finger and can enter the sump. The lower end of the pre-storage tank 32 is connected to a discharge pipe member 41 extending through a valve 37, and the valve 37 is connected to a piping structure extending downward from the water level holder 33 to form a duct shape. These piping structures for connecting the pre-storage tank 32 to the sump are preferably as straight as possible to prevent powder clogging. Mounted on the pre-storage 15 tank 32 is a cover for sealing the pre-storage tank 32 at its right/left side, and is disposed at a side where the cover body 38 is mounted to pass through the cover body 38. And a pre-sump pressurizer 36 for the pre-storage tank 32. The reason for pretreating the exhaust gases by the dual wet pretreatment apparatus 40 of the present invention is that the main chamber of the semiconductor or LCD manufacturing apparatus is mainly composed of a plurality of chambers 20. Since it is necessary to continuously deposit various substances required in the semiconductor or process, it is necessary to use a plurality of chambers connected to the CVD chamber. Different chambers are used in each chamber containing most of the chambers because different substances are deposited in each chamber. Therefore, a wet pretreatment apparatus corresponding to each chamber is necessary to reduce the risk of explosion or powder clogging due to an unpredictable reaction between the wastes of the 1272121 gas when the various exhaust gases discharged from the respective chambers are treated together. possibility. Finally, the number of such main chambers determines the number of wet pretreatment devices in the multiple wet pretreatment apparatus. Hereinafter, a method of pretreating exhaust gas by wet type 5 using the dual wet pretreatment apparatus 40 of the present invention will be described. The exhaust gas discharged from each CVD chamber is pretreated by a wet pretreatment apparatus installed in each CVD chamber, and Similarly to the description of Fig. 1, the pretreated exhaust gas discharged to the discharge port 21 enters the wet pretreatment device via the humidity reducing portion 23. Therefore, the treatment of the substances produced by the wet-pretreatment of the contaminants, i.e., the wet pretreatment, will be described below. The purpose of installing the pre-storage tank 32 is to effectively remove the powder discharged from the wet pretreatment apparatus. When the pre-storage tank 32 is generally absent as the wet pretreatment apparatuses 10 and 20 of the first and second drawings, the powdery pollutant discharged to the discharge hole 31 may be due to the discharge hole 31 The structure of the tube I5 of the storage tank is not straight to the storage tank because of a straight line or the like, so that it cannot be removed by the release of the ground, so that powder clogging may occur. Therefore, the foregoing problem is solved by the fact that the pre-storage tank 32 is installed in front of the sump to effectively discharge the powder discharged from the rake pretreatment apparatus. - The method of removing the powder from the pre-storage tank 32 is as follows. The pre-storage tank 32 mainly stores the contaminations. The powder 35 of the dyeable material is accumulated at the bottom of the rhyme 32 by the density difference (4) from the general neutral water. The gas pressurized in the pre-storage pressurizer 36 at a predetermined position of the wire (4) of the wire tray 32 is sprayed toward the inside of the pre-storage tank 1272121 32 to uniformly distribute the powder by the continuous (four) reliance setting 40. A powder mixed in the normal neutral water. The pre-sump pressurizer 36 uses nitrogen or cleaned dry air as pressurized air, and the general neutral water can be used in place of the gases. When the valve 37 in combination with the pre-storage tank 32 is opened, the powder will be moved by the pre-5 tank 3 and the generally neutral water through the discharge tube structure 41 to the tank 'because the powder is intended to be moved to the tank The normal neutral water is uniformly mixed, so that the powder can be removed more efficiently than when the pre-storage tank 32 is not installed. When the powder in the pre-storage tank 3 2 is removed by periodic gas injection and valve opening, the dual wet pretreatment apparatus 4 of the present invention can be easily maintained and repaired. The powder deposited in the pre-storage tank 32 can be periodically removed by opening the lids 38. 15 20 The water level of the general neutral water stored in the pre-shooting tank 32 is preferably maintained at the water level maintaining line % corresponding to the third figure, and is discharged to the dual wet pretreatment device 40. In the paste female 32, so that the water level gradually rises; when the water level rises _ water turns to hide, the water that exceeds the neutral water of the water level retaining line will use the water level retainer to move to the storage tank, so that - Straighten the pre-storage tank with water level _. ^ The groove 32 is preferably in a state of being fully charged when the double wet pre-station 40 of the present invention is operated to prevent the exhaust gas from coming into contact with the neutral water, for the reason that the pre-storage tank 32 is charged. There will be no simplification _ danger and powder clogging charge; the aforementioned wet pretreatment device has the following: First, the effect is achieved at 29 1272121 5 15 before the semiconductor or LCD is used to destroy the mountain exhaust gas. Only about 2% of the water-soluble gas enters the waste disposal device because the amount of the miscellaneous gas contained in the exhaust gas can be reduced by about 8 G% using the wet pretreatment device. For example, about 80% of the helium gas or ammonia gas that is introduced into the CVD chamber can be purified in the CVD apparatus. Therefore, it is possible to restrict the F2 gas from entering the exhaust gas treating device to form a nitrogen compound to reduce the processing load of the exhaust gas of the exhaust gas treating device, and to prevent the discharge of corrosion and toxic substances. Fig. 4 is a view for showing the result of the treatment of ammonia gas in the wet pretreatment apparatus, and as an example showing the effect of the present invention, which shows that the initial ammonia concentration in the field is 5,794 ppmV, and the micronization is entered. When the gas in the nozzle is 疋 191 pmd, the ammonia concentration corresponds to the ammonia removal efficiency after passing through the field pretreatment device according to the flow rate of the microfinishing nozzle. Although the ammonia removal efficiency was not greatly affected by the general neutral water, when the flow rate became 30 〇 cc / min, the ammonia removal efficiency in the wet pretreatment apparatus became about 80%. Further, since the fine powder has been removed together with the water-soluble substances when the wet pretreatment apparatus is previously used, the problem of the exhaust gas treating apparatuses, i.e., powder clogging, can be substantially prevented. Secondly, when the wet pretreatment apparatus is used, the exhaust gas treatment load of the exhaust gas treatment apparatus is largely reduced as compared with the case where the wet pretreatment apparatus is not used. According to the result of FIG. 4, when the operation time is set to be the same as the exhaust gas treatment, the load of the exhaust gas treatment device is reduced by about 8%, and therefore, the service life of each part of the exhaust gas treatment device is extended to be extended. Time and thereby reduce A/S costs. In addition, the overall operating time of the exhaust gas treatment device is increased to reduce semiconductor or LCD manufacturing costs. 30 1272121 The third 'the wet pretreatment apparatus of the present invention has an effect of first removing corrosive gas, particularly fluorine gas discharged during the semiconductor or LCD manufacturing process, and therefore, effectively processing the semiconductor or LCD manufacturing process. The effect of cleaning a large amount of gas in the main CVD chamber is excellent. Therefore, the wet pretreatment apparatus of the present invention is surely used in the exhaust gas treating apparatus for treating the NF3 gas, and it is expected that the amount of the cleaning gas used as the main CVD chamber will increase greatly thereafter. [Embodiment 2] Fig. 5 is a view showing the structure of a wet pretreatment apparatus using a duplex wet pretreatment apparatus 40 for treating a plurality of waste gas in the above Fig. 3. As shown in Fig. 5, the exhaust gas treatment device includes a "wet pretreatment device"

The gas unit 120 is connected to a discharge unit 13A. 15 The pre-button unit 40 is supplied with a waste (described below) which is discharged by the semiconductor device (10). The gas passes through and supplies the water-soluble gas solvent in a direction similar to the supply direction of the exhaust gases to achieve the function of dissolving the water-soluble gas contained in the exhaust gases, and is used to remove the dry processing unit% first. The pretreatment conduit 61 of each part of the ocean and δ has an exhaust gas supply hole 6ia of an exhaust gas discharged from the device, and a supply is supplied by the semiconductor to supply the water-soluble gas.

31 1272121 The pretreatment conduit 61 is provided with a plurality of roots for use by the exhaust gas discharged from the majority of the conductor manufacturing equipment, and the solvent extraction hole 61d is connected to a solvent storage cylinder 32 to mainly store and dissolve the water soluble solution. Solvent for a gaseous gas 0 5 The water-soluble gas solvent is sprayed by a general nozzle or a sprayer, or supplied in a vapor state, and uses electricity such as acidic water or alkaline water: water, or CaOl· ! with NaOH. The dry processing unit 70 has a manifold 72, and the manifold 72 has an exhaust gas supply port 107a for connecting an exhaust gas supply pipe 71 and a heating chamber 73, and the exhaust gas supply pipe 71 is for supplying The exhaust gas extracted from the solvent extraction hole 61d is extracted, and the heating chamber 73 is connected to the lower end of the manifold 72 to heat the exhaust gas to a predetermined temperature. It can be understood here that the heating chamber 73 has a shape composed of an inner tube and an outer tube, and an electric heater is mounted outside the outer tube. I5 In order to capture the powder generated by the heating chamber 73 and remove the water-soluble gas to prevent corrosion or clogging of the exhaust pipe, the first wet processing unit 8 is partitioned into a plurality of spaces 81b and 81c by a side wall 81a. The crucible has a chamber 81 forming a gas inlet/discharge port 81d and 81e, a rotor 83 rotatably mounted in the space 81b by a motor 82, and a jetting unit 84 mounted at the space 81c. And a solvent 86 housed in the chamber to immerse the rotor in a predetermined depth. ^^^^^^^^^^^^^^^^^^^^^^^^ The side wall 81a has a hole 81af, ^ ^ ^ ^ in the lower portion for the solvent 86 to flow. ^ ^ ^ ^ ^ ^ ^ ^ · The rotor 85 is composed of two porous hollow cylindrical tubes 85a. 32 1272121 In addition, a filler 85b is filled between the cylindrical tubes 85a and is composed of a mesh member made of Teflon or a material which can improve water treatment to increase gas solubility and capture speed. The second wet processing unit 90 includes a plurality of conduits 91 connected to the gas discharge holes 81e of the first wet processing unit 5, 80, a solvent supply tube 92 connected to the cover 91a of the conduit 91, and a The solvent supply pipe 92 is combined to spray the nozzle 93 of the solvent. The cooling unit 100 has a function of connecting the dry processing unit 70 and the first wet processing unit 80 and lowering the temperature of the hot gas 10 and the powder discharged through the dry processing unit 7 , and includes a connecting pipe 1 〇 3, The connecting pipe 103 is connected to a cooling water supply pipe 1〇1 for allowing the cooling water to enter so that the cooling water flows into the connecting pipe through the cooling water supply hole 102. 3, thereby cooling the hot powder and the exhaust gas discharged through the dry processing unit 70. I5 The dehumidifying unit 110 is installed between the second wet processing unit 90 and the exhaust unit 120 to achieve removal of moisture contained in the purified gas processed through the second wet processing unit 90. The discharge unit 130 is configured to collect the solvent mixed with the powder and the moisture removed by the second wet processing unit 9 , and the powder has passed through the double wet pretreatment device 40 , the first wet type The processing unit 80 is treated with the first wet treated soap unit 90. The discharge unit 130 includes a solvent storage cylinder 32, a chamber 81 of the first wet processing unit 80, and the dehumidification unit 110, which are interposed by the drainage tube structures 131, 132 and 133. Connected discharge chamber 135. And a drain pump 136 is mounted on one side of the discharge chamber 33 1272121 chamber 135 to discharge the solvent contained in the discharge chamber 135. A cooling water supply pump 137 is connected to the cooling water supply pipe 101 of the cooling unit 100 to pump the solvent contained in the discharge chamber 135, thereby circulating the cooling water. As shown, the cooling water supply pipe 101 is connected to the discharge chamber 135 for accommodation in the discharge chamber 135, and is connected to a water supply (not shown) to supply unused cooling water. . The drain tube structure 133 has an automatic valve (not shown) for automatically discharging excess solvent in the chamber 81 to maintain the solvent liquid in the chamber 81 at a predetermined value and during maintenance. These drain tube structures 133 are opened to achieve the function of discharging the solvent contained in the chamber 81. The operation theory and processing method of the exhaust gas dry-shake processing apparatus according to an embodiment of the present invention described above will be explained below. First, when the exhaust gas passes through the exhaust gas supply hole 61a and the semiconductor device 15 is ready (not shown), the water-soluble gas is diffused through the pretreatment conduit 61_. The water-soluble gas solvent t at the side and the hole 61b are supplied in the same direction as the supply direction of the exhaust gas to dissolve the water-soluble gas contained in the exhaust gas. (4) There is a water secret gas paste into the discharge hole 31 And the untreated gas system is supplied to the pure pores of the structure of the dry matter (4) through the exhaust gas extraction hole. The exhaust gas is gradually heated to one in the heating chamber 73. Predetermined temperature, oxidizing conditions, and the exhaust gases chemically react with air to form a powder having an extremely fine particle shape. 34 1272121 At this time, inside the dry processing unit 7〇, the powder is attached to the heating by a A powder removing unit (not shown) inside the chamber 73 comes to the rub to separate from the inner wall of the heating chamber 73. The hot powder and the untreated exhaust gas 5 generated by the dry processing unit 70 pass through the cooling unit 100. connection 1〇3 may be cooled by cooling water supplied to the inside of the connecting pipe 103, whereby it may be discharged in a powder slurry state. The powder slurry is contained in unreacted exhaust gas containing no reaction with the dry processing unit 7 and the cooling unit 100. The space is supplied to the space 81b' with the powder, and the unreacted exhaust gas and powder are captured and dissolved by the rotary scorpion 83 rotating in the space gib. That is, the rotor 83 is immersed in the chamber. a state of a predetermined depth in 81 is installed to maintain the state in which the rotor 83 is wetted by the solvent while the rotating operation is continuously performed; in this state, the exhaust gas and the powder are in contact with the rotor 83, and the rotor captures The powder, and the exhaust gases are readily soluble. The untreated gas and the powder enter the space 81C through the rotor 83, and are dissolved by the solvent ejected by the spraying unit 84. Then 'these are untreated The gas and the fine powder pass again through the conduit 91 constituting the first wet processing unit 90 and through the nozzle firing unit 84, and the 20 exhaust gases are dissolved in the spray installed at the conduit 91 The nozzle 93 emits a solvent, and the fine powder is collected by a filter member (not shown) installed in the conduit %. As described above, the gas finally processed through the second wet processing unit 9 is After the moisture is removed by the dehumidifying unit 110, it is discharged to the exhaust pipe via the exhaust unit 120 1272121. On the other hand, the solvent stored in the solvent storage cylinder 32 and the chamber si passes through the drainage tube structures 131 and 133. Discharge to the discharge chamber 135, and when the water level is detected by a water level detecting unit (not shown), the solvent contained in the discharge chamber 5 I35 is discharged to the solvent by the operation of the drain pump 136 The outside of the discharge chamber 135. According to the foregoing structure, the pretreatment unit for dissolving the water-soluble gas contained in the exhaust gas by supplying the water-soluble gas solvent before the exhaust gas enters the dry-wet treatment unit The dry or wet processing unit 10 is corroded or worn to solve the problem of shortening the service life, and the wet processing unit is configured to increase the wet processing effect and the exhaust pipe is blocked. Can be solved. [Embodiment 3] Fig. 6 is a structural view showing an example of an exhaust gas treating device for removing liquid components contained in exhaust gas in the month of the present invention; Fig. 7 is a view for showing the present invention for removing A structural view of another example of an exhaust gas treatment device containing a liquid component in an exhaust gas; Fig. 8 is a view for showing an embodiment of a cooling unit of the present invention; and Figs. 9-11 are for showing the present invention Figure 20 is a diagram showing another embodiment of the liquid separation/cooling unit of the present invention; Figures 13 and 14 are diagrams showing other embodiments of the liquid separation/cooling unit of the present invention. Example; and 36 1272121 Figure 15 is a block diagram showing the liquid separation/cooling unit installed with most stages. As shown in Fig. 6, a heating chamber 220 heats a combustible exhaust gas such as hydrogen or argon produced by a semiconductor manufacturing process such as a polishing process to convert its chemical characteristics. The cooling unit 210 of the present invention is in fluid communication with the heating chamber 220 to cool the purified gas produced by the heating chamber 220 and to capture and condense the liquid components contained in the purified gases. The liquid component partially generated by the heating chamber 220 and condensed in the cooling unit is collected in a discharge tank 230. As described above, the purified gas which has been trapped and removed from the liquid component is prevented from being condensed at the exhaust duct and the exhaust pipe, thereby preventing the exhaust duct and the exhaust pipe from being corroded. Fig. 7 is a view showing the structure of an exhaust gas treating apparatus of another embodiment of the present invention. 〆 Heating and mixing · Exhaust gas, mixing of such inert gases ^ 妓 妓 杂 并 录 录 」 」 因为 因为 因为 因为 因为 because of heating such as oxidation, 'deposition and light process, etc.; 20: household: production: waste milk will produce dust, because These are the same. , water treatment, (4) money removal; can therefore 'there is a greater contact area for the water treatment of these waste gases. The wet pretreatment unit of the present and the exhaust gas uses a direct pressure 37 1272121 atomizing nozzle to generate water particles having a diameter of 50 μm or less, thereby increasing the contact area and greatly reducing the amount of use, for example, the wastewater. The discharge amount is reduced to hundreds of cc per minute. The cooling unit 210 is in fluid communication with the wet processing unit 240 to cool the purified gas generated by the wet processing unit 240, and is captured and condensed therein. The liquid component of the purified gas. The liquid component partially generated in the heating chamber 220, and the liquid component mixed with the dust in the wet processing unit 240 and the liquid component condensed in the cooling unit are collected in the discharge tank 23'. 10 The cooling unit employed in the present invention will be described in detail below. Referring to Fig. 8, the cooling unit 210 includes a cooling tube 212 that is mounted to surround and be in fluid communication with the heating chamber 22 or the wet processing unit 240. The cooling water is circulated in a cooling pipe 212 connected to a suitable cooling water supply device or a cooler or the like to supply cooling water. Further, as shown in Fig. 9, the cooling pipe 212 is connected to a heat exchanger 215 to allow the cooling water to pass through the heat exchanger to another cooling pipe 216 directly connected to the cooling tank (not shown). Referring to FIG. 10, the cooling unit 210 includes a cooling tube 212 mounted at an inner side of the piping structure 20 and in fluid communication with the heating chamber 220 or the wet processing unit 240. In the foregoing method, the cooling The tube 212 is directly connected to the cooling tank to circulate cooling water, or as shown in Fig. u, the cooling tube 212 is connected to the heat exchanger 215 to circulate cooling water through the heat exchanger to another directly connected to the cold 38 Π 72121 The cooling tube 216 of the tank (not shown). The exhaust gas treating apparatus of another embodiment of the present invention includes a liquid separating/cooling element 300 for absorbing the wet processing unit. The flow rate of the purified gas is discharged to separate the liquid components contained in the purified gas and to cool the purified gas to capture and condense the liquid components contained in the purified gas. Referring to FIG. 12, the liquid separation/cooling unit 300 of the embodiment of the present invention includes a cyclonic liquid separator 310, wherein the purified gas enters from the side and is discharged to the upper side, and a cooling module. Mounting 1 in the liquid knife away from 310 and including a inner 340 and an outer tube 320, the outer tube 320 being coaxial with the inner tube to form a closed space 330 between the inner tube and the outer tube, and wherein The cooling water circulates through the closed space 33〇. Preferably, the liquid separator 310 comprises a buffer having a large cross section and a large capacity to reduce the flow rate of the gases, and preferably has a biased I5 core inlet to obtain the cyclone separation effect. Efficiently purify these gases. In order to obtain the cyclone separation effect and reduce the gas flow rate to remove the liquid components contained in the gases, a tapered drain portion 316 is integrally formed with a cylindrical body, and the heating chamber 220 or the wet processing unit 240 An inlet hole 312 that joins two turns for the gas to enter is formed at a side wall of the body, and a discharge hole 314 is formed at an upper portion of the body to be in fluid communication with an inner side of the inner tube 340. Referring to FIG. 13, the liquid separation/cooling unit 300 of another embodiment includes a cyclonic separation type liquid separator 310, wherein the purified gas 1272121 enters from one side and is discharged to the upper side; and a cooling module, A cover 350' is formed therein such that it is uniformly spaced apart from the entire outer surface of the body of the liquid separator 310 to form a closed space 355 therebetween, and the cooling water sill shield ring passes through the closed space 355 〇 5 thus The water cools the entire surface of the liquid separator 31 so that the cooling area can be increased to more efficiently capture and condense the liquid components contained in the purified gas. On the other hand, by combining the embodiments of the 12th and 13th embodiments, a combination of the first cooling module and the second cooling module of the double pipe structure can be used, and 10 cooling water circulates therebetween, and a cover is formed. The second cooling module is disposed such that it is uniformly spaced from the entire outer surface of the body of the liquid separator to form a closed space therebetween, and cooling water circulates through the closed space. Referring to Figure 14, there is shown a liquid separation/cooling unit of another embodiment. In this embodiment, the purified gas enters and is discharged to the top by the cyclonic liquid separator 310. The cooling unit includes a body 250 for supplying pressurized air to the body. The conduit 253 includes a hot air discharge pipe 255 for discharging hot air and a scroll pipe 251 for discharging the cooling air discharge pipe 256, and a mounting 20 in the liquid separator 310 and one end thereof. The cooling coil discharge pipe 256 is in fluid communication with the vortex tube and the other end is an open cooling coil 240. Referring to Figure 15, the liquid separation/cooling unit is installed in a plurality of stages and is in fluid communication with each other by providing a venting bend 260 such as a U-shaped bleed tube in the middle, thereby actually Increase the channel length. The addition of 40 1272121 channel length has the advantage of capturing more liquid components before being discharged to the exhaust duct. The aforementioned exhaust gas treatment device of the present invention will be described below. First, since the types and characteristics of the exhaust gases are different from each other due to the manufacturing process, the exhaust gases are supplied to the heating chamber 220 to be mixed with the inert gases and air or the exhaust gases themselves. The exhaust gases may be supplied to the heating chamber after it is first mixed with the inert gas and air at the manifold, and the heating chamber 220 is heated to enter the exhaust gas to change its chemical characteristics. Depending on the type of exhaust gas, the gas 10 discharged from the heating chamber 220 may or may not include dust such as powder, and if it includes dust, the gas may pass through the wet processing unit 240 and the cooling unit 21 connection. The gas processed by the foregoing process is cooled at the cooling unit 21, so that 'the water that is contained in the purified gas can be captured and condensed, and the condensed liquid components are collected in the discharge tank 23〇. . 15 The removal of liquid components such as water contained in the exhaust gases as described above can prevent corrosion of such piping structures or exhaust ducts and the like. According to another embodiment of the present invention, the purified gas enters the liquid separation/cooling unit 3, and a large amount of liquid components contained in the exhaust gases are discharged to the lower portion due to a decrease in flow rate. Further, the gas processed by each of the cooling units constituting the liquid separator 31 is cooled, and the liquid component contained in the inside is trapped and condensed in the liquid separator 3l 〇t 〇 $ in addition to the U-shaped discharge The curved tube 260 actually increases the length of the purified (four) channel to increase the efficiency of the enemy of the water. 41 1272121 Therefore, the exhaust gas discharged to the exhaust duct does not include moisture, and corrosion of the exhaust duct and the piping structure or the like can be prevented. As described above, although the present invention has been mainly described with respect to the preferred embodiment, those skilled in the art can understand various variations. According to the foregoing composition, there is an advantage that the cooling unit is installed at a rear end of the heating chamber or the wet pretreatment chamber to remove a liquid component contained in an exhaust gas such as moisture discharged from the heating chamber or the wet processing unit, The corrosion of the pipeline structure and the exhaust duct is prevented. Further, when dust generated by the heating chamber is processed in the wet processing unit, there is an advantage that the fine water particles are sprayed by the atomizing nozzle to increase dust collection efficiency, thereby increasing the amount of waste water generated . Further, it is effective to capture a liquid component such as moisture contained in the exhaust gas processed by the cooling units installed in most stages, and has a large amount of moisture excluding the water discharged from the finally discharged exhaust gas. [Embodiment 4] Fig. 16 is a view for showing the structure of the dry waste treatment apparatus of the present invention, and Fig. 17 is a longitudinal cross-sectional view of Fig. 16; and Fig. 18 is a view for showing the present invention. A diagram of the structure of another heating chamber of the exhaust gas dry processing apparatus. As shown in Figures 16 and 17, an exhaust dry processing apparatus according to an embodiment of the present invention includes a heating chamber 511 for forming a predetermined processing space, and a mounting portion on the upper side of the heating chamber 511 and on the side thereof. A manifold 513 having an exhaust gas supply port 42 1272121 513a. The manifold 513 has a plurality of rod heaters 515 vertically mounted in the heating chamber 511 on its upper side, and a temperature measuring sensor 517 at its central portion for measuring the temperature of the heating chamber 511. 5 The rod heater 515 and the temperature measuring sensor 517 are configured to prevent corrosion by using an anti-corrosion unit 520. The anti-corrosion unit 520 includes a rod heater 515 and the temperature measuring sensor. A tube 521 of 517, a connecting cover 523 for fixing the tube 521 to the upper portion of the manifold 513, and a 10 preventing corrosion gas 525 flowing in the tube 521. The connecting cover 523 has an upper cover and a lower cover 523a and 523c. The lower cover 523c has a clamp 518 for fixing the rod heater 515 and the temperature measuring sensor 517, and the exhaust gas supply hole 513a has The connection terminals 515a and 517a for electrically connecting the rod heaters 515 and the temperature measuring inductor 517 and extending from the I5, and a gas supply hole 523a for supplying the corrosion preventing gas 525. The jig 518 has a through hole 5i8a through which the anti-corrosion gas 525 supplied through the gas supply hole 523a enters the tube 521. The anti-corrupt gas 525 can use an inert gas such as N2, helium 2, air, h2, He 20 or the like. The tube 521 is made of a ceramic having high heat resistance and a high heat resistance (such as Al2〇3 or SiC) or gold crucible to have porosity, and therefore, the anti-corrosion gas 525 flowing in the tube 521 Fluidly communicating with the outside of the tube 521 0 43 1272121 The heating chamber 511 is further provided with a protective wall 531 separated from the inner wall, and the corrosion preventing gas 525 is supplied between the heating chamber 511 and the protective wall 531 to prevent The heating chamber 511 is rotted. As shown, the lower portion of the protective wall 531 may be formed to be closely connected 5 to the heating chamber 511 to block the passage, or to be separated from the bottom to open the corrosion preventing gas 525 to the inside of the heating chamber 511. It is preferable that the corrosion preventing gas 525 is supplied in a preheated state so as not to lower the heat value of the rod heaters 515. On the other hand, when the exhaust gases are supplied 10 through the exhaust gas supply holes 5i3a, the flow rates of the exhaust gases are lowered at the upper side of the manifold 513 to facilitate the adhesion of the powder to produce a thicker powder layer, thus increasing The possibility of blockage of the exhaust gas supply line structure. In order to solve this problem, a pulse unit 54 for periodically supplying a pulse of gas is additionally disposed at an upper portion of the exhaust gas supply hole 513a to prevent the powder layer from being generated or thickened. The pulse unit 540 includes a pulse tube 541 connected to the upper side of the exhaust gas supply hole 5, and the pulse gas of the air is periodically supplied through the pulse tube 541, and an electrically operated solenoid valve can be adjusted. Supply time. Further, the pulse tube 541 preferably has a shape in which the pulse gases are supplied in a tangential direction similar to the exhaust gas supply hole 5] [3a. Next, Fig. 18 is a view showing another embodiment of the heating chamber 511. As shown, the heating chamber 511 is further provided with a protective wall 531 as shown in Fig. 17. The protective wall 531 has a connecting pipe 532 formed on the outside thereof, and a cooling fluid such as a shell 2, an air, etc. is flown to prevent the heating chamber 511 from being overheated, and a heat insulating member 533 is inserted into the heating chamber 511 and the The walls 531 are protected to prevent heat from being transmitted to the outside and contribute to an increase in internal temperature. In this manner, the gas heated along the cooling tube 532 can be replaced by the corrosion preventing gas 525. The principle of operation of the exhaust gas dry processing apparatus will be described below. First, the exhaust gas discharged from the semiconductor manufacturing equipment (not shown) through the exhaust gas supply hole 513a of the manifold enters the heating chamber 511. At this time, the exhaust gas supply hole 513a is formed on the side of the manifold 513 to cause the exhaust gas to vortex, and therefore, the exhaust gas entering the heating chamber 511 is vortexed as shown in Fig. 17. When the exhaust gases are vortexed, the residence time of the exhaust gas in the heating chamber 511 becomes long. On the other hand, when the supplied exhaust gas stays in the heating chamber 5丨1, the exhaust gas is heated by the heating operation of the rod heater 515, and can be converted into a solid state to be Capture. When the exhaust gases are dry heat treated as described above, the fluorine gas reacts under the heated conditions of the rod heaters 515 to corrode the rod heaters 515 of the heating chambers 511. 20 This can be prevented by mounting the tube 521 outside the rod heater 515 and supplying the corrosion preventing gas 525 into the tube 521. The corrosion preventing gas 525 is preheated to a predetermined temperature so as not to lower the heat value of the rod heaters 515. When the anti-corrosion #gas 525 is supplied to the tube, the rod heating 45 1272121 is primarily blocked by the tube 521 and is secondaryly blocked by the anti-corrosion gas 525 supplied at a predetermined flow rate. The material 521 is made porous to contact the rod heater 515 such as the rot gas 5 to be heated to increase the temperature of the heating chamber 511. That is, by being treated as a heat transfer medium, the corrosion preventing gas 525 supplied to the tube 521 has a function of blocking and protecting the rod heaters 515 without reducing the heat value. The temperature measuring sensor 517 can also prevent corrosion by the foregoing principles. On the other hand, the risk of corrosion of the inner wall of the heating chamber 511 can also be solved by causing the corrosion preventing gas 525 to flow between the heating chamber 51 and the protective wall 53A. The retaining wall 531 mainly has a function of preventing the reaction of the heating chamber μ 1 from the rot I5 gas. When the protective wall 531 is corroded to produce a plurality of holes due to continuous use, the flow or pressure of the corrosion preventing gas 525 flowing between the heating chambers 511 of the protective wall 531 prevents the exhaust gases from directly contacting the heating chamber M1. . Next, when the rod heaters 515 are electrically operated by the above principle, the cooling water flowing through the cooling tubes 532 surrounding the protective wall 531 prevents the heating chamber 511 from being overheated. In addition, the heat generated by the rod heaters 515 is insulated by the heat insulating member 533 interposed between the heating chamber 511 and the protective wall 531 to reduce heat loss and reduce the temperature rise of the protective wall. time. 46 1272121 The advantage of supplying the exhaust gases in the side direction of the heating chamber to vortex the exhaust gases and supplying them to the heating chamber is that the treatment effect of the exhaust gases can be improved by increasing the residence time of the exhaust gases. Further, an advantage of preventing damage of the apparatus by using an anti-corrosion unit for protecting the heating chamber, a heater installed in the heating chamber 5, and a temperature measuring sensor is that the exhaust gas can be increased by reducing the error of the device. Handling amount 0 [Embodiment 5] Fig. 19 is a view showing the structure of a waste gas processing apparatus having a heating chamber corrosion preventing device of the present invention; and Fig. 20 is a view showing prevention of a heating chamber having another embodiment Fig. 21 is a view showing the structure of the exhaust gas treating device of the etching device; Fig. 21 is a view showing that in the structure of Fig. 19, in consideration of the occurrence of corrosion, the exhaust gas (CF4) is measured by forming an imaginary hole in the inner chamber. A graph of the concentration of 15; and Fig. 22 is a graph showing the measured value of the change in CF4 concentration at an arbitrary position between the heating chamber and the inner chamber in accordance with the N2 flow rate supplied from the structure of Fig. 21. As shown in Fig. 19, the exhaust gas treatment device has a predetermined space for accommodating the 20 exhaust gases to process exhaust gas discharged from the semiconductor manufacturing process equipment (for example, a fluorine gas for cleaning the chemical vapor deposition apparatus: CF4) , C2F6, NF3, etc.), and is provided with a heating chamber 411 having holes 411a and 411b and having upper and lower ends open, and a portion mounted at the periphery of the heating chamber 411 to be heated to a predetermined temperature to form the exhaust gas Processing conditions. 1272121 A manifold (not shown) for supplying the exhaust gas, air, etc. into the heating chamber 411 is combined with the upper side of the heating chamber 411, and the exhaust gas heated to the predetermined temperature in the heating chamber 411 is The mixed gas at the lower side of the heating chamber reacts to change the mixed gases and capture them. 5 mounted in the heating chamber 41 is a shielding unit 420 for preventing corrosion of the heating chamber 411 due to the reaction of the exhaust gas with the air and the thermal condition. The shielding unit 420 includes a mounting and heating. The chamber 411 is separated from the inner chamber 421, and the corrosion preventing 10 gas 423 flows between the heating chamber 411 and the inner chamber 421. Preferably, the non-corrosive gas such as vanadium, air, alpha gamma, and the like is prevented. The inner chamber 421 is formed in the heating chamber 411, and one end of the heating chamber 411 and one end of the inner chamber 421 are coupled to each other by an annular flange 15 member 425 on the same straight line. The flange member 425 has on one side thereof a supply of anti-corrosion gas for supplying the gas permeable hole 425a' between the inner chamber 421 and the heating chamber 411, and the gas inlet hole 425a' is supplied from the gas inlet hole 425a. 423 flows out through the hole 411b formed at the lower side of the heating chamber 411. According to the foregoing composition, the shielding unit 420 is mainly for preventing the heating chamber 411 from being exhausted by the exhaust gas (for example, fluorine gas such as CF4, QF6, NF3 or the like used in chemical vapor deposition or cleaning of a diffusion device). Corrosion caused by the reaction of the processing conditions of the heater 413. That is, the inner chamber 421 mainly has a function of preventing the reaction of the heating chamber 411 with the gases 48 1272121. When the inner chamber 421 is continuously used, it is formed by a lot of money. (4) The flow force of the anti-corrosion body 423 flowing between the chamber 421 and the heating chamber 411 prevents the exhaust gas from directly contacting the heating chamber 411 °. When the continuous flow is performed, the concentration of the exhaust gas is greatly reduced by the dilution effect of the anti-corrosion body 423 to prevent the heating chamber 411 from being severely corroded. According to the above description, the etching time of the heating chamber 411 is greatly extended compared to the prior art to further extend the pre-repair time, reduce the replacement cost of the heating chamber 10 411, and increase the service life of the heater 413. Figure 20 is a view showing another embodiment of the structure of the shield unit. The same components as those in Fig. 19 are denoted by the same reference numerals and the description thereof will be omitted. The structure different from that of Fig. 19 is A flange member 425 is coupled to the other end of the 15 inner chamber 421 to mount a partition member 427. The partition member 427 causes the corrosion preventing gas 423 to stay only between the heating chamber 411 and the inner chamber 421, and the like The supply and withdrawal of the corrosion preventing gas 423 is achieved by the gas inlet/outlet holes 425a and 425b formed at the flange member 425. 20 is mounted on one side of the flange member 425 on which the gas discharge hole 425b is formed. Above is a pressure gauge 431 for measuring the pressure of the corrosion preventing gas 423 flowing between the 411 and the inner chamber 421, and the valve unit 433 for opening/closing the passage is mounted on one side thereof and the measurement is passed. The pressure gauge 431 is supplied to the pressure of the corrosion preventing gas between the heating chamber 411 and the inner chamber 421. The valve unit 433 is opened to open the passage to release the heating chamber and the inner portion to 421. Preventing corruption 423, to maintain a certain pressure. When the inner chamber 421 or the heating chamber 41| has a hole due to corrosion, the pressure drop of the gas 5 is prevented from flowing between the heating chamber 411 and the inner chamber 421 It will be measured by the pressure gauge 431, so the corrosion state can be easily known. Fig. 21 is a view showing the formation of a hypothesis in the inner chamber 421 in the structure of Fig. 19 in consideration of the occurrence of corrosion. A hole 421 & to measure the structure of the exhaust gas (CF4). As shown in the figure, the length of the heating chamber, the distance between the outer periphery of the inner chamber 421 and the inner circumference of the heating chamber 411 is t* 2 mm, and the heating chamber 411 and the inner chamber 421 have a cylindrical shape. Further, the imaginary hole 421a is selected in a place where the rot is most likely to occur, and the diameter d thereof is different from each other (for example, 2 〇 mm or 4 〇 mn ^ And a Cf4 concentration _ 15 measurement position is separated from the center of the imaginary hole 421a by a predetermined distance (L: 40 mm). FIG. 22 is a flow rate of the supply according to the structure of FIG. 21 in the heating chamber 411 and the Any position between the inner chambers 421 (A position: in the imaginary hole 421a) A graph of the measured value of the CF4 concentration change slightly below. 20 In Fig. 22, the x-axis represents the value of the nitrogen supply [SLM (standard liter per minute)]' The y-axis represents the CF4 concentration value [ppmv], and the △ line represents The size is the measured value of the imaginary hole 421 & 40 mm in diameter, and the □ line indicates the measured value of the imaginary hole 421a whose size is 20 mm in diameter. As can be seen from the figure, the CF* concentration is significantly reduced in proportion to the amount of enthalpy supplied. 50 1272121 is small, when the size of the imaginary hole 421a is 20 mm, the concentration is 0 at a point where the nitrogen amount is 7 liters/min, and when the size of the imaginary hole 421a is 40 mm, the concentration is 0.5 liter/min. The point is 0. The conditions with 1 result are as follows: CF4 is 0.5 [SLM], air is 5 200 [SLM], and the heating temperature of the heater 413 is 700° (:. The concentration value of the CF4 can be converted by FTIR (Fourier transform far) Infrared (Fourier Transform Infra_Red) spectrometry is used to measure the corrosion of the heating chamber caused by the exhaust gas by installing the shielding unit in the heating chamber as described above. The service life and the pre-repair time. In addition, the replacement cost of the heating chamber can be significantly reduced, and the corrosion of the heater due to the corrosion of the heating chamber can be prevented to prolong the service life of the heater. 6] 15 20 Figure 23 is a diagram of a part of the exhaust gas treatment device of the invention - the actual closure; Figure 24 is a cross-sectional view of the BB of Figure 23; Figure 25A shows the pulse - single (four) Fig. 24 is a view showing the structure of the cooling water storage tank of Fig. 24; Fig. is a view showing the structure of the cooling water supply pipe in which the pulse unit is incorporated in Fig. 24; Show the gas for the 23rd picture a figure of a plastic example; and a predetermined angle

Figure 27 is a view showing an example in which the piping of the cooling unit is inclined at 51 1272121. As shown, the exhaust gas treatment device includes a dry processing unit 9A and a cooling unit 800. The dry processing unit 900 has an outer tube 91 〇, an inner tube 93 〇 and a heater 950. The cooling unit 800 includes a hollow tube 81A having a flange 813 having a fluid communication with the lower portion of the dry processing unit 9 and receiving cooling water and in a state of overflow 811 〇 10 that can be overflowed to the inside thereof is installed at the cooling water storage tank 811 at least one cooling water supply hole 820, and a cooling water extraction hole 821 is formed in the circumferential direction of the cooling water storage groove 811, and The diameter d is smaller than the width d of the cooling water receiving groove 811 and is fluidly connectable to the entire passage. When a plurality of cooling water supply holes 820 are installed, the cooling water extraction holes I5 821 must be installed to have the same direction as the cooling water supply holes 820. The cooling water supply hole 820 is connected to a cooling water supply pipe 822 that supplies cooling water. The supply of cooling water along the circumference creates vortexing and overflowing of the cooling water, which reliably prevents the flow rate difference from occurring and prevents the powder from being partially blocked. 20 Next, in order to promote the vortex effect of the cooling water, the pulse unit 850 shown in Figs. 24 to 25b may be additionally added. The pulse unit 850 has a function of generating a pulse flow of the cooling water that is periodically operated and supplied, and is configured to be drained by the cooling water supply hole 82 or separately formed on the cooling water supply hole 82. 52 1272121 FIG. 24 and FIG. 25A are diagrams for showing an example of being independently formed on the cooling water supply hole 820. As shown, the pulse unit 850 includes a mounting portion at the bottom of the cooling water storage groove 811. The pulse fluid supply hole 851, a pulse tube 852 connected to the pulse fluid supply hole 851, and a solenoid valve 853 for periodically opening/closing the passage of the pulse tube 852. The pulse fluid supply hole 851 has a shape similar to the cooling water supply hole 820, and a pulse fluid extraction hole 85la is formed along the circumferential direction of the cooling water storage groove 811 to form a cooling water extraction hole with the cooling water supply hole 820. A similar direction of 821 is formed. 10 is a diagram for showing the connection state of the pulse unit 850 and the cooling water supply pipe 822. As shown, the pulse tube 852 is connected to the cooling water supply pipe 822 to transmit the cooling water supply. The hole 82 is extracted from the cooling water. At this time, a pulsed fluid supply hole 851 is unnecessary. According to the foregoing description, although the pulse unit 850 is separate from the cooling water supply hole 820 or connected to the cooling water supply hole 820, a combination of two structural relationships may be used. In Figs. 25A and 25B, reference numerals 854 and 855 denote a check valve for preventing the cooling water from flowing back with the gas. 2〇 Next, in order to solve the problem of agglomeration of the powder at a rapid temperature difference generated at the junction of the cooling unit 8〇〇 and the dry processing unit 900, a gas supply unit for supplying a gas heated to a predetermined temperature The 700 is installed on the upper side of the cooling water overflow. As shown in Figures 23 and 27, the gas supply unit 7 has a gas supply pipe 710 installed in an inner tube 930 of the 53 1272121 and separated from the inner tube 930 to supply the preheated gases in a vertical direction. . The gas supply pipe 710 has a function of mainly preventing the reaction of the inner pipe 93G with the gases and the pipe 93. At the lower end, when the inner 5 = 93 () is used for continuous use, the pressure of the gas flowing between the gas supply pipe 71 and the inner pipe 930 can prevent the exhaust gas from being Inner tube gamma contact. In addition, the dilution effect of the gases also prevents the inner tube 930 from being severely corroded when the exhaust gases are continuously flowing. 10, Fig. 26 is a view for showing another example of the gas supply unit 7, as shown in Fig. 26, the gas system is discharged at the upper side of the cooling water overflow with the powder. The direction is supplied in the direction perpendicular to the direction. The gas supply unit 700 has a gas supply groove 731' for contacting the helium gas at its upper surface, and a gas supply plate 730 having a gas supply hole 733 communicating with the gas receiving groove 731. The gas supply hole 733 is formed by passing through one side of the gas supply plate 730, and the gas can be supplied in a swirling direction. When the gas supplied from the gas supply hole 733 fills the gas receiving groove 731, the gas supply hole 733 is formed. The gas creates a vortex in which it can overflow using the same theory as the extraction of the cooling water. 20 supplied gas systems such as nitrogen (NO preheating gas is preferred. Next, at the upper side of the cooling water overflow, as shown in Figures 23 to 26, a cover member 1000 is installed to make the cooling water The cover member 1000 is formed by an annular plate 1010 and is disposed between the unit 500 and the dry processing unit 900, and has an inner portion formed therein. The inclined portion of the predetermined angle covers the cooling water overflowed by the cooling water receiving groove 811 to cause the cooling water to flow downward. At this time, the cover member 1 must be lower than the cold forming a full state. 5 but the inner wall of the water receiving groove 811. When the tube 810 constituting the cooling unit 8A in Fig. 27 has a shape in which the diameter of the tube decreases in the downward direction, the powder and the exhaust gas are smoothly downward. Moving and rotating along the inclined surface. With the foregoing composition, supplying a gas preheated to a predetermined temperature solves the problem of vapor backflow caused by 10 at a junction between a cooling unit in a low temperature environment and a dry processing unit in a high temperature environment. fast The problem of the degree of difference or the clogging of the powder. Further, the installation of the cover member can solve the problem that the cooling water is dispersed or the powder is clogged to generate eddy currents to make the powder clogging at the joint. 15 In addition, the vortex supplies the cooling water to avoid generation. Irregular flow rate difference and flow rate distribution, thereby preventing powder clogging at low flow rates. The invention as described above has the advantage of more efficient treatment of the exhaust gas. Although the present invention has been considered to be the most practical and optimal The embodiments are described herein, but it is to be understood that the invention is not limited to the description of the embodiments described herein, but the invention is intended to cover various modifications within the spirit and scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1 to 3 are views showing an example of a wet pretreatment apparatus of an exhaust gas treatment apparatus of the present invention; 1272121 FIG. 4 is a view showing removal efficiency of ammonia by the wet pretreatment apparatus. Figure up to 80%; Figure 5 is a diagram showing the structure of a wet/combustion exhaust gas treatment device using multiple wet pretreatments for multiple exhaust gas treatments in Figure 3; 5 Figures 6 and 7 are structural diagrams 'showing an example of an exhaust gas treatment device of the present invention for removing liquid components contained in exhaust gas; Figures 8 to 11 show examples of a cooling unit suitable for use in the present invention; Figure 14 shows an embodiment of a liquid separation/cooling unit suitable for use in the present invention; 10 Figure 15 is a structural view showing a liquid separation/cooling unit installed in a multi-stage manner; Figure 16 is a view showing the present invention. Figure 17 is a longitudinal cross-sectional view of Figure 16; I5 Figure 18 is a view showing the structure of another heating chamber of the exhaust gas dry processing apparatus of the present invention; Figure 20 is a view for showing the structure of the exhaust gas treating apparatus having the apparatus for preventing the heating chamber of the present invention; Figure 21 is a view showing the formation of a hypothesis by the occurrence of corrosion in the structure of Fig. 19 by The structure for measuring the concentration of the exhaust gas (CF4) by the hole; Fig. 22 is for the change of the CF4 concentration generated according to the N2 flow supplied from Fig. 21 at any position between the heating chamber and the inner chamber Measured value Fig. 23 is a view showing a part of an exhaust gas treating device 56 1272121 (heating chamber) of an embodiment of the present invention; Fig. 24 is a cross-sectional view of B-B1 in Fig. 23; Fig. 25A Is a diagram for showing a structure in which a pulse unit is incorporated in the cooling water supply tank of FIG. 24; 5 FIG. 25B is a diagram showing a structure in which a pulse unit is incorporated in the cooling water supply line of FIG. Figure 26 is a diagram for showing an example in which the gas supply unit of Fig. 23 is constructed as another type; and Fig. 27 is a diagram for showing the piping of the cooling unit A diagram of an example of tilting at a predetermined angle. [Main component representative symbol table of the drawing] 10: Wet pretreatment device 19... Inner cylinder 10a... Outer cylinder 19a···Inner-outer cylinder connecting portion 11···Exhaust gas inlet hole 20...Reaction portion 12· ·Reagent inlet hole 21···Discharge hole 13...Gas injection hole 22...Humidity reduction unit inlet hole 13a···Gas injection hole valve 23...Humidity reduction unit 14...Reaction substance injection hole 24...Insulation member 14a· ·Reactant injection orifice valve 26...Gas injection hole 15...Micronization nozzle 26a...Valve 16...Micronally spray atomized reactant 30...Wet pretreatment device 17...cylindrical cylinder 31...discharge hole 17a...outer-inner cylinder connecting portion 32...pre-storage tank; solvent storage cylinder 18...corner cone 33···water level holder 57 1272121 34...water level holding line 81d...gas inlet hole 35...powder 81e···gas discharge hole 36...pre-slot pressurizer 82...motor 37...valve 83...rotor 38...cover 84...spray unit 39...connector 85···rotor 39a···connector inlet hole 85a...cylindrical tube 40 ...wet pretreatment device 85b...filler 41...discharge tube structure 86...solvent 61...pretreatment conduit 90 ...the second wet processing unit 61a...the exhaust gas supply hole 91..the conduit 61b...the water-soluble gas solvent supply hole 91a...the cover body 61c··the exhaust gas extraction hole 92...the solvent supply pipe 61d...the solvent extraction hole 93...the injection nozzle 70 ...dry processing unit 100...cooling unit 71...exhaust gas supply pipe 101···cooling water supply pipe 72...manifold 102...cooling water supply hole 72a...exhaust gas supply hole 103···connecting pipe 73...heating chamber 110... Dehumidifying unit 80... First wet processing unit 120... Exhaust unit 81... Chamber 130... Discharge unit 81a... Side wall 131, 132, 133... Drain tube structure 81a'... Through hole 135··· Release Room 81b, 81c··. Space 136···Drainage pump

58 1272121 137...Cooling water supply pump 411...heating chamber 210...cooling unit 41 la, 41 lb...212...cooling tube 413...heater 215...heat exchanger 420...shield unit 216...cooling tube 421...inner chamber 220 ...heating chamber 421a... imaginary hole 230... venting groove 423... preventing rot gas 230... wet processing unit; cooling coil 425... flange member 250... body 425a... gas inlet hole 25L & vortex tube 425b ...gas discharge hole 253...pressurized air duct 427...partition member 255...hot air discharge pipe 431···pressure gauge 256...cooling air discharge pipe 433.··valve unit 260...bleeding pipe 511... Heating chamber Deng 0...liquid separation/cooling unit 513···manifold 310...liquid separator 513a·.exhaust gas supply hole 312...inlet hole 515...rod heater 314...discharge hole 515 bucket 517a···connection terminal 316...conical draining portion 517...temperature measuring sensor 320...outer tube 518···clamp 330...closed space 518a...through hole 340...inner tube 520···corrosion preventing unit 350...cover 521.··tube 355 ...closed space 523···connecting cover

59 1272121 523a···Upper cover 852"•Pulse tube 523a,...Gas supply hole 853·.·Electromagnetic 阙523c... Lower cover 854,855···Check valve 525...Anti-corrosion gas 900... Dry processing unit 531 ...protecting wall 910...outer tube 532...cooling tube 930···inner tube 533...insulation member 950...heater 540...pulse unit 1000"·cover member 541...pulse tube 1010...annular plate 700...gas Supply unit 710...gas supply pipe 730...gas supply plate 731...gas storage groove 733...gas supply hole 800·•cooling unit 810... hollow tube 811...cooling water storage groove 813... flange 820&quot Cooling water supply hole 821... Cooling water extraction hole 822... Cooling water supply pipe 850... Pulse unit 851... Pulse fluid supply hole 851a... Pulse fluid extraction hole

60

Claims (1)

-22212, 92129311 Patent Application Application Patent Revision Amendment '3 repair (3⁄4 original) Revision date: October 94 Scope: 1 · A waste gas wet pretreatment device installed at the front end of an exhaust gas treatment device 'The exhaust gas wet pretreatment device comprises: a particulate droplet generator for spraying particulates for exhaust gas a pretreated reactant; and a reaction portion for forming a space for reacting the exhaust gas with the particulate sprayed reactant and comprising an outer cylinder and an inner cylinder, wherein the reaction portion comprises: The exhaust gas enters the inlet hole; a particulate droplet reactant for entering the particulate sprayed reactant enters the pore; and is used for discharging through the wet by reacting the exhaust gas with the particulate sprayed reactant a discharge hole of the pretreated exhaust gas; and a discharge hole for discharging a contaminant generated by the particulate sprayed reactant reacting with the exhaust gas. 2. The exhaust gas wet pretreatment apparatus according to claim 1, wherein the outer cylinder is composed of a cylindrical cylinder and a conical cylinder. 3. The exhaust gas wet pretreatment apparatus according to claim 1, wherein the outer meat is a cylindrical cylinder. The device further includes: a degree, and a dehumidification portion, which is installed between the discharge hole and the exhaust gas treatment device to reduce the wet pretreatment exhaust gas discharged from the discharge hole 61 1272121 At the outer wall of the dehumidification section. 5. The exhaust gas wet pretreatment apparatus of claim 4, wherein the dehumidifying section comprises a gas pressurizer for injecting the pressurized low humidity gas into the dehumidifying section. 5 6. A compound wet pretreatment apparatus comprising a plurality of exhaust gas wet pretreatment apparatus according to any one of claims 1 to 3. 7. The dual-type wet pretreatment apparatus according to claim 6, further comprising: a dehumidifying portion installed between the discharge hole and the exhaust gas treatment device 10 to reduce the wet pre-discharge discharged from the discharge hole The humidity of the exhaust gas is treated; and a heat insulating member is installed at the outer wall of the dehumidifying portion. 8. The dual-type wet pretreatment apparatus according to claim 7 further comprising: a pre-storage tank for accumulating the pollutants discharged from the discharge hole before discharging to a storage tank; a retainer for filling the pre-storage tank with the reactants when operating the multiple wet pretreatment apparatus; and a pre-sump pressurizer for injecting pressurized gas into the pre-storage tank. The double wet pretreatment apparatus according to claim 7 or 8, wherein the dehumidifying portion further comprises a gas pressurizer for injecting pressurized low-humidity gas into the dehumidifying portion. 10. A method for wet pretreating exhaust gas at a front end of an exhaust gas treatment device, the method comprising the steps of: 62 1272121 feeding waste gas to a reaction portion; feeding a particulate sprayed reactant into the a reaction portion; reacting the exhaust gas with the particulate sprayed reactant by a cyclone effect in the reaction portion; 5 discharging the wet pretreatment exhaust gas to a discharge hole; and flowing the pollutant to the Release hole. 11. The method of claim 1, wherein the particulate sprayed reactant is at least one of a diluted solution of a chemical such as normal neutral water, tap water, Na〇H or Ca〇H2, and at least one of the electrolyzed water. Made in one. The method of claim 10, wherein the step of feeding the particulate sprayed reactant into the reaction portion comprises passing a flow range by spraying nitrogen gas having a flow rate ranging from 5 to 201 pm. The step of spraying in a generally neutral water particle size of from 1 Torr to 300 cc/min. 13. The method of claim 10, before the step of flowing the contaminant to a discharge 15 hole, further comprising the steps of: reducing the humidity of the wet pretreated exhaust gas discharged to the discharge hole; and heating The wet pretreated exhaust gas having reduced humidity. 14. The method of claim 13, wherein the heating step comprises: utilizing a heat insulating member for maintaining a range of about 50 to 200 ° C to heat the wetted pretreatment having reduced humidity Exhaust gas. An exhaust gas treatment device comprising: - a pretreatment unit for supplying a water-soluble gas and removing a package of water-soluble gas in an exhaust gas from a semiconductor manufacturing facility; 63 1272121 a dry processing unit for transmitting The pretreatment unit oxidizes the untreated exhaust gas by heating to a predetermined temperature; a wet pretreatment unit for dissolving the unreacted exhaust gas not treated by the dry processing unit and capturing the fine powder; 5 a wet type a processing unit for receiving the untreated exhaust gas and the fine powder through the wet pretreatment unit and spraying a predetermined solvent to dissolve the exhaust gas, and collecting the fine powder through a collection filter; and a discharge unit for using The 10 solvent mixed with the powder treated by the pretreatment unit, the wet pretreatment unit and the wet treatment unit is removed. 16. An exhaust gas treatment method comprising: a pretreatment step of supplying a water-soluble gas to a passage through which exhaust gas supplied from a semiconductor manufacturing facility passes and removing water-soluble gas contained in the exhaust gas; 15 a dry processing step of producing a powder by heating the untreated exhaust gas supplied from the pretreatment step to a predetermined temperature; a wet pretreatment step of capturing the untreated fine powder passing through the dry treatment step by Filling a porous cylindrical tube in which a filler is dissolved and rotated to be immersed in the water-soluble solvent 20 at one end thereof; and a wet processing step is to dissolve the exhaust gas and to accommodate the exhaust gas The fine powder was collected by treating the exhaust gas with the fine powder passing through the wet pretreatment step and spraying the solvent. 17. An exhaust gas treatment device comprising: 64 1272121 a heating chamber 'for heating exhaust gas to change its chemical characteristics; and /"P early 7L, #, communicating with the heating chamber to cool the heating chamber The purified gas captures the liquid components contained in the purified gas and causes the liquid components to condense. 18· An exhaust gas treatment device comprising: a heat chamber for heating a mixed gas mixed with exhaust gas and an inert gas and air to transform its chemical characteristics; and a morning processing unit and the heating chamber Connected to perform water treatment and accumulate dust particles generated in the heating chamber; and, however, to cool the read by the wet processing unit, to capture the inclusions in the The body composition of the purified gas. 19. The exhaust gas treatment device of claim 17 or 18, wherein the cooling unit comprises a conduit structure mounted to surround the purified gas. The exhaust gas treatment device of claim 19, wherein the cooling pipe is connected to a cooling tank to circulate the cooling water. The exhaust gas treatment device of claim 19, wherein the cooling pipe U is cooled to connect the cooling water through a heat exchanger and is circulated by another cooling pipe directly connected to a cooling tank. 22. The exhaust gas treatment device of claim 17 or 18, wherein the chilling unit comprises a piping structure installed through the purified gas. The gas treatment device of claim 22, wherein the cooling pipe 65 1272121 is connected to a cooling tank to circulate the cooling water. 24. The exhaust gas treatment device of claim 22, wherein the cooling tube is coupled to a cooler such that the cooling water passes through a heat exchanger and is circulated by another cooling tube directly connected to a cooling tank. 5. The exhaust gas treatment device of claim 17 or 18, wherein the cooling unit is coupled to a freezer such that the cooling water circulates between the freezer and the cooling unit. 26. An exhaust gas treatment device comprising: a heating chamber for heating a mixed gas of exhaust gas, inert gas and air 10 to convert its chemical characteristics; a wet processing unit connected to the heating chamber Performing water treatment and accumulating dust particles generated in the heating chamber; and a liquid separating/cooling unit for absorbing a flow rate of the purified gas discharged from the wet processing unit to separate the liquid component from the 15 The purified gas is cooled and the purified gas is cooled to capture and condense the liquid components contained in the purified gas. 27. The exhaust gas treatment device of claim 26, wherein the liquid separation/cooling unit comprises: a cyclonic separation liquid separator, wherein the purified gas enters from a side of 20 and is discharged to an upper side; and a cooling die a set, installed in the liquid separator, and including an inner tube and a tube disposed in coaxial relationship with the inner tube to form a closed space between the inner tube and the outer tube, and cooling therein Water circulates through the confined space. 66 1272121. The exhaust gas treatment device of claim 26, wherein the liquid separation/cooling unit comprises: a cyclonic separation liquid separator, wherein the purified gas enters from one side and is discharged to the upper side; and 5 The cooling module has a cover formed such that the cooling module is uniformly separated from the entire outer surface of the body of the liquid separator to form a closed space therebetween, and wherein cooling water circulates through the sealed space. 29. The exhaust gas treatment device of claim 26, wherein the liquid separation/cooling unit comprises: 10 a cyclonic separation liquid separator, wherein the purified gas enters from one side and is discharged to the upper side; The module is installed in the liquid separator and includes an inner tube and a tube disposed coaxially with the inner tube to form a closed space between the inner tube and the outer tube, and wherein Cooling water passes through the closed space through the 15th ring; and a second cooling module, wherein a cover is formed to uniformly separate the second cooling module from the entire outer surface of the body of the liquid separator to form a seal therebetween Space, and wherein cooling water circulates through the enclosed space. The exhaust gas treatment device of claim 26, wherein the liquid separation/cooling unit comprises: a cyclonic separation liquid separator, wherein the purified gas enters from one side and is discharged to the upper side; The utility model comprises a 67 1272121 pressurized air supply pipe for supplying pressurized air to the body, a hot air discharge pipe for discharging hot air and a cooling air discharge pipe for discharging the cooling air; and a cooling plate The tube is mounted in the liquid separator such that one end thereof is in fluid communication with the cooling water discharge pipe of the scroll and the other end is open 5 . 31. The exhaust gas treatment device of claim 26, wherein the liquid separation/cooling unit is installed in a plurality of stages and is in fluid communication with each other by providing a venting elbow therebetween, thereby actually increasing the passage length. 32. An exhaust gas treatment device comprising: a heating chamber for heating a mixed gas mixed with exhaust gas, an inert gas and air to transform its chemical characteristics; a wet processing unit and a fluidity of the heating chamber Connected to perform water treatment and accumulate dust particles generated in the heating chamber, and use a spray nozzle to spray a water particle of 15 in a predetermined size in a mist state; and a cooling unit for The purified gas produced by the wet processing unit is cooled to capture and condense the liquid components contained in the purified gas. 33. An exhaust gas dry processing apparatus having an improved heating chamber, and wherein the apparatus 20 includes: a heating chamber for forming a predetermined processing space; and a manifold mounted at an upper side of the heating chamber And having a plurality of exhaust gas supply holes in its lateral direction; and a plurality of strip heaters are mounted on the upper side of the manifold and vertically installed in the interior of the heating chamber 68 1272121. 34. The exhaust gas dry processing apparatus of claim 33, wherein the apparatus further comprises a temperature measuring sensor mounted on the upper side of the manifold and vertically mounted in the heating chamber. The exhaust gas dry processing apparatus of claim 33, wherein the strip heater or temperature measuring sensor is protected by a money odour prevention unit. 36. The exhaust gas dry treatment device of claim 35, wherein the corrosion inhibiting unit comprises: a tube separated from the strip heaters and mounted to surround the strip heaters; And having a gas supply hole connected to the upper side of the tube and combined with the upper portion of the manifold; and a corrosion preventing gas supplied to the tube. 15 37. A waste gas dry treatment apparatus according to the scope of the patent application, wherein the piping is constructed to be porous. For example, the exhaust gas dry processing device of claim 36, wherein the pipe is made of ceramic or metal. 39. The exhaust gas dry treatment apparatus of claim 36, wherein the tube is made of alumina (Al2?3) or tantalum carbide (SiC). 40. The exhaust gas dry processing apparatus of claim 36, wherein the corrosion preventing gas is one of N2, krypton 2, air, and a composition thereof, or a composition thereof. 41. The exhaust gas dry processing apparatus of claim 33, wherein the hot chamber of the 69 1272121 further comprises a protective wall therein, and the corrosion preventing gas system is supplied between the heating chamber and the protective wall. 42. The exhaust gas dry processing apparatus of claim 41, wherein the corrosion preventing gas is one of N2, 02, air, and / or a composition thereof. 43. The exhaust gas dry processing apparatus of claim 33, wherein the heating chamber further comprises a protective wall therein; and wherein a cooling tube surrounds the outer side of the protective wall to generate a cooling fluid flow, and A heat insulating member is inserted between the heating chamber and the protective wall 10. 44. The exhaust gas dry processing apparatus of claim 33, further comprising a pulse unit mounted on an upper side of the manifold and periodically supplying the gas to an upper side of the exhaust gas supply hole, At the upper side of the exhaust gas supply hole, the flow rate of the exhaust gas passing through the exhaust gas supply hole is relatively lowered by 15. 45. An exhaust gas treatment device comprising: a heating chamber having a plurality of inlet holes at its upper and lower ends to form a predetermined space for accommodating exhaust gas to treat exhaust gas discharged from the semiconductor manufacturing equipment; And a shielding unit installed inside the heating chamber to prevent the heating chamber from being heated by the heat of the heater due to the high temperature of the exhaust gas The resulting reaction was rotted by I. 70 1272121. The exhaust gas treatment device of claim 45, wherein the shielding unit comprises an inner chamber installed in the heating chamber and separated from the heating chamber; and a gas to prevent clogging, It flows between the heating chamber and the inner chamber. 47. The exhaust gas treatment device according to the shame of the patent application, wherein the corrosion preventing gas is non-corrosive, 〇2, air, one of % and He is 0 10 15 20 48. An exhaust gas treatment device, wherein one end of the inner chamber is coupled to one end of the heating chamber through a medium of a flange member on the same straight line; and the flange member has a function for supplying the corrosion preventing gas to the side The chamber and the gas chamber enter the manhole, and the gas supplied from the gas inlet hole prevents the corrosion gas from flowing out and passes through the hole formed at the lower side of the heating chamber. 49. The exhaust gas treatment device of claim 46, wherein the inner chamber is heated to one end by a medium of a flange member on the same straight line; the other end has a a partition member for shielding a passage of the heating chamber and the inner chamber; the flange member having a gas inlet/outlet hole for supplying and extracting a gas between the heating chamber and the inner chamber; and the rolling body The outlet port is provided with a pressure gauge and an inter-unit for measuring the force of the gas supplied between the heating chamber and the inner chamber to open the passage when the force of the relay 71 1272121 becomes a predetermined value. 50. An exhaust gas treatment device having an improved cooling structure, the device comprising: a dry processing unit for pressurizing and oxidizing exhaust gas in a hot ambient gas 5 to change the exhaust gas phase into a powder phase; The cooling unit is constituted by a hollow tube having a flange having a cooling water storage tank that is in fluid communication with the lower portion of the dry processing unit and houses cooling water and overflows to the inside thereof if in a full state And a gas supply unit for supplying a gas that has been preheated to a predetermined temperature to the upper portion of the cooling water overflow. 51. The exhaust gas treatment device of claim 50, wherein the gas supply unit comprises a gas supply pipe installed in the dry processing unit to form a direction in which the gases are directed toward the discharge direction of the exhaust gases. Channels that flow in the same direction. 52. The exhaust gas treatment device of claim 50, wherein the gas supply unit comprises a gas receiving groove formed in a hollow state for containing the gas at an upper surface thereof; and a gas supply hole A gas supply plate, and the gas supply hole is fluidly connected to the gas receiving groove, and the gas systems are supplied laterally from the gas supply plate. 53. The exhaust gas treatment device of claim 50, wherein the gas is one of N2, krypton 2, air, Ar and He, or a composition thereof. 54. The exhaust gas treatment device of claim 50, further comprising a cooling water disposed at an upper side of the cooling water storage tank to prevent overflow from passing through the cold 72 1272121 but a water storage tank to the dry treatment unit. The exhaust gas treatment device of claim 5, wherein the cooling water storage tank comprises at least one cooling water supply hole formed to direct a cooling water extraction hole to the cooling water storage tank In the circumferential direction, the cooling water supply hole is connected to a cooling water supply conduit. 56. The exhaust gas treatment device of claim 55, wherein an outer diameter of the cooling water supply hole is smaller than a width of the cooling water storage groove. 57. The exhaust gas treatment device of claim 55, wherein the plurality of cooling water supply holes are installed and the directions of the cooling water extraction holes are the same. 58. The exhaust gas treatment device of claim 55, further comprising a pulse unit for pulsing the cooling water and installing at the bottom of the cooling water storage tank or the cooling water supply conduit. 59. The exhaust gas treatment device of claim 5, wherein the tube of the cooling unit has a shape in which a diameter of the crucible decreases downwardly along the tube to form an inclined configuration. 73